JP3347117B2 - Tape pressure welding device and tape pressure welding method - Google Patents
Tape pressure welding device and tape pressure welding methodInfo
- Publication number
- JP3347117B2 JP3347117B2 JP2000013426A JP2000013426A JP3347117B2 JP 3347117 B2 JP3347117 B2 JP 3347117B2 JP 2000013426 A JP2000013426 A JP 2000013426A JP 2000013426 A JP2000013426 A JP 2000013426A JP 3347117 B2 JP3347117 B2 JP 3347117B2
- Authority
- JP
- Japan
- Prior art keywords
- rotating plate
- panel
- tape
- pressure welding
- tcp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 title description 3
- 238000003825 pressing Methods 0.000 claims description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 239000000428 dust Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は駆動回路がフレキシ
ブル配線基板に実装されているTCP(TapeCar
rier Package)をパネル(電極が設けられ
たガラス基板)上に熱圧着するテープ圧接装置及びテー
プ圧接方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TCP (Tape Car) in which a driving circuit is mounted on a flexible wiring board.
The present invention relates to a tape pressing apparatus and a tape pressing method for thermocompression-bonding a package on a panel (a glass substrate provided with electrodes).
【0002】[0002]
【従来の技術】液晶表示装置(LCD)の製造工程にお
いては、パネルの電極にTCPを実装する工程がある。
この工程は異方性導電膜(ACF)をガラス基板に貼る
工程と、TCPをその上に載せて位置決めする工程及び
TCPを加熱・加圧することでTCPを電極に接着させ
る工程とから構成される。以下圧着工程について図3の
側面図を用いて説明する。2. Description of the Related Art In a manufacturing process of a liquid crystal display (LCD), there is a process of mounting TCP on a panel electrode.
This step includes a step of attaching an anisotropic conductive film (ACF) to a glass substrate, a step of positioning the TCP on the glass substrate, and a step of bonding the TCP to the electrodes by heating and pressing the TCP. . Hereinafter, the pressure bonding step will be described with reference to the side view of FIG.
【0003】まず図3(a)に示すように、異方性導電
膜3が貼りつけられTCP4が位置合わせされたパネル
7の先端部がステージ6から受台5上に搬送される。[0003] First, as shown in FIG. 3 (a), the tip of the panel 7 on which the anisotropic conductive film 3 is adhered and the TCP 4 is aligned is conveyed from the stage 6 onto the receiving table 5.
【0004】パネルが搬送されたのち、図3(b)に示
すように受台5が上昇しパネル7を下部から支える。支
えが完了した信号が上部の圧接ヘッド1に送られると図
3(c)に示すように、圧接ヘッド1が下降し、パネル
7をクッション材(均等に圧力を加えるための材料)を
交え圧接ヘッド1と受台5でプレスする。After the panel is transported, as shown in FIG. 3B, the pedestal 5 rises to support the panel 7 from below. When the signal indicating that the support is completed is sent to the upper pressure contact head 1, as shown in FIG. 3C, the pressure contact head 1 is lowered, and the panel 7 is pressed with a cushion material (a material for evenly applying pressure). Press with head 1 and cradle 5.
【0005】プレス完了後圧接ヘッド1が上昇して受台
5が下降する。圧接ヘッド1は主にステンレスから形成
される。また受台5はステンレスから形成され圧接ヘッ
ドと共に常温〜400℃に加熱される。After the pressing is completed, the press contact head 1 is raised, and the receiving table 5 is lowered. The pressure welding head 1 is mainly made of stainless steel. The receiving table 5 is made of stainless steel and is heated to a temperature ranging from room temperature to 400 ° C. together with the press-contact head.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、上述し
た従来のテープ圧接装置を用いパネルの電極にTCPを
実装する際、パネルの下に存在する異物粒子が様々な悪
影響を与える。例えば、ガラス基板の破損、ガラス基板
破損によるTCP端子断線、ガラスが浮くことで圧接不
十分になり接続信頼性がなくなる等の事故が発生する。However, when TCP is mounted on the electrodes of the panel using the above-described conventional tape pressing apparatus, foreign particles present below the panel exert various adverse effects. For example, accidents such as breakage of the glass substrate, disconnection of the TCP terminal due to breakage of the glass substrate, and insufficient press-fitting due to floating of the glass and loss of connection reliability occur.
