JP3385351B2 - Heat exchange component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

[Object of the Invention]

BACKGROUND OF THE INVENTION The present invention relates to a large scale integrated circuit (LS).
The present invention relates to a metallic heat exchange component for promoting heat dissipation such as I) and an inverter, and a method for manufacturing the same.

[0002]

BACKGROUND OF THE INVENTION As a heat exchange component for an electronic component such as an integrated circuit, there is one in which a large number of pin-shaped protrusions are formed on a metal substrate portion, and these protrusions are intended to increase the heat radiation action area. ing. By the way, as a manufacturing method of this type of heat exchange component, there are methods such as integral molding by plastic working, integral molding by molding, further molding the substrate part and the pin-shaped projections separately, and then assembling these two. Is generally present. And among these manufacturing methods, the manufacturing method with the highest product precision and production efficiency is
Generally, it is integrally formed by plastic working.

However, forming a large number of pin-shaped projections on the substrate portion by plastic working has the following problems. That is, during plastic forming, the resistance received from the starting material is strong, and the number and length of the pin-shaped protrusions formed on a unit area are limited, and there is the problem that the heat dissipation area cannot be further increased. It was And this means that the heat exchange rate of the heat exchange component is limited to a certain value. Also, the mold release after plastic molding has strong resistance of the contact surface between the pin mold and the molded product material,
There was also a problem that it was extremely difficult to remove.

These problems result from the conventional method of forming a pin-shaped projection and a closed-type molding method in which the tip of the pin-shaped projection is brought into contact with each other. That is, according to this method, the lengths of the pin-shaped projections are made uniform at the end of molding.
However, due to the volume error of the starting material, the hardness of the material, the manufacturing error of the mold, and the non-uniformity of the lubricating film for molding, the pin-shaped projection may be molded quickly or slowly. There is a difference in the molding speed such as pin-shaped protrusions.
For this reason, a large molding pressure is required to bring all pin-shaped projections into close contact with the molding die, and unnecessarily fills and adheres to pin-shaped projections other than the pin-shaped projections formed late in this way. The act made it difficult to remove the product from the mold.

Therefore, in such a closed mold forming method, the load of the forming mold is extremely large, and as a result, there is a limit to the precision of plastic forming, and it is not possible to form a hollow pin-shaped projection. Not only that, when trying to mold a fine delicate pin-shaped projection, the life of the mold member may be shortened, the mold member may be damaged, and the pin-shaped projection that is molded quickly may break. There was. Further, it is extremely difficult to form the pin-shaped projection having a complicated cross-sectional shape for the above reason.

[0006]

[Technical Items Attempted to Develop] The present invention has been made from such a background, and has a large number of pin-shaped projections per unit area integrally formed by plastic working, resulting in a large heat radiation action area and heat exchange. When exchanging a large number of pin-shaped projections on the substrate part by heat exchanging parts with excellent efficiency and plastic working, it is possible to do with a low load, and it is possible to tolerate volume errors of the starting material and manufacturing errors of the molding die, An attempt was made to develop a method of manufacturing a heat exchange component that can form a larger number of longer pin-shaped protrusions per unit area without breaking the pin-shaped protrusions during molding, shortening the life of the mold member or damaging them. It is a thing.

[0007]

[Constitution of the invention]

OBJECTS means of achieving That heat exchanger component according to claim 1, wherein the a large number of pins of Shin'ana mold to fitted to retentive in retained metal block shape of the starting material, the pin mold When pressed and compressed, the pin forming die has a narrowed portion and a deeper portion of the narrowed portion in the pin forming die, the hole diameter is larger than that of the narrowed portion, and the tip of the pin-shaped projection abuts at the end of molding. Do not use a molding hole having a large number of expansion holes with an extra space, narrow down a part of the starting material into the molding hole, and contact only the molding start side with the pin of the core hole molding die. The present invention is characterized in that a large number of pin-shaped projections having a core hole are formed on the surface of the substrate portion.

Further, in the heat exchange component according to claim 2 , in addition to the requirement of claim 1 , the surface area of the pin-shaped protrusion is
It is characterized by being 35 times or more the area of the surface of the substrate portion on which the pin-shaped projections are formed.

