JP3320382B2 - Package judgment device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package judging device, for example, to a package judging device for judging a direction of a package conveyed toward a marking process.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional QFP (Quad Flat Packag).
e) is shown. FIG. 2A is a plan view of the QFP, and FIG. 2B is a side view of FIG. The QFP 51 has a molded portion 53 in which a semiconductor chip is accommodated, and a plurality of leads 50 projecting from the molded portion 53 in all directions. The mold part 53 has a one-pin mark 52 corresponding to the first pin at a corner of the surface,
At the center of the front surface, there is a seal character 54 indicating the date of manufacture or product name and serving as a reference in the vertical direction. This seal character 5
Reference numeral 4 denotes a marking based on the 1-pin mark 52. When the marking is performed upside down, Q is marked when mounted on the board.
The FP51 is wired in an incorrect state.

[0003] The above QFP using a laser marker handler
When marking the stamp characters 54 on the 51, a plurality of QFPs 51 are placed on a tray and conveyed, and a dedicated camera detects the 1-pin mark 52 of each QFP 51 from above, and processes the detected data by image processing. Based on this, the orientation of each QFP 51 on the tray is determined. After this determination, QFP5
The marking character 54 is marked in accordance with the direction of 1.

In recent years, a chip size package (CSP) in which a semiconductor chip is housed in a package having substantially the same external dimensions as a semiconductor chip has appeared. In the CSP, a 1-pin mark is not formed on the surface of the package, but is formed on the back surface of the interposer by printing or plating. For this reason, the marking of the seal characters on the CSP is performed as follows.

FIG. 5 shows a CSP transport tray.
(a) is a perspective view of the entire tray, and (b) is a perspective view showing a part of the tray in an enlarged manner. The tray 32 is formed in a rectangular shape, and includes a plurality of chip accommodation units 2 arranged in a matrix.
2, 23. An opening 22 a having a notch 24 at one corner is formed at the bottom of the chip housing portion 22.
The opening 22a is for detecting a 1-pin mark on the back of the CSP from below the tray. On the other hand, an opening is not formed in the chip accommodating portion 23 at the center of the tray for the purpose of vacuum-adsorbing and transporting the tray 32.

At the time of marking using the tray 32, the CSP is placed in each chip accommodating section 22 and the notch 24
The dedicated camera detects the 1-pin mark exposed from, and forms the seal character 54 (first detection method). On the other hand, according to another method, the tray 32 is inverted before the marking, all CSPs are transferred to another tray, and the marking is performed based on detecting the 1-pin mark on the reverse side of the inverted CSP from above on this tray. The character 54 is marked (second detection method).

[0007]

In the first detection method,
The 1-pin mark cannot be detected for the CSP placed in the chip storage section 23 whose bottom is closed, and the chip storage section 22 is not detected.
The work efficiency was not good, for example, the CSP had to be placed and marked only on the surface. Further, in the second detection method, the CSP that falls when the tray 32 is inverted may be damaged, and a separate tray inversion mechanism is required, resulting in an increase in cost.

In view of the above, according to the present invention, in the case of placing and transporting on a tray, it is possible to determine the direction for all the loaded packages irrespective of the presence or absence of the bottom opening of the chip accommodating portion. It is an object of the present invention to provide a package determination apparatus that does not require processing such as transferring a package on a tray to another tray and inverting the package.

[0009]

In order to achieve the above object, a package judging device according to the present invention is a package judging device for judging a direction of a package to be conveyed, and irradiates the package with a transmissive light beam. Irradiating means, an image detecting means for receiving a light beam transmitted through the package and detecting an image of a circuit pattern or a solder pattern in the package, and detecting the image of the circuit pattern or the solder pattern in the package based on the detected image of the circuit pattern or the solder pattern. Determining means for determining an orientation.

The phrase "transmitted light beam" in the present invention means X rays as well as light rays such as infrared rays.

In the package determining apparatus of the present invention, a circuit pattern or a solder pattern can be detected, for example, on the same side as the irradiating means while irradiating the package to be conveyed with a transparent light flux. For this reason, in the case where the package is placed and transported on the tray, the direction can be determined for all the loaded packages regardless of the presence or absence of the bottom opening of the chip accommodating section. In addition, there is no need to perform a process such as transferring the package on the tray to another tray and inverting the package, so that there is no possibility of damaging the package, and the cost can be reduced by eliminating the need for a tray inversion mechanism.

