JP3328375B2 - Heat treatment equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for performing heat treatment such as heating or cooling of a thin substrate (hereinafter simply referred to as "substrate") such as a semiconductor substrate or a glass substrate for liquid crystal or photomask. About.

[0002]

2. Description of the Related Art For example, in a photolithography process in the manufacture of a liquid crystal substrate, in order to dry a resist applied to the surface of a glass substrate, the substrate is placed on a heating device having a heating element such as a hot plate. Heating,
A step of heat treatment at a high temperature is included. At this time, if the substrate is placed in direct contact with the heating element of the heating device, a sudden temperature change may be applied to the low-temperature substrate, which may damage the substrate. In the case of close contact with the heating element, there is a problem that a trace remains on the resist because the temperature distribution of the suction hole portion is different. Further, when the substrate is separated from the heating element by a transfer device or the like, the substrate may be separated and charged, and a circuit or the like formed on the substrate may be damaged. In order to solve such a problem, a proximity method in which a substrate is held at a predetermined distance from the heating element and the substrate is indirectly heated via an air layer formed between the heating element and the substrate. Is known.

FIG. 14 is a longitudinal sectional view of a heating device which is a main portion of a conventional proximity type heat treatment device.
FIG. 15 is a perspective view of the heating device.

As shown in FIG. 14, a heating device 100 includes a heat generating plate (mounting table) 1 made of metal such as aluminum.
01 and the holding plate 102 so as to sandwich the surface heating heater 103. The heat generating plate 101 has a through hole 10 in a direction perpendicular to its upper surface 101b.
1a, a plurality of proximity pins 104 are provided.
Are inserted into the through-holes 101a, and are arranged and held on the upper surface 101b of the heat generating plate 101 in a rectangular shape slightly smaller than the outer shape of the substrate W as shown in FIG. The substrate W is placed so that the lower surface of the outer peripheral portion abuts on the head 104b of the proximity pin 104.

In order to uniformly heat the substrate W by the heating device 100, the substrate W needs to be held in parallel with the upper surface 101 b of the heat generating plate 101, and the height of the head 104 b of the proximity pin 104 is high. D are all equal. The height d is set to, for example, about 1 mm.

The head 1 of the proximity pin 104 of the substrate
Since the temperature distribution of the portion in contact with the portion 04b is different from that of other portions, the resist film thickness after the heat treatment may vary. Therefore, it is desirable that the position of the substrate supported by the proximity pin 104 be set to an end of the substrate W as much as possible. Usually, the non-effective area of the substrate W, ie,
The proximity pin 104 supports the substrate W at a distance k from the end of the substrate W of 7 to 10 mm.

When power is supplied from a power supply device (not shown) to the surface heating heater 103 of the heating device 100, the surface heating heater 103 generates heat and the heating plate 101 is heated. When the substrate W is mounted on the proximity pins 104 by a transport device (not shown), an air layer S is formed between the lower surface of the substrate W and the upper surface of the heat generating plate 101, and the heat generating plate 101 is interposed via the air layer S. The substrate W is heated by the radiant heat from the substrate.

The heat generating plate 101 has a through hole 101.
a, and instead of attaching the proximity pin 104, a plurality of small recesses are provided on the upper surface 101b of the heating plate 101 as disclosed in, for example, Japanese Utility Model Application Laid-Open No. 63-193833, and a predetermined radius A ball is inserted and the substrate W is placed on the ball, and the air layer S
Is also available.

[0009]

The heating apparatus 100 is provided with an inlet / outlet for loading / transporting a substrate in the casing, not only when the heating apparatus is installed in the outside air, but also when the heating apparatus 100 is housed inside the casing. The outside air flows in from there, and in order to exhaust the toxic gas such as the organic solvent of the resist which evaporates at the stage of the heat treatment by the exhaust device,
An airflow is inevitably generated around the heating device 100. As described above, in the substrate support structure in the conventional proximity type heat treatment apparatus, since there are many gaps between the proximity pins and balls, the surrounding air flow enters the air space S, and In addition to disturbing the temperature distribution in the portion, there has been a problem that the thermal efficiency is reduced and the rate of temperature rise is deteriorated.

[0010] Such a problem also occurs in the case of a cooling device provided with a cooling means instead of a heating means such as the above-mentioned surface heating heater, and there is a problem that the temperature distribution is disturbed and the cooling rate is deteriorated. Was.

