JP3380733B2 - Optical module and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed optical module and a method for manufacturing the same, and particularly to provide a hybrid optical integrated circuit having a sealing structure excellent in economy and reliability.

[0002]

2. Description of the Related Art In an optical integrated circuit in which an optical element such as an LD optically coupled to an optical waveguide is integrated on a substrate, a method of molding with a resin is used in order to ensure economical reliability, like a silicon semiconductor. Is being considered. For example, Terashima
Others "1997 IEICE General Conference Proceedings C-3-
61 "has an LD and a monitor PD mounted on a Si substrate,
A structure has been proposed in which an optical fiber with a ferrule is placed in a V groove formed in a Si substrate, fixed, and then the whole is sealed with an epoxy resin. In addition, a resin-encapsulated optical module is also reported in Ishii et al., "Electronic Communication Institute General Conference Proceedings C-3-62".

FIG. 9A is a sectional view of an optical module based on those proposals, and FIG. 9B is a perspective view thereof. In FIG. 9, reference numeral 01 is an optical fiber, 02 is a ferrule, 03 is a sealing resin, 04 is a transparent resin, 05 is an optical element, 06 is a Si substrate with a V groove, and 07 is an optical fiber retainer. . In this conventional example, an optical fiber is used as the optical waveguide. The optical fiber 01 is the Si substrate 0.
It is adhered and fixed to the V groove of 6 with the optical fiber holder 07, and is optically coupled with the optical element. In the above report example, the optical element 05 includes an LD and a monitor PD. These optical elements 05 are wire-bonded to the lead frame 08 with gold wires through the electrodes on the Si substrate 06.

Further, the optical element 05 and the optical coupling portion between the optical element 05 and the optical fiber 01 are covered with the transparent resin 04 and are protected from the penetration and stress of the opaque sealing resin 03. In the optical module thus formed, for example, the receptacle of the optical connector is used by being adhered to the end surface.

[0005]

On the other hand, in the case of using, for example, a silica-based planar lightwave circuit instead of an optical fiber as the optical waveguide, a highly functional optical circuit such as a branch circuit or a demultiplexing circuit can be easily realized. LD for transmission and PD for reception by branching
An example is the case where the optical transceiver is integrated by integrating the above. In that case, it is necessary to connect an optical fiber to the optical waveguide in order to take out the input and output to the outside, and the optical fiber block is usually connected and fixed to the end portion of the optical waveguide with an adhesive. However, when an optical waveguide of this structure is to be resin-molded, the stress due to the contact of the mold at the time of molding and the residual stress of the molding compound act on the optical fiber block, and as a result, misalignment occurs between the optical fiber and the optical waveguide. Occurs, and in a more severe case, the optical fiber block may come off.

Therefore, it has been desired to realize a sealing technique which solves these problems, enables economical resin sealing, and enables highly efficient connection between an optical fiber and an optical waveguide. That is, it has been desired to realize a sealing technique that enables economical resin sealing and highly efficient optical connection between an optical fiber and an optical waveguide.

An object of the present invention is to provide a resin-sealed optical module capable of highly efficient optical connection between an optical fiber and an optical waveguide by exposing an end surface of the optical waveguide, and a method for manufacturing the same.

[0008]

According to a first aspect of the present invention for solving the above-mentioned problems, an optical waveguide provided on a substrate is embedded in a molded resin, and an optical waveguide is provided at an end portion of the optical waveguide.
In the optical module the fiber is bonded, the resin is prevented from flowing into the end face of the optical waveguide organic
The resin stop system material, the only setting the output end so as to surround the optical waveguide and the substrate, is proposed an optical module, characterized in that the end face of the optical waveguide is exposed to the outside.

According to the first aspect of the present invention, the optical waveguide provided on the substrate is embedded in the resin, and the optical waveguide is provided at the end portion of the optical waveguide.
In an optical module to which an optical fiber is bonded and fixed, by providing a resin stopper so as to surround the optical waveguide and the substrate, it is possible to prevent the sealing resin from covering the whole and expose one end of the optical waveguide to the outside. . This makes it possible to actively align the input / output optical fibers with the optical module while resin-sealing most of the optical module, and to realize an optical module that is highly efficient and highly reliable. it can. Further, as a result, since the optical fiber can be arranged outside the molding material, it is possible to prevent the displacement of the optical fiber due to the stress of the molding material.

