JP3362013B2 - High viscosity polyethylene naphthalate resin, method for producing the same, and molded article made therefrom - Google Patents
High viscosity polyethylene naphthalate resin, method for producing the same, and molded article made therefromInfo
- Publication number
- JP3362013B2 JP3362013B2 JP13380099A JP13380099A JP3362013B2 JP 3362013 B2 JP3362013 B2 JP 3362013B2 JP 13380099 A JP13380099 A JP 13380099A JP 13380099 A JP13380099 A JP 13380099A JP 3362013 B2 JP3362013 B2 JP 3362013B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- acid
- temperature
- polyethylene naphthalate
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 title claims description 85
- 239000011347 resin Substances 0.000 title claims description 85
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 title claims description 29
- 239000011112 polyethylene naphthalate Substances 0.000 title claims description 29
- -1 polyethylene naphthalate Polymers 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 58
- 238000006116 polymerization reaction Methods 0.000 claims description 31
- 239000007790 solid phase Substances 0.000 claims description 23
- 239000002253 acid Substances 0.000 claims description 16
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 claims description 13
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 11
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000012046 mixed solvent Substances 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 6
- 238000000113 differential scanning calorimetry Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 18
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 14
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 229940119177 germanium dioxide Drugs 0.000 description 7
- 238000005809 transesterification reaction Methods 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- XQKKWWCELHKGKB-UHFFFAOYSA-L calcium acetate monohydrate Chemical compound O.[Ca+2].CC([O-])=O.CC([O-])=O XQKKWWCELHKGKB-UHFFFAOYSA-L 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000006068 polycondensation reaction Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- GZBUMTPCIKCWFW-UHFFFAOYSA-N triethylcholine Chemical compound CC[N+](CC)(CC)CCO GZBUMTPCIKCWFW-UHFFFAOYSA-N 0.000 description 4
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 229940067460 calcium acetate monohydrate Drugs 0.000 description 3
- ZBYYWKJVSFHYJL-UHFFFAOYSA-L cobalt(2+);diacetate;tetrahydrate Chemical compound O.O.O.O.[Co+2].CC([O-])=O.CC([O-])=O ZBYYWKJVSFHYJL-UHFFFAOYSA-L 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- IWEATXLWFWACOA-UHFFFAOYSA-N 2,6-dimethylnaphthalene-1-carboxylic acid Chemical compound OC(=O)C1=C(C)C=CC2=CC(C)=CC=C21 IWEATXLWFWACOA-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WMRCTEPOPAZMMN-UHFFFAOYSA-N 2-undecylpropanedioic acid Chemical compound CCCCCCCCCCCC(C(O)=O)C(O)=O WMRCTEPOPAZMMN-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- WTKQQTGCQAFYOL-UHFFFAOYSA-N 3,4-dihydro-2h-naphthalene-1,1-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)(C(O)=O)CCCC2=C1 WTKQQTGCQAFYOL-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYUVMLBYMPKZAZ-UHFFFAOYSA-N dimethyl naphthalene-2,6-dicarboxylate Chemical compound C1=C(C(=O)OC)C=CC2=CC(C(=O)OC)=CC=C21 GYUVMLBYMPKZAZ-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【発明の属する技術分野】本発明は、ポリエチレンナフ
タレート(以下PENと略記する。)樹脂に関し、更に
詳しくは、固有粘度が高く、かつ異物の少ない成形品を
得ることができる、ボトルなどの材料として好適なPE
N樹脂とその製造方法およびそれからなる成形品に関す
る。TECHNICAL FIELD The present invention relates to a polyethylene naphthalate (hereinafter abbreviated as PEN) resin, and more specifically, a material such as a bottle, which has a high intrinsic viscosity and is capable of obtaining a molded product with less foreign matter. PE suitable as
The present invention relates to an N resin, a method for producing the N resin, and a molded article made of the same.
【0002】[0002]
【従来技術及び発明が解決しようとする課題】PEN樹
脂は、ポリエチレンテレフタレート(以下PETと略記
する)樹脂に比べて耐熱性、ガスバリアー性、耐薬品性
等の基本物性が優れていることから、ボトル(容器)や
シート、フィルム等の包装材料として有用であり、数多
くの提案が行われている。包装材料の中でも、ジュース
や化粧品等のボトルに使用される樹脂については、商品
価値の点から、異物の少ない樹脂が強く要求されてい
る。PEN樹脂は基本的にPET樹脂の場合と同様の方
法で製造することができ、ボトルのような高い固有粘度
を要求される場合、固相重合を行うことが提案されてい
る。(特開平7−18068号公報、特開平9−778
59号公報、特開平10−218979号公報など)。2. Description of the Related Art PEN resin is superior to polyethylene terephthalate (hereinafter abbreviated as PET) resin in basic physical properties such as heat resistance, gas barrier property and chemical resistance. It is useful as a packaging material for bottles (containers), sheets, films, etc., and many proposals have been made. Among packaging materials, resins used for bottles such as juices and cosmetics are strongly required to have a small amount of foreign matter from the viewpoint of commercial value. The PEN resin can be manufactured basically by the same method as that of the PET resin, and it is proposed to carry out solid phase polymerization when a high intrinsic viscosity such as a bottle is required. (JP-A-7-18068, JP-A-9-778
59, JP-A-10-218979, etc.).
【0003】しかしながら、PEN樹脂の場合、210
℃以上の高温で長時間固相重合すると、樹脂の一部が高
融点化してしまうという問題がある。そのため、固相重
合後の樹脂を溶融、成形すると、高融点化した部分が溶
融せず、異物として成形品に混入してしまう。従って、
ボトルなどの成形品ではその商品価値を大きく落として
しまう。However, in the case of PEN resin, 210
If solid phase polymerization is carried out at a high temperature of ℃ or more for a long time, there is a problem that a part of the resin has a high melting point. Therefore, when the resin after solid-phase polymerization is melted and molded, the part having a high melting point is not melted and is mixed as a foreign matter in the molded product. Therefore,
Molded products such as bottles greatly reduce the product value.
