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JP3358685B2 - Manufacturing method of low thermal expansion sintered alloy - Google Patents
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JP3358685B2 - Manufacturing method of low thermal expansion sintered alloy - Google Patents

Manufacturing method of low thermal expansion sintered alloy

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Publication number
JP3358685B2
JP3358685B2 JP01744095A JP1744095A JP3358685B2 JP 3358685 B2 JP3358685 B2 JP 3358685B2 JP 01744095 A JP01744095 A JP 01744095A JP 1744095 A JP1744095 A JP 1744095A JP 3358685 B2 JP3358685 B2 JP 3358685B2
Authority
JP
Japan
Prior art keywords
powder
alloy
thermal expansion
balance
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP01744095A
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Japanese (ja)
Other versions
JPH08188843A (en
Inventor
民夫 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Powdered Metals Co Ltd
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Filing date
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Application filed by Hitachi Powdered Metals Co Ltd filed Critical Hitachi Powdered Metals Co Ltd
Priority to JP01744095A priority Critical patent/JP3358685B2/en
Publication of JPH08188843A publication Critical patent/JPH08188843A/en
Application granted granted Critical
Publication of JP3358685B2 publication Critical patent/JP3358685B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】この発明は、通信機器、コンピュ
ーター周辺機器に搭載されるセラミックス材料やステン
レス鋼と整合されて用いられる低熱膨張焼結合金の製法
に関するものである。なお、本明細書中、Moはモリブ
デンを、Wはタングステンを、Cuは銅を、Snはスズ
を、Pはリンを、Siはケイ素を、Alはアルミニウム
を、Znは亜鉛の元素記号を示している。 [発明の詳細な説明]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a low thermal expansion sintered alloy which is used in alignment with a ceramic material or stainless steel mounted on a communication device or a computer peripheral device. In this specification, Mo represents molybdenum, W represents tungsten, Cu represents copper, Sn represents tin, P represents phosphorus, Si represents silicon, Al represents aluminum, and Zn represents an element symbol of zinc. ing. [Detailed description of the invention]

【0002】[0002]

【従来の技術】低熱膨張係数の金属材料としては、イン
バー(36%Ni−Fe)やコバール(29%Ni−1
7%Co−Fe)等がある。これらは高価で切削加工性
が悪く、使用される各種機種では磁気の影響を嫌うこと
から用途が制約される。Mo−Cu合金、W−Cu合金
は、焼結接点材料や電極材料、W基合金は電極材料や重
合金として知られている材料であるが、低熱膨張の材料
でもある。MoおよびWとCuとは合金化しないので粉
末冶金法によって作られ、斑組織を呈した合金である。
熱膨張係数は、Cuの含有量によって調整が可能で、C
uの含有量が少ない材料はMoまたはWの熱膨張係数に
近い値を示す。
2. Description of the Related Art Invar (36% Ni--Fe) or Kovar (29% Ni-1) is used as a metal material having a low coefficient of thermal expansion.
7% Co-Fe). These are expensive and have poor machinability, and their use is restricted because various kinds of models used dislike magnetic influence. Mo-Cu alloys and W-Cu alloys are materials known as sintered contact materials and electrode materials, and W-based alloys are materials known as electrode materials and heavy metal alloys, but are also materials with low thermal expansion. Since Mo, W, and Cu do not alloy with each other, they are made by powder metallurgy and have an uneven structure.
The coefficient of thermal expansion can be adjusted by the Cu content.
A material having a low u content shows a value close to the coefficient of thermal expansion of Mo or W.

【0003】このMoまたはW基焼結合金は、粒径が1
0μm以下のMoまたはWの粉末と微細なCu粉とを所
定の割合で混合、必要に応じて造粒した粉末を圧粉成
形、およびCuの溶ける温度で焼結(液相焼結)する方
法や、前記MoまたはW粉末の圧粉体にCuを溶浸する
方法により製造される。後者の製造はCu量の制御が困
難であり、表面に残る余剰なCuを切削除去しなければ
ならないので、複雑形状の部品を製作する場合は前者の
製法が適している。
[0003] This Mo or W base sintered alloy has a grain size of 1
A method in which Mo or W powder of 0 μm or less and fine Cu powder are mixed at a predetermined ratio, and the granulated powder is compacted if necessary, and sintered (liquid phase sintering) at a temperature at which Cu is melted. Alternatively, it is manufactured by a method in which Cu is infiltrated into the green compact of Mo or W powder. In the latter case, it is difficult to control the amount of Cu, and excess Cu remaining on the surface must be removed by cutting. Therefore, the former method is suitable for manufacturing a component having a complicated shape.