[0010] In claim 2 is the 請 Motomeko 1, wherein the resin blocking may propose an optical module characterized in that it is fixed to the optical waveguide and the substrate.

According to the second aspect, by fixing the resin stopper to the optical waveguide and the substrate with an adhesive or the like, flexibility can be obtained in the method of constructing the optical module.

In claim 3, in claim 1 or 2,
An optical module is proposed in which the resin stopper also serves as a member for reinforcing the optical fiber connection.

According to the third aspect, since the resin stopper also serves as a member for reinforcing the optical fiber connection, an economical and highly efficient optical module can be realized.

In claim 4, in claim 1 or 2,
An optical module is proposed in which the resin stopper also serves as a structure forming an optical connector.

According to the fourth aspect, since the resin stopper also serves as the structure forming the optical connector, an economical and highly efficient optical module can be realized. In the conventional report example, the receptacle of the optical connector was bonded later, but the resin module also serves as the receptacle of the optical connector, so that the optical module can be realized more economically.

According to a fifth aspect, in the first to fourth aspects,
The substrate provided with the optical waveguide is fixed on the lead frame, the optical element optically coupled to the optical waveguide is mounted on the substrate, and the lead frame is provided through electrodes on the substrate and / or electrical wiring on the optical waveguide. We propose an optical module in which an optical element is electrically connected to the optical module.

According to the fifth aspect, the substrate is fixed to the lead frame, and the electrical wiring to the optical element mounted on the substrate is performed through the lead frame mounting the substrate.
It is not necessary to separately provide an electrode or a pin for taking out electric wiring separately, and an optical module can be realized more economically.

According to a sixth aspect, in the first to fifth aspects,
An optical element optically coupled to the optical waveguide is mounted on a substrate provided with the optical waveguide, and an optical element and an optical coupling portion between the optical element and the optical waveguide are covered with a transparent resin. Propose an optical module.

According to the sixth aspect, by covering the optical waveguide and the optical coupling portion of the optical element with the transparent resin, it is possible to use an opaque resin as the resin for sealing the whole, and the choice of resins is expanded. That is, it becomes possible to use a resin having high moisture resistance filled with an inorganic substance or the like, and the moisture resistance and reliability of the optical module are greatly improved. As the sealing resin having high moisture resistance, it is possible to use a resin that has been used for sealing semiconductors and has a proven track record.

According to a seventh aspect, in the first to sixth aspects,
An optical module is proposed in which an optical fiber is connected to an end face of the optical waveguide.

According to claim 7, since the end face of the optical waveguide is exposed, a highly efficient connection with an input / output optical fiber is possible, and a highly reliable and economical resin-sealed optical module is provided. it can.

In claim 8, in claims 1 to 4,
An optical module is proposed in which resin stoppers are provided on both sides of the optical waveguide, and optical fibers are connected to each other.

According to the eighth aspect, the optical components such as the splitter and the multiplexing / demultiplexing circuit can be sealed with the resin to improve the reliability while the highly efficient connection with the optical fiber is possible.

According to a ninth aspect, in the first to fourth aspects,
An optical module is proposed, in which microcapillaries aligned with the core of the optical waveguide are provided on both sides of the end face of the optical waveguide, and optical fibers are connected to the microcapillaries.

According to the ninth aspect, since the optical waveguide is sealed with the resin and the resin stopper which also serves as the structure forming the optical connector is provided on the end face, the structure is extremely compact.
Optical components with high reliability can be constructed.

According to a tenth aspect of the present invention, in the first aspect, the resin stopper also serves as an optical fiber connection reinforcing member, and after fixing the resin stopper to the optical waveguide and the substrate,
We propose an optical module characterized in that its end face is flush with the optical waveguide and is connected to an optical fiber connecting block.

According to the tenth aspect, since the resin stopper is also used as the reinforcing member for optical fiber connection, highly efficient connection with the optical fiber is possible and reliable without reducing the number of parts and increasing the number of processes. Thus, a highly economical resin-sealed optical module can be obtained.

