JP3355288B2 - Wiring board for semiconductor mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting a semiconductor, and more particularly, to a wiring for mounting a semiconductor, which can eliminate and reduce the warpage of the wiring board and can mount and arrange a highly reliable semiconductor chip. Regarding the board.

[0002]

2. Description of the Related Art In recent years, in response to demands for higher functionality, smaller size, and lower cost of equipment, semiconductor chips are mounted on a main surface of a thin wiring board of, for example, about 50 to 200 μm, and formed on the main surface. There is known a surface-mount type semiconductor package system or a semiconductor module system in which connection is made to a wiring unit including a conductive pad. 3, the semiconductor chip 3 is mounted on one main surface of the wiring board 1 for mounting a semiconductor via the mounting material 2, and the electrodes of the semiconductor chip 3 are connected to the electrodes for mounting the semiconductor. A semiconductor package (or semiconductor module) having a configuration in which wire bonding 4 is performed between the terminal 1a of the wiring board 1 and the connected terminal 1a.
Is being developed.

Here, the wiring board for mounting a semiconductor is, as shown in an enlarged plan view in FIG.
A strip-shaped insulating sheet (or film) having a length of about 20 to 50 mm and a length of about 100 to 200 mm is used as a substrate 5, and a plurality of wiring units 6 groups are separably arranged on one main surface excluding an externally processed portion. I have. A group of external connection terminals (not shown) respectively corresponding to the six groups of the wiring units are arranged in the area except for the externally processed portion on the other main surface by through-hole connection (not shown). . The mounting of the semiconductor chip 3
The arrangement is usually performed collectively for each wiring unit 6 of the strip-shaped wiring board for semiconductor mounting 5 ′, and then cut and separated along the outline processing line (shown by a dotted line).

[0004]

The strip-shaped wiring board 5 'for mounting a semiconductor often poses the following disadvantages in practical use. That is, the separable wiring unit 6
The strip formation accompanying the grouping of the groups tends to cause warpage as a whole, in combination with the thin film of the insulating sheet 5 and the formation of the wiring unit 6, and in particular, slight twisting in the length direction is recognized. Can be On the other hand, the mounting and disposition of the semiconductor chip 3 on the semiconductor mounting wiring board 5 'is generally performed by sequentially transferring the semiconductor chips 3 to the semiconductor mounting wiring board 5' which is conveyed and positioned on the conveyor.・ It is performed by arrangement. Here, in order to mount and arrange the semiconductor chip 3 at a predetermined position of the semiconductor mounting wiring board 5 'with high accuracy and certainty, both are positioned with high accuracy and a certain direction is adopted. Is assumed.

However, if the strip-shaped wiring board for semiconductor mounting 5 'is slightly warped, it is likely to be displaced, so that the accuracy of mounting and disposing the semiconductor chip 3 is impaired. As a result, it becomes difficult to configure a highly reliable semiconductor package (or semiconductor module). In other words, there is a possibility that the mass productivity and yield of highly reliable semiconductor packages may be impaired, and there is a need for providing effective improvement measures.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a semiconductor mounting wiring board capable of easily positioning, mounting, and arranging a semiconductor chip accurately even in a configuration in which fine wiring units are arranged. For the purpose of providing.

[0007]

According to a first aspect of the present invention, there is provided a strip-shaped wiring board for mounting a semiconductor having an outer shape processing portion, wherein a plurality of wiring unit groups are arranged so as to be separable. Cross section that absorbs warpage at least in the length direction of the processed part
A wiring board for mounting a semiconductor, characterized in that a groove-shaped bent portion having a resistance of Ω or a cross section 形成 is formed.

According to a second aspect of the present invention, there is provided a strip-shaped wiring board main body having an externally processed portion and having a plurality of wiring unit groups separably disposed on one main surface, and corresponding to the plurality of wiring unit groups. And an external connection terminal group disposed on the other main surface of the wiring board main body, wherein the cross-section Ω or
Is a wiring board for mounting a semiconductor, which is formed by forming a groove-shaped bent portion having a cross section Π .

