JP3386743B2 - Method of manufacturing electromagnetic wave shielding adhesive film for PDP and method of manufacturing electromagnetic wave shielding structure and plasma display for PDP - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a PDP (plasma display).
Display panel) , an electromagnetic wave shielding adhesive film having a property of shielding electromagnetic waves generated from the front surface of the display, an electromagnetic wave shielding structure, and a method for manufacturing the display.

[0002]

2. Description of the Related Art With the recent increase in the use of various electric equipments and electronic equipments, electromagnetic noise interference is also increasing. Noise is roughly divided into conducted noise and radiated noise.
There is a method of using a noise filter or the like. On the other hand, as a measure against radiated noise, it is necessary to electromagnetically insulate the space, so the housing is made of a metal body or a highly conductive body, a metal plate is inserted between the circuit boards, or a cable is used. The method such as wrapping with a metal foil is taken. These methods can be expected to have an electromagnetic wave shielding effect for circuits and power supply blocks, but they cannot be applied to electromagnetic wave shielding applications such as CRTs and PDPs that are generated from the front surface of a display because they are opaque.

As a method for achieving both electromagnetic wave shielding property and transparency, a method of depositing a metal or a metal oxide on a transparent substrate to form a thin film conductive layer (Japanese Patent Laid-Open No. 1-278080).
No. 0, and Japanese Patent Laid-Open No. 5-323101) are proposed. On the other hand, an electromagnetic wave shielding material in which a good conductive fiber is embedded in a transparent substrate (Japanese Patent Laid-Open No. 5-327274,
(See JP-A-5-269912) or an electromagnetic wave shield material obtained by directly printing a conductive resin containing metal powder or the like on a transparent substrate (JP-A-62-57297, JP-A-2-5).
2499), and further, an electromagnetic wave shielding material in which a transparent resin layer is formed on a transparent substrate such as polycarbonate having a thickness of about 2 mm, and a copper mesh pattern is formed on the transparent resin layer by the electroless plating method. 5-2838
No. 89) is proposed.

[0004]

As a method for achieving both electromagnetic wave shielding properties and transparency, JP-A-1-278800 has been proposed.
Japanese Patent Laid-Open No. 5-323101 discloses a method of forming a thin film conductive layer by depositing a metal or a metal oxide on a transparent substrate. If it is 100 Å to 2,000 Å), the surface resistance of the conductive layer becomes too large, so 20 dB against the shielding effect of 30 dB or more required at 30 MHz to 1 GHz.
It was insufficient as below. In the case of an electromagnetic wave shielding material (Japanese Unexamined Patent Publication No. 5-327274, Japanese Unexamined Patent Publication No. 5-269912) in which good conductive fibers are embedded in a transparent substrate, 30 MHz is used.
The electromagnetic wave shielding effect at 1 GHz is sufficiently large at 40 to 50 dB, but the fiber diameter necessary for regularly arranging the conductive fibers so as to prevent electromagnetic wave leakage is too thick as 35 μm, so the fibers are visible (hereinafter visible It was not suitable for display applications. In addition, JP-A-6
In the case of the electromagnetic wave shielding material in which a conductive resin containing a metal powder or the like is directly printed on a transparent substrate as disclosed in JP-A-2-57297 and JP-A-2-52499, similarly, the line width is around 100 μm due to the limit of printing accuracy. Therefore, it is not suitable because the visibility is expressed. Furthermore, JP-A-5-28
No. 3889 discloses a shield material in which a transparent resin layer having a thickness of about 2 mm such as polycarbonate is formed on a transparent substrate and a copper mesh pattern is formed on the transparent resin layer by electroless plating. In order to secure the force, it is necessary to roughen the surface of the transparent substrate. As the roughening means, generally, a highly toxic oxidizing agent such as chromic acid or permanganic acid must be used.
With resins other than BS, it becomes difficult to perform satisfactory roughening. Even if the electromagnetic wave shielding property and the transparency can be achieved by this method, it is difficult to reduce the thickness of the transparent substrate and it is not suitable as a film forming method. Furthermore, if the transparent substrate is thick, it cannot be closely attached to the display, and electromagnetic waves leak from there. Further, in terms of manufacturing, there is a drawback that the shield material cannot be made into a scroll or the like and thus becomes bulky, and that it is not suitable for automation, resulting in high manufacturing cost. Regarding the shielding property of electromagnetic waves generated from the front surface of the display, in addition to the electromagnetic wave shielding function of 30 dB or more at 30 MHz to 1 GHz, the infrared rays of 900 to 1, 100 nm generated from the front surface of the display can be used by other VTR devices operated by remote control. This has an adverse effect and must be shielded. In addition to the good visible light transmittance and the high visible light transmittance, it is necessary to visually confirm the presence of a shield material and the adhesiveness that is closely attached to the display surface to prevent electromagnetic wave leakage. Non-visibility, which is a characteristic that cannot be achieved, is also required. Regarding adhesiveness, it is necessary to easily adhere to glass or a general-purpose polymer plate at a relatively low temperature and have good adhesiveness for a long period of time. However, until now, a satisfactory adhesive film has not been obtained as an adhesive film that sufficiently satisfies the properties of electromagnetic wave shielding property, infrared ray shielding property, transparency / non-visibility and adhesiveness. The present invention provides an electromagnetic wave shielding adhesive film having electromagnetic wave shielding properties, transparency, non-visibility and good adhesive properties, a method for producing the same, and an electromagnetic wave shielding composition and a method for producing a display using the electromagnetic wave shielding adhesive film. It is provided.

[0005]

