JP3365339B2 - Semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a ball grid array type semiconductor device (hereinafter referred to as BG) in which a semiconductor element and a flexible tape are combined.
A type semiconductor device).

[0002]

2. Description of the Related Art In recent years, semiconductor devices have been highly integrated and miniaturized.
Along with this, the pitch is being narrowed down, and the semiconductor package mounting the same is also being downsized and the pitch is being narrowed down. In addition, a semiconductor package is required to have a low thermal resistance so as to correspond to a highly integrated semiconductor element that generates a large amount of heat.

As a semiconductor package, a QFP type package is currently the mainstream, but a ball grid array (BGA) package which can be made smaller than the QFP type package is now on the market. Then, the ball grid array (B
A semiconductor device using a (GA) package is called a BGA type semiconductor device.

In the BGA type semiconductor device, it has been found that it is effective to use a very thin flexible material for the carrier in order to solve the problem of the thermal expansion coefficient mismatch between the semiconductor element and the carrier on which the semiconductor element is mounted. ing. As such a flexible material, a tape containing polyimide as a main component is generally used. In addition, this tape has very fine wiring and can have a narrow pitch. This type of BGA type semiconductor device is referred to as a tape BGA type semiconductor device (hereinafter referred to as tape BGA).

The conventional tape BGA is the tape BG shown in FIG.
This is illustrated in the schematic cross-sectional view of the structure A. As shown in FIG. 8, in this tape BGA, the tape 2, the reinforcing plate 7 and the heat radiating plate 8 are laminated and bonded to each other with a thermosetting or thermoplastic adhesive 10. The reinforcing plate 7 is also called a stiffener, and is used to prevent the warp of the tape 2 that causes mounting failure of the tape BGA on a mounting substrate (not shown), and is made of a material that is less likely to be deformed than the tape 2. Composed of metal (eg copper or stainless steel).
A device hole is formed in the central portion of the tape 2 and the reinforcing plate 7. The semiconductor element 1 is housed in the device hole, and the heat dissipation paste (for example, silicone paste) 11
It is fixed to the heat sink 8 by. The heat radiating plate 8 is also called a heat spreader and is for dissipating the heat generated by the semiconductor element 1, and is a metal having excellent thermal conductivity (for example, copper).
Alternatively, it is composed of ceramic (for example, alumina).

A plurality of lands 5 are formed in a matrix on the tape 2. The land 5 is connected to the electrode of the semiconductor element 1 via the wiring 4 formed on the tape 2 and the inner lead 3 protruding into the device hole. Here, the inner lead 3, the wiring 4, and the land 5 are patterned and formed of a metal material (for example, copper). The land 5 formed on the tape 2
Solder bumps 6 to be mounted on the mounting substrate are formed on the top.

Fixed to the heat sink 8 in the device hole,
The semiconductor element 1 to which the inner leads 3 are connected is sealed by a potting method with a sealing resin (for example, epoxy resin) 9 for protecting the semiconductor element 1.

When this tape BGA is mounted on a mounting substrate (not shown), solder paste is applied on the lands of the mounting substrate and the solder bumps 6 of the tape BGA are positioned on the lands of the mounting substrate. Then, the solder bumps 6 are heated to a temperature equal to or higher than the melting point of the solder bumps 6. As a result, the tape BGA is mounted on the mounting board.

[0009]

The above-described conventional tape BGA uses the reinforcing plate 7 made of metal (for example, copper or stainless steel) in order to suppress the warp of the tape 2. Since the reinforcing plate 7 is made of metal, it is heavy. Therefore, the tape BGA
When mounted on a mounting substrate, there is a problem that the solder bumps 6 that are heated and melted by the weight of the tape BGA itself are crushed and short-circuited with the adjacent solder bumps 6.