Here, in a preferred package determination apparatus of the present invention, the determination means preferably includes storage means for storing in advance comparison information on the orientation of the package corresponding to the circuit pattern or the solder pattern. This makes it possible to deal with various products by storing in advance the comparison information corresponding to the circuit pattern or the solder pattern that differs for each product.

It is preferable that the package comprises a chip size package having a semiconductor chip and an interposer for fixing the semiconductor chip. In this case, if the transmissive light beam is composed of infrared light in a predetermined wavelength range that passes through the semiconductor chip, the transmissive light beam can be easily supplied using an infrared lamp.

Alternatively, instead of the above, it is also a preferable embodiment that the transmissive light beam is composed of X-rays that pass through both the semiconductor chip and the interposer. In this case, even if the image detection unit is arranged on the opposite side of the irradiation unit with the conveyance path therebetween, the circuit pattern or the solder pattern can be detected.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail based on embodiments of the present invention with reference to the drawings. FIG.
1 is a side view showing a laser marker handler for CSP provided with a package determination device according to an embodiment of the present invention.

The CSP laser marker handler has a transport path constituted by an endless conveyor belt 35 wound around a plurality of pulleys 36, and trays are provided on the upper side of the transport path in order from the upstream side. Sending unit 25, package determining unit 26, laser marker 31, and tray receiving unit 27
Is arranged. At the lower side of the transport path, a tray sending section 25 is provided.
Unit 34 facing the laser marker, tray position adjusting unit 28 facing the laser marker 31, and tray receiving unit 27
A vertically moving unit 43 is disposed opposite to. Also, C
The SP laser marker handler has a control unit 18 such as a microcomputer that controls each unit as a whole.

The tray delivery section 25 has a function of holding a plurality of trays 32 in a stacked manner, and operates at predetermined timings from the lowermost tray 32 at predetermined timing by the operation of the delivery cylinders 33 arranged opposite to each other. To supply. The supplied tray 32 descends while being held by the vertical movement unit 34 and is placed on the conveyor belt 35.

The package determination section 26 includes an infrared camera 38 for photographing an image captured from the opening 29 facing the transport path, an infrared lamp 44 for irradiating infrared light having a wavelength of about 1100 nm, and a vertical and horizontal direction of the opening 29. A linear motion unit 39 for adjusting the position in the direction. When the infrared camera 38 has an epi-illumination half mirror (not shown), the infrared light from the infrared lamp 44 is guided via the optical fiber 45, and the CSP on the tray 32 stopped at a position facing the opening 29. Irradiated almost vertically toward. Not limited to this, the optical fiber 45 and the infrared camera 3
The infrared rays from the infrared lamp 44 can be radiated obliquely toward the CSP on the tray 32 stopped at a position facing the opening 29 without passing through the light source 8. The same can be done.

The laser marker 31 irradiates a laser beam to each of the CSPs placed on the tray 32 on the upper and lower units 41 to mark the stamped characters 12 (see FIG. 3) on the surface of the CSP at the corresponding position. I do.

The tray receiving section 27 has a function of vertically holding a plurality of processed trays 32 in a vertical direction. The tray receiving section 27 is lifted by the vertical movement unit 43 by the operation of the receiving cylinders 42 arranged opposite to each other. The trays 32 are sequentially held.

The tray position adjuster 28 has a two-axis XY table 40 and an upper / lower unit 41. The tray 32 is opposed to the laser marker 31 when marking the seal characters 12.
Is moved in the XY direction by the two-axis XY table 40 and in the up-down direction by the up-down unit 41.

FIG. 2 is a plan view showing the CSP laser marker handler of FIG. In the CSP laser marker handler, the pulley 36 is located on the left and right sides of the conveyance path in plan view.
The conveyor belts 35 are disposed one by one on both sides of the conveyance path at predetermined intervals. With this structure, the vertical movement unit 34, the tray position adjustment unit 28, and the vertical movement unit 43 can move up and down through the transport path. An electric motor 37 for rotating the driving pulley 36 is provided at one end of the transport path.

