JP3324376B2 - High viscosity material molding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for molding a high-viscosity material.

[0002]

2. Description of the Related Art As a specific example of a technique for molding and using a high-viscosity material, there is a technique for forming a bump electrode on a semiconductor IC. A metal material to be a bump electrode is made into a high-viscosity mixed liquid state together with a binder, and the mixture is discharged from a nozzle by a predetermined amount to form a predetermined electrode shape on a substrate.
This method has a feature that the operation is simpler and the number of steps can be reduced as compared with a technique of manufacturing a bump electrode using a photoengraving technique or an etching technique, which is generally performed conventionally.

[0003] On the other hand, a high-viscosity adhesive is deposited on a substrate in the form of spots for the purpose of die bonding or the like. Also in this case, the high-viscosity adhesive is formed into a predetermined spot shape using the same nozzle as described above.

[0004]

In the above-mentioned working techniques for bump electrodes and the like, the shape of a high-viscosity material is very important. It is required to obtain a molded product having a predetermined shape and size. However, a material liquid having a high viscosity has poor fluidity, and it is difficult to precisely control a discharge amount from a nozzle. Therefore, the shape and size of the formed high-viscosity material tend to vary. Further, in the case of the above bump electrodes, a large number of bump electrodes, such as several tens to more than one hundred, may be provided on one IC substrate. Dispensing and molding is a very laborious task. In particular, a high-viscosity material liquid with poor fluidity does not start discharging immediately when opening the gate or applying pressure to discharge from the nozzle, and conversely, immediately stopping discharging from the nozzle. Discharge does not end. Therefore, it takes a long molding time for each molding, and when a large number of moldings as described above are repeated, workability becomes extremely poor. Techniques have been proposed to solve the above problems by improving the shape and structure of the nozzle, but they have not been sufficiently solved, and the structure of the device such as the nozzle becomes complicated. The problem remains.

[0005] An object of the present invention is to supply a high-viscosity material as described above to a concave portion for molding quickly and accurately when molding it into a predetermined shape, and to place a molded article having an accurate shape and size at an accurate position. An object of the present invention is to provide a molding method that can be formed with good workability. In order to achieve this object, for example, in the case of a bump molding apparatus, it is necessary to supply the bump material in a non-molten state having no high viscosity. It is necessary to rapidly perform a heating / cooling cycle of heating and melting at the molding recess and then cooling.

[0006]

Therefore, in order to achieve a rapid heating / cooling cycle inside a mold, the present invention provides a mold having excellent heat conductivity and forming a mold recess from the outside of the mold. It was completed by focusing on the fact that it was necessary to configure it so that heating and cooling could be performed through the mold.When molding a high-viscosity material that exhibits high viscosity when melted, a mold made of highly oriented graphite material was used. Is prepared, a high-viscosity material is supplied in a non-molten state to the molding concave portion in the mold, and the high-viscosity material in the molding concave portion is heated and melted from the outside via the mold, and is then melted through the mold. There is a molding method in which a molten high-viscosity material is cooled and molded into a desired shape.

In the present invention, in order to carry out the above-mentioned molding method, it is necessary for the above-mentioned molding die to quickly and accurately transfer heat to the molding recess from the outside of the molding die. The oriented graphite material is a laminate in which highly oriented graphite sheets are laminated, and the molding concave portion is formed on one side surface in which the end surfaces of the sheets are arranged in parallel, and the graphite crystal is preferably oriented on the opposite side surface. .

Further, in order to uniformly heat and cool the molding recesses of the molding die, it is necessary to define the side surfaces of the highly oriented first graphite sheet laminate forming the molding die in parallel. On the opposite side, the second
It is preferable that the laminate in which the graphite sheets are laminated is joined, and the molding recess formed on the end face of the second laminate via the first laminate is heated and cooled.

