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JP3351273B2 - Manufacturing method of piezoelectric resonance component - Google Patents
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JP3351273B2 - Manufacturing method of piezoelectric resonance component - Google Patents

Manufacturing method of piezoelectric resonance component

Info

Publication number
JP3351273B2
JP3351273B2 JP34484796A JP34484796A JP3351273B2 JP 3351273 B2 JP3351273 B2 JP 3351273B2 JP 34484796 A JP34484796 A JP 34484796A JP 34484796 A JP34484796 A JP 34484796A JP 3351273 B2 JP3351273 B2 JP 3351273B2
Authority
JP
Japan
Prior art keywords
piezoelectric
adhesive layer
resonance component
manufacturing
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP34484796A
Other languages
Japanese (ja)
Other versions
JPH10190396A (en
Inventor
秀樹 岩城
司 白石
克典 守時
芳宏 別所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18372447&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3351273(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP34484796A priority Critical patent/JP3351273B2/en
Publication of JPH10190396A publication Critical patent/JPH10190396A/en
Application granted granted Critical
Publication of JP3351273B2 publication Critical patent/JP3351273B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発信回路やフィル
タ回路等を構成する際に使用される圧電共振部品及びそ
の製造方法に関し、特に共振特性の劣化が抑制された信
頼性の高い圧電共振部品の製造方法に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric resonance component used for constructing a transmission circuit, a filter circuit, and the like, and a method of manufacturing the same. More particularly, the present invention relates to a highly reliable piezoelectric resonance portion in which deterioration of resonance characteristics is suppressed. The present invention relates to a method for manufacturing a product .

【0002】[0002]

【従来の技術】従来、移動体通信機器やOA機器等にお
いて、水晶等の単結晶を用いた発振子やフィルタが広く
用いられてきた。しかし、水晶等の単結晶を用いた発振
子及びフィルタは高度な研磨技術を要し、また、周波数
安定性を追求することから非常に高価であった。ことろ
が、近年、移動体通信機器やOA機器の普及により、特
に、近年需要が拡大している携帯電話においては、安価
な発振子やフィルタが求められるようになった。そのた
め、従来より、一般機器や家電製品等に用いられてきた
圧電セラミックを用いて発振子やフィルタを構成した圧
電共振部品が移動体通信分野やOA機器分野においても
多く使用されるようになってきた。
2. Description of the Related Art Heretofore, oscillators and filters using a single crystal such as quartz have been widely used in mobile communication equipment and OA equipment. However, an oscillator and a filter using a single crystal such as quartz require a high level of polishing technique and are very expensive because they pursue frequency stability. However, in recent years, with the spread of mobile communication devices and OA devices, inexpensive oscillators and filters have been demanded, especially for mobile phones whose demand has been increasing in recent years. For this reason, piezoelectric resonance components, which constitute an oscillator or a filter using piezoelectric ceramics that have been used for general equipment and home electric appliances, have been widely used in the mobile communication field and the OA equipment field. Was.

【0003】例えば特開平7−336180号公報に記
載された従来の圧電共振部品を、図から図を用いて
説明する。図は従来の圧電共振部品の中間積層体の構
成を示す分解斜視図、図はその中間積層体を示す斜視
図、図は従来の圧電共振部品(完成品)を示す斜視図
である。
[0003] The conventional piezoelectric resonator component according to Japanese Unexamined Patent Publication No. 7-336180 will be described with reference to FIGS. 3 to 5. FIG. 3 is an exploded perspective view showing the configuration of a conventional intermediate laminate of piezoelectric resonance components, FIG. 4 is a perspective view showing the intermediate laminate, and FIG. 5 is a perspective view showing a conventional piezoelectric resonance component (finished product). .

