JP3376865B2 - Electronic component mounting apparatus, mounting method thereof, and liquid crystal panel manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and mounting method, and for example, fine pitch terminals are connected to each other, such as when an IC terminal is electrically connected to an input terminal of a liquid crystal panel. The present invention relates to a mounting device and a mounting method for crimping and mounting each electronic component by using an anisotropic conductive adhesive used in, and a method for manufacturing a liquid crystal panel.

[0002]

BACKGROUND ART Connection between electronic components such as semiconductor devices, especially connection between fine pitch terminals, such as connection between an input terminal provided on a glass substrate of a liquid crystal panel and a terminal of a liquid crystal driver IC, is different. An anisotropic conductive adhesive is used.

The adhesion using the anisotropic conductive adhesive is performed by temporarily bonding the anisotropic conductive adhesive between the electronic components and then crimping the electronic components together with a crimping head.

By the way, when a plurality of ICs are pressure-bonded on a glass substrate, conventionally, a plurality of pressure-bonding heads are arranged corresponding to each IC, and the heads are operated synchronously to simultaneously pressure-bond a plurality of ICs. It was improving productivity.

[0005]

However, since the distance between the ICs on the glass substrate differs depending on the model of the liquid crystal panel (electronic component), when different models are produced (when the models are switched), a plurality of crimps are used. There has been a problem that the head mounting position has to be changed to adjust the distance between the heads in a hardware manner, the setting work is complicated, and the workability is poor.

An object of the present invention is to provide an electronic component mounting apparatus, a mounting method thereof, and a liquid crystal panel manufacturing method which can reduce the setting work of the apparatus when the model to be manufactured is switched.

[0007]

The electronic component mounting apparatus of the present invention is an electronic component mounting apparatus for crimping and mounting a plurality of second electronic components arranged on a first electronic component, A pressure bonding head configured to move forward and backward toward the second electronic component to pressure bond the second electronic component, a support member on which the first electronic component is mounted, the pressure bonding head and the support member And a control means for controlling a relative movement amount by the movement means, the control means including the movement means for relatively moving the second electronic component along the arrangement direction of the second electronic component. A model input section for inputting the model of the second electronic component, and a storage section for storing arrangement interval data of the second electronic component in the model, the first model based on the data inputted by the model input section. Before supporting the electronic component models The arrangement interval data of the second electronic component is read from the storage unit and controls the relative movement amount.

According to the present invention, the control means determines the relative movement amount between the supporting member on which the first electronic component (such as a liquid crystal panel) is placed and the pressure bonding head. Since it can be set according to the arrangement interval of the second electronic component (liquid crystal driver IC etc.), when the arrangement interval of the second electronic component is changed at the time of model change, the data of the relative movement amount of the crimping head and the supporting member can be obtained. It is only necessary to re-set, and the model switching operation can be performed very easily compared to the conventional case where the intervals between the crimping heads are physically adjusted.

Further, it is preferable that the moving means moves the supporting member with respect to the pressure bonding head. The support member on which the electronic components are placed is usually movable for setting the electronic components at a position facing the crimping head or for carrying out the crimped electronic components. Can be easily controlled by the control means.

Further, the control means includes a model input section for inputting a model of the electronic component to be crimped, a storage section for storing arrangement interval data of the second electronic component in each model, and the model input. It is preferable to include a control unit that reads the arrangement interval data corresponding to the model input by the unit from the storage unit and controls the relative movement amount of the pressure bonding head and the support member.

If the arrangement interval data of each model is stored in the storage unit, the arrangement interval data of the second electronic component in each model can be read and easily set when the model is switched, and the operator can arrange each arrangement. Since it is not necessary to input the interval data, the operability can be improved.

Further, it is preferable that a plurality of sets of the pressure bonding head and the supporting member are provided and operated in synchronization with each other.

If a plurality of sets of crimping heads and supporting members are provided, even if each supporting member crimps a plurality of electronic components one by one, the entire apparatus simultaneously crimps a plurality of electronic components. The productivity can be improved accordingly.

At this time, it is preferable that the plurality of supporting members are arranged on the carrier according to the intervals between the plurality of pressure bonding heads.