Furthermore, the method of manufacturing a heat exchange component according to claim 3 has a core hole forming die having a large number of pins on its surface and a large number of pin holes into which the pins are inserted, and the core hole forming die is slid. A holding die having an extrusion die that is movably inserted, a throttle portion, which is opposed to the extrusion die, is located behind the throttle portion, has a larger hole diameter than the throttle portion, and has a pin-shaped projection at the end of molding. Using a pin forming die having a large number of forming holes each having an expanded portion having an extra space where the tip does not contact, a metal having a large number of through holes with respect to an extrusion die fitted to a pin of a core hole forming die. A block-shaped starting material made of is placed while inserting the pin into the through hole, then the pin forming die is pressed against the starting material and compressed, and a part of the starting material is squeezed into the forming hole, Formed by contacting only the molding start side by the pin of the core hole molding die A pin-shaped projection with a core hole is formed on the surface of the board to obtain a product material, and then the pin mold is released from the product material while holding the board, and then the board is held. It is characterized by releasing and taking out the product material.

Further, in the method for manufacturing a heat exchange component according to a fourth aspect, in addition to the requirements of the third aspect , the holding die is a holding die having a holding recess, and the holding die slides in the holding die. An extrusion die that pushes out the product material by pressing the pin-shaped protrusion into the holding recess at the same time when the pin-shaped projection is formed, and a chucking state is obtained at the same time. It is characterized by preventing the stopper and releasing the retaining state when pushing out the product material.

Furthermore, the heat exchange component manufacturing method according to a fifth aspect is characterized in that, in addition to the requirements of the fourth aspect , the holding concave portion has a reverse taper shape in a take-out direction of a product material. is there. The above objects are intended to be achieved by these inventions.

[0012]

SUMMARY OF THE INVENTION According to the heat exchanger component according to claim 1, wherein the pin-like projection has a Shin'ana, applied the inner area within Shin'ana outside the area of the pin-like projection, is very heat radiation action area large. Then, for example, by flowing a fluid in the core hole, the heat exchange rate can be further increased as compared with natural heat dissipation.

According to the heat exchange component of the second aspect, the surface area of the pin-shaped projections is 35 times or more the area of the surface of the substrate portion on which the pin-shaped projections are formed, so that the heat exchange rate is very good. , Dissipate the heat of electronic parts quickly. Therefore, the electronic parts are less likely to malfunction.

Further, according to the method of manufacturing a heat exchange component of claim 3 , only the narrowed portion in the molding hole is the starting material or product.
Materials and intermediate materials from starting materials to product materials
Wood (hereinafter, unless otherwise specified, these are generic names
And the expanded part does not touch.
Therefore, the resistance received from the metal material when the pin-shaped projection is formed
Is much less than conventional plastic working. Therefore, the substrate
Elaborate pin-shaped protrusions such as thin and complicated cross-section
It is also possible to plastically mold a large number of per unit area.
In addition, since there are few contact areas, the pin-shaped die will have a pin-like shape when released.
There is no chance of breaking the protrusion. Also pin mold
The tip of the pin-shaped projection does not come into contact with the molding hole at the end of molding
Since there is an extra space, the load on the mold is even smaller.
The life of the mold member is extremely short,
It may be damaged or the pin-shaped protrusion that is molded quickly may break.
There is no chance that it will end up. In addition, the conventional closed-type method
Large molding force due to the pin-shaped protrusions being molded slowly
Pins other than pin-shaped protrusions that do not require pressure and are molded slowly
The protrusions were not filled and adhered unnecessarily.
Therefore, the releasing force from the pin mold and the holding mold is extremely
Can be small. In addition, the volume error of the starting material, material hardness,
Manufacturing error of pin mold and uneven lubrication film for molding
Etc. are less problematic than before. So for example the starting material
Manufacturing process to make the volume accuracy of
Pin-shaped protrusions can be formed on various starting materials.
I will grow tired. Also, when the extrusion die is molded, the starting material and
Acts as a mold to support the intermediate material, and molding
After processing, the product material is taken out from the mold
Minimal time and effort required for molding, and very good production efficiency. Also above
In addition to the above action, since the core hole forming die having a large number of pins on the surface is used, the pin-shaped projection having the core hole can be formed by one plastic process. Therefore, the molded product material has a very large heat dissipation area because the inner area of the core hole is added to the outer area of the pin-shaped projection. Further, when the core hole is formed by the pin of the core hole forming die, the pin contacts only the forming start side of the core hole, so that the resistance during processing is very small.

