JP3319009B2 - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereofInfo
- Publication number
- JP3319009B2 JP3319009B2 JP07242093A JP7242093A JP3319009B2 JP 3319009 B2 JP3319009 B2 JP 3319009B2 JP 07242093 A JP07242093 A JP 07242093A JP 7242093 A JP7242093 A JP 7242093A JP 3319009 B2 JP3319009 B2 JP 3319009B2
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- flexible circuit
- base material
- circuit board
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂を基材とするフィ
ルム上にパターンを形成したフレキシブル回路基板製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible circuit board having a pattern formed on a resin-based film.
【０００２】[0002]
【従来の技術】従来のフレキシブル回路基板製造方法
は、図４に示す様にパターニングされたフィルム３上
に、回路保護の目的でソルダーレジスト１を塗布し、硬
化させ、ソルダーレジストに覆われていない部分にメッ
キをつけ、フレキシブル回路基板を供給していた。ソル
ダーレジストの成分は、製品の仕様により異なるが、現
在一番多く使用されているのは、エポキシが主成分の加
熱硬化型のソルダーレジストである。他に紫外線硬化型
のアクリル硬化型のソルダーレジストもあるが、紫外線
硬化型のソルダーレジストは、絶縁性、銅箔との密着性
が悪くフレキシブル回路基板の製造には、あまり使用さ
れない。2. Description of the Related Art In a conventional method for manufacturing a flexible circuit board, a solder resist 1 is applied on a patterned film 3 as shown in FIG. The parts were plated and supplied with flexible circuit boards. Although the components of the solder resist vary depending on the product specifications, the most widely used at present are epoxy-based heat-curable solder resists. In addition, there is an ultraviolet-curable acrylic-curable solder resist, but the ultraviolet-curable solder resist is poorly used in the production of flexible circuit boards because of its poor insulating properties and poor adhesion to copper foil.
【０００３】この加熱硬化型のソルダーレジストを加熱
硬化させる際、フレキシブル回路基板は、図５に示す様
にリール５にソルダーレジスト１印刷面側を内側になる
様にして凹凸のあるエンボスフィルム６を間にいれてコ
イル状に巻いていた。エンボスフィルム６は、フレキシ
ブル回路基板を巻取る際、ソルダーレジストが、フィル
ム３の裏側に接触しないようにするためのものである。When this heat-curable solder resist is cured by heating, a flexible circuit board is provided with an embossed film 6 having irregularities on a reel 5 with the solder resist 1 printed surface side inside as shown in FIG. It was coiled in between. The embossed film 6 prevents the solder resist from contacting the back side of the film 3 when winding the flexible circuit board.
【０００４】[0004]
【発明が解決しようとする課題】しかし、前述の従来技
術では、図６に示すようにソルダーレジストの加熱によ
る収縮量がポリイミドのフィルムの加熱による収縮量よ
り大きいので、フィルムがソルダーレジスト２印刷面側
に持ち上がり、次工程で実装出来ないという問題点を有
する。However, in the above-mentioned prior art, as shown in FIG. 6, the amount of shrinkage due to heating of the solder resist is larger than the amount of shrinkage due to heating of the polyimide film. Side and cannot be mounted in the next process.
【０００５】そこで本発明はこのような問題点を解決す
るもので、その目的とするところはフレキシブル回路基
板の反りを防止し、品質の安定したフレキシブル回路基
板を供給するところにある。Accordingly, the present invention is to solve such a problem, and an object of the present invention is to prevent a warp of a flexible circuit board and to supply a flexible circuit board of stable quality.
【０００６】[0006]
【課題を解決するための手段】本発明のフレキシブル回
路基板製造方法は、加熱硬化型のソルダーレジストの加
熱による収縮がフィルムに与える影響を少なくすること
によりフレキシブル回路基板の反りを防止し、品質を安
定させため下記の手段を有する。SUMMARY OF THE INVENTION According to the method of manufacturing a flexible circuit board of the present invention, warping of a flexible circuit board is prevented by reducing the influence of shrinkage of a thermosetting solder resist due to heating on a film, thereby improving the quality. The following means are provided for stabilization.