【0004】[0004]

【発明が解決しようとする課題】セラミックス材料やス
テンレス鋼と整合されて用いられる低熱膨張材料製部品
の使用環境は多様化され、部品の性能および形状に対す
る要求が厳しくなっており、特に通信情報関連機器に搭
載される部品では、小型軽量化、切削加工の削減および
部品の寸法精度向上、耐蝕性の向上、コスト低減等が一
層望まれている。すなわち、液相焼結しても寸法精度よ
く変形しない合金であれば、部品形状は粉末成形で造形
することが可能になる。また、部品の機械加工はコスト
高の要因であるが、複雑形状であり高寸法精度を得るた
めに切削加工した方が合理的なことがあり、切削性のよ
いことも要求される。さらに、MoおよびWは大気中に
放置すると酸化するが、特に高温多湿であったり、部品
を相手部材と整合する際、ラッピングやタッピング加工
等が施されることがあり、加工表面の耐蝕性も必要であ
る。
The use environment of parts made of low thermal expansion material used in alignment with ceramic materials and stainless steel has been diversified, and the demands on the performance and shape of the parts have become strict. With respect to components mounted on equipment, reductions in size and weight, reduction in cutting work, improvement in dimensional accuracy of components, improvement in corrosion resistance, reduction in cost, and the like are further demanded. That is, if the alloy does not deform with high dimensional accuracy even after liquid phase sintering, the component shape can be formed by powder molding. In addition, although machining of parts is a factor of high cost, cutting may be more rational in order to obtain high dimensional accuracy due to its complicated shape, and good cutability is also required. Further, Mo and W oxidize when left in the air, but may be subjected to lapping or tapping when the component is mated with a mating member, particularly when the temperature and humidity are high, and the corrosion resistance of the processed surface is also low. is necessary.

【0005】前記した従来のMo粉またはW粉とCu粉
の混合粉の圧粉体を液相焼結する製法は、溶浸法に比べ
て造形性に優れているが、Mo粉またはW粉を超硬合金
製造用粉末のように粒度が10μm以下の通常の粉末を
用いた場合、圧粉成形の際に金型とかじりを生じ易く、
それを改善するため樹脂などで造粒した粉末にしなけれ
ばならないという繁雑さがある。また、液相焼結中にM
o粒子またはW粒子が移動して変形や寸法変化が起こり
易く、所望する寸法精度が得られないため、切削加工を
必要とする個所が多くなり、コスト高の原因になってい
る。一方、Mo粉またはW粉の粒度が粗い粉末を用いた
場合は、比較して変形が少なくなるが、ラッピングやタ
ッピング加工の際の耐蝕性に問題があるとの指摘があ
る。
[0005] The conventional method of liquid phase sintering a green compact of the Mo powder or a mixture of the W powder and the Cu powder is superior in the formability as compared with the infiltration method. When a normal powder having a particle size of 10 μm or less is used, such as a powder for manufacturing a cemented carbide, the powder tends to seize with a metal mold during compaction,
There is a complication that the powder must be granulated with a resin or the like to improve it. During liquid phase sintering, M
The o-particles or W-particles are liable to be deformed or changed in size due to movement, and the desired dimensional accuracy cannot be obtained. Therefore, the number of locations requiring cutting is increased, resulting in high cost. On the other hand, when a powder having a coarse particle size of Mo powder or W powder is used, the deformation is relatively small, but it is pointed out that there is a problem in the corrosion resistance in lapping or tapping.

【0006】このような状況を改善するため、この発明
の目的は、低熱膨張で耐蝕性および切削加工性がよく、
しかも焼結による寸法変化量のばらつきが少なく寸法精
度のよい焼結部品を提供することである。さらに、他の
目的は、以下に説明する内容の中で順次明らかにして行
く。
[0006] In order to improve such a situation, an object of the present invention is to provide low thermal expansion, good corrosion resistance and good machinability,
Moreover, it is an object of the present invention to provide a sintered part having a small dimensional variation due to sintering and a high dimensional accuracy. Further, other objects will be clarified sequentially in the contents described below.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、この発明に係る低熱膨張焼結合金の製造方法は、
oまたはWの多孔質焼結体を粉砕して作られ、粒径が4
0〜300μmで粉末内に通気孔を有するスケルトン状
のMo粉またはW粉と、Cu粉または下記のイ〜トのい
ずれかのCu合金粉もしくはそのCu合金組成を構成す
る金属粉末との混合粉を圧粉し、CuまたはCu合金の
融点以上で加熱し液相焼結すること(請求項1)と、得
られる焼結合金の気孔率が20〜30%(密度比70〜
80%)である(請求項2)ことを特徴とする。 (イ)0.5〜9%Sn、残部Cu (ロ)0.5〜9%Sn、0.03〜0.5%P、残部
Cu (ハ)0.5〜9%Sn、1〜3%Si、残部Cu (ニ)5〜11%Al、残部Cu (ホ)1〜50%Zn、残部Cu (ヘ)1〜50%Zn、0.5〜9%Sn、残部Cu (ト)1〜50%Zn、1〜3%Al、残部Cu
To achieve SUMMARY OF to the above objects, a method for manufacturing a low-thermal expansion sintered alloy according to the present invention, M
It is made by crushing a porous sintered body of o or W and has a particle size of 4
Skeleton with 0-300 μm and air holes in powder
Mo powder or W powder, and Cu powder or the following
Make up some of the Cu alloy powder or its Cu alloy composition
Powder of the mixed powder with the metal powder
Liquid phase sintering by heating above the melting point (claim 1);
Porosity 20-30% of the sintered alloy to be (density ratio 70
80%) (claim 2) . (B) 0.5 to 9% Sn, balance Cu (b) 0.5 to 9% Sn, 0.03 to 0.5% P, balance Cu (c) 0.5 to 9% Sn, 1 to 3 % Si, balance Cu (d) 5 to 11% Al, balance Cu (e) 1 to 50% Zn, balance Cu (f) 1 to 50% Zn, 0.5 to 9% Sn, balance Cu (g) 1 -50% Zn, 1-3% Al, balance Cu

【0008】また、上記のMoまたはWの多孔質焼結体
が、平均粒径0.5〜10μmのMoまたはWの1次粒
子粉末を還元性ガス雰囲気中、温度1000〜2000
℃で加熱して得たものである(請求項3)ことを特徴と
する。
Further, the above-mentioned porous sintered body of Mo or W
Are primary particles of Mo or W having an average particle size of 0.5 to 10 μm.
Powder in a reducing gas atmosphere at a temperature of 1000 to 2000
It is obtained by heating at a temperature of ° C. (Claim 3) .