A laminate of the above sheet is disclosed in JP-A-4-215.
Using the method described in No. 08, a specific polymer film is laminated and heat-treated in a temperature range of 2000 ° C. or more in an inert gas, and finally heat-treated at a temperature of 2400 ° C. or more. However, it is preferable that they are bound by a heat-resistant band and fixed integrally. The polymer film contains a filler and has a thickness of 200 μm or less. It is selected from the group consisting of m-phenylene isophthalamide), poly (phenylene benzobisimidazole), polythiazole, and polyparaphenylene vinylene, and is particularly preferably an aromatic polyimide film such as polypyrrolimitimide.

[0010] In order to supply the high-viscosity material to the molding recess in the molding die, it is preferable that the molding die is provided with a high-viscosity material supply means for supplying the high-viscosity material to the molding recess. Further, in order to heat and melt the high-viscosity material in the molding recess from the outside via the molding die and to cool the molten high-viscosity material, the molding die is formed on the outer surface of the molding recess. It is preferable to provide a heating and cooling means for selectively heating and cooling the inside of the recess.

In the case of molding using the above powder form, it is preferable to prepare a high-viscosity material in the form of a paste by kneading with a printing binder. Various powders such as a bump material powder, a dielectric material powder, an insulating material powder, and an optical component material powder are selected.
The printing binder volatilizes and disappears when heated in the molding recess. As a means for supplying the paste-like high-viscosity material, a screen printing plate having a powder passage portion at a position corresponding to the molding recess arranged above the surface having the molding recess of the molding die; It is preferable that the screen printing apparatus includes a squeegee that pushes the powder supplied on the upper surface of the screen printing plate along the screen printing plate.

When the high-viscosity material is a linear body for wire bonding or the like, the high-viscosity material supply means includes:
It is configured as a linear body supply device that is disposed above a surface of the molding die having the molding concave portion and that feeds the tip of the linear body into the molding concave portion. On the other hand, it is preferable that the heating and cooling means include a heating element and a cooling element that can selectively contact the opposite surface of the mold.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of the present invention, a high-viscosity material forming die is made of highly oriented graphite and has excellent heat conductivity. At this time, the heating of the high-viscosity material through the mold is performed quickly and efficiently. Even when cooling the molded product of the high-viscosity material that has been heated and melted, it can be cooled quickly and efficiently via the mold. Therefore, the powder or the linear body is supplied to the molding concave portion, and a predetermined molded body can be molded using a rapid heating / cooling cycle. Since this highly oriented graphite is also excellent in heat resistance, it can be applied to a high viscosity material which must be melted at a high temperature without any problem.

If the highly oriented graphite is oriented from the surface having the molding concave portion to the opposite surface, the highly oriented graphite has a particularly high thermal conductivity in a direction along the orientation. By heating or cooling from the outer surface opposite to the molding concave portion, the powder or the molded product in the molding concave portion on the surface can be quickly and efficiently heated and cooled.

[0015] Highly oriented graphite is generally manufactured in a thin sheet state. By laminating such highly oriented graphite sheets into a laminate, a thick mold can be easily formed. The laminate of the highly oriented graphite sheet oriented in the plane direction is in a state where it is well oriented as a whole in the plane direction of the sheet.
If there is a molding recess on the surface where the end faces of the sheet are arranged side by side, a highly moldable mold having highly oriented graphite with a uniform orientation from the surface having the molding recess to the opposite surface will be obtained. The thermal conductivity from the surface to the opposite surface is improved.

The laminate of highly oriented graphite sheets is
If they are tied together with a heat-resistant band and fixed integrally,
A molding die can be easily manufactured without bonding the sheets constituting the laminate one by one. Since the mold is heated to a high temperature or repeatedly heated and cooled, the unity of the sheets is reduced by means such as bonding.
If they are bound with a heat-resistant band, they can sufficiently withstand heating to a high temperature or rapid heating and cooling.

If the above-mentioned mold is provided with a high-viscosity material supply means and a heating and cooling means, a series of operation steps from supply of the high-viscosity material to the concave portion for molding, heating and melting of the high-viscosity material, and further cooling. Can be done quickly. When the molding material is a powder, a high-viscosity material is formed by kneading the powder and a printing binder that is volatilized by heating.
It is easy to handle and easy to heat melt and mold. In this case, if the high-viscosity material supply means includes a screen printing apparatus having a screen printing plate and a squeegee, a required amount of powder can be reliably and efficiently supplied to the molding concave portion of the molding die. Even when a large number of molding concave portions are provided in the molding die, the powder can be simultaneously and uniformly supplied to the large number of molding concave portions.