According to the method for manufacturing a heat exchange component of claim 4, it is not necessary to separately provide a chucking device or the like because the chucking state is obtained by utilizing the compressive force at the time of molding. Since the pin forming die is released while the formed product material is chucked by the holding recess of the gripping die, the product material does not stick to the pin forming die and be lifted. Then, since the product material is easily taken out from the mold member by extruding with the extrusion mold after releasing the pin mold, the whole manufacturing process is very simple and the production efficiency is further improved.

[0016] According to the manufacturing method of the heat exchange component according to claim 5, wherein, for holding recess are opposite tapering outlet direction of the product material, sites outlet direction of the product material was pressed into the holding recess during molding It becomes a taper shape. Therefore, the product material is smoothly taken out from the holding recess,
The product material will not be damaged and the gripping mold will not be damaged.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A heat exchange component and a method for manufacturing the same according to the present invention will be described below with reference to the illustrated embodiments. In the description, first, the heat exchange component 1 of the present invention and the mold member for manufacturing the same will be described, and then the working state of the mold member with respect to the metallic starting material W ₀ will be described. A method of manufacturing the replacement part will be described. In the present invention, the metal material in a state in which the mold member has not been processed at all is the starting material W ₀ , and the material being processed is the intermediate material W ₀ .
_{1. The} material that has been processed and is still held by the die member is defined as the product material W ₂ , and all of them are collectively referred to as the metal material W unless otherwise explained. Further, the product material W ₂ is taken out from the mold member, and the pin-shaped projection 3
The heat exchange component 1 of the present invention is obtained by trimming the upper ends of the above and subjecting the whole to a surface treatment such as alumite or plating.

First, FIG. 1 shows a usage state of the first embodiment of the heat exchange component 1 of the present invention, in which the electronic component E, which generates a large amount of heat, is supported by the substrate portion 2 and is placed on the wiring substrate B. Is attached to. Thus, the heat exchange component 1 supports the electronic component E to radiate the heat generated from the electronic component E to cool the electronic component E.

The heat exchange component 1 will be described in detail. As an example, 121 pin-shaped projections 3 are formed on the cylindrical substrate portion 2.
Is formed so that it rises almost vertically. As shown in the plan view of FIG. 3 , the pin-shaped projections 3 have fins 3a radially arranged on the periphery of the cylindrical main body.
Are formed. Further, a hole penetrating the substrate portion 2 from the pin-shaped projection 3 in the longitudinal direction is defined as a core hole 3b. The heat exchange component 1 can be used not only by natural heat dissipation but also by actively flowing heat through the core hole 3b to cool it as is well known in the art. By the way, this heat exchange component 1 is made of aluminum,
Numerical data below will be shown. First, the pin-shaped projections 3 of the substrate 2
The area of the surface on which is formed is 390.94 mm ² . On the other hand, there are 121 pin-shaped projections 3, the outer peripheral side area is 98268.94 mm ² , and the inner peripheral side area in the core hole 3b is 3.
8601.9 mm ² , the tip area is 738.1 mm ² , and the total surface area is 137608.94 mm ² . Therefore, the surface area of the pin-shaped protrusion 3 is 35.22 times the area of the surface of the substrate portion 2 on which the pin-shaped protrusion 3 is formed.

The heat exchange component 1 has the pin-shaped projections 3 as described above.
However, the surface area of the pin-shaped projection 3 is very large because it has a thin and long core hole 3b and fins 3a as described above and a large number per unit area. Therefore, the supported electronic component E is very excellent in heat dissipation. The substrate 2 may have a rectangular shape, a circular shape, a polygonal shape, or any other various shape, and may have a flat plate shape, a bent shape, or any other suitable three-dimensional shape. Further, the pin-shaped projection 3 may be formed in an appropriate shape such as a prismatic shape as well as a cylindrical shape.

Next, a mold member for manufacturing the heat exchange component 1 will be described. As shown in FIG. 5 (a), this is a pin forming die 4 and a holding die 6 for holding the metal material W.
And a core hole forming die 9 for forming the core hole 3b of the pin-shaped projection 3. Reference numeral D is a base, on which the holding die 6 is held and the core hole forming die 9 is fixedly installed.

Next, the pin forming die 4 will be described. pin
The molding die 4 has a large number of molding holes 11 formed in the molding portion 10.
Become. As shown in the enlarged view of FIG.
The side that first contacts the material W ₀ (downward in FIG. 4) is
A cylindrical throttle portion 11A for setting the diameter of the projection 3
Has become. Then, behind the throttle 11A (see FIG. 4)
(Above) is an expanded portion having a larger hole diameter than the narrowed portion 11A.
It is 11B. Specific shape of the narrowed portion 11A
Has a shape having six concave portions corresponding to forming the fin 3a around the circular hole . The diaphragm part
The shape of 11A is the heat exchange component 1 illustrated in this embodiment.
It was made into a circle according to the shape of the pin-shaped projection 3 of
Various modifications depending on the shape of the pin-shaped projection 3
Is.