【0009】本発明で得られる焼結合金のMo相または
W相の断面組織は、焼結フィルター材料の断面のように
一次粒子が焼結凝集した多孔質状の断面組織(海綿状断
面組織)の粉末粒子がブリッジ状に集合した組織であっ
て、CuまたはCu合金は、その含有量および圧粉体の
密度に応じて、MoまたはW粉末粒子の周囲、粉末粒子
間の気孔および粉末粒子中の気孔の一部か全部に充填さ
れた状態で存在する。焼結合金中の気孔は、殆どない状
態か、または30体積%以下である。
The cross-sectional structure of the Mo phase or W phase of the sintered alloy obtained in the present invention is similar to that of the cross section of the sintered filter material.
A structure in which powder particles of a porous cross-sectional structure (sponge-like cross-sectional structure) in which primary particles are sintered and aggregated are aggregated in a bridge shape, and Cu or Cu alloy depends on its content and the density of the compact. Therefore, it exists around the Mo or W powder particles, the pores between the powder particles, and some or all of the pores in the powder particles . Pores in the sintered alloy are almost non-existent or less than 30% by volume.

【0010】この場合、Mo、Wともに熱膨張係数は同
程度であるが、Wは比較的安価であり比重が高いこと、
Moは比較的高価で比重が低いこと、Cuに比べCu合
金は融点が低く耐蝕性があり熱伝導率が低いこと、等を
考慮し、また、必要とする熱膨張係数、コストによって
WかMoの選択、CuまたはCu合金の含有量が適宜決
定される。
In this case, both Mo and W have the same thermal expansion coefficient, but W is relatively inexpensive and has a high specific gravity.
Considering that Mo is relatively expensive and has a low specific gravity, and that the Cu alloy has a lower melting point and lower corrosion resistance and lower thermal conductivity than Cu, and that W or Mo depends on the required thermal expansion coefficient and cost. And the content of Cu or Cu alloy are appropriately determined.

【0011】焼結合金の製造に用いるMo粉またはW粉
は、例えば、従来から接点材料などで用いられている平
均粒径0.5〜10μmの1次粒子粉末を還元性ガス雰
囲気中で温度1000〜2000℃で加熱して得られる
海綿状焼結体を粉砕して得た焼結粉末であって、Moま
たはWの1次粒子は粉末焼結温度が高いほど成長して大
きくなっており、粉砕された粉末の粒径が40〜300
μmで多孔質であり、粉末表面は凹凸になっているもの
である。
The Mo powder or the W powder used in the production of a sintered alloy is prepared, for example, by mixing primary particles having an average particle size of 0.5 to 10 μm conventionally used as a contact material or the like in a reducing gas atmosphere. A sintered powder obtained by pulverizing a spongy sintered body obtained by heating at 1000 to 2000 ° C., wherein primary particles of Mo or W grow and grow as the powder sintering temperature increases. The particle size of the pulverized powder is 40 to 300
It is porous at μm, and the powder surface is uneven.

【0012】前記したMoまたはW焼結粉末を製造する
場合における焼結温度の影響は次のようになる。焼結温
度は1000℃未満であると、粉砕したとき微粉が多量
に生じ、焼結凝集粉が効率よく得られなく、また、圧粉
成形したとき、焼結凝集が崩壊し、液相焼結状態が従
来と同様になる。一方、2000℃を超える温度では、
粒子の粗大化および閉鎖気孔が多くなり、焼結コストが
高くなると共に粉砕が困難になり、しかも焼結合金の密
度が低くなるので好ましくない。したがって、焼結温度
としては1000℃〜2000℃の範囲に設定すること
がより好ましいものとなる。
The influence of the sintering temperature in producing the above-mentioned Mo or W sintered powder is as follows. When the sintering temperature is less than 1000 ° C., a large amount of generated fine powder when pulverized, sinter agglomeration powder not be obtained efficiently, also when the compacted, sintered agglomerated powder collapses, the liquid phase sintering The connection state becomes the same as the conventional one. On the other hand, at temperatures exceeding 2000 ° C,
It is not preferable because the coarsening of the particles and the number of closed pores increase, the sintering cost increases, the pulverization becomes difficult, and the density of the sintered alloy decreases. Therefore, it is more preferable to set the sintering temperature in the range of 1000 ° C to 2000 ° C.

