JP3327424B2 - Hard alloy mold for resin and powder molding - Google Patents
Hard alloy mold for resin and powder moldingInfo
- Publication number
- JP3327424B2 JP3327424B2 JP31410293A JP31410293A JP3327424B2 JP 3327424 B2 JP3327424 B2 JP 3327424B2 JP 31410293 A JP31410293 A JP 31410293A JP 31410293 A JP31410293 A JP 31410293A JP 3327424 B2 JP3327424 B2 JP 3327424B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- hard alloy
- powder molding
- alloy mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 22
- 239000000956 alloy Substances 0.000 title claims description 22
- 239000000843 powder Substances 0.000 title claims description 22
- 239000011347 resin Substances 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 title claims description 20
- 238000000465 moulding Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910021385 hard carbon Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- -1 carbonitrides Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、樹脂及び粉末をプレス
成形、射出成形する場合等に用いられる硬質合金金型に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hard alloy mold used for press molding, injection molding and the like of resin and powder.
【０００２】[0002]
【従来の技術】粉末冶金における原料粉末のプレス成形
には古くから超硬合金が用いられている。最近はプレス
成形におけるニアネットシェイプ化に伴い、パンチ形状
も多様化し、パンチ面が受ける圧力も均一ではなく、局
所的に高圧になったりする場合が増えてきている。ま
た、成形助剤として用いられるワックス、樹脂も目的に
応じ、その種類が増えてきている。そこで最近では、特
にパンチ面のプレス圧が高圧な部分に局所的に粉末や樹
脂が付着する現象が発生し、製品精度の劣化、作業効率
の劣化を招いている。2. Description of the Related Art Cemented carbides have long been used for press forming of raw material powders in powder metallurgy. Recently, with the near net shape in press molding, the shape of the punch has been diversified, and the pressure applied to the punch surface is not uniform, and the pressure often increases locally. In addition, the types of waxes and resins used as molding aids are increasing depending on the purpose. Therefore, recently, a phenomenon in which powder or resin locally adheres particularly to a portion where the pressing pressure on the punch surface is high has occurred, which has resulted in deterioration of product accuracy and work efficiency.
【０００３】また、ＩＣに使用されている樹脂をプレス
成形、射出成形する場合においても上述した付着現象が
発生する。この場合、樹脂自体が金型に対する腐蝕性成
分を含有するため、金型の腐蝕が付着現象の発生を助長
する一因となる。この様な問題を解決する手段とし、一
時、金型のセラミック化が試みられた。しかし、セラミ
ックは金型の付着、腐蝕に対しては、効果が認められる
ものの金型の強度不足をもたらし金型の破損、チッピン
グ等の問題で一部しか普及していないのが現状である。[0003] In addition, when the resin used for the IC is press-molded or injection-molded, the above-mentioned adhesion phenomenon occurs. In this case, since the resin itself contains a corrosive component for the mold, corrosion of the mold contributes to the occurrence of the adhesion phenomenon. As a means for solving such a problem, ceramic molding of a mold has been tried temporarily. However, although ceramics have an effect on the adhesion and corrosion of a mold, the strength of the mold is insufficient, and the ceramic is currently only partially used due to problems such as breakage of the mold and chipping.
【０００４】また、最近では金型にＰＶＤやＣＶＤコー
ティングを施すことにより、硬質皮膜を金型表面に成膜
する技術が開発されている。しかしこの場合は、Ｔｉ系
の炭化物、炭窒化物、窒化物が主流であり、硬度も十分
ではなく繰り返し使用時における摩耗発生による寿命が
短い。また、皮膜の凹凸、または皮膜内の欠陥により付
着に対し、満足にいく効果も得られていないのが現状で
ある。Recently, a technique has been developed in which a hard film is formed on the surface of a mold by applying PVD or CVD coating to the mold. However, in this case, Ti-based carbides, carbonitrides, and nitrides are mainly used, the hardness is not sufficient, and the life due to abrasion during repeated use is short. At present, satisfactory effects on adhesion due to unevenness of the film or defects in the film have not been obtained.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は機械的
強度に問題を有しない硬質合金金型において、粉末、樹
脂の付着を防止するとともに腐蝕に対し耐蝕性を向上
し、金型の長寿命化を図ることを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a hard alloy mold which has no problem in mechanical strength, which prevents powder and resin from adhering and improves corrosion resistance against corrosion. The purpose is to extend the life.