【0004】これを避けるための方法として、溶融重合
で固有粘度を上げる方法や、固相重合を210℃未満の
低温で行う方法があるが、前者の方法では樹脂の粘度が
高くなるため、樹脂を重合釜より排出する際、重合釜に
残る樹脂量が多くなり生産性が低下するばかりか、重合
時間が長くなるため、ポリマーの色調が悪化してしま
う。また、後者の方法では、固相重合に長時間を要し、
生産性が著しく悪くなる。As a method for avoiding this, there is a method of increasing intrinsic viscosity by melt polymerization or a method of carrying out solid phase polymerization at a low temperature of less than 210 ° C. However, the former method increases the viscosity of the resin, When the resin is discharged from the polymerization kettle, not only the amount of resin remaining in the polymerization kettle increases and productivity decreases, but also the polymerization time increases, which deteriorates the color tone of the polymer. In the latter method, solid phase polymerization requires a long time,
Productivity is significantly reduced.
【0005】本発明者らは、高温で固相重合しても、樹
脂の一部が高融点化せず、かつ生産性及び樹脂の色調が
良好なポリエチレンナフタレート樹脂について鋭意検討
した結果、特定の熱的性質、溶解性を備えた樹脂を見出
し、本発明に到達した。The inventors of the present invention have made earnest studies on a polyethylene naphthalate resin which does not have a high melting point in a part of the resin even when it is solid-state polymerized at high temperature, and has good productivity and good color tone of the resin. The present invention has been achieved by finding a resin having the thermal properties and solubility of
【0006】[0006]
【発明の実施の形態】すなわち、本発明は、2,6−ナ
フタレンジカルボン酸を主たる酸成分とし、エチレング
リコールを主たるグリコール成分とし、更に2,6−ナ
フタレンジカルボン酸成分以外の酸成分及び/又はエチ
レングリコール以外のグリコール成分が、0.1mol
%以上2mol%未満共重合されているポリエステルで
あって、固有粘度(IV)が下記式1を満たし、示差走
査熱量計で25℃から10℃/分で昇温したときに最初
に観測される吸熱ピークのピーク温度が245℃以上で
あり、かつフェノール/1,1,2,2−テトラクロロ
エタン=60/40(重量比)の混合溶媒に1g/デシ
リットルの濃度で、130℃で溶解したときに、2時間
以内で溶解することを特徴とするポリエチレンナフタレ
ート樹脂及びその製造方法、更にそれからなる成形物で
ある。
0.65<IV≦1.2 (1)DETAILED DESCRIPTION OF THE INVENTION Namely, the present invention is 2,6-naphthalenedicarboxylic acid as a main acid component and ethylene glycol as a main glycol component, further 2,6 na
Acid component other than phthalenedicarboxylic acid component and / or ethylene
0.1 mol of glycol components other than ren glycol
% Or more and less than 2 mol% of a copolymerized polyester, the intrinsic viscosity (IV) of which satisfies the following formula 1 and is observed first when the temperature is raised from 25 ° C. to 10 ° C./min by a differential scanning calorimeter. When the peak temperature of the endothermic peak is 245 ° C. or higher and the compound is dissolved in a mixed solvent of phenol / 1,1,2,2-tetrachloroethane = 60/40 (weight ratio) at a concentration of 1 g / deciliter at 130 ° C. And a polyethylene naphthalate resin characterized by being dissolved within 2 hours, a method for producing the same, and a molded article comprising the same. 0.65 <IV ≦ 1.2 (1)
【0007】以下に本発明を詳細に説明する。本発明に
おいて「2,6−ナフタレンジカルボン酸」とは2,6
−ナフタレンジカルボン酸及びそのエステル形成性誘導
体(2,6−ナフタレンジカルボン酸ジメチルエステル
等の低級アルキルエステル、フェニルエステル、酸無水
物等)を対象にする。The present invention will be described in detail below. In the present invention, "2,6-naphthalenedicarboxylic acid" means 2,6
-Naphthalenedicarboxylic acid and its ester-forming derivative (lower alkyl ester such as 2,6-naphthalenedicarboxylic acid dimethyl ester, phenyl ester, acid anhydride, etc.) are targeted.
【0008】さらに本発明のPEN樹脂は、IVが0.
65を超え、1.2以下の樹脂である。IV=0.65
以下であると、ボトル等の成形品を製造する際、樹脂が
ドローダウンを起こしたり、成形されたボトルの機械的
強度が低下するなどの問題が生じる。また、IVが1.
2を超えると樹脂の溶融粘度が高くなりすぎて、成形機
に負荷がかかるばかりでなく、生産性が低下してしまい
好ましくない。IVのさらに好ましい範囲としては0.
7以上0.9以下である。Further, the PEN resin of the present invention has an IV of 0.
The resin is more than 65 and 1.2 or less. IV = 0.65
When it is below, when producing a molded product such as a bottle, there arise problems such as a drawdown of the resin and a decrease in mechanical strength of the molded bottle. In addition, IV is 1.
When it exceeds 2, the melt viscosity of the resin becomes too high, which not only imposes a load on the molding machine, but also reduces the productivity, which is not preferable. A more preferable range of IV is 0.
It is 7 or more and 0.9 or less.
