JP3364764B2 - Sealed equipment housing cooling device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a closed casing cooling device for equipment and, more particularly, to a closed casing cooling device having improved cooling efficiency by application of a heat pipe.

[0002]

2. Description of the Related Art As a closed casing cooling device that has been used for a long time, a closed casing is provided with an opening, and a separator plate having an expanded surface area is attached to the opening to form a secret. There is a system in which high temperature air inside the casing and low temperature air outside the casing are blown onto the inner and outer surfaces of the separator plate to cause heat exchange and cool the air inside the casing. However, since this method has a small surface area expansion ratio, it is inexpensive but could not exhibit high performance.

As a countermeasure, a heat pipe type closed casing cooling device has been put into practical use, and the market is expanding as a high performance sealed casing cooling device due to the excellent heat transport performance of the heat pipe. Such a conventional heat pipe type closed casing cooling device is schematically shown in the explanatory views of FIGS. 7 and 8. Figure 7
Shows a ceiling-mounted cooling device, and FIG. 8 shows a side-mounted cooling device. In the figure, 11 is a heat pipe, 12
Is a plate fin group that is commonly attached to the heat pipe group. Each of the heat pipes 11 has a separator plate 13 at the heat insulating portion between the heat radiating portion and the heat receiving portion.
13-1 is penetrated and kept confidential. Further, the separator plate 13 covers an opening (not shown) of the device housing 17 to secretly separate the inside and outside of the device housing 17, and the side of the cooling device housing 16 where the external convection 18 flows and the internal convection 19 flow. The side is secretly separated.

The high temperature internal air convection 19 generated by the internal fan 15 flows through the cooling device casing 16 as indicated by the arrow, and passes through the plate fin group 12 to the heat pipe 11.
After the amount of heat is absorbed by the heat receiving part of the device, it is changed to low-temperature convection and released to the outside of the cooling device housing 16, and circulates in the equipment housing 17 as shown by the arrow, while not shown in the equipment housing 1
The various mounted components of 7 and the device housing 17 are entirely cooled. The amount of heat absorbed by the heat receiving portion of the heat pipe 11 is efficiently transported to the heat radiating portion due to the characteristics of the heat pipe. The low temperature external air convection 18 generated by the external fan 14 flows through the cooling device housing 16 as indicated by the arrow and absorbs the amount of heat from the heat radiating portion of the heat pipe 11 via the plate fin group 12 to cool it. And again the cooling device housing 1
6 is discharged to the outside.

The heat pipe type closed casing cooling device thus configured as shown in the figure can efficiently cool the inside of the device casing due to the excellent heat transport capability of the heat pipe. In the figure, 20 is a convection outlet of the cooling device, and 2
1 is a convection inlet. Although the side-mounted cooling device in FIG. 8 is mounted on the inner wall of the device housing, it may be mounted on the outer wall of the device housing.

[0006]

Since the heat pipe type closed casing cooling device constructed as described above is constituted by the ordinary heat pipe, it has been a problem in view of the characteristic of the ordinary heat pipe. Was left as a problem as it was. Such problems were as follows. (B) If the heat pipe is held in the top heat mode or in the horizontal heat mode,
It cannot be applied because it becomes inoperable or the performance is halved. Therefore, the degree of freedom of the mounting posture at the time of application is small, and it may be difficult to deal with the arrangement and mounting state of the components in the device housing. Further, as the most practical example of the low degree of freedom, there is no choice but to use a case cooling device having a completely different structure between the ceiling mounting type and the side mounting type as shown in FIGS. (B) It is difficult to reduce the size and weight of the heat pipe because it must be used with the plate fin group attached. The volume weight of the plate fin group reaches several times that of the heat pipe. (C) Since the heat pipe must be used with the plate fin group attached, all the heat pipes must be straight pipe heat pipes due to the manufacturing technical reasons for the fin attachment. The length of each heat pipe of the straight pipe heat pipe group is required to be equal. From this point of view, the degree of freedom in design is small, and the application of heat pipes in the equipment housing is particularly limited, and it cannot be applied to anything other than the heat receiving structure by air convection. (D) The plate fin group has the effect of rectifying convection, but on the other hand, it is restricted in the flow direction of convection, which greatly limits the degree of freedom in design. (E) Since heat radiation by the heat pipe is performed through the plate fin group, generation of contact thermal resistance between the plate fin and the heat pipe is inevitable. The fin efficiency of the plate fin is 70% to 80%. Yes Thermal resistance is large,
The heat exchange efficiency cannot always be said to be good because the pressure loss of convection generated in the fin gap also causes an increase in thermal resistance.

