JP3370505B2 - Radiator for electronic equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various electronic devices such as on-vehicle audio equipment, and more particularly to a heat dissipation device for releasing heat from electronic parts such as power ICs.

[0002]

2. Description of the Related Art In an electronic device in which an electronic component that generates a large amount of heat is used, a heat dissipation device is used to release heat from the electronic component. FIG. 5 is a perspective view showing a conventional example of a heat dissipation device for releasing heat generated from an electronic component in a vehicle-mounted audio device. A heat dissipation member 2 is provided on one side surface of the housing 1. The heat dissipation member 2 is called a heat sink, and is made of a metal material having a high thermal conductivity such as an aluminum alloy. On the outer surface of the heat dissipation member 2, a plurality of heat dissipation fins (heat dissipation ribs) 2a protruding to the outside of the device are formed. Two electronic components 3 that generate a large amount of heat are mounted on a circuit board 4 installed in the housing 1. The electronic component 3 is a power IC that constitutes an audio amplifier. The electronic component 3 is mounted on the circuit board 4 and installed on the inner surface 2 b of the heat dissipation member 2. And a pair of support plates 5 formed of a metal plate
Is installed so as to hold the electronic component 3, the hook 5b at the lower end of the support plate 5 is inserted into the locking hole 4a of the circuit board 4, and the support plate 5 is fixed on the circuit board 4. Further, both end portions of the support plate 5 are fixed to the heat dissipation member 2 with screws 6. An elastic piece 5a bent and deformed in the direction of the heat radiating member 2 is integrally formed on the support plate 5, and each electronic component 3 is attached to the inner surface 2b of the heat radiating member 2 by the elastic force of the elastic piece 5a. Can be closely attached. Electronic component 3 and inner surface 2b
Silicone oil or the like having a high thermal conductivity is applied between and, and the heat from the electronic component 3 is transferred to the heat radiating member 2 and is radiated to the outside of the device mainly from the outer surface having the heat radiating fins 2a. There is.

In the process of assembling this type of equipment, first, the hook 5b is locked in the lock hole 4a of the circuit board 4, and the support plate 5 is fixed. Next, the electronic component 3 is inserted into the recess of the support plate 5 from above, the terminal legs 3 a are inserted into the through holes 4 b of the circuit board 4, and the electronic component 3 is mounted on the circuit board 4. Circuit board 4 in the dip solder bath in this state
Solder is attached to the back surface of the. Further, the circuit board 4 is installed in the housing 1, and the heat dissipation member 2 is applied and fixed to a position in which the heat dissipation member 2 is in close contact with the electronic component 3.

[0004]

In the heat dissipation device, since the elastic plate 5a capable of being bent and deformed is formed on the support plate 5, the electronic component 3 is assembled in the state shown in FIG.
Is reliably brought into close contact with the heat dissipation member 2, and the efficiency of heat transfer from the electronic component 3 to the heat dissipation member 2 is improved. However, this structure has a drawback that the assembly work is difficult. As described above, the support plate 5 is first fixed, and then the electronic component 3 is inserted from above, but the oppression piece 5a is inserted in the recess of the support plate 5.
Since the projecting part of the electronic component 3 protrudes, the elastic piece 5a is inserted into the electronic component 3 when the terminal leg 3a of the electronic component 3 is inserted into the through hole 4b.
Therefore, it is easy to cause inconveniences such as hitting the lower surface of the electronic component 3 and obstructing the insertion of the electronic component 3 or bending the terminal leg 3a of the electronic component 3 by hitting the elastic pressing piece 5a.

A support plate 5 and an electronic component 3 are mounted on the circuit board 4.
Since the electronic component 3 is pushed by the elastic pressure piece 5a when and are attached, an unnecessary bending force acts on the terminal leg 3a before the heat dissipation member 2 is attached, and the electronic component 3 is attached.
May cause a malfunction. Further, in the structure shown in FIG. 5, since a mechanism for preventing the electronic component 3 from floating upward is not provided, the electronic component 3 is lifted from the circuit board 4 during the soldering work in the dip solder bath. It may happen.

The present invention is to solve the above-mentioned conventional problems. When the assembly is completed, the electronic component is surely pressed against the heat radiation member so as to come into close contact therewith. Further, during the assembly work, the elastic pressure piece interferes with the mounting of the electronic component. It is an object of the present invention to provide a heat dissipation device for an electronic device, which is capable of preventing floating of an electronic component during a soldering work.

