JP3339712B2 - Removal method of runner branch from tape carrier package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing runner branches from a tape carrier package and a tape carrier package.

[0002]

2. Description of the Related Art In resin sealing molding of a tape carrier package (TCP) type semiconductor device, after a semiconductor chip is mounted on a TAB tape, these molded products are placed in a resin sealing mold of a transfer molding device. , And the cavity is filled with resin to seal a required area (resin sealing region) with resin. Then, degating is performed on the resin-molded TCP, and the cull and the runner branches are removed.

FIG. 7 shows a conventional method for removing runner branches or the like in TCP. According to the conventional method of FIG.
By rotating the cull 14 and the runner branch 16 in the direction of the arrow in a state where the tape 10 is sandwiched and fixed, the runner branch 16 is separated from the surface of the TAB tape 10, and the runner branch 16 is separated by the gate 18 into the package section. 12 and the TAB tape 10 are bent and degated to remove runner branches and the like. Further, in contrast to the conventional example of FIG.
By rotating the AB tape 10, the runner branches and the like can be removed similarly to the method of FIG. As described above, in the conventional method of removing the runner branch or the like, the runner branch 16 is rotated relative to the runner branch 16 or the like in a state where the TAB tape 10 is sandwiched, as in the case of the lead frame. Are removed.

[0004]

However, according to the above-mentioned conventional degate method, since the entire TAB tape is relatively rotated, a strong force tends to act partially and instantaneously, and the TAB tape is damaged. There was a problem that.
In addition, since the degate is collectively performed, the acting force for the degate does not gradually act in a well-balanced manner, and the runner branch may be cut off and the runner branch may remain on the TAB tape. Furthermore, it is necessary to separately hold the TAB tape and the runner branch, etc., and to move both of them relatively, so that the process and apparatus are complicated, and there is a problem that the production efficiency is poor.

Accordingly, an object of the present invention is to provide a method for removing runner branches in TCP, which can reliably remove runner branches and the like without damaging the TAB tape and has good production efficiency. .

[0006]

The present invention has the following arrangement to achieve the above object. That is, the present invention provides a TA
In a method of removing a runner branch from a tape carrier package formed by resin-molding a semiconductor chip mounted on a B tape, a step of bending a TAB tape against the runner branch and peeling the TAB tape from the runner branch; Is bent at the gate portion with respect to the package portion, and degated.

The present invention also provides a method of removing a runner branch from a tape carrier package formed by resin-molding a semiconductor chip mounted on a TAB tape. Bending and degating, T
Bending the AB tape with respect to the runner branch, and separating and separating the runner branch from the TAB tape surface.

Further, the present invention provides a long or strip-shaped TA.
In a molding die for a tape carrier package, a semiconductor chip mounted on a required portion of a B tape at a predetermined interval in a longitudinal direction of the TAB tape is filled with resin in a cavity along a surface of the TAB tape and sealed. The runner for injecting the resin into the cavities comprises, for each pair of adjacent cavities, one main runner and two branch runners branched from the main runner and connected to the respective cavities through gates, There is also a molding die for a tape carrier package, characterized in that a dummy runner extending in a direction intersecting with the main runner is formed on the main runner.

[0009]

According to the method for removing a runner branch in a tape carrier package according to the present invention, the TAB tape is bent from the runner branch so that the TAB tape is gradually peeled off from the runner branch in the course of the bending. In addition, the runner branch is bent at the gate portion with respect to the package and degated. The separation step of the runner branch and the degate step are performed in separate steps. Since the runner branches are removed by such a process, a strong force does not act locally and instantaneously on the TAB tape, and the acting force for peeling and degate gradually acts reliably. Further, it is possible to easily bend the TAB tape only by applying a pressing member on the feed path of the TAB tape. For this reason, continuous processing from reel to reel can be performed efficiently, and productivity can be improved.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory diagram illustrating an embodiment of a method for removing runner branches in a tape carrier package (TCP) according to the present invention. FIG. 1 (A)
Is a state in which a TAB tape 10 in which a semiconductor chip is resin-sealed is placed on a lower mold 20 for removing runner branches;
The cull 14 and the runner branch 16 are held by a holding device (not shown). The left end corner on the drawing of the lower mold 20 is the TA where the runner branch 16 is formed and adhered.
The left side of the B tape 10 is formed on a slope so as to be bent and cantilevered. Further, a V-shaped pressing member 22 is located above the TAB tape 10 corresponding to the slope of the lower die 20.