【0009】また本発明のPEN樹脂は、示差走査熱量
計で25℃から10℃/分で昇温したときに最初に観測
される吸熱ピークのピーク温度が245℃以上であるも
のである。ここでいう示差走査熱量計で25℃から10
℃/分で昇温したときに最初に観測される吸熱ピークと
は、樹脂の融点あるいは、樹脂を結晶化、固相重合する
ためにその融点未満で加熱した場合、その温度と時間に
応じて樹脂中に生じる構造変化に起因する吸熱ピークで
ある。そして後者の吸熱ピーク温度は樹脂を加熱する際
の温度が高いほど、また加熱時間が長いほど高くなる。
この温度が245℃未満であると、樹脂のIV=0.6
5以上で色調が良好な樹脂とならない。Further, the PEN resin of the present invention has a peak temperature of an endothermic peak which is first observed when the temperature is raised from 25 ° C. to 10 ° C./min by a differential scanning calorimeter, which is 245 ° C. or higher. The differential scanning calorimeter referred to here is from 25 ° C to 10
The endothermic peak observed first when the temperature is raised at ℃ / min is the melting point of the resin, or when the resin is heated below the melting point to crystallize or solid-phase polymerize, it depends on the temperature and time. It is an endothermic peak due to a structural change occurring in the resin. The latter endothermic peak temperature increases as the temperature at which the resin is heated increases and as the heating time increases.
If this temperature is less than 245 ° C., the resin IV = 0.6
When it is 5 or more, the resin does not have a good color tone.
【0010】さらに、本発明のPEN樹脂は、フェノー
ル/1,1,2,2−テトラクロロエタン=60/40
(重量比)の混合溶媒に1g/デシリットルの濃度で、
130℃で溶解したときに、2時間以内で溶解する。こ
の条件で溶解しない場合、その樹脂を溶融、成形する
と、高融点化した部分が溶融せず、異物として成形品に
混入してしまう。Furthermore, the PEN resin of the present invention is phenol / 1,1,2,2-tetrachloroethane = 60/40.
(Weight ratio) in a mixed solvent at a concentration of 1 g / deciliter,
When dissolved at 130 ° C, it dissolves within 2 hours. If the resin is not melted under these conditions, if the resin is melted and molded, the part having a high melting point is not melted and is mixed in the molded product as a foreign matter.
【0011】また、本発明のPEN樹脂には、2,6−
ナフタレンジカルボン酸以外の酸成分及び/又はエチレ
ングリコール以外のグリコール成分は、樹脂に含まれる
全酸成分の合計または全グリコール成分の合計に対し
て、0.1〜10mol%、好ましくは0.1mol%
以上5mol%以下、特に好ましくは0.1mol%以
上2mol%未満共重合されている方が好ましい。0.
1mol%未満の場合は、固有粘度(IV)が0.65
を超え、示差走査熱量計で25℃から10℃/分で昇温
したときに最初に観測される吸熱ピークのピーク温度が
245℃以上の樹脂を製造すると、樹脂の一部が高融点
化してしまい、その樹脂を溶融、成形すると、高融点化
した部分が溶融せず、異物として成形品に混入してしま
う可能性が高くなる。また、10mol%を超えるとポ
リマーの結晶性が低下するため、固相重合が困難とな
り、IVが0.65を超える樹脂を製造することが難し
い。樹脂の結晶性の低下を抑え、またポリマーの融点の
低下を抑えて樹脂の耐熱性を維持する目的から、2,6
−ナフタレンジカルボン酸以外の酸成分及び/又はエチ
レングリコール以外のグリコール成分の共重合比率は、
好ましくは5mol%以下、特に好ましくは2mol%
未満である。The PEN resin of the present invention contains 2,6-
The acid component other than naphthalenedicarboxylic acid and / or the glycol component other than ethylene glycol is 0.1 to 10 mol%, preferably 0.1 mol% with respect to the total of all acid components or the total of glycol components contained in the resin.
It is preferably 5 mol% or less and particularly preferably 0.1 mol% or more and less than 2 mol%. 0.
If it is less than 1 mol%, the intrinsic viscosity (IV) is 0.65.
When a resin having a peak temperature of 245 ° C. or higher of the endothermic peak first observed when the temperature is raised from 25 ° C. by a differential scanning calorimeter at 10 ° C./min, a part of the resin has a high melting point. If the resin is melted and molded, the high melting point portion is not melted and there is a high possibility that it will be mixed into the molded product as a foreign substance. Further, when it exceeds 10 mol%, the crystallinity of the polymer is lowered, so that solid phase polymerization becomes difficult, and it is difficult to produce a resin having an IV of more than 0.65. In order to suppress the deterioration of the crystallinity of the resin and the decrease of the melting point of the polymer to maintain the heat resistance of the resin, 2,6
-The copolymerization ratio of the acid component other than naphthalenedicarboxylic acid and / or the glycol component other than ethylene glycol is
Preferably 5 mol% or less, particularly preferably 2 mol%
Is less than.
