JP3338586B2 - Watertight and airtight materials for construction - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a watertight and airtight material for construction, and more particularly, to an antibacterial and antifungal property in which semiconductor fine particles having photocatalytic action are effectively dispersed in a base material made of a polymer material. The present invention relates to a watertight and airtight material for buildings having an antibacterial and antifungal action useful as a material for gaskets and the like.

[0002]

2. Description of the Related Art There has been a problem of mold and bacteria indoors, such as the problem of mold in general houses and offices, and the infection in hospitals and hospitals, but there has been no effective and simple solution to this problem. Conventionally, methods using chemicals such as antibacterial and antifungal agents have been mainly used. However, there are problems that the treatment is troublesome and that the odor of the chemicals causes discomfort. In particular, the gasket portion used as a fixing portion of the window glass is liable to accumulate dew condensation water and dirt, thereby causing mold growth and darkening, which is not only unsanitary but also aesthetically bad. There was a problem. Also,
Once grown, it is difficult to remove the mold, and there is a method of removing the mold using a chemical such as a mold treating agent. However, the removal of the mold by the chemical is not easy due to problems such as safety of the chemical and odor.

[0003] By the way, it has been conventionally known that semiconductor fine particles having a photocatalytic action represented by TiO ₂ exhibit an antibacterial and antifungal action. The development of materials with the slab is underway. For example, Japanese Patent Application Laid-Open No. 2-124949 discloses a plastic molded article formed by molding a thermoplastic resin sheet containing a small amount of water and containing a fine powder deodorant mainly composed of a hybrid of titanium dioxide and zinc oxide. ing. Japanese Patent Application Laid-Open No. 2-6333 discloses an antibacterial powder in which an antibacterial metal such as copper or zinc is supported on the surface of titanium oxide particles, and this powder is mixed with resin, rubber, glass or the like. It is taught that this results in an antimicrobial composition.

[0004]

SUMMARY OF THE INVENTION However, TiO
_When kneading semiconductor fine powder having photocatalytic action such as ₂ into rubber or resin, it shows sufficient photocatalytic effect and
In order to impart an antifungal effect, it is necessary to increase the compounding amount, whereby the flexibility of the rubber or resin material is impaired, such that the rubber or resin material is easily or easily cut,
There is a problem that the mechanical properties of the material deteriorate. Also,
Since the antibacterial and antifungal properties depend exclusively on the photocatalytic action of the semiconductor fine powder in the surface layer of the material that comes into contact with the outside air, the semiconductor fine powder inside the material does not contribute to the antibacterial and antifungal action, and is wasted. In addition, it causes problems such as deterioration in mechanical properties such as elongation and strength of the material as described above.

Accordingly, an object of the present invention is to solve the above-mentioned problems such as deterioration of mechanical properties such as strength and flexibility when compounding a powder having a photocatalytic action into rubber or resin, and to achieve maintenance-free operation. An object of the present invention is to provide a watertight and airtight material for buildings, such as a gasket member exhibiting an antibacterial and antifungal action. Furthermore, an object of the present invention is to provide an excellent antibacterial and antifungal effect by effectively dispersing a semiconductor fine powder having an antibacterial and antifungal effect in a surface layer exposed to the outside air, and to provide excellent processability. Another object of the present invention is to provide a watertight and airtight material for building which has excellent flexibility, strength and the like, and which can be manufactured relatively easily and at low cost.

[0006]

To SUMMARY OF THE INVENTION To achieve the above object, according to this onset bright, in a substrate made of a polymer material, semiconductor fine particles having a photocatalytic action on at least one surface of the substrate There is provided a watertight and airtight material for construction characterized by being mixed so as to increase toward the building. Suitably
It is preferable that semiconductor fine particles having a particle diameter of 1 nm to 100 μm are mixed at a ratio of 0.01 to 1000% by weight based on the polymer material of the base material.