[0007]

[Means for Solving the Problems] The basic idea of the means for solving the above problems according to the present invention is to abolish the application of the conventional heat pipe as a heat pipe to be applied, and to obtain a long meandering thin tube heat. At the same time that the pipe is applied, the plate fin group is entirely abolished, and the long meandering thin tube heat pipe itself is applied as the heat receiving and radiating pin fin group.

The following long-meandering thin pipe heat pipes have various structures. That is, JP-A-63-3
18493 (loop type thin tube heat pipe), Japanese Patent Application No. 2-
319461 (loop type thin tube heat pipe), Japanese Patent Application No. 3
-61385 (micro heat pipe) and the like. As a practical structure, the above-mentioned various thin tube heat pipes are used to form and apply a structure according to Japanese Patent Application No. 4-135507 (Kenyama type heat sink having a group of l-shaped pins). In this case, even if the l-shaped pin group is an inverted U-shaped pin group, the action and effect are exactly the same.

1 and 2 are schematic cross-sectional views for explaining the basic structure of a cooling device for cooling a hermetically-sealed equipment casing thus configured and an embodiment described later. In the figure, reference numeral 1 denotes a separator plate which is a first component of the present invention, and airtightly covers an opening portion provided in a predetermined portion of the equipment casing, so that the equipment casing is similar to the equipment casing wall. The inside and outside of the body are airtightly separated and also serve as a support for the heat radiation fin group. Reference numeral 2 denotes a meandering thin tube heat pipe which is the second component of the present invention. The meandering thin tube heat pipe penetrates the separator plate 1 by a large number of meandering and is arranged upright on the plate surface. , The side corresponding to the outside of the housing is the heat dissipation part, the intermediate part connecting them is the heat insulation part, and the heat insulation part holds the separator plate to form a large number of pin-shaped fin groups on both sides of the separator plate as a whole. There is.

As the basic structure of the cooling device for cooling the sealed equipment casing of the present invention, a predetermined sub-component is added to the cooling device basic unit formed by combining the first and second components as described above. Consists of Since the sub-components are different for each embodiment, it cannot be determined, but in the case of forced convection, a cooling device casing that also functions as a wind tunnel, a forced convection generating fan, etc. are shared as sub-components inside and outside the device casing. At this time, they are mounted on both sides of the separator plate. In the case of natural convection, convection control means for improving the flow velocity of convection is provided at a predetermined position inside and outside the equipment casing.

The details of the separator plate which is the first constituent element of the present invention are shown in FIGS. 4 and 5, and the details of the meandering capillary tube heat pipe which is the second constituent element are shown in FIGS. 7 and details of the basic unit of the hermetically-sealed equipment case cooling device of the present invention, which is a combination thereof, is shown in FIG.

The separator plate in FIG. 4 is formed by adhering a group of metal prisms 1-1 in parallel and in parallel. A sandwiching narrow groove 1-3 is formed in each of the metal prisms 1-1, and the metal prisms 1-1 are adhered to each other, and at the same time, the sandwiching narrow groove 1-3 causes the meandering thin tube heat pipe 2 to move.
The straight pipe part is airtightly sandwiched and adhered at its heat insulating part.
In the figure, only five straight tube portions of the meandering thin tube heat pipe 2 are shown in steps on the same plane, but each metal prism 1-1 has a large number of sandwiching narrow grooves 1-3 at a predetermined pitch. Is provided, and a large number of straight tube portions of the meandering thin tube heat pipe 2 are sandwiched between the metal prisms 1-1.

