JP3370627B2 - IC chip fixing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to a method for fixing an integrated circuit (IC) chip, and more particularly to a method for attaching an IC chip storing vehicle identification information to a vehicle license plate. The present invention relates to a method of fixing an IC chip that satisfies the conditions that it is extremely difficult to remove the IC chip without damaging it, and that it will not be damaged or dropped due to environmental changes such as temperature.

[0002]

2. Description of the Related Art The applicant has previously filed Japanese Patent Application No. 11-2
04800, Japanese Patent Application No. 11-229082, Japanese Patent Application No. 11-
241734, Japanese Patent Application No. 11-241734, Japanese Patent Application No. 11
In patent applications such as -285781, vehicle identification systems have been proposed. These vehicle identification systems install a storage device in which vehicle identification information is stored in at least two places in a vehicle, and determine whether or not the vehicle identification information stored in the storage devices in at least two places match each other for a predetermined time. This is to enable communication between the vehicle and the outside when the vehicle identification information matches at intervals.

Using such a vehicle identification system,
It becomes possible to warn the driver of an accident vehicle in the vicinity of a vehicle traveling on the road to the driver of the vehicle and to identify whether or not a certain vehicle traveling on the road is a stolen vehicle.

More specifically, the vehicle identification system proposed by the applicant in the above-mentioned plurality of patent applications comprises an external communication means and a vehicle-side communication means mounted on the vehicle. The vehicle-side communication means is (a) installed in a plurality of positions of the vehicle, and a plurality of storage devices each storing identification information, and (b) stored in a plurality of storage devices at regular time intervals. The plural pieces of identification information are compared, and communication is enabled between this vehicle-side communication means and the external communication means only when these pieces of identification information match, and when these pieces of identification information do not match, there is an abnormality. Control means for transmitting a signal for notifying the occurrence of

The storage device included in the above-mentioned vehicle-side communication means is usually an IC chip, that is, a memory chip. In the simplest case, the IC chips are installed at two positions, one of the front and rear license plates and the other position inside the vehicle. Alternatively, the IC chips may be provided at a total of three positions, that is, both the front and rear license plates and other positions inside the vehicle. The reason why the IC chip is installed on the license plate is that the license plate is officially managed so as to be a unique identification means for the vehicle, and performs the same function as the identification information stored in the IC chip. Therefore, it is preferable to maintain an inseparable relationship such that there is a one-to-one correspondence between the two, specifically, to maintain the same location. Therefore, in the following,
Consider attaching an IC chip to a license plate. Of course, this is not an absolute requirement, and the IC chip may be installed at a position other than the license plate.

The above-mentioned vehicle identification system is premised on that it is not easy to illegally replace or modify an IC chip attached to a vehicle license plate or the like. For that purpose, the method of fixing the IC chip to the license plate is important. The present invention is intended to provide an excellent fixing method for an IC chip.

[0007]

As a method of attaching an IC chip (specifically, a memory chip storing vehicle identification information) to a license plate of a vehicle, a substrate on which the IC chip is mounted or a film substrate is used. It is conceivable that the IC chip is attached to the license plate (usually the back surface) using an adhesive means such as a double-sided tape, or the case of the IC chip is screwed.

However, two problems can occur when such a method is used. First, since the license plate is exposed to the outside air, the IC chip fixed to the license plate is not thermally shielded from the outside air even if it is on the back side, and a large temperature change is suddenly generated in the surroundings. If it occurs, the IC chip may be peeled off or damaged. Secondly, even if it is fixed by the above method, it is easy to remove it from the license plate without damaging the IC chip, and it is easy to illegally replace or modify the IC chip, and it is difficult to find it. is there.

[0009]

In order to solve the above problems, in the method of fixing an IC chip according to the present invention, a concave groove is formed on the side surface of the substrate on which the IC chip is mounted, and the back surface of the license plate or the like is formed. A case having a convex claw portion is installed at a position to be fixed by welding or the like, and the mounting board is fixed to the license plate by engaging the concave groove and the convex claw portion. At this time, a certain clearance is secured between the concave groove and the convex claw portion to accommodate expansion and contraction due to temperature change. Furthermore, a flexible bonding process may be performed on the fixed mounting substrate.

[0010]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing how an IC chip 20 is attached to the back surface of a license plate 10 of a vehicle using a method according to the present invention. Actually, IC chip 2
Reference numeral 0 denotes a memory chip that stores vehicle identification information and the like, and is a printed wiring board (PWB) that is the substrate 30.
On top of soldering, surface mount, chip-on-
It is implemented by a general method such as a board method. Both the IC chip 20 and the substrate 30 may be collectively referred to as a printed circuit board or the like. Recessed grooves are formed on the four side surfaces of the board 30, and the board is attached to the mounting case and thus the license plate by engaging the convex claw portions of the mounting case 40 in the grooves. Fixed against. The state in which the groove is provided on the side surface of the substrate is shown in FIG. Even when the claw portion and the groove are engaged with each other, there is a clearance (clearance) between them so that some movement between them is possible. In FIG. 1, the IC chip 20 is the license plate 1
It is stored inside the mounting case 40 with the 0 side facing. However, the orientation of the IC chip 20 is irrelevant to the method of the present invention, and the orientation may be reversed. The mounting case 40 is directly fixed to the license plate 10 using welding.

Further, in order to suppress the influence of water, dust, heat, etc. from the outside, it is considered to perform a bonding process 50 on the outside of the mounting case 40 and the substrate 30 using, for example, a silicon-based solvent. To be The silicone-based dispersant does not completely solidify even when dried, and changes into a gel while maintaining its softness. Therefore, due to the flexibility of the bonding process 50, the mounting case 40 and the substrate 30 are fixed as a flexible structure so as to allow a slight movement between them. This flexible structure absorbs expansion and contraction between the mounting case 40 and the substrate 30 due to ambient temperature changes, so that the flexible structure absorbs the expansion and contraction.
Does not break.