【０００７】本発明のフレキシブル回路基板の製造方法
は、フレキシブル性を有する基材、前記基材上にパター
ニングされた形成された配線パターン、前記配線パター
ンの少なくとも一部を含む前記基材上に設けられたソル
ダーレジスト、を有するフレキシブル回路基板の製造方
法であって、前記ソルダーレジストを前記配線パターン
の少なくとも一部を含む前記基材上に設ける工程と、前
記ソルダーレジストの設けられた面が外側になるように
前記基材を巻く工程と、前記基材を巻いた状態で前記ソ
ルダーレジストを硬化する工程と、を含むことを特徴と
する。A method of manufacturing a flexible circuit board according to the present invention is provided on a substrate having flexibility, a wiring pattern patterned on the substrate, and provided on the substrate including at least a part of the wiring pattern. Provided a solder resist, a step of providing the solder resist on the base material including at least a part of the wiring pattern, the surface provided with the solder resist outward And a step of curing the solder resist while the substrate is wound.
【０００８】本発明のフレキシブル回路基板の製造方法
は、フレキシブル性を有する基材、前記基材上にパター
ニングされた形成された配線パターン、前記配線パター
ンの少なくとも一部を含む前記基材上に設けられたソル
ダーレジスト、を有するフレキシブル回路基板の製造方
法であって、前記基材における前記配線パターンの形成
された面側にソルダーレジストを設ける工程と、前記ソ
ルダーレジストの表面のみ硬化させ内部を未硬化の状態
とする工程と、前記基材の前記配線パターンが形成され
た面に反する面側に、前記表面に設けられたソルダーレ
ジストと同じ形状で未硬化状のソルダーレジストを配置
する工程と、前記ソルダーレジストを完全に硬化させる
工程と、を有することを特徴とする。[0008] A method of manufacturing a flexible circuit board according to the present invention is provided on a substrate having flexibility, a wiring pattern formed on the substrate, and a wiring pattern including at least a part of the wiring pattern. A solder resist, comprising: a step of providing a solder resist on the surface of the base material on which the wiring pattern is formed, and curing only the surface of the solder resist, and the interior is uncured. And a step of disposing an uncured solder resist in the same shape as the solder resist provided on the surface, on the side of the base opposite to the surface on which the wiring pattern is formed, Completely curing the solder resist.
【０００９】本発明のフレキシブル回路基板は、フレキ
シブル性を有する基材、前記基材上にパターニングされ
た形成された配線パターン、前記配線パターンの少なく
とも一部を含む前記基材上に設けられた熱硬化型のソル
ダーレジスト、を有するフレキシブル回路基板であっ
て、前記ソルダーレジストは、硬化した状態の表面部
と、未硬化の状態の内部と、を有することを特徴とす
る。A flexible circuit board according to the present invention comprises a flexible base material, a wiring pattern formed on the base material, and a heat source provided on the base material including at least a part of the wiring pattern. A flexible circuit board having a curable solder resist, wherein the solder resist has a cured surface portion and an uncured interior.
【００１０】[0010]
【実施例】（実施例１）図１は本発明の実施例における
フレキシブル回路基板の断面図である。加熱硬化型のソ
ルダーレジスト１は、銅箔パターン４を形成したフィル
ム３上にスクリーン印刷により１０μｍ〜４０μｍの厚
さで塗布されて加熱により硬化する。この加熱時の加熱
条件は、ソルダーレジスト中の成分によって異なるが、
エポキシ系のソルダーレジストで１３０℃で３０分〜６
０分の加熱が必要である。この硬化の際、ソルダーレジ
ストは、表面から徐々に硬化していき硬化した部分２が
できるが、この表面のみが硬化した状態（１３０℃ ５
分加熱）で加熱を止め半硬化の状態で、メッキをし実装
を行なう。この時のフレキシブル回路基板は、ソルダー
レジストの表面のみが硬化した状態であるため加熱収縮
量が少なく反りの発生がない状態で実装ができる。(Embodiment 1) FIG. 1 is a sectional view of a flexible circuit board according to an embodiment of the present invention. The thermosetting solder resist 1 is applied by screen printing to a thickness of 10 μm to 40 μm on the film 3 on which the copper foil pattern 4 is formed, and is cured by heating. The heating conditions during this heating vary depending on the components in the solder resist,
30 minutes to 6 at 130 ° C with epoxy solder resist
0 minute heating is required. During this curing, the solder resist gradually cures from the surface to form a cured portion 2, but only this surface is cured (130 ° C. 5
(Heating for one minute), heating is stopped, and plating and mounting are performed in a semi-cured state. At this time, the flexible circuit board can be mounted with only a small amount of heat shrinkage and no warpage since only the surface of the solder resist is cured.