If the high-viscosity material is a linear body that can be heated and melted, it is unlikely to be scattered like powder and is easy to store and carry. In this case, if the high-viscosity material supply means sends the tip of the linear body into the concave portion for molding, only the linear member of a required length can be heated and melted in the concave portion for molding to be molded.
There is no fear that the high-viscosity material leaks out of the molding recess. The structure of the device for supplying the linear body is simplified.

If the heating / cooling means is provided with a heating member and a cooling member which can be selectively contacted on the opposite surface of the mold, complicated heating and cooling mechanisms are provided inside the molding die made of highly oriented graphite. Is not required, and the production of the mold is easy. When a heating element is brought into contact with the molding die, heating is started immediately.When the heating element is separated from the molding die and brought into contact with a cooling element, cooling is quickly started. Thus, work efficiency can be improved.

In the method for molding a high-viscosity material according to the present invention, the high-viscosity material is supplied to the molding recesses of the molding die in a non-molten state in the form of a powder, a powder kneading paste or a linear body. The material can be supplied to the mold much more easily than supplying the material. Further, the supply amount of the high-viscosity material can be set accurately. If a heating element is brought into contact with the surface of the molding die opposite to the molding depression, the powder supplied to the molding depression on the surface can be rapidly supplied through the molding die made of highly oriented graphite having excellent thermal conductivity. , And is molded according to the shape of the molding concave portion. If the cooling body is brought into contact with the mold in place of the heating body, the molded product in the molding concave portion is quickly cooled, and a predetermined molded shape can be maintained. The cooled molded product can be taken out of the mold and used freely.

When the high-viscosity material is a mixed powder of a metal and a binder, it is possible to easily and efficiently manufacture a molded product for producing a metal sintered product and a molded product for forming a bump electrode. it can. If the high-viscosity material is a bump material, it is possible to easily and efficiently manufacture a bump electrode.
If the high-viscosity material is a dielectric material or an insulating material, it is possible to easily and efficiently manufacture dielectric members and insulating members used for various electronic devices and the like. If the high-viscosity material is an optical component material, optical components used for various optical devices and the like can be easily and efficiently manufactured. If the high-viscosity material is a linear material for wire bonding, it is possible to easily and efficiently manufacture a wire bonding structure used for various electronic devices and the like.

The molding apparatus shown in FIG. 1 is a molding apparatus used for producing bump electrodes on an IC substrate. Mold 1
0, a heating element 21 and a cooling element 30. Mold 1
0 is a strip-shaped highly oriented graphite sheet 12a
Are laminated in the thickness direction in a rectangular parallelepiped laminate 12
And a heat-resistant band 14 arranged on the outer periphery of the laminated body 12 along the laminating direction of the sheet 12a.

Graphite is a crystal of carbon, and the crystal has a layered structure. The material in which the carbon crystals are arranged with a certain orientation is highly oriented graphite. In order to produce highly oriented graphite, for example, it is obtained by baking a specific polymer film under the following conditions as described above. By baking and solidifying a plurality of polymer films in a stacked state, highly oriented graphite in the form of a sheet or a block can be obtained. The highly-oriented graphite sheet 12a may be a highly-oriented graphite film itself composed of the above-mentioned polymer film, or may be a sheet having a predetermined thickness by sintering a plurality of thin highly-oriented graphite films in a laminated state. May be used The thickness of the sheet 12a is 5 to 200 μm.
m is used.

