JP3362610B2 - Electronic component manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device that performs four-sided treatment while controlling the positions of small electronic components that require treatment such as inspection or marking of the upper and lower surfaces of the hexahedron excluding the end face and both side surfaces. The present invention relates to a method of manufacturing a component.

[0002]

2. Description of the Related Art Presently, a plurality of slits are provided as one of the highly reliable and economical treatment methods for performing visual inspections and markings on the top and bottom surfaces of a small electronic component excluding the end surface and both sides. A method is known in which a disc-shaped carrier table and a suction block that sucks electronic components by using a vacuum are used while changing the angle of the electronic components.

[0003]

However, in recent years,
Electronic parts are becoming smaller, and with the progress of smaller size and larger capacity as seen in multilayer capacitors, the end faces have external electrodes, so they can be easily identified, but the areas of the upper and lower surfaces and both side surfaces are almost the same. It becomes equal, and it is difficult to discriminate the upper and lower surfaces and both side surfaces reliably and economically, both artificially and in terms of equipment. Therefore, using the conventional method, if you perform a visual inspection, marking, etc. on all four surfaces except the end surface,
Trouble of transferring electronic parts is likely to occur from the aspect of equipment capacity, and there are cases where the parts that should be visually inspected are shipped as products without being inspected, which is a major issue for the reliability of electronic parts. It was

The present invention has solved the above-mentioned problems and is a method for economically improving the reliability of the upper and lower surfaces and both side surfaces of a small electronic component such as a multilayer capacitor, except for the end surfaces, by visual inspection, marking, etc. It is an object of the present invention to provide a manufacturing method capable of carrying out the above treatment.

[0005]

SUMMARY OF THE INVENTION The present invention is the same for an electronic component such as a small electronic component which has a surface which is difficult to discriminate between the upper and lower surfaces and both side surfaces and which requires treatment such as visual inspection or marking. While carrying while maintaining the carrying posture, a first carrying section including at least a first treatment section and a second treatment section,
Further, it is orthogonal to the first transport section, transports while maintaining the same transport attitude, and has a second transport section including at least a third treatment section and a fourth treatment section. Is to do.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is, in the manufacture of a rectangular parallelepiped or cubic shaped electronic component, at least a first treatment part and a first treatment part are provided between a supply part and an extraction part of the electronic part. A first transport part having two treatment parts, and a second transport part configured to intersect at right angles with this transport part and having at least a third treatment part and a fourth treatment part. At each position in the transfer unit, the electronic component is configured to maintain the same transfer posture, and further, in the first treatment unit of the first transfer unit, after treating any one surface of the electronic component, The opposite surface is treated by the second treatment section, and then transferred to the second conveyance section while keeping the same conveyance posture, and then the third side is formed on one side in contact with the first and second treatment surfaces. After performing the procedure, perform the fourth procedure on the side opposite to this. It is obtained by the configuration. According to this configuration, the electronic components at the respective positions of the first treatment section and the second treatment section, and the third treatment section and the fourth treatment section maintain the same conveyance posture, which causes a large trouble in the production facility. The factor, which is the transfer of products, is only one place from the first transfer section to the second transfer section, which improves the reliability and stability of the equipment, enables stable equipment operation, and improves mass productivity. It becomes possible, and naturally, the reliability and economy of the product can be improved.

According to a second aspect of the present invention, the first transfer section has a first fixed base and a first transfer table which performs an intermittent operation with respect to the first fixed base. The unit has a second fixed base and a second transfer table that performs an intermittent operation with respect to the second fixed base, and a vacuum is transferred from the first transfer table to the second transfer table while maintaining the same transfer posture of the electronic components. It is something to suck. This makes it possible to smoothly transfer from the first transfer table to the second transfer table without rotating the surface of the electronic component.
Problems associated with conventional transfer can be eliminated, which is preferable from the viewpoint of equipment configuration and reliability of electronic components.

The invention according to claim 3 of the present invention is
And the table of the second transport unit is a disc having a drive shaft in the center, and a plurality of slits slightly larger than the outer dimensions of the electronic components for inserting and transporting the electronic components in the circumferential portion thereof. The method of manufacturing an electronic component according to claim 1 or 2, which is formed. This is to eliminate the lateral displacement of the inserted electronic components in the transport table that rotates intermittently, and improve the working accuracy of the predetermined treatment section.

The invention according to claim 4 of the present invention is
The method of manufacturing an electronic component according to claim 3, wherein the table of the second transport unit is made of aluminum, and the inner surfaces of the plurality of slits formed in the circumferential portion are coated with a wear resistant material. This is to reduce the moment of inertia of the transport table which makes intermittent circular motion so that the treatment table is properly stopped at the fixed position. Further, the reason why the inner surface of the slit is coated with a wear-resistant substance is to prevent scratches from being generated on the inner surface of the slit which comes into contact with the electronic component to be inserted and conveyed or the contact surface of the electronic component.