【0012】そして、2,6−ナフタレンジカルボン酸
以外の酸成分としては特に限定されないが、例えばシュ
ウ酸、マロン酸、コハク酸、アジピン酸、セバシン酸、
ドデカンジカルボン酸等の脂肪族ジカルボン酸;またテ
レフタル酸、イソフタル酸、4,4′−ジフェニルジカ
ルボン酸、ジフェノキシエタン−4,4′−ジカルボン
酸、ジフェニルスルホン−4,4′一ジカルボン酸、ジ
フェニルエーテル−4,4′−ジカルボン酸などの芳香
族ジカルボン酸;ヘキサヒドロテレフタル酸、デカリン
ジカルボン酸、テトラリンジカルボン酸、1,4−シク
ロヘキサンジカルボン酸などの脂環族ジカルボン酸;ダ
イマー酸、グリコール酸、p−オキシ安息香酸などのオ
キシ酸などが挙げられる。この中でもテレフタル酸、イ
ソフタル酸がコストの面で好ましい。これらの酸成分
は、そのエステル形成性誘導体(ジメチルエステル等の
低級アルキルエステル、フェニルエステル、酸無水物
等)も対象にする。The acid component other than 2,6-naphthalenedicarboxylic acid is not particularly limited, but for example, oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid,
Aliphatic dicarboxylic acids such as dodecanedicarboxylic acid; also terephthalic acid, isophthalic acid, 4,4'-diphenyldicarboxylic acid, diphenoxyethane-4,4'-dicarboxylic acid, diphenylsulfone-4,4'-dicarboxylic acid, diphenyl ether Aromatic dicarboxylic acids such as -4,4'-dicarboxylic acid; alicyclic dicarboxylic acids such as hexahydroterephthalic acid, decalin dicarboxylic acid, tetralin dicarboxylic acid, 1,4-cyclohexanedicarboxylic acid; dimer acid, glycolic acid, p -Oxyacids such as oxybenzoic acid. Among these, terephthalic acid and isophthalic acid are preferable in terms of cost. These acid components are also applicable to ester-forming derivatives thereof (lower alkyl esters such as dimethyl ester, phenyl ester, acid anhydride, etc.).
【0013】また、エチレングリコール以外のグリコー
ル成分としては、酸成分と同様に特に限定されないが、
例えばテトラメチレングリコール、プロピレングリコー
ル、1,3−ブタンジオール、ネオペンチルグリコール
などの脂肪族ジオール;1,4−シクロヘキサンジメタ
ノール、トリシクロデカンジメチロールなどの脂環族ジ
オール;ビスフェノールA、ビスフェノールS、テトラ
ブロモビスフェノールAなどの芳香族ジオール及びこれ
らのエチレンオキサイド付加物、ダイマージオール及び
このエチレンオキサイド付加物などが挙げられる。この
中でもテトラメチレングリコール、ネオペンチルグリコ
ール、1,4−シクロヘキサンジメタノール、ビスフェ
ノールAやビスフェノールS及びこれらのエチレンオキ
サイド付加物が好ましい。The glycol component other than ethylene glycol is not particularly limited in the same manner as the acid component,
Aliphatic diols such as tetramethylene glycol, propylene glycol, 1,3-butanediol, neopentyl glycol; alicyclic diols such as 1,4-cyclohexanedimethanol and tricyclodecanedimethylol; bisphenol A, bisphenol S, Examples thereof include aromatic diols such as tetrabromobisphenol A and ethylene oxide adducts thereof, dimer diols and ethylene oxide adducts thereof. Among these, tetramethylene glycol, neopentyl glycol, 1,4-cyclohexanedimethanol, bisphenol A and bisphenol S, and their ethylene oxide adducts are preferable.
【0014】さらに本発明のPEN樹脂には、必要に応
じて、他の樹脂や、各種添加剤が含有されていてもよ
い。例えば、ポリエチレンテレフタレートなどのポリエ
ステル樹脂や、触媒として用いられる、酢酸カルシウ
ム、酢酸マグネシウム、酢酸マンガン、二酸化ゲルマニ
ウム、三酸化アンチモン、リン酸トリメチルなどの熱安
定剤、ジエチレングリコールなどの副生を防止するため
のヒドロキシテトラエチルアンモニウムなどのアンモニ
ウム塩、成形体の易滑性を向上させるための無機滑剤お
よび有機滑剤や、酸化防止剤、帯電防止剤、耐候剤等が
挙げられる。Further, the PEN resin of the present invention may contain other resins and various additives, if necessary. For example, polyester resins such as polyethylene terephthalate, heat stabilizers such as calcium acetate, magnesium acetate, manganese acetate, germanium dioxide, antimony trioxide, trimethyl phosphate, etc. used as catalysts and for preventing by-products such as diethylene glycol. Examples thereof include ammonium salts such as hydroxytetraethylammonium, inorganic lubricants and organic lubricants for improving the slipperiness of the molded article, antioxidants, antistatic agents, weathering agents and the like.
【0015】本発明のPEN樹脂は、公知のエステル交
換法あるいは直接重合法等の一般的なポリエステルの溶
融重合法を用いて製造することができる。例えば、ジカ
ルボン酸のアルキルエステルとジオールを用いてエステ
ル交換反応、あるいはジカルボン酸とジオールを用いて
エステル化反応を窒素気流下で行い、次いで高温、減圧
下において重縮合させる方法がある。The PEN resin of the present invention can be produced by using a general polyester melt polymerization method such as a known transesterification method or direct polymerization method. For example, there is a method in which an ester exchange reaction is performed using an alkyl ester of a dicarboxylic acid and a diol, or an esterification reaction is performed using a dicarboxylic acid and a diol under a nitrogen stream, and then polycondensation is performed at high temperature and reduced pressure.
【0016】更に本発明の高粘度PEN樹脂を製造する
ためには、溶融重合法により製造されたポリエステルを
結晶化、固相重合する必要がある。結晶化、固相重合の
方法としては一般的なポリエステルの結晶化、固相重合
法が用いられる。例えば、樹脂を150℃〜200℃の
温度に加熱、結晶化した後、その融点より低い温度で減
圧下か窒素気流下で固相重合する方法が挙げられる。但
し、固相重合は、210℃以上かつ12時間以上固相重
合を行うことが必要である。温度が210℃未満である
と、固相重合時間が長くなりすぎ、色調が良好なIV=
0.65を超える高粘度の樹脂を得ることができない。
また固相重合時間が12時間未満であっても色調が良好
なIV=0.65を超えるの高粘度の樹脂を得ることが
できない。Further, in order to produce the high-viscosity PEN resin of the present invention, it is necessary to crystallize and solid-phase polymerize the polyester produced by the melt polymerization method. As the crystallization and solid phase polymerization methods, general polyester crystallization and solid phase polymerization methods are used. For example, a method may be mentioned in which the resin is heated to a temperature of 150 ° C. to 200 ° C. to be crystallized, and then solid phase polymerization is carried out at a temperature lower than the melting point thereof under reduced pressure or a nitrogen stream. However, the solid phase polymerization needs to be performed at 210 ° C. or higher and for 12 hours or longer. If the temperature is lower than 210 ° C., the solid phase polymerization time becomes too long and the color tone is good IV =
A resin having a high viscosity exceeding 0.65 cannot be obtained.
