JP3389322B2 - Inspection and sorting machine for chip-type electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection / sorting machine for the electrical characteristics of chip-type electronic parts, and more particularly to a component in a chip-type electronic part inspection / sorting machine having electrodes formed at opposite ends thereof. Holding / conveying mechanism.

[0002]

2. Description of the Related Art Chip-type electronic parts such as chip-type multilayer ceramic capacitors and chip-type resistors aim to reduce the size, thickness and weight of various industrial or consumer electronic circuits and electronic devices. Accordingly, they are widely used as small, thin, and lightweight electronic parts mounted on them, and the demand for them is increasing more and more in recent years. Also, with the improvement of the manufacturing technology and manufacturing speed of these chip-type electronic components,
Improvements have also been made in the inspection technology for electrical characteristics, inspection speed, and inspection equipment. These chip type electronic parts are
Since the manufacturing process is complicated and not all products can obtain the desired characteristics, it is necessary to perform 100% inspection after manufacturing and select and exclude those with characteristics outside the allowable range. . For this reason, for example, in the inspection and selection of the electrical characteristics such as the electrostatic capacity of the chip type multilayer ceramic capacitor, an automatic inspection and sorting machine that can perform the inspection and the sorting at high speed is used.

The inspection / sorting machine as described above is provided with a component holding / transporting mechanism for continuously holding / transporting a large amount of parts to be inspected in the inspecting machine and performing inspection and sorting.
Various methods are used for this component holding / transporting mechanism, and an example of a rotating disk type which is a typical mechanism will be described with reference to FIG.

FIG. 3A shows a rotary disk type component holding /
It is an appearance front view showing the schematic structure of the inspection sorter of the chip type electronic parts which has a conveyance mechanism. Further, FIG. 7B is an exploded perspective view showing the configuration of the component holding / conveying mechanism, and FIG. 7C is an external perspective view for explaining the operation of the component holding / conveying mechanism.

As shown in FIG. 3 (a), the inspection / sorting machine 1 has a component holding / conveying mechanism 2 therein, and a chip type electronic component to be inspected by rotating a disc installed on the surface thereof. To transport. Around the parts holding / transporting mechanism 2,
For example, an insertion section in which a component insertion unit 3 including a ball feeder and a shooter is installed, an inspection unit in which an inspection unit 4 including an inspection electrode is installed, and an ejection unit 5 for selecting and ejecting an inspected component according to an inspection result. The installed sorting section is installed.

A hopper 6 for storing a large number of chip type electronic components and continuously supplying them is connected to the component inserting means 3, and the component inserting means 3 and the hopper 6 are positioned with respect to the component holding / conveying mechanism 2. It is placed on the XY table 7 so that they can be aligned. Further, the inspection means 4 is connected to an inspection control section 8 which measures characteristics of the chip-type electronic component and compares the measurement result with an allowable range to control selection and discharge. Is connected to a component storage container 9 for storing electronic components according to the selected characteristics. In addition to this, an operation control unit 10 of the apparatus body, a main power supply unit 11, and the like are arranged.

As shown in FIG. 1B, the component holding / conveying mechanism 2 has a structure in which a rotating disc 12 and a fixed platen 13 are superposed on each other. The rotating disk 12 has a plurality of component holding through holes for accommodating and holding / conveying chip-type electronic components.
14 are provided concentrically, and the thickness of the chip-type electronic component is such that the electrodes for inspection can contact the electrodes formed at both ends of the housed chip-type electronic component from both sides of the rotating disc 12. Is smaller than the distance between the two ends. The fixed platen 13 is arranged with a predetermined gap so as to cover the back surface of the rotating disc 12, and is conveyed by the rotating disc 12 to a position facing the component holding through hole 14 at a location corresponding to the inspection section. A fixed electrode 15 is embedded so as to come into contact with one end electrode of the chip-type electronic component that has been developed.

With respect to the component holding / conveying mechanism 2 having such a structure, as shown in FIG. 1C, the component inserting means 3 and the inspecting means 4 are provided on the surface side of the rotary disc 12 in accordance with the rotation direction thereof. The inspection movable electrode 16 and the discharging means 5 are installed. Then, the chip-type electronic component 17 inserted from the component inserting means 3 into the component holding through hole 14 is conveyed to the inspection section by the rotation of the rotary disc 12, and the fixed electrode 15 and the movable electrode 16 are provided on the electrodes at both ends. Are contacted and their characteristics are inspected. Then
The chip-type electronic component 17 conveyed to the discharge unit is sorted by characteristics as needed by the discharging unit 5 using a pusher, air (pressure air), vacuum, or the like, and is discharged from the component holding through hole 14.