【0007】異物粒子には、異方性導電膜屑、TCP切
断屑、ガラス屑、設備摩耗屑などがあり、大きさは10
μm〜5mmのものまで様々である。従来、このような異
物粒子の除去は、作業者が受台上の清掃頻度を決め、カ
ッターの刃やピンセットを用い、目視検査にて削り落と
していた。The foreign particles include anisotropic conductive film dust, TCP cutting dust, glass dust, equipment wear dust, and the like.
It varies from μm to 5 mm. Conventionally, such foreign particles have been removed by a worker by deciding the frequency of cleaning on the pedestal and visually removing the particles using a cutter blade or tweezers.
【0008】しかし清掃頻度を上げることは、設備の稼
働時間の減少につながると共に、作業者の異物粒子の除
去時の力加減のばらつきや異物粒子の見逃し等の問題が
あった。[0008] However, increasing the frequency of cleaning leads to a reduction in the operating time of the equipment, as well as problems such as variations in the force applied by the operator when removing foreign particles and missed foreign particles.
【0009】本発明の目的は、パネルにTCPを圧接す
る際のパネル下の異物粒子を除去し、パネルとTCPの
接続不良を低減することの可能なテープ圧接装置及びテ
ープ圧接方法を提供することにある。It is an object of the present invention to provide a tape pressing apparatus and a tape pressing method capable of removing foreign particles under the panel when pressing the TCP to the panel and reducing poor connection between the panel and the TCP. It is in.
【0010】[0010]
【課題を解決するための手段】第1の発明のテープ圧接
装置は、矩形状の表面の長手方向の部分が一方に突出し
た突出部を有し、断面形状が逆L字形に形成され、上下
方向に可動に構成されたパネルの受台と、この受台上で
前記突出部より延在して設けられ延在する長手方向の一
辺の部分を軸として回転可能に設けられた矩形状の表面
を有する回転板と、この回転板を回転させるためのモー
ターと、前記回転板上に移動可能に設けられ、前記回転
板の回転を制御するストッパーと、前記回転板上に設け
られ前記パネルの電極とTCPとを圧接するための圧接
ヘッドとを含むことを特徴とするものである。第2の発
明のテープ圧接装置は、請求項1記載のテープ圧接装置
を用い、回転板の表面を受台の突出部でこすって清掃し
たのち、回転板上にパネルを載せて位置合わせしパネル
の電極とTCPとを熱圧着することを特徴とするもので
ある。According to a first aspect of the present invention, there is provided a tape pressing apparatus having a rectangular surface having a protruding portion in which a longitudinal portion of the rectangular surface protrudes to one side, and having a reverse L-shaped cross section. And a rectangular surface which is provided on the support and extends from the protruding portion and is rotatable around a portion of one side in the longitudinal direction which extends. A rotating plate having: a motor for rotating the rotating plate; a stopper movably provided on the rotating plate to control rotation of the rotating plate; and an electrode of the panel provided on the rotating plate. And a press-contact head for press-contacting the TCP and the TCP. A tape pressing device according to a second aspect of the present invention uses the tape pressing device according to claim 1 to clean the surface of the rotary plate by rubbing the surface of the rotary plate with a protruding portion of the receiving table, and then place the panel on the rotary plate to position the panel. And the TCP are thermocompression-bonded.
【0011】[0011]
【発明の実施の形態】次に本発明について図面を参照し
て説明する。図1及び図2は本発明の実施の形態を説明
する為のテープ圧接装置の正面図及び側面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 and FIG. 2 are a front view and a side view of a tape pressing apparatus for explaining an embodiment of the present invention.
