JP3341761B2 - Die bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus for picking up a chip attached to an adhesive sheet with a collet.

[0002]

2. Description of the Related Art In a die bonding apparatus, a chip affixed to the upper surface of an adhesive sheet is picked up by being vacuum-adsorbed to a collet while being pushed up from below by a needle, and transferred and mounted on a substrate such as a lead frame or a printed circuit board. You. Hereinafter, a method of picking up a chip in a conventional die bonding apparatus will be described.

FIG. 5 is an explanatory diagram of a conventional chip pickup method. The horizontal axis represents time, the vertical axis represents height, the upper folding curve A represents the up and down movement of the collet, and the lower folding curve B represents the up and down movement of the needle. The horizontal line C indicates the height of the pressure-sensitive adhesive sheet having the chip attached to the upper surface.

Next, the operation will be described. In the figure, point a is the start position of the collet, and g is the start position of the needle. First, the collet descends at a high speed from the point a to the point b, descends to the point b and approaches the upper surface of the chip. Then, the collet decreases its speed, descends further, lands on the upper surface of the chip, and stops descending. Point c is the upper surface of the chip (the stop point of the collet lowering operation). When the collet arrives at the point c, the collet vacuum-adsorbs the chip until the point d, while still landing on the upper surface of the chip.

On the other hand, the needle starts rising at point g, and h
At this point, the chip reaches the lower surface of the adhesive sheet to which the chip has been attached, and stops the ascent operation. Then, the needle continues to stop until the point i corresponding to the point d at which the collet surely vacuum-adsorbs the chip and starts rising. The time t from the point h to the point i is referred to as a stable time. Then, the collet starts to rise at the point d, the needle starts to rise at the point i, the chip is peeled off from the adhesive sheet and picked up by the collet. The ascending speed from the point i to the point j is the same, whereby the chip is picked up by the collet while pushing up the chip with the needle.

When the collet reaches the point e, the collet increases its ascending speed and rises at a high speed to the point f, which is the pickup end point. The needle stops from the point j to the point k and then starts descending at the point k. Then, it descends to the point 1 which is the start position. The collet that has moved up to the point f and completed the pickup operation moves to above the substrate, and transfers and mounts the chip at a predetermined position on the substrate.

As described above, the collet and the needle pick up a chip while moving up and down on the trajectories indicated by the folding curves A and B. Conventionally, however, it is necessary to realize the trajectories indicated by the folding curves A and B. A cam that rotates by being driven by a motor (this cam has a cam curved surface on which bent curves A and B can be obtained) is used as a means for vertically moving the collet and the needle. By doing so, the up and down operation of one cycle shown in FIG. 5 was performed.

[0008]

In order to reliably pick up a chip with a collet, the point d where the collet starts rising and the point i where the needle starts rising must coincide. The time lag Δ between the points d and i
With t, the collet cannot reliably pick up the chip. That is, if the point i is earlier than the point d, the chip is pushed up by the needle while being pressed by the collet, and the chip is broken. If the point d is earlier than the point i, the collet tends to pick up the chip because the collet attempts to pick up the chip without pushing up the chip with the needle.

As described above, in order to reliably pick up a chip, it is necessary to match the points d and i.
Therefore, conventionally, the rotation start point (point of 0 °) of the collet lifting / lowering cam for starting the lowering of the collet at the point a,
The rotation control of the two cams is performed so that the timing of the rotation start point (point at 0 °) of the cam for raising and lowering the needle at the point g is started.

However, it is practically difficult to control the rotation of the two cams so that the rotation start point of the collet elevating cam and the needle elevating cam completely coincide with each other. And the i point tends to cause a time lag Δt, which causes the above-described pickup error to occur easily.

Accordingly, it is an object of the present invention to provide a die bonding apparatus capable of reliably picking up a chip stuck on an adhesive sheet by using a collet without picking up errors.

