JP3361891B2 - Assembly method of multi-stage voltage doubler rectifier circuit - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling a multi-stage voltage doubler rectifier circuit, and more particularly to a multi-stage voltage doubler used in a DC high voltage generator of about 20 kV to 30 kV used for an image intensifier tube or the like. The present invention relates to a method of assembling a rectifier circuit.

[0002]

2. Description of the Related Art A DC high voltage generator of about 20 kV to 30 kV used for an image intensifier tube or the like has a high voltage but almost no current, and therefore has a circuit configuration of
It is configured to rectify a high frequency of 20kHz to 50kHz with a multistage voltage doubler rectifier circuit to make it compact and lightweight. The high-voltage components are made compact and lightweight by molding them with synthetic resin insulation. With such a configuration, the size and weight are reduced to the extent that it can be directly attached to a tube.

The preferred conditions for this type of multi-stage voltage doubler rectifier circuit are first to maintain the insulation creepage distance and to ensure the necessary insulation strength, the thickness of the insulation layer when molding with a synthetic resin material. It is necessary to satisfy the two conditions of keeping almost uniform and reducing the outer peripheral volume of the finished circuit.

As a manufacturing method for this, Japanese Patent Publication No. 55-151
Japanese Patent Laid-Open No. 19 discloses a method of manufacturing a resin-molded electric device. According to the present invention, a step of fitting and holding a relay metal body having an opening in each of the holes of a jig having a plurality of holes formed at predetermined positions, and a predetermined number of lead wires of a plurality of electric components are held. The step of inserting the product into the opening of the relay metal body and arranging a required circuit, and the molten solder is poured into the opening of each relay metal body into which the lead wire of the electric component is inserted, and each of the electric components is attached. A step of connecting the required circuit through the relay metal body, and separating each of the electric components connected to the required circuit from the jig by detaching the relay metal body from the hole of the jig. There has been proposed a method of manufacturing a resin-molded electric device, which is characterized by including four molding steps.

This manufacturing method has the same good workability as that of the method using a printed circuit board, but there is no material that supports the constituent parts, so that there are no objects that cause insulation problems in the subsequent resin molding process. There is an advantage. However, this manufacturing method does not consider reducing the finished outer peripheral volume.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide an assembling method for a multi-stage voltage doubler rectifier circuit which can reduce the occupied outer peripheral volume with a small number of steps.

[0007]

The present invention proposes the following means in order to solve the above problems. Two sets of capacitor groups configured by serially connecting a plurality of ceramic capacitors having bidirectional lead wires, and a plurality of diodes having a lead wire having a rigidity slightly lower than the rigidity of each lead wire of this capacitor group are connected in series. A multi-stage voltage doubler rectifier circuit in which the diode groups are connected in series and the respective series connection points are alternately and sequentially connected to the respective series connection points of the two capacitor groups. Which comprises the following steps in sequence: (1) This thin film on a jig in which a plurality of thin cylinders having holes at the upper end are arranged in two rows in a substantially straight line at substantially constant intervals. A step of inserting a relay metal body having an opening into a cylindrical hole and storing the same; (2) placing each lead wire of the capacitor group and each lead wire of the diode group in the opening portion of the relay metal body; Insertion (3) Molten solder is poured into the openings of the relay metal bodies in which the lead wires of the capacitor group and the lead wires of the diode group are inserted, and the lead wires are connected to each other. A step of forming a multistage voltage doubler rectifier circuit by connecting through the relay metal body; (4) a step of disconnecting the multistage voltage doubler rectifier circuit from the hole of the jig; The capacitor group is rotated and bent inward with the diode group as the target axis , and the capacitor group
Aligning the lead wires on the same plane, and reducing the cross-sectional area of this multistage voltage doubler rectifier circuit.

Further, in the above assembling method, the step of inserting the relay metal body having the opening portion into the hole of the thin cylinder is omitted, and each lead wire of the capacitor group and each lead of the diode group are directly inserted into the hole of the thin cylinder. It is also possible to insert wires and pour molten solder into them for assembly.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a DC high voltage generator according to the present invention will be described with reference to FIGS. Fig. 1 shows the circuit diagram of a DC high voltage generator with an output of 30 kV.
A high-frequency voltage source 4 with a peak value of 2.5 kV of kHz to 50 kHz is received from the input terminals 3 and 5, and a direct current is generated by a five-stage voltage doubler rectifier circuit consisting of a diode group 11 and capacitor groups 7 and 9.
Generates high voltage of 30kV.

FIG. 2 shows a jig for assembly. This jig 1 is made of thick aluminum, and the upper surface of the jig is made of a thin stainless steel pipe for inserting parts 1a, 1b, 1
c, 1d, 1e, 1f, 1g, 1h, 1j, 1k, 1m, 1n 1p, 1q are planted in two rows at regular intervals.

The parts to be prepared include a capacitor group 7,
9 is a ceramic capacitor, which has a withstand voltage of 9 kV and an electrostatic capacity of 22
At 00PF, the lead wire comes out from almost the center of the disk shape.
The thickness of the insulating layer on the outer periphery of this capacitor is extremely thin. The lead wire is a hard copper wire having a diameter of about 1 mm. Each lead wire of the diode group 11 is a soft copper wire having a diameter of about 0.7 mm. One condition of the present invention is that the stiffness of each lead wire of the diode group 11 is softer than the stiffness of each lead wire of the capacitor groups 7 and 9. The eyelet 3 is made of brass that is well compatible with solder, and has an external dimension that produces appropriate friction with the component insertion post 1a and the like. The inner diameter of the eyelet 3 is set so that the two lead wires of the capacitor groups 7 and 9 and the two lead wires of the diode group 11 can be inserted.