FIGS. 3A and 3B show CSPs processed by the present CSP laser marker handler. FIG. 3A is a side view, FIG. 3B is a bottom view as viewed from the direction of arrow A in FIG. A diagram showing a circuit pattern formed in a state transmitted through from above,
(d) is a plan view after the marking character marking.

The CSP 11 includes an interposer 14, a semiconductor chip 13 fixed on the interposer 14 (FIG. 3A), and a solder ball row 1 in which minute solder balls are fixed in a matrix on the entire back surface of the interposer 14.
5 and a one-pin mark 16 formed at one corner of the back surface of the interposer 14 (FIG. 3B).

A different circuit pattern 17 is formed for each type of CSP on the interposer 14 side of the semiconductor chip 13 (FIG. 3C), and the circuit pattern 17 is used as comparison information for identifying its vertical direction. It is stored in a memory (not shown) of the control unit 18 in advance. The control unit 18 constitutes a determination unit that determines the orientation of the CSP 11 based on the detected image of the circuit pattern 17 (or a solder pattern described later).

When the circuit pattern 17 is captured from the CSP 11 by the infrared camera 38, the orientation of the CSP 11 on the tray 32 is determined based on the comparison with the comparison information in the memory, and thereafter, the surface of the semiconductor chip 13 is stamped. The character 12 is marked (FIG. 3D).

The CSP laser marker handler of this embodiment operates as follows. When the process is started by a predetermined operation, the vertical movement unit 34 moves up to a predetermined height in accordance with a command from the control unit 18, and in this state, the tray sending unit 25 operates the sending cylinder 33 to move the lowermost unit. Is supplied onto the vertical movement unit.

Next, the vertically moving unit 34 that has received the tray 32 descends, and places the tray 32 on the conveyor belt 35. Further, the electric motor 37 operates to rotate the conveyor belt 35 in the transport direction (the direction of the arrow B in FIG. 1), and the tray 32 faces the package determination unit 26.

The package judging section 26 includes the linear motion unit 3
9, the vertical and horizontal positions of the opening 29 are adjusted, and the plurality of chip accommodating portions 22 and 23 on the tray 32 are adjusted.
While sequentially irradiating infrared rays to the CSPs 11 mounted on the CSP 11 (see FIG. 5), an image of each circuit pattern 17 is photographed by the infrared camera 38. This photographing information is transmitted to the control unit 1
8, the orientation of each CPU 11 on the tray is determined based on the comparison with the comparison information stored in the memory in advance. This determination information is temporarily stored in the memory.

When the determination process for all the CSPs 11 on the tray 32 is completed, the electric motor 37 rotates the conveyor belt 35 by a predetermined amount. Thereby, the tray 32 after the photographing process faces the laser marker 31. In this state, the tray position adjustment unit 28 and the laser marker 31 are driven according to the determination information once stored in the memory. As a result, the laser marker 31 emits laser light to each CSP 11 on the tray 32 while the upper and lower units 41 and the two-axis XY table 40 operate to move the tray 32 appropriately in the vertical and horizontal directions. As a result, the seal character 12 in the direction corresponding to each CSP 11 (FIG. 3D)
Are sequentially marked.

When the marking on all the CSPs 11 on the tray 32 is completed, the electric motor 37 rotates the conveyor belt 35 by a predetermined amount. Thus, the tray 32 after the marking process faces the tray receiving unit 27. In this state, the vertical movement unit 43 is operated, and the other tray 32 held up to the previous time is raised to a predetermined height while being pushed up by the current tray 32, and the receiving cylinder 42 is operated at a predetermined timing. , This time tray 32
Hold. As described above, all CSPs 1 on one tray 32
A series of processes of marking for 1 is completed.

In this embodiment, the transported CSP 11
The circuit pattern 17 can be detected on the same side as the infrared lamp 44 while irradiating infrared light to the infrared light. For this reason, in the case of transporting the CSP 11 placed on the tray 32, the direction can be determined for all the CSPs 11 placed, regardless of the presence or absence of the openings 22a of the chip housing sections 22 and 23.
In addition, there is no need to perform a process such as transferring the CSP 11 on the tray 32 to another tray and inverting the CSP 11, and there is no possibility of damaging the CSP 11, thereby reducing the cost because the inversion mechanism of the tray 32 is not required.