Production Example 1 200 sheets of 25 μm-thick polypyromellitimide (Kapton H film manufactured by DuPont) were stacked, set on a graphite jig, and heated to 1400 ° C. at a rate of 10 ° C./min in argon gas. The temperature rose. During this time, the sample was 100g
/ Cm ² of jig weight pressure was applied. Then, 1
After reaching 400 ° C., 30
The mixture was heated to 1600 ° C. while applying a pressure of kg / cm ² . Thereafter, the pressure was reduced so that only the pressure of the jig was applied, and heating was performed to 2700 ° C. Then the pressure is 300
and kg / cm ^2, the temperature was raised to 3000 ° C., to complete the heat treatment, to obtain a graphite block.

Production Example 2 A 25 μm-thick polypyromellitimide (Kapton H film manufactured by DuPont) containing 5% by weight of calcium hydrogen phosphate was used in an LTF-S type electric furnace manufactured by Sankyo Electric Furnace Co., Ltd. The temperature was raised to 1000 ° C. at a rate of 3 ° C./min in nitrogen gas, and the heat treatment was performed at 1000 ° C. for 1 hour. Next, the obtained carbonized sheet was set inside a graphite cylinder so that it could be freely expanded and contracted, and was heated at 5 ° C./m together with the graphite cylinder using an ultra-high temperature furnace 46-5 manufactured by Shinsei Electric Co., Ltd.
Heated to 2800 ° C. at in speed. The heating was performed at normal pressure in an argon atmosphere. The obtained sheet was rolled through two stainless steel rollers (manufactured by Kumagai Riki Kogyo Co., Ltd.). A sheet having a thermal conductivity of 860 kcal / m · h · ° C. and a tensile strength of 630 Kgf / cm ² was obtained.

The heat-resistant band 14 is made of the same highly oriented graphite sheet as the laminate 12,
2 which is wound around the outer periphery of the sheet 2 to form the laminate 12
a are strongly bound together and integrated and fixed. The ends of the heat-resistant band 14 are overlapped and adhered or mechanically joined. On the upper surface of the molding die 10 on which the end surfaces of the sheet 12a are arranged, a large number of molding concave portions 16 are provided along the outer periphery. In order to form the forming concave portion 16 on the surface of the forming die 10 made of the highly oriented graphite sheet 12a, electric discharge machining is applied.

The recess 16 is shaped like a circular column and has a spherical bottom surface. The shape and arrangement of the molding recess 16 are set in accordance with the shape and arrangement of the bump electrode to be manufactured. The heating body 20 is made of metal or the like having a large heat capacity, has an upper surface shape in contact with the bottom surface of the mold 10, and has a rectangular parallelepiped shape as a whole. The cooling body 30 is also made of the same material as the heating body 20 and has a similar shape.

The heating element 20 moves between a position in contact with the bottom surface of the molding die 10 and a heating device (not shown) such as a heating furnace or a heater for heating the heating element 20 at a position remote from the molding die 10. It is provided movably. The cooling body 30 is provided movably between a position in contact with the bottom surface of the molding die 10 and a position away from the molding die 10. The cooling body 30 may be maintained at a low temperature with respect to the heating body 20 by being allowed to cool at room temperature without providing a special cooling device.

In order to facilitate uniform heating or cooling from the heating element 20 and the cooling element 30, a heating element having high orientation in the plane direction shown in FIG. 200 or a heating / cooling body 300 can be used. In the case of FIG.
A second graphite sheet having orientation perpendicular to one side opposite to one side where the end faces of the mold 100 which is the first graphite sheet laminate having high orientation forming the side is arranged in parallel. YAG or CO ₂ laser beam device 202 which is formed by joining bodies 200 via a flexible bonded graphite sheet 201 (which can be manufactured by the method shown in JP-A-2-103478) and reciprocates horizontally. From the second stack 200
And the heat spread in the surface direction of the second laminate 200 is received through the first laminate 100, and the molding recess 16 formed on the end face thereof can be heated. . Since the second stacked body 200 has a high orientation in the plane direction, the second stacked body 200 has a property of functioning as a uniform heating source even if the laser beam irradiates the center and has a thickness of 1 mm or more. ing.