[0007]

The water-tight hermetic material for construction according to the present invention is characterized in that the concentration of semiconductor fine particles exhibiting a photocatalytic action mixed in a base material of a polymer material such as rubber or resin is determined by comparing the concentration of the light-irradiating surface layer with the light. By making them different in the interior where they do not come into contact, problems such as deterioration of mechanical properties such as elongation and strength of the material are solved, and an excellent antibacterial and antifungal action is exerted. That is, the wood charge is sufficient amount of the semiconductor fine particles are present in the surface portion to reduce the amount as little as possible present in the interior, of the material when the semiconductor fine particles was large amount elongation and the strength and the like It is intended to solve problems such as deterioration of mechanical properties.

Further, as described above, the antibacterial and antifungal properties
Since it depends exclusively on the photocatalytic action of the semiconductor fine particles in the surface layer of the material that comes into contact with the outside air, the semiconductor fine particles inside the material do not contribute to the antibacterial and antifungal effects, and are wasted, as described above. This causes problems such as deterioration of mechanical properties such as elongation and strength of the material. If the compounding amount of the semiconductor fine powder is reduced in order to prevent such a problem from occurring, the antibacterial and antifungal effects are naturally weakened. On the other hand, when the surface of the resin or the like is coated with the semiconductor fine powder, sufficient adhesion between the resin and the coating film cannot be obtained, and the coating film may be peeled off.
The architectural watertight and airtight material of the present invention has no problem such as peeling of a coating film because semiconductor fine particles are mixed in a polymer material base material such as rubber or resin, and a surface layer of a material to which the base material is exposed to light. Since a sufficient amount of the semiconductor fine particles is present in the portion, an excellent antibacterial and antifungal action is exhibited. That is, when semiconductor fine particles, for example, TiO ₂ exposed on the surface of a material are irradiated with sunlight or fluorescent light, holes (h ⁺ ) and excited electrons (e ⁻ ) are generated on the TiO ₂ surface, and photocatalysts are generated. Show action. That is, the oxygen in the air is reduced by the action of the holes to generate oxygen radicals. These oxygen radicals have an excellent bactericidal action, and as a result, mold and the like hardly occur.

[0009] The polymer material used as the base material includes vinyl chloride resin, acrylic rubber, nitrile rubber (NBR), butyl rubber (IIR), and styrene-butadiene rubber (SB).
R) and ethylene propylene terpolymer (EPDM) are not particularly limited as long as they have appropriate flexibility and strength, and can be appropriately selected depending on the application. When the watertight and airtight material for construction of the present invention is used as a gasket member, various resins and rubbers conventionally used for gaskets can also be suitably used as the polymer material.

Next, the semiconductor fine powder mixed with the polymer material has a relatively high electron-hole mobility ratio.
Any semiconductor can be used as long as it has a photocatalytic action as described above. For example, TiO ₂ , RuO ₂ , Cs ₃ S
b, InAs, InSb, GaAs, etc.
Among them, TiO ₂ is particularly preferable. The particle size of the semiconductor fine particles used is 1 nm to 100 μm, preferably 5 nm.
nm to 10 μm is appropriate. When the particle size is smaller than 1 nm, the band cap becomes large due to the quantum size effect, and there is a problem that the photocatalytic performance cannot be obtained unless irradiation with light having a large energy such as ultraviolet light is performed. Also,
If the particle size is too small, problems arise such as difficulty in handling and poor dispersibility. A particle size of 5 nm or more is preferred from the viewpoint of handleability. On the other hand, when the particle size exceeds 100 μm, relatively large semiconductor fine particles are present on the surface of the material, so that the surface becomes poor in smoothness and particles exposed on the surface of the material easily fall off. In consideration of the smoothness of the material surface and the like, the particle size is preferably 10 μm or less.

