JP3336128B2 - Semiconductor pellet push-up device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of pushing up a semiconductor pellet stuck on an adhesive sheet from the back side of the adhesive sheet.
The present invention relates to a semiconductor pellet push-up device of a pellet bonding device that peels off from an adhesive sheet.

[0002]

2. Description of the Related Art A large number of semiconductor pellets adhered to a pressure-sensitive adhesive sheet are sequentially peeled off from the pressure-sensitive adhesive sheet using a pellet bonding apparatus, and are bonded to an island portion of a lead frame. In this step, the semiconductor pellet push-up device provided in the pellet bonding apparatus pushes up the semiconductor pellet from the back side of the adhesive sheet using a push-up pin, and peels the semiconductor pellet.

In this semiconductor pellet push-up device, as shown in FIG. 6A, a suction tube 2 is mounted on an upper portion of a suction holder 1, and a suction hole 4 is formed on an upper surface 3 of the suction tube 2. . When the inside of the suction holder 1 becomes negative pressure by the operation of a vacuum pump (not shown) serving as a vacuum source, the negative pressure acts on the adhesive sheet through the suction hole 4, and the adhesive sheet on which the semiconductor pellets are adhered becomes the suction cylinder 2. Is adsorbed on the upper surface 3. In this state, the semiconductor pellet is pushed up by a push-up pin that rises through the suction hole 4, and the semiconductor pellet is separated from the adhesive sheet.

By the way, the adhesive strength of an adhesive sheet acting on a semiconductor pellet depends on the adhesive strength of the adhesive sheet itself, and generally increases when the size of the semiconductor pellet is large and decreases when the size of the pellet is small. . Therefore, as shown in FIGS. 6B and 6C, when the size of the semiconductor pellet 5 is small, the suction force of the pressure-sensitive adhesive sheet is reduced by using, for example, the suction tube 2 in which one suction hole 4 is formed ( If the suction force is strong, the pellets will peel off due to the suction force.) If the dimensions of the semiconductor pellet 5 are large, for example, the suction tube 2 having five suction holes 4 formed therein
Is used to increase the attraction force of the pressure-sensitive adhesive sheet, so that the attraction force of the suction tube 2 is changed according to the adhesion force acting on the semiconductor pellet.

[0005]

As described above, in the conventional semiconductor pellet push-up apparatus, the adsorption cylinder 2 is replaced every time the adhesive strength of the adhesive sheet or the type of the semiconductor pellet 5 is changed, and the adhesive sheet is replaced with a new one. Since the suction force is changed, the setup work associated with this change becomes complicated.

In addition, a large number of suction cylinders 2 having different numbers of suction holes 4 must be prepared for each adhesive strength of the pressure-sensitive adhesive sheet and each kind of semiconductor pellet 5, and it is necessary to keep all of them.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor pellet push-up apparatus which can extremely easily perform a setup operation accompanying a change in adhesive force acting on a semiconductor pellet. Aim.

[0008]

According to the present invention, there is provided a semiconductor pellet having a pressure-sensitive adhesive sheet on which a semiconductor pellet is stuck, which is sucked from the back side, and a push-up pin is pushed up to release the semiconductor pellet from the pressure-sensitive adhesive sheet. In the push-up device,
The push-up pin is built in so as to be able to move up and down, and is connected to a vacuum source and the inside thereof can be set to a negative pressure.
A suction tube having a plurality of suction holes formed on its upper surface,
A switching means is provided between the suction holder and the suction tube for communicating or blocking a predetermined suction hole among the plurality of suction holes with the inside of the suction holder by relative rotation of the suction holder and the suction tube. It is characterized by the following.

[0009]

Therefore, according to the semiconductor pellet push-up device of the present invention, if the suction tube is rotated relative to the suction holder, the suction hole which is in communication with the inside of the suction holder can be controlled by the switching means. .

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing one embodiment of a semiconductor pellet push-up apparatus according to the present invention. FIG. 2 is an exploded perspective view showing the suction holder and the suction cylinder of FIG. FIG.
(A) Shows the operating state when small semiconductor pellets are adsorbed.
3 is a partial cross-sectional view of FIG. 1, and FIG.
It is an arrow view. FIG. 4 shows an operation state when a large semiconductor pellet is adsorbed, and FIG. 4A is a partial cross-sectional view of FIG.
(B) is a view on arrow IVB in FIG. 4 (A). FIG. 5A is a partial cross-sectional view of another embodiment of the semiconductor pellet push-up apparatus according to the present invention, and FIG. 5B is a sectional view of FIG.
5 (C) is a plan view of the suction holder of FIG. 5 (A).

The pellet bonding apparatus generally includes a semiconductor pellet push-up device 10 (FIG. 1) and a semiconductor pellet transfer device (not shown). The semiconductor pellet push-up device 10 peels many semiconductor pellets 11 stuck on the adhesive sheet 12 from the adhesive sheet 12. The semiconductor pellet transfer device holds the exfoliated semiconductor pellet 11 using a collet 13, transfers the semiconductor pellet 11 to an island portion of a lead frame (not shown), and fixes (bonds) the island to the island portion.