On the other hand, in FIG. 9, the Peltier device 300 is used as a heating / cooling body instead of the laser beam device used in FIG. 8, and the Peltier device 300 is provided at a part of both ends of the second laminate 200. Second laminate 200
The first layered body 100 may be used as a uniform heating and cooling source by utilizing the high orientation in the surface direction. A molding method using the molding apparatus having the above structure will be described.

As shown in FIG. 2, a screen printing device 40 is arranged above the mold 10. The screen printing device 40 is a device used for so-called silk screen printing. The screen printing device 40 has a screen printing plate 42 whose periphery is supported by a frame. The screen printing plate 42 is made of a metal or synthetic resin plate or mesh, and has holes through which the printing material passes only at locations where printing is to be performed. In this embodiment, the screen printing plate 42 has a powder passage hole 46 having a circular shape substantially the same as the planar shape of the molding recess 16 at a position above the molding recess 16 of the molding die 10.
It is provided in.

A powder paste 50 of a high-viscosity material is supplied to the upper surface of the screen printing plate 42, and a knife-shaped squeegee 44 having a sharpened lower end moves along the upper surface of the screen printing plate 42. The powder paste 50 is a powder in which a metal powder to be a bump electrode and a binder made of a synthetic resin exhibiting an action of combining the metal powders during molding are mixed.

As the squeegee 44 moves, the powder passage holes 4
The powder paste 50 dropped from the molding recesses 16
Accumulate inside. The powder paste 50 is applied to the molding recess 16.
Can be supplied to a quantity near or slightly above the upper end of the. The powder paste 5 is formed in the molding recess 16.
After 0 is supplied, as shown in FIG. 1, the heating body 20 heated to a high temperature of about 300 ° C. is brought into contact with the bottom surface of the mold 10. Then, heat is transmitted from the heating body 20 to the powder paste 50 in the molding recess 16 via the molding die 10. The heated powder paste 50 is melted and formed according to the shape of the forming recess 16. When a printing binder is used as the binder, the binder can be volatilized and eliminated during heating.

As shown in FIG. 3A, the heat-melted powder 50 is formed into a spherical shape along the bottom shape of the forming concave portion 16 by the action of its own surface tension or the like to form a molded product 52. . When the powder 50 is heated and melted to form the molded product 52, the heating body 20 is removed from the bottom surface of the molding die 10, and the cooling body 30 maintained at a temperature of about 20 ° C. is brought into contact with the bottom surface of the molding die 10. . The molding 52 is cooled through the molding die 10. If the molded product 52 is cooled to the extent that it can be handled,
The cooling body 30 may be separated from the mold 10 and the cooling may be terminated. The molding 52 can be taken out from the molding recess 16.

In this embodiment, as shown in FIG. 3B, the molding 52 is directly transferred from the molding die 10 to the substrate 60 on which the bump electrodes are to be formed. That is, the projections 62 for supporting the electrodes are provided on the lower surface of the substrate 60. The protrusion 62 may be a part of a terminal or a wiring member of the IC substrate. The protrusion 62 is pierced into the molded product 52 by approaching the molding die 10 of the substrate 60. At this time, the molded product 52 is in an easily deformed state before being completely cooled and solidified. Molded product 5
When the protrusion 62 pierced into the protrusion 2 is lifted together with the substrate 60, the molded product 52 is picked up from the molding recess 16 and transferred to the substrate 60 with the molded product 52 pierced at the tip of the projection 62. When the molded product 52 transferred to the substrate 60 is further cooled and solidified, the molded product 52
Is fixed in a state of being pierced.

In this way, the molded product 52 is
Directly from the mold 60 to the substrate 60, there is no need to separately perform the operation of taking out the molded product 52 from the molding die 10 and attaching the taken-out molded product 52 to each predetermined position of the substrate 60. Work can be performed very efficiently. In addition, since no other device or member comes into contact with the molded product 52, the shape of the bump electrode to be produced has the same exact shape as the molded product 52 at the time of molding. Foreign matter can be prevented from entering the molded product 52.