【0012】図1及び図2を参照すると本発明のテープ
圧接装置は、矩形状の表面の長手方向の部分が一方に突
出した突出部5Aを有し、断面形状が逆L字形に形成さ
れ、上下方向に可動に構成されたパネル7の受台5と、
この受台5上で突出部5Aより延在して設けられ延在す
る長手方向の一辺の部分を軸として回転可能に設けられ
た矩形状の表面を有する回転板10と、この回転板10
を回転させるためのモーター11と、回転板10上に移
動可能に設けられ、回転板10の回転を制御するストッ
パー9と、回転板10上に設けられパネル7の電極とT
CP4とを圧接するための圧接ヘッド1とから主に構成
されている。Referring to FIG. 1 and FIG. 2, the tape pressing apparatus of the present invention has a protruding portion 5A in which a longitudinal portion of a rectangular surface protrudes to one side, and has a reverse L-shaped cross section. A pedestal 5 of a panel 7 configured to be movable in the vertical direction;
A rotating plate 10 having a rectangular surface provided on the cradle 5 and extending from the protruding portion 5A so as to be rotatable around a portion of one side in the longitudinal direction, and the rotating plate 10
, A stopper 9 movably provided on the rotating plate 10 for controlling rotation of the rotating plate 10, an electrode of the panel 7 provided on the rotating plate 10, and T
It mainly comprises a pressure contact head 1 for pressure contact with the CP 4.
【0013】そして回転板10は受台5の表面より大き
く形成されている。また受台5の突出部5Aは他の部分
の厚さより薄く形成され、回転板10の表面に接する突
出部5Aの側面は他の部分より粗く形成されている。回
転板10及び受台5はステンレスから形成され、回転板
10及び受台5の突出部5Aの厚さは約1mmである。な
お図1、図2において、2はクッション材、3はAC
F、4はTCP、8は受皿、S1〜S3はセンサーであ
る。The rotating plate 10 is formed larger than the surface of the receiving table 5. The protruding portion 5A of the pedestal 5 is formed to be thinner than other portions, and the side surface of the protruding portion 5A in contact with the surface of the rotating plate 10 is formed to be coarser than other portions. The rotating plate 10 and the pedestal 5 are formed of stainless steel, and the thickness of the protrusion 5A of the rotating plate 10 and the pedestal 5 is about 1 mm. 1 and 2, 2 is a cushion material, 3 is AC
F, 4 are TCPs, 8 is a saucer, and S1 to S3 are sensors.
【0014】次にこのように構成されたテープ圧接装置
を用いパネル7上にTCPを圧接する方法について図1
及び図2を用いて説明する。なお図2においては一方の
モーター11を略してある。Next, a method of pressing the TCP on the panel 7 by using the tape pressing apparatus having the above-mentioned structure will be described with reference to FIG.
This will be described with reference to FIG. In FIG. 2, one motor 11 is omitted.
【0015】まず図1及び図2(a)に示すように、A
CF3を介して位置合わせされたTCP4を有するパネ
ル7を圧接ヘッド1の下降位置まで移動させ、ヒーター
により加熱された受台5により回転板10を介してパネ
ル7の端部を支持させる。First, as shown in FIG. 1 and FIG.
The panel 7 having the TCP 4 aligned via the CF 3 is moved to the lowering position of the press contact head 1, and the end of the panel 7 is supported via the rotating plate 10 by the receiving table 5 heated by the heater.
【0016】次に圧接ヘッド1を下降させクッション材
2を介してTCP4をパネル7に圧接させたのち、図2
(b)に示すように圧接ヘッド1を上昇させる。次いで
搬送アームによりパネル7を移動させる。Next, after the pressure contact head 1 is lowered and the TCP 4 is pressed against the panel 7 via the cushion material 2, FIG.
The press contact head 1 is raised as shown in FIG. Next, the panel 7 is moved by the transfer arm.
【0017】パネル7がある位置まで移動したことを第
1センサーS1で感知すると、ストッパー9が水平方向
に移動して外ずれ、図2(c)に示すように回転板10
が長手方向の一辺を軸とし、モーター11を軸に270
度程度回転して受台5の突出部5Aに接触する。接触時
の衝撃により回転板10上に存在した粘着性のないガラ
ス屑やTCPの切断屑等は、受皿8内に落とされる。When the first sensor S1 detects that the panel 7 has moved to a certain position, the stopper 9 moves in the horizontal direction and shifts outside, and as shown in FIG.
