JP3319792B2 - Soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus in which a chamber is attached to a top opening of a solder bath.

[0002]

2. Description of the Related Art As shown in FIG. 4, a soldering apparatus includes a solder bath 11 in which a molten solder 13 melted by a heater 12 is stored, and a molten solder surface 13a jetted by a pump 14 and a nozzle 15. The printed wiring board P conveyed by the conveyor 16 comes into contact therewith. Since oxides are likely to be generated on the surface of this type of molten solder, a chamber 17 is attached to the upper opening of the solder bath 11 to prevent such an oxide, and an inert atmosphere is introduced by nitrogen gas or the like injected into the chamber 17. Is maintained.

In a soldering apparatus using an inert atmosphere of this kind, a combustible gas generated in the chamber 17, such as alcohol generated from a flux applied to the substrate P, reacts with oxygen remaining in the chamber. (Oxidation treatment)
Then, the catalyst 18 is used to consume the remaining oxygen in the chamber.

Conventionally, when the atmospheric gas in the chamber 17 is introduced into such a catalyst 18, a dedicated heater 19 is required in advance.
Alternatively, the atmosphere gas is heated and supplied to the catalyst 18 by a part of the preheater for pre-heating the printed circuit board, so that the catalyst 18 can sufficiently exhibit its function.

[0005]

The conventional technique of heating the atmospheric gas in the chamber introduced into the catalyst 18 by using the dedicated heater 19 requires the temperature control, so that the cost cannot be denied. Also, pre-heater, in order to change the set temperature depending on the type of substrate to be processed, the temperature of the chamber atmosphere gas introduced into the catalyst 18 ends up changing, it is introduced into the catalyst <br/> medium 18 gas 200-250 required as temperature
℃ may not be maintained.

The present invention has been made in view of the above circumstances, and has as its object to activate a catalyst for treating an atmospheric gas in a chamber by effectively utilizing thermal energy of a solder bath. It is.

[0007]

According to the first aspect of the present invention, a molten solder melted by a heater is accommodated in a solder bath, and a chamber is attached to an upper opening of the solder bath. In a soldering machine in which atmospheric gas is treated with a catalyst, the catalyst housing
This is a soldering device which is attached and a catalyst is filled in the inside of the catalyst accommodating portion .

According to a second aspect of the present invention, the inside of a solder bath is provided.
The molten solder melted by the heater is stored in the
A chamber is attached to the top opening of the fermenter tank, and inside this chamber
Atmosphere gas is treated with a catalyst by soldering equipment
The lower part of the chamber is immersed in the molten solder
Is a soldering apparatus in which a catalyst is closely attached to a chamber.

According to a third aspect of the present invention, molten solder melted by a heater is housed in a solder bath, a chamber is attached to an upper opening of the solder bath, and an atmosphere gas in the chamber is treated by a catalyst. A heat exchange pipe for introducing an atmospheric gas in the chamber to the catalyst is inserted into the solder bath.

[0010]

According to the first aspect of the present invention, there is provided a semiconductor device which is in close contact with a solder bath.
After passing through the catalyst storage section,
By controlling the catalyst to a suitable temperature, the function of the catalyst is activated.

The invention according to claim 2 is characterized in that the molten solder contains
Through the immersed chamber, the molten solder temperature in the solder bath
By controlling the catalyst to an appropriate temperature, the function of the catalyst can be improved.
Activate.

According to a third aspect of the present invention, the catalytic function is activated by heating the atmospheric gas in the chamber introduced into the catalyst by the thermal energy of the molten solder in the solder bath.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to a first embodiment shown in FIG.
This will be described in detail with reference to the second embodiment shown in FIG. 2 and the third embodiment shown in FIG.

FIG. 1 shows a first embodiment of the present invention in which a molten solder melted by a heater 12 is placed inside a solder bath 11.
The printed wiring board P conveyed by the conveyor 16 contacts the molten solder surface 13a jetted by the pump 14 and the nozzle 15. Oxides are easily generated on the surface of this type of molten solder.To prevent this, a chamber 17 is attached to the upper opening of the solder bath 11 and an inert gas such as nitrogen gas is injected into the chamber 17. ,
An inert atmosphere is maintained.

From one side of the solder bath 11 to the other side, a catalyst housing 21 is installed in close contact with the wall surface of the solder bath 11, and a catalyst 22 is filled in the catalyst housing 21. The catalyst accommodating portion 21 has thermal conductivity and transmits heat of the molten solder 13 in the solder bath to the catalyst 22.

A gas inlet 23 is provided at one end of the catalyst housing 21.
Are provided and communicate with a gas outlet 24 provided on the substrate unloading side of the chamber 17. Further, a gas outlet 25 is provided at the other end of the catalyst storage section 21, and communicates with a suction port of the ejector 26.

