JP3368243B2 - Molding equipment for resin sealing - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealing die device for resin-sealing an electronic component such as a semiconductor element, and more particularly, a resin-sealing die for resin-sealing an electronic component arranged on only one surface of a substrate. Regarding the mold device.

[0002]

2. Description of the Related Art Conventionally, as a mold device for resin sealing of electronic parts such as semiconductors, for example, as shown in FIG. 12, an upper mold having an upper chess 2 is incorporated. There is a set including a set 1 and a lower mold set 3 incorporating a lower chess 4. Then, by pushing up the lower mold set 3, the lower mold set 3 is pressed against and clamped to the upper mold set 1, and the cavity block 5 assembled on the lower surface of the upper mold chess 2 and the upper surface of the lower mold chess 4 are attached. The substrate 7 was held by the cavity bar 6 attached to the substrate. Then, eject the plunger 3a via a drive mechanism (not shown),
The solid tablet 8 in the pot 3b is heated and compressed to be fluidized, and the electronic component (not shown) mounted on the surface of the substrate 7 is sealed with resin. In the mold apparatus, for example, the variation in the thickness dimension (maximum 0.02 mm) of the metallic substrate 7 such as the lead frame is absorbed by the elastic deformation of the elastic pin 2a in the axial direction. Reference numeral 9 is a support block that constitutes the lower mold set 3.

However, in recent years, there is an increasing need for resin-sealing a resin substrate such as a so-called substrate. Generally, the variation in the thickness dimension of the resin substrate (up to 0.2 mm) is much larger than that of the metal substrate. Therefore, it is difficult for the elastic pin 2a having a small elastic deformation amount to completely absorb the variation in the plate thickness.
It is not possible to prevent the formation of gaps, and burr easily occurs. Further, in the above-mentioned conventional example, since the elastic deformation amount of the elastic pin 2a is small, it is necessary to replace the elastic pin 2a according to the substrate to be resin-sealed, and it takes time and effort to disassemble and assemble the mold device. For this reason, it has been proposed to use a plurality of mortar-shaped disc springs (not shown), which have a larger elastic deformation amount than the elastic pin 2a, in a stacked manner. But,
The mortar-shaped disc spring has a problem in that the spring force (repulsive force) varies, and the spring force (repulsive force) changes significantly depending on the stroke of heating and compression.

In view of the above problems, it is an object of the present invention to provide a resin encapsulating mold device that completely absorbs large variations in the thickness of the substrate and is easy to maintain.

[0005]

In order to achieve the above-mentioned object, a resin encapsulating mold for a semiconductor device according to the present invention comprises an upper mold cavity block arranged on the lower surface of an upper mold set. An electronic component mounted on the surface of the substrate by sandwiching the substrate with a lower mold cavity block arranged on the upper surface of the lower mold set, projecting a plunger provided in the lower mold set to fluidize the solid resin for sealing, and mounting it on the surface of the substrate. In a mold device for resin encapsulation, the cavity block
At least one of them is supported by a plurality of pistons arranged in parallel, while the piston is supported by the cavity block.
The structure is slidably inserted into a hydraulic cylinder block provided in the mold set corresponding to the cylinder. According to the present invention, even if there is a large variation in the thickness of the substrate, the piston slides in the hydraulic cylinder block to absorb it. As a result, the cavity block
Since there is no gap between the rack and the substrate and the substrate can be pressed with a constant pressure, it is possible to prevent the occurrence of burrs.

As an embodiment of the present invention, a substrate is sandwiched between an upper mold cavity block arranged on the lower surface of the upper mold set and a lower mold cavity block arranged on the upper surface of the lower mold set, A plurality of lower mold cavity blocks are provided in a resin molding die device that projects a plunger provided in a mold set to fluidize a solid resin for sealing and resin-molds electronic components mounted on the surface of the substrate. The pistons may be supported by two parallel pistons, and the lower end of the pistons may be slidably inserted into a hydraulic cylinder block provided in the lower mold set. Therefore, according to the present invention, similarly to the above, even if there is a large variation in the thickness of the substrate, the lower end of the piston slides in the hydraulic cylinder block to absorb it. As a result, a gap is not created between the upper mold cavity block and the lower mold cavity block and the substrate, and the substrate can be pressed with a constant pressure, so that the occurrence of burrs can be prevented.