The present invention SUMMARY OF] is about <br/> the following. ( 1) Flow on a transparent film by heating or pressurizing.
Conductive metal whose surface is roughened through a moving adhesive layer
Laminating a foil, to the conductive metal foil, the micro-lithographic processes, etching processes, a conductive metal foil to form an etching resist pattern having a geometric shape by using a screen printing method or a gravure offset printing method forming a geometric figure composed of a conductive metal by, then preparation of the electromagnetic wave shielding adhesive film for PDP, which comprises the step of clearing under pressure. (2) It is characterized in that the thickness of the adhesive layer that flows by heating or pressurization is not less than the thickness of the conductive metal (1)
The method for producing an electromagnetic wave shielding adhesive film for PDP as described in 1. (3) The conductive metal is copper, and at least the surface thereof is blackened (1) or (2)
The electromagnetic wave shielding adhesive film for PDP as described in 1. (4) The method for producing an electromagnetic wave shielding adhesive film for PDP according to (1) or (2), wherein the conductive metal is a paramagnetic metal. (5) The method for producing an electromagnetic wave shielding adhesive film for PDP according to any one of (1) to (3), wherein a peelable protective film is laminated on the side opposite to the transparent substrate simultaneously with or after the pressurization. (6) After carrying out the method for producing an electromagnetic wave shielding adhesive film for PDP according to any one of (1) to (4), the obtained electromagnetic wave shielding adhesive film and a plastic plate are bonded together. A method of manufacturing an electromagnetic wave shielding structure for a PDP, comprising: (7) After carrying out the method for producing an electromagnetic wave shielding adhesive film for PDP as described in (5), peeling off the protective film of the obtained electromagnetic wave shielding adhesive film, or after peeling, a plastic plate is attached. Characterized by
Manufacturing method of electromagnetic wave shielding structure for PDP . (8) After carrying out the method for producing an electromagnetic wave shielding adhesive film for PDP according to any one of (1) to (4), the obtained electromagnetic wave shielding adhesive film is attached to a display surface. A method for manufacturing a plasma display, which is characterized by the above. (9) After carrying out the method for producing an electromagnetic wave shielding adhesive film for PDP as described in (5), the protective film of the obtained electromagnetic wave shielding adhesive film is peeled while or after being peeled off, and then bonded to the display surface. A method for manufacturing a plasma display, which is characterized by the above. As a result of the above,
Ming is associated with the following technologies: (A) An adhesive layer is laminated on a transparent substrate,
PD in which a conductive layer of geometrical figures is embedded in the adhesive layer of
Electromagnetic wave shielding adhesive film for P. (B) Adhesives that flow when heated or pressed
And its softening temperature is 200 ° C. or less, as described in (a)
Electromagnetic wave shielding adhesive film for PDP. (C) The refractive index of the adhesive is in the range of 1.40 to 1.70
The electromagnetic wave shield for PDP according to (a) or (b)
Adhesive film. (D) The conductive layer of the geometrical figure of the adhesive layer is embedded
The thickness of the non-existing portion is equal to or larger than the thickness of the conductive layer (a) ~
The electromagnetic wave shield contact for PDP according to any one of (c)
Wearing film. (E) The aperture ratio of the geometric pattern of the conductive layer is 50% or more.
The electromagnetic wave shield for PDP according to any one of (a) to (d)
Shielding adhesive film. (F) The line width of the conductive layer of the geometric figure is 40 μm or less.
Bottom, line spacing is 100 μm or more, line thickness is 40 μm
The PDP according to any one of (a) to (e), which is m or less.
Electromagnetic wave shielding adhesive film. (G) Further peelable on the surface opposite to the transparent substrate
Any of (a) to (f) in which protective films are laminated
An electromagnetic wave shielding adhesive film for PDP as described in Crab .

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The transparent base material used in the present invention may be a plastic plate, a glass plate or the like, but a flexible one is preferable, and for example, a plastic film is preferably used. Examples of the plastic film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate, polyolefins such as polyethylene, polypropylene, polystyrene and EVA, vinyl resins such as polyvinyl chloride and polyvinylidene chloride, polysulfone and polyethersulfone. , Plastics such as polycarbonate, polyamide, polyimide and acrylic resin. The transparent substrate preferably has a total visible light transmittance of 70% or more and a thickness of 1 mm or less. The transparent substrate may be used as a single layer, but may be used as a multilayer body by combining two or more layers. Among the plastic films, a polyethylene terephthalate film or a polycarbonate film is preferable from the viewpoints of transparency, heat resistance, handleability, and price. The thickness of the transparent substrate, particularly the thickness of the plastic film, is preferably 5 to 500 μm. If it is less than 5 μm, the handleability tends to deteriorate, and if it exceeds 500 μm, the visible light transmittance tends to decrease. The thickness of the transparent substrate, especially the thickness of the plastic film, is 1
It is more preferable that the thickness is 0 to 200 μm.

The refractive index of the adhesive used in the present invention is 1.40.
It is preferable to use those of 1.70 to 1.70. This is because the difference between the refractive index of the transparent base material such as the plastic film used in the present invention and the refractive index of the adhesive is made small to prevent the visible light transmittance from decreasing. .4
When it is 0 to 1.70, the decrease in visible light transmittance is small and good.

The adhesive used in the present invention is also preferably an adhesive that flows by heating or pressurizing, and in particular, heating at 200 ° C. or lower or 1 Kgf / cm ²
An adhesive that exhibits fluidity under the above pressure is preferable. By using such an adhesive, the electromagnetic wave shielding adhesive film of the present invention in which a conductive layer is embedded in the adhesive layer is adhered to a display or a plastic plate as an adherend by flowing the adhesive layer. can do. Because it can flow, the electromagnetic wave shielding adhesive film is laminated on the adherend or pressure-molded, especially by pressure molding,
Also, it can be easily adhered to an adherend having a curved surface or a complicated shape. For this, the softening temperature of the adhesive is 20
It is preferably 0 ° C or lower. From the use of the electromagnetic wave shielding adhesive film, the environment used is usually less than 80 ° C, so the softening temperature of the adhesive layer is preferably 80 ° C or higher,
From the workability, 80 to 120 ° C is most preferable. The softening temperature is a temperature at which the viscosity becomes 10 ¹² poise or less, and at that temperature, fluidization is generally recognized within a time of about 1 to 10 seconds.

Typical examples of the above-mentioned adhesive that flows by heating or pressurization include the thermoplastic resins shown below. For example, natural rubber (refractive index n = 1.52), polyisoprene (n = 1.521), poly-1,2-
Butadiene (n = 1.50), Polyisobutene (n = 1.505-1.5)
1), polybutene (n = 1.513), poly-2-heptyl-1,
3-butadiene (n = 1.50), poly-2-t-butyl-1,
3-butadiene (n = 1.506), poly-1,3-butadiene
(n = 1.515) and other (di) enes, polyoxyethylene (n =
1.456), polyoxypropylene (n = 1.450), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.459), polyvinyl butyl ether (n = 1.456) and other polyethers, polyvinyl acetate (n = 1.467). ,
Polyesters such as polyvinyl propionate (n = 1.467), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n
= 1.479), polyvinyl chloride (n = 1.54 to 1.55), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.5
2), polysulfone (n = 1.633), polysulfide (n = 1.6),
Phenoxy resin (n = 1.5 to 1.6), polyethyl acrylate
(n = 1.469), polybutyl acrylate (n = 1.466), poly-
2-ethylhexyl acrylate (n = 1.463), poly-t
-Butyl acrylate (n = 1.464), poly-3-ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethylene (n = 1.465), polymethyl acrylate (n = 1.472 to 1.47).
480), polyisopropylmethacrylate (n = 1.473), polydodecylmethacrylate (n = 1.474), polytetradecylmethacrylate (n = 1.475), poly-n-propylmethacrylate (n = 1.484), poly-3,3,5 -Trimethylcyclohexyl methacrylate (n = 1.484), polyethyl methacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate (n = 1.487), poly-1,1
-Poly (meth) acrylic acid esters such as diethylpropylmethacrylate (n = 1.489), polymethylmethacrylate (n = 1.489) can be used. If desired, two or more of these acrylic polymers may be copolymerized,
It is also possible to use a mixture of two or more kinds.

