JP3347403B2 - Current collecting electrode and electrode forming method - Google Patents
Current collecting electrode and electrode forming methodInfo
- Publication number
- JP3347403B2 JP3347403B2 JP15511393A JP15511393A JP3347403B2 JP 3347403 B2 JP3347403 B2 JP 3347403B2 JP 15511393 A JP15511393 A JP 15511393A JP 15511393 A JP15511393 A JP 15511393A JP 3347403 B2 JP3347403 B2 JP 3347403B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electrode
- forming
- current collecting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Liquid Crystal (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、集電電極及び電極形成
法に係わり、特に太陽電池や液晶パネル面等の透明電極
上に形成される低抵抗で微細な集電電極及びその形成方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a current collecting electrode and an electrode forming method, and more particularly to a low-resistance and fine current collecting electrode formed on a transparent electrode such as a solar cell or a liquid crystal panel surface, and a method of forming the same. .
【０００２】[0002]
【従来の技術】太陽電池では、発生した電荷を効率的に
集めるために、透明電極上に低抵抗の集電電極が形成さ
れる。集電電極には、集電ロスと共にシャドウロスを低
減するために低抵抗且つ細線形状であることが求められ
る。低抵抗化のためにハンダ材料が電極材料として良く
用いられている。2. Description of the Related Art In a solar cell, a current collecting electrode having a low resistance is formed on a transparent electrode in order to efficiently collect generated charges. The current collecting electrode is required to have a low resistance and a fine wire shape in order to reduce the shadow loss together with the current collecting loss. A solder material is often used as an electrode material to reduce the resistance.
【０００３】従来太陽電池等の透明電極上に集電電極を
形成する方法として、導電ペースト、蒸着あるいは電着
法を用いて所望の形状を形成し、次に該導電層の上に低
抵抗化のためにハンダを用いて電極を形成する方法が、
経済性、信頼性の上から既に検討されている。Conventionally, as a method of forming a current collecting electrode on a transparent electrode of a solar cell or the like, a desired shape is formed by using a conductive paste, vapor deposition or electrodeposition, and then a low resistance is formed on the conductive layer. The method of forming electrodes using solder for
It has already been studied from the viewpoint of economy and reliability.
【０００４】更なる低抵抗化のために、ハンダ電極は出
来るだけ厚く形成するのが望ましいが、ハンダ材料を厚
く形成するとハンダの溶融硬化時にハンダの一部が滞留
集合して所々にハンダのカタマリが発生していまう。[0004] In order to further reduce the resistance, it is desirable to form the solder electrode as thick as possible. However, if the solder material is formed thickly, a part of the solder stays and collects at the time of melting and hardening of the solder, so that the solder is sometimes broken up. Is occurring.
【０００５】このハンダのカタマリは、保護コートへの
突出、剥離の原因となり、結果的に保護コートの厚膜化
を招いてしまうので、コストが高くなってしまうという
問題が生じる。[0005] The dislocation of the solder causes the protection coat to protrude and peel off, resulting in an increase in the thickness of the protection coat, resulting in an increase in cost.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、集電電極の
ハンダ層形成時に発生するカタマリを抑制し、均一な高
さの低抵抗集電電極及びその電極形成法を提供すること
を目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a low-resistance current collecting electrode having a uniform height, which suppresses the formation of a solder layer when a solder layer is formed on the current collecting electrode, and a method of forming the electrode. I do.
【０００７】[0007]
【課題を解決するための手段】本発明の電極形成法は、
透明電極上に集電電極を形成する電極の形成法におい
て、該透明電極上にハンダ材料に対して濡れ性を有する
導電層を細線形状に形成した後、該導電層を覆うように
該ハンダ材料を形成し、続いて該ハンダ材料の上面部に
ハンダ溶融温度において平面性を有する部材を載置した
状態で、該ハンダ材料を溶融・凝固させて平坦な面を有
するハンダ層を形成することを特徴とする。 According to the present invention, there is provided an electrode forming method comprising:
The method of forming the current collector electrode on the transparent electrode
Has a wettability to the solder material on the transparent electrode
After forming the conductive layer in a thin line shape, cover the conductive layer
Forming the solder material, and then on the top surface of the solder material
A member with flatness at the solder melting temperature was placed
In this state, the solder material is melted and solidified to have a flat surface.