In this embodiment, the CSP on the tray 32
Although the determination method for irradiating infrared rays to 11 to detect a circuit pattern has been described, the determination method is not limited to this, and X-rays can be used instead of infrared rays. In this case, the X-rays pass through the interposer 14 together with the semiconductor chip 13.
Therefore, what is photographed is not the circuit pattern but the solder ball row 15 on the back surface of the interposer 14. In FIG. 3, the pattern of the solder ball array 15 (solder pattern) is simply arranged in a matrix. However, when the pattern of the solder ball array 15 is used for determining the direction of the CSP 11 as described above, the pattern of the solder ball is changed. The arrangement is different between the top and bottom. The output during X-ray irradiation was adjusted,
If the tray 32 can be transmitted together with the CSP 11, the X-ray camera can be arranged at the lower side of the transport path.

In this embodiment, a plurality of CSPs 1
Although the direction determination and the marking are performed in a state in which 1 is placed on the tray 32, the present invention is not limited to this, and the present invention can also be applied to a CSP laser marker handler of a type that transports the CSP 11 one by one.

Although the present invention has been described based on the preferred embodiment, the package judging device of the present invention is not limited to the configuration of the above-described embodiment, but the configuration of the above-described embodiment. Various modifications and changes made from the above are also included in the scope of the present invention.

[0036]

As described above, according to the package judging device of the present invention, when a package is conveyed while being placed on a tray, all the packages placed are placed regardless of the presence or absence of the bottom opening of the chip accommodating portion. Can be determined, and processing such as transferring a package on a tray to another tray and inverting the package can be eliminated.

[Brief description of the drawings]

FIG. 1 is a side view showing a laser marker handler for CSP to which a package determination device according to an embodiment of the present invention is applied.

FIG. 2 is a plan view showing the CSP laser marker handler of FIG. 1;

FIGS. 3A and 3B show a CSP processed by the CSP laser marker handler of the present embodiment, where FIG. 3A is a side view, FIG. 3B is a bottom view seen from the direction of arrow A in FIG. A diagram showing a circuit pattern formed on a chip in a state of being transmitted from above,
(d) is a plan view after the marking character marking.

FIG. 4 shows a conventional QFP, (a) is a plan view of the QFP,
(b) is a side view of (a).

5A and 5B show a transfer tray of the CSP, wherein FIG. 5A is a perspective view of the entire tray, and FIG. 5B is a perspective view showing a part of the tray in an enlarged manner.

[Explanation of symbols]

 11: CSP 12: Sealing character 13: Semiconductor chip 14: Interposer 15: Solder ball array 16: 1 pin mark 17: Circuit pattern 18: Control unit (determining means) 25: Tray sending unit 26: Package determining unit 27: Tray receiving Unit 28: Tray position adjusting unit 31: Laser marker 32: Tray 33: Sending cylinder 34: Vertical movement unit 35: Conveyor belt 37: Electric motor 38: Infrared camera (image detecting means) 39: Linear movement unit 40: 2-axis XY Table 41: Vertical unit 42: Receiving cylinder 43: Vertical unit 44: Infrared lamp 45: Optical fiber

Claims (5)

(57) [Claims] 1. A package determining apparatus for determining a direction of a package to be conveyed, comprising: an irradiating unit configured to irradiate a transmissive light beam to the package; and a circuit pattern in the package that receives the light beam transmitted through the package. Alternatively, a package determining apparatus comprising: image detecting means for detecting an image of a solder pattern; and determining means for determining the orientation of the package based on the detected image of the circuit pattern or the solder pattern. 2. The storage device according to claim 1, wherein the determination unit includes a comparison unit that stores in advance comparison information on the orientation of the package corresponding to the circuit pattern or the solder pattern.
3. The package determination device according to claim 1. 3. The package determination device according to claim 1, wherein the package comprises a chip size package including a semiconductor chip and an interposer for fixing the semiconductor chip. 4. The package judging device according to claim 3, wherein said transmissive light beam is composed of infrared light having a predetermined wavelength range and transmitted through said semiconductor chip. 5. The transmissive light beam includes X-rays that pass through both the semiconductor chip and the interposer.
The package determination device according to claim 3.