The invention according to claim 5 of the present invention is
The fourth treatment means at least one operation such as inspection, processing, marking or surface treatment, and the method for manufacturing an electronic component according to any one of claims 1 to 3, which is performed singly or in combination. Is. This defines the content of work to be performed in the transport section.

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings by taking as an example a case where an external appearance inspection is performed on four surfaces of an laminated ceramic capacitor as an electronic component excluding the end portions.

FIG. 1 is a schematic view of a carrying section in the present invention, FIG. 2 is an enlarged schematic view of a main portion of FIG. 1, and FIG. 3 is a monolithic ceramic capacitor.

First, in the manufacturing method of the present invention, as shown in FIG. 3, a rectangular parallelepiped or cubic shaped monolithic ceramic capacitor (hereinafter referred to as a product) 1 is provided from the component supply unit 2 of FIG. The product 1 is regulated and fed into the slit 4, and the product 1 slides between the first fixed bases 21 shown in FIG. 2A by the rotation of the first transport table 3 by the slits 4 provided therein. Be transported to. Here, the first transport table 3 is installed on the first fixed base 21 so as to be capable of intermittent rotation, and further, slits 4 are provided at equal intervals on the outer periphery of the first transport table 3, and the component supply unit 2 The product 1 is sequentially supplied to the slits 4 of the first transport table 3. The supplied product 1 is rotated by the first transport table 3 to cause the first treatment section 5 to rotate.
2A, the image of the external appearance inspection of the upper surface is set on the upper side of the product 1 in a state where the lower surface of the product 1 is sucked by the vacuum suction portion 22 by the first treatment portion 5 shown in FIG. 2A. It is taken into the appearance inspection camera 23 and inspected. First treatment section 5
The product 1 whose appearance inspection has been completed is position-regulated by the slit 4 while the same conveyance posture is maintained by the rotation of the first conveyance table 3, and is conveyed to the second treatment section 6. Next, FIG.
The upper surface of the product 1 is sucked by the vacuum suction unit 24 by the second treatment section 6 shown in (a), and the appearance inspection image of the lower surface is taken in and inspected by the appearance inspection camera 25 installed in the lower portion of the product 1. The product 1 that has undergone the first and second inspections is position-regulated by the rotation of the first transfer table 3 while maintaining the same transfer posture by the slit 4, and is transferred to the primary defective extraction unit 7, where the first treatment unit is disposed. 5 and the product 1 determined to be defective by the second treatment section 6 are discharged. On the other hand, the product 1 determined to be non-defective is transported to the chute entrance 8 while being regulated by the slit 4 by the rotation of the first transport table 3. The product 1 conveyed to the chute inlet 8 is sucked by the vacuum suction hole 9 provided on the second conveying table 10 side, and the first conveying table 3
The chute 8A while maintaining the same conveyance posture to the slit 11 of the second conveyance table 10 which is formed at a position orthogonal to
Transferred through. Here, the upper surface and the lower surface of the product 1 come into contact with the side surfaces of the slit 11 of the second transport table 10, respectively, and the product 1 is apparently rotated by 90 degrees. After that, the product 1 has the same conveyance posture as the first conveyance table 3 at the slit 11 of the second conveyance table 10 which is installed so as to be capable of intermittent rotation between the second fixed bases 26 of FIG. 2B. The position is regulated while keeping it and it is conveyed so as to slide. At the position of the third treatment section 12 shown in FIG. 1, one side surface of the product 1 is sucked by the vacuum suction section 27 as shown in FIG. Captured and inspected. Next, the product 1 is position-regulated by the rotation of the second transfer table 10 while maintaining the same transfer posture by the slit 11, and is transferred to the fourth treatment section 13, and the side surface inspected by the third treatment section 12 is attached to the vacuum suction section 29. Product 1
The external appearance inspection image of the side opposite to is captured by the external appearance inspection camera 30 and inspected. The product 1 for which the visual inspection of both side surfaces has been completed is transported to the take-out portion 14 of the product 1 while being regulated in position by the slit 11 while keeping the same transporting posture and sliding between the second fixed bases 26. Based on the appearance inspection results of the third and fourth treatment sections 12 and 13, the product 1 is taken out according to the good product and the defective product, sorted and stored.
Here, how to classify and store the products 1 based on the measurement result of the appearance inspection is not directly related to the configuration of the present invention, and thus the description thereof is omitted.