If each supporting member is arranged on the carrier, each supporting member can be relatively moved in synchronization with the crimping head by controlling the amount of movement of the carrier by the control means, and a plurality of supporting members can be supported. Even if the member is provided, the structure of the moving means is simplified.

Further, the electronic component mounting method of the present invention is an electronic component in which a plurality of second electronic components are pressure-bonded to the first electronic component mounted on the support member via an anisotropic conductive adhesive. A mounting method of components, comprising a setting step of disposing the support member at a position where the outermost electronic component of the plurality of second electronic components is opposed to a pressure bonding head, and the pressure bonding head. A crimping step of moving the first electronic component to the second electronic component side and crimping the first and second electronic components,
The crimping head and the supporting member are relatively moved by an arrangement interval between the second electronic components arranged on the first electronic component to move the other second electronic component to the crimping head. And a carry-out step for carrying out the first electronic component to which the second electronic component is crimped, the crimping step and the moving step being the second electronic component. It is characterized by repeating according to the number of.

Furthermore, the mounting method of the electronic component of the present invention is
In the method of mounting an electronic component, the first electronic component is placed on a support member, and a plurality of second electronic components are mounted on the first electronic component by pressure bonding with a pressure bonding head. The step of inputting the model of the component, and the second corresponding to the model of the first electronic component based on the input data.
Reading the arrangement interval data between the electronic component and the other second electronic component,
The other second electronic component and the pressure bonding head relatively move so as to face each other, and the pressure bonding head causes the other second electronic component to move.
Crimping the electronic component of above onto the first electronic component,
It is characterized by including. Also, in the electronic component mounting method of the present invention, a first electronic component is placed on each of a plurality of support members, and a plurality of second electronic components are provided on each of the first electronic components. In the method of mounting an electronic component that is crimped and mounted by a crimping head corresponding to the electronic component, the step of inputting the model of the first electronic component, and the model of the first electronic component based on the input data The arrangement interval data between the second electronic component corresponding to the second electronic component and the other second electronic component is read, and each of the pair of the pressure bonding head and the supporting member is synchronized with each other to generate the other second electronic component. Relative movement so that the component and the crimping head face each other,
Pressure-bonding the other second electronic component onto the first electronic component with the pressure-bonding head. The method for manufacturing a liquid crystal panel of the present invention is the method for manufacturing a liquid crystal panel, wherein the liquid crystal panel is placed on a supporting member, and a plurality of electronic components are pressure-bonded and mounted on the liquid crystal panel by a pressure bonding head. A step of inputting the model of the panel, and reading out the arrangement interval data between the electronic component corresponding to the model of the liquid crystal panel and the other electronic component based on the input data, the pressure bonding head and the support member, A step of relatively moving the other electronic component and the crimping head so as to face each other, and crimping the other electronic component onto the liquid crystal panel by the crimping head. Further, the method for manufacturing a liquid crystal panel of the present invention, the liquid crystal panel is placed on each of the plurality of support members, and a plurality of electronic components are crimped onto each of the liquid crystal panels by a crimping head corresponding to each of the liquid crystal panels. In a method of manufacturing a liquid crystal panel to be mounted, a step of inputting a model of the liquid crystal panel, and data of arrangement intervals between the electronic component and other electronic components corresponding to the model of the liquid crystal panel based on the input data. Each of the pair of the crimping head and the supporting member for reading is moved in synchronization so that the other electronic component and the crimping head relatively move so as to face each other, and the crimping head moves the other electronic component. And a step of pressing the liquid crystal panel on the liquid crystal panel.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a block diagram of a mounting apparatus 1 of this embodiment. As shown in FIG. 2, the mounting apparatus 1 mounts a plurality of liquid crystal driver ICs 20 which are second electronic components on a liquid crystal panel 10 which is a first electronic component.

Here, the liquid crystal panel 10 is constructed by enclosing a liquid crystal between two glass substrates 11 and 12 with a sealing material interposed therebetween. On the facing surfaces of the glass substrates 11 and 12, transparent electrodes and input terminals made of an ITO film or the like corresponding to the display pattern are formed.

