JP3333357B2 - Manufacturing method of electronic component suction nozzle and electronic component suction nozzle - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component suction nozzle used in an electronic component mounting machine and a configuration of the electronic component suction nozzle.

[0002]

2. Description of the Related Art Electronic component mounting machines use an electronic component suction nozzle for suctioning required electronic components and mounting them at predetermined locations on a circuit board.

Conventionally, as a suction nozzle for electronic parts, a nozzle opening 71 having a predetermined shape as shown in FIG. 5, for example, is formed at the tip of a hard metal nozzle, and a diamond coating is applied to the suction surface of the tip to provide abrasion resistant. The one provided with wear resistance and magnetization prevention function is used.

As shown in FIG. 5, the nozzle opening 71 is formed by a central slit 72 and V-shaped slits 73 and 74 extending radially symmetrically from the center of the slit 72 to the left and right. It is symmetrical, and has a structure in which the suction part where the suction force acts on the electronic parts and the support part that receives the electronic parts are alternately and evenly distributed, and it is compatible with the size of the parts and the displacement of the suction position We were able to.

[0005]

In the above-mentioned conventional suction nozzle, defective products are often generated due to the fact that the coating material protrudes into the nozzle opening 71 during the diamond coating on the tip suction surface during manufacturing, and the yield is high. And cost had to be increased.

Further, since the nozzle opening 71 is formed by the radially formed slits, the supporting portion for receiving the electronic component at the time of suction becomes naturally acute-angled, and the compressive strength is such that the sharp-pointed end is easily chipped. There is a problem above. Specifically, assuming that the broken line frame 50 is the smallest electronic component to be sucked, the suction force acts on the electronic component 50 in the areas J, K, L, M, and N to which the dots in the figure are added,
The suction force applied to the electronic component 50 is received by the acute-angled support portions 75 to 80 indicated by diagonal lines in the drawing, and a larger compressive force is applied to the acute-angled support portion when the component is mounted on the board. Therefore, the high hardness material is easily chipped.

In addition, since the entire nozzle is integrally formed from the diamond-coated nozzle tip to the mounting shank (pattern), even if a chip occurs, it cannot be corrected by replacing the nozzle tip. If a problem occurs at the tip, there is also a problem that the entire nozzle must be disposable.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component suction nozzle which is excellent in economy and durability during production or use.

[0009]

SUMMARY OF THE INVENTION The present invention is a method for manufacturing an electronic component suction nozzle including the following steps.

A) The other end of a nozzle rod formed by fixing a diamond tip to the tip of a nozzle pipe is thinned to a predetermined size to form a connection with a shank at the other end.

B) Connect the nozzle rod to the shank.

[0012] c) processing the <br/> tip including a diamond tip of the nozzle rod in a predetermined cross-section.

D) A center hole is formed in the diamond tip.

E) A diamond shaped chip having a predetermined shape
A nozzle hole having a nozzle opening is formed.

In the above invention, the steps c) to e) are preferably processed by wire electric discharge machining.

The present invention also provides a nozzle opening of a nozzle hole which is manufactured by the above-mentioned method and comprises a central slit and a U-shaped slit symmetrically provided outwardly on both sides in the longitudinal direction of the central slit. It is an electronic component suction nozzle having.

[0017]

According to the present invention, according to the above-mentioned manufacturing method, the tip including the tip is cut into a predetermined sectional shape for the nozzle rod with the diamond tip provided by fixing the diamond tip to the tip of the nozzle pipe. By drilling a nozzle hole of a predetermined shape together with it, any kind of nozzle required can be easily produced with good yield, and various types of nozzles can be formed by cutting the base of the nozzle rod. This is a low-cost nozzle that is connected to a shank that is common to the nozzles and is applied to various electronic component mounting machines. In addition, the tip is made of a diamond tip and has excellent wear resistance and compression resistance. By this, the problem of magnetization can be sufficiently prevented, and a nozzle with good durability that does not easily cause chipping can be obtained. Further, according to the wire electric discharge machining, the machining can be easily and accurately achieved irrespective of the addition of the diamond tip.

Moreover, even if the diamond chip is chipped, the nozzle rod can be replaced as needed, and replacement of the nozzle rod unit can be easily and inexpensively performed.

In addition to being manufactured with the above characteristics,
Further, the shape of the nozzle opening of the nozzle hole is formed by a central slit and a U-shaped slit provided symmetrically on both sides in the longitudinal direction of the central slit, and the component suction by the distributed arrangement of the suction part and the support part is performed. Without losing the stability, the component supporting portion is free of the acute angle portion, so that the opening portion is not easily chipped and has excellent compression resistance. Further, since there is no acute angle portion, particularly a fine acute angle portion in the suction port, workability is good.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of a manufacturing process of an electronic component suction nozzle according to the present invention. This will be briefly described.