FIG. 1B shows a state in which the pressing member 22 shown in FIG. 1A is lowered, the left side of the TAB tape 10 is bent, and the TAB tape 10 is separated from the runner branch 16. . TAB tape 1 up to the state shown in FIG.
In the process of bending of the runner branch 16 with zero, the pressing member 22 gradually presses the TAB tape 10 from its left end, and presses the TAB tape 10 on the runner branch 16.
Peels off gradually from Then, as shown by the arrow, the runner branch 16 is bent with respect to the package 12 at the gate portion 18 and dedated, and the cull 14 and the runner branch 16 are removed.

Next, another embodiment of the method for removing runner branches in TCP according to the present invention will be described with reference to FIGS. The TCP shown in FIGS. 2 and 3 is
Molten resin is filled through a runner branched from one cull into two, and two semiconductor chips mounted at a predetermined interval in the longitudinal direction of the TAB tape 10 are molded together by resin sealing. Have been. FIG. 2 shows a state in which the TAB tape 10 conveyed in the longitudinal direction is bent with respect to the runner branch 16 and the TAB tape 10 is being peeled off from the runner branch 16. That is, T
The AB tape 10 is on a path conveyed so as to be wound up from reel to reel in a state where a predetermined tension is given, and the roller 24, which is a rod-shaped pressing member, is pressed against the tension of the TAB tape 10 by TAB. Press the tape 10 and press T
The AB tape 10 is bent so that T
The AB tape 10 has been peeled off from the runner branch 16.
Note that 16a is a main runner branch, 16b is a branch runner branch, and 16c is a dummy runner branch.

A process of removing the runner branch 16 by the pressing member having the roller 24 will be described. First, when the TAB tape 10 is transported, the roller 2
4 is located above the TAB tape 10 and the package 12
The TAB tape 10 on which is molded is transported from the left side to the right side (feed direction) in the drawing of FIG. Gate portion 18a on the front side of branch runner branch 16b branched into two from main runner branch 16a
Reaches the position below the roller 24,
The transport of the B tape 10 is stopped, the roller 24 is lowered, and the TAB tape 10 is bent at the position of the front gate 18a. Thereby, the branch runner branch 16b can be bent and degated together with the TAB tape 10 with respect to the package 12 by the gate portion 18a.

Next, when the TAB tape 10 is transported in the feeding direction with the roller 24 bending the TAB tape 10, the TAB tape 10 is gradually peeled off from the runner branch 16 as is apparent in FIG. . At this time, TAB
To improve the peelability of the tape 10, the TAB tape 1
An operation of returning 0 to the direction opposite to the feeding direction, or a small reciprocating operation in the longitudinal direction of the TAB tape 10 may be given.
The TAB tape 10 may also be provided with a high tension by a tension roller or the like (not shown).
The releasability of the B tape 10 from the runner branches 16 can be improved. The rear gate 18b, which is the other gate, is also folded by the roller 24 at the position of the rear gate 18b by the roller 24, similarly to the degate of the front gate 18a. , Degate.

FIG. 3 shows a TAB tape 1 formed with TCP, which is adapted to the method for removing runner branches in the TCP of FIG.
0 is shown. The runner branch 16 extends upward from the cull 14 molded downward in the drawing, is molded on the surface of the TAB tape 10, and is a package 12 for resin-sealing two semiconductor chips mounted at a predetermined interval. And is connected to both packages at gate portions 18a and 18b. Reference numeral 16c denotes a dummy runner, which assists in separating the runner branch 16. This dummy runner 16
According to c, the TAB tape 10 is formed in a direction orthogonal to the fold to be bent. For this reason, the action force for peeling can be strongly and stably applied to the portion of the runner branch 16 along the fold, whereby the peelability of the runner branch 16 can be improved.