The present invention has solved the above-mentioned problems,
In a proximity type heat treatment apparatus, an object is to provide a heat treatment apparatus capable of eliminating disturbance due to an air current, uniformly heating or cooling a substrate, and preventing deterioration of a temperature rising rate or a cooling rate.

[0012]

According to a first aspect of the present invention, there is provided a heat treatment apparatus for mounting a substrate on a mounting table at a predetermined interval and performing heat treatment by a heating means or a cooling means. A substrate holding portion that holds a lower surface of an outer peripheral portion of the substrate over substantially the entire circumference so that an air layer in a substantially sealed state is formed between the substrate and the mounting table, and is provided inside the mounting table. is, one end opened before Symbol air layer, and the other end connected to the exhaust means, said
Air pressure in the air layer is reduced by exhaust from exhaust means
An exhaust flow path to be caused , and the substrate in the air layer.
An interval regulating member that regulates an interval with the mounting table .

[0013] The heat treatment apparatus according to claim 2 is based on claim 1.
In the heat treatment apparatus according to the invention of the above,
Form a recess having an outer shape smaller than the outer shape of the substrate,
The substrate holding portion is formed on the upper outer edge of the concave portion.

[0014] The heat treatment apparatus of claim 3 provides the heat treatment apparatus of claim 1.
In the heat treatment apparatus according to the invention,
Having an opening in the center smaller than the outer shape of the substrate
A spacer placed on the upper surface of the base,
The substrate holding portion is formed on a spacer.

Further, the heat treatment apparatus according to claim 4 is a heat treatment apparatus according to claim 1.
In the heat treatment apparatus according to the invention,
A continuous projection formed on the upper surface of the mounting table
You.

[0016] The heat treatment apparatus according to claim 5, claim 1
In the heat treatment apparatus according to the present invention, one of the substrate holding portions
The part has a notch.

In this specification, the term "heat treatment" refers to
This is a concept that includes both heating processing and cooling processing.

[0018]

According to the first aspect of the present invention, there is provided a substrate holding section for holding the lower surface of the outer peripheral portion of the substrate over substantially the entire circumference so that an air layer in a substantially sealed state is formed between the substrate and the mounting table. the mounting provided inside the base, one end opens into the air layer, and the other end connected to the exhaust means, the exhaust from the exhaust means
An exhaust passage that reduces the pressure in the air layer with air,
An interval rule that regulates the distance between the substrate and the mounting table in the gas layer
And a control member, so that no external airflow enters,
It is possible to prevent a decrease in the temperature rising rate or the cooling rate due to the influence of the outside air and to make the temperature distribution of the substrate uniform. Also,
Adhesion with the board holding part around the board is improved,
Airtightness is improved, and thermal efficiency is improved. Furthermore, for suction
Therefore, the substrate central portion is prevented from warping, and the substrate temperature
Non-uniformity of the cloth is prevented.

According to the second aspect of the present invention, on the upper surface of the mounting table,
Is formed with a recess having an outer shape smaller than the outer shape of the substrate.
Since the upper outer edge of the substrate forms a substrate holding portion,
An almost closed air layer is formed inside for heat treatment
You.

According to the third aspect of the present invention, the mounting table is a base.
And a base with an opening smaller than the outer shape of the board in the center
And a spacer placed on the upper surface of the
Since the spacer forms the substrate holding portion, the spacer
Openings form an almost closed air layer for heat treatment
You.

According to the fourth aspect of the present invention, the substrate holding portion is mounted
Because it is a continuous projection formed on the top surface of the table,
Almost sealed inside the continuous protrusion for heat treatment of the substrate
A formed air layer is formed.

According to the fifth aspect of the present invention, one of the substrate holding portions is provided.
Even if there is a notch in the part, the airtightness of the internal air layer is substantially
If it is secured, it will be possible to fully demonstrate its effect
it can.

[0023]

Embodiments of the present invention will be described below in detail with reference to the drawings, but the technical scope of the present invention is not limited thereby.

FIG. 1 is a schematic diagram showing a configuration of a heat treatment apparatus according to a first embodiment of the present invention, and FIG. 2 is a perspective view of a heating apparatus of the heat treatment apparatus.