【0013】[0013]

【作用】以上の構成において、WおよびMoは、ほぼ同
じ熱膨張係数の低熱膨張金属である。MoはWより比重
が低いので、軽量を必要とする場合に適している。W粉
またはMoが従来のように微粒であると、液相焼結中
に粒子が液相と共に移動できる状態にあるから、変形し
やすく焼結寸法変化量および寸法ばらつきが大きいが、
本発明製造方法のように焼結されたスケルトン状の粉
を用いれば、スケルトン状の粉末の圧粉体はブリッジ状
に骨格を形成しているから、周囲に液相が発生しても移
動し難く、変形が少なくなる。また、焼結寸法変化率
は、W粉またはMo粉の製造における焼結温度が高いほ
ど小さくなり、寸法変化のばらつきも同様に少なくな
る。
In the above construction, W and Mo are low thermal expansion metals having substantially the same thermal expansion coefficient. Mo has a lower specific gravity than W, and thus is suitable for a case where light weight is required. If the W powder or the Mo powder is fine as in the past, the particles are in a state where they can move together with the liquid phase during the liquid phase sintering, so that they are easily deformed and the sintering dimensional change and dimensional variation are large.
With the sintered skeleton-like powder powder <br/> as in the present invention production process, because the green compact of the skeleton-like powder forms a skeleton like a bridge, a liquid phase around occurs Even if it is difficult to move, deformation is reduced. Further, the sintering dimensional change rate becomes smaller as the sintering temperature in the production of W powder or Mo powder becomes higher, and the variation in dimensional change also becomes smaller.

【0014】CuまたはCu合金は結合材料であると共
に熱膨張率調整材料として作用する。この場合、Cuま
たはCu合金の含有量が増加するに伴って熱膨張係数は
関数的に高くなる。また、一般的にはCuに対しCu合
金の方が耐蝕性がよく、焼結温度も低いので製造コスト
の点においても好ましい。
[0014] Cu or a Cu alloy is a bonding material and acts as a thermal expansion coefficient adjusting material. In this case, the coefficient of thermal expansion functionally increases as the content of Cu or Cu alloy increases. In general, Cu alloys are better than Cu alloys in terms of corrosion resistance and sintering temperature.

【0015】Cu−Sn合金は、Sn含有量が0.5%
未満の場合は耐蝕性および機械強度は純Cuと殆ど同じ
で、9%を越えるとδ相の生成により機械強度が低下
し、切削性が悪くなるので、Snは0.5〜9%である
ことが好ましい。
The Cu—Sn alloy has a Sn content of 0.5%
If it is less than 10%, the corrosion resistance and mechanical strength are almost the same as pure Cu. If it exceeds 9%, the mechanical strength decreases due to the formation of the δ phase and the machinability deteriorates, so Sn is 0.5 to 9%. Is preferred.

【0016】PはCu−Sn合金の耐蝕性および機械強
度を改善する。Pの含有量が0.03%未満ではその効
果が認められず、0.5%を越えるとPとCuの金属間
化合物を生成して機械強度および切削性を低下するの
で、P含有量は0.03〜0.5%であることが好まし
い。
P improves the corrosion resistance and mechanical strength of the Cu—Sn alloy. If the content of P is less than 0.03%, the effect is not recognized, and if it exceeds 0.5%, an intermetallic compound of P and Cu is generated to lower the mechanical strength and machinability. It is preferably 0.03 to 0.5%.

【0017】Siは、Cu−Sn合金の耐蝕性および機
械強度を向上する。Siの含有量1%未満ではその効果
が認めらず、3%を越えると機械強度および切削性を低
下し、MoまたはWとの濡れ性が悪くなって気孔への含
浸または被覆が不十分になるので、Si含有量は1〜3
%であることが好ましい。
[0017] Si improves the corrosion resistance and mechanical strength of the Cu-Sn alloy. If the content of Si is less than 1%, the effect is not recognized. If the content exceeds 3%, mechanical strength and machinability are reduced, wettability with Mo or W is deteriorated, and impregnation or coating of pores is insufficient. Therefore, the Si content is 1 to 3
%.

【0018】Cu−Al合金も同様であるが、Al含有
量が5%未満では耐蝕性および機械強度の改善効果が認
めらず、11%を越えると機械強度および加工性が低下
することから、Al含有量は5〜11%であることが好
ましい。Cu−Zn合金も同様に、Zn含有量が1%未
満では機械強度および耐蝕性の向上が認められず、50
%を越えると金属間化合物が生成して機械強度および切
削性が低下するため、Zn含有量は1〜50%とする。
加工性と耐蝕性とを考慮すると1〜43%が好ましい。
The same applies to Cu-Al alloys. However, if the Al content is less than 5%, no improvement in corrosion resistance and mechanical strength is observed, and if it exceeds 11%, the mechanical strength and workability decrease. The Al content is preferably 5 to 11%. Similarly, for a Cu—Zn alloy, if the Zn content is less than 1%, no improvement in mechanical strength and corrosion resistance is observed, and
%, The intermetallic compound is formed and the mechanical strength and machinability decrease, so the Zn content is set to 1 to 50%.
In consideration of workability and corrosion resistance, 1 to 43% is preferable.

【0019】Cu−Zn合金中のSnは、脱亜鉛腐蝕や
応力腐蝕割れを改善し、耐蝕性および機械強度を向上す
る。Sn含有量が0.5%未満では効果が少なく、9%
を越えると合金を著しく脆くするので、0.5〜9%で
あることが好ましい。Cu−Zn合金のZn含有量が3
0%以上の合金では、固溶限界を超えたSnが析出し材
料強度を低下するので、Sn含有量は1〜2%が好まし
い。
Sn in the Cu—Zn alloy improves dezincification corrosion and stress corrosion cracking, and improves corrosion resistance and mechanical strength. If the Sn content is less than 0.5%, the effect is small, and 9%
Exceeds 0.5%, the alloy becomes extremely brittle. Therefore, the content is preferably 0.5 to 9%. The Zn content of the Cu—Zn alloy is 3
In an alloy of 0% or more, Sn exceeding the solid solution limit precipitates and the material strength is reduced, so the Sn content is preferably 1 to 2%.

