JP3339474B2 - Semiconductor package and semiconductor package mounting structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package such as a CSP manufactured by a package encapsulation and package dicing cutting method.

[0002]

[Prior art]

The batch encapsulation / package dicing cutting method is a method in which a plurality of semiconductor chips are bonded to one interposer substrate, sealed with a resin, cut into individual pieces by dicing, and divided into a single package. Say. On the other hand, the method of bonding a single semiconductor chip to a single dicing interposer substrate and sealing it with a resin to obtain a single package (hereinafter referred to as an individual encapsulation method) is a package encapsulation / packaging method. It was common before the dicing method was adopted. FIG. 2A is a schematic cross-sectional view of a CSP manufactured by the conventional batch encapsulation and package dicing cutting method, and FIG. 2B is a schematic cross-sectional view of a mounting structure of the CSP illustrated in FIG. 2A. Show. FIG. 3A is a schematic cross-sectional view of a CSP manufactured by a conventional individual encapsulation method.
FIG. 3B is a schematic cross-sectional view of the mounting structure of the CSP shown in FIG.

[0004] As shown in FIG. 2 (A), C is manufactured by a conventional batch encapsulation and package dicing cutting method.
The SP has a semiconductor chip 4 on the upper surface of the interposer substrate 2.
Is mounted, and the bonding wire 5 is connected to the semiconductor chip 4
Is connected between the pad and the stitch on the interposer substrate 2 side, the sealing resin 3 is sealed including the semiconductor chip 4 and the bonding wires 5, and the solder ball 1 is joined to the bottom surface of the interposer substrate 2. Also, such a structure
A plurality of semiconductor chips bonded on one interposer substrate are collectively resin-sealed, and the space between each semiconductor chip is continuously filled with sealing resin,
Laser, diamond cutter, dicing saw or the like is cut perpendicularly to the interposer substrate 2 and obtained by dividing into individual pieces.
It is formed by cutting by dicing, and is configured as a cut surface by dicing. That is, one side surface of the interposer substrate 2 and one side surface of the sealing resin 3 are arranged on the same plane as the same cut surface, and are configured as one plane perpendicular to the bottom surface of the interposer substrate 2.

On the other hand, in the CSP manufactured by the individual encapsulation method, as shown in FIG. 3A, the side surface of the interposer substrate 2 is formed by cutting by dicing, and the side surface of the sealing resin 3 is formed by a mold. Therefore, it is easily possible to form a step on the side surface of the package and expose the peripheral portion of the upper surface of the interposer substrate 2 to form the side surface of the package.

On the other hand, CSP stands for Chip Scale Package.
Alternatively, it is an abbreviation of Chip Size Package, which is a general term for packages equal to or slightly larger than the chip size, and is used for a high-density package in which the package size is smaller than the chip size. As a connection method, there are a BGA method, an LGA method, a SON method, and the like. Therefore, it cannot be clearly distinguished what package is a CSP and what package is not a CSP, which has a very vague meaning.

At present, however, BGA-type CSPs employing solder bumps are mainly used as connection terminals, and because of their small size and high density, they are widely used in portable information devices such as mobile phones and digital video cameras. Since it is often used for such portable information devices, there is a situation where a CSP mounting structure that can withstand dropping and deformation of the mounting substrate due to button operation is desired.

[0008] As a CSP mounting structure for withstanding dropping and deformation of the mounting substrate due to button operation, after bonding the solder bumps formed on the bottom surface of the CSP to the mounting substrate, the uncured space is formed in the gap between the mounting substrate and the interposer substrate. Fill the resin,
2. Description of the Related Art There is a semiconductor device in which a CSP is fixed to a mounting substrate by curing in a state in which a resin is adhered to a bottom surface and a side surface of an interposer substrate. Such a resin is generally called an underfill. However, only the side of the interposer substrate
The resin for fixing the SP is called a sidefill.
The underfill / sidefill is often of the same composition as the sealing resin 3 of the semiconductor chip. However, the viscosity is set low so as to easily fill the narrow gap.