[0007]

A heat dissipation device for electronic equipment according to the present invention includes a heat dissipation member for releasing heat from a heat-generating electronic component, a support plate provided to face the heat dissipation member, and the heat dissipation member. In a heat dissipation device for an electronic device including the heat-generating electronic component installed between a support plate and the support plate, a lifting prevention piece located on the upper surface of the electronic component when bent and deformed. An elastic pressure piece that deforms in the direction of the electronic component and elastically presses the electronic component against the heat dissipation member following the bending deformation of the lifting prevention piece is integrally formed.

In the above, the support plate is provided with the heat dissipation member.
Is not attached, the front
The receiving part capable of holding the electronic components is integrally formed.
It is preferable.

In the method of assembling the heat dissipation device for electronic equipment of the present invention, the support plate is first fixed to the circuit board, and then the terminal legs of the heat-generating electronic component are inserted into the through holes of the circuit board.
At this time, since the lifting prevention piece and the elastic piece provided on the support plate are flush with the main body portion of the supporting plate, when the electronic component is mounted, the anti-lifting piece and the oppression piece are not attached to the electronic part. It does not interfere with the insertion. After the electronic component is attached to the board, if the uplift prevention piece is bent and moved over the electronic component, the elastic piece is deformed following the bending of the uplift prevention piece. Is suppressed. If the support plate is integrally formed with a receiving portion that receives the elastically pressed electronic component, the electronic component is sandwiched between the receiving portion and the elastic piece, and the heat dissipation member is attached. In the previous step, unnecessary bending force does not act on the terminal legs of electronic components. During the soldering work in the dip solder bath or the like, the lifting prevention piece faces the upper surface of the electronic component and the lifting of the electronic component is prevented, so that the soldering work of the electronic component is reliably performed.

When the heat dissipating member is attached, the electronic component is elastically pressed against the heat dissipating member by the elastic pressure piece, the electronic component and the heat dissipating member are in close contact with each other, and the heat generated from the electronic component is transferred to the heat dissipating member, and is put into the air. Divergent.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an exploded perspective view showing a heat dissipation device provided in an on-vehicle audio equipment as one configuration example of the present invention, and FIG. 2 is a relation between a lifting prevention piece, a pressure piece and an electronic component. FIG. 3 is a plan view showing a state in which the assembly is completed. Although the housing of the vehicle-mounted audio equipment is not shown in FIG. 1, the circuit board 11 installed inside the housing is omitted.
A support plate 12 is fixed to the. The support plate 12 is formed by bending a sheet metal material such as a rolled steel plate, and a hook claw 12a provided at the lower end of the support plate 12 has a circuit board 11 formed therein.
The locking claws 12a are inserted into the locking holes 11a of the above, and the latch claws 12a are bent at the lands on the back surface of the circuit board 11, and the support plate 12 is fixed onto the circuit board 11.

In the support area A of the support plate 12, heat-generating electronic components 13, 13 are installed. In the other support area B, another heat-generating electronic component 14 is installed. The structure of the support area A on which the electronic components 13 and 13 are supported is a feature of the present invention. The heat-generating electronic component 13,
Reference numeral 13 denotes a power IC such as an audio amplifier, and the plurality of terminal legs 15 are inserted into the through holes 11b of the circuit board 11, respectively.

In the support area A of the support plate 12, lower support pieces 12b are bent and formed at three places on the lower end portion, and both side portions of the lower surface 13a of each electronic component 13 are supported by the lower support pieces 12b. . Further, a bent piece 12c bent outward is provided on the upper part of the support plate 12, and a stepped receiving portion 12d formed on the bent piece 12c is provided on the outer surface 13b of each electronic component 13. It faces both ends. Deformation portions C are integrally formed on the upper end of the support plate 12 so as to correspond to the individual electronic components 13. FIG. 1 shows a state in which the deformed portion C is not deformed, and the deformed portion C is flush with the main body portion of the support plate 12. The base end of the deformable portion C is a neck portion 12e that can be twisted and deformed, and a rising prevention piece 12f and a resilient pressure piece 12g are branched and integrally formed above the neck portion 12e.