Forming a solder layer.
【０００８】本発明の集電電極は、前記平面性を有する
部材の少なくとも２ケ所にハンダ層厚を規制するための
高さ規制板を設置することが望ましい。 また、本発明の
電極形成方法の前記ハンダ材料はクリームハンダである
ことが望ましい。 [0008] The current collecting electrode of the present invention has the flatness.
For regulating the solder layer thickness in at least two places of the member
It is desirable to install a height regulating plate. In addition, the present invention
The solder material of the electrode forming method is cream solder
It is desirable.
【０００９】[0009]
【作用】本発明によれば、透明電極上にハンダと濡れ性
のある導電層を下地層として形成し、次いで比抵抗の小
さいハンダを導電層の上に形成する。次に、ハンダ上面
に平面を有する部材を該ハンダに押し当てながら加熱
し、ハンダを溶融凝固する。このようにして、厚膜で且
つ上面部に平坦な面を持つハンダ層を形成することがで
きる。その結果、保護コートへの突出、剥離等のない電
極を形成することが可能となり、低コスト、高信頼性の
電極を提供することができる。According to the present invention, a conductive layer having wettability with solder is formed as an underlayer on a transparent electrode, and then solder having a low specific resistance is formed on the conductive layer. Next, a member having a flat surface on the solder is heated while being pressed against the solder, and the solder is melted and solidified. In this manner, a thick solder layer having a flat surface on the upper surface can be formed. As a result, it is possible to form an electrode without protruding or peeling off from the protective coat, and it is possible to provide a low-cost and highly reliable electrode.
【００１０】本発明において、透明電極上に形成される
下地導電層としては、金、銀、銅、ニッケル等の金属や
その合金層が用いられ、蒸着法、メッキ法、印刷法等に
より所望の形状に形成される。特に、導電ペーストを用
いたスクリーン印刷法が経済的に好ましく、好適に用い
られる。In the present invention, as the underlying conductive layer formed on the transparent electrode, a metal such as gold, silver, copper, nickel or an alloy layer thereof is used, and the desired conductive layer is formed by vapor deposition, plating, printing or the like. It is formed into a shape. In particular, a screen printing method using a conductive paste is economically preferable and is preferably used.
【００１１】ハンダ材料は、より低抵抗化のために、よ
り厚く形成することが望ましくその厚膜化方法には、ク
リーム状ハンダ材料での印刷法や、ハンダメッキ方式に
よる電解ハンダでの方法等があり、ハンダの厚膜化に対
しては、クリームハンダ材料を用いた印刷法が特に有効
である。ハンダ材料としては、例えばＳｎ−Ｐｂ系、Ｓ
ｎ基系やＩｎ基系およびＰｂ基系等のハンダが好適に用
いられる。ハンダ層の加熱条件は、ハンダの融点以上、
例えば２００℃〜２３０℃である。The solder material is desirably formed to be thicker in order to further reduce the resistance. The method for increasing the film thickness includes a printing method using a creamy solder material, a method using electrolytic soldering by a solder plating method, and the like. In order to increase the thickness of the solder, a printing method using a cream solder material is particularly effective. Examples of the solder material include Sn-Pb, S
An n-based, In-based, or Pb-based solder is preferably used. The heating conditions of the solder layer are above the melting point of the solder,
For example, it is 200 ° C to 230 ° C.
