JP3367083B2 - Polishing sheet and method for producing the same - Google Patents
Polishing sheet and method for producing the sameInfo
- Publication number
- JP3367083B2 JP3367083B2 JP12322394A JP12322394A JP3367083B2 JP 3367083 B2 JP3367083 B2 JP 3367083B2 JP 12322394 A JP12322394 A JP 12322394A JP 12322394 A JP12322394 A JP 12322394A JP 3367083 B2 JP3367083 B2 JP 3367083B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- cerium oxide
- abrasive
- polishing
- oxide particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002245 particle Substances 0.000 claims description 80
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 30
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 30
- 239000002002 slurry Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- 239000006061 abrasive grain Substances 0.000 claims description 6
- 238000004898 kneading Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims 2
- 239000010432 diamond Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000004411 aluminium Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 11
- 239000013307 optical fiber Substances 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002353 algacidal effect Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶表示板、光ファイ
バー端面を研磨するための研磨シートおよびその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display panel, a polishing sheet for polishing an end face of an optical fiber, and a method for manufacturing the polishing sheet.
【０００２】[0002]
【従来技術】液晶表示板は、ガラス板電極間において液
晶分子が電界の作用により偏光面を変化させる等の現象
を利用した表示素子であり、ガラス板電極間に均一な電
界を形成させるため、ガラス板表面を平坦かつ透明に研
磨しなければならない。2. Description of the Related Art A liquid crystal display panel is a display element that utilizes a phenomenon in which liquid crystal molecules change the plane of polarization by the action of an electric field between glass plate electrodes. In order to form a uniform electric field between glass plate electrodes, The glass plate surface must be polished flat and transparent.
【０００３】また、光ファイバーは、ガラスを基材とし
た光の周波数帯の導波路であり、光ファイバー同士を接
続する場合、その接続面を通過する光の強度を減衰させ
たり乱反射を生じさせないため、光ファイバー端面には
非常に高度な平坦度および透明度が要求される。Further, the optical fiber is a waveguide in the frequency band of light made of glass as a base material, and when connecting the optical fibers, since the intensity of the light passing through the connecting surface is not attenuated or irregular reflection is caused, A very high degree of flatness and transparency is required at the end face of the optical fiber.
【０００４】従来、このような液晶表示用ガラス板の表
面、光ファイバー端面は、比較的硬質の砥粒、例えば酸
化アルミニウム粒子を付着させた研磨シートによって研
磨されていた。Conventionally, the surface of such a glass plate for a liquid crystal display and the end face of an optical fiber have been polished by a polishing sheet having relatively hard abrasive grains, for example, aluminum oxide particles attached thereto.
【０００５】[0005]
【発明が解決しようとする課題】しかし、従来の硬質の
砥粒を付着させた研磨シートで液晶表示用ガラス板表
面、光ファイバー端面を研磨すると、液晶表示用ガラス
板表面、光ファイバー端面の透明度が劣化することか
ら、軟質の砥粒、例えば酸化セリウム粒子を付着させた
研磨シートでの仕上研磨が行なわれるため、２段階の研
磨工程が必要であり、また研磨テープの交換が必要であ
った。However, when the surface of the glass plate for a liquid crystal display and the end face of the optical fiber are polished with a conventional polishing sheet to which hard abrasive grains are adhered, the transparency of the glass plate surface for the liquid crystal display and the end face of the optical fiber deteriorates. Therefore, since the finishing polishing is performed with the polishing sheet to which the soft abrasive grains, for example, the cerium oxide particles are attached, the two-step polishing process is required and the polishing tape needs to be replaced.