A heat dissipation member 16 is installed outside the electronic component 13. Similar to that shown in FIG. 5, this heat dissipation member 16
Is a part of the housing and is made of a material having a high thermal conductivity such as an aluminum alloy. On the outer surface of the heat dissipation member 16, a plurality of heat dissipation fins 16 are provided.
a is formed. Further, as shown in FIG. 3, the inner surface of the heat dissipation member 16 is formed with an escape recess 16b into which the tip of the bent piece 12c of the support plate 12 is inserted and hit in the assembled state. Further, the heat dissipating member 16 has screw holes 1
6c is bored, and the fixing screw 17 inserted in the screw fixing hole 16c is screwed into the female screw hole 12h formed in the support plate 12.

Next, a process of assembling the heat dissipation device of the electronic equipment will be described. First, before mounting various electronic components in the form of chips or discretes on the circuit board 11, the support plate 12 is placed on the circuit board 11. In this work, the latching claw 12a of the support plate 12 is inserted into the locking hole 11a of the circuit board 11, and the latching claw 12a is formed at the land portion on the back surface of the circuit board 11.
Bend and deform. Next, various electronic components are mounted on the circuit board 11
The electronic component 14 is inserted in the support region B, and the heat-generating electronic component 13 such as a power IC is inserted in the support region A. At this time, the electronic component 13 is attached to the support plate 12
Then, the terminal leg 15 is inserted into the through hole 11b of the circuit board 11 by interposing it between the main body and the receiving portion 12d. At the time of inserting the terminal leg 15 into the through hole 11b, since the deformed portion C having the lifting prevention piece 12f and the elastic pressure piece 12g is flush with the main body of the support plate 12, when the electronic component 13 is inserted, The lifting prevention piece 12f and the elastic pressing piece 12g do not hinder the insertion, and the terminal leg 15 prevents each piece 12 from forming.
It is not forcibly bent by hitting f and 12g. When the mounting of the electronic component 13 is completed, the lower surface 13a of the electronic component 13 contacts the lower support piece 12b, and the positioning in the direction of the circuit board 11 is performed.

Next, as shown in FIG. 2, the uplift prevention piece 12f of the deformed portion C protruding above the support plate 12 is twisted and deformed in the α direction in FIG. As a result, the uplift prevention piece 12f reaches a position facing the upper surface 13c of the electronic component 13, or the uplift prevention piece 12f faces the upper surface 13c.
The electronic component 13 is prevented from rising by coming into contact with c. When the lifting prevention piece 12f is twisted and deformed in the α direction, a large twist is generated in the neck portion 12e of the deformed portion C. As a result, the elastic pressure piece 12g follows and deforms in the same α direction, and the elastic pressure piece 12g becomes an electronic component. The inner surface 13d of 13 is pressed by force F. Although the electronic component 13 is pushed in the direction of the force F by the elastic force piece 12g, the receiving portion 12d is provided in the portion facing the elastic force piece 12g, so at this point (the state before the heat dissipation member 16 is attached). Then, electronic parts 13
Is sandwiched between the receiving portion 12d and the elastic pressure piece 12g.

The circuit board 11 on which the electronic components 13 are mounted is sent into the dip solder bath, and the back surface of the circuit board 11 is soldered. In this soldering, the hook 1 of the support plate 12
2a is soldered to the land on the back surface of the circuit board 11,
Further, the terminal legs 15 of the electronic component 13, the terminal legs of the electronic component 14, and the terminal legs of other electronic components are soldered to the land portion on the back surface of the circuit board 11. During the soldering work, the lower surface 13a of the electronic component 13 has the support plate 12
Is supported by the lower support piece 12b, and the uplift prevention piece 12f is positioned on the upper surface 13c to position the electronic component 13 in the vertical direction. Further, the inner surface 13d of the electronic component is supported by the compression piece 12g and the outer surface 13b is supported by the receiving portion 12d, and the electronic component 13 is supported by the support plate 12 so as not to move unnecessarily in each direction. Therefore, during the soldering work by the dip soldering, the electronic component 13 does not float up from the circuit board 11 or, on the contrary, sink into the circuit board 11.