Next, the holding mold 6 will be described. This is composed of a holding die 7 and an extrusion die 8. The gripping type 7 is for processing
Also, when the pin forming die 4 after processing is released from the metal material W,
Is held so as to be chucked in
Has a holding recess 7a that is notched in a reverse taper shape as
It An appropriate shape is selected as the shape of the holding recess 7a.
It can be done, for example, the cross section was cut out in a semicircular shape
It may have a shape. In addition, the extrusion die 8 is inside the gripping die 7.
Is slidable, and the lower surface of the metal material W is
Supports and holds the metal material W after processing
It is pushed out from 7. Specifically, the extrusion die 8 includes a mounting table 21 on which the metal material W is mounted, an extruding plate 22 appropriately fixed to a cylinder, and a connecting rod 23 connecting the mounting table 21 and the extruding plate 22. Made of The mounting table 21 has a large number of pin holes 21a, and receives pins 9B of a core hole molding die 9 described later therein.

Next, the core hole molding die 9 will be described. This is made up of a large number of pins 9B provided on a plate-shaped pin base 9A, and the pin base 9A is fixedly provided on a base D. The pins 9B are pin holes 21a of the mounting base 21 of the extrusion die 8. Inserted in.

The mold member has the structure as described above, and the operation state for manufacturing the heat exchange component 1 by the mold member will be described below, together with the method for manufacturing the heat exchange component of the present invention. To do. (I) forming before starting (starting material W ₀₎ First, as shown in FIG. 5 (a), the mold member has a mounting table 21 of the extrusion die 8 fitted to a pin 9B of Shin'ana mold 9 pin stands 9A
It is placed on top. The starting material W ₀ having a large number of through holes W ₀ a, placed on the core holes through the pin 9B of the mold 9 hole W ₀ fitted inserted in a mounting table 21. At this time, the pin 9B of the core hole molding die 9 is slightly projected from the upper end of the starting material W ₀ .

[0026] (ii) by pressing a molding start time (starting material W ₀ → intermediate material W ₁₎ and the pin mold 4 in the starting material W ₀ as shown in FIG. 5 (b), the compression of the starting material W ₀ To do. Then, the starting material W ₀ is deformed so that a part thereof is drawn into the forming hole 11 of the pin forming die 4, and the outer surface of the pin-shaped projection 3 is formed by the drawing portion 11A. In addition to this, the through hole W ₀ a of the starting material W ₀ is formed by the pin 9B of the core hole forming die 9.
Figure 5 but is formed core hole 3b so as to extend it
The intermediate material W ₁ as shown in (b) is formed.

(Iii) In the middle of molding (intermediate material W ₁ → product material W ₂ ), and further, the intermediate material W ₁ includes the drawn portion 11 A and the pin 9 B.
Will pin-like projection 3 is formed by, it will be formed into the product material W ₂ as shown in FIG. 5 (c). In addition, the diaphragm part 1
An expanded portion 11B is formed above 1A, and the pin-shaped projection 3 is formed.
Since they do not come into contact with each other as they are formed above, there is little resistance during processing. Further, since the pin 9B of the core hole molding die 9 does not contact the core hole 3b formed so as to extend upward,
Also in this respect, the resistance during processing is small. Further, the molding speed of each pin-shaped projection 3 is slightly different due to the volume error of the starting material W ₀ , the material hardness, the manufacturing error of the pin molding die 4 and the like, the unevenness of the lubricating film for molding, and the like. . However, since there is an extra space above the expanded portion 11B that does not come into contact with the tips of the pin-shaped protrusions 3, the difference in speed at which these pin-shaped protrusions 3 are formed is allowed. By allowing the difference in the molding speed of the pin-shaped protrusions 3, it is possible to prevent the mold member from being damaged, the life of the mold member being shortened, and the pin-shaped protrusions 3 being molded quickly being broken. On the other hand, by being pressed by the pin forming die 4, a part of the lower part of the intermediate material W ₁ is also moved so as to be pushed out to the holding recess 7a of the holding die 7, and the product material W ₂ and the holding die 7 are moved. The chucking state of will be obtained. Note that the pin forming die 4 is pressed by the tip of any one of the many pin-shaped projections 3 at the expanded portion 11B of the pin forming die 4.
The range that does not contact the innermost part of the.