As shown in FIG. 1, the heat treatment apparatus comprises a heating device 1 and a power supply device 6 for supplying power thereto. The heating device 1 is formed such that a surface heating heater 4 is sandwiched between a heating plate 2 and a holding plate 3 formed of a metal such as aluminum. A concave portion 5 having a flat bottom surface is formed on the upper surface 2a of the heat generating plate 2. The depth d1 of the recess 5
Is about 1 mm, for example, and the outer shape of the recess 5 (the recess 5
The shape of the upper edge portion 5a) forms a rectangle slightly smaller than the outer shape of the rectangular substrate W as shown in FIG.
Is placed on the upper edge 5 of the recess 5 from the end of the substrate W.
The distance k1 to a is set to about 7 mm to 10 mm,
The upper surface 2a of the heat generating plate 2 contacts only the periphery (non-effective area) of the substrate W and does not contact the inner effective area. At this time, the upper surface 2a of the heating plate 2
A portion (upper edge portion of the concave portion 5) that contacts the substrate W forms a substrate holding portion.

In such a heating device, when power is supplied to the surface heating heater 4 from the power supply device 6, the heating plate 2 is heated, and an air layer formed between the lower surface of the substrate W and the bottom surface of the recess 5 is formed. The substrate W is radiantly heated through S. Initially, the temperature of the air layer S is lower than that of the heat generating plate 2, but since it is a gas, the specific heat is small, and the air layer S is immediately heated to reach the same temperature as the heat generating plate 2. In the embodiment of FIG. 1, only the power supply device 6 is provided, but a temperature sensor is provided on the heating plate 2 and a temperature control device for controlling the amount of power supplied by the power supply device 6 based on the detection signal is further provided. By doing so, the temperature of the heat generating plate 2 can be accurately controlled to a predetermined value.

Since the upper edge portion 5a of the concave portion 5 is entirely in contact with the lower surface of the substrate W, the air layer S is maintained in a substantially sealed state, and an external air current enters to lower the temperature of the air layer S. Problems such as lowering the rate of temperature rise or disturbing the temperature distribution in this portion and degrading the heat treatment accuracy of the substrate are eliminated.

The heat-treated substrate W is separated from the heat-generating plate 2 by a transfer device (not shown) and carried out. At this time, the contact area between the heat-generating plate 2 and the substrate W is small. Almost no occurrence, substrate W
There is no occurrence of a situation in which the circuit formed in is destroyed by charging.

FIG. 3 is a longitudinal sectional view showing a second embodiment of the heating apparatus in the heat treatment apparatus of the present invention, and FIG. 4 is an exploded perspective view thereof.

The difference from the first embodiment is that, instead of providing the concave portion 5 on the upper surface of the heat generating plate 2, a frame-shaped spacer 7 having a large opening at the center as shown in FIG. Is placed on the upper surface of. Spacer 7
The opening of the spacer 7 is set smaller than the outer shape of the substrate mounted thereon. As shown in FIG. 3, the frame portion of the spacer 7 serves as a substrate holding portion, and the opening inside forms the air layer S. . The thickness d2 of the spacer 7 and the distance k2 between the inner periphery of the spacer 7 and the edge of the substrate W are the depth d1 of the recess 5 and the upper edge of the recess 5 from the edge of the substrate W in the first embodiment. A value similar to the distance k1 to the part 5a is set.

The advantage of the second embodiment is that if a large number of spacers 7 having openings of different sizes and different shapes are prepared, various shapes and sizes can be changed only by changing the type of the spacers 7. Once the spacer 7 is removed, the substrate W can be brought into direct contact with the heat generating plate 2 and heated, and the heating method can be easily changed if the spacer 7 is removed.

[0032] The thickness d 2 of the spacer 7, since very thin as about 1mm, as described above, the surface can be considered may not be able to maintain the flatness deformed. In such a case, a gap is formed in the contact surface between the spacer 7 and the heat generating plate 2 and the substrate W, and the airtightness in the air layer S cannot be maintained. The flatness of the surface of the spacer 7 may be ensured by vacuum-adsorbing the spacer 7 to the heating plate 2.

FIG. 5 is a longitudinal sectional view showing a third embodiment of the heating apparatus in the heat treatment apparatus of the present invention, and FIG. 6 is a perspective view thereof.

The feature of the third embodiment is that a continuous projection 8 having a uniform height is formed on the upper surface of the heating plate 2 as shown in FIG. The cross-sectional shape of the protruding portion 8 is rectangular as shown in FIG. 5, and the height d3 and the distance k3 between the inner peripheral portion thereof and the end of the substrate W are different from those of the first embodiment. 5 and a distance k from the edge of the substrate W to the upper edge 5a of the recess 5
It is set to the same value as 1.