[0012]

To this end, the die bonding apparatus according to the present invention comprises a needle for pushing up a chip attached to the upper surface of an adhesive sheet, and a collet for picking up the chip and transferring it to a predetermined position on a substrate. A first motor for moving the needle up and down, a first motor drive circuit for driving the first motor based on a first operation pattern, and a vertically moving collet. A second motor for operating, a second motor drive circuit for driving the second motor based on a second operation pattern, a feedback signal from the first motor drive circuit and the second motor drive circuit, The feedback signal from the motor drive circuit indicates that the needle has reached the adhesive sheet and has stopped ascending, and that the collet has It is confirmed that the descent operation has been stopped by landing on the surface of the needle, and after a predetermined stabilization time has elapsed after this confirmation, the first motor and the second motor are simultaneously driven to drive the needle. And a control unit for simultaneously raising the collet at the same speed.

According to the structure of the present invention, after the collet reaches the upper surface of the chip, it is ensured that a predetermined stabilization time has elapsed and that the collet starts to rise and that the needle rises and the tip starts to push up. And the collet can pick up the chip.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a die bonding apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a chip pickup method according to an embodiment of the present invention, and FIG. FIG. 4 is an explanatory diagram of a pickup operation, and FIG. 4 is a flowchart of a chip pickup operation in one embodiment of the present invention.

First, the overall structure of the die bonding apparatus will be described with reference to FIG. Reference numeral 1 denotes a wafer, and a chip 4 is provided on the surface of the adhesive sheet 3 attached to the ring holder 2.
Are bonded by bond. A push-up unit 6 for chips 4 is provided below the wafer 1.
The push-up unit 6 is configured such that a pepper pot 8 is erected on the upper surface of a case 7 and a needle holder 10 holding a needle 9 is housed inside the pepper pot 8.
A first motor 11 is provided on a side of the case 7. The first motor 11 rotates the cam 12. A roller 13 that abuts on the cam 12 is provided below the needle holder 10.
The roller 13 is pressed against the peripheral surface of the cam 12 by the spring force of the spring 14. The cam 12 is a constant velocity cam, and causes the needle 9 to perform a predetermined up-down operation by rotating the cam 12 forward and backward. That is, the first motor 11, the cam 12, and the roller 13 are first vertical moving means for causing the needle 9 to perform a vertical operation.

A moving table 20 is provided above the wafer 1. The head part 21 is mounted on the moving table 20. The head unit 21 holds a second motor 22, and the second motor 22 holds a collet 23. That is, the second motor 22 is
3 is a second vertical movement means for causing the vertical movement 3 to perform vertical movement. The second motor 22 is a linear motor. Therefore, when the second motor 22 is driven, the collet 23 moves up and down. When the moving table 20 is driven,
The head unit 21 moves between the wafer 1 and the substrate 24 in the horizontal direction. 25 is a table for positioning the substrate 24.

Next, the control system will be described. A control unit 40 controls the driving of the first motor 11 via a first operation pattern storage unit 41, a first pulse generation circuit 42, and a first motor drive circuit 43. Further, the control unit 40 includes a second operation pattern storage unit 44, a second pulse generation circuit 45,
The drive of the second motor 22 is controlled via the second motor drive circuit 46.

The first operation pattern storage section 41 and the second operation pattern storage section 44 store operation patterns for causing the needle 9 and the collet 23 to perform predetermined up and down operations, respectively. The first pulse generation circuit 42 and the second pulse generation circuit 45 perform the first motor generation based on the operation patterns stored in the first operation pattern storage unit 41 and the second operation pattern storage unit 44, respectively. 11 and a pulse for driving the second motor 22 is generated. The first pulse generation circuit 42, the first motor drive circuit 43, the second
Of the pulse generation circuit 45 and the second motor drive circuit 46
Each driving condition is fed back to the control unit 40,
The control unit 40 controls the first operation pattern storage unit 41 and the second operation pattern storage unit 44 based on the feedback signal.
Control.

This die bonding apparatus is configured as described above. Next, the overall operation will be described with reference to FIGS. First, as shown in FIG. 1, the collet 23 is stopped above desired chips 4 on the wafer 1. Next, the second motor 22 is driven to lower the collet 23 toward the chip 4. In this case, the collet 23 is shown in FIG.
The collet 23 descends at a high speed from the point to the point b, descends at a low speed from the point b, and reaches the upper surface of the chip 4 at the point c (step 1 in FIG. 4). The reason for shifting to the low speed at the point b is to prevent the collet 23 from landing on the chip 4 at a high speed and destroying the chip 4. FIG. 3 (a)
3 shows a state where the collet 23 has been lowered to the point b, and FIG. 3 (b) shows a state where the collet 23 has been lowered to the point c.