Further, since the reinforcing plate 7 is made of metal and the heat dissipation plate 8 is opaque because it is made of metal or ceramic, it is possible to visually confirm whether the solder bumps 6 on the lower surface of the tape BGA mounted on the mounting substrate are short-circuited. There is a problem that it cannot be confirmed unless the X-ray inspection device is used.

Therefore, an object of the present invention is to provide a tape BGA which prevents the solder bumps from being crushed by the weight of the tape BGA itself and short-circuited with the adjacent solder bumps when the tape BGA is mounted on a mounting substrate. To do.

Another object of the present invention is to determine whether the solder bumps on the lower surface of the tape BGA mounted on the mounting substrate are short-circuited.
It is to provide a tape BGA that can be visually confirmed.

[0013]

The semiconductor device of the present invention comprises:
A semiconductor element, and a flexible tape having a plurality of solder bumps electrically connected to the semiconductor element,
In a semiconductor device having a plate-shaped reinforcing material that is attached to the tape and supports the tape, and a sealing resin that seals a surface and the periphery of the semiconductor element and a connection portion of the tape with the semiconductor element , The reinforcing material is another adhesive
The adhesive is applied directly to the tape without the interposition of
Of the reinforcing material formed on the side opposite to the tape side.
The surface is more protruding than the back surface of the semiconductor element.
In addition, the reinforcing material is formed by applying a resin to the tape by a screen method and then heating and curing the resin.

[0014]

Further, on the surface of the semiconductor element opposite to the surface to which the tape is connected, a heat dissipation plate for dissipating heat generated by the semiconductor element is attached by an adhesive.
The size of the heat sink is larger than the size of the semiconductor element and smaller than the formation range of the solder bumps formed on the tape.

The semiconductor device of the present invention comprises a semiconductor element and a plurality of solder bumps electrically connected to the semiconductor element.
A semiconductor device comprising: a flexible tape formed on a first main surface; and a sealing resin for sealing a surface and a periphery of the semiconductor element and a connecting portion of the tape with the semiconductor element, The thickness of the tape is thicker than the thickness of the semiconductor element, and the surface of the semiconductor element opposite to the surface to which the tape is connected is on the side opposite to the first main surface of the tape on which the solder bumps are formed . The tape is recessed from the second main surface , and the tape has the first main surface and the second main surface.
There is no adhesive film between the main surface and the main surface
It is characterized in that it is composed of the same material .

Further, on the surface of the semiconductor element opposite to the surface to which the tape is connected, a heat dissipation plate for dissipating heat generated by the semiconductor element is attached by an adhesive.
The size of the heat sink is larger than the size of the semiconductor element and smaller than the formation range of the solder bumps formed on the tape.

[0018]

The sealing resin is a transparent resin.

According to the present invention as described above, the reinforcing plate of the semiconductor device is a reinforcing plate composed of an adhesive, a tape also serving as the reinforcing plate, or a sealing resin also serving as the reinforcing plate. Therefore, the weight of the semiconductor device can be reduced and the weight of the semiconductor device can be reduced as compared with the conventional metal reinforcing plate.

The reinforcing plate of the semiconductor device is made of an adhesive, the tape also serves as the reinforcing plate, or the transparent sealing resin also serves as the reinforcing plate. it can. Then, by arranging or not providing the heat dissipation plate so that the solder bumps formed on the tape can be seen, it is possible to visually confirm whether or not the solder bumps on the lower surface of the tape BGA mounted on the mounting substrate are short-circuited.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic sectional view showing a first embodiment of the present invention.

As shown in FIG. 1, the tape B of this embodiment
In the GA, a reinforcing plate 71 made of an adhesive is laminated on the tape 2 and attached. The reinforcing plate 71 is for preventing the warp of the tape 2 which causes a mounting failure of the tape BGA on a mounting substrate (not shown). Therefore, the reinforcing plate 71 made of an adhesive is made of a resin that is less deformable than the tape 2, for example, a thermosetting epoxy resin, and is thickened to obtain strength, for example, 0.5 mm. It is a thing. Then, a resin is applied to the tape 2 by, for example, a screen method, and then heated and cured. The thickness of the conventional metal reinforcing plate 7 is, for example, 0.35 mm.