FIG. 5 shows another example of the separator plate of the equipment casing cooling device of the present invention, which is formed by bonding thin metal tubes 1-2 in parallel and in parallel. Each thin metal tube 1-2 has a large number of holding fine grooves 1 at a predetermined pitch.
-3 is formed under pressure, and a group of thin-walled metal tubes 1-2 are bonded to each other, and at the same time, a large number of straight tube portions of the meandering thin tube heat pipe 2 are held by the group of holding narrow grooves 1-3. There is.

The group of thin-walled metal pipes 1-2 in FIG. 5 is not necessarily limited to the simple thin-walled metal pipes 1-2, and may be a heat pipe constituted by enclosing a two-layer fluid hydraulic fluid. . Further, the heat pipe in this case is not necessarily limited to a normal heat pipe, and all the heat pipes may be formed by a continuous long thin metal thin tube meandering. When the thin metal tube 1-2 is a heat pipe, a new function is added to the performance of the equipment casing cooling device of the present invention, as will be described later, and the performance is significantly improved.

FIGS. 6 and 7 show the second component of the equipment casing cooling device of the present invention, in which the meandering thin tube heat pipe sandwiched between the separator plates 1 in FIGS. 4 and 5 is arranged. It is a detailed explanatory view showing. The meandering thin tube heat pipe repeats meandering many times and penetrates the separator plate at many places, and by the turn, many heat radiation pin fin groups are formed on both sides of the separator plate. 6 and 7 show the shape of the heat receiving and radiating pin fin group formed by the turn of the meandering thin tube heat pipe, and 2-1 of FIG. 6 is an inverted U-shaped pin fin group. 2-2 of 7 indicates an l-shaped pin fin group.

FIG. 3 is a plan view of a cooling device basic unit formed by combining the first and second components.
1 is a separator plate, which is a metal prism 1-1 of FIG.
5 or the group of thin-walled metal tubes 1-2 of FIG. 5 are shown as bonded together. Reference numeral 1-3 is a holding thin groove for adhesively holding the meandering thin tube heat pipe.
Reference numeral 2 is a meandering thin tube heat pipe, and its tip end group is shown, that is, the inverted U-shaped pin fin group 2-1 of FIG. 6 or the l-shaped pin fin group 2-2 of FIG. 7 is shown. It has been done. Reference numeral 1-4 is a mounting frame, which supports both end groups of the metal prism group or the thin metal tube group, and the separator plate 1 is attached to the device housing while covering the opening of the device housing.

In FIGS. 6, 7 and 3, a large number of pin-shaped fin groups formed on both sides of the separator plate are so-called sword-shaped pin fin groups having relatively low fin heights and uniform fin heights. Shown. However, this is a basic structure, and in practical use, as a feature of the long meandering thin tube heat pipe 2 which is the second component of the cooling device of the present invention, only a predetermined pin type fin is predetermined. It can be extended to the height or the length.

[0018]

Since the heat pipe applied to the apparatus for cooling the enclosure of the hermetically sealed apparatus of the present invention is a long meandering thin tube heat pipe, it has all of its features. Solve all of. The details are as follows. (A) Since the cooling device exhibits sufficient performance in any holding posture, this cooling device can be attached to any part of the equipment casing in any posture. That is, it can be mounted regardless of the arrangement of components inside the equipment housing. Further, the same design can be used for mounting on the ceiling of the equipment housing and for mounting on the side wall.

(B) Since the pin-type fin group formed by the meandering of the long meandering thin tube heat pipe has a very large heat transfer coefficient, it is not necessary to mount the plate fin group, so that the pin-fin group can be constructed in a very small size.

(C) Since it is not necessary to mount the plate fin group, the long meandering thin tube heat pipe can be freely meandered and applied. Therefore, a given fin in the pin fin group can be formed by extending its height or length to a required position, and by adhering it to a component with a large heat generation inside the equipment casing The amount of heat can be directly absorbed by conduction, and the heat can be radiated directly to the outside of the equipment casing, which can help the heat radiation by the air convection of the other fin group and greatly improve the performance of the cooling device. Alternatively, the amount of heat can be directly absorbed from the component having a large amount of heat generation by radiant heat transfer, and the heat can be radiated directly to the outside of the device housing, and the overall performance of the cooling device can be dramatically improved.