After soldering the circuit board 11,
The circuit board 11 is incorporated in the housing, and at the same time, the heat dissipation member 16 which is a part of the outer surface of the housing is installed and fixed so as to face the outside of the electronic component 13. As shown in FIG. 3, the support plate 1
The tip of the bent piece 12c of 2 is the escape recess 1 of the heat dissipation member 16.
The mutual position of the support plate 12 and the heat dissipation member 16 is determined in a state of being abutted against the inner surface of 6b, and the support plate 12 and the heat dissipation member 16 are fixed to each other by the screw 17. At this time, as shown in FIG. 3, the outer surface 13b of the electronic component 13 contacts the inner surface of the heat dissipation member 16, and a distance δ is provided between the outer surface 13b and the receiving portion 12d. Therefore, the elastic force of the compression piece 12g causes the electronic component 13 to move to the heat dissipation member 16
Since the outer surface 13b of the electronic component 13 and the heat dissipating member 16 are pressed against the inner surface of the electronic component 13 and the heat generated from the electronic component 13 is efficiently transmitted to the heat dissipating member 16, the heat dissipating fins 16a are radiated into the outside air. Become. Note that silicon oil or the like having good thermal conductivity may be interposed between the outer surface 13b of the electronic component 13 and the heat dissipation member 16.

FIG. 4 shows a second configuration example of the present invention. In this example, the deformed portion Ca is integrally provided on the upper portion of the support plate 12, but in the deformed portion Ca, the notch 12 is formed.
A neck portion 12i that extends horizontally toward the inside of j is provided, and the rising prevention piece 12f and the elastic pressure piece 12g are integrally formed at the tip of the neck portion 12i. In the above-mentioned first configuration example, as shown in FIG.
When the neck portion 12e is deformed in the direction, the neck portion 12e is deformed by twisting and bending.
Is deformed in the α direction, the neck portion 12i is simply bent and deformed, and the elastic pressure piece 12g deforms in a direction in which the electronic component 13 can be elastically pressed, following the deformation of the rising prevention piece 12f. Further, the present invention is not limited to vehicle-mounted audio equipment, and can be implemented in other electronic equipment. The heat-generating electronic component is not limited to the power IC, and may be a large transistor that generates a large amount of heat or a resistor that has a high resistance value.

[0020]

As described above, according to the present invention, when the rising prevention piece is bent and deformed toward the upper surface of the electronic component, the elastic pressure piece is deformed following this, and the electronic component is radiated by the elastic piece. Since it is a structure that is pressed against, when completed, the electronic component and the heat dissipation member will be in close contact and the heat dissipation effect will increase,
Further, it is possible to prevent the electronic components from floating from the circuit board during soldering work.

At the time of mounting the electronic component, the oppressing piece does not project in the direction of the electronic component on the same surface as the supporting plate,
The oppression piece does not interfere with the insertion of electronic components.

Further, since it is not necessary to bend and deform the elastic pressure piece at the time of manufacturing the supporting plate, the manufacturing process of the supporting plate is simple.

Furthermore, if a receiving portion is provided on the support plate,
When the lifting prevention piece is bent, the electronic component will be sandwiched between the elastic piece that follows this and the receiving part, and it will be impossible for the terminal leg of the electronic component in the process before attaching the heat dissipation member. No bending force is applied.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a heat dissipation device of an electronic device according to a configuration example of the present invention,

FIG. 2 is a perspective view showing the relationship between the lifting prevention piece, the compression piece, and the electronic component,

FIG. 3 is a plan view of the heat dissipation device showing a state where assembly is completed,

FIG. 4 is a perspective view of a lifting prevention piece and a pressure piece, showing a second configuration example;

FIG. 5 is a perspective view showing a heat dissipation device of a conventional electronic device,

[Explanation of symbols]

11 circuit board 12 Support plate 12f Lifting prevention piece 12g oppression piece 12e neck 12d receiver 13 Electronic components 16 Heat dissipation member

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Claims (2)

(57) [Claims] 1. A heat-dissipating member for releasing heat from a heat-generating electronic component, and a support plate provided so as to face the heat-dissipating member.
In a heat dissipation device for an electronic device comprising the heat-dissipating electronic component installed between the heat dissipation member and a support plate, the support plate has a float located on the upper surface of the electronic component when bent and deformed. It is characterized in that a rising prevention piece and an elastic pressure piece that follows the bending deformation of the floating prevention piece and deforms in the direction of the electronic component to press the electronic component against the heat dissipation member are integrally formed. Heat dissipation device for electronic equipment. 2. A heat dissipation member is attached to a support plate .
The electronic component between the oppression piece and the
The heat dissipation device for an electronic device according to claim 1, wherein the sandwichable receiving portion is integrally formed.