【0020】AlもSnと同様にCu−Zn合金の耐蝕
性および機械強度を改善するが、0.1%未満ではその
効果が少なく、7.5%より多くなると材料が脆くなり
加工性が悪くなるので、Al含有量は0.1〜3%が好
ましい。
Al improves the corrosion resistance and mechanical strength of the Cu—Zn alloy similarly to Sn, but if less than 0.1%, the effect is small, and if more than 7.5%, the material becomes brittle and the workability is poor. Therefore, the Al content is preferably 0.1 to 3%.

【0021】焼結合金のCuまたはCu合金の含有量
は、2%より少ないとMoまたはWの粒子を被覆する機
能が少なくなり耐蝕性が不十分になるほか、材料強度が
低く、ねじ加工などを行うとねじ山が欠け易くなる。含
有量が増加するに伴いこれらが改善されるが、熱膨張係
数が大きくなり、整合する相手部材がステンレス鋼やセ
ラミックス材料であることを考慮して熱膨張係数12×
10−6/℃未満を目標とし、また、CuまたはCu合
金の含有量が多くなると、焼結寸法変化のばらつきが大
きくなるため、50%以下の含有量であることが好まし
い。
If the content of Cu or Cu alloy in the sintered alloy is less than 2%, the function of coating the particles of Mo or W is reduced and the corrosion resistance is insufficient, and the material strength is low and the thread processing is difficult. When doing so, the thread is likely to be chipped. These are improved as the content increases, but the coefficient of thermal expansion increases, and the coefficient of thermal expansion is 12 × considering that the mating member to be matched is stainless steel or a ceramic material.
The target is less than 10 −6 / ° C., and when the content of Cu or Cu alloy increases, the variation in sintering dimensional change increases. Therefore, the content is preferably 50% or less.

【0022】CuまたはCu合金は焼結中に溶融し、W
またはMo粉末の表面および粉末中の気孔表面を覆う。
CuまたはCu合金の含有量が多くなると共にWまたは
Mo粉末粒子内および粉末間の気孔に充填される。Wま
たはMoの表面をCuまたはCu合金で被覆した状態に
なり、焼結合金の耐蝕性が良好となる。また、本発明の
焼結合金のWまたはMoは、その粉末の粒径は40〜3
00μmであるけれども、粉末を構成する一次粒子は比
較的細かく、スケルトン状に凝集した状態で通気孔を有
しているので、合金を切削や研磨した場合、表面に露出
するWまたはMoの粒子は小さく、また、気孔内にある
CuまたはCu合金が塑性流動してWまたはMo表面を
覆うので、従来の微粉WまたはMoを用いた合金と同様
に加工面の耐蝕性にも優れている。
The Cu or Cu alloy melts during sintering and W
Alternatively, it covers the surface of the Mo powder and the pore surface in the powder.
As the content of Cu or Cu alloy increases, pores in the W or Mo powder particles and between the powders are filled. The surface of W or Mo is coated with Cu or a Cu alloy, and the corrosion resistance of the sintered alloy is improved. Further, W or Mo of the sintered alloy of the present invention has a particle diameter of 40 to 3
Although it is 00 μm, the primary particles constituting the powder are relatively fine, and have air holes in a state of being aggregated in a skeleton shape. Therefore, when the alloy is cut or polished, W or Mo particles exposed on the surface are Since Cu or Cu alloy in the pores is small and plastically flows and covers the W or Mo surface, the corrosion resistance of the processed surface is excellent similarly to the alloy using conventional fine powder W or Mo.

【0023】焼結合金中に気孔がない場合は、Moまた
はWと、CuまたはCu合金との含有率により熱膨張係
数が決定される。焼結合金の気孔率が10体積%程度ま
では気孔がない焼結合金の熱膨張係数と同様であるが、
それに比べて気孔率が20%では約8%、気孔率が30
%では約17%熱膨張係数が少なくなり、焼結合金の気
孔率は焼結合金の熱膨張係数を制御する要因の一つであ
る。但し、気孔率が30%を越えるようになると強度が
低くなるので、強度の必要な部品には好ましくない。ま
た、気孔率が多い合金は軽量でもある。したがって、気
孔率としては20〜30%であることが好ましい。
If there are no pores in the sintered alloy, the coefficient of thermal expansion is determined by the content of Mo or W and Cu or Cu alloy. The porosity of the sintered alloy is similar to the coefficient of thermal expansion of a sintered alloy having no porosity up to about 10% by volume,
On the other hand, when the porosity is 20%, about 8% and the porosity is 30%.
%, The coefficient of thermal expansion is reduced by about 17%, and the porosity of the sintered alloy is one of the factors controlling the coefficient of thermal expansion of the sintered alloy. However, if the porosity exceeds 30%, the strength becomes low, which is not preferable for a component requiring strength. Alloys with high porosity are also lightweight. Therefore, the porosity is preferably 20 to 30%.