【0004】図及び図に於いて1は圧電共振子、2
は励振電極、3は引き出し電極、4は封止基板、5は接
着剤層、6は振動空間、7は固形充填物、8は外部電極
である。図及び図に示すように、従来の圧電共振部
品の中間積層体は、圧電共振子1と圧電共振子をその両
主面側から挟持する一対の封止基板4と、圧電共振子1
と封止基板4とを接合するための接着剤層5を具備す
る。圧電共振子1は、例えばPZT等の圧電セラミック
ス材料からなる圧電基板を母材とし、圧電基板の上面及
び下面をそれぞれ主面とする。圧電基板の上面及び下面
のそれぞれの中央部には励振電極2が形成されている。
また、圧電基板の上面及び下面の互いに異なる端縁部上
には引き出し電極3が形成されており、圧電基板の上面
及び下面の励振電極2と引き出し電極3はそれぞれ導通
接続されている。
In FIGS. 3 and 4 , reference numeral 1 denotes a piezoelectric resonator;
Is an excitation electrode, 3 is an extraction electrode, 4 is a sealing substrate, 5 is an adhesive layer, 6 is a vibration space, 7 is a solid filling, and 8 is an external electrode. As shown in FIGS. 3 and 5 , a conventional intermediate laminate of a piezoelectric resonance component includes a piezoelectric resonator 1 and a pair of sealing substrates 4 that sandwich the piezoelectric resonator from both main surfaces thereof.
And an adhesive layer 5 for bonding the sealing substrate 4 with the sealing substrate 4. The piezoelectric resonator 1 has, as a base material, a piezoelectric substrate made of a piezoelectric ceramic material such as PZT, and has upper and lower surfaces of the piezoelectric substrate as main surfaces, respectively. Excitation electrodes 2 are formed at the center of each of the upper and lower surfaces of the piezoelectric substrate.
Further, extraction electrodes 3 are formed on different edges of the upper and lower surfaces of the piezoelectric substrate, and the excitation electrodes 2 and the extraction electrodes 3 on the upper and lower surfaces of the piezoelectric substrate are electrically connected to each other.

【0005】封止基板は、それぞれアルミナや誘電体材
料等のセラミック基板であり、圧電共振子とほぼ同じ形
状及び大きさの矩形平板上に形成されている。図に示
すように、封止基板4の圧電共振子1に対向する面に
は、それぞれ励振電極2に対向する略円形の部分(以
下、振動空間と称する)6を除いて接着剤層5が形成さ
れている。接着剤層5を構成する接着剤中には、固形充
填物7がほぼ均一に分散されている。固形充填物7はほ
ぼ球形の外形を有し、圧電共振子1が振動しうる高さ
(振動空間6の高さ)に対応した大きさである。固形充
填物7はスペーサとして機能し、封止基板4と圧電共振
子1と接着する接着剤層5の厚さ、すなわち、接着剤層
5に形成された振動空間6の高さを一定に保つととも
に、圧電共振子1と封止基板4とを加圧する際に、接着
剤が振動空間6内に押し出されることによる振動阻害を
防止する。
The sealing substrates are ceramic substrates such as alumina and dielectric materials, respectively, and are formed on a rectangular flat plate having substantially the same shape and size as the piezoelectric resonator. As shown in FIG. 3 , the surface of the sealing substrate 4 facing the piezoelectric resonator 1 has an adhesive layer 5 except for a substantially circular portion (hereinafter referred to as a vibration space) 6 facing the excitation electrode 2. Are formed. The solid filler 7 is substantially uniformly dispersed in the adhesive constituting the adhesive layer 5. The solid filling 7 has a substantially spherical outer shape, and has a size corresponding to the height at which the piezoelectric resonator 1 can vibrate (the height of the vibration space 6). The solid filler 7 functions as a spacer, and keeps the thickness of the adhesive layer 5 bonded to the sealing substrate 4 and the piezoelectric resonator 1, that is, the height of the vibration space 6 formed in the adhesive layer 5 constant. In addition, when the piezoelectric resonator 1 and the sealing substrate 4 are pressurized, the vibration is prevented from being hindered by the adhesive being pushed into the vibration space 6.

【0006】上記積層体の端面に、例えばめっき法など
の湿式製膜法あるいはスパッター法等の乾式製膜法によ
り、外部電極8を形成する。その結果、図に示すよう
に、従来の圧電共振部品が完成される。これらの外部電
極8が形成された圧電共振部品は半田付けによりプリン
ト配線板上に実装される。
An external electrode 8 is formed on an end face of the laminate by, for example, a wet film forming method such as a plating method or a dry film forming method such as a sputtering method. As a result, as shown in FIG. 5 , a conventional piezoelectric resonance component is completed. The piezoelectric resonance component having the external electrodes 8 formed thereon is mounted on a printed wiring board by soldering.