The lower glass substrate 11 is extended to the outside of the upper glass substrate 12, and each IC 20 is provided with an anisotropic conductive adhesive in the extended portion so as to be close to the glass substrate 12. Attached, and is electrically connected to the transparent electrode and the input terminal. That is, in this embodiment, a COG (Chip On Glass) type liquid crystal panel 1 is used.
0 is manufactured.

The mounting apparatus 1 includes two support tables (support members) 2 on which the liquid crystal panel 10 is placed, a ceramic stage 3 arranged adjacent to the support tables 2, and an upper portion of the stage 3. Placed opposite to stage 3
It is provided with two crimping heads 4 configured to be vertically movable toward and to the side, and a carrier table 5 to which the two support tables 2 are attached.

Further, the mounting apparatus 1 is, as shown in FIG. 1, a drive cylinder for vertically moving each crimping head 4 or a temperature controller for operating the heater in the crimping head 4 to adjust the temperature of the head 4. Crimping head driving means 6 configured
And a carriage moving means 7 composed of a motor for moving the carriage 5, and a control means 8 for controlling the pressure bonding head driving means 6 and the carriage moving means 7.

The support table 2, as shown in FIG.
It is arranged on the carrier table 5 so as to match the space between the two pressure bonding heads 4. The contact surface of the pressure bonding head 4 to the IC 20 has a size substantially corresponding to the size of each IC 20.

The control means 8 has a model input section 31 for inputting the model of the liquid crystal panel (electronic component) 10 to be produced, a data file 41 for each model, and an information file 42 for the IC 20.
And a control unit 33.

The model-specific data file 41 stored in the storage unit 32 has a data structure as shown in FIG. That is, with respect to the model number 51, the pitch (arrangement interval) 52 of the IC 20 and the size 53 of the liquid crystal panel 10
And the like, the crimping condition data such as the crimping number 54, the crimping temperature 55, the crimping time 56, the crimping force 57, and the type number 61 of the IC 20 attached to the liquid crystal panel 10 are stored.

The IC information file 42 has a data structure as shown in FIG. That is, IC20
For the type number 61 of
Each dimensional data such as the thickness 63 is stored.

The model-specific data files 41 and I
The C information file 42 is associated with the IC type number 61 as a key code.

The procedure for crimping the IC 20 in this embodiment will be described with reference to the flowchart of FIG. 6 and the operation explanatory diagram of FIG.

First, the liquid crystal panel 10 is placed on the two support tables 2 provided on the carrier 5, and a plurality of ICs 20 are temporarily adhered onto the glass substrate 11 via an anisotropic conductive adhesive. Keep it.

Then, the model of the liquid crystal panel 10 to be produced is inputted by the model input section 31 (step 1, hereinafter "step" is abbreviated as "S"). As a method of inputting this model, a keyboard may be prepared as the model input unit 31 to input the model number, or a pointing device such as a mouse may be prepared to select and input the listed model numbers. . Further, a bar code may be pasted on the glass substrates 11 and 12 of the liquid crystal panel 10 and read by a bar code reader to input the model.

The control unit 33 stores the input size data 52 and 53 of the model, the crimping condition data 54 to 57, and the IC size data 62 and 63 into the model-specific data file 41 and the IC.
It is read from the information file 42 (S2).

Based on the read data, the control unit 33 controls the carriage moving means 7 such as a drive motor to move the carriage 5, and as shown in FIG. Each support table 2 is set at a position where the IC 20 at the left end of the liquid crystal panel 10 placed on the second unit 2 faces each pressure bonding head 4 (S3).

Then, the pressure-bonding head driving means 6 is controlled so that the pressure-bonding head 4 is moved at a predetermined pressure, temperature and time.
The C20 is brought into contact with and crimped (S4).

After the crimping is completed and the crimping head 4 is raised, the control unit 33 determines whether the number of crimping times in the liquid crystal panel 10 is smaller than the number of crimping times set in the model-specific data file 41 (S5). .

If the number of times of crimping is less than the set number of times, the carrier table moving means 7 is controlled to move the carrier table 5 by the distance dimension of the IC 20, that is, the pitch 52 of the model-specific data file 41 (S6). .