Further, the shape of the semiconductor fine particles having the above-mentioned particle diameter is desirably a spherical shape or a shape close thereto.
The photocatalytic property of the semiconductor itself does not depend on the shape of the semiconductor fine particles, so that any shape can be used.However, in order to disperse the semiconductor fine particles in the polymer material of the base material, the dispersion of the semiconductor fine particles is required. For simplicity, spherical or near-spherical particles are more desirable than fiber or needle-like structures. In addition, the smoothness of the surface of the obtained watertight and airtight material for construction is better when spherical particles are used.

In one embodiment, the watertight and airtight material for construction of the present invention comprising the above-mentioned polymer material and semiconductor fine particles having a photocatalytic action has the semiconductor fine particles on at least one surface of the polymer base material. It has a structure that is mixed so as to increase toward it. As an embodiment in which the semiconductor fine particles are mixed in the polymer base material, the semiconductor fine particles are mixed in a concentration gradient that increases toward the outside of the base material, for example, when the cross section is spherical or cylindrical. Can be a structure in which semiconductor particles are mixed so as to increase in the direction from the center to the surface or side surface, or in the direction from the concave surface to the outer surface when the cross section is concave.
In addition, a mode in which the base material is mixed with a concentration gradient such that it increases from one outer surface to the other outer surface, for example, in the case of a plate, a large amount of semiconductor fine particles are directed from one surface to the other surface. It is possible to have a mixed structure.

Various methods can be used as a method for producing the watertight and airtight material for construction of the present invention having such a structure. For example, an appropriate amount of the semiconductor fine particles is mixed with a polymer material, and the mixture is placed in a cylindrical rotating container 1 as shown in FIG. By such an operation, the semiconductor fine particles move to the vicinity of the outer surface due to the centrifugal force. Thereafter, by solidifying, a water-tight and air-tight material having a circular cross section in which a large amount of semiconductor fine particles are mixed near the surface of the polymer base material is obtained. The mixing amount of the semiconductor fine particles having a photocatalytic action mixed in such an embodiment is preferably in the range of 0.01 to 1000% by weight based on the polymer base material. If the amount is less than 0.01% by weight, the amount of semiconductor fine particles exhibiting photocatalytic properties becomes insufficient, and as a result, sufficient antibacterial and antifungal properties of a watertight and airtight material for construction cannot be obtained.
If it exceeds 1000% by weight, there is no problem in exhibiting antibacterial and antifungal properties, but the mechanical properties of the watertight and airtight material for construction are significantly reduced.

[0014] In the injection molding or press molding, as shown in FIG. 3, previously coated cloth's film kneaded semiconductor fine particles in the semiconductor fine particles 21 and the polymer material into the cavity within the wall of the mold 20 By injecting a polymer material into the material or by filling and pressing the same, a watertight and airtight material in which semiconductor fine particles are dispersed in the surface layer can be obtained.

[0015] Also in the embodiment described above, the proportion of fine semiconductor particles mixed in the front surface layer is the same reason as the previous embodiment, is preferably in the range of 0.01 to 1000% by weight of the total polymeric material.

[0016] Having described the basic aspects of the building watertight airtight material of the present invention, the copper in addition to the semiconductor fine particles as a material to further enhance the antimicrobial, silver, metal fine particles having an antimicrobial such as platinum May be contained. These metals are
Since it exhibits antibacterial properties even without light irradiation, these antibacterial metals, which are present in the surface layer of the building, maintain their antibacterial and antifungal properties even at night, even when the light of the fluorescent lamp disappears. Will be. The size, shape and method of adding these antibacterial metals to the polymer material are the same as those of the semiconductor fine particles exhibiting the photocatalytic action described above, and the content is
The total amount of the semiconductor fine particles and the semiconductor fine particles mixed together is desirably in the range of 0.01 to 1000% by weight based on the polymer material.