As shown in FIG. 3B, when the CSP manufactured by the individual encapsulation method is fixed to the mounting board by using the underfill / sidefill, the peripheral edge of the upper surface of the interposer substrate 2 is sealed with a sealing resin. 3, the underfill / sidefill 7 is exposed not only on the bottom surface and the side surface of the interposer substrate 7 but also exposed.
It is applied to the upper surface to fix the CSP. However, as shown in FIG. 2A, in the CSP manufactured by the conventional package encapsulation and package dicing cutting method, one side surface of the interposer substrate 2 and one side surface of the sealing resin 3 are on the same plane as the same cut surface. And the entire surface of the upper surface of the interposer substrate 2 is covered with the sealing resin 3, and the side surface of the interposer substrate 2 does not face upward. Therefore, such a CSP is underfilled.
When fixing to the mounting substrate using the side fill, the underfill / sidefill 7 cannot be applied to the upper surface of the interposer substrate 2 and the underfill / sidefill 7 does not ride on the interposer substrate 2. As a result, the adhesion strength and holding force between the CSP and the mounting substrate are reduced, and there is a possibility that the device may fall or a solder bump or the like may be defectively bonded due to a button operation or the like. There is a problem that the resistance is reduced.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and is intended to improve the adhesion between a semiconductor package manufactured by a package encapsulation and package dicing cutting method and a mounting substrate. It is another object of the present invention to improve the holding force of a semiconductor package by underfill and sidefill, and to improve drop resistance and bending resistance of the device.

[0011]

Means for Solving the Problems A first invention of the present application for solving the above problems is an interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate, a sealing resin for sealing the one surface, A semiconductor package comprising a bump formed on the opposite surface of the one surface, and each side surface being constituted by one plane constituted by one side surface of the interposer substrate and one side surface of the sealing resin,
A semiconductor package, wherein an angle formed by any one or more of the side surfaces and a bottom surface of the interposer substrate is an acute angle .

[0012] Accordingly, the present application according to the first semiconductor package of the invention, since the angle of the side surface of the interposer substrate and the bottom surface of the interposer substrate is at an acute angle, the side surface of the conventional interposer substrate as the interposer substrate The surface area of the side surface of the interposer substrate increases as compared with the case where the angle formed by the bottom surface is a right angle ,
The side surface of the interposer substrate faces upward. When the semiconductor package of the first invention of the present application is fixed to a mounting substrate using underfill / sidefill, the contact area between the side surface of the interposer substrate and the underfill / sidefill increases and the underfill / sidefill increases. Part of the fill rides on the side of the interposer board,
There is an advantage that the adhesion between the semiconductor package and the mounting substrate and the holding power of the semiconductor package due to underfill and sidefill are improved. Therefore, there is an advantage that the drop resistance and the bending resistance of the semiconductor device having such a mounting structure are improved.

Further, the adhesion strength better angle is an acute angle of all sides and the bottom surface of the interposer substrate of the semiconductor package, the holding force is improved. Therefore, the second invention of the present application describes an interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate, a sealing resin for sealing the one surface, and a bump formed on the opposite surface of the one surface. In a semiconductor package, wherein each side surface is constituted by one plane formed by one side surface of the interposer substrate and one side surface of the sealing resin, an angle formed between each side surface and a bottom surface of the interposer substrate is an acute angle. The semiconductor package is characterized in that:

[0014] Thus, according to the semiconductor package of the present application the second invention, in all aspects of the semiconductor package, with the contact area between the side surface of the interposer substrate and the underfill side fill increases, the underfill side fill one Since the portion rides on the side surface of the interposer substrate, there is an advantage that the adhesion between the semiconductor package and the mounting substrate and the holding power of the semiconductor package due to underfill and sidefill are improved. Since the top surface and the bottom surface of the semiconductor package are usually parallel, the package side surface of the semiconductor package of the second invention of the present application has a trapezoidal shape, and the cross section cut along a plane passing through the top surface and the bottom surface of the semiconductor package also has a trapezoidal shape.

The third invention of the present application is also directed to an interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate, a sealing resin for sealing the one surface, and a bump formed on the opposite surface of the one surface. And a mounting substrate to which the bumps are joined, and a mounting structure of a semiconductor package including an underfill and a sidefill, wherein each side surface of the semiconductor package includes one side surface of the interposer substrate and one side surface of the sealing resin. one plane is composed of, the angle is acute der with either one or more surfaces and the bottom surface of the interposer substrate of each side was
A mounting structure of a semiconductor package, characterized in that that.