【０００６】[0006]
【課題を解決するための手段】そこで本発明者は、上述
の様な付着現象の原因を突き止めるべく種々検討した結
果、硬質合金中の金属相部分が初期に優先的に摩耗する
ことに伴う金型表面の凹凸の発生が、付着を誘発するも
のであることを確認した。例えば、炭化タングステンと
Ｃｏよりなる超硬合金においては、Ｃｏ金属相の初期の
摩耗による凹凸の発生が付着を誘発する。The present inventor has conducted various investigations to find the cause of the above-mentioned adhesion phenomenon. As a result, the metal phase portion in the hard alloy is preferentially abraded at the initial stage. It was confirmed that the occurrence of irregularities on the mold surface induced adhesion. For example, in a cemented carbide made of tungsten carbide and Co, the occurrence of irregularities due to the initial wear of the Co metal phase induces adhesion.
【０００７】そこで、金属表面のＣｏ相を除去する手法
を検討した結果、硼化処理により金属Ｃｏ相を除去でき
るという知見を得た。つまり、金属Ｃｏ層が、硼化処理
により硼化Ｃｏ相に変わり、また１部は（ＷＣｏ）Ｂ相
に変わり、金属表面は炭化タングステンと硼化Ｃｏもし
くは（ＷＣｏ）Ｂ相より構成され、実質上金型表面に金
属Ｃｏ相がなくなるわけである。これら硼化Ｃｏ相は、
ビッカース硬さ１０００以上の数値を有しており、金属
Ｃｏ相のビッカース硬さ約３００に対し格段に硬く、金
属表面の局所的優先摩耗に基づく凹凸の発生に対し著し
い効果を発揮するわけである。Therefore, as a result of studying a method for removing the Co phase from the metal surface, it was found that the metal Co phase can be removed by boride treatment. That is, the metal Co layer is changed to a boride Co phase by the boride treatment, a part of the metal Co layer is changed to the (WCo) B phase, and the metal surface is composed of tungsten carbide and the Co boride or (WCo) B phase. This means that the metal Co phase disappears on the upper mold surface. These Co boride phases are:
It has a value of Vickers hardness of 1000 or more, which is remarkably harder than the Vickers hardness of the metal Co phase of about 300, and exerts a remarkable effect on the occurrence of irregularities based on local preferential wear of the metal surface. .
【０００８】一方、ダイヤモンド膜、ダイヤモンドライ
クカーボン膜等はビッカース硬さ５０００以上の高硬度
膜であり、このような金型の表面を被覆するには理想的
な膜である。本発明者は、ダイヤモンド膜、ダイヤモン
ドライクカーボン膜を金型へ応用する研究を重ねてきた
が、密着性に難点があり所望の特性を得られなかった。
その原因を検討した結果、金属Ｃｏの存在がダイヤモン
ド膜、ダイヤモンドライクカーボン膜の密着性を劣化さ
せることが明らかとなった。そこで、上述の硼化処理を
適用し金属Ｃｏを硼化Ｃｏに変えた金型上にダイヤモン
ド膜、ダイヤモンドライクカーボン膜を成膜した結果、
著しく密着性が改善される結果を得るに至った。On the other hand, a diamond film, a diamond-like carbon film and the like are high hardness films having a Vickers hardness of 5,000 or more, and are ideal films for covering the surface of such a mold. The present inventor has repeatedly studied the application of a diamond film and a diamond-like carbon film to a metal mold, but could not obtain desired characteristics due to a problem in adhesion.
As a result of examining the cause, it became clear that the presence of metal Co deteriorates the adhesion of the diamond film and the diamond-like carbon film. Therefore, as a result of forming a diamond film and a diamond-like carbon film on a mold in which the above-mentioned boride treatment was applied and metal Co was changed to boride Co,
The result was that the adhesion was significantly improved.
【０００９】[0009]
【作用】次に数値限定した理由について述べる。付着に
対しては金属相のミーンフリーパス（平均厚み）が薄い
方が好ましい。そのため、炭化タングステン粒子の平均
粒径が１μｍ以下であるとより長寿命化が達成される。
Ｃｒ、Ｍｏはその含有量が０．０１％未満では腐蝕に対
し効果が認められず、また５％を越えて含有すると硬質
合金の靱性を劣化するため０．０１％以上５％以下とし
た。Next, the reason for limiting the numerical values will be described. For the adhesion, it is preferable that the mean free path (average thickness) of the metal phase is thin. Therefore, if the average particle size of the tungsten carbide particles is 1 μm or less, a longer life can be achieved.
