JP3348375B2 - Multi-stage partition wall forming method for discharge display panel - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a discharge type display device, a so-called plasma display panel, hereinafter referred to as a PDP.
In the method of forming barrier ribs.

[0002]

2. Description of the Related Art Partition walls of a PDP not only have a role of separating discharge for each pixel, but also are important parts that influence the luminance characteristics of a panel in order to apply a phosphor to the wall surface to emit light. . Therefore, the shape of this partition wall should be as narrow as possible, but the partition wall height should be about 10
0 μm must be secured. By the way, normal PD
The pixel pitch of P is about 150 to 250 μm, but according to the conventional partition wall forming method shown in FIG.
0 μm was the limit. Therefore, the pixel pitch is 15
In the case of a panel having a thickness of 0 μm, the width of the groove between the partitions when the partition width is 80 μm is only about 70 μm, and a sufficient phosphor-coated surface and a discharge space cannot be secured.

[0003] The conventional partition wall forming method shown in FIG. 3 will be described.
FIG. 3 is a cross-sectional view showing a part of a pixel portion in a process of forming a back plate of a PDP. Steps not directly related to the present invention, such as the back electrode 3 and its coating layer 4
The description of the forming process will be simply described. First, on a back glass substrate 5, a back electrode 3 made of a material such as silver or nickel and a glass layer 4 covering the back electrode 3 are formed by firing. Thereafter, a low-melting glass layer 6 serving as a partition material is formed thereon.
Is formed to a thickness of about 120 to 150 μm by thick film printing or blade coating and dried. Then, as shown in step A of FIG. 3, a photosensitive film 7, for example, a photoresist or a photosensitive film, is adhered to the upper surface of the partition wall material 6, and a partition wall pattern is formed by a photographic method. The coating film exposed and developed in the form of a partition pattern is removed by using a release material except for the portion left as a partition.

Thereafter, as in step B, the partition wall material 6 other than the coating remaining on the partition wall pattern by the sand blasting step 6
Is cut off in a partition pattern. When the chemical etching method is used, the partition wall material 6 is melted with a chemical such as hydrofluoric acid. Although there is a slight difference in the photosensitive coating material between sandblasting and chemical etching, the pattern forming process is the same. Then, as in Step C, the partition wall material 6 is shaved until the predetermined depth, that is, the partition height reaches a predetermined height, for example, about 150 μm, and then the pattern coating is removed.
Finally, when the back glass is fired, the height of the partition wall 1 is reduced to about 100 to 120 μm due to slight shrinkage, but is completed as in step D. The coating can be burned off at the same time as the partition wall firing in the last firing step.

[0005]

The partition wall 1 formed as described above must have a width as small as possible, particularly at the top, and a height of about 100 μm. In a high-resolution PDP for a high-definition TV or the like, formation of the partition walls is regarded as one of extremely difficult steps. Because, in the chemical etching step, it is difficult to increase the etching depth only in the height direction of the partition walls, and the peeling of the coating and the like easily occur with the process time. Further, in the sandblasting method, heat is generated during the process, so that the coating is peeled off. These problems become more conspicuous as the partition width decreases. Therefore, the limit of the partition wall width in the conventional partition wall forming method is about 60 μm, and usually is limited to about 80 to 100 μm.

[0006]

SUMMARY OF THE INVENTION In view of the above problems, the present invention aims to realize a partition forming method which can cope with a higher resolution of a PDP in the future. However, a partition having a sufficiently small width is formed. Thereafter, a material such as a resin agent that is resistant to sand blasting is formed again on the upper and side surfaces of the partition wall by a method such as screen printing. Thereafter, sandblasting is performed again to form a partition wall having a desired height.

[0007]

First Embodiment FIGS. 1 and 2 are cross-sectional views of a back glass substrate 5 and members formed thereon for explaining the steps of the present invention. In the process of the present invention, the partition material 6 is formed to a thickness of about 150 μm, and a photosensitive film 7 is further deposited thereon to form a pattern by a photographic method. , B, C and D,
This is a step of engraving the partition wall material 6 by a chemical etching method or a sand blasting method, but not by engraving the partition material 6 to the end, that is, to the upper surface of the electrode coating layer 4 which is already there, as shown in FIG. Stop at the depth of.

Next, here, the coating of the above pattern is entirely removed with a release agent or the like. Thereafter, as shown in step E of FIG. 2, a protective resin 9 such as a resin is applied again to the upper and side surfaces of the partition walls already formed at a height of about 20 to 30 μm. For this formation, for example, a thick film screen printing method is suitable. Further, the material of the protective resin 9 does not necessarily need to be photosensitive, and may be a resin material that is resistant to sandblasting and that can be peeled off with an appropriate chemical or has the property of leaving no residue after firing.

After the protective resin 9 is applied, it is dried and, as shown in step F of FIG. 2, the partition wall 6 is deeply carved again by sandblasting to obtain the partition 1 having a desired height. Thereafter, the protective resin 9 is removed by a method such as using a release agent as in the step G, followed by baking to complete the partition 1.
It is also possible to burn off the protective resin 9 simultaneously with the baking of the partition wall 1.

[0010]

According to the above-described partition wall forming method of the present invention, the first partition wall formed in the same manner as the conventional method is a thin pattern having a width of, for example, about 20 to 30 μm, but a low height, for example, about 20 μm. Since the thickness is suppressed to 30 μm, the photosensitive film can be easily formed without peeling. Further, since the protective resin 9 to be subsequently applied to the partition walls is applied to the upper surface and the side surfaces of the partition walls differently from the previous photosensitive film 7, the strength is greatly improved. Since it withstands, it becomes easy to form the partition up to a predetermined height. By using the thus formed narrow and sufficiently high partition walls 1 for the PDP, the discharge characteristics can be improved by providing a sufficiently large discharge space, and further, the luminance can be improved by enlarging the phosphor application area. Contribute to improvement.

[Brief description of the drawings]

FIG. 1 is a process explanatory view of a first embodiment of the present invention (1).

FIG. 2 is a process explanatory view (2) of the first embodiment of the present invention.

FIG. 3 is an explanatory view of a conventional partition wall forming step.

FIG. 4 is an exploded perspective view of a rear substrate of a general PDP.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Partition wall 2 Phosphor 3 Back side electrode 4 Electrode coating layer 5 Back glass substrate 6 Partition material 7 Photosensitive film 8 Protective resin AG process

Claims (1)

(57) [Claims] 2. Description of the Related Art In a discharge display panel, that is, a plasma display panel, as a method of forming a partition between a front glass and a rear glass for separating each pixel, a photosensitive coating is first formed on an upper surface of a partition material. After forming a partition pattern by a photographic process or the like and forming a partition of an appropriate height by a sandblasting method or a chemical etching method or the like, the photosensitive coating remaining on the upper surface of the partition is removed and then aligned with the partition. A material that can withstand sand blasting, such as an elastic resin, is applied to the upper surface and the side wall of the partition by a screen printing method or the like, and after the resin is dried, the partition is heightened to a predetermined size by performing sand blasting again. A multi-stage discharge display panel, which cuts the material and finally removes the resin by a release material or baking to complete the partition Partition wall formation method.