In this way, as shown in FIG. 7B, when the crimping head 4 is placed on the second IC 20 from the left, the crimping step (S4) is performed again to judge the number of crimping times ( S5).

At this time, since the number of times of pressure bonding (2 times) is smaller than the number of times of setting (3 times), as shown in FIG.
The moving step (S6) and the pressure bonding step (S4) of the carrier table 5 are performed again.

When the set number of times of pressure bonding is completed, the carrier 5 is unloaded from the mounting apparatus 1 (S7), and the next carrier 5 is set on the mounting apparatus 1.

A plurality of carrier tables 5 are prepared, and when one carrier table 5 is placed between the stage 3 and the pressure bonding head 4 to perform the pressure bonding process, each of the other carrier tables 5 is carried out. The liquid crystal panel 10 can be attached to and detached from the support table 2.

According to this embodiment as described above, the following effects can be obtained.

Since the controller 33 can move the carrier 5 by the pitch of the IC 20 via the carrier moving means 7,
The carriage 5 for the crimping head 4, that is, each support table 2
Can be moved by the pitch of the IC 20. For this reason, even when the model to be produced is switched to a model having a different pitch of the IC 20, by moving the carrier table 5 according to the pitch of the IC 20 of the model, the liquid crystal panel 10 can be moved.
The plurality of ICs 20 can be sequentially crimped.

Therefore, unlike the conventional case, it is not necessary to change the arrangement interval between the crimping heads 4 by hardware at the time of model change, and only the movement data, that is, software change need be performed, so that the model change work is simplified. The workability can also be improved.

Further, this movement amount data, that is, IC2
The arrangement interval data of 0 is previously stored in the model-specific data file 41.
Is stored in the storage unit 32, the operator only needs to input the model to be produced by the model input unit 31, and the operability can be improved.

Since the two support tables 2 are arranged on the carrier table 5 and the pressure bonding work of the ICs 20 in the two liquid crystal panels 10 is performed in synchronization, the pressure bonding work of the two liquid crystal panels 10 in one pressure bonding cycle. It is possible to improve the productivity.

Since the arrangement direction of the IC 20 on the glass substrate 11 is aligned with the moving direction of the carrier table 5, the carrier table 5, that is, each support table 2 is crimped only by adjusting the moving amount in the carrier table moving means 7. Since it can be moved by the pitch of the IC 20 with respect to the head 4 and it is not necessary to separately prepare a special moving means, it can be applied to a conventional mounting apparatus and can be realized at low cost.

It should be noted that the present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved.

For example, in the above-described embodiment, two sets of pressure bonding heads 4 and support tables 2 are provided to perform the pressure bonding process of two liquid crystal panels 10 at the same time, but only one pressure bonding head 4 and support table 2 are provided. It may be provided, or three or more sets may be provided, and these may be appropriately set in consideration of productivity in the line.

Further, in the above-mentioned embodiment, the carrier table 5, that is, the supporting table 2 side is moved, but the crimping head 4 side may be moved, and the supporting table 2 and the crimping head 4 are relative as moving means. Anything that can be moved manually is acceptable. Furthermore, the present invention is not limited to the case where the liquid crystal driver IC 20 is mounted on the liquid crystal panel 10, but also when a resistor or a capacitor is mounted on the liquid crystal panel, an electronic printing element (thermal printer head) used in a thermal printer, or an optical sensor. It can also be applied to mounting other electronic components such as ICs, resistors and capacitors on various electronic components such as.

[0050]

As described above, according to the present invention,
This is effective in reducing the setting work of the device when switching the model to be produced.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a main part of the mounting apparatus of the embodiment.

FIG. 3 is a schematic diagram showing a main part of the mounting apparatus of the embodiment.

FIG. 4 is a diagram showing a data structure of a model-specific data file of the embodiment.

FIG. 5 is a diagram showing a data structure of an IC information file of the embodiment.

FIG. 6 is a flowchart showing a procedure of a mounting method according to the exemplary embodiment.

FIG. 7 is an operation explanatory view showing the procedure of the mounting method of the embodiment.