【0007】[0007]

【発明が解決しようとする課題】上記従来の圧電共振部
品においては、振動空間を形成する際の封止基板と圧電
基板を接着する工程の接着剤層にエポキシ樹脂などを用
いることが一般的となっている。熱硬化性樹脂の場合、
所定の温度と所定の時間で硬化させるが、その過程は、
おおよそ室温から温度を上昇させると一旦粘度が低下
し、ある温度を超えると再び粘度が上昇し完全に硬化す
る。また空洞内の気体は状態方程式に従い、シャルルの
法則で知られるように一定容積内の圧力は気体の温度に
比例することがわかっている。つまり、接着剤層の硬化
に際して、加熱によって接着剤層の粘度が低下するのと
同時に空洞内の圧力が上昇することから、空洞内の空気
が外部へ漏れ、気密性が阻害されるという問題を有して
いた。
In the above-described conventional piezoelectric resonance component, it is generally assumed that an epoxy resin or the like is used for an adhesive layer in a step of bonding the sealing substrate and the piezoelectric substrate when forming a vibration space. Has become. For thermosetting resin,
Curing at a predetermined temperature and a predetermined time, the process is,
When the temperature is increased from about room temperature, the viscosity once decreases, and when the temperature exceeds a certain temperature, the viscosity increases again and the resin is completely cured. Also, the gas in the cavity follows the equation of state, and it is known that the pressure in a certain volume is proportional to the temperature of the gas as known by Charles' law. In other words, when the adhesive layer is cured, heating reduces the viscosity of the adhesive layer and at the same time raises the pressure in the cavity, so that the air in the cavity leaks outside and the airtightness is impaired. Had.

【0008】本発明は、上記従来例の問題を解決するた
めになされたものであり、気密性の信頼が高く、共振特
性が安定した圧電共振部品を、再現性良く製造し得る製
造方法を提供することを目的とする。
[0008] The present invention has been made to solve the above prior art problems, high airtightness of trust, a manufacturing method of the piezoelectric resonator unit products resonance characteristic is stabilized, it can be produced with good reproducibility The purpose is to provide.

【0009】[0009]

【課題を解決するための手段】この課題を解決するため
に本発明の圧電共振部品は、圧電基板の両主面に振動用
電極を設けて圧電共振子を形成する工程と、大気圧より
も低い圧力の雰囲気中で前記圧電基板の両側に接着剤層
を介して封止基板を積層することによって前記圧電共振
子の振動空間を形成し、大気圧中または加圧槽中で加圧
することによって前記振動空間内部の圧力を大気圧より
も低い圧力にする工程と、前記接着剤層を硬化させる工
程と、を含む圧電共振部品の製造方法である。
In order to solve this problem, a piezoelectric resonance component according to the present invention is provided on both sides of a piezoelectric substrate.
Providing electrodes and forming a piezoelectric resonator;
Adhesive layers on both sides of the piezoelectric substrate even in a low pressure atmosphere
The piezoelectric resonance by laminating the sealing substrate through
Creates a vibration space for the element and pressurizes it at atmospheric pressure or in a pressurized tank
To increase the pressure inside the vibrating space from the atmospheric pressure.
And a step of hardening the adhesive layer.
And a method for manufacturing a piezoelectric resonance component .

【0010】また、前記製造方法において、大気圧より
も低い圧力の雰囲気中で前記圧電基板の両側に接着剤層
を介して封止基板を積層する際に、減圧パックに密封し
た状態もしくは減圧層中で前記圧電基板の両側に接着剤
層を介して封止基板を積層することを特徴とするもので
ある。
Further , in the above-mentioned manufacturing method, the pressure may be higher than the atmospheric pressure.
Adhesive layers on both sides of the piezoelectric substrate even in a low pressure atmosphere
When laminating the sealing substrate via
Adhesive on both sides of the piezoelectric substrate in the decompressed state or in a decompression layer
It is characterized by laminating a sealing substrate through layers
is there.

【0011】また、前記製造方法において、前記接着剤
層が半硬化のシート状の接着剤であることを特徴とする
ものである。
In the above method, the adhesive may be
Characterized in that the layer is a semi-cured sheet-like adhesive
Things.