The dummy runner 16c is provided with a semiconductor chip mounted on a required portion of a long or strip-shaped TAB tape at a predetermined interval in a longitudinal direction of the TAB tape, and is provided in a cavity along the TAB tape surface. It is molded together with the main runner 16a and the branch runner 16b by a molding die for a tape carrier package in which a resin is injected and sealed. In other words, the dummy runner 16c is configured such that, for each pair of adjacent cavities, a runner for injecting resin into the cavity is divided into one main runner and two branches that branch from the main runner and are connected to the respective cavities via gates. And a runner.
The tape carrier package is formed by a tape carrier package forming die having a dummy runner extending in a direction intersecting with the main runner (orthogonal in this embodiment).

Reference numeral 26 denotes a notch, which is formed at a location where the molten resin passage of the runner is narrowed. FIG. 4 is a sectional view taken along line XX of FIG. 3, and the notch portion 26 is formed in a V-shape as is apparent from the drawing. By breaking the runner branch 16 at the notch portion 26, the cull 14
Can be easily removed in advance. That is, Cal 1
The cull 14 can be easily removed if the cull 14 is held between the holding members 30a and 30b and turned in the direction of the arrow in FIG. By removing the cull 14 with the runner branch 16 removing device as shown in FIG. 2, it is possible to continuously remove the runner branch 16 in the transport path from reel to reel. And production efficiency can be improved.

As shown in FIG. 3, 13 is an external lead of the semiconductor device, and 19 is a window. The window 19 is a through hole provided in the TAB tape 10 and is usually formed as a space separating the external leads 13. In order to form the runner branch 16 without forming a thin burr portion, the window 19 may be provided with a connecting portion 32 for connecting the outer peripheral portion of the TAB tape 10 and the resin sealing region as shown in FIG. Good.

FIG. 6 shows another embodiment of the present invention.
4 while being held by holding members 34a and 34b,
The TAB tape 10 is bent as in the method shown in FIG. According to this, the runner branch 16 can be reliably removed together with the cull 14. As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and it goes without saying that many more modifications can be made without departing from the spirit of the invention. That is.

[0020]

According to the method for removing a runner branch in a tape carrier package of the present invention, the TAB tape is bent from the runner branch by bending the TAB tape with respect to the runner branch. The TAB tape peeling step and the degate step are performed in separate steps. For this reason, according to the present invention, it is possible to prevent an unreasonable acting force from being applied,
This has a significant effect that the runner branches and the like can be reliably removed without damaging the TAB tape. Also, T
Since the AB tape can be easily bent only by applying a pressing member on the feed path of the TAB tape, efficient continuous processing from reel to reel can be performed, and productivity can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating an embodiment of the present invention.

FIG. 2 is an explanatory diagram illustrating another embodiment of the present invention.

FIG. 3 is an explanatory view illustrating a tape carrier package according to the present invention.

FIG. 4 is an explanatory diagram for explaining a method for removing cull according to the present invention.

FIG. 5 is an explanatory view illustrating an embodiment of a runner according to the present invention.

FIG. 6 is an explanatory view for explaining another embodiment of the present invention.

FIG. 7 is an explanatory diagram for explaining a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 TAB tape 12 Package 14 Cull 16 Runner branch 16c Dummy runner branch 18 Gate part 20 Lower mold 22 Pressing member 24 Roller

Claims (2)

(57) [Claims] 1. A method of removing a runner branch from a tape carrier package formed by resin-molding a semiconductor chip mounted on a TAB tape, wherein the TAB tape is bent with respect to the runner branch and the TAB tape is separated from the runner branch. A method for removing a runner branch from a tape carrier package, comprising the steps of: bending a runner branch with respect to a package portion at a gate portion; 2. A method of removing a runner branch from a tape carrier package formed by resin-molding a semiconductor chip mounted on a TAB tape, wherein the runner branch is bent and degated together with the TAB tape at a gate portion with respect to the package portion. A method for removing a runner branch from a tape carrier package, comprising the steps of: bending a TAB tape with respect to a runner branch; and separating and separating the runner branch from the surface of the TAB tape.