【００１２】本発明において、ハンダ電極の溶融凝固時
のハンダのカタマリによる突出を防止し、かつハンダ電
極上部に平担な面を形成するための部材は、ハンダ溶融
時に平面性を保持していること、更にハンダが付着しな
い様な濡れ性の悪い性質の物であり、例えば、金属板
（Ａｌ、Ｔｉ等金属又はその合金）、ガラス板、セラミ
ック、耐熱性高分子等の耐熱性部材が用いられる。In the present invention, the member for preventing the solder electrode from projecting due to the dissolution during the solidification of the solder electrode and forming a flat surface on the upper portion of the solder electrode maintains the flatness when the solder is melted. In addition, it is a material having poor wettability such that solder does not adhere. For example, a heat-resistant member such as a metal plate (a metal such as Al or Ti or an alloy thereof), a glass plate, a ceramic, or a heat-resistant polymer is used. Can be
【００１３】更に前記部材と基板との間に高さ規制板を
数カ所に設置して、ハンダ材料を融解凝固することによ
り、前記平面を有する部材と基板との平行度が容易に保
持されるため、全ての集電電極においてハンダが均一な
高さ・幅で溶融凝固することが可能となる。該高さ規制
板には前記耐熱性部材のいずれが使用可能である。[0013] Further, by installing a height regulating plate between the member and the substrate in several places and melting and solidifying the solder material, the parallelism between the member having the flat surface and the substrate can be easily maintained. In addition, the solder can be melt-solidified at a uniform height and width in all the current collecting electrodes. Any of the heat-resistant members can be used for the height regulating plate.
【００１４】[0014]
【実施例】以下に実施例を挙げて本発明をより詳細に説
明するが、本発明がこれら実施例に限定されないことは
言うまでもない。The present invention will be described in more detail with reference to the following examples, but it goes without saying that the present invention is not limited to these examples.
【００１５】（実施例１）本発明の第１の実施例を図１
を参照して説明する。(Embodiment 1) FIG. 1 shows a first embodiment of the present invention.
This will be described with reference to FIG.
【００１６】導電性基板（ステンレス製）６上に、公知
の方法で光電変換層５及び透明電極ＩＴＯ（ＳnＯ2−Ｉ
n2Ｏ3）４を形成した。次いで、透明電極４上にスクリ
ーン印刷法にて、銅ペースト（奥野製薬社製ＤＳー４１
６０）を、厚さ３０μｍ、線巾２００μｍに印刷し、１
８０℃の乾燥オーブン中で３０分硬化して下地導電層１
を形成した。The conductive substrate on (stainless steel) 6, the photoelectric conversion layer 5 and the transparent electrode ITO in a known manner (S n O 2 -I
n2 O 3) 4 was formed. Next, a copper paste (DS-41 manufactured by Okuno Pharmaceutical Co., Ltd.) was applied on the transparent electrode 4 by screen printing.
60) is printed to a thickness of 30 μm and a line width of 200 μm.
Cured for 30 minutes in a drying oven at 80 ° C.
Was formed.
【００１７】続いて、クリームハンダ（ＮＩＨＯＮ Ｈ
ＡＮＤＡ社製Ｒｘ−３６２）をスクリーン印刷法を用い
て、前記下地導電層上に線巾４００μｍ、厚さ５０μｍ
に印刷した。厚さ２ｍｍのガラス板からなる平面を有す
る部材２をクリームハンダ上に置いた状態で、２４０℃
の乾燥オーブンに入れ溶融した後、室温に戻し凝固させ
てハンダ層３を形成した。Subsequently, cream solder (NIHON H
Andrx Rx-362) was screen-printed on the underlying conductive layer using a screen printing method to obtain a line width of 400 μm and a thickness of 50 μm.
Printed on. A member 2 having a flat surface made of a glass plate having a thickness of 2 mm is placed on a cream solder at 240 ° C.
After melting in a drying oven, the mixture was returned to room temperature and solidified to form a solder layer 3.
【００１８】このようにして、ハンダの凝集による突出
がなく、上面部が平担な面を有するハンダ層が得られ
た。In this way, a solder layer having no flattened surface with no protrusion due to solder aggregation was obtained.
【００１９】しかし、前記平面性を有する部材と基板と
を平行に保持するのはかなりの熟練を要し、慣れないと
各集電電極間で図２に示す様にハンダの高さ、幅方向に
差が発生する場合がある。例えば極端な場合、高さ方向
では５０μｍ〜２０μｍ、幅方向で２００μｍ〜３００
μｍの差が生じる時がある。特に幅方向に関しては、シ
ャドウロスの原因となり、太陽電池の場合変換効率が低
下してしまう。例えば２００μｍの線幅のものが、３０
０μｍ程度に拡ってしまうと全体で１０％程度の効率が
低下する。However, it takes considerable skill to hold the above-mentioned planar member and the substrate in parallel, and if not used, the height and width of the solder between the current collecting electrodes as shown in FIG. In some cases. For example, in an extreme case, 50 μm to 20 μm in the height direction and 200 μm to 300 μm in the width direction.
