JP3320458B2 - Plate making method of heat sensitive stencil paper - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for making a heat-sensitive stencil sheet, and more particularly to a method for easily preventing a hot melt produced by heat perforation from adhering to a thermal head and obtaining excellent perforation. The present invention relates to a method for making a heat-sensitive stencil sheet.

[0002]

2. Description of the Related Art Conventionally, as one of the methods for making a heat-sensitive stencil sheet, a method in which a surface of a thermal head is brought into contact with a thermoplastic film surface and a portion corresponding to an image portion of a document is melt-punched by the heat of the thermal head. Are known. However, when the continuous plate making is performed by this method, the hot melt of the film adheres to the surface of the thermal head, so that there is a problem that the thermal piercing property of the thermal head is reduced. In order to solve this problem, a method of applying a release agent to the film surface of the heat-sensitive stencil paper (JP-A-61-170392), a method of including a release agent in a support or an adhesive (JP-A-2-255)
384) has been proposed, but in any of the methods, the heat-sensitive stencil base paper is subjected to a release agent treatment, so that the manufacturing process of the base paper becomes complicated and the manufacturing cost increases.
Further, there is a disadvantage that uniform performance is hardly obtained.

[0003] To solve this drawback, a thermal head which coating is coated heat melts the film has hardly properties attached is proposed to the surface (actual HirakiAkira 61-191
225). However, when a film such as a fluororesin is coated on the surface of the thermal head, it is difficult to make the thickness of the film uniform. There is a problem in that the thermal conductivity is reduced and uniform perforation of the film cannot be ensured.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and to provide a uniform thermal head surface.
Proof attachment of the thermal head of the thermal melt caused by thermal perforation of the thermoplastic resin film of a silicone resin layer is thermally adhered Gutotomoni, wherein the said thermal head film surface
It is an object of the present invention to provide a method for making a heat-sensitive stencil sheet which can obtain excellent perforation by improving the adhesion to the stencil sheet.

[0005]

[Means for Solving the Problems In order to achieve the above-mentioned problems
The invention claimed in the present application is as follows. (1) the film surface of the heat-sensitive stencil sheet comprising a thermoplastic resin film and the porous support is brought into contact with the surface of the thermal head in performing plate making for heat-sensitive stencil sheet, the surface of the support <br/> Maruheddo , A silicone resin with a lower surface tension than the hot melt of thermoplastic resin film
Applying a grease , heat-generating all the heat-generating elements incorporated on the surface of the thermal head to make a temporary plate of the heat-sensitive stencil paper,
The silicone resin <br/> the heating element surface of the thermal head to form a resin layer having a uniform thickness is thermally fixed,
Next, a continuous stencil making of the heat-sensitive stencil sheet is performed.

In the plate making method of the present invention, a continuous stencil sheet
Before performing subsequent plate making,
Thermoplastic resin film silicone resin solution having a low surface tension surface tension than the thermal melt is applied a temporary
Plate making is performed. Examples of the silicone resin liquid include X-62-7026A and X-62-7026B manufactured by Shin-Etsu Chemical Co., Ltd.
KNS-5004A, KNS-5004B and the like are used. The method for applying the resin liquid is not particularly limited, and the method can be performed, for example, by manually applying the silicone resin liquid by dipping it into a cloth, or by applying the liquid with a coating roller or a blade. The coating amount may be within a range that does not impair the thermal piercing property of the thermoplastic resin film, and specifically, so that the thickness of the resin layer formed in the temporary plate-making process described below is in the range of 0.01 to 2 μm. Adjustment is preferred.