【0024】[0024]

【実施例】以下、実施例と比較例により本発明を説明す
る。 (実施例1) 下記のMo粉を準備した。平均粒径が2〜5μmのMo
粉末を水素雰囲気中で各温度で焼結した後、これを粉砕
して60メッシュ篩を通過した粉末(250μm以下)
A〜C粉、およびD粉、E粉である。 A粉:焼結温度1000℃ B粉:焼結温度1100℃ C粉:焼結温度1800℃ D粉:最大粒径10μm以下で平均粒径が6μmの市販
のMo粉 E粉:粉末粒径が60〜250μmの範囲にある気孔が
ない市販のMo粉末 これらのMo粉末に、電解Cu粉を10重量%混合した
粉末を成形圧力7ton/cmで圧縮粉成形した後、水
素ガス雰囲気中で温度1150℃で焼結し、焼結寸法変
化率および寸法変化量のばらつき(3σ)、耐蝕性、加
工性、および熱膨張係数を測定した。
The present invention will be described below with reference to examples and comparative examples. (Example 1) The following Mo powder was prepared. Mo having an average particle size of 2 to 5 μm
After sintering the powder at various temperatures in a hydrogen atmosphere, the powder is pulverized and passed through a 60 mesh sieve (250 μm or less)
AC powder, D powder, and E powder. A powder: sintering temperature 1000 ° C B powder: sintering temperature 1100 ° C C powder: sintering temperature 1800 ° C D powder: commercially available Mo powder having a maximum particle diameter of 10 μm or less and an average particle diameter of 6 μm E powder: powder particle diameter A commercially available Mo powder having no pores in the range of 60 to 250 μm. A powder obtained by mixing 10% by weight of electrolytic Cu powder with these Mo powders is subjected to compaction molding at a molding pressure of 7 ton / cm 2 , and then heated in a hydrogen gas atmosphere. After sintering at 1150 ° C., the dimensional change in sintering and variation in dimensional change (3σ), corrosion resistance, workability, and coefficient of thermal expansion were measured.

【0025】耐蝕性試験は、表面を研磨した試料を温度
80℃で相対湿度90%の環境に96時間放置した後、
各試料に変色があるか否かにより評価した。加工性は、
ドリル孔をあけた後、ねじ切りを行って、ねじ山の状態
および欠けの有無により評価した。表1にその結果を示
す。表1中、○印は良好、×印は欠点が認められたもの
である。
In the corrosion resistance test, the surface-polished sample was left in an environment at a temperature of 80 ° C. and a relative humidity of 90% for 96 hours.
Each sample was evaluated for discoloration. Workability is
After drilling a hole, the thread was cut and evaluated based on the condition of the thread and the presence or absence of chipping. Table 1 shows the results. In Table 1, the mark 良好 indicates good, and the mark X indicates defect.

【0026】本発明に係る試料1〜3は、焼結寸法変化
率が少ないことが判る。また、寸法のばらつきも際だっ
て少ないことが判る。耐蝕性および加工性は、Mo粒子
が粗い試料5が著く劣っている。また、図1は、表1の
試料2(MoがB粉を使用)と、試料4(粉末粒子が細
かなMo粉を使用)の焼結体断面組織を模写した図面で
ある。同図において、白い領域はMoで、黒の領域はC
uおよび僅かの気孔が含まれる。図1の左側の本材料は
Moの一次粒子が比較的大きく、それが焼結凝集した粉
末の内部に気孔があり、気孔内にCuが充填されてい
る。Mo粉末の間の気孔に充填された黒の領域は比較的
大きい。Mo粉末がブリッジ状に積み重なった状態であ
り、Cuが液相になったとき、Mo粉末粒子が移動しに
くいことが判る。一方、図1の右側の従来合金は、Mo
およびCuが細かく分散した組織を呈している。Mo粉
末粒子がもともと微細だったものであり、液相焼結中に
CuおよびMoが移動して気孔を減少させた結果、寸法
変化が大きくなっている。
Samples 1 to 3 according to the present invention have a small sintering dimensional change rate. Also, it can be seen that the dimensional variation is remarkably small. The corrosion resistance and the workability of Sample 5 having a coarse Mo particle were remarkably inferior. FIG. 1 is a drawing in which the cross-sectional structures of the sintered bodies of Sample 2 (Mo used B powder) and Sample 4 (Mo powder used as fine powder particles) of Table 1 are replicated. In the figure, the white area is Mo and the black area is C
u and a few pores. In the present material on the left side of FIG. 1, the primary particles of Mo are relatively large, and there are pores in the powder obtained by sintering and agglomeration, and the pores are filled with Cu. The black area filling the pores between the Mo powders is relatively large. It is understood that the Mo powder is in a state of being stacked in a bridge shape, and that when the Cu becomes a liquid phase, the Mo powder particles are difficult to move. On the other hand, the conventional alloy on the right side of FIG.
And Cu have a finely dispersed structure. Mo powder particles were originally fine, and Cu and Mo moved during liquid phase sintering to reduce pores, resulting in a large dimensional change.

【0027】[0027]

【表1】 なお、熱膨張係数の単位は(×10−6/℃)である。[Table 1] The unit of the coefficient of thermal expansion is (× 10 −6 / ° C.).

【0028】(実施例2) Mo粉は前記のB粉を用い、電解Cu粉を10重量%混
合し、その混合粉を成形圧力を変えて圧粉成形し、水素
ガス雰囲気中で温度1150℃で焼結を行い、気孔率
(密度比)の異なる試料(No6,7,8,9,10,
11)を作成した。気孔率の最も少ない試料は、加圧焼
結したものである。これらの試料の熱膨張係数の測定結
果を表2に示す。
(Example 2) As the Mo powder, the above-mentioned B powder was mixed with 10% by weight of electrolytic Cu powder, and the mixed powder was compacted at a different molding pressure to a temperature of 1150 ° C in a hydrogen gas atmosphere. And sintering, samples having different porosity (density ratio) (No. 6, 7, 8, 9, 10,
11) was created. The sample with the lowest porosity was pressure sintered. Table 2 shows the measurement results of the thermal expansion coefficients of these samples.