[0016] Thus, according to the mounting structure of the semiconductor package of the present application the third invention, the angle of the side surface of the interposer substrate and the bottom surface of the interposer substrate acute der
Since that, than the angle between the side surface of the conventional interposer substrate as the bottom surface of the interposer substrate is square, with the surface area of the side surface of the interposer substrate is increased, the side surface of the interposer substrate faces upward. Then, as the contact area between the side surface of the interposer substrate and the underfill / sidefill increases, a part of the underfill / sidefill rides on the side surface of the interposer substrate, and the adhesion between the semiconductor package and the mounting substrate,
There is an advantage that the holding power of the semiconductor package by the underfill / sidefill is improved. Therefore, there is an advantage that the drop resistance and the bending resistance of the semiconductor device having such a mounting structure are improved.

Further, the adhesion strength better angle is an acute angle of all sides and the bottom surface of the interposer substrate of the semiconductor package, the holding force is improved. Therefore, the fourth invention of the present application relates to an interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate, a sealing resin for sealing the one surface, and a bump formed on the opposite surface of the one surface, In a mounting structure of a semiconductor package including a mounting substrate to which bumps are bonded and an underfill / sidefill, one side surface of each of the semiconductor packages is formed by one side surface of the interposer substrate and one side surface of the sealing resin. in the structure will mounting structure of a semiconductor package, wherein the angle formed between the bottom surface of the interposer substrate and the side surface is an acute angle.

Therefore, according to the mounting structure of the semiconductor package of the fourth invention of the present application, the contact area between the side surface of the interposer substrate and the underfill / sidefill increases on all side surfaces of the semiconductor package,
Since a part of the underfill / sidefill runs on the side surface of the interposer substrate, there is an advantage that the adhesion between the semiconductor package and the mounting substrate and the holding power of the semiconductor package due to the underfill / sidefill are improved. Since the top surface and the bottom surface of the semiconductor package are usually parallel to each other, in the semiconductor package mounting structure of the seventh aspect of the present invention, the side surface of the semiconductor package is trapezoidal, and a cross section cut along a plane passing through the top surface and the bottom surface of the semiconductor package. Is also trapezoidal.

The above first to fourth inventions of the present application are extremely effective when the semiconductor package is a CSP. As mentioned above, the CSP is a high-density package in which the package size is smaller than the chip size, and the bump pitch and the bump size are small.
This is because there is a situation where it is used for a device which needs to be fixed to a mounting board with a small area and has a large chance of receiving a shock such as a mobile phone or a digital video camera.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package according to an embodiment of the present invention and a mounting structure of the semiconductor package will be described below with reference to FIG. FIG. 1A is a schematic sectional view showing a CSP according to an embodiment of the present invention. FIG. 1 (B)
FIG. 2 is a schematic cross-sectional view illustrating a mounting structure of the CSP illustrated in FIG.

The CSP of this embodiment is a BGA-type CSP manufactured by a batch encapsulation and package dicing cutting method. That is, the CSP of this embodiment is:
The semiconductor chip 4 is mounted on the interposer substrate 2,
A semiconductor package manufactured by bonding a bonding wire 5 between a pad of a chip 4 and a stitch on an interposer side, forming a sealing resin 3 by encapsulation at a time, mounting a solder ball 1, and cutting into individual pieces by package dicing. It is. Therefore, the process up to package dicing is a process in which several packages for a single interposer substrate are manufactured together. Therefore, FIG.
As shown in FIG. 1, the CSP of this embodiment has a semiconductor chip 4 mounted on an upper surface of an interposer substrate 2, a bonding wire 5 is connected between a pad of the semiconductor chip 4 and a stitch on the interposer substrate 2 side, and a sealing resin 3 is provided. Seals the semiconductor chip 4 and the bonding wires 5 together and includes a large number of solder balls 1 on the bottom surface of the interposer substrate 2.
Are joined and arranged in a lattice. Also, the CSP of this embodiment
Each side surface is formed as a cut surface by diagonally cutting a laser, a diamond cutter, a dicing saw or the like into an upper surface or a bottom surface of the package in the package dicing process. Therefore, each side surface of the CSP is constituted by one plane constituted by one side surface of the interposer substrate 2 and one side surface of the sealing resin 3, and
Between each side surface of the CSP and the bottom surface of the interposer substrate 2
The angle is an acute angle. FIG. 1 shows a mounting structure of a semiconductor package according to this embodiment in which a CSP having such a structure is fixed to a mounting substrate 6 using underfill and sidefill.
It is shown in (B).