[0007] The resin liquid applied to the surface of the thermal head is thermally fixed by a temporary plate to form a resin layer. Temporary plate making is performed by supplying power to all of the heating elements incorporated on the surface of the thermal head to generate heat and transporting the heat-sensitive stencil sheet, for example, to repeat plate making for about five plates.
The number of plate making during temporary plate making is appropriately determined depending on the type of resin liquid and the like. By this temporary plate making process, an extra resin layer attached to the surface of the thermal head can be removed, and a uniform resin layer can be formed on the entire heating element surface of the thermal head. By performing the process of reducing the surface tension on the surface of the thermal head and performing temporary plate making in this manner, a uniform resin layer can be formed on the entire heating element surface of the thermal head. The hot melt does not adhere to the surface of the thermal head but is absorbed and reattached to the support side, and the adhesion between the heat-sensitive stencil paper and the thermal head is improved, and the heat perforation of the film is improved.

[0008]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. Example 1 Shin-Etsu Chemical Co., Ltd. brand name KNS-5004A and KNS-50
04B was prepared at a weight ratio of 10: 1 and stirred to obtain a silicone resin liquid. This silicone resin liquid was manually applied to the surface of the thermal head to a thickness of 0.5 μm. When the surface roughness of this coating layer was measured,
The value of the zero point average roughness was 2.3 μm. Next, this thermal head was used as a plate making machine (RC-115 manufactured by Riso Kagaku).
, And electric power was supplied to all the heat generating elements of the thermal head to repeat the heat-sensitive stencil stencil for five plates to perform temporary plate-making. As a result, the coating layer of the silicone resin liquid was thermally fixed to the surface of the thermal head, and an excessive amount of the resin layer was removed to form a uniform resin layer having extremely excellent thermal conductivity. Next, using the thermal head in this state, continuous stencil making of a heat-sensitive stencil sheet having a polyester film on its surface was performed, but no phenomenon was observed in which a hot melt of polyester adhered to the thermal head, and stencil making with good perforation properties was performed. An image was obtained. It was confirmed by measurement of the contact angle that the surface tension of the silicone resin liquid was lower than the surface tension of the hot melt of the polyester film.

Comparative Example 1 In Example 1, continuous plate making was performed in the same manner as in Example 1 except that temporary plate making was not performed, but no phenomenon was observed in which a hot melt of polyester adhered to the thermal head. However, the piercing property was remarkably inferior. Comparative Example 2 In Example 1, temporary plate making was performed in the same manner as in Example 1 except that the thermal head was treated with dimethyl silicone oil instead of the silicone resin liquid, and then continuous plate making was performed. The phenomenon that the hot melt of polyester melted to the thermal head occurred, and good perforation was not obtained. At this time, the surface tension of the thermal head surface was almost the same as that of the untreated thermal head surface.
The surface tension of dimethyl silicone oil and the surface tension of the hot melt of polyester were examined in the same manner as in Example 1. As a result, it was found that the surface tension of dimethyl silicone oil was higher than that of the polyester melt.

[0010]

According to the plate making method of the present invention, a silicone resin liquid having a surface tension smaller than that of a hot melt of a thermoplastic resin film is applied to the surface of a thermal head, followed by temporary plate making. Since the resin layer can be uniformly heat-fixed to the surface of the thermal head without forming an extra resin layer, it is possible to prevent the above-mentioned hot melt from adhering to the thermal head even when performing continuous plate making. Piercing property can be ensured.

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B41C 1/055 511

Claims (1)

(57) [Claims] 1. A by contacting the film surface of the heat-sensitive stencil sheet comprising a thermoplastic resin film and the porous substrate on the surface of the thermal head in performing plate making for heat-sensitive stencil sheet, the surface of the thermal head, heat sheet having a smaller surface tension surface tension than the thermal melt of thermoplastic resin film
Applying a recone resin solution, heat is generated all heating elements embedded in the surface of the thermal head performs the temporary plate-making of the heat-sensitive stencil sheet, the silica to the heating element surface of the thermal head
Corn resin to form a resin layer having a uniform thickness is thermally fixed, and then the process for making a heat-sensitive stencil sheet, characterized in that a continuous plate-making of the heat-sensitive stencil sheet.