(D) Since there is no restriction on the direction of convection in the pin fin group, there is no restriction on the shape of the cooling device housing, and there is no restriction on the mounting part of the fan for convection generation. The degree of freedom is extremely large.

(E) Convection heat radiation is eliminated without passing through the plate fin group, and since the pin fin group has a short distance between the heat radiation sections and generates little heat loss, the fin efficiency is 100%. , The heat exchange efficiency is very good.

[0023]

【Example】

First Embodiment FIG. 1 shows a first embodiment of the present invention, in which both sides of a separator plate 1 which is a first constituent element are respectively pin-shaped heat radiation by a meandering thin tube heat pipe 2 which is a second constituent element. A fin group and a pin-shaped heat receiving fin group are formed to form a basic unit of the device housing cooling device of the present invention. The planar shape of the cooling device basic unit of the present embodiment is a square as illustrated in FIG. 3, and the pin-shaped heat radiation fins are also arranged in a square shape, which is a square sword mountain shape. This cooling device basic unit is combined with various auxiliary elements and mounted in the opening of the device housing as shown in the figure to form a device housing cooling device. In FIG. 1, reference numerals 3-1 and 3-2 denote cooling device casings on the outer and inner sides of the device housing, and both sides of the separator plate 1 constitute wind tunnels that serve as channels for forced convection air. Reference numeral 4 is an external fan, and 5 is an internal fan, both of which are mounted on the central portion of the upper surface of the cooling device housing 3-1 and the lower surface of 3-2. Reference numeral 6 denotes a convection intake / exhaust port, which is provided at a large number of locations along the entire outer circumference of the cooling device housings 3-1, 3-2. The arrows show the flow direction of convection generated by the internal and external fans, but when the rotation direction of the fan is reversed, the direction of the arrow is completely opposite to the direction of the figure.

The convection of the high temperature air in the equipment casing 7 generated by the rotation of the internal fan 5 is sucked in from the outer periphery of the cooling device casing as indicated by the arrow and the amount of heat is absorbed by the pin-shaped heat receiving fin group to be cooled. The low temperature convection is discharged from the internal fan 5 and cools the inside of the device housing. When the rotation direction of the internal fan 5 is opposite, the convection flow direction is opposite, but the cooling effect inside the equipment casing is exactly the same.

The external low temperature air sucked by the rotation of the external fan 4 becomes low temperature convection and flows as shown by an arrow, and absorbs the amount of heat from the heat radiating fin group heated by the heat absorption of the heat receiving section fin group. Meanwhile, the amount of heat is released to the outside through the convection intake / exhaust holes. When the rotation direction of the internal fan 5 is opposite, the convection flow direction is opposite, but the heat radiation effect is exactly the same.

The present embodiment solves all the problems of the conventional heat pipe type sealed equipment housing cooling device by the above-described action of the long meandering thin tube heat pipe. The application form of the present embodiment is not limited to mounting on the ceiling wall surface as shown in FIG. 1, and it is possible to apply the same performance even when mounted on the side wall surface. Since it can be used in any posture and can be used in the top heat mode, it can exhibit high performance even if it is attached to the floor surface of the housing and applied. Such an application could not be realized with the conventional heat pipe type cooling device for enclosures of enclosures.

The internal and external fans have the cooling device casing 3 as shown in the drawing.
It is also a feature of this embodiment that it can be attached to the central part of -1, 3-2, whereby the convection flow can be discharged in all directions or inhaled from all directions as shown by the arrow in the figure. As a result, the flow distance required for heat exchange is short, pressure loss is small, and heat exchange efficiency is high, resulting in high performance. Since the fan mounting position is as shown in the figure, the overall height of the cooling device that protrudes in and out of the equipment housing will be slightly higher,
Since it is not necessary to attach the plate fin group, the plate fin group is sufficiently lower than the conventional example, and the cooling device as a whole is significantly reduced in size and weight.