Thus, according to the inspection / sorting machine 1 having the above-mentioned structure, the chip type electronic components 17 housed in the hopper 6 are supplied to the component holding / conveying mechanism 2 by the component inserting means 3 and are inspected by the rotating disc 12. Then, the fixed electrode 15 and the movable electrode 16 are brought into contact with each other and the characteristics are inspected by the inspection controller 8 and the inspection means 4. Then, according to the inspection result, in the sorting section, the discharging means 5 controlled by the inspection control section 8 sorts the sheets according to their characteristics and discharges them, and stores them in the parts storage container 9 according to their characteristics.

[0010]

2. Description of the Related Art In the rotary disc type component holding / conveying mechanism 2 as described above, the chip type electronic component 17 is inserted into the component holding through hole 14 of the rotary disc 12 by the component inserting means 3 at the inserting portion. Then, the fixed electrode 15
When the movable electrode 16 and the movable electrode 16 are brought into contact with the electrodes at both ends of the chip-type electronic component 17 for inspection, the rotating disk 12 and the fixed plate 13
And the gap between the rotary disk 12 and the component insertion means 3,
It was necessary to properly set the predetermined value. This
It will be described in detail with reference to a sectional view showing a detailed configuration from the insertion portion to the inspection portion of the component holding / transporting mechanism 2 of FIG.

The chip-type electronic component 17 is fed one by one by the component insertion means 3 so that the electrodes at both ends thereof are located on both sides of the rotary disc 12, respectively, and the component holding through-holes of the rotary disc 12 are fed. Inserted in 14. The chip-type electronic component 17 inserted into the component holding through hole 14 is pushed by the next component 17 so that the electrode 17a on the back surface side of the rotating disk 12 contacts the stationary plate 13 and the other electrode 17b. Is inserted so that it comes out to the surface side of the rotating disk 12. Therefore, the rotary disk 12 and the fixed disk 13 are arranged with a constant gap A so that the electrode 17a projects. On the other hand, when the rotary disc 12 rotates in this state, the component 17 held in the component holding through hole 14
However, the rotating disk 12 is moved so as to move to the inspection unit while contacting the fixed platen 13 without being interfered by the next component 17.
And the component insertion means 3 are arranged with a constant gap B therebetween. Then, in the inspection section, the component 17 is pressed against the movable electrode 16 on the fixed electrode 15 from the surface side of the rotating disk 12, so that the fixed electrode 15 and the electrode 17a and the movable electrode 16 and the electrode 17b come into contact with each other, The inspection is done. In this inspection unit, in the rotating disk 12 and the fixed disk 13, the electrode 17a protruding on the back surface side of the rotating disk 12 contacts the fixed electrode 15 and the other electrode 17
It is arranged with a constant gap C so that b comes into contact with the movable electrode 16 on the surface side of the rotating disk 12.

The rotating disk 12 at the tip of the component insertion means 3
By the side where the chip-type electronic component 17 is conveyed, a shutter 18 that can be opened and closed is provided, and as described below, when the chip-type electronic component 17 is not properly inserted,
The part 17 is opened by pressing the part 17 and the part 17 is removed, and the chip-type electronic part 17 and the part insertion means 3 are mechanically impacted.
Alternatively, the rotary disc 12 is prevented from being damaged.

The above-mentioned gaps A and C are usually the rotating disk 12
The same value, for example, about 0.3 mm was set in consideration of the dimensional accuracy of the sled and the like and the mounting accuracy of the rotating disk 12 and the fixed platen 13. The gap B must secure a distance for the chip-type electronic component 17 to transfer from the component insertion means 3 to the component holding through hole 14, and similarly, the dimensional accuracy of the warp of the rotating disc 12 and the rotating disc 12 are the same. Considering the mounting accuracy between the fixing plate 13 and the fixed plate 13, it is necessary to have at least about 0.5 mm.

However, as the size of the chip-type electronic component 17 becomes smaller with the demand for smaller components,
The posture of the chip type electronic component 17 becomes unstable when it is inserted from the component insertion means 3 into the component holding through hole 14, and FIG.
As shown in the sectional view in the vicinity of the component insertion means 3,
It becomes easy for the trouble that the component 17 is caught between the through hole 14 and the component inserting means 3 and the component 17 is not normally inserted into the through hole 14. At that time, as shown in the figure, the shutter 18 is opened and the component 17 is removed, but the tip of the component insertion means 3 and the rotary disc 12 are worn or damaged, and their life is shortened. There is a problem in that the quality is deteriorated due to defects such as breakage and cracks in the body of the component 17 and its electrode portion. There is also a problem that the operation rate of the inspection / sorting machine is lowered due to a large number of parts that are not normally inserted and the insertion rate is deteriorated.