【００１１】この半硬化状態のフレキシブルテープの反
り量であるが、完全硬化に１３０℃で３０分加熱を必要
とするソルダーレジストでは完全硬化時にフィルムが印
刷面側に最大３mm程度の反りが発生するが、１３０℃で
５分加熱した半硬化の状態では、０mm〜０．６mm持ち上
がる程度であり、反りが発生がきわめて少ない。反りの
発生量が０mm〜０．６mm程度であれば反りが原因で起こ
る実装での問題は発生しない。The amount of warpage of the flexible tape in the semi-cured state is as follows. In the case of a solder resist which requires heating at 130 ° C. for 30 minutes for complete curing, the film is warped by up to about 3 mm on the printing surface side when completely cured. However, in a semi-cured state heated at 130 ° C. for 5 minutes, it is lifted by about 0 mm to 0.6 mm, and warpage is extremely small. If the amount of warpage is about 0 mm to 0.6 mm, there is no problem in mounting due to warpage.
【００１２】ソルダーレジストは、完全硬化していない
状態で実装するわけであるが以後の工程でモールド加熱
のなどの加熱の工程があるため、モールド加熱後は、十
分硬化して必要とされる絶縁性が得られる。The solder resist is mounted in a state where it is not completely cured. However, since there is a heating step such as heating of the mold in the subsequent steps, after the heating of the mold, the solder resist is fully cured and required insulation is required. Property is obtained.
【００１３】（実施例２）図２は本発明の他の実施例に
おけるフレキシブル回路基板の加熱時の断面図である。
加熱硬化型のソルダーレジスト１は、銅箔パターン４を
形成したフィルム３上にスクリーン印刷により塗布され
るが、ソルダーレジスト１を塗布し加熱し硬化させる
際、ソルダーレジスト印刷面側を外側にして巻き、コイ
ルの状態で加熱硬化させる。これによりソルダーレジス
トは伸びた状態で硬化するため、ソルダーレジストの収
縮する量を和らげ最終的に発生するフレキシブル回路基
板のそりを防止する事ができる。この時のフィルムの状
態は、巻きの外側に行くほどフィルムのＲの状態は変わ
るが通常１０〜６０cmのＲで巻かれる。このＲが１０〜
６０cmの条件で硬化させるとフレキシブル回路基板のそ
り量は、１mm以下に抑えられそりの少ない状態で実装が
できる。(Embodiment 2) FIG. 2 is a cross-sectional view of another embodiment of the present invention when a flexible circuit board is heated.
The heat-curable solder resist 1 is applied by screen printing on the film 3 on which the copper foil pattern 4 is formed. When the solder resist 1 is applied, heated and cured, the solder resist 1 is wound with the solder resist printed surface side outside. Then, heat and cure in the state of the coil. As a result, the solder resist is hardened in an extended state, so that the amount of shrinkage of the solder resist can be reduced and the warp of the flexible circuit board, which is finally generated, can be prevented. At this time, the state of the film changes as it goes to the outside of the winding, but the film is usually wound at an R of 10 to 60 cm. This R is 10
When cured under the condition of 60 cm, the amount of warpage of the flexible circuit board is suppressed to 1 mm or less, and mounting can be performed with less warpage.