Second Embodiment FIG. 2 is an explanatory view of a second embodiment of the present invention and is shown by a schematic sectional view. In this embodiment, the internal and external fans 4,
5 is provided in the extension part of the terminal of each of the cooling device housings 3-1 and 3-2. The convection intake / exhaust port 6 is provided on the opposite side of each fan. Therefore, although the advantage of the case where the convection flow is sucked in from all directions as in the example of FIG. 1 is lost, the heights of the cooling device casings 3-1 and 3-2 are lowered, and the equipment of the cooling device It is characterized in that the height protruding from the wall surface of the housing to the inside and outside is significantly lower than that of the first embodiment. This projection height is much lower than that of the conventional example because the plate fin group need not be mounted.

Like the first embodiment, this embodiment also solves all the problems of the conventional heat pipe type sealed equipment housing cooling device by the action of the long meandering thin tube heat pipe. The fact that any part of the device housing can be freely mounted and used is the same, and it is also possible to mount it on the bottom wall surface of the device housing. The same effect can be obtained in that the surface of the pin fin group directly serves as a heat exchange surface without the help of the plate fin group and thus the efficiency of receiving and radiating heat is high.

Third Embodiment A third embodiment of the present invention relates to the structure of the separator plate which is the first component, and will be described with reference to FIGS. 3, 5 and 7. In this embodiment, the 1-2 thin-walled metal tube shown in FIG. 5 is used as a closed container and a predetermined amount of the two-phase condensable hydraulic fluid is sealed therein. As a result, the separator plate 1 shown in FIGS. 3 and 7 becomes a flat plate-shaped heater and a pipe. Therefore, the cooling device basic unit in this embodiment has a combination structure of the meandering thin tube heat pipe and the flat plate heat pipe.

In the case of receiving and radiating heat by convection, the convection air absorbs or releases the amount of heat between its inflow portion and exhaust portion in the cooling device housings 3-1, 3-2, and gradually increases in temperature or temperature. To descend. That is, the heat exchange capacity of the cooling device gradually decreases from the inlet to the outlet. Therefore, when the path of the convection flow path is long or when the flow velocity of the convection is slow, this phenomenon occurs remarkably and the performance of the cooling device may be significantly deteriorated.

In the case of the present embodiment, since the separator plate 1 is a flat plate-shaped heater and a pipe, its temperature equalizing characteristic allows the amount of heat of a portion whose temperature has risen due to insufficient heat radiation to have a margin in its heat radiation capacity and a temperature drop portion. There is an action of transporting or transporting the amount of heat in a portion where the temperature has risen due to a surplus of heat absorption capacity to a portion where the temperature has dropped due to insufficient heat absorption, and uniformizing the heat exchange capacity of each part of the heat radiation fin group. This significantly improves the overall capacity of the enclosure cooling device.
Further, when the length of the pin fin is extended to directly absorb the heat quantity of the high temperature component and radiate the heat as in the embodiment described later, it is particularly effective and has an effect of uniformly lowering the component temperature.

The temperature equalizing characteristic of the separator plate 1 of this embodiment is outstandingly excellent in the length direction of the heat pipe constituting the plate. The above-mentioned convection temperature difference occurs in the convection flow direction. Therefore, in carrying out this embodiment, the flow direction of convection should be made to coincide with the length direction of the heat pipe. The effect is the same whether the heat pipe forming the separator plate is a group of normal heat pipes or a meandering thin pipe heat pipe in which they are connected in series.

Fourth Embodiment FIGS. 8 and 9 are explanatory views of a fourth embodiment of the present invention and are shown in a schematic sectional view. The present embodiment is a natural convection-type cooling system for a sealed device housing, which is configured by adding an auxiliary element for increasing the flow rate of natural convection to a cooling device basic unit. As a common means for natural body flow cooling, the pin fin group formed by the meandering thin tube heat pipe 2 is arranged with a step distance and a row distance of 8 mm or more, preferably 10 mm or more, in order to make the flow good. Since the natural convection flows in the vertical direction, unlike the case of forced convection, the ceiling wall mounting type and the side wall mounting type have different structures.