Further, even if the solid-phase polymerization time is less than 12 hours, it is impossible to obtain a high-viscosity resin having a good color tone of IV = 0.65 or more.
【0017】本発明のPEN樹脂から、容器やボトル等
の成形物を得るための方法としては、特に限定があるわ
けではなく、従来公知の方法が用いられる。例えばボト
ルを製造する方法としては、本発明のPEN樹脂を射出
成形機に供給して、プリフォームを成形し、これを加
熱、ブロー成形する方法が挙げられる。容器等の成形品
を製造する方法としては、本発明のPEN樹脂を押し出
し機に供給して、Tダイより押し出すことによりシート
を作製し、このシートを熱成形する方法が挙げられる。The method for obtaining a molded product such as a container or a bottle from the PEN resin of the present invention is not particularly limited, and a conventionally known method can be used. For example, as a method of manufacturing a bottle, a method of supplying the PEN resin of the present invention to an injection molding machine to mold a preform, and heating and blow molding the preform can be mentioned. Examples of the method for producing a molded article such as a container include a method in which the PEN resin of the present invention is supplied to an extruder and extruded through a T die to produce a sheet, and the sheet is thermoformed.
【0018】[0018]
【実施例】以下、実施例にて本発明をさらに詳細に説明
するが、本発明はこれらの実施例に限定されるものでは
ない。測定及び評価方法を以下に示す。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. The measurement and evaluation methods are shown below.
【0019】(1)樹脂溶解性
樹脂を、1g/デシリットルの濃度で、フェノール/
1,1,2,2−テトラクロロエタン=60/40(重
量比)の混合溶媒に130℃で2時間溶解したとき、樹
脂の溶解性を目視にて評価した。
○:溶解、×:未溶解(1) Phenol / resin soluble resin at a concentration of 1 g / deciliter
When dissolved in a mixed solvent of 1,1,2,2-tetrachloroethane = 60/40 (weight ratio) at 130 ° C. for 2 hours, the solubility of the resin was visually evaluated. ○: dissolved, ×: undissolved
【0020】(2)IV
樹脂を、1g/デシリットル、0.6g/デシリット
ル、0.3g/デシリットルの濃度で、それぞれフェノ
ール/1,1,2,2−テトラクロロエタン=60/4
0(重量比)の混合溶媒に溶解し、ウベローデ型粘度計
にて、20℃で、それぞれの濃度(C)における比粘度
(ηSP)を求める。次いで、ηSP/CをCに対してプロ
ットし、得られた直線から濃度ゼロに外挿して求めた。(2) IV resin is phenol / 1,1,2,2-tetrachloroethane = 60/4 at a concentration of 1 g / deciliter, 0.6 g / deciliter and 0.3 g / deciliter, respectively.
It is dissolved in a mixed solvent of 0 (weight ratio), and the specific viscosity (η SP ) at each concentration (C) is determined with an Ubbelohde viscometer at 20 ° C. Then, η SP / C was plotted against C and extrapolated to zero concentration from the obtained straight line to obtain it.
【0021】(3)吸熱ピーク温度
パーキンエルマー社製DSC7に樹脂を約10mg入
れ、昇温速度10℃/分で25℃から昇温したときに最
初に観測されるピーク温度である。(3) Endothermic peak temperature This is the peak temperature observed first when about 10 mg of the resin is put into DSC7 manufactured by Perkin Elmer Co., Ltd. and the temperature is raised from 25 ° C. at a heating rate of 10 ° C./min.
【0022】(4)未溶融物
樹脂を押し出し機に供給して、290℃でTダイより押
し出してシートを作製し、さらにこのシートから熱成形
によりトレイを成形したとき、トレイ底面100cm2
中に含まれる異物の数を目視にて評価した。
○:1個以下、△:2〜5個、×:5個以上(4) The unmelted resin is supplied to an extruder and extruded from a T die at 290 ° C. to prepare a sheet, and when a tray is formed from this sheet by thermoforming, the tray bottom 100 cm 2
The number of foreign matters contained therein was visually evaluated. ○: 1 or less, △: 2 to 5, ×: 5 or more
【0023】実施例1
ステンレス製のオートクレーブに、2,6−ジメチルナ
フタレート242重量部、ジメチルテレフタレート2重
量部、エチレングリコール137重量部を仕込み、次い
でエステル交換触媒として酢酸カルシウム1水塩0.1
1重量部を添加し、さらに酢酸コバルト4水塩0.01
重量部を添加し、エステル交換反応を行った。エステル
交換反応完了後、ヒドロキシテトラエチルアンモニウム
0.002重量部、リン酸トリメチル0.11重量部を
添加し、次いで重合触媒として二酸化ゲルマニウムの
0.8wt%水溶液4.24重量部(二酸化ゲルマニウ
ムとして0.03重量部)を添加後、290℃、減圧下
で重縮合反応を行った。その後、常圧に戻し、内容物を
ガット状に押出して水で冷却、カッターを用いてチップ
状のPEN樹脂(IV=0.56)を得た。さらにこの
樹脂を真空中、160℃で8時間加熱、結晶化した。そ
して、この樹脂を真空中で、220℃×24時間固相重
合した。こうして得られた樹脂を1g/デシリットルの
濃度で、フェノール/1,1,2,2−テトラクロロエ
タン=60/40(重量比)の混合溶媒に130℃で溶
解したところ、2時間以内で溶解し、且つIVは0.7
5であった。そして示差走査熱量計で25℃から10℃
/分で昇温したときに最初に観測される吸熱ピークのピ
ーク温度は250℃であった。そしてこの樹脂を押し出
し機に供給して、290℃でTダイより押し出しでシー
トを作製し、さらにこのシートから熱成形によりトレイ
を成形したところ、トレイ底面100cm2中に含まれ
る異物の数は0個であった。Example 1 A stainless steel autoclave was charged with 242 parts by weight of 2,6-dimethylnaphthalate, 2 parts by weight of dimethyl terephthalate and 137 parts by weight of ethylene glycol, and then calcium acetate monohydrate 0.1 as an ester exchange catalyst.