(Iv) At the end of molding (product material W ₂ ) and when the pin-shaped projections 3 are formed as described above,
Pins mold 4 is released lifted upward as shown in FIG. 5 (d). The substrate portion 2 of the product material W ₂ molded at this time
Is held in a chucking state by the gripping die 7, so that it is not held by the pin forming die 4 and lifted upward. Further, the pin molding die 4 is in contact with the pin-shaped projection 3 only at the narrowed portion 11A,
Since the pin 9B of the core hole molding die 9 is in contact with the core hole 3b only at the lower end, the pin molding die 4 can be released very smoothly with less resistance.

[0029] (v) after completion of molding (product material W ₂ → heat exchange part 1) Then, as shown in FIG. 5 (e), the molded product material W
₂ is taken out by extruding ₂ with an extrusion die 8. Incidentally, since the holding recess 7a has an inversely tapered shape, the product material W ₂ can be taken out relatively smoothly as described in the first embodiment. Then, the product material W ₂ thus taken out is properly cut at the upper ends of the pin-shaped projections 3 and the whole surface is subjected to a surface treatment such as alumite or plating to obtain the heat exchange component 1.

[0030]

According to the heat exchange component of the first aspect , the pin-shaped projection 3 has the core hole 3b, and the inner area of the core hole 3b is added to the outer area of the pin-shaped projection 3, which is extremely advantageous. Large heat dissipation area. Then, for example, by flowing a fluid in the core hole 3b, the heat exchange rate can be further increased as compared with the natural heat dissipation.

Further, according to the heat exchange component of claim 2 ,
Since the surface area of the pin-shaped projection 3 is 35 times or more the area of the surface of the substrate portion 2 on which the pin-shaped projection 3 is formed, the heat exchange rate is very good, and the heat possessed by the electronic component E is quickly radiated. To do. Therefore, the electronic parts E are less likely to malfunction.

Furthermore, according to the method for manufacturing a heat exchange component of claim 3, only the narrowed portion 11A in the molding hole 11 is formed.
Contacting the starting material W ₀ , the intermediate material W ₁ , and the product material W ₂ ,
When the pin-shaped projection 3 is formed, the expanded portion 11B does not contact.
Compared with conventional plastic working, the load received from metal material W is
Very few. Therefore, it is thinner than the substrate part 2 and has a double cross section.
There are many elaborate pin-shaped protrusions 3 per unit area
Several can be plastically molded. There are few contact areas
Therefore, do not fold the pin-shaped protrusion 3 when releasing the pin mold 4.
There is no such thing. In addition, the molding hole 11 of the pin molding die 4
Is a surplus screw that the tip of the pin-shaped projection 3 does not contact at the end of molding.
Since it has a pace, the load on the mold member is even smaller,
The life of the parts becomes extremely short, or the mold parts are damaged.
Or, the pin-shaped projection 3 that is molded quickly breaks
There is no such thing as waiting. Also like the traditional closed-type method
Large molding pressure due to the pin-shaped projection 3 which is molded slowly
Pins other than the pin-shaped projection 3 that is formed slowly without requiring
The protrusions 3 are not unnecessarily filled and closely attached.
Therefore, the releasing force from the pin forming die 4 and the holding die 6 is extremely high.
Can be small. Also, the volume error and material hardness of the starting material W ₀ ,
In addition, the manufacturing error of the pin mold 4 and the lubrication film for molding
Non-uniformity is less problematic than before. So for example
Simplify the manufacturing process to make the volume accuracy of the material W ₀ accurate
It is possible, and also pin-shaped protrusions on various starting materials W ₀
It also allows the rise 3 to be molded. In addition, the extrusion die 8
Mold for supporting starting material W ₀ and intermediate material W ₁ during construction
Acts as a product material after completion of molding
Since W ₂ is taken out from the mold member, there is little labor at the time of mold release.
And production efficiency is very good. In addition to the above effects,
Since the core hole forming die 9 having a large number of pins 9B on its surface is used, the pin-shaped projection 3 having the core hole 3b can be formed by a single plasticizing step. Therefore, the molded product material W ₂ has a very large heat dissipation area because the inner area of the core hole 3b is added to the outer area of the pin-shaped projection 3. Further, when the core hole 3b is molded by the pin 9B of the core hole molding die 9, the pin 9B contacts only the molding start side of the core hole 3b, so that the resistance during processing is very small.