As an embodiment of the present invention, the hydraulic cylinder block may be sandwiched between the base plate constituting the upper and lower parts of the lower mold set and the chess base plate. Conventionally, a support block that supports the central portion of the chess base plate has been provided between the base plate and the chess base plate. However, according to the present embodiment, the hydraulic cylinder block can also serve as the support block, without significantly increasing the number of parts,
The above function can be obtained.

As another embodiment, the lower mold cavity block supported by the piston may be detachable from the upper surface of the lower mold set. According to this embodiment, it is easy to take out the cavity block when cleaning it, and maintenance is simplified.

As another preferred embodiment, a plurality of pistons arranged in parallel may be connected by a single synchronizing bar. As a result, there is no time lag in the operation of the piston, and the responsiveness is further improved. For this reason, the cavity block is pushed up at the same time and operates while maintaining the horizontal state, so that the yield of the sealed product is improved without tilting or distorting.

A plurality of pistons arranged in parallel and a through hole for operation confirmation, which can communicate with the lower die chess base plate which supports the intermediate portion of the pistons and which constitutes the lower die mold set on the same straight line. May be provided respectively. According to this embodiment, unless the through hole for confirming the operation of the piston is located on the same straight line as the through hole for confirming the operation of the lower chess base plate , the light passing through the through hole is blocked, and the piston It means that an abnormal situation such as a stack has occurred. Therefore, the operating state can be confirmed through the through hole, which is safe and convenient.

As another embodiment, a vertically movable block which is pressed by the lower surface of the upper mold set and descends, and a guide block which is laterally moved to a guide position of the cavity block by being pressed by a taper surface of the vertically movable block. And a guide mechanism part that guides the cavity block with the guide block at the time of mold clamping, and opens the guide block when the mold is opened, near the outer surface of the lower mold cavity block assembled to the lower mold set,
In other words, it may be arranged laterally and in the insertion / removal direction. According to this embodiment, the guide block is positioned at the guide position only when the mold is clamped. Therefore, when the mold is opened, so-called galling does not occur in the guide block, and there is an effect that damage to the parts can be prevented in advance.

[0012]

1 is a block diagram of an embodiment according to the present invention.
11 to the accompanying drawings. As shown in FIGS. 1 to 8, the resin molding die device according to the first embodiment generally includes an upper mold set 10 incorporating an upper chess 20 and a lower mold incorporating a lower chess 50. And a mold set 30.

As shown in FIG. 2, the upper mold set 10 includes side blocks 12 and 12 arranged on both side edges of the lower surface of an upper base plate 11. Then, guide ridges 13 and 13 are provided on the inward facing surfaces of the side blocks 12, respectively, so that an upper die chess 20 described later can be slidably fitted from the side.

As shown in FIGS. 1 and 2, the upper die chess 20 has a pin plate 22 and an ejector plate 23 sequentially stacked at the center of the upper surface of a holder base plate 21, and chess space blocks 24, 24 on both sides thereof. 24 are arranged and a fitting guide groove 25 is formed. On the other hand, upper mold cavity blocks 27, 27 are arranged on both sides of a cull block 26 arranged in the center of the lower surface of the holder base plate 21, respectively. 1 shows an upper die set block 28 for positioning the upper die chess 20 on a lower die chess 50 described later.

In the lower mold set 30, as shown in FIGS. 1 and 2, the lower chess base plate 33 is assembled via the space blocks 32, 32 respectively arranged on both side edges of the upper surface of the lower mold base plate 31. It is a thing. Then, the space blocks 32 facing each other,
A plunger isobaric cylinder block 34 is disposed in the center of the space 32. The plunger isobaric cylinder block 34 has a plunger 35 reciprocally movable in the axial direction through a through hole provided in the lower chess base plate 33. Further, piston cylinder blocks 40, 40 are arranged on both sides of the plunger isobaric cylinder block 34, respectively.
As shown in FIG. 1, the lower chess base plate 33 has side blocks 36, 36 arranged on both side edges of its upper surface, and an end block 37 arranged at one end of its upper surface. And the side block 3
Lower die chess 5 to be described later is provided on the inner side surfaces of 6, 36 that face each other.
Guide ridges 36a, 36a for slidingly fitting 0 are formed respectively.