Further, as a copolymer resin of acrylic resin and other than acrylic, epoxy acrylate (n = 1.48 to 1.6
0), urethane acrylate (n = 1.5 to 1.6), polyether acrylate (n = 1.48 to 1.49), polyester acrylate (n = 1.48 to 1.54) and the like can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent in terms of adhesiveness, and as the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether,
Resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. An acrylic acid addition product is mentioned. A polymer having a hydroxyl group in the molecule such as epoxy acrylate is effective for improving the adhesiveness. Two or more kinds of these copolymer resins can be used in combination, if necessary. The softening temperature of these adhesive polymers is preferably 200 ° C. or lower, more preferably 150 ° C. or lower, from the viewpoint of handleability. From the use of the electromagnetic wave shielding adhesive film, the environment in which it is used is usually 80 ° C. or lower, so that the softening temperature of the adhesive layer is most preferably 80 to 120 ° C. from the viewpoint of workability. On the other hand, it is preferable to use a polymer having a weight average molecular weight (measured using a calibration curve of standard polystyrene by gel permeation chromatography, the same applies hereinafter) of 500 or more. When the molecular weight is 500 or less, the cohesive force of the adhesive composition is too low, and therefore the adhesion to the adherend may be reduced. The adhesive used in the present invention, if necessary, a diluent, a plasticizer, an antioxidant, a filler,
You may mix | blend additives, such as a coloring agent, a ultraviolet absorber, and a tackifier. The thickness of the adhesive layer is preferably 10 to 80 μm, and is 20 to 50 μm when the conductive layer is thicker than the thickness.
It is particularly preferable to set m.

As the material of the conductive layer in the present invention, a conductive metal, a conductive paste or the like is used, but the conductive metal is particularly preferable. As the conductive metal, copper, aluminum,
Metals such as nickel, iron, gold, silver, stainless steel, tungsten, chromium and titanium, or alloys combining two or more of these metals can be used. Copper, aluminum, or nickel is suitable from the viewpoint of conductivity, easiness of circuit processing, and price, and metal such as metal foil, plated metal, and vapor deposited metal formed under vacuum is used. The thickness of the conductive layer is preferably 0.5 to 40 μm. If it exceeds 40 μm, it is difficult to form a fine line width or the viewing angle becomes narrow. On the other hand, if the thickness is less than 0.5 μm, the surface resistance becomes large and the electromagnetic wave shielding effect tends to be poor.
From the viewpoint of workability and electromagnetic wave shielding property, 1 to 20 μm is more preferable.

It is preferable that the conductive metal is copper, and at least the surface of the conductive metal is blackened, because the contrast is increased. In addition, it is possible to prevent the conductive metal from being oxidized and discolored over time. The blackening treatment may be performed before or after the geometrical figure is formed, but is preferably performed after the geometrical figure is formed. The method can be performed using a usual method used in the field of printed wiring boards. For example, sodium chlorite (31 g / l), sodium hydroxide (1
5 g / l) and trisodium phosphate (12 g / l) in an aqueous solution at 95 ° C. for 2 minutes. In addition, the conductive metal is nickel, iron, stainless steel,
Paramagnetic metals such as titanium are preferable because they have excellent magnetic field shielding properties. The simplest method of bringing the conductive metal into close contact with the transparent substrate is to bond a foil or film of the conductive metal via the adhesive layer. When it is necessary to reduce the thickness of the conductive layer of conductive metal, thin film formation technology such as vacuum deposition method, sputtering method, ion plate method, chemical vapor deposition method, electroless / electroplating method, etc. on the adhesive layer It can be achieved by combining one or more of these methods. The thickness of the conductive metal is preferably 40 μm or less, and the thinner the thickness, the wider the viewing angle of the display, which is preferable as the electromagnetic wave shielding material, and more preferably 18 μm or less.

The geometrical figure drawn by the conductive layer of the present invention is
Equilateral triangles, isosceles triangles, right triangles and other triangles, squares, rectangles, rhombuses, parallelograms, trapezoids and other rectangles, (regular) hexagons, (regular) octagons, (regular) dodecagons,
A (positive) n-gon (n is a positive integer), such as a (positive) decagon
The pattern is a combination of circles, ellipses, and stars, and these units can be used individually or in combination of two or more. The triangle is most effective from the viewpoint of electromagnetic wave shielding property, but from the viewpoint of visible light transparency, the aperture ratio increases as the n number of the (positive) n-sided polygon increases with the same line width. From the point the aperture ratio is 50
% Or more is required. The aperture ratio is more preferably 60% or more. The aperture ratio is the percentage of the ratio of the effective area of the electromagnetic wave shielding adhesive film to the effective area minus the area of the conductive metal of the geometric figure drawn with the conductive metal. When the area of the display screen is taken as the effective area of the electromagnetic wave shielding adhesive film, it becomes the ratio at which the screen can be seen.

Further, by plating the conductive metal, the electromagnetic wave shielding property can be further improved. As a method for performing metal plating, any of ordinary electrolytic plating and electroless plating is possible. The type of plating metal can be gold, silver, copper, nickel, aluminum, etc., but copper or nickel is most suitable in terms of conductivity and price. Plating thickness range is 0.1-100μ
If m is appropriate, and if it is less than 0.1 μm, the electrical conductivity is insufficient, and there is a possibility that sufficient shielding properties may not be exhibited. Further, if the plating thickness exceeds 100 μm, the viewing angle becomes narrow, which is not preferable. 0.5 to 50 μm is more preferable.

As a method of forming such a geometrical figure, a microlithography method, a screen printing method, an intaglio offset printing method, etc. are used when a conductive metal is laminated on a transparent substrate as described above. There is a method of etching a conductive metal after forming an etching resist pattern by etching. These methods are effective in terms of accuracy of circuit processing and efficiency of circuit processing. As a method for etching, there is a chemical etching method or the like. Chemical etching is a method of dissolving and removing unnecessary conductors other than the conductor portion protected by an etching resist with an etching liquid. Examples of the etching solution include ferric chloride aqueous solution, cupric chloride aqueous solution, and alkaline etching solution. Among these, an aqueous solution of ferric chloride or cupric chloride, which has low contamination and can be reused, is preferable. The concentration of the etching liquid is usually 150 to 250 g / liter, though it depends on the thickness of the object to be etched and the processing speed. The liquid temperature is 6
The range of 0 to 80 ° C is preferable. The method of exposing the object to be etched to the etching solution includes dipping the object to be etched in the etching solution, showering the object to be etched in the etching solution, and exposing the object to be etched in the vapor phase of the etching agent. is there. From the viewpoint of stability of etching accuracy, showering to the object to be etched in the etching solution is preferable.

The method utilizing the microlithographic method is as follows:
A conductive layer of a laminate including a transparent substrate, an adhesive layer and a conductive metal layer is provided with a photosensitive layer which is exposed to active electromagnetic waves, and the photosensitive layer is imagewise exposed and developed to form a resist image. Is formed, then the conductive metal is etched to form a geometric pattern of the conductive metal, and finally the resist is peeled off. The microlithography method includes a photolithography method, an X-ray lithography method, an electron beam lithography method, an ion beam lithography method, and the like. Among these, the photolithographic method is the most efficient in terms of its simplicity and mass productivity. Among them, the photolithography method using the chemical etching method is easy, economical,
Most preferable in terms of circuit processing accuracy.

In the screen printing method or the intaglio offset printing method, an etching resist ink is printed on the surface of a conductive metal layer of a laminate including a transparent substrate, an adhesive and a conductive metal layer, and after curing, an etching treatment is carried out. There is a method of forming a geometrical figure of a conductive metal and then removing the resist. In screen printing, a mesh plate made by adding emulsion to a mesh and forming desired pattern holes in the emulsion, a meshless metal plate made by adding emulsion to a meshless metal plate and forming desired pattern holes in the emulsion A pattern is generally printed on a conductive metal layer through a plate such as a plate using a squeegee.

The etching resist ink may be any one as long as the cured product has resistance to the etching treatment of the conductive metal, and the commonly used one can be used. Examples of the etching resist ink include a negative photoresist composition, a photosensitive resin composition, a thermosetting resin composition and the like.