As shown in FIG. 1B, in the mounting structure of the semiconductor package according to the present embodiment, a part of the underfill / sidefill 7 is cured in a state in which the underfill / sidefill 7 is in close contact with the side surface of the interposer substrate 2, and the CSP is cured. It is fixed to the mounting board 6.

The mounting structure of the semiconductor package according to the present embodiment is, as apparent from the mounting structure of the CSP manufactured by the conventional package encapsulation and package dicing cutting method shown in FIG. The bonding area with the interposer substrate 2 is large, and the adhesion strength is improved.
Further, since the side surface of the interposer substrate faces upward, there is an effect that the holding force by the side fill is improved.

In this embodiment, the internal connection method of the semiconductor chip is wire bonding, and the external connection method is BGA. However, in the present invention, the internal connection method of the semiconductor chip is not limited to wire bonding. The connection method is not limited to BGA.

[0025]

As described above, the present invention has the effect of increasing the contact area between the side surface of the interposer substrate and the side fill, thereby improving the adhesion to the mounting substrate. As a result, the semiconductor package of the present invention is obtained. There is an effect that the drop resistance and the bending resistance of the device equipped with the can be improved.

[Brief description of the drawings]

FIG. 1A is a schematic sectional view showing a CSP according to an embodiment of the present invention, and FIG. 1B is a schematic sectional view showing a mounting structure of the CSP shown in FIG.

2A is a schematic cross-sectional view of a CSP manufactured by a conventional batch encapsulation and package dicing cutting method, and FIG. 2B is a schematic cross-sectional view of a mounting structure of the CSP illustrated in FIG.

3A is a schematic cross-sectional view of a CSP manufactured by a conventional individual encapsulation method, and FIG. 3B is a schematic cross-sectional view of a mounting structure of the CSP illustrated in FIG.

[Explanation of symbols]

 Reference Signs List 1 solder ball 2 interposer substrate 3 sealing resin 4 semiconductor chip 5 bonding wire 6 mounting substrate 7 underfill / sidefill

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/28-23/31 H01L 23/12 501 H01L 21/60 311

Claims (4)

(57) [Claims] An interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate,
A sealing resin that seals the one surface, and a bump formed on the opposite surface of the one surface, each side surface being a plane formed by one side surface of the interposer substrate and one side surface of the sealing resin. in structured semiconductor package comprising a semiconductor package, wherein the angle formed between the bottom surface of the interposer substrate with any one or more of the surfaces of each side is an acute angle. 2. An interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate,
A sealing resin that seals the one surface, and a bump formed on the opposite surface of the one surface, each side surface being a plane formed by one side surface of the interposer substrate and one side surface of the sealing resin. in structured semiconductor package comprising a semiconductor package wherein the angle <br/> the bottom surface of each side and the interposer substrate is an acute angle. 3. An interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate,
A sealing resin for sealing the one surface, a bump formed on the opposite surface of the one surface, and a mounting board to which the bump is bonded;
In a mounting structure of a semiconductor package having an underfill and a sidefill, each side surface of the semiconductor package is constituted by one plane formed by one side surface of the interposer substrate and one side surface of the sealing resin. An angle formed between any one or two or more surfaces and the bottom surface of the interposer substrate is an acute angle .
Mounting structure of a semiconductor package, characterized in that. 4. An interposer substrate, a semiconductor chip bonded to one surface of the interposer substrate,
A sealing resin for sealing the one surface, a bump formed on the opposite surface of the one surface, and a mounting board to which the bump is bonded;
In a mounting structure of a semiconductor package including an underfill and a sidefill, each side surface of the semiconductor package is formed of one plane formed by one side surface of the interposer substrate and one side surface of the sealing resin. A mounting structure of a semiconductor package, wherein an angle between the bottom surface of the interposer substrate and the bottom surface is an acute angle .