On the other hand, the needle 9 starts rising at the point g,
It reaches the lower surface of the adhesive sheet 3 at the point h (step 2 in FIG. 4). FIG. 3C shows the state at this time. That is, the needle 9 reaches the lower surface of the adhesive sheet 3 slightly after the collet 23 lands on the upper surface of the chip 4. In step 3, it is confirmed that the collet 23 and the needle 9 have stopped the lowering operation and the raising operation. This confirmation is performed by the control unit 40 based on feedback signals from the first motor drive circuit 43 and the second motor drive circuit 46. That is, the control unit 40 is a confirmation unit for confirming that the lowering operation of the collet 23 and the raising operation of the needle 9 are stopped. After this confirmation, it waits for the stabilization time t to elapse (step 4). This stabilization time t is determined by the collet 23
Is the time required for firmly adsorbing the tip 4 under vacuum, and FIG. 3C shows the needle 9 and the collet 23 during the stabilization time t.

After the stabilization time t has elapsed, the first motor 11 and the second motor 22 are simultaneously driven to
And the collet 23 are raised synchronously, and the chip 4 is peeled off from the adhesive sheet 3 and picked up (step 5). Thereby, the timing (d) at which the collet 23 starts to rise
And the timing (i) at which the needle 9 starts to rise.
2), and the chip 4 can be picked up between the collet 23 and the needle 9 from above and below. FIG. 3D shows the operation at this time. As shown, the needle 9 breaks through the adhesive sheet 3 and pushes up the chip 4 to peel off the adhesive sheet 3, and the collet 23 raises the pushed up chip 4. While picking up.

Next, when the needle 9 reaches the point j in FIG. 2, the needle 9 stops rising, starts to descend at the point k, and moves downward toward the point l which is the height of the start position. On the other hand, the collet 23 shifts from the point e to a high speed and stops rising at the point f. FIG. 3E shows a state in the middle. Thus, the pickup operation of the chip 4 by the collet 23 is completed. Next, the moving table 20 starts to be driven, and the collet 23 moves above the substrate 24. The collet 23 moves up and down to transfer the chip 4 to a predetermined position on the substrate 24 and then returns to the start position. Thus, the operation of one cycle is completed. Hereinafter, by repeating the same operation,
The chips 4 of the wafer 1 are mounted on the substrate 24 one after another.

[0023]

According to the present invention, the point at which the needle and the collet start rising can be made to coincide with each other, and the chip can be picked up by the collet.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a chip pickup method according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a chip pickup operation in one embodiment of the present invention.

FIG. 4 is a flowchart of a chip pickup operation in one embodiment of the present invention.

FIG. 5 is an explanatory view of a conventional chip pickup method.

[Explanation of symbols]

 Reference Signs List 1 wafer 3 adhesive sheet 4 chip 6 push-up unit 9 needle 11 first motor 20 moving table 22 second motor 23 collet 40 control unit 41 first operation pattern storage unit 42 first pulse generation circuit 43 first motor Drive circuit 44 Second operation pattern storage unit 45 Second pulse generation circuit 46 Second motor drive circuit

Claims (1)

(57) [Claims] 1. A die bonding apparatus comprising a needle for pushing up a chip attached to an upper surface of an adhesive sheet and a collet for picking up the chip and transferring and mounting the chip at a predetermined position on a substrate, wherein the needle is moved up and down. A first motor for
A first motor drive circuit for driving the first motor based on a first operation pattern, a second motor for moving the collet up and down, and a second motor
A second motor drive circuit driven based on the operation pattern of the above, the needle reaches the sticking sheet from a feedback signal from the first motor drive circuit and a feedback signal from the second motor drive circuit. It was confirmed that the ascent operation was stopped and the collet landed on the surface of the chip and stopped the descending operation. After the confirmation, if a predetermined stabilization time had elapsed, the first motor and the A die bonding apparatus comprising: a control unit that simultaneously drives a second motor to raise the needle and the collet simultaneously at the same speed.