(A) The other end (base) of the nozzle rod 1 formed by fixing the diamond tip 2 to the tip of the cemented metal nozzle pipe 4 is thinned to a predetermined diameter and connected to the shank 5. Is formed. As the diamond chip 2, fine diamond particles hardened with a binder to a thickness of, for example, about 2 mm is used.

(B) The connecting portion 41 of the nozzle rod 1 is inserted into a connecting hole provided at one end of the shank 5, and the butted portions of the two are connected by bonding or the like. Thereby, the nozzle rod 1 and the shank 5 are integrally connected, and the nozzle pipe 4 and the air flow hole provided in the shank 5 in advance are connected. At the other end (the lower end in the figure) of the shank 5, a mounting portion 6 for mounting to an electronic component mounting head (not shown) is provided in advance.

(C) The vicinity of the tip of the nozzle rod 1 is cut off to form a nozzle block 3 having a cross-sectional shape and size suitable for the shape and dimensions required for the nozzle suction port. The cross section of the nozzle block 3 depends on the size of the electronic component to be suctioned,
For small parts, for example, 1.2 mm x 1.5 mm
It will be of the order of magnitude. Since it is necessary to apply a considerable amount of fine processing to cemented carbide materials such as diamond and cemented carbide,
It is preferable to use wire electric discharge machining. Next (d),
The same applies to the step (e).

In electric discharge machining, a voltage of about 100 V is applied between a tool electrode and a workpiece with a minute gap in an insulating machining fluid to cause arc discharge in a pulsed manner. Due to vaporization and the resulting impact pressure, a crater is generated on the workpiece, and it is possible to process carbide metal, diamond, etc. with high accuracy, and the working force during processing is small, there is little thermal effect, and processing of complex shapes is easy. It is easy to automate and suitable for the above processing. Wire electric discharge machining
The use of a thin metal wire as an electrode is effective for the above-mentioned fine processing.

(D) A center hole in the direction of the nozzle axis A is formed at the center of the diamond chip 2 by wire electric discharge machining. Thereby, a through hole p passing through the entire nozzle rod 1 is formed. When a bar having no center hole is used as the super-hard metal of the nozzle bar, a center hole can be formed in the bar itself by this step.

(E) A nozzle hole 10 having a nozzle opening 11 of a predetermined shape is formed in the diamond chip 2 by wire electric discharge machining. The nozzle hole 10 is connected to an air flow hole (not shown) provided in the shank 5 in advance, and serves as a suction air passage for the entire nozzle 1.

Although the order of the above steps a) to e) can be partially changed, it is desirable that the nozzle hole forming step (e) be the last one in order to maintain accuracy, and that the wire electric discharge machining should be performed. It is desirable that the steps used be continuous in terms of production efficiency.

According to the above-mentioned manufacturing method, it is not necessary to apply a diamond coating to the tip of the electronic component at the time of manufacturing the suction nozzle, so that the manufacturing is easy and the manufacturing time is shortened, and the yield is improved. As a result, the manufacturing cost is reduced. It has been reduced by about 30 to 40%.

FIG. 2 is an enlarged view of the nozzle rod 1 of the electronic component suction nozzle 7 according to one embodiment of the present invention manufactured by the method of FIG. Have been. The nozzle block 3 is formed at the tip of the nozzle pipe 4 together with the diamond tip 2, and the lower part of the nozzle rod 1 is fixed to the shank 5 as shown in FIG.

A nozzle opening 11 of a nozzle hole 10 is formed near the tip of the nozzle 7, and is opened on a rectangular nozzle suction surface 20.

FIG. 3 is a plan view of the tip opening surface of the electronic component suction nozzle 7 according to one embodiment of the present invention.
It has a rectangular shape. The nozzle opening 11 of the nozzle hole 10 is symmetrical with respect to the rectangular center lines X and Y of the suction surface 10, and has a point-symmetric shape with respect to the nozzle axis A.

More specifically, the nozzle opening 11 is provided with a slightly elongated center slit 12, and opened outward on both sides in the longitudinal direction of the center slit 12 so as to be provided symmetrically with respect to the center lines X and Y, respectively. The slits 13 and 14 are formed. On the other hand, the support portion for supporting the sucked electronic component is formed of support legs 2 projecting in the direction of the center axis A of the suction nozzle.
1, 22, 23 and 24, each of which is formed in a substantially rectangular shape, has no acute angle portion, and has substantially the same width, length and area. The nozzle opening 1
The corner of the outward part of 1 is formed substantially circular.

In the above configuration, the supporting portions for supporting the electronic components and the sucking portions to be sucked are alternately and almost uniformly distributed in the X and Y-axis directions. For example, when viewed in the Y-axis direction, the support legs 23
-Attraction portion 12-Arranged almost evenly and alternately like support legs 24, and also at the center left portion, outer frame support portion-suction portion 131-support portion 21-suction portion 132-outer frame support portion. In this way, the two are arranged alternately and substantially evenly. The same applies to the center right part and the X-axis direction.