The shape of the molding recess 16 provided in the molding die 10 may be hemispherical as shown in FIG. In the case of the hemispherical concave portion 16 for molding, as shown in FIG. 4B, the powder 50 is supplied so as to rise above the upper end of the concave portion 16 for molding and rise on the surface of the mold 10. The powder 50 is applied to the molding die 10 around the molding recess 16.
It may be protruding to the surface.

As shown in FIG. 4C, when the powder 50 is heated and melted, a spherical molded product 52 is formed in the same manner as in the above embodiment.
Is formed. As the powder 50 is heated and melted, it is formed into a spherical shape due to the effect of surface tension and the like.
, And the powder 50 is also integrated with the molded product 52. In this embodiment, the molding 52 is formed by the molding recess 16.
, It is easy to perform the above-described transfer operation to the substrate 60. Even if the substrate 60 does not have the projections 62, the flat surface of the substrate 60 is brought into contact with the upper end of the spherical molded product 52 protruding from the surface of the molding die 10, and the molded product 52 is attached to the substrate 60, The object 52 can be transferred to the substrate 60.

Next, as shown in FIGS. 5A to 5C, a conical concave portion 16 for molding can be used. Again,
When the powder 50 supplied immediately outside the molding recess 16 is heated and melted, it is formed into a spherical shape due to surface tension and the like, and the spherical molded product 5 inscribed in the conical molding recess 16 is formed.
2 is obtained. In this embodiment, the molded product 5 to be formed is controlled by the amount of the powder 50 supplied to the concave portion 16 for molding.
The ball diameter of 2 changes. Various types of spherical molded products 52 can be easily molded with one kind of conical molding concave portion 16.

As shown in FIG. 6, a wire 54 formed by forming a wire bonding material, which is a high-viscosity material, into a thin wire shape can be used. As shown in FIG. 6A, the linear body 54 is arranged above the molding recess 16 of the molding die 10. The handling of the linear member 54 is performed using a similar device for handling a linear object such as a normal wire bonding apparatus.

As shown in FIG. 6B, the distal end of the linear body 54 is pressed against the heated concave portion 16 of the mold 10. The linear body 54 is gradually heated and melted from the tip. If the linear body 54 is continuously pressed against the molding recess 16, the linear body 5
4 is heated and melted one after another, and the high-viscosity material accumulates in the heat-melted state in the molding recess 16. As shown in FIG. 6C, when a necessary amount of the high-viscosity material of the linear member 16 is supplied into the concave portion 16 for molding, the linear member 54 is moved away from the concave portion 16 for molding.
The high-viscosity material in the heat-melted state accumulated in the molding recess 16 is naturally molded into a spherical shape in the same manner as in the above embodiment, and a spherical molded product 56 is obtained. The subsequent cooling step is performed in the same manner as in the above embodiment.

[Embodiment of Performing Vacuum Suction] As shown in FIG. 7, the basic steps are the same as those of the embodiment shown in FIG. 4, but in this embodiment, FIG. As shown in FIG. 7, after the powder 50 of the high-viscosity material is supplied to the molding recess 16 of the molding die 10, as shown in FIG.
Is sent to the vacuum suction device 80. In the vacuum suction device 80, the mold 10 was heated to release volatile components such as a binder component contained in the powder 50, and the gas in the vacuum suction device 80 was released from the powder 50 by vacuum suction. Volatile components are removed to the outside.

As shown in FIG. 7 (c), the powder 50 from which the volatile components have been removed is heated and melted and shaped according to the shape of the forming recess 16, and a molded product 52 having a substantially lens shape is obtained. In this embodiment, the volatile components contained in the high-viscosity material can be quickly and efficiently removed by vacuum suction, the workability of the molding process can be improved, and the obtained molded product 52 has the volatile components. Less residue and high quality.

[Other Embodiments] (1) The molding die 10 may be composed of a laminate 12 in which the above-mentioned highly oriented graphite sheets 12a are laminated, or may be formed by using block-shaped highly oriented graphite. It can also be configured. (2) In addition to the above-described electric discharge machining, machining techniques such as etching and laser machining can be applied to the machining of the molding recess 16.