【0029】[0029]

【表2】 [Table 2]

【0030】表2から分かるように、気孔率が15%で
は僅かに熱膨張係数が低くなり、気孔率30%では気孔
率1%のものに対し約17%熱膨張係数が低くなってい
る。なお、表2への記載を省いているが、気孔率が高い
ものは、加工性が比較して劣っており、強度の必要な用
途、ねじ加工を必要とする用途には好ましい状態ではな
い。
As can be seen from Table 2, when the porosity is 15%, the coefficient of thermal expansion is slightly lower, and when the porosity is 30%, the coefficient of thermal expansion is about 17% lower than that when the porosity is 1%. Although not shown in Table 2, those having a high porosity are inferior in workability and are not in a preferable state for applications requiring strength and applications requiring threading.

【0031】(実施例3) Mo粉は前記のB粉を用い、Cu合金粉を10重量%混
合した粉末を用い、同様に成形、焼結した試料を作成
し、前記と同様に各性状を測定した。用いたCu合金
は、 (1)Cu−0.5%Sn合金粉、 (2)Cu−8%Sn−0.25%P合金粉、 (3)Cu−1%Sn−3%Si合金粉、 (4)Cu−7%Al合金粉、 (5)Cu−1%Zn合金粉、 (6)Cu−30%Zn−1%Sn合金粉、 (7)Cu−20%Zn−2%Al合金粉である。 また、焼結温度は、前記(1)〜(5)の合金粉を用い
たものは1130℃であり、(6)のものは1020
℃、(7)ものは1070℃で行った。
(Example 3) As the Mo powder, the above-mentioned B powder was used, and a powder obtained by mixing and adding 10% by weight of a Cu alloy powder was used. It was measured. The Cu alloys used were: (1) Cu-0.5% Sn alloy powder, (2) Cu-8% Sn-0.25% P alloy powder, (3) Cu-1% Sn-3% Si alloy powder (4) Cu-7% Al alloy powder, (5) Cu-1% Zn alloy powder, (6) Cu-30% Zn-1% Sn alloy powder, (7) Cu-20% Zn-2% Al Alloy powder. The sintering temperature was 1130 ° C. using the alloy powders of (1) to (5), and 1020 ° C. for (6).
° C, (7) was performed at 1070 ° C.

【0032】物性測定から、寸法変化率および寸法ばら
つき共に、Cu−Al系合金を用いたものは寸法変化率
が1.5%程度、寸法ばらつきが20μm程度を示し、
純Cuを用いた合金(電解Cu粉を用いた実施例1−試
料No2の合金)よりやや大きい値を示していたが、他
のCu合金では純Cuの場合と同程度であった。熱膨張
係数は、5.7〜6.5×10−6/℃の範囲にあり、
純Cuを用いた合金とほぼ同じであった。耐蝕性および
加工性は、Cu合金を用いた方が純Cuものより優れ
いた。
From the measurement of the physical properties, both the dimensional change rate and the dimensional variation show that the one using the Cu—Al alloy has a dimensional change rate of about 1.5% and a dimensional variation of about 20 μm.
Alloy using pure Cu (Example 1-trial using electrolytic Cu powder)
(Alloy of material No. 2), but the values of other Cu alloys were almost the same as those of pure Cu. The coefficient of thermal expansion is in the range of 5.7 to 6.5 × 10 −6 / ° C.
It was almost the same as the alloy using pure Cu. Corrosion resistance and workability, superior to people using Cu alloy is pure Cu
I was

【0033】(実施例4) Mo粉は前記C粉を用い、電解Cu粉を1〜60%の範
囲の各種組成の混合粉を用い、実施例1と同様に試料を
作成して各種性状を測定した。焼結寸法変化率の平均は
Cu含有量によって大差なく0.2〜0.4%であった
が、寸法変化量のばらつきは、Cu含有量1〜10%で
は4μm、Cu含有量30%で10μm、Cu含有量5
0%で50μm、Cu含有量60%では90μmであ
り、Cu含有量が30%を越えるとばらつきが多くなっ
ており、熱膨張係数が約8×10−6/℃以上の焼結合
金は、高寸法精度の焼結体が得られ難いことが判明し
た。
(Example 4) As the Mo powder, the above-mentioned C powder was used, and electrolytic Cu powder was used as a mixed powder having various compositions in the range of 1 to 60%. It was measured. The average of the sintering dimensional change was 0.2 to 0.4% without much difference depending on the Cu content, but the variation of the dimensional change was 4 μm for the Cu content of 1 to 10% and 30% for the Cu content. 10 μm, Cu content 5
It is 50 μm at 0% and 90 μm at 60% Cu content, and the variation increases when the Cu content exceeds 30%, and the sintered alloy having a coefficient of thermal expansion of about 8 × 10 −6 / ° C. or more is: It turned out that it was difficult to obtain a sintered body with high dimensional accuracy.