【０００６】そこで、本発明の目的は、１段階の研磨工
程でガラス板表面およびファイバー端面等を平坦かつ透
明に研磨することができる研磨シートおよびその製造方
法を提供することである。Therefore, an object of the present invention is to provide a polishing sheet capable of polishing the surface of a glass plate, the end face of a fiber and the like in a flat and transparent manner in a single polishing step, and a method for producing the same.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明の研磨シートは、酸化セリウム粒子とその他
の研磨材粒子との混合物とバインダー接着剤とを混練し
たスラリーを基板シートに塗布して成る。In order to achieve the above object, the polishing sheet of the present invention comprises a substrate sheet coated with a slurry prepared by kneading a mixture of cerium oxide particles and other abrasive particles and a binder adhesive. Consists of
【０００８】ここで、その他の研磨材粒子は、ダイヤモ
ンド、酸化アルミニウム、若しくはシリコンカーバイド
等である。[0008] Here, other abrasive grains, die algicidal <br/> command, aluminum oxide, or silicon carbide or the like.
【０００９】酸化セリウム粒子およびその他の研磨材粒
子の平均粒径は、０.１μｍから４０μｍの範囲にあ
り、酸化セリウム粒子の平均粒径が、その他の研磨材粒
子の平均粒径以上の大きさである。The average particle size of the cerium oxide particles and other abrasive particles is in the range of 0.1 μm to 40 μm, and the average particle size of the cerium oxide particles is larger than the average particle size of the other abrasive particles. Is.
【００１０】酸化セリウム粒子とその他の研磨材粒子と
の重量混合比は、１：９から９：１の範囲である。The weight mixing ratio of the cerium oxide particles to the other abrasive particles is in the range of 1: 9 to 9: 1.
【００１１】本発明の上記研磨シートの製造方法は、酸
化セリウム粒子とその他の研磨材粒子とを混合する工程
と、酸化セリウムとその他の研磨材粒子とを混合したも
のとバインダー接着剤とを混練してスラリーとする工程
と、このスラリーを基板シートに塗布する工程とから成
る。In the method for producing the above-mentioned abrasive sheet of the present invention, the step of mixing cerium oxide particles with other abrasive particles, the mixture of cerium oxide with other abrasive particles and the binder adhesive are kneaded. And forming a slurry, and applying the slurry to the substrate sheet.
【００１２】また、本発明の研磨シートの製造方法は、
酸化セリウム粒子とその他の研磨材粒子とを混合する工
程の前に、酸化セリウム粒子およびその他の研磨材粒子
を乾燥させる工程を含む。The method of manufacturing the polishing sheet of the present invention is
Before the step of mixing the cerium oxide particles and the other abrasive particles, a step of drying the cerium oxide particles and the other abrasive particles is included.
【００１３】この乾燥は、酸化セリウム粒子とその他の
研磨材粒子とをそれぞれ１００°Ｃから１５０°Ｃの温
度で約１時間加熱乾燥することができる。In this drying, the cerium oxide particles and the other abrasive particles can be dried by heating at a temperature of 100 ° C. to 150 ° C. for about 1 hour.
【００１４】[0014]
【実施例】図１は、本発明の研磨シートの拡大断面図の
概念図である。EXAMPLE FIG. 1 is a conceptual diagram of an enlarged sectional view of a polishing sheet of the present invention.
【００１５】図１を参照して、本発明の研磨シート１０
は、酸化セリウム粒子１とその他の研磨材粒子２との混
合物とバインダー接着剤３とを混練したスラリーを基板
シート４に塗布して成る。Referring to FIG. 1, the polishing sheet 10 of the present invention.
Is formed by applying a slurry obtained by kneading a mixture of cerium oxide particles 1 and other abrasive particles 2 and a binder adhesive 3 to the substrate sheet 4.
【００１６】その他の研磨材粒子２は、ダイヤモンド、
酸化アルミニウム、若しくはシリコンカーバイド等の粒
子である。[0016] Other abrasive particles 2, die Ya Monde,
The particles are particles of aluminum oxide or silicon carbide.