Some negative photoresist compositions contain an alkali aqueous solution-soluble resin, an amino resin, and an acid generator, and after printing and drying, the activity of ultraviolet rays, far ultraviolet rays, X-rays, electron rays, etc. Irradiate,
Further, it can be cured by heating if necessary. The alkaline aqueous solution-soluble resin is not particularly limited as long as it is a resin soluble in the alkaline aqueous solution, but a novolac resin obtained by condensing phenols and aldehydes is preferable. Examples of the acid generator include halogen-containing compounds, quinonediazide compounds, sulfonic acid ester compounds, and onium salts.

In these formulations, the acid generator is preferably added in an amount of 5 to 40 parts by weight, and the amino resin is preferably added in an amount of 3 to 50 parts by weight, based on 100 parts by weight of the alkali aqueous solution-soluble resin. The solvent is usually 200 to 20 with respect to 100 parts by weight of the alkaline aqueous solution-soluble resin.
It is used in the range of 00 parts by weight. As the solvent, acetone, diethyl ketone, methyl amyl ketone, a ketone solvent such as cyclohexanone, an aromatic solvent such as toluene and xylene, methyl cellosolve, methyl cellosolve acetate, a cellosolve solvent such as ethyl cellosolve acetate, ethyl lactate. Ester solvents such as butyl acetate, isoamyl acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, methyl pyruvate, ethyl pyruvate and propyl pyruvate, methanol, ethanol, propanol, propylene glycol methyl ether, propylene glycol ethyl Alcohol solvents such as ether and propylene glycol propyl ether can be used alone or in combination of two or more kinds.

Some photosensitive resin compositions include a binder resin containing a polymerizable monomer and a photoinitiator. Examples of the binder resin include those shown below. Natural rubber, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene, poly-2-heptyl-1,3-butadiene, poly-2-t-butyl-
(Di) enes such as 1,3-butadiene, poly-1,3-butadiene, polyethers such as polyoxyethylene, polyoxypropylene, polyvinyl ethyl ether, polyvinyl hexyl ether, polyvinyl butyl ether, polyvinyl acetate, polyvinyl pro Polyesters such as pionate, polyurethane, ethyl cellulose, polyvinyl chloride, polyacrylonitrile, polymethacrylonitrile, polysulfone, polysulfide, polyethyl acrylate, polybutyl acrylate, poly-2-ethylhexyl acrylate, poly-t-butyl acrylate, poly -3-Ethoxypropyl acrylate, polyoxycarbonyl tetramethacrylate, polymethyl acrylate, polyisopropyl methacrylate, polydodecyl meth Acrylate, poly tetradecyl methacrylate, poly -n- propyl methacrylate, poly-3,3,5-trimethyl cyclohexyl methacrylate, polyethyl methacrylate, poly-2-nitro -
Poly (meth) acrylic acid esters such as 2-methylpropyl methacrylate, poly-1,1-diethylpropyl methacrylate, polymethyl methacrylate, or copolymers thereof can be used.

As the polymerizable monomer, acrylic monomers, epoxy acrylates, urethane acrylates, polyether acrylates, polyester acrylates and the like can be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent in terms of adhesion to the support, and as the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and allyl alcohol diacrylate are used. Glycidyl ether, resorcinol diglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether, etc. (Meth) acrylic acid adducts may be mentioned. A polymer having a hydroxyl group in the molecule such as epoxy acrylate is effective for improving the adhesion to the support. These can be dissolved in a general-purpose solvent, or can be used as they are without solvent with stirring and mixing with a metal dispersant or the like.

As the thermosetting resin, phenol resin,
Melamine resin, epoxy resin, xylene resin, etc. can be applied.
One or more kinds may be copolymerized, or two or more kinds may be blended and used. These can be usually dissolved in a general-purpose solvent, or can be used as they are without solvent with stirring and mixing with a metal dispersant and the like. The above photosensitive resin composition can also be used for producing a photosensitive layer when performing a microlithographic method.

These compositions used in the present invention may optionally contain a thixotropy-imparting agent in addition to the dispersant.
You may mix | blend additives, such as a defoaming agent, a leveling agent, a diluent, a plasticizer, an antioxidant, a metal deactivator, a coupling agent, and a filler.

The line width of the geometrical figure drawn by the conductive metal is preferably less than 40 μm. The line pitch is 100
It is preferable that the line thickness is not less than μm and not more than 40 μm. The line width is 3 from the viewpoint of non-visibility of geometric figures.
It is more preferably less than 0 μm, further preferably 25 μm or less. From the viewpoint of visible light transmittance, the line pitch is more preferably 120 μm or more and the line thickness is 18 μm or less. The line width is preferably thin from the viewpoint of visible light transmittance as long as it is electrically conductive. If it is too thin, the production tends to be difficult, so the thickness is preferably 10 μm or more. The line thickness is preferably 1 μm or more from the viewpoint of electromagnetic wave shielding properties. The larger the line pitch, the higher the aperture ratio and the visible light transmittance, but the electromagnetic wave shielding property deteriorates. Therefore, the line pitch is preferably 1 mm or less. In addition,
If the line pitch becomes complicated due to the combination of geometric figures,
Using the repeating unit as a reference, the area is converted into a square area, and the length of one side is defined as the line pitch. The larger the line interval, the higher the aperture ratio and the visible light transmittance. When used on the front surface of the display as described above, the aperture ratio needs to be 50% or more, and more preferably 60% or more. If the line spacing becomes too large, the electromagnetic wave shielding property will deteriorate, so the line width will be 1000 μm (1
mm) or less. The line spacing is
When it becomes complicated by the combination of geometric figures, the area is converted into the area of a square with the repeating unit as a reference, and the length of one side is defined as the line interval.

In the present invention, the conductive layer having a geometrical pattern is obtained by screen-printing a conductive paste on an adhesive layer,
It may be directly drawn by a printing method such as an intaglio offset printing method.

As a method for embedding the conductive layer in the adhesive layer, the laminate containing the transparent substrate, the adhesive layer and the conductive layer having a geometrical shape as described above is passed between a heat press and a roll of a roll laminator. There is a method of heating and pressurizing depending on the method of applying. The condition at this time is that the temperature is 20 to 200.
It is preferable to appropriately select suitable conditions from the range of 0.1 to 40 Kgf / cm ^{2 in} the range of ° C. Time is 30
It should be more than a second. More preferable condition is 6
Pressure is 1 to 10 Kgf / cm ^{2 in} the range of 0 to 150 ° C.
It may be selected from the range and the time may be 60 seconds or more.