【0034】また、耐蝕性および加工性とも、1%Cu
の試料は劣っているが、その他のものは欠点は認められ
なかった。熱膨張係数は、1〜2%Cuの焼結体が5.
3×10−6/℃、60%Cuの焼結体が12.0×1
−6/℃であり、Cu含有量と熱膨張係数との関係
は、この2点を結ぶ直線で表すことができる。
Further, both the corrosion resistance and the workability are 1% Cu
Samples were inferior, but no other defects were observed. The coefficient of thermal expansion is 5.
3 × 10 −6 / ° C., 60% Cu sintered body is 12.0 × 1
0 −6 / ° C., and the relationship between the Cu content and the coefficient of thermal expansion can be represented by a straight line connecting these two points.

【0035】(実施例5) なお、Moに代えて、各種のWを適用した試験を行った
結果は、前記の実施例で説明したと同様な性質を示し
た。熱膨張係数はWを用いた方が僅かに低い値を示し
た。
Example 5 The results of a test using various types of W instead of Mo showed the same properties as those described in the above example. The coefficient of thermal expansion showed a slightly lower value when W was used.

【0036】[0036]

【発明の効果】以上説明したように、この発明に係る
熱膨張焼結合金の製造方法は、Mo粉またはW粉をスケ
ルトン状の多孔質粉末を用い、CuまたはCu合金によ
り焼結したものであるから、耐蝕性および切削加工性に
優れ、組成および気孔率を調整することにより所望する
熱膨張係数にできるほか、特にこの発明で得られる合金
は焼結寸法変化率および寸法ばらつきが少ないので、複
雑形状部品を粉末成形により造形し、切削加工を少なく
して、製造することができるので、効率よく安価に低熱
膨張部品を製作することができる。
As described in the foregoing, the production method of low <br/> thermal expansion sintered alloy according to the present invention, using the skeleton-like porous powder Mo powder or W powder, the Cu or Cu alloy since it is obtained by sintering, excellent corrosion resistance and machinability, in addition to be in thermal expansion coefficient is desired by adjusting the composition and porosity, particularly the alloy obtained by this invention is sintered dimensional change and dimensional Since there is little variation, it is possible to form a complicated-shaped part by powder molding and to reduce the number of cutting processes, so that a low-thermal-expansion part can be manufactured efficiently and inexpensively.

【図面の簡単な説明】[Brief description of the drawings]

【図1】発明合金と従来合金の断面組織を模写した図面
である。
FIG. 1 is a drawing simulating the sectional structures of an inventive alloy and a conventional alloy.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B22F 1/00 C22C 1/04 C22C 27/04 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) B22F 1/00 C22C 1/04 C22C 27/04

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 MoまたはWの多孔質焼結体を粉砕して
作られ、粒径が40〜300μmで粉末内に通気孔を有
するスケルトン状のMo粉またはW粉と、Cu粉または
下記のイ〜トのいずれかのCu合金粉もしくはそのCu
合金組成を構成する金属粉末との混合粉を圧粉し、Cu
またはCu合金の融点以上で加熱し液相焼結することを
特徴とする低熱膨張焼結合金の製造方法。 (イ)0.5〜9%Sn、残部Cu (ロ)0.5〜9%Sn、0.03〜0.5%P、残部
Cu (ハ)0.5〜9%Sn、1〜3%Si、残部Cu (ニ)5〜11%Al、残部Cu (ホ)1〜50%Zn、残部Cu (ヘ)1〜50%Zn、0.5〜9%Sn、残部Cu (ト)1〜50%Zn、1〜3%Al、残部Cu
1. A skeleton-like Mo powder or W powder having a particle diameter of 40 to 300 μm and having air holes in the powder, made by pulverizing a porous sintered body of Mo or W, Cu powder or the following Any of Cu alloy powder or Cu
Compress the mixed powder with the metal powder constituting the alloy composition,
Alternatively, a method for producing a low-thermal-expansion sintered alloy, comprising heating at a temperature equal to or higher than the melting point of a Cu alloy and performing liquid phase sintering. (B) 0.5 to 9% Sn, balance Cu (b) 0.5 to 9% Sn, 0.03 to 0.5% P, balance Cu (c) 0.5 to 9% Sn, 1 to 3 % Si, balance Cu (d) 5 to 11% Al, balance Cu (e) 1 to 50% Zn, balance Cu (f) 1 to 50% Zn, 0.5 to 9% Sn, balance Cu (g) 1 -50% Zn, 1-3% Al, balance Cu
【請求項2】 得られる焼結合金の気孔率が20〜30
%(密度比70〜80%)であることを特徴とする請求
項1に記載の低熱膨張焼結合金の製造方法
2. The porosity of the obtained sintered alloy is 20 to 30.
% (Density ratio: 70 to 80%). The method for producing a low thermal expansion sintered alloy according to claim 1, wherein
【請求項3】 前記MoまたはWの多孔質焼結体を得る
にあたり、平均粒径0.5〜10μmのMoまたはWの
1次粒子粉末を還元性ガス雰囲気中、温度1000〜2
000℃で加熱して製造することを特徴とする請求項1
に記載の低熱膨張焼結合金の製造方法。
3. A porous sintered body of Mo or W is obtained.
In the case of Mo or W having an average particle size of 0.5 to 10 μm
The primary particle powder is placed in a reducing gas atmosphere at a temperature of 1000-2.
2. A method of manufacturing by heating at 000.degree.
3. The method for producing a low thermal expansion sintered alloy according to item 1.
JP01744095A 1995-01-10 1995-01-10 Manufacturing method of low thermal expansion sintered alloy Expired - Fee Related JP3358685B2 (en)

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