FIG. 8 shows an example of a ceiling-mounted type, and externally the cooling device basic unit is applied as it is.
However, in the pin fin group, a chimney effect occurs in the direction perpendicular to the gap between them, and the effect becomes better when the fin height is moderately higher. As a result of the experiment, it was found that the effect started to increase from a height of around 80 mm and reached the maximum around 300 mm. Therefore, in this embodiment shown in FIG. 8, the fin height is set to 80 mm to 400 mm as an auxiliary element for improving performance.

FIG. 9 shows an example of a side wall mounting type, in which the cooling device housings 3-1 and 3-2 are provided vertically so as to cover the entire cooling device basic unit also serving as a wind tunnel for improving the stack effect. is there. Based on the experimental results, the shape is such that the position of the convection intake / exhaust port is as close as possible to the fin in the convection inflow part, and sufficiently far from the fin in the convection outflow part.

Fifth Embodiment FIG. 10 is an explanatory view of a fifth embodiment of the equipment casing cooling apparatus of the present invention, and is shown by a schematic sectional view. There may be a case where parts 8-1 and 8-2 having a large heat generation amount are partially arranged in the equipment casing, and such an indirect cooling method for cooling the air inside the equipment casing. In many cases, it is impossible to cool. This embodiment makes it possible to selectively and strongly cool such parts 8-1, 8-2.

In a predetermined group of the heat radiation / radiation fin group 2 in the figure, those parts 2-1 and 2-corresponding to the insides of the equipment casings.
2 is extended and developed inside the housing, and the tip portion thereof is directly adhered to a predetermined high temperature heat generating component 8-1, or is attached to the high temperature heat generating component 8-2 via a heat receiving flat plate 2-3. They are bonded or heat-conductively connected.
With this configuration, the high temperature heat generating component 8-1,
The generated heat amount of 8-2 is efficiently absorbed by the heat receiving fin group due to the heat conduction between metals, is directly transported to the heat radiating portion of the fin group, and is radiated into the air outside the equipment housing. Therefore, the remaining fin group of the cooling device can efficiently cool the amount of heat generated from the remaining weak heat-generating components with a relatively light load.

Since the cooling device of this embodiment radiates the heat quantity of the main heat-generating components directly to the outside of the equipment housing, natural convection heat radiation is sufficient for cooling the remaining small quantity of heat. Therefore, in FIG. 10, the arrangement of the internal fan and the cooling device casing is omitted, and the structure is a natural convection system. However, if the internal calorific value is large and natural convection causes insufficient cooling capacity, the forced convection method may be adopted as in the other embodiments.

In this embodiment, a group of extended fins 2-2 extended into the equipment casing and a metal flat plate or a flat heat pipe having a structure suitable for mounting mounting components are thermally and adhesively connected. Alternatively, the high heat-generating component in the equipment housing may be selectively mounted on the metal flat plate or the flat heat pipe.

The configuration of this embodiment can be implemented only in the meandering thin tube heat pipe type equipment casing cooling device of the present invention having a high degree of freedom, and in the conventional normal heat pipe type equipment casing cooling device, It was absolutely impossible to configure it like this.

Sixth Embodiment FIG. 11 is an explanatory view of a sixth embodiment of the present invention and is shown by a schematic sectional view. The sealed device housing 7 of the present embodiment is a housing in which printed circuit board groups 9 are arranged in parallel and in parallel at a predetermined pitch. In the general case, the weak heat generating components in the housing cooling device are cooled by the heat transfer of the low temperature convection which is absorbed by the heat receiving fin group 2 and cooled. However, when flat plate-like bodies such as the printed circuit board group 9 are arranged in parallel and in parallel, it is extremely difficult to introduce low temperature convection into a large number of board gaps at a uniform flow rate, and it is introduced between boards. In addition, it is almost impossible to make low-temperature convection flow at the same flow velocity all over the boards, and therefore, the cooling of a large number of weak heat-generating components mounted on the group of printed circuit boards 9 is extremely uneven. However, even though it is a weak heat generating component, there are many components that greatly exceed the limit temperature and rise in temperature, which is a serious problem. Especially in the case of the natural convection method, the flow velocity of low-temperature convection is small, so that the flow velocity between the substrate gaps is large and even within the same substrate gap. The above-mentioned problems occur depending on the frequency.