When the above-mentioned semiconductor fine particles and antibacterial metal fine particles are used in combination, ultrafine particles of Cu, Ag, Pt, Pd, Au or the like having a smaller diameter are projected and carried on the surface of the fine particles of TiO _2. a composite ultrafine particles, it is advantageous that the above TiO ₂ ultrafine particles are used TiO ₂ composite ultrafine particles containing ultrafine particles of anatase type TiO ₂ and rutile TiO _2. Such composite ultrafine particles contain 50 to 99 atomic% of Ti, Cu, Ag, Pt, P
A raw material (alloy) consisting of 1 to 50 atomic% of a metal element such as d or Au is converted into an inert gas (Ar, He, Kr, Xe, N
₂ etc.) It can be produced by heating and melting in an atmosphere or an inert gas atmosphere containing oxygen, and reacting the evaporated raw material with oxygen in the above atmosphere, or by reacting with oxygen after forming ultrafine particles.

The resulting composite ultrafine particles are nanometer-sized fine ultrafine particles having a structure in which a plurality of ultrafine particles such as a metal or an oxide having a smaller diameter are bonded to the surface of the ultrafine particles made of TiO ₂ . The individual TiO ₂ ultrafine particles consist of either anatase TiO ₂ ultrafine particles or rutile TiO ₂ ultrafine particles, and both types of TiO ₂ ultrafine particles are generated. That is, the composite ultrafine particles to be produced are generally composed of composite ultrafine particles in which carrier particles (large particles carrying smaller particles) are composed of anatase TiO ₂ and rutile TiO _2. Composed of a mixture of composite ultrafine particles.

Anatase TiO ₂ has a higher photocatalytic activity than rutile TiO ₂ , but has a band gap of 3.2 eV, so that it has a 350 g / m3 compared to rutile TiO _2.
There is a disadvantage that only light having a short wavelength of less than nm can be used. Conversely, rutile TiO ₂ is the activity of the photocatalyst is low as compared to the anatase type TiO _2, since the band gap of 3.0 eV, even slightly longer wavelengths up to 400nm as compared to the anatase type TiO ₂ Available. Carrier particles of composite ultrafine particles which produced the anatase type TiO ₂ is 50 to 80% by weight with respect to TiO ₂ whole, since the rutile TiO ₂ is accounts for 20 to 50 wt%, single anatase TiO ₂ And rutile type TiO ₂ ,
Catalytic activity is enhanced by the anatase type TiO _2, also effectively sunlight due to the presence of rutile TiO ₂ (wavelength 36
0-780 nm).

In general, since the catalytic reaction proceeds on the surface of the catalyst, if the catalyst particles are made highly pure and fine, the number of active sites per unit mass is significantly increased, and high activity can be expected.
The composite ultrafine particles are nanometer-order composite ultrafine particles in which ultrafine particles such as antibacterial metals and oxides having a smaller diameter than the ultrafine particles made of TiO ₂ are projected and supported. Therefore, it has high photocatalytic activity and high antibacterial
Since they exhibit an antifungal effect, they can be used very advantageously as the semiconductor fine particles of the present invention. Further, unlike TiO ₂ particles produced by a liquid phase method, the particles are extremely fine, contain no impurities, and have extremely high purity.

The antibacterial and antifungal water-tight hermetic material of the present invention having the above-described embodiments is conventionally formed into a shape according to the use to be used, if necessary, so that the generation of fungi has been a problem. It can be advantageously applied to the parts and various uses. For example, when used as a gasket for a window frame,
The building water-tight airtight material is heated and pressed to form a desired cross-sectional shape, or using a mold having a desired cross-sectional shape,
An antibacterial / antifungal gasket can be produced directly from a resin and semiconductor fine particles having a photocatalytic action. Either method can produce an unprecedented gasket having excellent antibacterial and antifungal properties without significantly impairing mechanical properties such as strength and flexibility. In addition, it can also be used as a watertight and airtight material in places such as bathrooms where moisture is high and mold is likely to occur.