【0012】[0012]

【発明の実施の形態】(実施の形態1) 本発明の圧電共振部品に関する実施の形態1について、
図1(a)と図1(b)と図2を参照しつつ説明する。
図1(a)は実施の形態1にかかる圧電共振部品の中間
積層体を示す斜視図、図1(b)は図1(a)のA−A
での断面図、図2はその構造を示す分解斜視図である。
図1(a)と図1(b)と図2において、PZT等の圧
電性セラミックス材料を矩形平板状に形成した圧電基板
から成る圧電共振子1の両主面には励振電極2と引き出
し電極3がそれぞれ形成されている。励振電極2に外部
から電圧を印加すると励振電極2の近傍のみが振動する
振動モードが励振される。圧電共振子1と封止基板4と
の間には接着剤層5が層状に設置されており、圧電振動
子1の振動を阻害しないように振動空間を形成してい
る。接着剤としては、耐熱性と接着強度を考慮して、例
えばエポキシ系の熱硬化型樹脂を用いる。さらにこの振
動空間は内部の圧力が大気圧よりも低い圧力で形成され
ている。振動空間の内部の圧力が大気圧とほぼ同じ圧力
である場合、接着剤層5の硬化が室温で行われれば、振
動空間内の空気が熱膨張し、外部へ漏れることなく気密
性が保たれる。しかしながら一般には、接着剤層に熱硬
化性樹脂を用いる場合、接着剤層の硬化において加熱が
必要であり、このとき振動空間内の気体が熱膨張し、外
部へ漏れることがあり、そのため気密性が阻害されるこ
とがある。そこで本実施の形態1では、振動空間の内部
の圧力が大気圧よりも低い圧力で形成されているため、
接着剤層の硬化における加熱の際に振動空間の気体が熱
膨張しても接着剤の変形をもたらすような圧力になら
ず、気体が外部へ漏れることによって気密性が損なわれ
る割合を小さくすることができる。さらに、外部と振動
空間の内部の圧力差により、振動空間に対して等方的に
圧力差に等しい大きさの力が加わるため、圧電共振子1
と封止板4との密着度が均一となり、変形がほとんどな
い振動空間が形成できる。また、接着剤層の硬化後にお
いても、振動空間の内部と外部との圧力差により、加圧
力が維持されるため剥離などの可能性が低くなる。尚、
接着剤層は接着剤層の硬化に際する粘度の変化に対し
て、硬化の前後で振動空間の容積を一定に保つために任
意の形状と大きさの固形充填物を含有したものがより好
ましい。
(Embodiment 1) Embodiment 1 relating to a piezoelectric resonance component of the present invention will be described.
This will be described with reference to FIGS. 1 (a), 1 (b) and 2.
FIG. 1A is a perspective view showing an intermediate laminated body of the piezoelectric resonance component according to the first embodiment, and FIG. 1B is an AA of FIG.
FIG. 2 is an exploded perspective view showing the structure.
1 (a), 1 (b) and 2, an excitation electrode 2 and an extraction electrode are provided on both main surfaces of a piezoelectric resonator 1 composed of a piezoelectric substrate formed of a piezoelectric ceramic material such as PZT in a rectangular flat plate shape. 3 are formed respectively. When a voltage is externally applied to the excitation electrode 2, a vibration mode in which only the vicinity of the excitation electrode 2 vibrates is excited. An adhesive layer 5 is provided between the piezoelectric resonator 1 and the sealing substrate 4 in a layered manner, and forms a vibration space so as not to hinder the vibration of the piezoelectric vibrator 1. As the adhesive, for example, an epoxy-based thermosetting resin is used in consideration of heat resistance and adhesive strength. Furthermore, this vibration space is formed at a pressure where the internal pressure is lower than the atmospheric pressure. When the pressure inside the vibrating space is substantially the same as the atmospheric pressure, if the adhesive layer 5 is cured at room temperature, the air in the vibrating space thermally expands and airtightness is maintained without leaking to the outside. It is. However, in general, when a thermosetting resin is used for the adhesive layer, heating is required for curing the adhesive layer, and at this time, the gas in the vibration space expands thermally and may leak to the outside. May be inhibited. Therefore, in the first embodiment, since the pressure inside the vibration space is formed at a pressure lower than the atmospheric pressure,
Even if the gas in the vibrating space is thermally expanded during curing of the adhesive layer, the pressure will not cause deformation of the adhesive even if the gas expands, and the rate at which gas tightness is impaired due to leakage of the gas to the outside will be reduced. Can be. Further, a force having a magnitude equal to the pressure difference isotropically applied to the vibration space due to a pressure difference between the outside and the inside of the vibration space.
The degree of adhesion between the sealing plate 4 and the sealing plate 4 becomes uniform, and a vibration space with almost no deformation can be formed. Further, even after the adhesive layer is cured, the pressure is maintained due to the pressure difference between the inside and the outside of the vibration space, so that the possibility of peeling or the like is reduced. still,
It is more preferable that the adhesive layer contains a solid filler having an arbitrary shape and size in order to keep the volume of the vibration space constant before and after curing with respect to a change in viscosity upon curing of the adhesive layer. .