On the other hand, in the piston cylinder block 40, as shown in FIG. 2, a space 40a sealed by a cylinder cover 41 has a skirt portion 42a of a piston 42.
And a packing (not shown) for the upper liquid chamber 43 and the lower liquid chamber 44.
It is divided into The upper liquid chamber 43 and the lower liquid chamber 44 are respectively connected to a hydraulic pump (not shown) via supply and discharge ports 43a and 44a (Fig. 3) communicating with each other. An upper end portion 45a of a rod 45 extending in the same axis direction from the piston 42 projects from a through hole 33b provided in the lower die chess base plate 33 (Fig. 2). Further, the upper end portion 45a of the rod 45
Is formed so as to be slidably fitted to a detachable block 55 described later. The upper end portion 45 of the rod 45
a is a lower cavitation directly without using the attachment / detachment block 55.
It is also possible to fit the lower mold cavity bar 56, which is an i-block .

Further, as shown in FIG.
The rod 45 and the base plate 33 are provided with operation confirming through holes 45b and 33d so as to communicate with each other on the same line. An optical fiber light source 38a is positioned on one side of the operation confirmation communication hole 33d, and an optical sensor 38b is arranged on the other side. Therefore, in the unlikely event that the piston 42 cannot return to a predetermined position due to a stack or the like, the light remains blocked, and the optical sensor 38b detects this and stops the drive urgently.

As shown in FIGS. 1 and 2, the lower die chess 50 has space blocks 52, 52 arranged on both side edges of the lower die holder base plate 51 to form guide grooves 53, while the upper surface thereof is formed. A center block 54 is arranged in the center. Through holes 54a are formed in the center block 54 at a predetermined pitch.
The molding resin tablet inserted in 4a can be extruded by the plunger 35. Further, attachment / detachment blocks 55 are arranged on both sides of the center block 54 and at positions where they can be slidably fitted to the rod 45 of the piston 42. The attachment / detachment block 55 can be slidably fitted to the upper end portion 45a of the rod 45 at the lower end portion thereof, and the lower die cavity bar 56 is slidably fitted to the upper end portion thereof. In addition, as described above, the upper end portion 4 of the rod 45 is
It is also possible to directly slide fit the 5a and the lower mold cavity bar 56. In addition, in FIG.
A lower mold set block 57 for positioning the lower mold chess 50 is shown.

A guide mechanism portion 60 shown in FIGS. 4 and 5 is adjacent to the outer surface of the lower mold cavity bar 56. The guide mechanism section 60 is composed of a vertically movable block 61 and a guide block 62 which are adjacent to each other, and both are in contact with each other via their respective tapered surfaces 61a and 62a. Further, the vertically movable block 61 is urged upward via a spring plunger 63. However, since the vertically movable block 61 and the guide block 62 are engaged with the retaining pin 65 provided with the spring 64, they do not fall off.

Next, the sealing process by the resin-sealing die device composed of the above-mentioned components will be described. Figure 6
As shown in (a) and (b), the lower mold cavity bar 56
The resin substrate 70 is arranged in the above, and the solid tablet 71 is inserted into the through hole 54a. Then, the lower mold set 30 is clamped to the upper mold set 10 by pushing up the lower mold set 30 via a drive mechanism (not shown) (FIG. 6C).

At this time, as shown in FIGS. 4 and 5,
When the lower mold set 30 moves up, the lower surface of the upper holder base plate 21 contacts the vertically movable block 61 and pushes it down. Therefore, the vertically movable block 6
1 presses the guide block 62 laterally via the tapered surfaces 61a and 62a, and the guide block 62 is positioned at a regular position for guiding the lower mold cavity bar 56. In this clamped state, the gap between the lower die cavity bar 56 and the guide block 62 is a gap (0.001 to 0.0
15 mm) is held. Therefore, it is possible to ensure the vertical movement of the lower mold cavity bar 56 that absorbs the variation in the thickness of the substrate.