Further, the gasket according to the present invention,
The use of a combination of window glass and panels whose surfaces are coated with an antibacterial and antifungal film further enhances the antibacterial and antifungal effects. The whole can be kept hygienic. In particular, a window unit having excellent antibacterial and antifungal properties is provided by imparting an antibacterial and antifungal effect to a window glass, its frame member, and a gasket. In this way, by coating the entire inner surface of the window glass with photocatalytic semiconductor particles, sunlight is irradiated during the day and fluorescent light is irradiated at night, so the coated surface always has a photocatalytic function. The surface exhibits an antibacterial and antifungal action according to the principle described above. In addition, since room air is always convective, it is in contact with the inner surface of the window glass. Thus, the room air is cleaned by touching the inner surface of the window glass.

As a method of coating semiconductor fine particles exhibiting antibacterial and antifungal properties on a window glass or the like, a vapor deposition method such as a sputtering method, a sol-gel method, a plating method, or the like can be used. １1 μm is appropriate. The thicker the film thickness, the higher the photocatalytic action and thus the higher the antibacterial and antifungal properties. However, a film thickness of 1 μm or more is not preferred because it is easy to peel off from the glass surface. On the other hand, when the film thickness is small, the photocatalytic action is also weakened.
m or more is desirable. Further, on the surface of the window glass or the like coated with the semiconductor fine particles in this way, further, copper, silver,
An antibacterial metal such as platinum can be coated by the same method as the above-described coating of the semiconductor fine particles. As a result, the antibacterial property is maintained even when the light of the fluorescent lamp is extinguished at night, and the entire indoor space can be always kept hygienic. The appropriate thickness of the antibacterial metal film is 1 to 10 nm. As the thickness of the antibacterial metal film is larger, the antibacterial action becomes stronger. However, when the thickness exceeds 10 nm, the light transmittance decreases, and the film does not function as a window. Also, the antibacterial and antifungal effects of the underlying photocatalytic film are reduced. Therefore, the appropriate thickness of the antibacterial metal film is 1 to 10 nm. Also,
Such an antibacterial metal does not necessarily have to be adhered to the surface of a building material in a film form, and is preferably dispersed and attached in an island form in consideration of light transmittance.

[0024]

EXAMPLES Hereinafter, the effects of the present invention will be described more specifically with reference to examples, but it is needless to say that the present invention is not limited to the following examples.

Example 1 Vinyl chloride resin and Ti having a particle size (average particle size) of 20 nm
5% by weight of the O ₂ fine powder was put in a cylindrical rotary container 1 shown in FIG. 1 and rotated around a central axis 2 at 1000 rpm for 10 minutes. By this operation, a composite resin material 3 in which many TiO ₂ fine particles 5 were dispersed near the surface of the vinyl chloride resin 4 as shown in FIG. 2 was produced.

Comparative Example 1 A vinyl chloride resin and 5% by weight of TiO ₂ fine powder having a particle size of 20 nm were kneaded, and the mixture was placed in a cylindrical container shown in FIG. 1 and solidified to prepare a composite resin material. .

Comparative Example 2 Vinyl chloride resin and TiO ₂ fine powder 10 having a particle size of 20 nm
0% by weight was kneaded, and the mixture was put into a cylindrical container shown in FIG. 1 and solidified as it was to prepare a composite resin material.

Comparative Example 3 A vinyl chloride resin and 5% by weight of TiO ₂ fine powder having a particle size of 20 nm were kneaded and extruded to produce a composite resin material having a diameter of 5 mm.

A tensile test and an antifungal test were performed to examine the strength and antifungal properties of each composite resin material produced in Example 1 and Comparative Examples 1 to 3. The evaluation method of the tensile test is as follows: ○ for those having the strength of the current gasket member or higher, × for those below.
Was evaluated. With respect to the antifungal property, each composite resin material was exposed to an air atmosphere maintained at a temperature of 25 ° C. and a humidity of 90% for 50 days, and when no mold was generated on the surface of the composite resin material, ○ was recognized. Those were evaluated as x. Table 1 shows the results of the above test .