If the content of Cr and Mo is less than 0.01%, no effect on corrosion is recognized, and if the content exceeds 5%, the toughness of the hard alloy is deteriorated, so that the content is made 0.01% or more and 5% or less.
【００１０】この発明は、上記の研究結果に基づいて成
されたものであり、硬質合金表面を硼化処理し金属成分
を除去すること及び、この上にダイヤモンドあるいはダ
イヤモンドライクカーボン膜を被覆し密着性を改善せし
めた樹脂及び粉末成形用硬質合金金型に特徴と有するも
のである。The present invention has been made on the basis of the above-mentioned research results, in which the surface of a hard alloy is subjected to boride treatment to remove metal components, and a diamond or diamond-like carbon film is coated thereon and adhered. It is characterized by a resin and a hard alloy mold for powder molding with improved properties.
【００１１】[0011]
【実施例】以下にこの発明の硬質金型について具体的に
説明する。硬質金型として８５％ＷＣ−１５％Ｃｏ合金
を２種類の粒度で試作し、またＣｏの１部をＮｉ、Ｃ
ｒ、Ｍｏで置換した合金も試作した。これらの合金にお
いてφ１０ｍｍのプレスパンチを試作した。このパンチ
をＢ4Ｃを主成分とする粉末の中で９００℃１ｈｒ硼化
処理を行い本発明パンチとした。組成及び皮膜等に付い
て表１に示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS A hard mold according to the present invention will be specifically described below. A prototype of 85% WC-15% Co alloy was produced as a hard mold with two kinds of particle sizes, and one part of Co was Ni, C
Alloys substituted with r and Mo were also prototyped. For these alloys, press punches having a diameter of 10 mm were prototyped. The punch was subjected to a boring treatment at 900 ° C. for 1 hour in a powder containing B 4 C as a main component to obtain a punch of the present invention. Table 1 shows the compositions, coatings, and the like.
【００１２】[0012]
【表１】 [Table 1]
【００１３】ついで、本発明パンチと無硼化処理パンチ
に、イオンプレーティング法によりダイヤモンドライク
カーボン膜１．０μｍ、マイクロ波プラズマＣＶＤ法に
よりダイヤ膜を４μｍ成膜した。これらのパンチを用い
以下のテスト１、テスト２を行い付着性の評価を行った
結果を表２に示す。 テスト１ 粉末 超硬合金粉末（２ｗｔ％パラフ
ィンワックス添加） プレス圧力 ２．０ｔ／ｃｍ2 寿命基準 付着面積が２ｍｍ2を越えるショット回数 テスト２ 樹脂 ＩＣ封入用樹脂 引張テスト １５０℃、２.０ｔ／ｃｍ2の圧力でパンチ
面と樹脂を圧着、その後接着面の引張り強度を引張りテ
ストにて測定Then, a diamond-like carbon film of 1.0 μm was formed on the punch of the present invention and the non-borated punch by an ion plating method, and a diamond film of 4 μm was formed by a microwave plasma CVD method. The following Test 1 and Test 2 were performed using these punches to evaluate the adhesion, and the results are shown in Table 2. Test 1 Powder Cemented carbide powder (2 wt% paraffin wax added) Press pressure 2.0 t / cm 2 Life criterion Number of shots where the adhesion area exceeds 2 mm 2 Test 2 Resin IC encapsulation resin Tensile test 150 ° C, 2.0 t / cm Pressing the resin to the punch surface with the pressure of 2 , then measure the tensile strength of the bonding surface by tensile test
【００１４】[0014]
【表２】 [Table 2]
【００１５】先の実施例と同様の粉末を用いてＴｉＣ、
ＴａＣ等を含有する硬質合金からなるパンチを試作し、
実施例１と同様の評価をした結果を表３・表４に併記す
る。Using the same powder as in the previous embodiment, TiC,
Prototype punch made of hard alloy containing TaC etc.
The results of the same evaluation as in Example 1 are also shown in Tables 3 and 4.