Next, as shown in FIG. 7 (a), oil is supplied to the lower liquid chamber 44 to push up the piston 42, and the rod 4
5 and the attachment / detachment block 55, or by directly raising the lower mold cavity bar 56, the substrate 70
The lower mold cavity bar 56 and the upper mold cavity block 2
Clamp with 7. Further, the plunger 35 of the isobaric cylinder block 34 is raised to move the solid tablet 71.
Is heated and compressed into a fluid, and a resin is injected to seal and mold the substrate 70 (FIG. 7B). Then, lower mold device 3
0 is lowered and the mold is opened (FIG. 7 (c)).

At this time, since the load of the upper holder base plate 21 on the vertically movable block 61 is removed,
The vertically movable block 61 is pushed up by the spring force of the spring plunger 63. Therefore, the pressing force on the guide block 62 is released, and the guide block 62
Becomes movable in the lateral direction, and is withdrawn from a predetermined position for positioning the lower mold cavity bar 56. As a result, even when the piston 42 largely moves up during maintenance of the lower mold cavity bar 56, the guide block 62 is retracted from the positioning position of the lower mold cavity bar 56, so that sliding resistance occurs at that portion. do not do. Therefore, there is an advantage that so-called galling, stack (lock) and the like do not occur in the guide block 62.

Then, the plunger 35 of the isobaric cylinder block 34 is raised to a position higher than the position where the resin is sealed to lift the product from the lower mold cavity bar 56, and then the molded product is held by a carrier (not shown). ,
Take out the product. A relief (not shown) may be formed in a part of the lower mold set 30, and the molded product may be taken out only by the carrier without raising the plunger of the isobaric cylinder block. Further, the ejector may be provided with a commonly used ejector mechanism.

When cleaning the lower mold cavity bar 56, after the piston 42 is raised to the highest position,
The lower mold cavity bar 56 is slid sideways and pulled out. Further, depending on the degree of the cylinder stroke (maximum lifted position) at this time, it is possible to pull out by taking out some parts in the sliding direction.

As shown in FIGS. 9 to 11, the second embodiment is different from the first embodiment described above except that the upper end portion 45a of the rod 45 extending from the piston 42 is connected by a synchronizing bar 46.
Since it is the same as the embodiment, the same parts are designated by the same reference numerals and the description thereof is omitted. According to this embodiment, the synchronization bar 46
Since the pistons 42 are connected with each other, there is no time lag in the operation of each piston 42, and the response of the pistons 42 is further improved. Therefore, since the lower mold cavity bar 56 supported by the piston 42 is pushed up at the same time, the lower mold cavity bar 56 is not tilted or distorted. As a result, the slidability of the lower mold cavity bar 56 is improved, burrs do not occur, and the yield can be improved.

In the above embodiment, the case where the solid tablet is used as the solid resin for sealing has been described.
The present invention is not limited to this, and granular or powdered solid resin or the like may be used. The fluidization of the sealing solid resin may be performed not only by heating and compression but also by simple compression work.

[0028]

According to the present invention, the lower mold cavity block is provided.
The lower end of the piston supporting the click is slidably supported in the hydraulic cylinder block. Therefore, even if there is a large variation in the thickness of the resin-sealed substrate, the piston slides up and down to absorb the variation in the thickness. As a result, a gap is not created between the upper mold cavity block and the lower mold cavity block and the substrate, burrs can be prevented from being generated, and the yield of sealed products is improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of a resin sealing mold device according to the present invention.

FIG. 2 is a front sectional view of the mold device shown in FIG.

FIG. 3 is a side sectional view of the mold device shown in FIG.

FIG. 4 is a partial front cross-sectional view of the mold apparatus shown in FIG. 1 before the operation.

5 is a front view, partially in section, of the mold apparatus shown in FIG. 1 after the operation.

6 is an operation explanatory view of the mold device shown in FIG. 1. FIG.

FIG. 7 is an operation explanatory view of the mold device following FIG. 6.

FIG. 8 is an operation explanatory view of the mold device following FIG. 7.

FIG. 9 is an exploded perspective view showing a second embodiment of the resin sealing mold device according to the present invention.

10 is a partial cross-sectional view of the mold apparatus shown in FIG. 9 before the operation.

11 is a partial cross-sectional front view of the mold apparatus shown in FIG. 9 after the operation.

FIG. 12 is a front sectional view of a mold device according to a conventional example.