[0030]

[Table 1]

As it is apparent from Table 1, as a composite resin material of Comparative Example 1, but decrease in strength observed in the extent of 5% of TiO ₂ fine particles are mixed throughout the resin, TiO ₂
Since the fine particles are uniformly dispersed, the amount of TiO ₂ fine particles present in the surface layer of the material is small, and thus a sufficient antifungal effect is not obtained. In the composite resin material of Comparative Example 2, since the same amount of TiO ₂ fine particles as the resin was mixed, the amount of the fine particles in the material surface layer was large, and the antimicrobial property was exhibited. The mechanical properties were very poor due to the large amount of dispersion. On the other hand, in the composite resin material of Example 1, a sufficient antifungal effect was obtained only by mixing 5% of TiO ₂ fine particles as in Comparative Example 1, and the mechanical properties were also excellent. This is because the kneaded TiO ₂
This is because the fine particles moved toward the surface due to the centrifugal force, and the amount of TiO ₂ present in the material surface layer increased. Further, in the same mixing ratio as the ratio Comparative Examples 1, a composite resin material of Comparative Example 3 fabricated by extrusion, for the same reasons as in Comparative Example 1 was also resulted in antimicrobial is insufficient.

Example 2 As shown in FIG. 3 , TiO ₂ fine particles 21 were applied to the inner wall of a cavity of a mold 20 having a diameter of 10 mm and a length of 50 mm. 10 mm in diameter and 50 mm in length in which TiO ₂ fine particles are dispersed in a layer
Was prepared.

Example 3 Using titanium and palladium as raw materials each having a purity of 99.9 mass% or more, arc melting was performed in an Ar atmosphere.
A button-shaped ingot of an alloy having a composition of 89.6 at% Ti-10.4 at% Pd was produced. Using this button-shaped ingot, arc melting was performed in an Ar gas atmosphere (gas pressure of 200 Torr) containing 10% oxygen gas to produce composite ultrafine particles. The phases of the generated ultrafine particles were identified by X-ray diffraction, and the structure of the ultrafine particles was observed by a transmission electron microscope (TEM). As a result, T
iO ₂ and Pd were produced, and TiO ₂ was produced in both anatase type and rutile type. When the produced ultrafine particles were observed with a TEM (transmission electron microscope) photograph, approximately 1 to 50 nm were added to the approximately spherical ultrafine particles of about 10 to 300 nm.
Were joined together to produce a composite ultrafine particle having a supported composite form. As a result of examining these composite ultrafine particles by an energy dispersive detection method (SEM EDX), only a strong peak of Ti was detected from the carrier ultrafine particles carrying the fine ultrafine particles, while the carrier ultrafine particles were supported by the carrier ultrafine particles. The peaks of Ti and Pd were detected from the ultrafine particles. The X-ray diffraction, TEM, and the results of EDX, manufactured composite ultrafine particles, TiO ₂ oxide ultrafine particles and fine Pd ultra-fine particles from being carried on it was combined with nm level - turned metal composite ultrafine particles It is thought that it is. The vinyl chloride resin and 5% by weight of the TiO ₂ -based composite ultrafine particles produced as described above
Into a cylindrical rotating container 1 shown in FIG.
Rotated at 000 rpm for 10 minutes. With this operation,
As shown in FIG.
A composite resin material 3 in which a large amount of ₂ type composite ultrafine particles 5 were dispersed was produced.

Example 4 As shown in FIG. 3 , the Ti produced in Example 4 was placed on the inner wall of the cavity of a mold 20 having a diameter of 10 mm and a length of 50 mm.
After applying the O ₂ -based composite ultrafine particles 21, the vinyl chloride-based resin 22 was injected into a mold to prepare a composite resin material having a diameter of 10 mm and a length of 50 mm in which the TiO ₂ -based composite ultrafine particles were dispersed in the surface layer. .