【００１５】[0015]
【表３】 [Table 3]
【００１６】[0016]
【表４】 [Table 4]
【００１７】[0017]
【発明の効果】表１、表２に示される結果から本発明合
金は、粉末成型時における粉末の付着現象に対し明らか
に効果が認められるとともに、ダイヤモンド及びダイヤ
モンドライクカーボン膜と基体の密着性をも改良し、膜
の剥離も発生せず、長寿命化されることが明らかであ
る。これにより、金型の長寿命化が達成されるだけでな
く、付着物を除去するための作業効率の低下を防止する
ことができるものである。From the results shown in Tables 1 and 2, the alloy of the present invention has a clear effect on the powder adhesion phenomenon at the time of powder molding, and the adhesion between the diamond and the diamond-like carbon film and the substrate is improved. It is evident that the film has also been improved, the film does not peel off, and the life is extended. This not only achieves a longer life of the mold, but also prevents a reduction in work efficiency for removing extraneous matter.
Claims (6)
いて、該硬質合金は超硬合金からなり、且つ、該超硬合
金金型の表面のＷＣ相、結合金属相の一部を（ＷＣｏ）
Ｂ相、硼化Ｃｏ相としたことを特徴とする樹脂及び粉末
成形用の硬質合金金型。In a hard alloy mold for resin and powder molding, the hard alloy is made of a cemented carbide, and a part of a WC phase and a bonding metal phase on a surface of the cemented carbide mold is (WCo). )
A resin and a hard alloy mold for powder molding, which are a B phase and a boride Co phase.
質合金金型において、該硬質合金がＷＣとＣｏの結合金
属及び不可避不純物からなることを特徴とする樹脂及び
粉末成形用の硬質合金金型。2. The resin and the hard alloy for powder molding according to claim 1, wherein the hard alloy comprises a bonding metal of WC and Co and unavoidable impurities. Mold.
質合金金型において、該Ｃｏの一部をＦｅ、Ｎｉの１種
もしくは２種に置換したことを特徴とする樹脂及び粉末
成形用の硬質合金金型。3. The resin and powder molding hard alloy mold according to claim 2, wherein a part of said Co is replaced with one or two of Fe and Ni. Hard alloy mold.
用の硬質合金金型において、該ＷＣの平均粒径が１μｍ
以下であることを特徴とする樹脂及び粉末成形用の硬質
合金金型。4. The resin and the hard alloy mold for powder molding according to claim 1, wherein said WC has an average particle diameter of 1 μm.
A resin and a hard alloy mold for powder molding, characterized in that:
用の硬質合金金型において、該Ｃｏ又はＦｅ、Ｎｉの１
種もしくは２種の金属の一部にＣｒ及び／又はＭｏを
０．０１重量％以上５重量％以下を含有することを特徴
とする樹脂及び粉末成形用の硬質合金金型。5. The resin and the hard alloy mold for powder molding according to claim 2 or 3, wherein the Co or Fe or Ni is used.
A hard metal mold for resin and powder molding, characterized in that Cr and / or Mo are contained in a part of one or two kinds of metals in an amount of 0.01 to 5% by weight.
用の硬質合金金型において、該金型の上に、硬質炭素膜
もしくはダイヤモンドライクカーボン膜もしくはダイヤ
モンド膜を被覆したことを特徴とする樹脂及び粉末成形
用の硬質合金金型。6. A hard alloy mold for resin and powder molding according to claim 1, wherein a hard carbon film, a diamond-like carbon film, or a diamond film is coated on the mold. Hard alloy mold for resin and powder molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31410293A JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31410293A JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07145471A JPH07145471A (en) | 1995-06-06 |
| JP3327424B2 true JP3327424B2 (en) | 2002-09-24 |
Family
ID=18049270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31410293A Expired - Fee Related JP3327424B2 (en) | 1993-11-19 | 1993-11-19 | Hard alloy mold for resin and powder molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3327424B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8852751B2 (en) | 2009-09-25 | 2014-10-07 | Hamilton Sundstrand Corporation | Wear resistant device and process therefor |
| CN108165930A (en) * | 2018-01-16 | 2018-06-15 | 马鞍山市新桥工业设计有限公司 | A kind of metallic surface treatment process |
| CN114427058B (en) * | 2022-01-06 | 2023-11-21 | 四川神工钨钢刀具有限公司 | Hard alloy and manufacturing method thereof |
-
1993
- 1993-11-19 JP JP31410293A patent/JP3327424B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07145471A (en) | 1995-06-06 |
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