According to the third embodiment, the contact area between the projecting portion 8 as the substrate holding portion and the substrate W can be reduced, so that the influence of the substrate holding portion on the temperature distribution of the substrate W can be reduced. Can be reduced.

FIG. 7 is a partial longitudinal sectional view showing a modified example of the cross-sectional shape of the protruding portion 8 in the third embodiment, and FIG. Has a triangular shape, and has a vertex in line contact with the substrate W, so that the contact area between the substrate W and the substrate holding portion can be minimized. Therefore, the substrate holder has little effect on the heat distribution of the substrate W. In addition, there is an advantage that the surface contact of the substrate W is less likely to occur due to the linear contact. FIG. 7 (b) shows the projection 8
Is formed in a semicircular shape, and has the same advantage as that of FIG. 7A because it is in line contact with the substrate W. There is no risk of damaging the back surface of W, which is superior to the modification of FIG. 7A.

On the other hand, the one shown in FIG. 8 does not make the substrate holding portion convex, but forms a step portion one step lower than the upper surface 2a of the heat generating plate 2, so to speak, a first deformation. Although this embodiment can be said to be an example, since the end of the substrate W is covered with the side surface 5a of the step, the positioning of the substrate W is ensured, the surface is less likely to be displaced, and the heat release on the side surface of the substrate Therefore, there is an advantage that the uniformity of the temperature distribution of the substrate W is further improved.

The above-described embodiment is mainly a heat treatment apparatus for pre-baking, and is formed so that the substrate holding portion does not come into contact with portions other than the non-effective area around the substrate W so that the resist film does not become uneven. Have been. Therefore, the substrate W
Substrate W due to its own weight and the temperature difference between the front and back of the substrate W during heating.
Has a tendency to slightly warp downward. The amount of warpage is
Since it is less than 1 mm according to the actual measurement, the air layer S
Since the thickness of the substrate W is set to 1 mm, there is no possibility that the central portion of the substrate W contacts the heat generating plate 2. However, at the stage of drying baking or post-baking, there is no possibility that unevenness occurs in the resist film thickness. Therefore, as shown in FIG. Can be supported without warping. In this case, since the depth d4 can be reduced to 1 mm or less, the thermal efficiency can be improved.

In the fourth embodiment of the heating apparatus shown in FIG. 10, a substrate suction means is provided to improve the adhesion between the periphery of the substrate W and the substrate holding portion of the heat generating plate 2. . That is, in FIG. 10A, an exhaust passage 10 communicating with the air layer S is provided in the heat generating plate 2, and the inside of the air layer S is evacuated from the exhaust passage 10 by an exhaust device (not shown) so that the pressure is appropriately adjusted. By lowering, the substrate W is pressed down toward the heat generating plate 2 by the atmospheric pressure, and the adhesiveness with the substrate holding portion around the substrate W is improved. Therefore, the airtightness of the air layer S is improved, and the air layer S is less affected by an external airflow. When the substrate W is thin, the central portion may warp downward due to suction. Therefore, the proximity pins 9 may be arranged in the air space S as shown in FIG. However, as described above, this is limited to the case where there is no possibility that the resist film thickness such as post bake will cause unevenness.

FIG. 10B shows an opening 1 of the exhaust passage 10.
This is an example in which 0a is positioned on the substrate holding unit. Since the holding portion of the substrate W is directly sucked, there is no possibility that the substrate W is warped by the suction force as in the case of FIG. 10A. Since it acts so as to be parallel to the upper surface of the plate 2, there is an advantage that the warpage of the substrate W is corrected. In this case, it is desirable that a large number of openings 10a of the exhaust passage 10 be provided along the substrate holding portion.

In the embodiment shown in FIGS. 10 (a) and 10 (b), a vacuum sensor is provided in the middle of the exhaust path from the exhaust flow path 10 to the exhaust device (not shown), and the substrate W is placed on the basis of the detection signal. If you make sure to check for
The process control of the heat treatment can be reliably performed.

Even if the substrate W warps downward, the air layer S
If the thickness of the substrate W is made sufficiently large, there is no danger that the central portion thereof will come into contact with the upper surface 2a of the heat generating plate 2; Is difficult to maintain strictly. Therefore, if a concave portion having an appropriate shape is provided in the heat generating plate 2 assuming the warpage of the substrate W, the uniformity of the temperature distribution of the substrate W can be more accurately secured.