【００１４】（実施例３）図３は本発明の更に他の実施
例におけるフレキシブル回路基板の断面図である。従来
の加熱硬化型のソルダーレジスト１は、銅箔パターン４
を形成したフィルム３上のみにスクリーン印刷により塗
布されるが、本発明は、図３に示すようにフィルムの銅
箔パターン４上にソルダーレジスト１を印刷した後、実
施例１記載のソルダーレジストの表面のみが硬化した硬
化不足の状態にしておき、裏面のフィルム側にも表面と
同じ形状でソルダーレジスト１を塗布した後、加熱硬化
させる。これにより両側から同じ量の加熱収縮が起こ
り、表と裏が互いに打ち消し合い、そりの発生は、起こ
らない。この時のそり量は、０mm〜０．６mm持ち上がる
程度であり反りの少ない状態でフレキシブル回路基板の
実装を行うことができる。(Embodiment 3) FIG. 3 is a sectional view of a flexible circuit board according to still another embodiment of the present invention. A conventional heat-curable solder resist 1 has a copper foil pattern 4
Is applied only by screen printing to the film 3 on which the solder resist 1 is formed. However, in the present invention, after the solder resist 1 is printed on the copper foil pattern 4 of the film as shown in FIG. In a state of insufficient curing where only the front surface is cured, the solder resist 1 is applied to the film side on the back surface in the same shape as the front surface, and then cured by heating. As a result, the same amount of heat shrinkage occurs from both sides, the front and back sides cancel each other, and no warpage occurs. The amount of warpage at this time is about 0 mm to 0.6 mm raised, and the flexible circuit board can be mounted with little warpage.
【００１５】[0015]
【発明の効果】以上述べたように発明によれば、樹脂を
基材とするフィルム上にパターンを形成したフレキシブ
ル回路基板製造において、ソルダーレジストの加熱収縮
がフィルムに与える影響を少なくすることによりフレキ
シブル回路基板の反りを防止することができ、品質の安
定したフレキシブル回路基板を供給する事を可能とする
という効果を有する。As described above, according to the invention, in the production of a flexible circuit board in which a pattern is formed on a resin-based film, the effect of heat shrinkage of the solder resist on the film is reduced by reducing the influence on the film. It is possible to prevent the warpage of the circuit board and to provide a flexible circuit board with stable quality.
【図１】本発明のフレキシブル回路基板の実施例を示す
断面図。FIG. 1 is a sectional view showing an embodiment of a flexible circuit board according to the present invention.
【図２】本発明のフレキシブル回路基板の他の実施例を
示す断面図。FIG. 2 is a sectional view showing another embodiment of the flexible circuit board of the present invention.
【図３】本発明のフレキシブル回路基板の更に他の実施
例を示す断面図。FIG. 3 is a sectional view showing still another embodiment of the flexible circuit board of the present invention.
【図４】従来のフレキシブル回路基板の印刷後の断面
図。FIG. 4 is a cross-sectional view of a conventional flexible circuit board after printing.
【図５】従来のフレキシブル回路基板の加熱形態の正面
図。FIG. 5 is a front view of a conventional flexible circuit board heating mode.
【図６】従来のフレキシブル回路基板のソルダーレジス
ト硬化後の断面図。FIG. 6 is a cross-sectional view of a conventional flexible circuit board after a solder resist is cured.