Are 270 on one side in the longitudinal direction and 270 on the motor 11 as an axis.
It rotates about a degree and contacts the protruding portion 5A of the receiving table 5. Non-adhesive glass chips, TCP cutting chips, and the like existing on the rotating plate 10 due to the impact at the time of contact are dropped into the tray 8.
【0018】回転板10が受台5の突出部5Aに接触し
たことを第2センサーS2が感知すると受台5は図2
(d)に示すように、下側に移動する。回転板10の表
面と接触する突出部5Aの側面は、異物粒子をそぎ落と
すため粗く形成されている。この工程で除去される異物
粒子は主にACFや樹脂屑等の粘着性物質である。When the second sensor S2 detects that the rotating plate 10 has come into contact with the protrusion 5A of the pedestal 5, the pedestal 5 is moved to the position shown in FIG.
As shown in (d), it moves downward. The side surface of the protruding portion 5A that comes into contact with the surface of the rotating plate 10 is formed roughly to remove foreign particles. The foreign particles removed in this step are mainly sticky substances such as ACF and resin dust.
【0019】受台5が下降最下点の中間まできたことを
第3センサーS3が感知するとストッパー9が元の位置
に戻る。ストッパー9は、移動後すぐに戻るようにして
もよい。回転板10の動きを止めていた受台5が最下点
まで下がると回転板10がフリーになり、ストッパー9
に接触し、受台5が上昇する。次いで図2(a)に示し
たように、TCP4が位置合わせされた次のパネル7が
再び回転板10上に搬送され、圧接ヘッド1による圧接
操作が繰り返される。When the third sensor S3 detects that the cradle 5 has reached the middle of the lowermost point, the stopper 9 returns to the original position. The stopper 9 may return immediately after the movement. When the cradle 5 which has stopped the movement of the rotating plate 10 is lowered to the lowest point, the rotating plate 10 becomes free and the stopper 9
, And the pedestal 5 rises. Next, as shown in FIG. 2A, the next panel 7 on which the TCP 4 has been aligned is again conveyed onto the rotating plate 10, and the pressing operation by the pressing head 1 is repeated.
【0020】以上の動作により回転板10上の異物粒子
は、回転板10が受台5の突出部5Aと接触した時の衝
撃及び受台5が下降する時の回転板10上のブラッシン
グ効果により確実に除去できる。尚、上記実施の形態で
は、モーター11を回転板10の両側に設けた場合につ
いて説明したが、片側だけに設けてもよい。また、回転
板10の軸となる部分を突出させ、モーター11の回転
軸と結合できるようにしてもよい。With the above operation, the foreign particles on the rotating plate 10 are subjected to the impact when the rotating plate 10 comes into contact with the protrusion 5A of the receiving table 5 and the brushing effect on the rotating plate 10 when the receiving table 5 descends. Can be removed reliably. In the above-described embodiment, the case where the motors 11 are provided on both sides of the rotating plate 10 has been described, but they may be provided on only one side. Further, a portion serving as an axis of the rotating plate 10 may be protruded so as to be connectable to the rotating shaft of the motor 11.
【0021】[0021]
【発明の効果】以上説明したように本発明は、受台上に
回転板を設け、パネルにTCPを圧接したのち、回転板
を回転させて受台の突出部に衝突させ、次いで受台を下
降させて回転板の表面をブラッシングすることにより、
回転板表面の異物粒子を確実に除去できるためパネルと
TCPの接触不良を低減させる事ができるという効果が
ある。As described above, according to the present invention, a rotary plate is provided on a pedestal, a TCP is pressed against a panel, and then the rotary plate is rotated to collide with a projection of the pedestal. By lowering and brushing the surface of the rotating plate,
Since foreign particles on the surface of the rotating plate can be reliably removed, poor contact between the panel and the TCP can be reduced.
【図1】本発明の実施の形態を説明するためのテープ圧
接装置の正面図。FIG. 1 is a front view of a tape pressing device for describing an embodiment of the present invention.