1 part by weight was added, and further cobalt acetate tetrahydrate 0.01
By weight part, transesterification reaction was carried out. After the completion of the transesterification reaction, 0.002 part by weight of hydroxytetraethylammonium and 0.11 part by weight of trimethyl phosphate were added, and then 4.24 parts by weight of a 0.8 wt% aqueous solution of germanium dioxide as a polymerization catalyst (0.2% by weight as germanium dioxide. (03 parts by weight) was added, and a polycondensation reaction was performed at 290 ° C. under reduced pressure. Then, the pressure was returned to normal pressure, the content was extruded into a gut shape, cooled with water, and a chip-shaped PEN resin (IV = 0.56) was obtained using a cutter. Further, this resin was heated in a vacuum at 160 ° C. for 8 hours for crystallization. Then, this resin was subjected to solid phase polymerization at 220 ° C. for 24 hours in vacuum. When the resin thus obtained was dissolved in a mixed solvent of phenol / 1,1,2,2-tetrachloroethane = 60/40 (weight ratio) at a concentration of 1 g / deciliter at 130 ° C., it was dissolved within 2 hours. And IV is 0.7
It was 5. And with a differential scanning calorimeter from 25 ℃ to 10 ℃
The peak temperature of the endothermic peak that was first observed when the temperature was raised at a rate of / min was 250 ° C. Then, this resin was supplied to an extruder and extruded from a T die at 290 ° C. to form a sheet, and a tray was formed from this sheet by thermoforming. The number of foreign matters contained in the tray bottom 100 cm 2 was 0. It was an individual.
【0024】実施例2〜4、参考例1〜4
ポリエステル樹脂の組成及び固相重合条件を表1及び表
2に示すとおり変更したこと以外は、実施例1と同様に
してPEN樹脂を得た。表1及び表2に評価結果を示
す。Examples 2 to 4 and Reference Examples 1 to 4 PEN resins were obtained in the same manner as in Example 1 except that the composition and solid phase polymerization conditions of the polyester resin were changed as shown in Tables 1 and 2. . The evaluation results are shown in Tables 1 and 2.
【0025】比較例1
ステンレス製のオートクレーブに、2,6−ジメチルナ
フタレート244重量部、エチレングリコール137重
量部を仕込み、次いでエステル交換触媒として酢酸カル
シウム1水塩0.11重量部を添加し、さらに酢酸コバ
ルト4水塩0.01重量部を添加し、エステル交換反応
を行った。エステル交換反応完了後、ヒドロキシテトラ
エチルアンモニウム0.002重量部、リン酸トリメチ
ル0.11重量部を添加し、次いで重合触媒として二酸
化ゲルマニウムの0.8wt%水溶液4.24重量部
(二酸化ゲルマニウムとして0.03重量部)を添加
後、290℃、減圧下で重縮合反応を行った。その後、
常圧に戻し、内容物をガット状に押出して水で冷却、カ
ッターを用いてチップ状のPEN樹脂(IV=0.5
6)を得た。さらにこの樹脂を真空中、160℃で8時
間加熱、結晶化した。そして、この樹脂を真空中で、2
20℃×24時間固相重合した。こうして得られた樹脂
を1g/デシリットルの濃度で、フェノール/1,1,
2,2−テトラクロロエタン=60/40(重量比)の
混合溶媒に130℃で溶解したが、2時間以上溶解して
も溶解しなかった。そしてこの樹脂を示差走査熱量計で
25℃から10℃/分で昇温したときに最初に観測され
る吸熱ピークのピーク温度は252℃であった。そして
この樹脂を押し出し機に供給して、290℃でTダイよ
り押し出しでシートを作製し、さらにこのシートから熱
成形によりトレイを成形したところ、トレイ底面100
cm2中に含まれる異物の数は20個と大量であり、成
形材料としては不適なものであった。Comparative Example 1 A stainless steel autoclave was charged with 244 parts by weight of 2,6-dimethylnaphthalate and 137 parts by weight of ethylene glycol, and then 0.11 part by weight of calcium acetate monohydrate as an ester exchange catalyst was added. Further, 0.01 part by weight of cobalt acetate tetrahydrate was added to carry out a transesterification reaction. After completion of the transesterification reaction, 0.002 parts by weight of hydroxytetraethylammonium and 0.11 parts by weight of trimethyl phosphate were added, and then 4.24 parts by weight of a 0.8 wt% aqueous solution of germanium dioxide as a polymerization catalyst (0.2% as germanium dioxide was used). (03 parts by weight) was added, and a polycondensation reaction was performed at 290 ° C. under reduced pressure. afterwards,
The pressure is returned to normal pressure, the contents are extruded into a gut shape, cooled with water, and a chip-shaped PEN resin (IV = 0.5
6) was obtained. Further, this resin was heated in a vacuum at 160 ° C. for 8 hours for crystallization. Then, in vacuum, 2
Solid phase polymerization was carried out at 20 ° C. for 24 hours. The resin thus obtained was mixed with phenol / 1,1,1 at a concentration of 1 g / deciliter.