FIG. 4 shows the change over time in the area occupied by the mold on the surface of the composite resin material prepared in each of Examples 1 to 4 and Comparative Examples 1 to 3. The antifungal property was measured by exposing each material to an air atmosphere maintained at a temperature of 25 ° C. and a humidity of 90% for 50 days. As is clear from FIG. 4, the composite resin materials produced in the examples exhibited excellent antibacterial and antifungal effects over a long period of time.

[0036]

As described above, the watertight and airtight material for architectural use of the present invention is effective in that semiconductor fine particles exhibiting antibacterial and antifungal properties by a photocatalytic action on the surface thereof and metal fine particles exhibiting antibacterial action as required. Since these particles are dispersed and present in a homogeneous manner, a relatively small amount of antibacterial and antimicrobial properties can be obtained without impairing mechanical properties such as strength and flexibility as compared to those produced by uniformly dispersing these fine particles throughout the material. Exhibits better antibacterial and antifungal properties simply by using moldy fine particles. Also, since extremely fine antibacterial and antifungal fine particles are mixed in the surface layer of the polymer material, the antibacterial and antifungal fine particles fall off the material surface, and
There is no problem that the antifungal property is reduced. Therefore,
The antibacterial and antifungal watertight and airtight material for construction according to the present invention can be used for various applications, and as an example, can be applied to a gasket for a window frame to which mold easily adheres. In particular, if the gasket according to the present invention is used in combination with a window glass or panel whose surface is coated with an antibacterial / antifungal film and the gasket according to the present invention, the antibacterial / antifungal effect is further enhanced. The entire indoor space made of such building materials can be kept hygienic.

[Brief description of the drawings]

FIG. 1 is a schematic structural view of an example of an apparatus for producing an antibacterial and antifungal watertight hermetic material for buildings by utilizing centrifugal force according to the present invention.

FIG. 2 is a sectional view of a composite resin material produced by the apparatus shown in FIG.

FIG. 3 is a schematic structural view of an example of an apparatus for producing an antibacterial and antifungal building watertight airtight material by injection molding according to the present invention.

FIG. 4 is a graph showing the change over time in the area occupied by fungi on the surface of the antibacterial / antifungal composite resin material obtained in Examples 1 to 4 and Comparative Examples 1 to 3.

[Explanation of symbols]

1 rotating container 2 around axis 3 composite resin material 4, 22 vinyl chloride resin 5, 2 1 TiO ₂ particles 20 mold

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification code FI C08K 3/10 C08K 3/10 C08L 101/00 C08L 101/00 E04B 1/682 E04B 1/68 L (58) Fields surveyed ( Int.Cl. ⁷ , DB name) C09K 3/10 B32B 5/14 B32B 27/00 B32B 27/18 C08J 5/00 C08K 3/10 C08L 101/00 E04B 1/682

Claims (6)

(57) [Claims] 1. A watertight and airtight building structure, wherein semiconductor fine particles having a photocatalytic action are mixed in a base material made of a polymer material so as to increase toward at least one surface of the base material. Wood. 2. The watertight and airtight material for building according to claim 1, wherein said semiconductor fine particles are mixed in a concentration gradient increasing toward the outside of the base material. 3. The watertight and airtight construction according to claim 1, wherein the semiconductor fine particles are mixed in a concentration gradient such that the concentration increases from one outer surface to the other outer surface of the base material. Wood. 4. The semiconductor fine particles have a particle size of 1 nm to 10 nm.
0 μm, 0.01 to 1 with respect to the polymer material of the base material.
The watertight and airtight material for building according to any one of claims 1 to 3 , wherein the watertight and airtight material is mixed at a ratio of 000% by weight. 5. A building watertight airtight material according to any one of claims 1乃<br/> optimum 4, characterized by further antibacterial metal with the semiconductor fine particles are mixed into the base material . 6. is a gasket member for a window frame according to claim 1乃<br/> building watertight airtight material according to any one of Itaru 5.