In the invention of the strip-shaped wiring board for mounting a semiconductor, the wiring board body is made of, for example, a liquid crystal polymer, a glass epoxy resin, a polyimide resin or the like having a thickness of 50 to 200.
μm sheet or film as insulating material,
The wiring unit including the connected terminal has a thickness of 18 to 35 μm, for example.
It is composed of a copper foil of a degree. The form may be a double-sided wiring type or a multi-layered wiring type having three or more layers having inner layer wirings, and the pitch of the wiring unit or the like is generally about 60 to 300 μm. Here, the wiring board for mounting a semiconductor means a wiring board for a semiconductor package or a multi-chip module,
A configuration in which the external connection terminal is led to the other main surface (back surface) by through-hole connection may be employed.

In the strip-shaped wiring board for mounting a semiconductor having the above structure, the bent portion provided for absorbing the warp at least in the longitudinal direction of the externally processed portion has a depth of, for example, 0.1 to 1.5.
It can be formed by groove-shaped bending with a cross section Ω or cross section of about mm, or L-shaped bending at the longitudinal edge of the externally processed portion. By providing the bent portion for absorbing the warp in the length direction of the externally processed portion, the occurrence of the warp of the thin and strip-shaped wiring board can be easily absorbed and reduced, but the groove-shaped bent portion is also provided in the width direction. May be additionally provided.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 and 2 (a) and (b)
An example will be described with reference to FIG.

FIGS. 1 and 2 (a) and (b) show an example of a configuration of a main part of a wiring board for a semiconductor package. FIG. 1 is a plan view, and FIGS. It is sectional drawing of the wiring for different semiconductor packages.

In each of the above drawings, reference numeral 7 'denotes a strip-shaped wiring board for mounting a semiconductor having an outer shape processing portion 8 and a plurality of wiring units 9 arranged so as to be separable. It is a bent portion formed at least in the length direction for absorbing a warp. More specifically, a strip-shaped wiring board main body 7 having an outer shape processing portion 8 and having a plurality of wiring units 9 groups separably arranged on one main surface, and the plurality of wiring units 9 groups A wiring board 7 ′ for mounting a semiconductor device, comprising a group of external connection terminals 11 disposed on the other main surface of the wiring board body 7, respectively, wherein the externally processed portion 8 is warped at least in the length direction. This is a wiring board for mounting a semiconductor, characterized in that it is provided with a bent portion 10 that absorbs the noise. Here, the strip-shaped wiring board body 7 has a thickness of, for example, 100 μm and a length of 1 μm.
50mm, 35mm width glass epoxy resin sheet,
The wiring unit 9 including the terminal to be connected has a thickness of, for example, 18 mm.
It is formed by photo-etching of μm copper foil with a size of about 8 × 8 mm and a wiring pitch of about 170 μm. In other words, the configuration is such that the outer shape processing portion 8 is cut and separated by a cutting line (dotted line) between both ends in the width direction of the strip-shaped wiring board main body 7 and between the wiring units 9. An external connection terminal 11 group corresponding to each of the wiring unit 9 groups is
The through-hole connection (not shown) is provided on the other main surface outside the contour processing area.

On the other hand, as shown in FIGS. 2 (a) and 2 (b), a part along (in parallel with) the edge of the externally processed portion 8 is formed with a groove having a cross section Ω or a cross section of about 1 mm in depth. By bending it into an L-shape or by bending the edge into an L-shape having a height of about 1 mm, the warpage generated in the strip-shaped wiring board body 7 or the strip-shaped wiring board 7 'for semiconductor mounting is absorbed.

The mounting and disposition of the semiconductor chip on the strip-shaped wiring board 7 'for semiconductor mounting having the above-described structure is performed continuously for each wiring unit 9 and then along the contour processing line (shown by a dotted line). It is used in the form of cutting and separating.