A broken line frame 50 is an example of the smallest electronic component sucked on the nozzle suction surface 20, and shows the suction nozzle suction position, the supporting position, and the relative relationship with the electronic component. In this relationship, portions A, B, and
C, D, E, F, and G are suction positions where suction force acts on the surface of the electronic component, and portions S, T, U, and V indicated by hatching.
And the outer frame part corresponds to the supporting position for supporting the electronic components,
The suction position and the support position are alternately and almost uniformly distributed on the nozzle suction surface 20, and this relationship is clearly shown in the figure. This relationship between the suction position and the support position is slightly smaller than the broken line frame 50, sufficiently large (for example, the same size as the nozzle end face), and the angle of the suction is slightly rotated around the nozzle axis. Even if it is almost maintained.

When the outline of the nozzle opening 11 protrudes from the outline of the electronic component, the suction air escapes from the protruding portion. In the case of FIG. It is evenly distributed at the four corners of the electronic component 50, and serves to stably suck the electronic component at a normal position and in a normal direction.

FIG. 4 shows a comparison of the nozzle performance between the electronic component suction nozzle (No. 1) and the conventional electronic component suction nozzle (No. 2) according to the manufacturing method and configuration of the present invention. As shown in FIG. 4, according to the electronic component suction nozzle of the present invention, the above-described manufacturing method and a nozzle opening comprising a central slit and a U-shaped slit symmetrically provided on both sides in the longitudinal direction of the central slit. By constructing the suction nozzle having the above, the suction performance was remarkably improved overall.

For example, the compression strength of the conventional product shown in FIG.
It is increased by about 1.6 times from 6.9 Kg to 153.0, and the abrasion resistance at the edge is further improved. As a result, the life of the nozzle is improved 3 to 10 times as compared with the conventional one, and one nozzle is improved. In some cases, about 10 million parts can be sucked.

The adsorbing power was sufficient, and the air flow was uniform.

An improvement was also obtained from the standpoint of superior adsorption. That is, since the distribution of the suction position and the distribution of the support positions for the components are alternately and substantially evenly distributed on the suction surface without being biased, the suction can be performed in a normal posture even if the component suction position is slightly shifted. .

Therefore, according to the present invention, the economics in the production and use of the nozzle are improved, and the problems of the above-mentioned conventional nozzles, such as the abrasion of the edge portion and the compressive strength, are also reduced. Thus, stable suction performance can be maintained for a long time, and an electronic component suction nozzle having excellent durability can be configured.

[0041]

As described above, according to the present invention, the problems of the above-mentioned conventional electronic component suction nozzles, such as the high production cost and the edge portion compression strength, which were the disadvantages of the conventional electronic component suction nozzle, are solved. Economic and durability can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a manufacturing process of an electronic component suction nozzle according to the present invention.

FIG. 2 is a main part configuration diagram of an electronic component suction nozzle according to one embodiment of the present invention.

FIG. 3 is a plan view of a nozzle opening of the electronic component suction nozzle according to the embodiment of the present invention.

FIG. 4 is a nozzle performance comparison diagram of the electronic component suction nozzle of the present invention and a conventional nozzle.

FIG. 5 is a diagram showing a configuration example of a nozzle opening of a conventional electronic component suction nozzle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle rod 2 Diamond tip 3 Nozzle tip block 4 Nozzle pipe 5 Shank 6 Mounting part 7 Electronic component suction nozzle 10 Nozzle hole 11 Nozzle opening 12 Central slit 13 14 U-shaped slit 20 Nozzle suction surface 21, 22, 23, 24 Support Part 41 Mounting part 50 Electronic component A Nozzle shaft BG Pickup position SV Support position

────────────────────────────────────────────────── ─── Continued on the front page Examiner Motoki Takada (56) References JP-A-62-208825 (JP, A) JP-A-6-244592 (JP, A) JP-A-3-109743 (JP, U) JP-B-51-16298 (JP, B1) (58) Fields investigated (Int. Cl. ⁷ , DB name) B25J 15/06 B23H ⁷ /00-7/10 B23H 9/14 H05K 13/02

Claims (3)

(57) [Claims] 1. A method for manufacturing an electronic component suction nozzle, comprising the following steps: a) The other end of the nozzle rod formed by attaching a diamond tip to the tip of the nozzle pipe is thinned to a predetermined size to form a connection with the shank at the other end. b) Connect the nozzle rod to the shank. c) machining the distal portion including a diamond tip of the nozzle rod in a predetermined cross-section. d) forming a central hole in the diamond tip; e A nozzle hole having a nozzle opening of a predetermined shape is formed in the diamond tip . 2. The method according to claim 1, wherein the steps c) to e) are performed by wire electric discharge machining. 3. The electronic component suction according to claim 1 or 2.
An electronic component suction nozzle which is manufactured by a method of manufacturing a nozzle and has a central slit, and a nozzle opening including a U-shaped slit symmetrically provided on both sides in the longitudinal direction of the central slit so as to open outward. .