There may be a difference of μm. Particularly in the width direction, it causes shadow loss, and in the case of a solar cell, the conversion efficiency is reduced. For example, a line having a line width of 200 μm
If the width is increased to about 0 μm, the efficiency is reduced by about 10% as a whole.
【００２０】上述の平坦な面を有するハンダ層を形成す
る際に、熟練を要せず、容易に均一な高さ・幅の集電電
極を形成する方法を第２の実施例で示す。A method of easily forming a current collecting electrode having a uniform height and width without requiring skill in forming the above-mentioned solder layer having a flat surface will be described in a second embodiment.
【００２１】（実施例２）本発明の第２の実施例を図３
を参照して説明する。(Embodiment 2) FIG. 3 shows a second embodiment of the present invention.
This will be described with reference to FIG.
【００２２】実施例１と同様にして、導電性基板６上
に、光電変換層５及び透明電極ＩＴＯ４、下地導電層１
を形成した。次いて、クリームハンダ（ＮＩＨＯＮ Ｈ
ＡＮＤＡ社製Ｒｘ−３６２）をスクリーン印刷法を用い
て、下地導電層１上に線巾４００μｍ、厚さ７０μｍに
印刷した。In the same manner as in Example 1, a photoelectric conversion layer 5, a transparent electrode ITO4,
Was formed. Next, cream solder (NIHON H
Rx-362 manufactured by Anda Co.) was printed on the underlying conductive layer 1 to have a line width of 400 μm and a thickness of 70 μm using a screen printing method.
【００２３】続いて、厚さ約１００μｍのポリイミド製
高さ規制板を設けた、厚さ１ｍｍの平面を有するステン
レス部材２を、クリームハンダ上に置き、２４０℃の乾
燥オーブンに入れ溶融した後、室温に戻し凝固させてハ
ンダ層３を形成した。なお、本実施例ではステンレス板
を用いたが、ステンレス板はガラス板に比べ熱容量が小
さいため、ハンダ溶融の際昇温が速く、ハンダの酸化が
生じ難いという利点を有している。Subsequently, a stainless member 2 having a flat surface of 1 mm in thickness provided with a polyimide height regulating plate of about 100 μm in thickness is placed on a cream solder, put into a drying oven at 240 ° C. and melted. It returned to room temperature and was solidified to form a solder layer 3. In this embodiment, a stainless steel plate is used. However, since the stainless steel plate has a smaller heat capacity than a glass plate, there is an advantage that the temperature rises quickly when the solder is melted and the solder is hardly oxidized.
【００２４】このようにして、幅２００μｍ、厚さ１０
０μｍであり、上部に平坦な面を持つ集電電極を均一な
高さ・幅に、しかも容易に得ることができた。Thus, the width of 200 μm and the thickness of 10
A current collecting electrode having a flat surface on the top having a thickness of 0 μm could be easily obtained with a uniform height and width.
【００２５】[0025]
【発明の効果】以上説明した様に、本発明により、透明
電極上に金属ハンダ材料を用いて上面部が平担な面を持
ち、均一の厚みの集電電極を提供することが可能とな
る。その結果、保護コートへの突出、剥離の問題を解消
し、太陽電池の低コスト化、信頼性向上を図ることが可
能となる。As described above, according to the present invention, it is possible to provide a current collecting electrode having a uniform thickness with a flat upper surface using a metal solder material on a transparent electrode. . As a result, it is possible to solve the problem of protrusion and peeling of the protective coat, and to reduce the cost and improve the reliability of the solar cell.
【図１】本発明の実施例１を説明する概念図である。FIG. 1 is a conceptual diagram illustrating a first embodiment of the present invention.