As shown in FIG. 1, a semiconductor pellet push-up device 10 includes a suction holder 14 having a bottomed cylindrical shape, and a suction cylinder 1 mounted on an upper opening of the suction holder 14 so as to be relatively rotatable.
5, a pin support 17 to which the push-up pin 16 is fixed, and a cam 19 driven by a motor 18.

The suction holder 14 has a vacuum pipe 20.
The vacuum source is connected to a vacuum source (not shown), and by the operation of the vacuum source, the inside of the suction holder 14 becomes negative pressure and functions as a vacuum chamber. In addition, on the upper surface 22 of the suction tube 15,
A plurality of suction holes 23 corresponding to the type of the semiconductor pellet 11 are formed, and in the illustrated example, a center suction hole 23A,
An example is shown in which the surrounding suction holes 23B are formed at 90 degrees on the same circumference centered on the suction holes 23A. The negative pressure in the suction holder 14 is applied to the adhesive sheet 1 through the suction holes 23.
2, the adhesive sheet 12 is attached to the upper surface 2 of the suction tube 15.
2 can be adsorbed.

The pin support 17 is slidable through the bottom of the suction holder 14, and a roller 24 is rotatably supported at the lower portion. The roller 24 is always in sliding contact with the cam 19. Accordingly, the pin support 17 can be moved up and down via the cam 19 and the roller 24 by the driving of the motor 18, and the push-up pin 16 can protrude to the outside through the suction hole 23 </ b> A at the center of the suction hole 23. It is said. This push-up pin 16
As a result, the push-up pins 16 penetrate the adhesive sheet 12 adsorbed on the upper surface 22 of the adsorption cylinder 15, push up the semiconductor pellet 11, and peel the semiconductor pellet 11 from the adhesive sheet 12.

As shown in FIG. 2, a plurality of cutouts 25 as switching means are formed in the upper part of the suction holder 14 in the circumferential direction. A locking pin 26 projects from the side surface of the suction holder 14, and the locking pin 26 can be locked in a pin locking groove 27A or 27B formed in the lower portion of the suction tube 15. When the locking pin 26 is locked in the pin locking groove 27A, the notch 25 corresponds to the surrounding suction hole 23B and the surrounding suction hole 23B is Communicate inside. Lock pin 2
3 is locked in the pin locking groove 27B, as shown in FIG.
In response to B, the top 28 closes the suction hole 23B and cuts off communication with the inside of the suction holder 14.

If the semiconductor pellet 11 is small, the communication between the surrounding suction holes 23B and the inside of the suction holder 14 is cut off as described above (FIG. 3), and the negative pressure from only the central suction hole 23A is reduced. By the action, the pressure-sensitive adhesive sheet 12 is suctioned with a weak suction force. When the semiconductor pellet 11 is large, the surrounding suction holes 23B communicate with the inside of the suction holder 14 as described above (FIG. 4), and the center suction holes 23A are formed.
The pressure-sensitive adhesive sheet 12 is suctioned with a strong suction force by the action of the negative pressure from the surrounding suction holes 23B. Accordingly, by rotating the suction tube 15 relatively to the suction holder 14 and locking the locking pin 26 in the pin locking groove 27A of the suction tube 15, the central suction hole 23A and the surrounding suction holes 23B are formed.
The adhesive sheet 12 can be sucked with a strong suction force by the above, and the suction force can be optimized for the large semiconductor pellet 11. Also,
By locking the locking pin 26 in the pin locking groove 27B of the suction cylinder 15, the adhesive sheet is suctioned with a weak suction force only by the central suction hole 23A, and the suction force can be optimized for the small semiconductor pellet 11.

According to the above embodiment, if the suction tube 15 is rotated relative to the suction holder 14, the suction holes 23 (surrounding suction holes 23B) are sucked by the notch 25 and the top 28 of the suction holder 14. The state of communication with the inside of the holder 14 can be controlled. For this reason, even if the type of the semiconductor pellet 11 is different, the setup operation accompanying the change of the type of the semiconductor pellet 11 can be completed by relatively rotating the same suction tube 15, so that the setup operation can be performed very easily. .

Further, since it is not necessary to change the adsorption cylinder 15 according to the type of the semiconductor pellet 11, this adsorption cylinder 15
Can be reduced. FIG. 5 shows another embodiment according to the present invention, and the same parts as those in the above-mentioned embodiment are denoted by the same reference numerals and description thereof will be omitted. In the semiconductor pellet push-up device 30 of the other embodiment, a switching plate 31 as switching means is fixed to the upper end of the suction holder 14. The switching plate 31 has a suction hole 23 formed in the upper surface 22 of the suction tube 15 (a center suction hole 23A).
And the same control holes 32 as the surrounding suction holes 23B).
(A central control hole 32A and a peripheral control hole 32B) are formed in the same position and in the same shape.