When the pressurized inert gas is supplied from an inert gas supply source 27 such as a nitrogen tank, the ejector 26 receives the gas passing through the catalyst by a negative pressure generated around the inert gas flow. The discharge port of the ejector 26 is communicated with a gas return port 28 provided on the substrate loading side of the chamber 17.

In the structure of FIG. 1, the atmospheric gas sucked out of the chamber 17 by the suction action of the ejector 26 is supplied to the solder bath at 200 to 250 ° C.
The catalyst 22 is led to the catalyst 22 having the same temperature as that of 11, and is oxidized by the catalyst 22 whose function is activated by this high temperature.

For example, the atmosphere gas in the chamber is mainly an inert gas such as nitrogen gas, but there is also a flammable gas such as an alcohol component generated from the flux applied to the substrate P. It reacts with the residual oxygen inside and is decomposed into carbon dioxide and water vapor.

The atmosphere oxidized by the catalyst 22 in this manner is mixed into the nitrogen gas fed from the inert gas supply source 27 by the ejector 26 and circulated into the chamber 17.

[0021] Next, a second embodiment of the present invention, the catalyst 22a by the thermal energy possessed by the molten solder 13 in the I vessel, heating the 22b itself, the catalyst 22a, 22b function as indicated in FIG. 2 In this example, the lower part of the chamber 17 is immersed in the molten solder 13 in the vicinity of the portions 17a and 17b.
a and 22b are attached in close contact.

The catalysts 22a and 22b are maintained at 200 to 250 ° C.
Immersive portion 17a from the molten solder 13 heated to, given the heat through 17b, a state of being heated to a temperature approximately equal with molten solder, this directly in contact with the ambient gas to be natural convection in the chamber 17 Oxidation treatment.

Next, in a third embodiment of the present invention shown in FIG. 3, a catalyst 22 is provided outside the solder bath 11,
A heat exchange pipe 31 for introducing an atmosphere gas in the chamber into the solder bath 11 is inserted into the solder bath 11, and the atmosphere gas in the chamber 17 is supplied to the catalyst 22 via the heat exchange pipe 31. The same parts as those in the embodiment of FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

Then, before the atmospheric gas in the chamber 17 is introduced into the catalyst 22 by the suction action of the ejector 26,
Molten solder 13 in a solder bath heated to 200-250 ° C
Since it passes through the heat exchange pipe 31 inside, it is heated by the thermal energy of the molten solder 13 at that time, and the high-temperature atmosphere gas in the chamber is supplied to the catalyst 22, and the reaction of the catalyst 22 is activated.

[0025]

According to the first aspect of the present invention, the solder
Because the catalyst is heated through the catalyst storage unit that is in close contact with the tank,
Even without special catalyst heating means, the melting of the solder bath
The temperature can be automatically controlled to the appropriate temperature to activate the catalyst.

According to the second aspect of the invention, the molten solder
Heats the catalyst through the chamber immersed in the
Even without special catalyst heating means, the melting of the solder bath
Temperature automatically activates the catalyst at the appropriate temperature
Can control.

According to the third aspect of the present invention, even if no special heating means is provided, the atmosphere gas in the chamber to be introduced into the catalyst in advance by effectively utilizing the thermal energy of the molten solder whose temperature is controlled is effectively used. It can be automatically controlled to the temperature suitable for the catalyst function.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a soldering apparatus of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the same soldering apparatus.

FIG. 3 is a sectional view showing a third embodiment of the soldering apparatus.

FIG. 4 is a sectional view showing a conventional soldering apparatus.

[Explanation of symbols]

11 Solder bath 12 Heater 13 Molten solder 17 Chamber 21 Catalyst storage 22 Catalyst 31 Heat exchange piping

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-107091 (JP, A) JP-A-3-34271 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) B23K 1/08 H05K 3/34

Claims (3)

(57) [Claims] 1. A soldering apparatus in which molten solder melted by a heater is housed in a solder bath, a chamber is attached to an upper opening of the solder bath, and an atmosphere gas in the chamber is treated by a catalyst. A soldering device, wherein a catalyst housing is closely attached to a solder bath, and a catalyst is filled in the catalyst housing . 2. The solder bath is melted by a heater inside the solder bath.
Molten solder is stored in the top opening of the solder bath.
Gas is deposited by the catalyst
Solder to the soldering apparatus to be processed Ri, the lower portion of the chamber is submerged in molten solder, wherein the catalyst is adhered to the chamber
Mounting device. 3. A soldering apparatus in which molten solder melted by a heater is accommodated in a solder bath, a chamber is attached to an upper opening of the solder bath, and an atmosphere gas in the chamber is treated by a catalyst. A soldering apparatus, wherein a heat exchange pipe for introducing an atmospheric gas in the chamber to the catalyst is inserted into the solder bath.