【図2】本発明の実施の形態を説明するためのテープ圧
接装置の側面図。FIG. 2 is a side view of the tape pressing device for explaining the embodiment of the present invention.
【図3】従来のテープ圧接方法を説明するためのテープ
圧接装置の側面図。FIG. 3 is a side view of a tape pressing device for explaining a conventional tape pressing method.
1 圧接ヘッド 2 クッション材 3 ACF 4 TCP 5 受台 5A 突出部 6 ステージ 7 パネル 8 受皿 9 ストッパー 10 回転板 11 モーター DESCRIPTION OF SYMBOLS 1 Pressing head 2 Cushion material 3 ACF 4 TCP 5 Receiving stand 5A Projection 6 Stage 7 Panel 8 Receiving tray 9 Stopper 10 Rotating plate 11 Motor
Claims (6)
突出した突出部を有し、断面形状が逆L字形に形成さ
れ、上下方向に可動に構成されたパネルの受台と、この
受台上で前記突出部より延在して設けられ延在する長手
方向の一辺の部分を軸として回転可能に設けられた矩形
状の表面を有する回転板と、この回転板を回転させるた
めのモーターと、前記回転板上に移動可能に設けられ、
前記回転板の回転を制御するストッパーと、前記回転板
上に設けられ前記パネルの電極とTCPとを圧接するた
めの圧接ヘッドとを含むことを特徴とするテープ圧接装
置。1. A panel receiving pedestal having a rectangular surface having a projecting portion protruding to one side and having an inverted L-shaped cross-section and movable vertically. A rotating plate having a rectangular surface provided on the receiving table and extending from the protruding portion and provided rotatably around a portion of one side in the longitudinal direction extending therethrough; and a rotating plate for rotating the rotating plate. A motor, movably provided on the rotating plate,
A tape pressing device, comprising: a stopper for controlling rotation of the rotary plate; and a pressing head provided on the rotary plate for pressing an electrode of the panel against TCP.
形成されている請求項1記載のテープ圧接装置。2. The tape pressing apparatus according to claim 1, wherein the rotating plate is formed larger than a surface of the receiving table.
受台の突出部の側面は、他の部分より粗らく形成されて
いる請求項1または請求項2記載のテープ圧接装置。3. The tape pressure welding device according to claim 1, wherein a side surface of the projecting portion of the receiving table that is in contact with the surface of the rotating rotating plate is formed to be coarser than other portions.
が設けられている請求項1〜3のいづれか記載のテープ
圧接装置。4. The tape pressure welding device according to claim 1, wherein a dust tray is provided below the projecting portion of the tray.
さより薄く形成されている請求項1〜4のいづれか記載
のテープ圧接装置。5. The tape pressure welding apparatus according to claim 1, wherein the thickness of the projecting portion of the receiving table is smaller than the thickness of the other portion.
回転板の表面を受台の突出部でこすって清掃したのち、
回転板上にパネルを載せて位置合わせしパネルの電極と
TCPとを熱圧着することを特徴とするテープ圧接方
法。6. A tape pressing device according to claim 1,
After cleaning the surface of the rotating plate by rubbing it with the protrusion of the cradle,
A tape pressing method comprising placing a panel on a rotating plate, positioning the panel, and thermocompression bonding an electrode of the panel and TCP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013426A JP3347117B2 (en) | 2000-01-21 | 2000-01-21 | Tape pressure welding device and tape pressure welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000013426A JP3347117B2 (en) | 2000-01-21 | 2000-01-21 | Tape pressure welding device and tape pressure welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001203240A JP2001203240A (en) | 2001-07-27 |
| JP3347117B2 true JP3347117B2 (en) | 2002-11-20 |
Family
ID=18541016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000013426A Expired - Fee Related JP3347117B2 (en) | 2000-01-21 | 2000-01-21 | Tape pressure welding device and tape pressure welding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3347117B2 (en) |
-
2000
- 2000-01-21 JP JP2000013426A patent/JP3347117B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001203240A (en) | 2001-07-27 |
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