【図２】ハンダ層の厚み、線幅がばらつく例を示した概
念図である。FIG. 2 is a conceptual diagram showing an example in which the thickness and line width of a solder layer vary.
【図３】本発明の実施例２を説明する概念図である。FIG. 3 is a conceptual diagram illustrating a second embodiment of the present invention.
１ 銅パターン、 ２ 平面性を有したガラスまたはステンレス部材、 ３ ハンダ層、 ４ 透明電極、 ５ 光電変換層、 ６ 基板、 ７ 高さ規制板。 1 Copper pattern, 2 Flat glass or stainless steel member, 3 Solder layer, 4 Transparent electrode, 5 Photoelectric conversion layer, 6 Substrate, 7 Height regulating plate.
フロントページの続き (56)参考文献 特開 平４−296723（ＪＰ，Ａ) 特開 平５−74778（ＪＰ，Ａ) 特開 平２−150031（ＪＰ，Ａ) 特開 平４−82226（ＪＰ，Ａ) 特開 平５−283414（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 H01L 21/92 G02F 1/1343 H01L 29/40 Continuation of the front page (56) References JP-A-4-296723 (JP, A) JP-A-5-74778 (JP, A) JP-A-2-150031 (JP, A) JP-A-4-82226 (JP) (A) JP-A-5-283414 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 21/60 H01L 21/92 G02F 1/1343 H01L 29/40
Claims (3)
形成法において、該透明電極上にハンダ材料に対して濡
れ性を有する導電層を細線形状に形成した後、該導電層
を覆うように該ハンダ材料を形成し、続いて該ハンダ材
料の上面部にハンダ溶融温度において平面性を有する部
材を載置した状態で、該ハンダ材料を溶融・凝固させて
平坦な面を有するハンダ層を形成することを特徴とする
電極形成法。 1. An electrode for forming a current collecting electrode on a transparent electrode.
In the forming method, a solder material is wet on the transparent electrode.
After forming a conductive layer having resiliency into a fine line shape, the conductive layer
Forming the solder material so as to cover the
On the top surface of the material that has flatness at the solder melting temperature
With the material placed, melt and solidify the solder material
Characterized by forming a solder layer having a flat surface
Electrode formation method.
ケ所にハンダ層厚を規制するための高さ規制板を設置す
ることを特徴とする請求項１に記載の電極形成法。 2. The apparatus according to claim 1, wherein at least two of said flat members are provided.
A height regulating plate to regulate the solder layer thickness
The method for forming an electrode according to claim 1, wherein:
ことを特徴とする請求項１または２に記載の電極形成方
法。 3. The solder material is cream solder.
The electrode forming method according to claim 1 or 2, wherein
Law.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511393A JP3347403B2 (en) | 1993-06-25 | 1993-06-25 | Current collecting electrode and electrode forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15511393A JP3347403B2 (en) | 1993-06-25 | 1993-06-25 | Current collecting electrode and electrode forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0729937A JPH0729937A (en) | 1995-01-31 |
| JP3347403B2 true JP3347403B2 (en) | 2002-11-20 |
Family
ID=15598877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15511393A Expired - Fee Related JP3347403B2 (en) | 1993-06-25 | 1993-06-25 | Current collecting electrode and electrode forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3347403B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2794731B2 (en) * | 1988-11-30 | 1998-09-10 | 富士通株式会社 | Solder bump formation method |
| JP2822630B2 (en) * | 1990-07-24 | 1998-11-11 | 松下電器産業株式会社 | Method of forming bump electrode on semiconductor device |
| JPH0574778A (en) * | 1991-03-06 | 1993-03-26 | Nau Chem:Yugen | Bump and forming method of thereof |
| JPH04296723A (en) * | 1991-03-26 | 1992-10-21 | Toshiba Corp | Manufacture of semiconductor device |
| JPH05283414A (en) * | 1991-04-16 | 1993-10-29 | Nippon Steel Corp | Bump height control device for metal wiring for semiconductor devices |
-
1993
- 1993-06-25 JP JP15511393A patent/JP3347403B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0729937A (en) | 1995-01-31 |
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