An infrared absorbing agent can be interposed in the electromagnetic wave shielding adhesive film of the present invention. As an infrared absorber, iron oxide, cerium oxide, metal oxides such as tin oxide and antimony oxide, or indium-
Tin oxide (hereinafter ITO), tungsten hexachloride, tin chloride, cupric sulfide, chromium-cobalt complex salt, thiol-
Nickel complex or aminium compound, diimonium compound (trade name of Nippon Kayaku Co., Ltd.) or anthraquinone type (SIR-114), metal complex type (SIR-12)
8, SIR-130, SIR-132, SIR-15
9, SIR-152, SIR-162), phthalocyanine-based (SIR-103) (above, Mitsui Toatsu Chemical Co., Ltd. product name), and other organic infrared absorbers. The infrared absorbent is preferably contained in the adhesive layer. In addition to this, the composition dispersed in a binder resin is applied as an adhesive to the surface of an adhesive layer formed on a transparent substrate and flowing by heating or pressurization, or directly applied to the surface of a plastic. It is also possible to form an adhesive layer which flows by heating or pressurizing, or to apply it to the back surface of the film opposite to the surface of the adhesive layer formed on the transparent substrate. It is also possible to use a transparent substrate in which an infrared absorber is contained in advance in the transparent substrate. Among these infrared absorbing compounds, those having the most effective infrared absorbing effect are the infrared absorbing agents such as cupric sulfide, ITO, aminium compounds, diimonium compounds and metal complex compounds. In the case of infrared absorbers other than organic infrared absorbers, it is necessary to pay attention to the particle size of the primary particles of these compounds. If the particle size is too large than the wavelength of infrared rays, the shielding efficiency is improved, but diffuse reflection occurs on the particle surface, haze increases, and transparency decreases. On the other hand, if the particle size is too short as compared with the wavelength of infrared rays, the shielding effect is reduced. The preferred particle size is 0.01 to 5 μm, more preferably 0.1 to 3 μm.

The infrared absorbing agent which is an infrared absorbing material is, for example, bisphenol A as a binder resin.
-Type epoxy resin, bisphenol F-type epoxy resin, novolac-type epoxy resin and other epoxy resins, polyisoprene, poly-1,2-butadiene, polyisobutene, polybutene and other diene resins, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate , Evenly dispersed in a binder resin such as polyacrylic acid ester copolymer composed of t-butyl acrylate, polyester resin such as polyvinyl acetate and polyvinyl propionate, polyolefin resin such as polyethylene, polypropylene, polystyrene and EVA. To be done. The optimum amount of the compound is the binder resin 10
The infrared absorber is 0.01 to 10 parts by weight with respect to 0 parts by weight, but 0.1 to 5 parts by weight is more preferable. 0.0
If it is less than 1 part by weight, the infrared shielding effect is small, and if it exceeds 10 parts by weight, the transparency is impaired.

It is preferable that the adhesive layer containing the above infrared absorber in the adhesive layer is formed on one surface of the transparent substrate, and the surface of the adhesive layer is coated with a conductive metal.
Further, as described above, the composition containing the infrared absorbent is formed on the surface of the transparent substrate, and the adhesive layer (the infrared absorbent is contained or not contained therein) is fluidized by heating or pressurizing the composition. Good) may be formed, or an adhesive layer may be formed on the transparent substrate surface, and a composition containing an infrared absorber may be formed thereon. Further, it may be formed on the surface of the electromagnetic wave shielding adhesive film opposite to the conductive metal. Further, it may be formed on any layer of an electromagnetic wave shielding structure composed of an electromagnetic wave shielding adhesive film and a plastic plate. For example, in the case of an electromagnetic wave shielding structure composed of one electromagnetic wave shielding adhesive film and one plastic plate, the surface A of the electromagnetic wave shielding adhesive film,
It may be formed on either the surface B between the electromagnetic wave shielding adhesive film and the plastic plate or the surface C of the plastic plate. In this case, the composition containing the infrared absorbent may be directly formed on at least one surface of A, B and C. At least one layer containing infrared absorber
A layer is necessary, and the other layers may not contain an infrared absorbing agent. It is preferable that the layer containing the infrared absorber has adhesiveness because workability and processability are facilitated. Specifically, it is applied to the adhesive layer surface or the film back surface of the electromagnetic wave shielding adhesive film in a thickness of 0.1 to 10 μm. The applied composition containing an infrared absorbing compound may be cured using heat or ultraviolet rays. On the other hand, the infrared absorbent may be directly mixed with the adhesive composition of the adhesive layer that flows by heating or pressurization. In this case, the addition amount is 0.0 based on the effect and transparency with respect to 100 parts by weight of the polymer which is the main component of the adhesive.
Optimally 1 to 5 parts by weight.

An adhesive layer is laminated on a transparent substrate, and a conductive layer having a geometrical pattern is embedded in the adhesive layer. You may laminate | stack a protective film. As such a film, it is appropriately selected and used from the above-mentioned plastic films. The surface of this film facing the adhesive layer may be subjected to a peeling treatment. As the peeling treatment, there is a method of applying a release agent such as a silicone polymer. Lamination of the protective film can be performed under the same heating and pressing conditions as described above. In addition, the protective films may be attached separately using an adhesive. As the adhesive at this time, the same adhesive as described above can be used.

An electromagnetic wave shielding adhesive film according to the present invention in which an adhesive layer is laminated on a transparent substrate and a conductive layer having a geometrical pattern is embedded in the adhesive layer is a glass plate, a plastic plate or the like. It can be bonded to another substrate of the above to form an electromagnetic wave shield. At this time, another substrate and the electromagnetic wave shielding adhesive film of the present invention may be laminated as they are and pressed. The pressurizing conditions are the same as described above. Further, a protective film may be attached to at least one surface of the opposing surfaces of another substrate and the electromagnetic wave shielding adhesive film by using an adhesive separately. As the adhesive at this time, the same adhesive as described above can be used. As a bonding method at this time, a press machine or a laminator may be used. When the above-mentioned electromagnetic wave shielding adhesive film has a protective film, it can be laminated as described above after peeling off the protective film or while peeling it off to form an electromagnetic wave shield. Also, instead of another substrate, it may be directly attached to the display surface.

Specific examples of the material of the plastic plate include polystyrene resin (n = 1.59) and acrylic resin (n = 1.59).
= 1.49), polymethylmethacrylate resin (n = 1.49), polycarbonate resin (n = 1.58), polyvinyl chloride resin (n = 1.5)
4), polyvinylidene chloride resin (n = 1.6 to 1.63), polyethylene resin (n = 1.51), polypropylene resin (n = 1.50), polyamide resin (n = 1.52), polyamideimide resin (n = 1.5),
Polyetherimide resin (n = 1.5), polyetherketone resin (n = 1.45), polyarylate resin (n = 1.5 to 1.6), polyacetal resin (n = 1.5 to 1.6), polybutylene terephthalate resin (n = 1.57) , Polyethylene terephthalate resin (n
= 1.58) and other thermoplastic polyester resins, cellulose acetate resins (n = 1.49), fluororesins (n = 1.4 to 1.5), polysulfone resins (n = 1.63), polyether sulfone resins (n = 1.45 to
1.6), polymethylpentene resin (n = 1.45 to 1.6), polyurethane resin (n = 1.45 to 1.6), diallyl phthalate resin (n = 1.
45-1.6) and other thermoplastic resins and thermosetting resins. Among these, polystyrene resin with excellent transparency,
Acrylic resin, polymethylmethacrylate resin, polycarbonate resin, polyvinyl chloride resin, polyethylene terephthalate resin, and polymethylpentene resin are preferably used. The thickness of the plastic plate used in the present invention is
0.5 mm to 5 mm is preferable from the viewpoint of protection of display, strength and handleability.