FIG. 3 is a diagram showing a first step of the assembling method of the present invention. Each part insertion post 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1
First, insert eyelet 3 at the upper end of h, 1j, 1k, 1m, 1n 1p, 1q. Then, the capacitor groups 7 and 9 and the diode group 11 are inserted into each eyelet 3 according to the circuit diagram of FIG. Then, the lead wires of the respective parts inserted in the respective eyelets 3 are soldered.

The multi-stage voltage doubler rectifier circuit 4 which has completed the wiring is inserted into the respective component insertion posts 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1j, 1 of the jig 1.
When separated from k, 1m, 1n 1p, 1q, the shape shown in Fig. 4 is obtained. Here, the lead wire protruding from the eyelet 3 is cut.

Next, as shown in FIG. 5, the periphery of the eyelet 3 is rounded by adding soldering so that the sharpness is eliminated. Then, the capacitor groups 7 and 9 are rotated around the diode group 11 in the direction of the arrow in FIG.

[0015] the stiffness of the lead wires of the diode group 11, because softer than the strength of each lead waist capacitor group 7 and 9, bending most lead of the diode group 11, a capacitor group 6 Each lead wire is the same
By arranging them in a plane, the cross-section of the multistage voltage doubler rectifier circuit 4 is elliptical and the outer peripheral volume is small.

[0016] In the above manufacturing method, the soldering of the electric parts is finished in a round shape so that there is no sharpness. In addition, it is necessary to take care so that oil, grease, and moisture do not adhere to the hands of workers in any process, and to perform a cleaning process and a drying process immediately before resin molding.

[0017]

The present invention has the characteristics as described above, and since the assembling method of the present invention has good workability,
It can be assembled with a small number of man-hours, and the solder finish can be made sure and round. Further, the completed multi-stage voltage doubler rectifier circuit can occupy a small area. In addition, the insulation creepage distance can be achieved without using special insulation supports.
Therefore, it is possible to reliably manufacture a small and lightweight high voltage generator at low cost.

[Brief description of drawings]

FIG. 1 shows a circuit diagram of a 30 kV output DC high voltage generator having a multi-stage voltage doubler rectifier circuit.

FIG. 2 shows a jig for assembly.

FIG. 3 shows a first step of the method for assembling the multistage voltage doubler rectifier circuit according to the present invention.

FIG. 4 shows a second step of the method for assembling the multistage voltage doubler rectifier circuit according to the present invention.

FIG. 5 shows a third step of the method for assembling the multistage voltage doubler rectifier circuit according to the present invention.

FIG. 6 shows a fourth step of the method for assembling the multistage voltage doubler rectifier circuit according to the present invention.

[Explanation of symbols]

1 ... Jig 9 ... Capacitor group 2 ... High frequency source 11 ... Diode group 3 ... Input terminal 13 ... Resistor 5 ... Input terminal 7 ... Capacitor group

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H02M 7/10 H02M 7/04

Claims (2)

(57) [Claims] 1. A set of two capacitor groups configured by serially connecting a plurality of ceramic capacitors having bidirectional lead wires, and a plurality of lead wires having a rigidity slightly lower than the rigidity of each lead wire of the capacitor group. And a diode group configured by connecting the diodes in series, the diode groups being connected in series, and the respective series connection points are alternately and sequentially connected to the series connection points of the two capacitor groups. A method for assembling a multi-stage voltage doubler rectifier circuit, which sequentially comprises the following steps: (1) A plurality of thin cylinders having holes at the upper end are arranged in two rows in a substantially straight line at substantially constant intervals. A step of inserting and storing a relay metal body having an opening into the thin cylindrical hole on the tool, (2) connecting each lead wire of the capacitor group and each lead wire of the diode group to the relay metal of a body (3) Pour molten solder into the openings of the relay metal bodies in which the lead wires of the capacitor group and the lead wires of the diode group described above are inserted. A step of forming a multistage voltage doubler rectifier circuit by connecting the lead wires through the relay metal body, and (4) a step of disconnecting the multistage voltage doubler rectifier circuit from the hole of the jig. 5) The two capacitor groups are rotated and bent inward with the diode group as a target axis to bend the two capacitor groups.
Aligning the lead wires on the same plane, and reducing the cross-sectional area of this multistage voltage doubler rectifier circuit. 2. A set of two capacitor groups configured by serially connecting a plurality of ceramic capacitors having bidirectional lead wires, and a plurality of lead wires having a rigidity slightly lower than the rigidity of each lead wire of the capacitor group. And a diode group configured by connecting the diodes in series, the diode groups being connected in series, and the respective series connection points are alternately and sequentially connected to the series connection points of the two capacitor groups. A method for assembling a multi-stage voltage doubler rectifier circuit, which sequentially comprises the following steps: (1) A plurality of thin cylinders having holes at the upper end are arranged in two rows in a substantially straight line at substantially constant intervals. Inserting each lead wire of the capacitor group and each lead wire of the diode group into the hole of the thin cylinder on the tool to arrange the circuit; (2) each lead wire of the capacitor group and the diode; A step of pouring molten solder into the hole of the thin cylinder into which each lead wire of the group is inserted and connecting the lead wires to each other to form a multi-stage voltage doubler rectifier circuit; a step of separating from the hole of the jig, (4) the two sets of the capacitor group bent rotated inward as the target axis the diode group, of the capacitor group
Aligning the lead wires on the same plane, and reducing the cross-sectional area of this multistage voltage doubler rectifier circuit.