(3) The heat-resistant band 14 is made of a material other than the high-orientation graphite, as long as it has heat resistance enough to withstand heating during the molding process and mechanical strength capable of binding the high-orientation graphite sheet 12a. Materials can also be used. If the heating temperature during molding exceeds 1200 ° C,
Ceramic insulation fabrics or highly oriented graphite sheets are preferred. When the heating temperature during molding is low, a metal band can be used.

(4) As the high-viscosity material, any material can be used as long as it contains various metals, synthetic resins, ceramics, and other organic and inorganic substances, such as the above-mentioned materials for bump electrodes. It is preferable to apply the present invention to a material which has been conventionally formed into a high-viscosity liquid state. Specifically, electrode materials, dielectric materials, insulating materials, adhesives, and the like used for various electronic components are used. In addition, sintered materials for sintering various types of mechanical parts can also be used. Optical component materials such as glass are also used. In order to use a high-viscosity material as a powder or a linear body, a material that can be processed into each form may be used.

(5) In order to heat and melt a high-viscosity material for molding, the material is heated to a heating temperature corresponding to each high-viscosity material. When the heating temperature is relatively low, molding can be performed in the air, but when the heating temperature is as high as 800 ° C. or more, it is preferable to perform molding in an inert gas. (6) In order to mold the molded product 52 from the powder 50 or the linear body 54 of the high-viscosity material, a means for heating the molding die 10 is indispensable. In some cases, no means are necessary. However, a cooling means such as the above-described cooling body 30 is effective for quickly cooling and improving workability.

(7) The present invention can be applied not only to the formation of the above-mentioned bump electrodes and spot-shaped adhesives but also to the molding of a sintered material for sintering and manufacturing various mechanical parts. It can also be applied to melt molding of optical parts such as glass. FIG. 10 shows a comparison between the conventional method and the case where the method of the present invention is applied in circuit mounting. That is, conventionally, a bonding component is formed by a bonding wire and a gold ball and bonded to an IC to be transported. If the number of joints is N, the joining is repeated N times. Next, a solder / silver paste is printed, and the IC component is surface-mounted on a separately conveyed circuit board. Next, after performing a reflow / laser reflow on the circuit board on which the IC components are mounted, a final inspection of the circuit mounting is performed.

According to the present invention, a printing paste formed by kneading a powder of a high-viscosity material for a joint part and a printing binder is supplied to the concave portion of the molding die of the present invention by screen printing, and heated and melted. After cooling, it is molded. By one molding, the three-dimensionally joined parts are aligned and manufactured in the mold. Therefore, a predetermined IC can be conveyed to the molding die having the aligned joining components, and the joining components can be collectively transferred and joined. The surface mounting on the circuit board is the same as the conventional one.

FIG. 11 shows a comparison between the conventional method and the molding method applied to the method of the present invention in molding an optical component. That is, conventionally, as a lens material, a ball lens is cut and cut from a lens rod, polished into a predetermined shape, formed into a predetermined shape by a heating and pressing press, polished and sent to a final inspection. On the other hand, when the present invention is applied, the glass frit of the lens material is pulverized into ultrafine powder, and kneaded with an acrylic low-molecular composition (eg, a binder for ceramic green sheet) as a printing binder to form a paste. Eggplant This paste is injected into the molding recesses of the mold by the printing method of the present invention. Therefore, while the thermal cycle is precisely controlled by a laser beam, the material is heated to a high temperature of about 1600 ° C. to melt and volatilize the binder component, and then press-formed. According to the method of the present invention, the steps of cutting and polishing the lens ball are not required, and the molding step becomes extremely easy.

[Brief description of the drawings]

FIG. 1 is a perspective view of a molding apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a process of supplying a high-viscosity material.

FIG. 3 is a sectional view showing stepwise a transition process of a molded high-viscosity material.

FIG. 4 is a cross-sectional view showing stepwise a forming process using another embodiment of the forming concave portion.

FIG. 5 is a sectional view showing stepwise a molding process using another embodiment of the molding concave portion.

FIG. 6 is a sectional view showing stepwise a molding process using a linear body according to an embodiment of the present invention.