An object of the present invention is to solve the above problems. Therefore, the present invention provides a rotating disk, a fixed plate, a component inserting means in a component holding / conveying mechanism of a chip type electronic component inspection and sorting machine. By setting the respective gaps in a predetermined relationship, a small chip-type electronic component can be stably inserted into the component holding through hole of the rotating disk, and the characteristics can be inspected by the same inspection means as the conventional one. The object is to provide an inspection and sorting machine for parts.

It is another object of the present invention to provide an inspection / sorting machine for chip type electronic components, which has a high rate of insertion of the chip type electronic components into the component holding / conveying mechanism and an improved operating rate.

Furthermore, the present invention reduces the wear and damage of the rotary disc of the component holding / conveying mechanism and the component insertion means due to abnormal insertion of the chip type electronic component to extend their life, and damages the chip type electronic component. An object of the present invention is to provide a chip-type electronic component inspection / sorting machine in which defects such as cracks and cracks are reduced.

[0018]

A chip-type electronic component inspection / sorting machine according to the present invention is provided with a plurality of component-holding through holes for accommodating chip-type electronic components having electrodes at both ends, which are concentrically formed. A rotary disc having a thickness smaller than the distance between both ends of the chip-type electronic component, and a gap provided so as to cover the back face of the rotary disc, and at a position facing at least one of the component holding through holes. A fixed plate in which a fixed electrode for measuring and inspecting the electrical characteristics of the chip type electronic component is embedded, and the fixed electrode is brought into contact with the electrodes at both ends of the chip type electronic component conveyed by the rotation of the rotating disk. A movable electrode arranged on the surface side of the rotating disc, a component inserting means for inserting the chip type electronic component into the component holding through hole from the surface side of the rotating disc, and the chip type electronic component according to the inspection result. Selection or A chip type electronic component inspection / sorting machine equipped with a sorting means for outputting, wherein a gap between the rotary disc and the fixed plate in a region where the chip type electronic component is inserted is made wider than other regions. It is a feature.

Further, the inspection / sorting machine for chip type electronic parts of the present invention is characterized in that, in the inspection / sorting machine of the above construction, a concave portion is formed on the surface of the fixed plate in the region where the chip type electronic parts are inserted. It is a thing.

The chip type electronic component inspection / sorting machine of the present invention is characterized in that, in the inspection / sorting machine having the above-mentioned structure, a convex portion is formed on a surface in the vicinity of a region in which the fixed electrode of the fixed plate is embedded. It is what

[0021]

According to the chip type electronic component inspection / sorting machine of the present invention, in the rotary disc type component holding / conveying mechanism, the gap between the rotary disc and the fixed plate in the region (insertion portion) where the chip type electronic component is inserted. Is wider than the gap between the rotating disc and the fixed plate in other areas, so that the chip-type electronic component can be securely inserted deep into the component holding through hole in a stable posture and the component can be inserted in the insertion part. The gap between the means and the rotating disc can be reduced. As a result, even when inserting a small chip-type electronic component, the component is prevented from being caught between the component-holding through hole and the component inserting means, and the chip-type electronic component is normally inserted into the component-holding through hole. The trouble of disappearing is reduced. As a result, the tip of the component insertion means and the rotating disc are not worn or damaged, and their life is improved.
Further, defects such as damage and cracks of the chip type electronic component body and its electrodes do not occur, and the quality does not deteriorate.
Further, the operation rate of the inspection / sorting machine is improved by increasing the insertion rate of the chip type electronic components.

The chip-type electronic component deeply inserted into the component holding through hole at the insertion portion is conveyed to the inspection unit (the region where the fixed electrode is embedded in the fixed plate) as the rotary disc rotates. Since the gap between the rotating disc and the fixed disc in the inspection unit is set to be gradually smaller than the gap in the insertion unit, the electrodes on the surface side of the rotating disc of the chip type electronic component are pushed out in the inspection unit. And the protrusion is sufficient for contact with the movable electrode. Therefore, the electrodes on both ends of the chip-type electronic component can surely contact not only the fixed electrode but also the movable electrode by the same inspection means as the conventional one, and stable measurement and inspection can be performed.

In setting the gap between the rotary disc and the fixed plate as described above, the gap may be continuously changed from the insertion portion to the inspection portion, or may be changed stepwise. You may do it.