１ ソルダーレジスト（硬化前） ２ ソルダーレジスト（硬化後） ３ フィルム ４ 銅箔パターン ５ リール ６ エンボスフィルム Reference Signs List 1 solder resist (before curing) 2 solder resist (after curing) 3 film 4 copper foil pattern 5 reel 6 embossed film
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−185051（ＪＰ，Ａ) 特開 平４−372145（ＪＰ，Ａ) 特開 平２−135748（ＪＰ，Ａ) 特開 平４−28244（ＪＰ，Ａ) 特開 平５−3224（ＪＰ，Ａ) 特開 平６−132358（ＪＰ，Ａ) 実開 昭64−13127（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-185505 (JP, A) JP-A-4-372145 (JP, A) JP-A-2-135748 (JP, A) JP-A-4-185 28244 (JP, A) JP-A-5-3224 (JP, A) JP-A-6-132358 (JP, A) JP-A 64-13127 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60
Claims (3)
上にパターニングされた形成された配線パターン、前記
配線パターンの少なくとも一部を含む前記基材上に設け
られたソルダーレジスト、を有するフレキシブル回路基
板の製造方法であって、 前記ソルダーレジストを前記配線パターンの少なくとも
一部を含む前記基材上に設ける工程と、 前記ソルダーレジストの設けられた面が外側になるよう
に前記基材を巻く工程と、 前記基材を巻いた状態で前記ソルダーレジストを硬化す
る工程と、を有することを特徴とするフレキシブル回路
基板の製造方法。1. A flexible circuit comprising: a base material having flexibility; a wiring pattern patterned on the base material; and a solder resist provided on the base material including at least a part of the wiring pattern. A method of manufacturing a substrate, comprising: a step of providing the solder resist on the base material including at least a part of the wiring pattern; and a step of winding the base material so that a surface provided with the solder resist is outside. And a step of curing the solder resist while the base material is wound. A method for manufacturing a flexible circuit board, comprising:
上にパターニングされた形成された配線パターン、前記
配線パターンの少なくとも一部を含む前記基材上に設け
られたソルダーレジスト、を有するフレキシブル回路基
板の製造方法であって、 前記基材における前記配線パターンの形成された面側に
ソルダーレジストを設ける工程と、 前記ソルダーレジストの表面のみ硬化させ内部を未硬化
の状態とする工程と、 前記基材の前記配線パターンが形成された面に反する面
側に、前記表面に設けられたソルダーレジストと同じ形
状で未硬化状のソルダーレジストを配置する工程と、 前記ソルダーレジストを完全に硬化させる工程と、を有
することを特徴とするフレキシブル回路基板の製造方
法。2. A flexible circuit comprising: a base material having flexibility; a wiring pattern patterned on the base material; and a solder resist provided on the base material including at least a part of the wiring pattern. A method of manufacturing a substrate, comprising: providing a solder resist on the surface of the base material on which the wiring pattern is formed; curing only the surface of the solder resist to leave the interior uncured; A step of disposing an uncured solder resist in the same shape as the solder resist provided on the surface on the side of the material opposite to the surface on which the wiring pattern is formed, and a step of completely curing the solder resist. A method for manufacturing a flexible circuit board, comprising:
にパターニングされた形成された配線パターン、前記配
線パターンの少なくとも一部を含む前記基材上に設けら
れた熱硬化型のソルダーレジスト、を有するフレキシブ
ル回路基板であって、 前記ソルダーレジストは、硬化した状態の表面部と、未
硬化の状態の内部と、 を有することを特徴とするフレキシブル回路基板。3. A base material having flexibility, a wiring pattern formed on the base material, a thermosetting solder resist provided on the base material including at least a part of the wiring pattern, A flexible circuit board, comprising: a solder resist having a cured surface portion and an uncured interior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07242093A JP3319009B2 (en) | 1993-03-30 | 1993-03-30 | Flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07242093A JP3319009B2 (en) | 1993-03-30 | 1993-03-30 | Flexible circuit board and manufacturing method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002105689A Division JP3632675B2 (en) | 2002-04-08 | 2002-04-08 | Method for manufacturing flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06283576A JPH06283576A (en) | 1994-10-07 |
| JP3319009B2 true JP3319009B2 (en) | 2002-08-26 |
Family
ID=13488782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07242093A Expired - Fee Related JP3319009B2 (en) | 1993-03-30 | 1993-03-30 | Flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3319009B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4507137B2 (en) * | 1999-12-17 | 2010-07-21 | 東洋紡績株式会社 | Flexible printed wiring board and manufacturing method thereof |
| JP2007123425A (en) * | 2005-10-26 | 2007-05-17 | Seiko Epson Corp | Wiring board manufacturing method |
-
1993
- 1993-03-30 JP JP07242093A patent/JP3319009B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06283576A (en) | 1994-10-07 |
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