Next, an example of a method for manufacturing the wiring board for a semiconductor package will be described.

First, a glass-epoxy resin strip-like laminate having a copper foil of 18 μm thickness on both sides and a total thickness of 100 μm was prepared, and divided into a required wiring unit area and an external processing area. Drilling is performed at a position corresponding to a required through-hole connection portion (not shown), and then a plating process is performed to form a conductive layer on the inner wall surface of the drilled hole, thereby forming a through-hole connection portion. Next, the desired double-sided copper foil is subjected to a photo-etching process to form 9 groups of required wiring units and 11 groups of external connection terminals, thereby manufacturing a desired wiring board for a semiconductor package.

Thereafter, a plurality of wiring units 9 are formed in the strip shape.
Apply a thin, band-shaped (selective) heat and pressure press process to the area parallel to the edges on both width sides of the wiring board for a semiconductor package with a group, and bend it into a cross-section groove with a depth of 1 mm and a width of 1 mm As a result, a strip-shaped wiring board for a semiconductor package is obtained in which the occurrence of warpage is suppressed or eliminated. The bending position may be provided along with the region parallel to both width side edges and also at the interval between the wiring units 9 or simply bending both width side edges substantially vertically and standing. Good.

In the above description, the wiring board for a semiconductor package has been described as an example. However, the present invention can also be used as a wiring board for a multi-chip module on which multiple chips are mounted, and the present invention is not limited to the above examples. Various modifications can be made without departing from the spirit of the present invention. For example, the configuration of the wiring unit of the wiring board body may be a multilayer,
The insulating sheet may also be a liquid crystal polymer other than the glass / epoxy resin type.

[0020]

In the case of the wiring board for mounting a semiconductor according to the present invention, since a part of the externally processed portion 11 is bent so that a play portion is provided for the elasticity of the wiring board, a strip shape is obtained. The warp generation property and the warp generation phenomenon that are likely to occur in the length direction are easily absorbed, so that good flatness is exhibited as a whole. Therefore, the risk of misalignment or the like during mounting and mounting of the semiconductor chip is eliminated and reduced, which greatly contributes to providing a highly reliable semiconductor package while improving the yield in mass production.

[Brief description of the drawings]

FIG. 1 is a plan view showing a configuration of a main part of a wiring board for a semiconductor package according to an embodiment.

FIGS. 2 (a) and 2 (b) are cross-sectional views showing the main configuration of a wiring board for a semiconductor package different from each other.

FIG. 3 is a cross-sectional view showing an example of a main part structure of a conventional semiconductor package.

FIG. 4 is a plan view showing a configuration of a main part of a conventional wiring board for a semiconductor package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Wiring board main body 2 ... Mounting material 3 ... Semiconductor chip 4 ... Wire bonding 5, 7 ... Strip shaped wiring board main body 5 ', 7' ... Strip shaped semiconductor mounting wiring board 6, 9 ... … Wiring unit 8… External processing part 10… Bending part 11 …… External connection terminal

Claims (2)

(57) [Claims] 1. A strip-shaped wiring board for mounting a semiconductor having an externally processed portion and a plurality of wiring unit groups arranged so as to be separable, wherein the externally processed portion absorbs warpage at least in a length direction. A wiring board for mounting a semiconductor, characterized by forming a groove-shaped bent portion having a cross section Ω or a cross section す る . 2. A strip-shaped wiring board body having an externally processed portion and having a plurality of wiring unit groups separably arranged on one main surface, and a wiring board body corresponding to the plurality of wiring unit groups. A semiconductor mounting wiring board comprising an external connection terminal group disposed on the other main surface of the semiconductor device, wherein the external shape processing portion absorbs warpage at least in a length direction, and has a groove-shaped cross section of Ω or Π. A wiring board for mounting a semiconductor, comprising a bent portion.