【００１７】酸化セリウム粒子１の平均粒径とその他の
研磨材粒子２の平均粒径は約０.１μｍから４０μｍの
範囲にあり、酸化セリウム粒子１の平均粒径がその他の
研磨材粒子２の平均粒径と同程度か或いはそれ以上の大
きさであることが望ましい。酸化セリウム粒子１の大き
さとその他の研磨材粒子２の大きさとに差がありすぎる
と偏析することがある。The average particle size of the cerium oxide particles 1 and the average particle size of the other abrasive particles 2 are in the range of about 0.1 μm to 40 μm, and the average particle size of the cerium oxide particles 1 is larger than that of the other abrasive particles 2. It is desirable that the average particle size be about the same or larger. If there is too much difference between the size of the cerium oxide particles 1 and the size of the other abrasive particles 2, segregation may occur.
【００１８】酸化セリウム粒子１とその他の研磨材粒子
２との重量混合比は１：９から９：１の範囲にある。The weight mixing ratio of the cerium oxide particles 1 to the other abrasive particles 2 is in the range of 1: 9 to 9: 1.
【００１９】バインダー接着剤３は、ポリエステル系、
ポリエステル・ポリウレタン系、または塩化ビニル・酢
酸ビニル系樹脂接着剤である。The binder adhesive 3 is a polyester adhesive,
It is a polyester / polyurethane-based or vinyl chloride / vinyl acetate-based resin adhesive.
【００２０】基板シート４は、厚さ１０μｍから５００
μｍの範囲にあるポリエステルフィルム、ポリウレタン
フォームフィルム、または不織布等である。The substrate sheet 4 has a thickness of 10 μm to 500 μm.
It is a polyester film, a polyurethane foam film, a non-woven fabric, or the like in the range of μm.
【００２１】本発明の研磨シート１０は、酸化セリウム
粒子１とその他の研磨材粒子２とをそれぞれ１００°Ｃ
から１５０°Ｃの範囲の温度で約１時間加熱乾燥させて
水分を除去し、両者を混合し、バインダー接着剤３と混
練してスラリーとし、次いでこのスラリーを基板シート
４上に塗布し、乾燥させて製造される。The polishing sheet 10 of the present invention contains cerium oxide particles 1 and other abrasive particles 2 at 100 ° C., respectively.
To 150 ° C. for about 1 hour to remove moisture, mix both, knead with the binder adhesive 3 to form a slurry, and then apply this slurry onto the substrate sheet 4 and dry. Is manufactured.
【００２２】本発明の研磨シートは、液晶表示用ガラス
板表面、光ファイバー端面の研磨のみならず他の被研磨
物、例えばレンズ表面等の研磨に応用され得る。The polishing sheet of the present invention can be applied not only to polishing the surface of the glass plate for liquid crystal display and the end surface of the optical fiber, but also to polishing other objects to be polished, such as the lens surface.
【００２３】本発明の研磨シート１０は具体的に以下の
ように製造された。
［実施例１］ 液晶表示板用ガラス板の表面を研磨する
ための研磨シートとして以下の通りに製造した。The polishing sheet 10 of the present invention was specifically manufactured as follows. Example 1 A polishing sheet for polishing the surface of a glass plate for a liquid crystal display plate was manufactured as follows.
【００２４】平均粒径２μｍの酸化セリウム粒子と、平
均粒径１μｍの酸化アルミニウム粒子とをそれぞれ１１
０°Ｃの温度で約１時間加熱乾燥し水分を除去し、両者
を混合した。このとき、酸化セリウム粒子と酸化アルミ
ニウム粒子との重量混合比は２：１であった。Cerium oxide particles having an average particle size of 2 μm and aluminum oxide particles having an average particle size of 1 μm were used in each case.
The mixture was heated and dried at a temperature of 0 ° C. for about 1 hour to remove water, and both were mixed. At this time, the weight mixing ratio of the cerium oxide particles and the aluminum oxide particles was 2: 1.