In FIG. 11, a predetermined group 2-4 of the pin fin group 2 formed by the meandering thin tube heat pipe is extended and deployed in the equipment casing, and that portion is a metal having good heat conductivity. A group of flat plates or a group of flat plate heat pipes 2-5 having a small thickness are thermally connected to each other, and the group of flat plates is inserted into the board gap of the group of printed circuit boards 9 to form a printed circuit board. It is characterized in that it is arranged over the surface of 9 or is thermally connected to the surface of the printed circuit board 9.

In the cooling device constructed as described above, most of the heat generated in the components mounted on the printed circuit board 9 is radiant heat transfer or direct heat transfer, which is a group of flat metal plates or a flat heat pipe. It is absorbed evenly by the group 2-5. This amount of heat can be efficiently extended by the operation of the flat plate heat pipe or the heat conduction between metals of the heat receiving flat plate.
4 is absorbed by the heat sink 4, and this heat quantity is transported to the heat dissipating portion of the pin fin group by the thin tube heat pipe action of the group of extension fins 2-4 and dissipated outside the device housing. Since this heat transport is several tens of times more efficient than the heat transfer heat transport due to convection inside the housing, the amount of heat generated by the components mounted on the printed circuit board 9 is radiated to the outside of the equipment housing with almost no loss. .

In this way, most of the heat generated in the equipment housing is directly radiated to the outside of the equipment housing, so the amount of heat remaining in the equipment housing is extremely small. Therefore, the remaining amount of heat can be radiated only by natural convection heat absorption of the remaining pin fin group heat receiving portion, so that the forced convection generating means in the equipment casing is omitted in this embodiment. However, when the amount of heat of the remaining heating element is particularly large, a forced convection generating means may be used together.

[0046]

EFFECTS OF THE INVENTION The equipment case cooling device of the present invention, which uses the pin fin group formed by meandering of a long meandering thin tube heat pipe as a heat receiving and radiating means, enables not only downsizing and high performance but also inside the equipment case. In particular, the heat quantity of the heat generating parts that generate a large amount of heat and the heat generating parts that are difficult to cool due to the inflow of convection inside the housing can be efficiently dissipated to the outside of the equipment case by radiative heat transfer or heat conduction between metals. That is, it has become possible to exhibit excellent characteristics that could not be considered with conventional equipment casing cooling devices.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a basic structure and a first embodiment of an equipment housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 2 is an explanatory view showing a second embodiment of the device housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 3 is a plan view of a basic unit that is the basis of the device housing cooling device configuration of the present invention.

FIG. 4 is an explanatory view showing an example of a structure of a separator plate which is a first constituent element of the cooling device basic unit of the equipment housing of the present invention.

FIG. 5 is an explanatory view showing another example of the structure of the separator plate which is the first constituent element of the cooling device basic unit of the equipment housing of the present invention.

FIG. 6 is an explanatory diagram showing an example of a structure of a meandering thin tube heat pipe which is a second constituent element of the cooling device basic unit of the equipment housing of the present invention.

FIG. 7 is an explanatory diagram showing another example of the structure of the meandering thin tube heat pipe which is the second component of the cooling device basic unit of the equipment casing of the present invention.

FIG. 8 is an explanatory view showing an example of a fourth embodiment of the equipment housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 9 is an explanatory view showing another example of the fourth embodiment of the device housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 10 is an explanatory view showing a fifth embodiment of the equipment housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 11 is an explanatory view showing a sixth embodiment of the equipment housing cooling device of the present invention, and is shown in a schematic sectional view.