A device hole is formed in the central portion of the tape 2 and the reinforcing plate 71. The semiconductor element 1 is housed in the device hole and fixed to the heat dissipation plate 8 with a heat dissipation paste (for example, silicone paste) 11. The heat dissipation plate 8 is also called a heat spreader, and is for dissipating the heat generated by the semiconductor element 1, and is made of metal (for example, copper) or ceramic (for example, alumina) having excellent thermal conductivity. The heat radiating plate 8 is sized so that the solder bumps 6 can be seen through the reinforcing plate 71 and the tape 2 made of an adhesive and that the device hole in the central portion of the reinforcing plate 71 is covered.

On the tape 2, a plurality of lands 5 are formed in a matrix. The land 5 is connected to the electrode of the semiconductor element 1 via the wiring 4 formed on the tape 2 and the inner lead 3 protruding into the device hole. Here, the inner lead 3, the wiring 4, and the land 5 are patterned and formed of a metal material (for example, copper). The land 5 formed on the tape 2
Solder bumps 6 to be mounted on the mounting substrate are formed on the top.

Fixed to the heat sink 8 in the device hole,
The semiconductor element 1 to which the inner leads 3 are connected is sealed by a potting method with a sealing resin (for example, epoxy resin) 9 for protecting the semiconductor element 1.

FIG. 2 is a schematic sectional view showing the second embodiment of the present invention. As shown in FIG. 2, in the tape BGA of this embodiment, the reinforcing plate 71 of the first embodiment shown in FIG.
Is composed of an adhesive, whereas the tape 21 also serves as a reinforcing plate. Therefore, the tape 21 is configured as a reinforcing plate and is made of polyimide as a main component, and has a large thickness, for example, 0.6 mm in order to obtain strength that is difficult to deform. The thickness of the tape 21 is thicker than that of the semiconductor element 1 and protrudes from a position opposite to the surface of the semiconductor element 1 to which the inner lead 3 protruding from the tape 21 is connected. The thickness of the conventional metal reinforcing plate 7 is, for example, 0.35 mm. And
The heat dissipation plate 8 is such that the solder bumps 6 can be seen through the tape 21 which also functions as a reinforcing plate, and the tape 21 which also functions as a reinforcing plate.
It is sized to cover the device hole in the central part of the.
The configuration other than the tape 21 and the heat sink 8 is the same as in FIG.
The same as the first embodiment shown in FIG.

FIG. 3 is a schematic sectional view showing a third embodiment of the present invention. As shown in FIG. 3, in the tape BGA of the present embodiment, as in the first embodiment shown in FIG. 1, a reinforcing plate 71 made of an adhesive is laminated and attached to the tape 2. However, unlike the first embodiment shown in FIG. 1, the heat dissipation plate 8 is not provided. The configuration other than the heat sink is the same as that of the first embodiment shown in FIG. This is because the semiconductor device 1 mounted on the tape BGA has a small amount of heat generation and it is not necessary to provide a heat radiating plate, the configuration of this embodiment can be adopted.

FIG. 4 is a schematic sectional view showing a fourth embodiment of the present invention. As shown in FIG. 4, in the tape BGA of the present embodiment, the tape 21 also serves as a reinforcing plate as in the second embodiment shown in FIG. 2, but the second embodiment shown in FIG. Unlike the embodiment, the heat dissipation plate 8 is not provided. The configuration other than the heat sink is the same as that of the second embodiment shown in FIG. This is because the semiconductor device 1 mounted on the tape BGA has a small amount of heat generation and it is not necessary to provide a heat radiating plate, the configuration of this embodiment can be adopted.