【００２５】次に、酸化セリウム粒子と酸化アルミニウ
ム粒子との混合物にポリエステル系のバインダー接着剤
を混入して混練し、粘度８０ｃｐから１５０ｃｐのスラ
リーとし、このスラリーを厚さ３０μｍのポリエステル
フィルムの基板シート上に均一に塗布し、このスラリー
を塗布した基板シートを乾燥器内で１００°Ｃから１３
０°Ｃの温度で乾燥させて本発明の、液晶表示板用ガラ
ス板の表面を研磨するための研磨シートを製造した。
［実施例２］ 光ファイバー端面を研磨するための研磨
シートとして以下の通りに製造した。Next, a polyester binder adhesive is mixed into a mixture of cerium oxide particles and aluminum oxide particles and kneaded to form a slurry having a viscosity of 80 cp to 150 cp. This slurry is a polyester film substrate sheet having a thickness of 30 μm. The substrate sheet coated evenly on the above and coated with this slurry was dried at 100 ° C to 13 ° C in a dryer.
A polishing sheet for polishing the surface of the glass plate for a liquid crystal display plate of the present invention was manufactured by drying at a temperature of 0 ° C. Example 2 A polishing sheet for polishing the end face of an optical fiber was manufactured as follows.
【００２６】平均粒径１μｍの酸化セリウム粒子と、平
均粒径１μｍのシリコンカーバイド粒子とをそれぞれ１
１０°Ｃの温度で約１時間加熱乾燥し水分を除去し、両
者を混合した。このとき、酸化セリウム粒子とシリコン
カーバイドとの重量混合比は５：１であった。One cerium oxide particle having an average particle size of 1 μm and one silicon carbide particle having an average particle size of 1 μm are used.
The water was removed by heating and drying at a temperature of 10 ° C. for about 1 hour, and both were mixed. At this time, the weight mixing ratio of the cerium oxide particles and the silicon carbide was 5: 1.
【００２７】次に、酸化セリウム粒子とシリコンカーバ
イド粒子との混合物にポリエステル・ポリウレタ系のバ
インダー接着剤を混入して混練し、粘度８０ｃｐから１
５０ｃｐのスラリーとし、このスラリーを厚さ３０μｍ
のポリウレタンフォームフィルムの基板シート上に均一
に塗布し、このスラリーを塗布した基板シートを乾燥器
内で１００°Ｃから１３０°Ｃの温度で乾燥させて本発
明の、光ファイバー端面を研磨するための研磨シートを
製造した。Next, a polyester / polyurethane binder adhesive is mixed in a mixture of cerium oxide particles and silicon carbide particles and kneaded to obtain a viscosity of 80 cp to 1
A 50 cp slurry with a thickness of 30 μm
For uniformly polishing the polyurethane foam film on a substrate sheet, and drying the substrate sheet coated with this slurry at a temperature of 100 ° C. to 130 ° C. in a dryer to polish the end face of the optical fiber of the present invention. An abrasive sheet was manufactured.
【００２８】[0028]
【発明の効果】本発明の研磨シートを実施すると、従来
の粗研磨用の研磨シートと仕上研磨用の研磨シートとを
使用した２段階の研磨工程で得られた研磨面の平坦度お
よび透明度を１段階の研磨工程で得ることができ、さら
に、研磨時間も大幅に短縮できる。When the polishing sheet of the present invention is carried out, the flatness and the transparency of the polishing surface obtained by the two-step polishing process using the conventional rough polishing polishing sheet and finish polishing polishing sheet can be improved. It can be obtained by a one-step polishing process, and the polishing time can be greatly shortened.
【図１】本発明の研磨シートの拡大断面図である。FIG. 1 is an enlarged cross-sectional view of a polishing sheet of the present invention.