It was dissolved in a mixed solvent of 2,2-tetrachloroethane = 60/40 (weight ratio) at 130 ° C., but it was not dissolved even if it was dissolved for 2 hours or more. The peak temperature of the endothermic peak first observed when the temperature of this resin was raised from 25 ° C to 10 ° C / min by a differential scanning calorimeter was 252 ° C. Then, this resin was supplied to an extruder and extruded from a T die at 290 ° C. to form a sheet, and a tray was formed from this sheet by thermoforming.
The number of foreign matters contained in cm 2 was as large as 20, which was unsuitable as a molding material.
【0026】比較例2、3
ポリエステル樹脂の組成及び固相重合条件を表3に示す
とおり変更したこと以外は,実施例1と同様にしてPEN
樹脂を得た。表3に評価結果を示す。Comparative Examples 2 and 3 PEN was prepared in the same manner as in Example 1 except that the composition of the polyester resin and the solid phase polymerization conditions were changed as shown in Table 3.
A resin was obtained. Table 3 shows the evaluation results.
【0027】比較例4
ステンレス製のオートクレーブに、2,6−ジメチルナ
フタレート208重量部、ジメチルテレフタレート29
重量部、エチレングリコール137重量部を仕込み、次
いでエステル交換触媒として酢酸カルシウム1水塩0.
11重量部を添加し、さらに酢酸コバルト4水塩0.0
1重量部を添加し、エステル交換反応を行った。エステ
ル交換反応完了後、ヒドロキシテトラエチルアンモニウ
ム0.002重量部、リン酸トリメチル0.11重量部
を添加し、次いで重合触媒として二酸化ゲルマニウムの
0.8wt%水溶液4.24重量部(二酸化ゲルマニウ
ムとして0.03重量部)を添加後、290℃、減圧下
で重縮合反応を行った。その後、常圧に戻し、内容物を
ガット状に押出して水で冷却、カッターを用いてチップ
状のPEN樹脂(IV=0.56)を得た。さらにこの
樹脂を真空中、160℃で8時間加熱したところ、樹脂
が融着してしまい、固相重合を行うことができなかっ
た。Comparative Example 4 208 parts by weight of 2,6-dimethyl naphthalate and 29 parts of dimethyl terephthalate were placed in an autoclave made of stainless steel.
1 part by weight, 137 parts by weight of ethylene glycol were charged, and then calcium acetate monohydrate as an ester exchange catalyst was added.
11 parts by weight of cobalt acetate tetrahydrate 0.0
1 part by weight was added to carry out a transesterification reaction. After the completion of the transesterification reaction, 0.002 part by weight of hydroxytetraethylammonium and 0.11 part by weight of trimethyl phosphate were added, and then 4.24 parts by weight of a 0.8 wt% aqueous solution of germanium dioxide as a polymerization catalyst (0.2% by weight as germanium dioxide. (03 parts by weight) was added, and a polycondensation reaction was performed at 290 ° C. under reduced pressure. Then, the pressure was returned to normal pressure, the content was extruded into a gut shape, cooled with water, and a chip-shaped PEN resin (IV = 0.56) was obtained using a cutter. Further, when this resin was heated in vacuum at 160 ° C. for 8 hours, the resin was fused and solid-phase polymerization could not be performed.
【0028】比較例5
固相重合を200℃で行ったこと以外は比較例1と同様
にしてPEN樹脂の製造を試みたが、30時間重合して
もIVが0.60までしか上がらず固相重合を打ちきっ
た。そのポリマーを押し出し機に供給して、290℃で
Tダイより押し出してシートを作製したところ、ドロー
ダウンのため、良好なシートが得られなかった。このた
め、このシートを熱成形しても外観良好なトレイを得る
ことができなかった。Comparative Example 5 An attempt was made to produce a PEN resin in the same manner as in Comparative Example 1 except that the solid-state polymerization was carried out at 200 ° C. However, even if the polymerization was carried out for 30 hours, the IV was only 0.60 and the solid content was solid. Phase polymerization was terminated. When the polymer was supplied to an extruder and extruded from a T die at 290 ° C. to produce a sheet, a good sheet could not be obtained due to drawdown. Therefore, even if this sheet is thermoformed, a tray having a good appearance cannot be obtained.
【0029】[0029]
【表1】 [Table 1]
【0030】[0030]
【表2】 [Table 2]
【0031】[0031]
【表3】 [Table 3]
【0032】以上の結果から明らかなように、固相重合
を210℃以上かつ12時間以上行って、示差走査熱量
計で25℃から10℃/分で昇温したときに最初に観測
される吸熱ピークのピーク温度が245℃以上の樹脂を
得ても、フェノール/1,1,2,2−テトラクロロエ
タン=60/40(重量比)の混合溶媒に130℃で2
時間以上溶解しても溶解しない場合は、溶融成形すると
未溶融物が多く含まれているため、良好な成形品を得る
ことができない。(比較例1〜3)
一方、固相重合を低温で行うと、IVが0.65を越え
る樹脂を効率良く生産することが難しくなる。(比較例
5)
また、2,6−ナフタレンジカルボン酸以外の酸成分及
び/又はエチレングリコール以外のグリコール成分の割
合が10mol%を超えると樹脂の結晶性が低下するた
め、樹脂の結晶化と固相重合を行うことができす、IV
=0.65以上の樹脂を得ることができない。(比較例
4)As is clear from the above results, the endotherm first observed when the solid phase polymerization is carried out at 210 ° C. or higher for 12 hours or longer and the temperature is raised from 25 ° C. to 10 ° C./min by the differential scanning calorimeter. Even if a resin having a peak peak temperature of 245 ° C. or higher is obtained, it is mixed with a mixed solvent of phenol / 1,1,2,2-tetrachloroethane = 60/40 (weight ratio) at 130 ° C.