【0013】(実施の形態2) 次に、本発明の圧電共振部品の製造方法に関する実施の
形態2について、図2を参照しつつ説明する。実施の形
態2は、上記実施の形態1にかかる圧電共振部品の製造
に適する方法に関する。
Second Embodiment Next, a second embodiment of the method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. The second embodiment relates to a method suitable for manufacturing the piezoelectric resonance component according to the first embodiment.

【0014】本発明の実施の形態2における圧電共振子
の製造方法は、圧電共振子1の2つの主面上に励振電極
2に対向する部分を除いて所定の厚さに接着剤層5を印
刷等により塗布し、特定の温度と時間で加熱して半硬化
状態にしたものを介して大気圧よりも低い圧力の雰囲気
中で封止基板4を圧電共振子1の外側に積層し、特定の
温度と時間で加熱して接着剤層を完全硬化させることに
より、接着剤層が励振電極2の近傍に流れることなく、
かつ振動空間内の気体が熱膨張し、外部へ漏れることな
く気密性を保った振動空間を安定に形成することができ
る。このような圧電共振部品の製造方法をとることによ
り、特性の安定した実施の形態1にかかる圧電共振部品
を得ることができる。例えば大気圧よりも低い圧力の雰
囲気中で積層することを実現する方法として、積層前の
中間積層体を減圧パックに密封し大気圧中または加圧槽
中で加圧することによって振動空間の内部の圧力を大気
圧よりも低い圧力にすることができる。また接着剤層の
形成には、印刷のほかに半硬化状態のシート状の接着剤
を用いても同様の効果が得られ、この場合、減圧槽中で
中間積層体をラミネートすることで所望の振動空間を形
成できる。
In the method of manufacturing the piezoelectric resonator according to the second embodiment of the present invention, the adhesive layer 5 is formed on the two main surfaces of the piezoelectric resonator 1 to a predetermined thickness except for a portion facing the excitation electrode 2. The sealing substrate 4 is laminated on the outside of the piezoelectric resonator 1 in an atmosphere having a pressure lower than the atmospheric pressure through a material which is applied by printing or the like and heated at a specific temperature and time to a semi-cured state, and By completely heating the adhesive layer by heating at the temperature and time of the above, the adhesive layer does not flow near the excitation electrode 2,
In addition, the gas in the vibration space thermally expands, and the vibration space with airtightness can be stably formed without leaking to the outside. By adopting such a method of manufacturing a piezoelectric resonance component, it is possible to obtain the piezoelectric resonance component according to the first embodiment having stable characteristics. For example, as a method of realizing lamination in an atmosphere at a pressure lower than the atmospheric pressure, the intermediate laminated body before lamination is sealed in a decompression pack and pressurized in the atmospheric pressure or in a pressurized tank by pressurizing in an atmospheric pressure or a pressure tank. The pressure can be below atmospheric pressure. In addition, in forming the adhesive layer, the same effect can be obtained by using a sheet-like adhesive in a semi-cured state in addition to printing. In this case, the desired effect can be obtained by laminating the intermediate laminate in a reduced-pressure tank. A vibration space can be formed.