FIG. 12 is an explanatory view of a conventional heat pipe type closed casing cooling device of a ceiling mounting type, and is shown in a schematic sectional view.

FIG. 13 is an explanatory view of a side-mounted type of a conventional heat pipe type closed casing cooling device, which is shown in a schematic sectional view.

[Explanation of symbols]

1 Separator plate 2 Meandering thin tube heat pipe or heat radiation fin group 2-1 Extension fin 2-2 Extension fin 3-1 Cooling device housing 3-2 Cooling device housing 4 External fan 5 Internal fan 6 Convection inlet and outlet 7 Enclosed device housing 8-1 High temperature heat generating parts 8-2 High temperature heat generating parts 9 printed circuit board 11 heat pipe 12 Plate fin group 13 Separator plate 14 External fan 15 Internal fan 16 Cooling device housing 17 equipment housing

Claims (4)

(57) [Claims] 1. A device inside a device housing, which absorbs heat generated inside the device housing mainly by convection of a fluid inside the device and transports it to the outside of the device housing, and radiates heat mainly during convection of air outside the device housing. A device enclosure cooling device for preventing an increase in temperature of a heat generating part of the device enclosure device, wherein the device device enclosure cooling device is attached by airtightly covering an opening provided in a predetermined part of the device enclosure. A separator plate having a function equivalent to a housing wall and a function as a heat radiation / fination fin group support plate is used as a first component, and is formed by a meandering thin tube heat pipe, penetrating the separator plate while repeating meandering many times, It is placed upright with respect to the plate surface, the side corresponding to the inside of the equipment case is the heat receiving part, the side corresponding to the outside of the equipment case is the heat radiating part, and the intermediate part connecting them is the heat insulating part. A group of heat radiation fins held and formed on the pallet plate is used as a second component,
Mainly composed of a cooling device basic unit consisting of these two elements, a predetermined auxiliary element is attached to these, and is configured.
The separator plate, which is the first component, is a flat plate-shaped body composed of a large number of metal prisms or thin-walled tubes of metal that are closely adhered in parallel and in parallel and in an airtight manner. It is configured by closely adhering to and sandwiching the sandwiching narrow grooves formed on the outer wall surfaces of the prisms or the thin-walled tubes at the mutual bonding portion, and the group of the heat dissipating fins as the second component is L-shaped. Or, it is an inverted U-shaped pin fin group, and is formed by a loop type or non-loop type meandering thin tube heat pipe in which a long meandering thin tube container is configured by repeating a large number of meandering. Each time, a pair of l-shaped or inverted U-shaped pins are formed and a large number of pin-shaped fin groups are formed on both sides of the separator plate as a whole to form a cooling device basic unit. Sealed equipment cabinet cooling device, characterized in that there are. 2. The thin metal tube group constituting the separator plate is usually a group of heat pipes or a loop type or non-loop type long meandering thin tube heat pipe meandering. The apparatus for cooling a sealed device casing according to claim 1, wherein the thin-walled tube group is aligned with the separator plate in the same direction as the convection flow direction on both sides of the separator plate. 3. In a predetermined group of the heat radiation fin group,
The part corresponding to the inside of the housing is extended and developed inside the housing, and the tip part thereof is directly adhered to a predetermined heat-generating component in the housing, or is adhered via a heat receiving flat plate to be transferred. The closed device housing cooling device according to claim 1, wherein the cooling device is thermally connected. 4. A hermetically-sealed device housing is a housing in which printed circuit board groups are arranged in parallel and in parallel at a predetermined pitch, and a predetermined group in a heat receiving fin group of a housing cooling device. Is heat-conductively connected to a group of metal flat plates having good thermal conductivity or a flat plate-shaped heat pipe having a small thickness, and these flat plate groups are inserted into the board gap of the printed circuit board group, The sealed device housing cooling device according to claim 1, wherein the cooling device is arranged so as to cover the surface of the printed circuit board or is thermally connected to the surface of the printed circuit board.