In FIG. 3, the board 30 is attached to the mounting case 4.
The procedure fixed using 0 is shown. The mounting case 40 is composed of two parts 40a and 40b. First, the first of the mounting case 40 which is U-shaped
40a is welded to the back surface of the license plate 10. Secondly, the substrate 30 on which the IC chip 20 is mounted is
It is fixed to the first portion 40a of the mounting case 40.
At that time, the substrate is slid while keeping the state where the claw portions of the first portion 40a of the mounting case 40 are engaged in the grooves formed on the four side surfaces of the substrate 30.
As described above, a predetermined clearance is secured in the uneven engaging portion. Since the first portion 40a has a U-shape, the grooves on the three side surfaces of the substrate 30 engage with the claws up to this stage.

In order to compare the vehicle identification information stored in the IC chip 20 with the vehicle identification information stored in another storage device at another position in the vehicle, between the substrate 30 and the outside of the substrate 30. , Signals are transmitted and received. for that reason,
For example, a connector is provided at the back of the U-shaped first portion 40a, and a connecting pin or pattern is provided at the end of the substrate 30, and when the substrate 30 is slid and inserted, the connector and the pin engage with each other. And electrical connection is ensured. This configuration for electrical connection between the substrate 30 and the outside may use conventional configurations commonly known to those skilled in the art.

Next, in a third step, the second portion 40b of the mounting case 40 is fixed in correspondence with the engagement of its claw portion with the groove on the remaining one side surface of the substrate 30. In the drawing, the second part 40b of this mounting case 40
Also has a U shape similar to the first portion 40a. Due to the U-shape, the two claw portions of the first and second portions 40a and 40b are vertically overlapped and simultaneously engaged with the groove in the direction in which the substrate is inserted, and the strength is increased. improves. However, it is not essential for the present invention that the second portion 40b be U-shaped. It suffices if the claws of the second portion 40b can fix the remaining one side surface of the substrate 30 with which the claws of the first portion 40a are not engaged. The second portion 40b is fixed to the license plate by welding after engaging with the groove on the side surface of the substrate while maintaining the clearance. Second part 40
By welding b, the attachment of the IC chip 20 to the license plate 10 according to the present invention is completed.

The mounting location of the IC chip 20 in the vehicle is not limited to the license plate 10. It is also clear that the present invention can be applied to cases other than vehicles.

[0016]

By attaching the IC chip to the license plate of the vehicle using the method of the present invention, two problems in the conventional method are solved. First, since a clearance is provided between the groove on the side surface of the board and the claw portion of the mounting case, and the bonding process performed as a cover for the mounting case and the entire board has a flexible structure, The expansion and contraction due to the temperature change is absorbed, and there is no fear that the IC chip is peeled off or damaged. Second, since the groove on the side surface of the board and the claw portion of the mounting case are engaged with each other and the mounting case is welded to the license plate, if the IC chip is forcibly removed from the license plate, the board or the The IC chip mounted on it is damaged. That is, it is impossible to illegally replace or modify an IC chip that is properly installed without damaging it.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing how an IC chip is attached to the back surface of a license plate of a vehicle using a method according to the present invention.

FIG. 2 is an overall view of a substrate on which an IC chip is mounted.
It shows a state in which a groove is provided on the side surface of the substrate.

FIG. 3 shows an outline in which a substrate is fixed to a license plate using a mounting case.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masanori Ito 6532, Wada, Matsumoto City, Nagano 5 TMI Japan Co., Ltd. (56) Bibliography 61-102092 (JP, U) 154191 (JP, U) Actual development Sho 51-108825 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 7/14 B60R 25/00

Claims (6)

(57) [Claims] 1. A method of fixing a mounting board, comprising: forming a concave groove on a side surface of the mounting board; and having a convex claw portion at a desired fixing position, and only a part thereof is opened. The step of installing the first portion of the case, and the step of setting the concave groove of the mounting board and the convex claw portion of the first portion of the case to engage while securing a clearance. The mounting substrate is slid from the open portion to be inserted into the first portion of the case, and further, the second portion of the case having a convex claw portion is mounted on the open portion. Fixing the mounting substrate in a non-detachable manner by installing the concave groove of the substrate and the claw portion of the second portion of the case so as to engage with each other while ensuring a clearance. , By that Te, once method in removing the fixed mounting substrate is characterized in that it is impossible to remove the without destroying the mounting substrate. 2. The method according to claim 1, further comprising the step of subjecting the fixed mounting substrate to a flexible bonding process. 3. The method according to claim 1 or 2, wherein the mounting board is a printed circuit board on which integrated circuit elements are mounted. 4. A mounting board, comprising a concave groove formed on a side surface thereof, installed at a desired fixed position, having a convex claw portion, and having only a part thereof opened. From the open portion to the first portion, the concave groove of the mounting board and the convex claw portion of the first portion of the case engage with each other while ensuring a clearance. The mounting board is slid and inserted, and the second portion of the case having the convex claw portion is further provided with the concave groove of the mounting board and the claw of the second portion of the case in the open portion. The parts are fixed in a non-detachable manner by being installed so as to ensure clearance with each other, whereby the mounting board once fixed can be removed without destroying the mounting board. Impossible A mounting board, which is fixed to the fixed position so that the mounting board can function. 5. The mounting board according to claim 4, wherein a flexible bonding process is performed on the mounting board. 6. The mounting board according to claim 4 or 5, which is a printed circuit board on which an integrated circuit element is mounted.