FIG. 5 is a schematic sectional view showing a fifth embodiment of the present invention. As shown in FIG. 5, in the tape BGA of this embodiment, the sealing resin 91 seals the semiconductor element 1 to which the inner leads 3 are connected, and is opposite to the surface of the tape 2 on which the solder bumps 6 are formed. It is integrally formed on the surface and doubles as a reinforcing plate. Therefore, the sealing resin 91
The material is made of thermosetting resin such as epoxy resin in order to obtain strength that is difficult to deform as a reinforcing plate. The encapsulating resin 91 is made of a transparent resin such that the solder bumps 6 can be seen through the encapsulating resin 91 also serving as a reinforcing plate and the tape 2. Such a resin is called a clear mold resin. The sealing method is a transfer molding method using a sealing die. And the heat sink is shown in FIG.
The third embodiment shown in FIG. 4 and the fourth embodiment shown in FIG. 4 are not provided. The configuration other than the sealing resin 91 that also serves as the reinforcing plate is the same as that of the third embodiment shown in FIG. 3 and the fourth embodiment shown in FIG.

FIG. 6 is a schematic sectional view showing a sixth embodiment of the present invention. As shown in FIG. 6, the tape BGA of this embodiment has the same structure as the conventional tape BGA shown in FIG. 8, but the reinforcing plate 71 made of an adhesive is used as the tape 2
It is also laminated and attached to the heat dissipation plate 8. The structure other than the reinforcing plate 71 made of an adhesive is the same as that of the conventional tape BGA shown in FIG. The tape BGA of this embodiment has the same configuration as that of the first embodiment shown in FIG. 1, but the heat dissipation plate 8 is larger than that of the first embodiment shown in FIG. The tape BGA has the same external dimensions as the tape 2. The configuration other than the size of the heat dissipation plate 8 is the same as that of the first embodiment shown in FIG. this is,
When the semiconductor element 1 mounted on the tape BGA has a large amount of heat generation and it is necessary to provide a large heat dissipation plate 8, the configuration of this embodiment is adopted. However, in the tape BGA of the present embodiment, the size of the heat dissipation plate 8 is the same as the outer size of the tape 2, and the solder bump 6 cannot be seen through the reinforcing plate 71 and the tape 2 which are made of an adhesive. Absent.

FIG. 7 is a schematic sectional view showing a seventh embodiment of the present invention. As shown in FIG. 7, the tape BGA of the present embodiment has the same configuration as the conventional tape BGA shown in FIG. 8, but the tape 21 also serves as a reinforcing plate. And, the structure other than the tape 21 which also serves as the reinforcing plate is
It has the same structure as the conventional tape BGA shown in FIG. The tape BGA of this embodiment has the same configuration as that of the second embodiment shown in FIG. 2, but the heat dissipation plate 8 is larger than that of the second embodiment shown in FIG. The tape BGA has the same size as the outer dimension of the tape 21. The configuration other than the size of the heat sink 8 is shown in FIG.
Is the same as the second embodiment shown in FIG. This is tape B
When the amount of heat generated by the semiconductor element 1 mounted on the GA is large and it is necessary to provide a large heat dissipation plate 8, the configuration of this embodiment is adopted. However, in the tape BGA of this embodiment, the size of the heat dissipation plate 8 is the same as the outer size of the tape 21, and the solder bumps 6 cannot be seen through the tape 21.

[0033]

As described above, according to the present invention, the reinforcing plate of the tape BGA is a reinforcing plate composed of an adhesive, the tape also serves as the reinforcing plate, or the sealing resin is the reinforcing plate. Since it also serves as a combination, the weight can be reduced as compared with the conventional metal reinforcing plate, and the weight of the tape BGA can be reduced. For example, in the case of a product of □ 40 mm, the weight is
The weight can be reduced to 5/8 in the second embodiment, 3/8 in the third, fourth and fifth embodiments, and 3/4 in the sixth and seventh embodiments. As a result, when the tape BGA is mounted on the mounting substrate, it is possible to prevent the solder bumps heated and melted by the weight of the tape BGA itself from being crushed and being short-circuited with the adjacent solder bumps.