In the eleventh aspect of the present invention, the optical waveguide provided on the substrate is embedded in a molded resin with its end exposed to the outside, and an optical fiber is provided at the exposed end of the optical waveguide.
In the method for manufacturing an optical module to be bonded, the
Organic to prevent resin from flowing into the end face of the optical waveguide
Enclose the optical waveguide and the substrate with the resin stopper of the system material.
Forming input and output end to Migihitsuji, a mold used when embedding in the resin by installing so as to be in contact with the resin stop, the optical waveguide and the substrate is not in direct contact with the mold
In this way, a method for manufacturing an optical module is proposed, which is characterized in that the resin is embedded .

According to the eleventh aspect, since the optical waveguide and the substrate do not come into direct contact with the resin sealing mold,
There is an advantage that the generation of scratches on the optical waveguide and the substrate due to contact with the mold can be avoided.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below, but the present invention is not limited thereto.

[First Embodiment] The first embodiment of the present invention is an example in which a resin stopper is formed on the optical waveguide and the substrate provided on the substrate and the resin is sealed. FIG. 1 (A) is a plan view of an example in which a resin stopper 15 is formed on an optical waveguide provided on a substrate, and FIG. 1 (B) is a perspective view thereof. Note that the lead frame is omitted in FIG. The lead frame in FIG. 1B is shown in a cut form after the module is formed.

As shown in FIG. 1B, the optical waveguide 11 is formed on the substrate 12. The substrate 12 is adhesively fixed on the lead frame 13, but an adhesive, solder, or the like can be applied to this adhesion, as in the normal semiconductor production process. The reinforcing member 14 is adhered and fixed onto the optical waveguide 11 with an adhesive or the like. Here, as the above-mentioned optical waveguide 11, various optical waveguides such as quartz, polymer, and semiconductor can be cited. Examples of the substrate 12 include an Al substrate, a steel polyimide substrate, a ceramic substrate, and a glass substrate, in addition to the Si substrate similar to the conventional example shown in FIG. Further, various metals generally used in semiconductor production can be applied to the lead frame 13. The reinforcing member 14 may be made of glass, plastic, ceramic, or the like.

The resin stopper 15 in the present invention, thermoplastic resin or thermosetting resin, an organic material such as an elastomer is preferred, the invention is not name limited thereto. As an example of manufacturing the resin stopper 15, it may be formed by injection molding or grinding of a thermoplastic resin, and then fixed around the substrate 12, the optical waveguide 11 and the reinforcing member 14 by a fixing means such as an adhesive. It

The cutout portion 16 of the optical waveguide of FIG. 1A shown in this embodiment is a portion where the optical waveguide 11 is removed and the substrate 12 is exposed, and the optical element 17 is mounted. Has been done. For example, as the optical element 17, LD and P
An optical module for an optical transceiver can be constructed by mounting D and optically coupling it to one end of the Y-branch waveguide as shown in FIG.

FIG. 2 is a cross-sectional view when the optical waveguide with resin stopper shown in FIG. 1 is set in a sealing mold (hereinafter referred to as “mold”) 21 and resin sealing is performed. is there. The injection hole for the sealing resin 22 is omitted. The optical coupling portion and the optical element 17 are protected by the transparent resin 23. The transparent resin 23
For this purpose, a silicone resin having a small stress is suitable.
In the present invention, the encapsulating resin 22 may be a liquid molding epoxy resin or urethane resin, as well as an epoxy resin for transfer molding, but the present invention is not limited thereto. If a release agent is applied to the inside of the mold 21, the mold 21 can be easily removed after the sealing resin is cured.

The mold 21 is divided into, for example, an upper part and a lower part,
A structure in which the lead frame 13 and the resin stopper 15 are sandwiched and fixed can be applied. In this case, only the lead frame 13 and the resin stopper 15 are in contact with the mold 21. The upper and lower molds 21 are pressed and fixed by using a fastening member such as a screw. The encapsulating resin 22 is poured into the mold 21 and heated and cured at a predetermined temperature to obtain a resin-encapsulated optical module.

For comparison, FIG. 3 shows a cross-sectional view of the optical module of this embodiment manufactured without the resin stopper 15 at the time of sealing. As shown in FIG. 3, when the resin stopper 15 is not provided, the mold 21 directly connects the substrate 12 and the reinforcing member 1.
You will come into contact with 4. Upper and lower molds 2 when sealing
Since it is necessary to apply pressure to the substrates 1 and 21 to fix them to prevent the resin from leaking, the substrate 12 that directly contacts the mold 21.
It can be seen that stress is applied to the reinforcing member 14 and the reinforcing member 14 and there is a risk of damage. On the other hand, as shown in FIG. 2, since the resin stopper 15 is interposed between the mold 21 and the substrate 12 or the reinforcing member 14, the stress can be absorbed and the risk of damage can be reduced. .

In the resin-sealed optical module obtained in this embodiment, since the end face of the optical waveguide 11 is exposed, the optical fibers for input and output are aligned with high accuracy by the active alignment method and then bonded. Can be fixed.

FIG. 4 is a sectional view of a module in which an optical fiber 24 is adhesively fixed to the resin-sealed optical module obtained in this embodiment. The glass block 25 for fiber connection has a V groove, and the optical fiber 24 is sandwiched and fixed,
It is for reinforcing the fiber connection part.

In the present embodiment, for example, the optical element 17
If one of the two is a laser diode, a drive current is passed through the one and the light emitted from the end face of the optical waveguide 11 is monitored by an optical sensor connected to the other end of the optical fiber 24, while the optical fiber 24 and the optical waveguide 11 are monitored. Alignment can be done. If an ultraviolet curable adhesive is applied to the end surface of the optical waveguide 11 in advance, it is possible to irradiate ultraviolet rays after positioning and fix the adhesive. Further, the connection portion can be cut obliquely as shown in FIG. 4 to suppress reflection at the interface.

Thus, by fixing the mold with the resin stopper fixed to the optical waveguide and the substrate, the fragile optical waveguide and the substrate are not in contact with the mold, and the end face of the optical waveguide is exposed to the outside. It can be sealed with a resin, and as a result, a resin-sealed optical module that can be highly efficiently connected to an optical fiber and has high reliability and economy can be obtained.

[Second Embodiment] The second embodiment is an example in which a resin stopper is also used as an optical connector, and a sectional view is shown in FIG. In this embodiment, the resin stopper 31 also serves as the receptacle of the optical connector, and is fixed around the substrate 12, the optical waveguide 11 and the reinforcing member 14 with an epoxy adhesive as in the first embodiment. The end surface of the optical waveguide is vertically cut and polished, and the microcapillary 32 is aligned and bonded and fixed to the core of the optical waveguide by the active alignment method before resin sealing. The plug 33 of the optical connector in which the optical fiber 24 is mounted is the receptacle 31.
The optical fiber 24 meshes with the microcapillary 3
It is designed to be inserted in the center of 2.

As in the first embodiment, the mold is fixed with resin 3
1 and the lead frame 13 are aligned and fixed, resin is injected, and heating and curing are performed to obtain a desired resin-sealed optical module.

Since the resin stopper and the optical connector are also used in this manner, a resin-sealed optical module with an optical connector can be obtained without increasing the number of processes.

[Third Embodiment] The third embodiment is an example in which resin stoppers are provided at both ends of an optical module and optical fibers are connected to both ends, and FIG. 6 is a sectional view. Optical waveguide 11
Is, for example, a splitter or a multiplexer / demultiplexer circuit. In the present embodiment, the resin stoppers 15 are fixed to both ends of the optical waveguide 11. Also in the present embodiment, a mold (not shown) is fixed so as to sandwich the resin stoppers 15 at two places, and the resin is injected / heated / cured to obtain a desired resin-sealed optical module. . In FIG. 6, the interface between the optical waveguide and the substrate and the connection reinforcing glass block 34 is obliquely cut and polished to suppress the return of reflected light at the adhesive interface after connection.

In this way, the optical components such as the splitter can be sealed with the resin while the highly efficient connection with the input / output optical fiber is possible, and the reliability can be improved.

In the present embodiment, the active alignment using the glass block is illustrated as the connection with the optical fiber, but an example in which the resin stopper is also used as the optical connector may be mentioned. The sectional view is shown in FIG. In the present embodiment, the resin stopper 31 also serves as the receptacle of the optical connector, as in the second embodiment. In this example, since the optical waveguide is sealed with resin and the optical connector is already connected to the end face, a highly reliable optical component can be configured with an extremely compact configuration.

[Fourth Embodiment] The fourth embodiment is an example in which a resin stopper is also used as an optical fiber connection reinforcing member, and a sectional view is shown in FIG. The optical waveguide 11 is formed on the substrate 12, and the optical element 17 optically coupled to the optical waveguide 11 is mounted as in the first embodiment.
Protected by 3. However, the optical fiber connection reinforcing member 14 shown in the first embodiment is also used as the resin stopper 35 in the present embodiment. After the resin stopper 35 is fixed to the optical waveguide 11 and the substrate 12,
And the end faces are flush with each other. The same material as that shown in the first embodiment can be applied to the resin stopper 35 that also serves as the reinforcing member. After that, the optical module is fixed in a mold and resin-sealed in the same manner as in Embodiment 1.

As described above, by using the resin stopper and the member for reinforcing the optical fiber connection as well, it is possible to achieve highly efficient connection with the optical fiber without reducing the number of parts and increasing the number of processes, and the reliability and cost efficiency are improved. It is possible to obtain a resin-sealed optical module with high efficiency.

[0050]

As described above, according to the inventions of claims 1 to 4, an optical module in which an optical waveguide provided on a substrate is embedded in a resin and an optical fiber is bonded and fixed to an end of the optical waveguide. In, by providing a resin stopper on a part of the optical waveguide and the substrate, at least one end of the optical waveguide is exposed to the outside, it is possible to connect the optical fiber there by the active alignment method, the connection loss is small,
A highly reliable resin-sealed optical module can be obtained. This resin stopper can be bonded and fixed to the optical waveguide and the substrate, and can also serve as an optical connector or an optical fiber connection reinforcing member. As a result, a resin-sealed optical module having excellent connectivity can be obtained without increasing the cost of manufacturing the module.

According to the fifth and sixth aspects of the invention, by fixing the substrate on the lead frame and performing electrical wiring,
The optical waveguide having the optical element optically coupled to the optical waveguide can be easily resin-sealed while maintaining the connectivity with the optical fiber to obtain a highly reliable optical module. At this time, the optical element and the optical coupling portion can be protected from the sealing resin by being covered with the transparent resin.

Further, according to the invention of claim 7, since the end face of the optical waveguide is exposed, highly efficient connection with the optical fiber for input and output is possible, and the resin sealing with high reliability and economical efficiency. An optical module can be provided.

According to the eighth aspect of the present invention, the optical components such as the splitter and the multiplexing / demultiplexing circuit can be sealed with the resin to improve the reliability while the highly efficient connection with the optical fiber is possible. it can.

According to the ninth aspect of the present invention, the optical waveguide is sealed with resin, and the resin stopper, which also serves as the structure forming the optical connector, is provided on the end face. Therefore, the structure is extremely compact and reliable. High optical components can be constructed.

According to the tenth aspect, since the resin stopper is also used as the reinforcing member for the optical fiber connection, highly efficient connection with the optical fiber can be achieved without reducing the number of parts and increasing the number of processes, and the reliability is improved. Thus, a highly economical resin-sealed optical module can be obtained.

According to the eleventh aspect of the present invention, fixing the mold with a resin stopper prevents the fragile optical waveguide and the substrate from directly contacting with the mold. It is possible to prevent deterioration such as cracks in the optical waveguide or the substrate, and to realize a highly reliable optical module.

[Brief description of drawings]

FIG. 1 shows a first embodiment of a resin-sealed optical module of the present invention. (A) is a plan view and (b) is a perspective view.

FIG. 2 is a cross-sectional view of the first embodiment of the resin-sealed optical module of the present invention when sealing.

FIG. 3 is a cross-sectional view when resin sealing is performed without using the resin stopper of the present invention.

FIG. 4 is a cross-sectional view of a module in which an optical fiber is bonded and fixed to the resin-sealed optical module obtained in the first embodiment of the resin-sealed optical module of the present invention.

FIG. 5 is a sectional view showing a second embodiment of the resin-sealed optical module of the present invention.

FIG. 6 is a sectional view showing a third embodiment of the resin-sealed optical module of the present invention.

FIG. 7 is a cross-sectional view showing a third embodiment of the resin-sealed optical module of the present invention, in which the resin stopper also serves as an optical connector.

FIG. 8 is a sectional view showing a fourth embodiment of the resin-sealed optical module of the present invention.

FIG. 9 is a cross-sectional view showing a form of a conventional resin-sealed optical module.