FIG. 11 shows the form of the concave portion formed on the upper surface of the heat generating plate 2, and the shape of the concave portion is exaggerated for convenience of explanation. In FIG. 11A, a trapezoidal concave portion 11 is formed, and in FIG.
A stepped recess 12 is formed. FIG.
1C, a conical recess 13 is formed, and FIG.
1 (d) shows a mortar formed by a smooth curved surface
Jo recess 14 is formed. From FIG. 11 (a) to FIG.
In the order of 1 (d), a shape approximated by the warpage of the substrate W is formed, whereby the distance from the bottom surface of the concave portion to the warped substrate W is substantially uniform, and the heat distribution of the substrate W is reduced. Although it is considered that the uniformity is increased, on the other hand, there is a problem that processing becomes difficult in this order and the cost increases.

[0044] In the above in the embodiments, but is held so as to sandwich the plane heater 4 by the heating plate 2 and the holding plate 3, as shown in FIG. 12, for example, semiconductive elastic material material May be directly fixed to the back surface of the heat generating plate 2 with a heat-resistant adhesive. The surface heating heater 15
Is extensible, so it expands and contracts in accordance with the thermal expansion of the heat generating plate 2 and does not peel off at the bonded portion.

The present invention is applicable not only to the case where the substrate is heated by the heating device, but also to the case where the heated substrate W is cooled by using the cooling device. FIG. 13 shows an example of the cooling device. FIG. 13A shows a cooling plate 16 having a concave portion 17 for forming an air space S similar to the embodiment of FIG. FIG. 3 is a longitudinal sectional view of a cooling device provided with a cooling block 19 in contact with a lower surface of the cooling plate 16. Cooling block 19
Is formed with a plurality of flow paths 18 in a direction perpendicular to the plane of the drawing, and water whose temperature is adjusted to a predetermined temperature, for example, about 23 ° C., is supplied to the flow paths 18 by cooling water supply means (not shown). Thereby, the cooling plate 16 is cooled, whereby the substrate W is cooled. The cooling plate 16
And the cooling block 19 may be formed integrally.

FIG. 13B shows an embodiment in which a thermo module 20 is used as the cooling means. The cooling device is formed such that a thermo module 20 is sandwiched between a cooling plate 16 and a cooling block 19 with its heat absorbing side up and its heat generating side down. The thermo module 20 is formed by arranging a plurality of cooling elements utilizing the Peltier effect in a two-dimensional manner. The cooling capacity can be easily adjusted by the magnitude of the applied voltage. When the substrate is cooled and the voltage is dropped to gradually cool the substrate W when the temperature approaches the target temperature, there is an advantage that the cooling rate can be greatly accelerated as compared with the case of FIG.

It is needless to say that various modifications of the substrate holding section described in the case of the heating device can be applied to the case of the cooling device.

In the above embodiment, the case where the rectangular substrate W is heat-treated has been described. However, even if the substrate has a circular or other shape, the outer shape of the substrate holding portion may be adjusted according to the outer peripheral shape. It can be easily applied by changing. In addition, the substrate holding portion does not necessarily need to be completely continuous along the outer peripheral portion of the substrate to be placed. If the hermeticity is substantially ensured, the effect can be sufficiently exhibited.

[0049]

As described above, according to the first aspect of the present invention, almost all the lower surface of the outer peripheral portion of the substrate is formed so that an air layer in a substantially sealed state is formed between the substrate and the mounting table. A substrate holding unit for holding the circumference, provided inside the mounting table,
One end opened to the air layer, and the other end connected to the exhaust means, the air pressure in the air layer by the exhaust from the exhaust means low
The exhaust flow path to be lowered, the substrate and the mounting table in the air layer
And an interval regulating member for regulating the interval of
External airflow does not enter the air layer, so that a decrease in the temperature rising rate or the cooling rate due to the influence of the outside air can be prevented, and the temperature distribution of the substrate can be made uniform. Also, keep the board around the board.
The airtightness of the air layer is improved,
Efficiency is improved. Furthermore, the central part of the substrate is
The temperature distribution of the substrate.
It is.

According to the second aspect of the present invention, on the upper surface of the mounting table
Is formed with a recess having an outer shape smaller than the outer shape of the substrate.
Since the upper outer edge of the substrate forms a substrate holding portion,
An almost closed air layer is formed inside for heat treatment
You.