Further, the reinforcing plate of the tape BGA is a reinforcing plate made of an adhesive, a tape also functions as a reinforcing plate, or a transparent sealing resin also functions as a reinforcing plate. it can. Then, an opaque heat dissipation plate is sized or not provided so that the solder bumps formed on the tape can be seen. It is also possible to obtain the effect that it can be visually confirmed without doing so.

When the reinforcing plate of the tape BGA is the one in which the sealing resin also serves as the reinforcing plate, the sealing method is a transfer molding method using a sealing die, and therefore, a general plastic package is used. The effect that a mold sealing device can be used is also obtained.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing a first embodiment of a semiconductor device of the present invention.

FIG. 2 is a schematic cross-sectional view showing a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing a third embodiment of the present invention.

FIG. 4 is a schematic sectional view showing a fourth embodiment of the present invention.

FIG. 5 is a schematic sectional view showing a fifth embodiment of the present invention.

FIG. 6 is a schematic sectional view showing a sixth embodiment of the present invention.

FIG. 7 is a schematic sectional view showing a seventh embodiment of the present invention.

FIG. 8 is a schematic sectional view illustrating a conventional technique.

[Explanation of symbols]

1 Semiconductor element 2 tapes 21 Tape that doubles as a reinforcing plate 3 inner lead 4 wiring 5 lands 6 Solder bump 7 Reinforcement plate (stiffener) 71 Reinforcement plate composed of adhesive 8 Heat sink (heat spreader) 9 Sealing resin 91 Sealing resin that doubles as a reinforcing plate 10 adhesive 11 Heat dissipation paste

Front page continuation (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/12

Claims (7)

(57) [Claims] 1. A semiconductor element, a flexible tape having a plurality of solder bumps electrically connected to the semiconductor element, and a plate-like tape attached to the tape to support the tape. A semiconductor device comprising a reinforcing material, and a sealing resin for sealing the surface and the periphery of the semiconductor element and a connecting portion of the tape with the semiconductor element, wherein the reinforcing
The material is applied directly to the tape without any other adhesive.
And the side opposite to the tape side.
The surface of the reinforcing material of the
Further, the reinforcing material is configured by applying a resin to the tape by a screen method and then heating and curing the resin. 2. A semiconductor device according to claim 1 , wherein a heat dissipation plate for dissipating heat generated by the semiconductor element is attached to the surface of the semiconductor element opposite to the surface to which the tape is connected, by an adhesive. apparatus. Wherein the radiating plate is larger than the size of the semiconductor element size, a semiconductor device forming area smaller claim 2, wherein the solder bumps formed on the tape. 4. A semiconductor element, a flexible tape in which a plurality of solder bumps electrically connected to the semiconductor element are formed on a first main surface , a surface and a periphery of the semiconductor element, and the semiconductor tape. In a semiconductor device having a sealing resin that seals a connecting portion of a tape with the semiconductor element, the thickness of the tape is thicker than the thickness of the semiconductor element, and the surface of the semiconductor element is opposite to the surface to which the tape is connected. Surface is opposite to the first main surface of the tape on which the solder bumps are formed.
The second main surface on the side of the tape
Is an adhesive film between the first main surface and the second main surface.
Both main surfaces are continuously made of the same material without having
Wherein a is. Wherein the surface opposite to the tape connected to the surface of the semiconductor element, the claims radiator plate for dissipating heat generated of the semiconductor element, are attached by an adhesive
4. The semiconductor device according to 4 . Wherein said heat radiating plate is larger than the size of the semiconductor element size, a semiconductor device forming area smaller claim 5, wherein the solder bumps formed on the tape. Wherein said sealing resin, the semiconductor device according to claim 1 or 4, wherein the transparent resin.