[Explanation of symbols]

1 Mounting device 2 support table 4 Crimping head 5 carrier 6 Crimping head drive means 7 Transport platform moving means 8 Control means 10 Liquid crystal panel which is the first electronic component 20 Liquid crystal driver IC that is the second electronic component 31 Model input section 32 memory 33 Control unit 41 Model-specific data file 42 IC information file

─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-4-322492 (JP, A) JP-A-6-244238 (JP, A) JP-A-6-349892 (JP, A) JP-A-8- 114810 (JP, A) JP-A-9-330957 (JP, A) JP-A-10-163274 (JP, A) JP-A-10-294333 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345 G09F 9/00 H05K 3/32 H05K 13/03

Claims (8)

(57) [Claims] 1. An electronic component mounting apparatus for crimping and mounting a plurality of second electronic components arranged on a first electronic component, the device being configured to be movable back and forth toward the second electronic component. And a supporting member on which the first electronic component is placed, and the pressing head and the supporting member are arranged relative to each other along the arrangement direction of the second electronic component. A moving unit that moves automatically, and a control unit that controls the amount of relative movement by the moving unit,
The control means includes a model input unit for inputting a model of the first electronic component, and a storage unit in which arrangement interval data of the second electronic component in the model is stored, Based on the data input in the model input section, the first
The electronic component mounting apparatus, wherein the arrangement interval data of the second electronic component corresponding to the electronic component model is read from the storage unit to control the relative movement amount. 2. The electronic component mounting apparatus according to claim 1, wherein the moving unit moves the supporting member with respect to the pressure bonding head. 3. The electronic component mounting apparatus according to claim 1, wherein a plurality of sets of the pressure bonding head and the supporting member are provided and are operated in synchronization with each other. apparatus. 4. The electronic component mounting apparatus according to claim 3, wherein the plurality of support members are arranged on a carrier according to a space between the plurality of pressure bonding heads. Component mounting equipment. 5. A first electronic component is placed on the support member,
In a mounting method of an electronic component, wherein a plurality of second electronic components are crimped and mounted on the first electronic component by a crimping head, a step of inputting a model of the first electronic component, Based on the data of the arrangement interval between the second electronic component corresponding to the model of the first electronic component and the other second electronic component, the pressure-bonding head and the supporting member are set to the other second electronic component. The electronic component and the crimping head relatively move so as to face each other, and the crimping head crimps the other second electronic component onto the first electronic component. The mounting method of the characteristic electronic component. 6. A first electronic component is placed on each of a plurality of support members, and a plurality of second electronic components are crimped onto each of the first electronic components in correspondence with each of the first electronic components. In a method of mounting an electronic component by crimping and mounting with a head, a step of inputting a model of the first electronic component, and a step of inputting a model of the first electronic component based on the input data. The arrangement interval data between the electronic component and the other second electronic component is read and each of the pair of the pressure bonding head and the supporting member is synchronized so that the other second electronic component and the pressure bonding head A step of relatively moving so as to face each other, and crimping the other second electronic component onto the first electronic component by the crimping head, the mounting method of the electronic component. 7. A method of manufacturing a liquid crystal panel, wherein a liquid crystal panel is placed on a support member, and a plurality of electronic components are crimped and mounted on the liquid crystal panel by a crimping head, wherein a model of the liquid crystal panel is input. And reading out the arrangement interval data between the electronic component corresponding to the model of the liquid crystal panel and the other electronic component based on the input data, and setting the pressure bonding head and the supporting member to the other electronic component and the electronic component. A step of relatively moving so as to face the crimping head, and crimping the other electronic component onto the liquid crystal panel by the crimping head, the mounting method of the electronic component. 8. A method of manufacturing a liquid crystal panel, wherein a liquid crystal panel is placed on each of a plurality of support members, and a plurality of electronic components are mounted on each liquid crystal panel by pressure bonding with a pressure bonding head corresponding to each liquid crystal panel. In the step of inputting the model of the liquid crystal panel, the arrangement interval data between the electronic component corresponding to the model of the liquid crystal panel and the other electronic component is read out based on the input data, and the pair of the crimps is formed. The head and the supporting member are synchronized with each other and relatively move so that the other electronic component and the crimping head face each other, and the crimping head crimps the other electronic component onto the liquid crystal panel. A method of manufacturing a liquid crystal panel, comprising: