JP3382201B2 - Wheel cutter and substrate cutting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wheel cutter referred to as a diamond cutter and a substrate cutting apparatus provided with a plurality of such wheel cutters. Relating to applied cutting technology.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 6, for example, a mold chip is cut and separated by the following procedure. Here, FIG. 6 is a perspective view showing a cutting procedure of the substrate. The substrate 1 prepared in advance, which is pasted on the UV film F, is prepared, and the substrate 1 is suction-held on a substrate holder (not shown). Then, while the substrate holder is sequentially fed in the X direction, the wheel cutter 3 is run in the Y direction for each line to divide the wheel cutter 3 in the X direction. After the division in the X direction is completed, the substrate holder is turned by 90 °, and the wheel cutter 3 is run line by line while the substrate holder is sequentially fed in the same manner to perform the division in the Y direction.

Then, the UV film F is removed from the substrate holder, and the mold chip 2 and the remaining debris attached to the UV film F are removed from the UV film F.
Remove from. Here, reference numeral 1c in FIG. 6 is a positioning pin hole of the substrate 1, and Sx and Sy are mold chips 2 respectively.
The X-direction clearance and the Y-direction clearance are shown in between, and the vertical and horizontal broken lines indicate the cutting lines along which the wheel cutter 3 travels. Further, the cutting depth of the wheel cutter 3 is set in units of several μ, and the UV film F is not divided.

The mold chip 2 is, for example, a silicon chip or the like on which an integrated circuit is formed, made of epoxy resin, or the like.
Refers to the one molded above (the same applies below). In the state where the substrate 1 is cut and the mold chip 2 is cut into pieces, as shown in FIG.
Bottom cut surfaces 2a and 2b of the molded chip 2 in (A)
Then, the lead 2R as shown in FIG. 5B, for example, is exposed. Here, FIG. 5A is a perspective view of the cut mold chip, FIG. 5B is an enlarged view of a main part of the cut surfaces 2a and 2b, and FIG. 5C is a lead appearing on the bottom surface of the mold chip. FIG. Note that FIG. 5 (B)
Reference numeral 2R in (C) indicates a lead of the mold chip 2 and 2S indicates a through hole formed in the lead 2R.

For example, as shown in FIG. 4, the wheel cutter 3 has a thin disc core 3a and a thin peripheral metal core portion 3b formed integrally with the diamond abrasive material 5 so as to cover the peripheral metal core portion 3b. Is sintered with a substantially uniform thickness. Further, the width (thickness) W of the cutting edge is approximately 0.
It is set to 2 mm to 0.3 mm. Since the width W of the disk body 3a and the cutting edge is extremely thin and the rigidity of the wheel cutter 3 is weak, the wheel cutter 3 has a small radius and a rotation speed set to 20,000 rpm to 30,000 rpm to ensure cutting accuracy. It In this conventional technique, since the wheel cutter rotates at an extremely high speed, it is necessary to employ a gas bearing or cool the blade edge portion, so that the structure of the cutting device is complicated and the cost becomes high. Further, according to the conventional cutting (dividing) technology, the wheel cutter 3 is run line by line to cut the substrate 1 while sequentially feeding the substrate holders by pitch, so that it takes a long time to cut the mold chips 2. It costs.

Therefore, the present applicant has filed Japanese Patent Application No. 11-3218.
No. 87 proposed a substrate cutting device shown in FIG. 3 (hereinafter, referred to as "preliminary proposal example"). In the previously proposed example, as shown in FIG. 3, a first rotary blade group 7A having a plurality of wheel cutters 3 aligned with the X direction array pitch Px of the mold chips 2 and the Y of the mold chips 2 are provided.
The second rotary blade group 7B having a plurality of wheel cutters 3 aligned with the direction array pitch Py is configured to be coaxially rotatable, and the mold chips 2 arrayed in the X direction by the first rotary blade group 7A are collectively packaged. After that, the substrate holder is rotated 90 ° and the mold chips 2 arranged in the Y direction by the second rotary blade group 7B are collectively cut.

Here, FIG. 2A is a front view of a wheel cutter constituting the above cutting device, FIG. 2B is a vertical sectional side view of the wheel cutter, and FIG. 1B is a cutting edge portion of the wheel cutter. It is an expanded longitudinal cross-sectional view of E. The wheel cutter 3 has, for example, as shown in FIG.
Forming a disk body 3A having a thickness P matching the array pitch (Px or Py) of the mold chips 2;
The disc main body 3A has a paragraph-shaped and thick peripheral metal core portion 3B.
Are integrally formed, and the diamond abrasive 5 is sintered to have a substantially uniform thickness so as to cover the peripheral core metal portion 3B.

Further, the width (thickness) W of the blade edge portion E of each wheel cutter 3 constituting each rotary blade group 7A, 7B is smaller than the gap Sx, Sy in the X, Y directions between the mold chips 2, More than half of each gap Sx and Sy (for example, about 2 mm
~ 3 mm, 10 times or more of the thickness of the conventional example),
For example, as shown in FIG. 1 (B), the cross section of the tip corner portion is formed to have an arc in consideration of durability. That is, the gap is separated by polishing the gaps Sx and Sy between the mold chips 2 using a wheel cutter having a wider blade edge than in the conventional example.

[0009]

The above proposed example is very excellent, but there is still room for improvement in the following points.
The width W of the cutting edge portion E is set to be 10 times or more the thickness of the conventional example, and the thick wheel cutter is used to divide the gap Sx / Sy between the mold chips 2 by polishing. Becomes a rough surface, and in particular, there is a problem that the lead 2R exposed on the cut surface is peeled off at the position of the through hole 2S, and the lead 2R is frayed. The present invention has been made in view of such circumstances, the object is, even when using a thick wheel cutter, the cut surface does not become a rough surface, the leads exposed on the cut surface is peeled off, It is to eliminate the inconvenience of lead burring.

[0010]

In order to solve the above technical problems, the present invention is configured as follows. That is, the invention described in claim 1 is, for example, FIG. 1 (A) and FIG. 2 (A).
As shown in (B), in a wheel cutter constituted by forming a thick peripheral core metal part 3B integrally with the disc body 3A and covering the peripheral core metal part 3B with a diamond abrasive 5, the peripheral core metal part A pair of thin cored bar portions 3C and 3C are projected from both ends in the thickness direction of 3B in the outer peripheral direction, and the cored bar portions 3C and 3C are covered with the diamond abrasives 5 to form the cut portions 6 and 6. It is characterized by being configured. Here, the thick peripheral core metal portion 3B means that the thickness W of the peripheral core metal portion 3B is formed to be several times thicker than that of the peripheral core metal portion 3b of the conventional example.

A second aspect of the present invention includes a plurality of wheel cutters 3 according to the first aspect, the substrate 1 held by a substrate holder is cut, and mold chips arranged on the substrate 1 in XY directions. A substrate cutting device for dividing the mold chip 2 into two pieces, the arrangement pitch P of the mold chips 2 in the X direction.
a first rotary blade group 7A having a plurality of the wheel cutters 3 aligned with x, and a second rotary blade group 7B having a plurality of the wheel cutters 3 aligned with the Y-direction array pitch Py of the mold chips 2; After the mold chips 2 arranged in the X direction are collectively cut by the first rotary blade group 7A, the substrate holder is turned by 90 ° and the second rotary blade group 7B is used in the Y direction. It is characterized in that the mold chips 2 arranged in the above are cut off at once.

According to a third aspect of the present invention, in the substrate cutting apparatus according to the second aspect, the rotary blade groups 7A and 7 are provided.
The width (thickness) W of the cutting edge portion E of each wheel cutter 3 forming B is set to be smaller than the gaps Sx and Sy in the X and Y directions between the mold chips 2 and to be more than half of the respective gaps Sx and Sy. The rotary blade groups 7A and 7B and the substrate holder are cut while being relatively repeatedly moved in a lateral direction intersecting the cutting direction.

[0013]

According to the present invention, the following actions and effects are exhibited. (A) Even if a thick wheel cutter is used, it is possible to eliminate the inconvenience that the cut surface does not become a rough surface, the lead exposed on the cut surface is peeled off, and the lead is burred.

That is, according to the first aspect of the invention, the thick peripheral cored bar portion 3B is formed integrally with the disc body 3A, and a pair of thin peripheral peripheral cored bar portions 3B are formed in the outer peripheral direction from both ends in the thickness direction. Since the metal core portions 3C and 3C are provided in a protruding manner and the metal core portions 3C and 3C are covered with the diamond abrasive 5 to form the cut portions 6 and 6, these thin cut portions 6 and 6 are formed. Cuts sharply at the cutting point. That is,
The gap Sx between the mold chips 2 arranged in XY on the substrate
・ Sharply divide Sy. Therefore, it is possible to eliminate the inconvenience that the cut surface does not become a rough surface, the lead exposed on the cut surface is peeled off, and lead burring occurs.

(B) In the invention described in claim 2, the plurality of wheel cutters 3 described in claim 1 are provided, and the plurality of wheel cutters 3 are arranged in alignment with the X direction array pitch Px of the mold chips 2. A first rotary blade group 7A,
A second rotary blade group 7 having a plurality of the wheel cutters 3 arranged in alignment with the Y-direction arrangement pitch Py of the mold chips 2.
B and B are configured to be coaxially rotatable, and the mold chips 2 arranged in the X direction by the first rotary blade group 7A are collectively cut, and then the substrate holder is rotated 90 ° and the second rotary blade group 7B is used in the Y direction. Since the mold chips 2 arranged in the above are configured to be cut at a time, the time required for cutting the mold chips can be significantly shortened as compared with the conventional technique in which the wheel cutter is run line by line to cut the substrate. it can.

(C) In the invention according to claim 3, in the substrate cutting device according to claim 2, the width W of the blade tip portion E of each wheel cutter 3 constituting each of the rotary blade groups 7A and 7B is set to , The gap between the mold chips 2 is smaller than the gaps Sx and Sy in the X and Y directions, respectively, and is set to be more than half of the gaps Sx and Sy, and the rotary blade groups 7A and 7B and the substrate holder are cut. Since the cutting is performed while repeatedly moving relatively in the lateral direction intersecting the direction, the gaps Sx and Sy of the substrate 1 are removed from each wheel cutter 3.
It is possible to divide the cut portion 6 and the side surface thereof.

(D) Further, since the rotary blade groups 7A and 7B and the substrate holder are configured to perform cutting while relatively repeatedly moving in the lateral direction intersecting the cutting direction, the type of substrate is Since it is different, the above-mentioned XY direction gap Sx
Even when Sy is different, if the array pitches Px and Py of the mold chips 2 are the same, the wheel cutter 3 and the array pitch thereof are not changed, and the amount of repetitive horizontal movement of the substrate holder 5 is adjusted. , The cutting width can be adapted to the gaps Sx and Sy.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a wheel cutter and a substrate cutting device according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 (A) is an enlarged cross-sectional view of an essential part of a wheel cutter according to the present invention, FIG. 1 (B) is an enlarged cross-sectional view of an essential part of a wheel cutter according to the previously proposed example, FIG. 2 shows a wheel cutter, and FIG. 2A is a front view of the wheel cutter, FIG.
FIG. 3B is a vertical sectional side view of the wheel cutter, and FIG. 3 is a front view of a partially cut substrate cutting device.

The substrate cutting apparatus according to the present invention has the same basic structure as the previously proposed example. That is, as shown in FIG.
A first rotary blade group 7A and a second rotary blade group 7B configured to be coaxially rotatable are provided, and the mold chips 2 arrayed in the X direction are collectively cut by the first rotary blade group 7A, and then illustrated. Not rotate the substrate holder 90 ° and rotate the second rotary blade group 7
The mold chips 2 arranged in the Y direction at B are collectively cut. In addition, as the substrate holder, one that adsorbs and holds a UV filter to which a substrate is adhered, and FIG.
The one disclosed in can be applied.

In the first rotary blade group 7A, a plurality of (31) wheel cutters 3 aligned with the X-direction arrangement pitch Px of the mold chips 2 are mounted on the first cylindrical shaft 41 and fastened with fastening nuts 43. And the second rotary blade group 7B is
On the cylindrical shaft 42 of the mold chip 2 in the Y-direction array pitch Py
A plurality of (five) wheel cutters 3 aligned with each other are mounted and fastened with a fastening nut 43.
The first and second cylindrical shafts 42 are detachably fixed to one rotary drive shaft 40 via an intermediate taper flange 44a and both end taper flanges 44b, and are coaxially rotatably supported. Each wheel cutter 3 is composed of a diamond cutter as described later.

The gap between the outer diameter of each of the cylinder shafts 41 and 42 and the inner diameter of the shaft insertion hole 4 of each of the wheel cutters 3 is set to less than 50 μ, and the wheel cutter 3 is independently attached to each of the cylinder shafts 41 and 42. When it is mounted on the wheel cutter 3, the disk body 3A of each wheel cutter 3 is set to have a thickness P including spacers equivalent to the XY-direction array pitch Px · Py of the substrate. In FIG. 3, reference numeral 45 is a transmission pulley, and 46 is the first cylinder shaft 41 and the second cylinder shaft.
A fastening nut for fixing the cylindrical shaft 42 of the
Reference numerals 47 respectively indicate tailstock shafts.

As shown in FIGS. 1 (A), 2 (A) and 2 (B), each wheel cutter 3 constituting the rotary blade groups 7A and 7B has a shaft insertion hole 4 at the center of the disk body 3A. Disc body 3A set to thickness P while opening
A thick peripheral core metal part 3B is formed integrally with the peripheral peripheral metal core part 3B, and a pair of thin core metal parts 3C and 3C are projected from both ends in the thickness direction of the peripheral core metal part 3B so as to project from each core metal. Part 3C
The diamond abrasive 5 is sintered so as to cover 3C, and the cut portions 6 are formed.

This is intended to make a sharp cut at the cut point by the thin cut portion 6. That is, the cut portions 6 of the cutting edge portion E sharply divide the gaps Sx and Sy between the mold chips 2 arranged in XY on the substrate. As a result, the cut surface does not become a rough surface and the lead 2R exposed on the cut surface peels off or the lead 2R
It is possible to eliminate the inconvenience of causing burrs and the like.

The width (thickness) W of the cutting edge portion E is slightly smaller than the X-direction gap Sx and the Y-direction gap Sy of the mold chip 2, and is at least half the width of each gap Sx.Sy (for example, 2.0 mm to 3.0 mm).
The width T of each cut portion 6 is, for example, 0.2 mm to 0.
It is set to 3 mm, and the height H of the cut portion 6 is set to 0.5 mm to 0.7 mm, for example. The substrate holder (not shown) is configured to be able to perform cutting while repeatedly moving with respect to each of the rotary blade groups 7A and 7B in the lateral direction intersecting the cutting direction. This is intended to divide the gaps Sx and Sy between the mold chips 2 by the pair of cut portions 6 of each wheel cutter 3 and the outer surface thereof.

As a result, even when the gaps Sx and Sy in the XY directions are different because the types of substrates are different, if the arrangement pitches Px and Py of the mold chips 2 are the same, the wheel cutter 3 and the arrangement pitch thereof are changed. Instead, the cutting width can be adapted to the gaps Sx and Sy only by adjusting the amount of repetitive lateral movement of the substrate holder 5. By the way, in this embodiment, one reciprocating time in the lateral direction of the substrate holder (not shown) can be adjusted within the range of 0.5 seconds to 1.5 seconds. Thereby, the cutting speed of the substrate 1 can be set appropriately. The radius of this wheel cutter 3 is large, and its rotation speed is 2000r.
It is set to pm to 4000 rpm.

The present invention is not limited to the above-described embodiment, and it is possible to make design changes, for example, as follows, within the scope of not changing the gist of the present invention. In the above embodiment, the thick disc body 3A has the peripheral core metal portion 3B formed in a paragraph shape, but the disk body 3A and the peripheral core metal portion 3B have the same thickness W.
And the array pitch of the wheel cutters with the spacers interposed between them is the array pitch Px of the mold chips 2 on the substrate 1.
-It may be configured to be aligned with Py.