FIG. 1 is a sectional view showing an example of the electromagnetic wave shielding adhesive film of the present invention. In FIG. 1, a layer of an adhesive 2 is formed on a transparent substrate 1, and a conductive layer 3 having a geometrical pattern is embedded in the layer of the adhesive 2.

The electromagnetic wave shielding adhesive film of the present invention basically comprises a conductive layer having a geometric pattern, an adhesive layer and a transparent substrate. It is particularly preferable to use a metal foil for the conductive layer, and in this case, the surface of the metal foil is often roughened to improve the adhesiveness. Since the roughened shape is transferred and the roughened shape is transferred to the portion of the adhesive layer that is in contact with the metal and visible light is scattered there, the light transmittance is lowered and the transparency is impaired. Further, also in the transparent substrate, to improve the molding processability of the film, a small amount of filler is added to give unevenness to the film surface to improve the slippage between the films at the time of film winding and improve the winding property, The film surface may be subjected to a roughening treatment such as matting for improving the adhesiveness with the adhesive. In this way, the part of the adhesive layer from which the conductive layer (particularly the metal foil) has been removed or the transparent substrate itself has intentionally unevenness to improve the adhesiveness, or the conductive layer (particularly the metal foil). Light is scattered on the surface to transfer the back surface shape of and the transparency is impaired, but the adhesive layer of the present invention fills the uneven surface of the transparent base material and the refractive index of the transparent base material Diffuse reflection is suppressed to a minimum when a resin close to is applied, and transfer of the roughened shape of the conductive layer (especially metal foil) is eliminated by the flow of the adhesive layer and the surface shape of the adherend It is thought that transparency will develop as it flows along. Furthermore, the geometric figure formed of the conductive material on the transparent substrate is
The line width is so small that it is not visible to the naked eye. In addition, it is considered that the line spacing is sufficiently large and thus the transparency is apparently exhibited. On the other hand, the line spacing of the geometric figure is sufficiently smaller than the wavelength of the electromagnetic wave to be shielded, and it is considered that excellent shielding properties are exhibited.

[0036]

EXAMPLES The present invention will now be specifically described with reference to Examples, but the present invention is not limited thereto. (Example 1) <Preparation example of electromagnetic wave shielding adhesive film 1 and electromagnetic wave shielding structure 1> 50 μm thick as plastic film
Polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name A-4100, refractive index n =
1.575), and the adhesive layer 1 containing the following infrared absorber is applied to one surface thereof at room temperature using an applicator so as to have a predetermined dry coating thickness (thickness 20 μm).
C., and dried by heating for 20 minutes. A 12 μm-thick electrolytic copper foil, which is a conductive metal, is placed through the adhesive layer 1 with its roughened surface facing the adhesive layer side at 180 ° C. and 30 kg.
A PET film with a copper foil, which is a plastic film with a conductive metal, was obtained by heating and laminating under the condition of f / cm ² . The obtained PET film with copper foil was subjected to a screen printing method [screen printing machine (New Long Precision Co., Ltd., LS-34GX with alignment device), nickel alloy meshless metal plate (Mesh Industry Co., Ltd., thickness 50 μm, Pattern size 8mm x 8mm) and permalex metal squeegee (imported by Tomoe Kogyo Co., Ltd.)] are used to etch a resist on a copper thin film (trade name, manufactured by Hitachi Chemical Co., Ltd., RAYCAST).
An etching resist having a line width of 40 μm and a line interval of 250 μm was formed. Then, 200 g / liter ferric chloride aqueous solution (liquid temperature 60 ° C.) is sprayed for 3 minutes and chemical etching (etching rate 2.0 mm / min) is performed to form a copper grid pattern with a line width of 25 μm and a line interval of 250 μm on a PET film. An electromagnetic wave shielding adhesive film 1 was obtained by forming the above. The visible light transmittance of this electromagnetic wave shielding adhesive film 1 was 20% or less. This electromagnetic wave shielding adhesive film 1 was used as a protective film using a heat press machine, and one side was subjected to a peeling treatment to a P thickness of 50 μm
Electromagnetic wave shielding property by heat-pressing under conditions of 110 ° C., 20 Kgf / cm ² , and 15 minutes so that the surface on which the adhesive layer is formed is in contact with the release surface of the ET film (release coating PET manufactured by Tohcello Co., Ltd.) I got a film. The protective film of the electromagnetic wave shielding adhesive film 1 thus produced was peeled off, and a commercially available acrylic plate (COMO glass; product name by Kuraray Co., Ltd., thickness 3 mm, n = 1.49) was used.
An electromagnetic wave shielding structure 1 was obtained by thermocompression bonding and pasting under conditions of ²⁰ ° C., 20 Kgf / cm ² and 15 minutes.

<Composition of adhesive layer 1> Toluene 200 cm ³ and methyl methacrylate (MMA) 5 in a three-necked flask equipped with a thermometer of 500 cm ³ , a cooling tube and a nitrogen introducing tube.
0 g, 5 g of ethyl methacrylate (EMA), 2 g of acrylamide (AM) and 250 mg of AIBN were added, and the mixture was stirred at 100 ° C. for 3 hours under reflux with bubbling with nitrogen. Then, it was reprecipitated with methanol, and the obtained polymer was filtered and dried under reduced pressure to synthesize a polyacrylic acid ester. The yield was 75% by weight. This was used as the main component of the adhesive layer 1. Polyacrylic acid ester (MMA / EMA / AM = 88/9/3, Mw = 700,000) 100 parts by weight SIR-159 (infrared absorber 1: Mitsui Toatsu Chemical Co., Ltd. trade name) 0.5 parts by weight toluene 450 parts by weight ethyl acetate 10 parts by weight The composition of the adhesive layer 1 has a refractive index of 1.
48 and the softening point was 105 degreeC.

Example 2 <Preparation Example of Electromagnetic Wave Shielding Adhesive Film 2 and Electromagnetic Wave Shielding Constituent 2> An adhesive layer 2 containing the following infrared absorbent on one side of a PET film having a thickness of 25 μm at room temperature with an applicator. It was applied and dried by heating at 90 ° C. for 20 minutes.
25 μm in thickness through the adhesive layer 2 (40 μm in thickness)
Of aluminum foil by heating (130 ℃, 20Kg / c
m ² ) and adhered to obtain a PET film with aluminum foil. An etching resist pattern having a line width of 40 μm and a line interval of 125 μm was formed on the PET film with the aluminum foil by the screen printing method similar to that in Example 1. Then, a 200 g / liter ferric chloride aqueous solution (liquid temperature 60 ° C.) was sprayed for chemical etching to form an aluminum grid pattern having a line width of 15 μm and a line interval of 125 μm on the PET film. The visible light transmittance of this electromagnetic wave shielding adhesive film 2 was 20% or less. This electromagnetic wave shielding adhesive film 1 was subjected to a peeling treatment on the same side as in Example 1 using a heat press to give a thickness of 5
The peeling surface of the 0 μm PET film (protective film) is brought into contact with the surface on which the adhesive layer is formed.
An electromagnetic wave shielding adhesive film 2 was obtained by thermocompression bonding using a hot press machine under the conditions of 30 ° C., 30 Kgf / cm ² , and 30 minutes. The protective film of the electromagnetic wave shielding adhesive film 2 thus produced is peeled off and a commercially available acrylic plate (COMO glass; product name by Kuraray Co., Ltd., thickness 3 mm)
So that the surface on which the adhesive layer is formed contacts
An electromagnetic wave shielding structure 2 was obtained by thermocompression bonding using a hot press machine under the conditions of 0 ° C., 30 Kgf / cm ² , and 30 minutes.