FIG. 7 is a sectional view showing stepwise a molding process of an embodiment of the present invention using a vacuum suction device.

FIG. 8 is a side view showing an outline of a molding die when a laser beam is used as a heating source.

FIG. 9 is a side view showing an outline of a molding die when a Peltier element is used as a heating / cooling source.

FIG. 10 is a process diagram comparing a conventional circuit mounting process with a circuit mounting process when the method of the present invention is applied.

FIG. 11 is a process chart comparing a molding process of a conventional optical component with a molding method when the method of the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Mold 12 Laminated body 12a Highly oriented graphite sheet 14 Heat-resistant band 16 Molding recess 20 Heating body 30 Cooling body 40 Screen printing device 42 Screen printing plate 50 High-viscosity material powder 52 High-viscosity material molded product 54 High Linear body of viscous material

Continuation of front page (56) References JP-A-5-17118 (JP, A) JP-A-5-17117 (JP, A) JP-A-5-97418 (JP, A) JP-A-6-69282 (JP, A) , A) JP-A-8-115946 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60 C01B 31/04 101 C04B 35/52

Claims (10)

(57) [Claims] In molding a high-viscosity material that exhibits high viscosity when molten, a molding die made of a highly oriented graphite material is prepared, and the high-viscosity material is placed in a non-molten state in a molding recess in the mold. A high-viscosity material molding method for supplying and heating and melting the high-viscosity material in the molding recess from the outside via the mold, and cooling and melting the high-viscosity material through the mold into a desired shape. . 2. The laminated body in which the highly oriented graphite material constituting the molded mold is laminated with a highly oriented graphite sheet so that the molding die transmits heat to the molding recess from the outside. 2. The method for molding a high viscosity material according to claim 1, wherein the molding concave portion is formed on one side surface where the end surfaces of the sheet are arranged side by side, and the graphite crystal is oriented on the opposite side surface. 3. A second structure in which the orientation is orthogonal to a side opposite to one side in which the end faces of the highly oriented first graphite sheet laminate forming the forming recesses are arranged in parallel. The high-density laminate according to claim 2, wherein the laminate in which the graphite sheets are laminated is joined, and the molding recess formed on the end face of the second laminate through the first laminate is heated and cooled. Molding method for viscous materials. 4. The method for molding a high-viscosity material according to claim 3, wherein the laminate of the sheets is bound and integrally fixed by a heat-resistant band. 5. In order to supply a high-viscosity material to a molding recess in the molding die, the molding die includes high-viscosity material supply means for supplying the high-viscosity material to the molding recess. In order to heat and melt the high-viscosity material in the molding recess from outside through the outside, and to cool the molten high-viscosity material,
2. The method for molding a high-viscosity material according to claim 1, further comprising heating and cooling means for selectively heating and cooling the inside of the molding recess on the outer surface of the molding recess of the molding die. 6. When the high-viscosity material is a powder, the paste is used as it is or kneaded with a printing binder to form a paste, and the high-viscosity material supply means includes a surface of the mold having the molding recess. A screen printing plate having a powder passage portion at a position corresponding to the molding recess disposed above the squeegee, and a squeegee for pushing the powder supplied on the upper surface of the screen printing plate along the screen printing plate The method for molding a high-viscosity material according to claim 5, further comprising a screen printing device having the following. 7. The high-viscosity material is one kind of powder selected from the group consisting of metal powder, bump material powder, dielectric material powder, insulating material powder and optical component material powder. 7. The method for molding a high-viscosity material according to 6. 8. When the high-viscosity material is a linear body,
6. The high viscosity material supply means according to claim 5, further comprising a linear body supply device disposed above a surface of the molding die having the molding concave portion, for feeding a tip of the linear body into the molding concave portion. Molding method for high viscosity materials. 9. The method according to claim 8, wherein the high-viscosity material is a linear body for wire bonding. 10. The method for molding a high-viscosity material according to claim 5, wherein said heating and cooling means comprises a heating element and a cooling element which can selectively contact said opposite surface of said mold.