【0015】(参考例) 次に、本発明の圧電共振部品の製造方法に関する参考例
について、図2を参照しつつ説明する。参考例は、実施
の形態2と同様に、実施の形態1にかかる圧電共振部品
の製造に適する方法に関する。従って、上記実施の形態
2にかかる製造方法と共通する部分の説明は省略する。
Reference Example Next, a reference example relating to a method for manufacturing a piezoelectric resonance component of the present invention will be described with reference to FIG. The reference example relates to a method suitable for manufacturing the piezoelectric resonance component according to the first embodiment, as in the second embodiment. Therefore, description of portions common to the manufacturing method according to the second embodiment will be omitted.

【0016】本発明の参考例における圧電共振子の製造
方法は、圧電振動子1の2つの主面上に励振電極2に対
向する部分を除いて形成した半硬化状態の接着剤層5を
介して、接着剤層5を硬化させるときの温度よりも高い
温度において、封止基板4を圧電共振子1の外側に積層
し、特定の温度と時間で加熱して接着剤層を硬化させる
ことにより、振動空間を形成する。
In the method of manufacturing a piezoelectric resonator according to the reference example of the present invention, a semi-cured adhesive layer 5 is formed on two main surfaces of a piezoelectric vibrator 1 except for a portion facing the excitation electrode 2. Then, at a temperature higher than the temperature at which the adhesive layer 5 is cured, the sealing substrate 4 is laminated on the outside of the piezoelectric resonator 1, and heated at a specific temperature and time to cure the adhesive layer. , Forming a vibration space.

【0017】上記参考例にかかる圧電共振部品の製造方
法では、全ての工程において大気圧中で行うので、接着
剤層を介して封止基板と圧電共振子を高温で積層しなけ
ればならないが、実施の形態2に於ける大気圧よりも低
い圧力の雰囲気中での工程を経ることなく簡便に特性の
安定した実施の形態1にかかる圧電共振部品を得ること
ができる。
In the method of manufacturing a piezoelectric resonance component according to the above reference example , since all the steps are performed at atmospheric pressure, the sealing substrate and the piezoelectric resonator must be laminated at a high temperature via an adhesive layer. The piezoelectric resonance component according to the first embodiment having stable characteristics can be easily obtained without performing the process in the atmosphere at a pressure lower than the atmospheric pressure in the second embodiment.

【0018】[0018]

【発明の効果】以上のように本発明によれば、振動空間
の内部の圧力を大気圧よりも低い圧力で振動空間を形成
しているため接着剤層の硬化の際に振動空間内の気体が
熱膨張し外部へ漏れることなく安定して気密性を保つこ
とができ、且つ、振動空間の形成に圧電基板やアルミナ
等のセラミック基板と半硬化状態の接着剤層を用いてい
るため振動空間の変形や接着剤が流れ出すことによる励
振電極への付着を防ぎ、電極の励振を阻害することなく
安定して振動空間を形成できる。
As described above, according to the present invention, since the vibration space is formed at a pressure lower than the atmospheric pressure, the gas in the vibration space is hardened when the adhesive layer is cured. Can be kept airtight stably without thermal expansion and leakage to the outside, and the vibration space is formed by using a piezoelectric substrate or a ceramic substrate such as alumina and a semi-cured adhesive layer to form the vibration space. This prevents deformation of the electrode and adhesion of the adhesive to the excitation electrode due to the flowing out of the adhesive, thereby stably forming a vibration space without obstructing the excitation of the electrode.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)は本発明の実施の形態1における圧電共
振部品の中間積層体の斜視図 (b)は図1(a)のA−A面での部分断面図
FIG. 1A is a perspective view of an intermediate laminated body of a piezoelectric resonance component according to a first embodiment of the present invention. FIG. 1B is a partial cross-sectional view taken along a line AA in FIG.

【図2】本発明の実施の形態1における圧電共振部品の
中間積層体の構造を示す分解斜視図
FIG. 2 is an exploded perspective view showing a structure of an intermediate laminated body of the piezoelectric resonance component according to the first embodiment of the present invention.

【図3】従来の圧電共振部品の中間積層体の構造を示す
分解斜視図
FIG. 3 is an exploded perspective view showing the structure of a conventional intermediate laminate of a piezoelectric resonance component.