In the first embodiment, the product 1
Although the case where the visual inspection of the upper surface, the lower surface and both side surfaces of the product 1 is performed has been described, the manufacturing method of the present invention can be applied to the case where some treatment is performed on the four surfaces of the product 1 excluding the end surfaces.
Further, the manufacturing method of the present invention can be applied not only to the equipment of the rotating mechanism shown in the first embodiment but also to the equipment of the linear motion mechanism. Further, in the present embodiment, the base materials of the first and second transfer tables 3 and 10 shown in FIG. 1 are made of metal aluminum, and the slits 4 and 11 provided on the circumferential portions thereof are sprayed with alumina having high wear resistance. Since there is no difference between the stop positions of the first and second transfer tables 3 and 10 that perform intermittent high-speed movements, and the alumina applied to the slits 4 and 11 does not scratch the side surface of the product 1. It became possible to do.

[0015]

As described above, the structure of the manufacturing method of the present invention can produce even small electronic components in which it is difficult to distinguish the four sides because the top and bottom surfaces and the side surfaces of the four sides have substantially the same area shape. There is one product transfer process where troubles are likely to occur in the equipment, and the electronic components have the same transfer posture at each position of the first treatment section and the second treatment section, and the third treatment section and the fourth treatment section. Since the treatment is performed while maintaining the above, stable equipment operation can be performed without damaging the electronic parts, and the reliability and stability of the equipment can be dramatically improved and the mass productivity can be improved. It is a thing. Further, as described above, the treatment of the four surfaces of the upper and lower surfaces and both side surfaces is performed by the transfer mechanism at only one place, so that the equipment can be simplified and the economic effect on the product can be improved. Is. Therefore, the manufacturing method of the present invention is extremely effective in the case of performing a visual inspection, a marking, and the like on all four surfaces of an electronic component, which are becoming smaller and more chips, except for the end faces.

[Brief description of drawings]

FIG. 1 is a perspective view of a transport unit according to an embodiment of the present invention.

2 (a) and 2 (b) are enlarged perspective views showing a part of the main part constituting section in section.

FIG. 3 is a perspective view of a monolithic ceramic capacitor.

[Explanation of symbols]

1 product 2 parts supply department 3 First transport table 4 slits 5 First treatment department 6 Second treatment department 7 Primary defective part 8 chute entrance 9 Vacuum suction hole 10 Second transport table 11 slits 12 Third treatment department 13 Fourth treatment department 14 Extraction Department 21 First fixed base 22 Vacuum suction part 23 Appearance inspection camera 24 Vacuum suction part 25 Appearance inspection camera 26 Second fixed base 27 Vacuum suction unit 28 Appearance inspection camera 29 Vacuum suction part 30 Appearance inspection camera

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Claims (5)

(57) [Claims] 1. In the manufacture of a rectangular parallelepiped or cube-shaped electronic component, a first transfer unit having at least a first treatment unit and a second treatment unit between a supply unit for the electronic component and a take-out unit for the electronic component; It is configured to be orthogonal to the first transport unit, and comprises at least a second transport unit having a third treatment unit and a fourth treatment unit, at respective positions in the first transport unit and the second transport unit, The electronic component is configured to maintain the same transporting posture, and further, in the first treatment section of the first transporting section, after treating one surface of the electronic component,
The surface opposite to this is treated with the second treatment section, and then transferred to the second conveyance section while keeping the same conveyance posture, and then contacted with the surface subjected to the first treatment and the second treatment. A method of manufacturing an electronic component, wherein after performing a third treatment on the side surface of the third treatment portion by the third treatment portion, a fourth treatment portion performs the fourth treatment on the side surface facing the side treatment. 2. The first transfer section has a first fixed base and a first transfer table which performs an intermittent operation with respect to the first fixed base, and the second transfer section has a second fixed base and the second fixed base. The electronic component according to claim 1, further comprising a second transport table that intermittently operates with respect to the second fixed base, and vacuum suctions the electronic component from the first transport table to the second transport table while maintaining the same transport posture. Manufacturing method. 3. The outer dimensions of the electronic parts are such that the tables of the first and second carrying parts are disc-shaped with a drive shaft in the center, and the electronic parts are inserted and carried in the circumferential part. The method for manufacturing an electronic component according to claim 1 or 2, comprising a plurality of slightly larger slits. 4. The electronic component according to claim 3, wherein the tables of the first and second transfer parts are made of aluminum, and the inner surfaces of a plurality of slits formed in the circumferential part are coated with a wear-resistant substance. Manufacturing method. 5. The first to fourth treatments refer to at least one work of inspection, processing, marking or surface treatment, and any one of them is carried out individually or in combination. A method for manufacturing the described electronic component.