According to the third aspect of the present invention, the mounting table is a base.
And a base with an opening smaller than the outer shape of the board in the center
And a spacer placed on the upper surface of the
Since the spacer forms the substrate holding portion, the spacer
Openings form an almost closed air layer for heat treatment
You. Also, since the spacer can be easily replaced,
Prepare multiple spacers with different shapes and sizes.
If it can, it can correspond to substrates of various shapes and sizes.

According to the fourth aspect of the present invention, the substrate holder is mounted on
Because it is a continuous projection formed on the top surface of the table,
Almost sealed inside the continuous protrusion for heat treatment of the substrate
A formed air layer is formed. Also, the board holding part and the board
The contact area of the substrate is small.
The effect on the cloth can be reduced.

According to the fifth aspect of the present invention, one of the substrate holding portions is provided.
Even if there is a notch in the part, the airtightness of the internal air layer is substantially
If it is secured, it will be possible to fully demonstrate its effect
it can.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a heat treatment apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a heating device of the heat treatment device of FIG.

FIG. 3 is a longitudinal sectional view showing a heating device of a heat treatment device according to a second embodiment of the present invention.

FIG. 4 is a perspective view of the heating device of FIG. 3;

FIG. 5 is a longitudinal sectional view showing a heating device of a heat treatment device according to a third embodiment of the present invention.

6 is a perspective view of the heating device of FIG.

FIG. 7 is a partial longitudinal sectional view showing a modified example of the projection in the third embodiment of the present invention.

FIG. 8 is a partial longitudinal sectional view showing a modified example of the substrate holding section according to the first example of the present invention.

FIG. 9 is a longitudinal sectional view showing a configuration in which a proximity pin is provided in the embodiment of FIG. 1;

FIG. 10 is a longitudinal sectional view showing a configuration when a substrate suction means is provided in the embodiment of FIG. 1;

11 is a longitudinal sectional view showing an embodiment in the case of changing the shape of the bottom surface of the concave portion on the upper surface of the heating plate in the embodiment of FIG.

12 is a longitudinal sectional view showing an embodiment in which an elastic surface heating heater is adhered to a heating plate in the embodiment of FIG. 1 and a pressing plate is omitted.

FIG. 13 is a diagram showing an example of a cooling device to which the present invention is applied.

FIG. 14 is a longitudinal sectional view showing a configuration of a heating device in a conventional heat treatment device.

FIG. 15 is a perspective view of the heating device of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heating device 2 Heating plate 3 Holding plate 4 Surface heating heater 5 Depression 6 Power supply device 7 Spacer 8 Projection 10 Exhaust flow path 16 Cooling plate 19 Cooling block 20 Thermo module W Substrate S Air layer

────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-4-181717 (JP, A) JP-A-62-1216328 (JP, A) JP-A-4-127516 (JP, A) JP-A-4- 11721 (JP, A) Japanese Utility Model Hei 3-56129 (JP, U) Japanese Utility Model Application Showa 56-52065 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027 G03F 7 / 26

Claims (5)

(57) [Claims] 1. A heat treatment apparatus for mounting a substrate on a mounting table at a predetermined interval and performing heat treatment by heating means or cooling means, wherein an air layer in a substantially sealed state is formed between the substrate and the mounting table. as will be, a substrate holding portion for holding the lower surface of the outer peripheral portion of the substrate over substantially the entire circumference, is provided inside the mounting table, one end opened before Symbol air layer, the other end exhausting means Connected to the exhaust means
An exhaust passage for lowering the air pressure in the air layer by exhausting air from the space between the substrate and the mounting table in the air layer.
And a space regulating member for regulating the pressure. 2. An outer shape of the substrate on an upper surface of the mounting table.
A recess with a smaller profile is formed, the upper outer edge of said recess
Forming the substrate holding portion.
3. The heat treatment apparatus according to item 1. 3. The mounting table according to claim 1 , further comprising: a base;
It has an opening smaller than the outer shape of the plate and is mounted on the top of the base.
And a spacer that is placed on the substrate.
The heat according to claim 1, wherein the holding part is formed.
Processing equipment. 4. The substrate holding section is provided on an upper surface of the mounting table.
Claims characterized by a continuous projection formed
Item 2. The heat treatment apparatus according to Item 1. 5. The substrate holding portion has a notch in a part thereof.
The method according to any one of claims 1 to 4, wherein
3. The heat treatment apparatus according to item 1.