Furthermore, according to the method for manufacturing a heat exchange component of claim 4 , there is no need to separately provide a chucking device or the like because the chucking state is obtained by utilizing the compressive force during the molding process. Then, the molded product material W ₂ is a gripping mold 7.
In a state in which the chucked by the holding recess 7a, for releasing the pin mold 4, the pin mold product material W ₂ 4
There is no such thing as sticking to and lifting. Since the product material W ₂ is easily taken out from the die member by extruding it with the extrusion die 8 after releasing the pin forming die 4, the whole manufacturing process is very simple and the production efficiency is further improved.

Furthermore, according to the method of manufacturing a heat exchange component of claim 5 , since the holding recess 7a has a reverse taper shape,
The portion of the product material W ₂ pushed into the holding recess 7a during molding is tapered in the take-out direction. Therefore, product material W ₂
Are smoothly taken out from the holding recess 7a, and the product material W ₂ and the gripping die 7 are not damaged during this taking out.

[Brief description of drawings]

FIG. 1 is a perspective view showing a usage state of a heat exchange component.

FIG. 2 is a perspective view showing a heat exchange component.

FIG. 3 is a plan view of a pin-shaped protrusion.

FIG. 4 is a perspective view showing a molding hole in an enlarged manner and partially broken.
It

FIG. 5 is an explanatory view showing a method of manufacturing a heat exchange component step by step.
is there.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 heat exchange component 2 board part 3 pin-shaped projection 3a fin 3b core hole 4 pin molding die 6 holding die 7 gripping die 7a holding recess 8 extrusion die 9 core hole molding die 9A pin base 9B pin 10 molding portion 11 molding hole 11A Drawing portion 11B Expanding portion 21 Mounting table 21a Pin hole 22 Extrusion plate 23 Connecting rod B Wiring board D Base E Electronic component W Metal material W ₀ Starting material W ₀ a Through hole W ₁ Intermediate material W ₂ Product material

Claims (5)

(57) [Claims] 1. A metal block-shaped starting material, which is inserted into a large number of pins of a core hole forming die and held in a holding die,
The pin forming die is pressed and compressed, and in this compression, the pin forming die has a narrowed portion and a deeper portion of this narrowed portion, and has a larger hole diameter than this narrowed portion, and has a pin-shaped projection at the end of molding. Using a number of forming holes consisting of an expanded part with an extra space where the tip does not contact, narrow down part of the starting material into the forming hole and start forming with the pin of the core hole forming die A heat exchange component, characterized in that a large number of pin-shaped projections having a core hole formed by being contacted only on the side are formed on the surface of the substrate portion. Wherein the surface area of the pin-like projections, the heat exchanging component according to claim 1, wherein the pin-like projection is not less than 35 times the area of the surface of the substrate portion which is formed. 3. A core hole forming die having a large number of pins on its surface, and a holding die having a large number of pin holes into which the pins are inserted and having an extrusion die slidably inserted into the core hole forming die. A converging portion, which faces the extrusion die, and an expanding portion which is deeper in the constricting portion and has a larger hole diameter than the constricting portion, and which has an extra space with which the tip of the pin-shaped projection does not come into contact at the end of molding. And a pin forming die having a large number of forming holes made of a metal block-shaped starting material having a large number of through holes for the extrusion die fitted to the pin of the core hole forming die. The pin forming die is pressed against the starting material to compress it, a part of the starting material is narrowed down into the forming hole, and only the forming start side is contacted by the pin of the core hole forming die. A large number of pin-shaped protrusions with formed core holes on the surface of the substrate Molded into product material, then
A method for manufacturing a heat exchange component, comprising: removing a pin mold from a product material while holding the board part, and then releasing the holding part of the board part to take out the product material. 4. The holding die comprises a holding die having a holding recess and an extruding die that slides in the holding die to push out a product material. A chucking state is obtained at the same time by pushing the portion into the holding concave portion, preventing the pin mold from coming off when the product material is released from the product material, and releasing the product at the time of taking out the product material material and pushing it out. Item 3. A method for manufacturing a heat exchange component according to Item 3 . 5. The method for manufacturing a heat exchange component according to claim 4, wherein the holding recess has an inversely tapered shape in the take-out direction of the product material.