Therefore, by rotating the suction tube 15 relative to the suction holder 14, the suction tube 23A at the center of the suction tube 15 and the control hole 32A at the center of the switching plate 31 always coincide with each other. The surrounding suction holes 23B and the control holes 32B around the switching plate 31 can be matched or mismatched. In the case of coincidence, the central suction hole 23A and the peripheral suction holes 2A
3B, a negative pressure acts on the adhesive sheet 12 with a large suction force.
Can be adsorbed. In the case of mismatch, a negative pressure acts only on the central suction hole 23A, and the pressure-sensitive adhesive sheet 12 can be suctioned with a small suction force.

Therefore, also in the other embodiment, the same suction cylinder 15 can correspond to the size of the semiconductor pellet 11, so that the same operation and effect as in the above embodiment can be obtained.

In the above embodiment, the position of the suction tube 15 with respect to the suction holder 14 is set using the locking pin 26 and the pin locking grooves 27A and 27B. As shown in (1), a gear 33 is engraved around the adsorption cylinder 15, a pinion 35 installed on the motor 34 is engaged with the gear 33, and the rotation and stop of the motor 34 are controlled according to the dimensions of the semiconductor pellet 11. Thus, the relative position of the suction tube 15 to the suction holder 14 may be set.

In the above embodiment, the central suction hole 2 is provided.
Although the case where four suction holes 23B are formed on the same circumference with respect to 3A has been described, the number of suction holes is increased (the suction holes need not be on the same circumference), and the suction holder 14 and the suction tube 15 The suction force may be changed by increasing or decreasing the number of suction holes communicating with the inside of the suction holder 14 by changing the relative rotation amount of the suction holder 14.

Further, in the above-described embodiment, the description has been given of the case where the attraction force to the adhesive sheet is changed in accordance with the dimensions of the semiconductor pellets. Since the adhesive force of the adhesive sheet to the pellets differs when the adhesive sheet is different, the adhesive force of the adhesive cylinder may be changed according to the adhesive strength of the adhesive sheet.

[0024]

As described above, according to the apparatus for pushing up a semiconductor pellet according to the present invention, it is possible to extremely easily carry out a setup operation associated with a change in the adhesive force acting on the semiconductor pellet.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing one embodiment of a semiconductor pellet push-up device according to the present invention.

FIG. 2 is an exploded perspective view showing the suction holder and the suction cylinder of FIG. 1;

3A and 3B show an operation state when a small semiconductor pellet is adsorbed, FIG. 3A is a partial cross-sectional view of FIG. 1, and FIG. 3B is a view taken in the direction of arrow IIIB in FIG. 3A.

4A and 4B show an operation state at the time of adsorption of a large semiconductor pellet, FIG. 4A is a partial cross-sectional view of FIG. 1, and FIG. 4B is a view taken on line IVB of FIG. 4A.

FIG. 5A is a partial cross-sectional view of another embodiment of the semiconductor pellet push-up device according to the present invention.
FIG. 5B is a plan view of the suction cylinder of FIG.
FIG. 5C is a plan view of the suction holder of FIG.

6 (A) is a perspective view showing a part of a conventional semiconductor pellet push-up device, and FIGS. 6 (B) and 6 (C) are plan views of the suction cylinder of FIG. 6 (A). FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor pellet push-up apparatus 11 Semiconductor pellet 12 Adhesive sheet 14 Suction holder 15 Suction cylinder 16 Push-up pin 23 Suction hole 23A Center suction hole 23B Peripheral suction holes 25 Notch 28 Top of suction holder

Claims (3)

(57) [Claims] 1. A semiconductor pellet push-up device for adsorbing a pressure-sensitive adhesive sheet to which a semiconductor pellet is adhered from a back surface side and lifting up a push-up pin to separate the semiconductor pellet from the pressure-sensitive adhesive sheet. A suction holder having a pin built therein so as to be movable up and down, connected to a vacuum source and capable of setting the inside to a negative pressure; and a plurality of suction holes mounted on the upper surface of the suction holder while being relatively rotatably mounted on the suction holder. A predetermined suction hole among the plurality of suction holes is formed between the suction holder and the suction tube by the relative rotation of the suction holder and the suction tube between the suction holder and the suction tube. A push-up device for a semiconductor pellet, comprising a switching means for communicating with or shutting off the semiconductor pellet. The switching means is a notch formed in the upper part of the suction holder in a circumferential direction, and the notch is made to correspond to a predetermined suction hole by the relative rotation of the suction holder and the suction cylinder. 2. The device for pushing up a semiconductor pellet according to claim 1, wherein the suction hole communicates with the inside of the suction holder. 3. The switching means is a switching plate provided on a suction holder and provided with a control hole, and the control hole is made to correspond to a predetermined suction hole by the relative rotation of the suction holder and the suction tube. 2. The device for pushing up a semiconductor pellet according to claim 1, wherein the suction hole communicates with the inside of the suction holder.