<Composition of Adhesive Layer 2> TBA-HME (manufactured by Hitachi Chemical Co., Ltd .; high molecular weight epoxy resin, Mw = 300,000) 100 parts by weight UFP-HX (infrared absorber 2: Sumitomo Metal Mining Co., Ltd.) Product name: ITO, average particle size 0.1 μm) 0.4 parts by weight MEK 330 parts by weight Cyclohexanone 15 parts by weight The composition of the above adhesive layer 2 has a refractive index of 1.
57 and the softening point was 79 degreeC.

Example 3 <Preparation Example of Electromagnetic Wave Shielding Adhesive Film 3 and Electromagnetic Wave Shielding Structure 3> The following adhesive layer 3 was applied to one side of a PET film having a thickness of 50 μm at room temperature using an applicator,
It was dried by heating at 90 ° C. for 20 minutes. On the adhesive layer (thickness 5 μm), an intaglio offset printing machine [glass plate; soda lime glass, average groove depth 10 μm, average surface roughness 1 μm inside, silicone polymer release layer thickness 0.5 μm
m-blanket; made of epoxy-modified silicone rubber, J
Hardness of 50 degrees according to IS K 6253, average surface roughness (Rz) of 0.5 μm], and nickel paste was used to form a line width of 10 μm, a line interval of 100 μm, and a thickness of 1 μm
The grid pattern was printed on a PET film, followed by electroless copper plating. Using a roll laminator, the same one side as in Example 1 was peel-treated, and the peeled surface of the PET film (protective film) having a thickness of 50 μm was brought into contact with the surface on which the adhesive layer was formed at 110 ° C. and 20K.
An electromagnetic wave shielding adhesive film 3 was produced by thermocompression bonding under the condition of gf / cm ² . The visible light transmittance of this electromagnetic wave shielding adhesive film 3 was 20% or less. The protective film of the electromagnetic wave shielding adhesive film 3 is peeled off, and the surface on which the adhesive layer is formed is in contact with a commercially available acrylic plate (COMO glass; product name by Kuraray Co., Ltd., thickness 3 mm), and the temperature is 20 Kgf at 20 ° C. It was heated and pressed under the condition of / cm ² to obtain an electromagnetic wave shielding structure 3. An electromagnetic wave shielding structure 3 was produced in the same manner as in Example 2 using the electromagnetic wave shielding adhesive film 3.

<Composition of Adhesive Layer 3> Byron UR-1400 (trade name, manufactured by Toyobo Co., Ltd .; saturated polyester resin, Mn = 40,000) 100 parts by weight IRG-002 (infrared absorber 3: Nippon Kayaku Co., Ltd. Trade name of the company; aminium compound) 1.2 parts by weight MEK 285 parts by weight cyclohexanone 5 parts by weight The composition of the adhesive layer 3 has a refractive index of 1.
55 and the softening point was 83 degreeC.

(Example 4) The composition of the polyacrylic ester which is the main component of the composition of the adhesive layer 1 is methyl methacrylate (MMA) / ethyl methacrylate (EMA) / acrylamide (AM) = 85/10 / 5, and was synthesized under the same conditions to obtain a polyacrylic acid ester having Mw = 550,000.
The same composition other than this polyacrylic ester is used as the composition of the adhesive layer 4, and the electromagnetic wave shielding adhesive film 4 and the electromagnetic wave shielding structure are formed in the same manner as the electromagnetic wave shielding adhesive film 1 and the electromagnetic wave shielding structure 1 of Example 1. Body 4 was produced. The refractive index of the adhesive layer 4 after solvent drying is 1.4.
7. The softening point was 99 ° C.

Example 5 A polybutadiene ester (Poly bd R-45HT: trade name of Idemitsu Petrochemical Co., Ltd.) which is the main component of the composition of the adhesive layer 1 of Example 1 is used. Was used as the composition of the adhesive layer 5, and the other conditions were the same as in Example 1 to prepare an electromagnetic wave shielding adhesive film 5 and an electromagnetic wave shielding structure 5. The refractive index after solvent drying of the adhesive layer 5 was 1.50, and the softening point was 61 ° C.

Example 6 The polyacrylic acid ester, which is the main component of the composition of the adhesive layer 1 of Example 1, was mixed with virion.
200 (trade name, manufactured by Toyobo Co., Ltd., Mn = 15,000)
0, a linear saturated polyester resin) was used as the composition of the adhesive layer 6, and the electromagnetic wave shielding adhesive film 6 and the electromagnetic wave shielding structure 6 were produced under the same conditions as in Example 1 except for the above. The refractive index after solvent drying of the adhesive layer 6 was 1.55, and the softening point was 163 ° C.

(Embodiment 7) PE is used as a plastic film.
T (50 μm) to polycarbonate film (50 μm
m, n = 1.58), except that the thickness of the adhesive layer 2 was changed from 40 μm to 30 μm, an electromagnetic wave shielding adhesive film 7 and an electromagnetic wave shielding structure 7 were obtained in the same manner as in Example 2.

(Embodiment 8) Line width from 10 μm to 30
μm, the line spacing was 100 μm to 500 μm, and the thickness of the adhesive layer was 5 μm to 10 μm, to obtain an electromagnetic wave shielding adhesive film 8 and an electromagnetic wave shielding structure 8 in the same manner as in Example 3.

(Example 9) Example 1 except that the copper grid pattern formed on the PET film was blackened.
An electromagnetic wave shielding adhesive film 9 and an electromagnetic wave shielding structure 9 were obtained in the same manner as in.

(Example 10) <Production Example of Electromagnetic Wave Shielding Adhesive Film 10 and Electromagnetic Wave Shielding Structure 10> Plastic film having a thickness of 5
A 0 μm polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., trade name A-4100, refractive index n = 1.575) was used, and the adhesive layer 1 of Example 1 (provided that the infrared absorber was used (Not included) at room temperature using an applicator to a predetermined dry coating thickness,
It was dried by heating at 90 ° C. for 20 minutes. A 12 μm-thick electro-deposited copper foil, which is a conductive metal, is placed through the adhesive layer 1 at 180 ° C. for 30 minutes with its roughened surface facing the adhesive layer side.
A PET film with a copper foil, which is a plastic film with a conductive metal, was obtained by heating and laminating under a condition of Kgf / cm ² . Photolithographic process using the chemical etching method on the obtained PET film with copper foil (resist film application-exposure-development-chemical etching-
After peeling the resist film), a copper grid pattern having a line width of 25 μm and a line interval of 250 μm was formed on the PET film to obtain an electromagnetic wave shielding adhesive film 1.
The visible light transmittance of this electromagnetic wave shielding adhesive film 1 was 20% or less. This electromagnetic wave shielding adhesive film 1 is subjected to a heat press using a hot press machine, and the same side as in Example 1 is subjected to a release treatment, and the release surface of a PET film (protective film) having a thickness of 50 μm is in contact with the surface on which the adhesive layer is formed. In this way, an electromagnetic wave shielding film 10 was obtained by thermocompression bonding under the conditions of 110 ° C., 20 Kgf / cm ² and 15 minutes. Electromagnetic wave shielding adhesive film 1 produced in this way
The protective film of No. 0 was peeled off, and a commercially available acrylic plate (COMO glass; product name by Kuraray Co., Ltd., thickness 3 mm, n = 1.
49) and 110 ° C., 20 Kgf / cm ² , 15 minutes for heating and pressure bonding and pasting to obtain an electromagnetic wave shielding structure 10.