【図4】図3に示す中間積層体の外観を示す斜視図FIG. 4 is a perspective view showing the appearance of the intermediate laminate shown in FIG. 3;

【図5】従来の圧電共振部品の外観を示す斜視図FIG. 5 is a perspective view showing the appearance of a conventional piezoelectric resonance component.

【符号の説明】[Explanation of symbols]

1 圧電共振子 2 励振電極 3 引き出し電極 4 封止基板 5 接着剤層 6 振動空間 7 固形充填物 8 外部電極 DESCRIPTION OF SYMBOLS 1 Piezoelectric resonator 2 Excitation electrode 3 Leader electrode 4 Sealing substrate 5 Adhesive layer 6 Vibration space 7 Solid filling 8 External electrode

フロントページの続き (72)発明者 別所 芳宏 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平3−210809(JP,A) 特開 平7−336180(JP,A) (58)調査した分野(Int.Cl.7,DB名) H03H 3/00 - 3/04 Continuation of the front page (72) Inventor Yoshihiro Bessho 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-3-210809 (JP, A) JP-A-7-336180 (JP) , A) (58) Field surveyed (Int. Cl. 7 , DB name) H03H 3/00-3/04

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 圧電基板の両主面に振動用電極を設けて
圧電共振子を形成する工程と、大気圧よりも低い圧力の
雰囲気中で前記圧電基板の両側に接着剤層を介して封止
基板を積層することによって前記圧電共振子の振動空間
を形成し、大気圧中または加圧槽中で加圧することによ
って前記振動空間内部の圧力を大気圧よりも低い圧力に
する工程と、前記接着剤層を硬化させる工程と、を含む
圧電共振部品の製造方法
1. A vibrating electrode is provided on both main surfaces of a piezoelectric substrate.
Forming a piezoelectric resonator, and applying a pressure lower than the atmospheric pressure.
Sealed via an adhesive layer on both sides of the piezoelectric substrate in an atmosphere
The vibration space of the piezoelectric resonator is formed by stacking substrates.
And pressurize it at atmospheric pressure or in a pressurized tank.
The pressure inside the vibration space to a pressure lower than atmospheric pressure
And a step of curing the adhesive layer.
A method for manufacturing a piezoelectric resonance component .
【請求項2】 大気圧よりも低い圧力の雰囲気中で前記
圧電基板の両側に接着剤層を介して封止基板を積層する
際に、減圧パックに密封した状態もしくは減圧層中で前
記圧電基板の両側に接着剤層を介して封止基板を積層す
ることを特徴とする請求項1記載の圧電共振部品の製造
方法。
2. The method according to claim 1 , wherein the atmosphere is at a pressure lower than the atmospheric pressure.
Laminating sealing substrates on both sides of the piezoelectric substrate via an adhesive layer
When in a sealed state in a vacuum pack or in a vacuum layer,
The sealing substrate is laminated on both sides of the piezoelectric substrate via an adhesive layer.
The method for manufacturing a piezoelectric resonance component according to claim 1, wherein
【請求項3】 前記接着剤層が半硬化のシート状の接着
剤である請求項1記載の圧電共振部品の製造方法。
3. An adhesive in which the adhesive layer is a semi-cured sheet.
2. The method for manufacturing a piezoelectric resonance component according to claim 1, wherein the agent is an agent .
JP34484796A 1996-12-25 1996-12-25 Manufacturing method of piezoelectric resonance component Expired - Fee Related JP3351273B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34484796A JP3351273B2 (en) 1996-12-25 1996-12-25 Manufacturing method of piezoelectric resonance component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34484796A JP3351273B2 (en) 1996-12-25 1996-12-25 Manufacturing method of piezoelectric resonance component

Publications (2)

Publication Number Publication Date
JPH10190396A JPH10190396A (en) 1998-07-21
JP3351273B2 true JP3351273B2 (en) 2002-11-25

Family

ID=18372447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34484796A Expired - Fee Related JP3351273B2 (en) 1996-12-25 1996-12-25 Manufacturing method of piezoelectric resonance component

Country Status (1)

Country Link
JP (1) JP3351273B2 (en)

Also Published As

Publication number Publication date
JPH10190396A (en) 1998-07-21

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