１ ．．．酸化セリウム粒子 ２ ．．．その他の研磨材粒子 ３ ．．．バインダー接着剤 ４ ．．．基板シート １０．．．本発明の研磨シート 1. ． ． Cerium oxide particles 2. ． ． Other abrasive particles 3. ． ． Binder adhesive 4. ． ． Board sheet 10. ． ． Abrasive sheet of the present invention
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B24D 11/00 B24D 3/00 320 B24D 3/00 330 ─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. 7 , DB name) B24D 11/00 B24D 3/00 320 B24D 3/00 330
Claims (2)
リーを基板シートに塗布し、乾燥させて成る研磨シート
において、 前記砥粒が、酸化セリウム粒子と、その他の研磨材粒子
との混合物であり、 前記酸化セリウム粒子の平均粒径が、前記その他の研磨
材粒子の平均粒径以上の大きさであり、 前記酸化セリウム粒子と前記その他の研磨材粒子との重
量混合比が、１：９から９：１の範囲にあり、 前記その他の研磨材粒子として、ダイヤモンド、酸化ア
ルミニウム又はシリコンカーバイドの粒子が使用され
る、 ところの研磨シート。1. A slurry prepared by kneading abrasive grains and a binder adhesive.
Polishing sheet made by applying substrate to substrate sheet and drying
At The abrasive grains are cerium oxide particles and other abrasive particles
Is a mixture with The average particle size of the cerium oxide particles is the other polishing
The average particle size of the material particles or more, Weight of the cerium oxide particles and the other abrasive particles
The volume mixing ratio is in the range of 1: 9 to 9: 1., As the other abrasive particles, diamond and oxide
Luminium or Silicon Carbide particles are used
The Polishing sheet.
とを混合する工程であって、前記酸化セリウム粒子の平
均粒径が、前記その他の研磨材粒子の平均粒径以上の大
きさであり、前記酸化セリウム粒子と前記その他の研磨
材粒子との重量混合比が、１：９から９：１の範囲にあ
り、前記その他の研磨材粒子として、ダイヤモンド、酸
化アルミニウム又はシリコンカーバイドの粒子が使用さ
れる、ところの工程、 前記酸化セリウム粒子と前記その他の研磨材粒子との混
合物と、バインダー接着剤とを混練してスラリーとする
工程、及び前記スラリーを基板シートの表面に塗布し、
これを乾燥させる工程、 から成る研磨シートの製造方法。2. A step of mixing cerium oxide particles and other abrasive particles, wherein the average particle diameter of the cerium oxide particles is equal to or larger than the average particle diameter of the other abrasive particles. The weight mixing ratio of the cerium oxide particles to the other abrasive particles is in the range of 1: 9 to 9: 1.
, Other abrasive particles, diamond, acid
Aluminium or Silicon Carbide particles are used
It is Ru, at the step, by applying a mixture of the cerium oxide particles the other abrasive particles, a step of a slurry by kneading the binder adhesive, and the slurry on the surface of the substrate sheet,
A method of manufacturing an abrasive sheet, which comprises a step of drying the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12322394A JP3367083B2 (en) | 1994-05-13 | 1994-05-13 | Polishing sheet and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12322394A JP3367083B2 (en) | 1994-05-13 | 1994-05-13 | Polishing sheet and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07308861A JPH07308861A (en) | 1995-11-28 |
| JP3367083B2 true JP3367083B2 (en) | 2003-01-14 |
Family
ID=14855255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12322394A Expired - Lifetime JP3367083B2 (en) | 1994-05-13 | 1994-05-13 | Polishing sheet and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3367083B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101050274B1 (en) | 2009-12-31 | 2011-07-19 | 한국생산기술연구원 | Abrasive pad containing polishing pad and method for manufacturing same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4601317B2 (en) * | 2004-04-15 | 2010-12-22 | 株式会社リコー | Polishing tool and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993022103A1 (en) | 1992-04-27 | 1993-11-11 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
-
1994
- 1994-05-13 JP JP12322394A patent/JP3367083B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993022103A1 (en) | 1992-04-27 | 1993-11-11 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101050274B1 (en) | 2009-12-31 | 2011-07-19 | 한국생산기술연구원 | Abrasive pad containing polishing pad and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07308861A (en) | 1995-11-28 |
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