If it does not dissolve even if it dissolves for more than a time, a good molded product cannot be obtained because a large amount of unmelted material is included in the melt molding. (Comparative Examples 1 to 3) On the other hand, if solid phase polymerization is performed at a low temperature, it becomes difficult to efficiently produce a resin having an IV of more than 0.65. (Comparative Example 5) Further, when the ratio of the acid component other than 2,6-naphthalenedicarboxylic acid and / or the glycol component other than ethylene glycol exceeds 10 mol%, the crystallinity of the resin decreases, so that crystallization and solidification of the resin occur. Phase polymerization can be performed, IV
It is not possible to obtain a resin having a value of 0.65 or more. (Comparative example 4)
【0033】[0033]
【発明の効果】本発明のPEN樹脂は、ボトル成形等に
好適な高い固有粘度を有し、かつ溶融成形時に溶融しな
い高融点物を含まないため、外観の良好な成形品を得る
ことができる。EFFECT OF THE INVENTION The PEN resin of the present invention has a high intrinsic viscosity suitable for bottle molding and does not contain a high-melting point material that does not melt during melt molding, so that a molded product having a good appearance can be obtained. .
【図1】本発明のPEN樹脂を、示差走査熱量計で25
℃から10℃/分で昇温したときに観測される吸熱ピー
クの一例である。FIG. 1 shows the PEN resin of the present invention in a differential scanning calorimeter of 25
It is an example of an endothermic peak observed when the temperature is raised from 10 ° C to 10 ° C / min.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平11−106492(JP,A) 特開 平11−60704(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08G 63/00 - 63/91 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-11-106492 (JP, A) JP-A-11-60704 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) C08G 63/00-63/91
Claims (4)
る酸成分とし、エチレングリコールを主たるグリコール
成分とし、更に2,6−ナフタレンジカルボン酸成分以
外の酸成分及び/又はエチレングリコール以外のグリコ
ール成分が、0.1mol%以上2mol%未満共重合
されているポリエステルであって、固有粘度(IV)が
下記式1を満たし、示差走査熱量計で25℃から10℃
/分で昇温したときに最初に観測される吸熱ピークのピ
ーク温度が245℃以上であり、かつフェノール/1,
1,2,2−テトラクロロエタン=60/40(重量
比)の混合溶媒に1g/デシリットルの濃度で、130
℃で溶解したときに、2時間以内で溶解することを特徴
とするポリエチレンナフタレート樹脂。 0.65<IV≦1.2 (1)1. A 2,6-naphthalenedicarboxylic acid as a main acid component, ethylene glycol as a main glycol component, and a 2,6-naphthalenedicarboxylic acid component as a main component.
External acid component and / or glycos other than ethylene glycol
Of 0.1% or more and less than 2% by mole
A polyester that is, the intrinsic viscosity (IV) satisfies the following formula 1, 10 ° C. from 25 ° C. by differential scanning calorimetry
The peak temperature of the endothermic peak that is first observed when the temperature is raised at 1 / min is 245 ° C. or higher, and phenol / 1,
At a concentration of 1 g / deciliter in a mixed solvent of 1,2,2-tetrachloroethane = 60/40 (weight ratio), 130
A polyethylene naphthalate resin characterized by being dissolved within 2 hours when it is dissolved at a temperature of ℃. 0.65 <IV ≦ 1.2 (1)
とする請求項1に記載のポリエチレンナフタレート樹
脂。2. The polyethylene naphthalate resin according to claim 1, which has been crystallized and solid-phase polymerized.
分とし、エチレングリコールをグリコール成分とするポ
リエステルを製造するに際し、2,6−ナフタレンジカ
ルボン酸以外の酸成分及び/又はエチレングリコール以
外のグリコール成分を0.1〜2mol%未満共重合し
て溶融重合を行った後、得られたプレポリマーを210
℃以上かつ12時間以上固相重合を行うことを特徴とす
る請求項1〜3のいずれかに記載のポリエチレンナフタ
レート樹脂の製造方法。3. When producing a polyester having 2,6-naphthalenedicarboxylic acid as an acid component and ethylene glycol as a glycol component, an acid component other than 2,6-naphthalenedicarboxylic acid and / or a glycol component other than ethylene glycol is used. Of 0.1 to less than 2 mol% and melt-polymerized.
The method for producing a polyethylene naphthalate resin according to any one of claims 1 to 3, wherein solid phase polymerization is carried out at a temperature of not less than ° C and for not less than 12 hours.
チレンナフタレート樹脂よりなる成形物。4. A molded product made of polyethylene naphthalate resin according to any one of claims 1-2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13380099A JP3362013B2 (en) | 1999-05-14 | 1999-05-14 | High viscosity polyethylene naphthalate resin, method for producing the same, and molded article made therefrom |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13380099A JP3362013B2 (en) | 1999-05-14 | 1999-05-14 | High viscosity polyethylene naphthalate resin, method for producing the same, and molded article made therefrom |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000319364A JP2000319364A (en) | 2000-11-21 |
| JP3362013B2 true JP3362013B2 (en) | 2003-01-07 |
Family
ID=15113335
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13380099A Expired - Fee Related JP3362013B2 (en) | 1999-05-14 | 1999-05-14 | High viscosity polyethylene naphthalate resin, method for producing the same, and molded article made therefrom |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4681348B2 (en) * | 2005-05-17 | 2011-05-11 | 帝人ファイバー株式会社 | Method for producing polyethylene naphthalate fiber |
| JP5855973B2 (en) * | 2012-02-27 | 2016-02-09 | 帝人株式会社 | Polyester resin and polyester film using the same |
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1999
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