Comparative Example 1 0.1 μm as a conductive material
(1,000Å) Using ITO vapor-deposited PET vapor-deposited over the entire surface, a composition obtained by directly removing the infrared absorber from the composition of the adhesive layer 1 was applied without forming a pattern, and electromagnetic waves were applied in the same manner as in Example 1. The shielding structure 10 was obtained.

The aperture ratio, the electromagnetic wave shielding property, the visible light transmittance, the non-visibility, the infrared shielding ratio, the electromagnetic wave of the geometrical figure drawn by the conductive metal material of the electromagnetic wave shielding adhesive film obtained as described above, The adhesive properties of the shielding construction before and after heat treatment were measured. The results are shown in Table 1.

The refractive index of the composition of the adhesive layer was measured by a refractometer (Abbe refractometer manufactured by Atago Optical Machine Co., Ltd.). The aperture ratio of the geometrical figure drawn by the conductive metal was measured based on the micrograph. The electromagnetic wave shielding property is the coaxial waveguide converter (manufactured by Japan High Frequency Co., Ltd., TWC-S-
024) with the sample inserted between the flanges and using a spectrum analyzer (YHP, 8510B vector network analyzer) with a frequency of 30 MHz to 1 GHz.
It was measured at. The visible light transmittance was measured by using a double beam spectrophotometer (manufactured by Hitachi, Ltd., Model 200-10) and using an average value of the transmittance in the range of 400 to 700 nm.
The non-visibility is evaluated by observing the electromagnetic wave shielding structure in which the electromagnetic wave shielding adhesive film is adhered to the acrylic plate from a place 0.5 m away and recognizing the geometric figure formed of the conductive metal. Those that could not be recognized were rated as good, and those that could be recognized were rated as NG. As the infrared shielding rate, a spectrophotometer (U-3410, manufactured by Hitachi, Ltd.) was used, and an average value of infrared absorption rates in the region of 900 to 1, 100 nm was used. Adhesive strength is a tensile tester (Tensilon UTM-4-100, manufactured by Toyo Baldwin Co., Ltd.)
Width of 10 mm, 90 ° direction, peeling speed of 50 mm
It was measured in minutes.

[0052]

[Table 1]

In Comparative Example 1, ITO (indium-tin oxide) was vapor-deposited on the PET film, but the electromagnetic wave shielding property was poor. It has a geometrical pattern drawn with a conductive metal as shown in the examples, its aperture ratio is 50% or more, and the adhesive layer has a softening temperature of 200 ° C. or less and a refractive index of 1.
It was in the range of 40 to 1.70, the thickness of the adhesive layer was not less than the thickness of the conductive metal, and the adhesive layer containing the infrared absorber showed a preferable value. Further, the line width drawn by the conductive metal is 40 μm or less, and the line interval is 1
A conductive metal having a line thickness of 00 μm or more and a line thickness of 40 μm or less showed a preferable value. Further, the electromagnetic wave shielding structure obtained by blackening the copper shown in Example 9 could comfortably appreciate a clear image having a large contrast.

[0054]

The electromagnetic wave shielding adhesive film obtained by the present invention can be easily attached to an adherend for use, and since it has excellent adhesion, it does not leak electromagnetic waves and has a particularly good shielding function. In addition, it has good optical properties such as visible light transmittance and non-visibility, and moreover, it has good changes in adhesive properties at high temperatures over a long period of time. Since the electromagnetic wave shielding adhesive film and the electromagnetic wave shielding composition of the present invention are excellent in electromagnetic wave shielding property and transparency, they are a measuring device, a measuring device and a manufacturing device that generate or protect against electromagnetic waves in addition to the display. It can be used by providing it in a window or a housing that looks into the inside of the housing, especially in a portion such as a window that requires transparency. The display according to the present invention has little electromagnetic wave leakage, is lightweight, compact, has excellent transparency, has a large visible light transmittance, and has good non-visibility.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an electromagnetic wave shielding adhesive film of the present invention.

[Explanation of symbols]

1. Transparent substrate 2. Adhesive layer 3. Geometric conductive layer

Continuation of front page (56) Reference JP-A-1-168100 (JP, A) JP-A-2-296398 (JP, A) JP-A-9-321485 (JP, A) JP-A-7-225301 (JP , A) JP 5-251890 (JP, A) JP 61-134189 (JP, A) JP 1-278800 (JP, A) JP 57-145400 (JP, A) 3-97998 (JP, U) Actual development 1-143197 (JP, U) Actual development Sho 61-192497 (JP, U) Actual development Sho 60-127924 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 9/00 G09F 9/00 B32B 7/02

Claims (9)

(57) [Claims] 1. A conductive film having a roughened surface on a transparent film via an adhesive layer that flows by heating or pressure.
Laminating a sex metallic foil, to the conductive metal foil, the micro-lithographic processes, forming an etching resist pattern having a geometric shape by using a screen printing method or a gravure offset printing method, a conductive metal foil forming a geometric figure composed of a conductive metal by etching, then, the preparation of the electromagnetic wave shielding adhesive film for PDP, wherein the this <br/> comprising the step of clearing under pressure. Wherein P heating or thickness of the adhesive layer to flow by the pressure is equal to or greater than the thickness of the conductive metal claim 1, wherein
Manufacturing method of electromagnetic wave shielding adhesive film for DP . 3. The PD according to claim 1, wherein the conductive metal is copper, and at least the surface of the conductive metal is blackened.
Manufacturing method of electromagnetic wave shielding adhesive film for P. 4. The conductive metal is a paramagnetic metal.
Alternatively, the method for producing the electromagnetic wave shielding adhesive film for PDP as described in 2). 5. A peelable protective film is laminated on the side opposite to the transparent substrate simultaneously with or after the pressurization.
5. The method for producing an electromagnetic wave shielding adhesive film for PDP according to any one of 4 above. 6. The P according to claim 1.
After preparation of the electromagnetic wave shielding adhesive film for DP, preparation for PDP electromagnetic shielding structure, characterized in that bonding the obtained electromagnetic wave shielding property against Chakufu Irumu and plastic plates. 7. The method for producing an electromagnetic wave shielding adhesive film for a PDP according to claim 5, and then peeling the protective film of the obtained electromagnetic wave shielding adhesive film while or after peeling it off, and then sticking a plastic plate. A method of manufacturing an electromagnetic wave shielding structure for a PDP, which is characterized by combining . 8. P according to any one of claims 1 to 4.
A method for producing a plasma display, which comprises performing the method for producing an electromagnetic wave shielding adhesive film for DP and then bonding the obtained electromagnetic wave shielding adhesive film to the surface of a display. 9. After the process of a PDP electromagnetic wave shielding adhesive film according to claim 5, after or peeled while peeling off the protective film of the electromagnetic shielding property against Chakufu Irumu obtained, the display surface A method for manufacturing a plasma display, which is characterized in that the plasma display is bonded to the.