[Explanation of symbols]

10 ... Upper mold set, 11 ... Upper mold base plate, 12 ... Side block, 13 ... Guide ridge, 20
… Upper chess, 21… Holder base plate, 22…
Pin plate, 23 ... Ejector plate, 24 ... Chess space block, 25 ... Fitting guide groove, 26 ...
Cull block, 27 ... Upper mold cavity block , 28 ...
Upper mold set block, 30 ... Lower mold set, 31
… Lower mold base plate, 32… Space block, 33
... Base plate for lower chess, 33d ... Through hole for operation confirmation, 34 ... Isobaric cylinder block for plunger,
35 ... Plunger, 36 ... Side block, 36a ... Guide ridge, 37 ... End block, 38a ... Light source, 3
8b ... Optical sensor, 40 ... Piston cylinder block, 40a ... Space, 41 ... Cylinder cover, 42 ... Piston, 42a ... Skirt part, 43 ... Upper liquid chamber, 44 ... Lower liquid chamber, 43a, 44a ... Supply / discharge port, 45 ... Rod, 4
5a ... Upper end part, 45b ... Operation confirmation through hole, 50 ... Lower mold chess, 51 ... Lower mold holder base plate, 52 ... Space block, 53 ... Guide groove, 54 ... Center block, 55 ... Removable block, 56 ... Lower mold Cavity bar
(Lower mold cavity block) , 60 ... Guide mechanism section, 6
1 ... Vertical movable block, 62 ... Guide block, 61
a, 62a ... tapered surface, 63 ... spring plunger,
64 ... spring, 65 ... prevention pin, 70 ... substrate,
71 ... Tablet.

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-7-308934 (JP, A) JP-A-2000-326364 (JP, A) JP-A-7-314491 (JP, A) Jitsukohei 7-4899 (JP, Y2) (58) Fields surveyed (Int.Cl. ⁷ , DB name) B29C 33/20-33/30 B29C 45/02-45/30 H01L 21/56

Claims (7)

(57) [Claims] 1. A and an upper mold cavity block arranged on the lower surface of the upper mold set, the substrate in the lower cavity block disposed on the upper surface of the lower mold set sandwiching protrudes a plunger provided in the lower mold set In a resin-sealing die device for fluidizing solid resin for sealing by sealing the electronic components mounted on the surface of the substrate, a plurality of pistons in which at least one of the cavity blocks is arranged in parallel. The mold device for resin encapsulation is characterized in that the piston is slidably inserted into a hydraulic cylinder block provided in the mold set corresponding to the cavity block while being supported by. 2. A and the upper die cavity block arranged on the lower surface of the upper mold set, the substrate in the lower cavity block disposed on the upper surface of the lower mold set sandwiching protrudes a plunger provided in the lower mold set In a resin molding die device for fluidizing solid resin for sealing to seal electronic components mounted on the surface of the substrate, the lower mold cavity block is supported by a plurality of pistons arranged in parallel. On the other hand, a resin sealing mold device, wherein the lower end of the piston is slidably inserted into a hydraulic cylinder block provided in the lower mold set. 3. The mold device for resin encapsulation according to claim 1, wherein the hydraulic cylinder block is sandwiched between a base plate and a chess base plate which form the upper and lower parts of the lower mold set. 4. The lower cavity blanking supported on the piston
The mold device for resin encapsulation according to any one of claims 1 to 3, wherein the lock is attachable to and detachable from the upper surface of the lower mold set. 5. A plurality of said pistons arranged in parallel are connected by one synchronization bar.
The mold device for resin sealing according to any one of 1. 6. An operation confirming device capable of communicating on the same straight line with a plurality of pistons arranged in parallel and a lower die chess base plate which supports an intermediate portion of the pistons and which constitutes a lower die mold set. The resin molding die device according to any one of claims 1 to 5, wherein each of the through holes is provided. 7. An upper and lower movable block which is pressed by the lower surface of the upper mold set to descend, and a guide block which is laterally moved to a guide position of the cavity block by being pressed by a taper surface of the upper and lower movable blocks. A guide mechanism portion that guides the cavity block with the guide block at the time of tightening and opens the guide block at the time of mold opening is arranged in the vicinity of the outer surface of the lower mold cavity block assembled to the lower mold set. The mold device for resin encapsulation according to any one of claims 1 to 6.