[Explanation of symbols]

11 Optical waveguide 12 substrates 13 lead frame 14 Connection reinforcing member 15 Resin stop 16 Notch of optical waveguide 17 Optical element 18 Optical Waveguide Core 21 Sealing mold 22 Sealing resin 23 Transparent resin 24 optical fiber 25 Glass block for reinforcing optical fiber connection 31 Resin stop (combined with receptacle) 32 microcapillaries 33 Optical connector plug 34 Glass block for connection reinforcement 35 Resin stopper that doubles as a member for reinforcing optical fiber connection 02 ferrule 01 optical fiber 02 ferrule 03 sealing resin 04 transparent resin 05 Optical element 06 V grooved Si substrate 07 Optical fiber holder 08 lead frame

Front page continuation (72) Inventor Akira Morinaka 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo Japan Telegraph and Telephone Corporation (72) Inventor Shuichiro Asakawa 3-2-3-3 Nishishinjuku, Shinjuku-ku, Tokyo Nippon Telegraph and Telephone Corp. (72) Inventor Koji Sato 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Nihon Telegraph and Telephone Corp. (72) Inventor Shunichi Higashino 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo No. 2 Nihon Telegraph and Telephone Corporation (56) Reference JP-A-10-123371 (JP, A) JP-A-4-330788 (JP, A) JP-A-8-162591 (JP, A) JP-A 55-138847 (JP, A) Actual Kaihei 3-16109 (JP, U) Actual Kaihei 5-2930 (JP, U) Teramine Munehiro et al. al. , Proceedings of the 1997 IEICE General Conference, March 6, 1997, Electronics 1, p. 246 Toshiaki Ishii et. al. , Proceedings of the 1997 IEICE General Conference, March 6, 1997, Electronics 1, p. 247 (58) Fields investigated (Int.Cl. ⁷ , DB name) G02B 6/30 G02B 6/12 -6/14 G02B 6/42-6/43 B29C 45/14 H01L 21/56

Claims (11)

(57) [Claims] 1. An optical waveguide provided on a substrate is embedded in a molded resin, and an optical fiber is provided at an end of the optical waveguide.
In the optical module Aiba is bonded, the resin is prevented from flowing into the end face of the optical waveguide
The resin stop organic material, only set in the optical waveguide and the input end so as to surround the substrate, an optical module, characterized in that exposing the end face of the optical waveguide to the outside. 2. The optical module according to claim 1, wherein the resin stopper is fixed to the optical waveguide and the substrate. 3. The optical module according to claim 1, wherein the resin stopper also serves as an optical fiber connection reinforcing member. 4. The optical module according to claim 1, wherein the resin stopper also serves as a structure forming an optical connector. 5. The substrate according to claim 1, wherein the substrate on which the optical waveguide is provided is fixed on a lead frame, an optical element optically coupled to the optical waveguide is mounted on the substrate, and electrodes and / Alternatively, the optical module is characterized in that the optical element is electrically wired to the lead frame through the electrical wiring on the optical waveguide. 6. The optical element according to claim 1, wherein the optical element optically coupled to the optical waveguide is mounted on a substrate provided with the optical waveguide, and the optical element and an optical coupling portion between the optical element and the optical waveguide are transparent. Optical module characterized by being covered with transparent resin. 7. The optical module according to claim 1, wherein an optical fiber is connected to an end surface of the optical waveguide. 8. The optical module according to claim 1, wherein resin stoppers are provided on both sides of the optical waveguide, and optical fibers are connected to each other. 9. The microcapillary according to claim 1, wherein microcapillaries aligned with the core of the optical waveguide are provided on both sides of the end face of the optical waveguide, and optical fibers are connected to the microcapillaries. An optical module characterized by. 10. The resin stopper according to claim 1, wherein the resin stopper also serves as an optical fiber connection reinforcing member, and after fixing the resin stopper to the optical waveguide and the substrate, the end face is flush with the optical waveguide. An optical module characterized by being connected to a fiber connecting block. 11. The optical waveguide provided on the substrate has an end portion.
The exposed to the outside it is embedded in molded resin, dew
An optical fiber is bonded and fixed to the end of the ejected optical waveguide.
In the method of manufacturing an optical module, the resin is prevented from flowing into the end face of the optical waveguide.
A resin stopper of an organic material is used for the optical waveguide and the substrate.
It was formed on the output end so as to surround the mold used when embedding in resin this <br/> and installing so as to be in contact with the resin stop, the optical waveguide and the substrate directly into contact with the mold A method of manufacturing an optical module, characterized in that the resin is embedded so as not to do so .