In the above-described embodiment, the width W of the cutting edge portion E of the wheel cutter 3 is set to 2.0 mm to 3.0 mm, the width T of each cutting portion 6 is set to 0.2 mm to 0.3 mm, and each cutting portion 6 is cut. Although the height H of the recessed portion 6 is set to about 0.5 mm to 0.7 mm, the values are appropriately changed according to the distance between the mold chips arranged on the substrate and the thickness of the substrate to be cut. It doesn't matter.

[Brief description of drawings]

FIG. 1 (A) is a vertical sectional view of a cutting edge of a wheel cutter according to the present invention, and FIG. 1 (B) is a vertical sectional view of a cutting edge of a wheel cutter according to a previously proposed example.

FIG. 2 shows a wheel cutter, FIG. 2 (A) is a front view of the wheel cutter, and FIG. 2 (B) is a longitudinal sectional view of the wheel cutter.

FIG. 3 is a front view of a substrate cutting device.

FIG. 4 is an enlarged sectional view of a main part of a wheel cutter according to a conventional example.

5 (A) is a perspective view of a cut mold chip, FIG. 5 (B) is an enlarged view of an essential part of a lead appearing on a cut surface of the mold chip, and FIG. 4 (C) is a view of the mold chip. It is a principal part enlarged view of the lead which appears on a bottom face.

FIG. 6 is a perspective view showing a cutting procedure of a substrate according to a conventional example.

[Explanation of symbols]

1 ... Substrate, 2 ... Molded chip, 3 ... Wheel cutter,
3A ... Disk body, 3B ... Perimeter core metal part, 3C ... Thin core metal part, 5 ... Diamond abrasive, 6 ... Notch part, 7A
... 1st rotary blade group, 7B ... 2nd rotary blade group, Px ... X-direction arrangement pitch of mold chips, Py ... Y of mold chips
Directional arrangement pitch, W ... Width of the edge of the wheel cutter, Sx
... Gap between mold chips in the X direction, Sy ... Gap between mold chips in the Y direction.

Claims (3)

(57) [Claims] 1. A wheel cutter comprising a disc body (3A) and a thick peripheral cored bar (3B) formed integrally therewith, and the peripheral cored bar (3B) covered with a diamond abrasive (5). A pair of thin cored bar portions (3C, 3C) are projected from both ends in the thickness direction of the peripheral cored bar portion (3B) in the outer peripheral direction thereof, and the cored bar portions (3C, 3C) are respectively attached to the diamond abrasive material. A wheel cutter characterized in that a notch portion (6.6) is formed by being covered with (5). 2. A mold chip (3) comprising a plurality of wheel cutters (3) according to claim 1, wherein the substrate (1) held by a substrate holder is cut to be arranged on the substrate (1) in XY directions. 2)
A device for cutting a substrate for separating the mold chips, wherein the mold chip (2) has an arrangement pitch (Px) in the X direction.
A first rotary blade group (7A) having a plurality of wheel cutters (3) aligned with each other, and Y of the mold tip (2).
The second rotary blade group (7B) having a plurality of wheel cutters (3) aligned with the direction array pitch (Py) is configured to be coaxially rotatable, and the first rotary blade group (7A) is arrayed in the X direction. After collectively cutting the formed mold chips (2), the substrate holder is turned by 90 ° and the mold chips (2) arranged in the Y direction by the second rotary blade group (7B) are collectively cut. A substrate cutting device characterized by the above. 3. The substrate cutting device according to claim 2, wherein the width (W) of the cutting edge of each wheel cutter (3) constituting each of the rotary blade groups (7A, 7B) is set to the mold chip (2).
The gaps are smaller than the gaps (Sx / Sy) in the X and Y directions, respectively, and are set to half or more of the gaps (Sx / Sy), and the rotary blade groups (7A and 7B) and the substrate holder are A substrate cutting device, which is configured to perform cutting while being repeatedly moved in a lateral direction intersecting the cutting direction.