Further, the entire gap between the rotary disc and the fixed platen is set to a required value in the inspection section, and a concave section is formed on the surface of the fixed platen facing the component insertion means in the insertion section. Good. According to this, by a simple method of forming a concave portion on the fixed plate, a component holding / conveying mechanism having substantially the same setting as the conventional one can easily cope with a smaller chip type electronic component. Furthermore, a small chip-type electronic component can be transported in a stable posture with electrodes at both ends protruding from both sides of the component holding through hole. Furthermore, by preparing concave portions having various depths and sizes and allowing them to be exchanged on the fixed plate, it becomes possible to easily cope with chip-type electronic components of various sizes.

Further, the entire gap between the rotating disk and the fixed plate is set to a required value in the insertion part, and a convex part is formed on the surface of the fixed plate in the vicinity of the fixed electrode embedded in the inspection part. You may form. According to this, by a simple method of forming a convex portion on the fixed plate, a component holding / conveying mechanism having substantially the same setting as the conventional one can easily cope with a smaller chip type electronic component. Furthermore, a small chip-type electronic component can be transported in a stable posture with it being deeply inserted into the component holding through hole. Furthermore, by preparing convex portions having various depths and sizes and allowing them to be exchanged on the fixed plate, it becomes possible to easily cope with chip-type electronic components of various sizes.

[0026]

The following is a description of the structure of a rotary disk type component holding / conveying mechanism in a chip type electronic component inspection and sorting machine of the present invention.
A detailed description will be given based on examples. The present invention is not limited to these embodiments, and various modifications, improvements, applications, etc. may be made without departing from the technical idea of the present invention.

FIG. 1 is a sectional view similar to FIG. 4A, showing a detailed structure from an insertion portion to an inspection portion in an embodiment of the component holding / conveying mechanism of the present invention. The chip-type electronic component inspection / sorting machine of the present invention has substantially the same structure as the inspection / sorting machine 1 shown in FIG. 3, and is characterized by the structure of a rotary disk-type component holding / conveying mechanism. Therefore, in FIG. 1, the same members as those in FIGS. 3 and 4 are denoted by the same reference numerals.

In the embodiment shown in FIG. 1, the entire gap between the rotary disk 12 and the fixed platen 13 is set to a required value in the inspection section (the region where the fixed electrode is embedded in the fixed platen). In the insertion part (the area where the chip-type electronic component is inserted), the fixed board
This is an example in which a concave portion 19 is formed on the surface of the region of 13 facing the component inserting means 3.

The chip type electronic component 17 is
It is sent out one by one by the component insertion means 3 and is deeply inserted into the component holding through hole 14 of the rotary disc 12. The chip-type electronic component 17 inserted into the component holding through hole 14 is the next component 17
The electrode 17a protruding from the back surface side of the rotating disk 12 contacts the concave portion 19 formed on the surface of the stationary plate 13 while the other electrode 17b slightly moves to the surface side of the rotating disk 12 by being pressed by. It is inserted deeper than in the conventional component holding / conveying mechanism so that it comes out. Therefore, the gap D between the rotary disk 12 and the concave portion 19 of the fixed platen 13 is set larger than the gap A in the conventional insertion portion. On the other hand, when the rotary disc 12 rotates in this state, the component 17 held in the component holding through hole 14
However, the rotating disk 12 and the component inserting means 3 have a constant gap so that they are moved to the inspection unit while being in contact with the concave portion 19 and the surface of the fixed platen 13 without being interfered by the next component 17. It is arranged via E. In this gap E, the gap D is the gap A
Since the component 17 is inserted deeper than the conventional one because it is larger than the conventional one, it is made smaller than the conventional gap B. Therefore, the distance for the chip type electronic component 17 to transfer from the component insertion means 3 to the component holding through hole 14 can be reduced, so that even a small chip type electronic component 17 can be inserted into the component holding through hole 14 in a stable posture. can do. In the gap F between the rotary disc 12 and the fixed disc 13 in the inspection unit, the electrode 17a protruding to the back side of the rotary disc 12 contacts the fixed electrode 15, and the other electrode 17a.
A value similar to that of the conventional gap C is set so that b comes into contact with the movable electrode 16 on the front surface side of the rotating disk 12. As a result, in the inspection unit, the fixed electrode 15 and the electrode 17a and the movable electrode 16 and the electrode 17b are in stable and sufficient contact with each other,
The inspection is done.

A shutter 18 that can be opened and closed is provided at the tip of the component insertion means 3 on the side where the chip-type electronic component 17 is conveyed by the rotary disk 12, so that the chip-type electronic component 17 may be opened. When it is not properly inserted, the component 17 is pressed to open and remove the component 17, preventing the chip-type electronic component 17, the component insertion means 3, or the rotary disc 12 from being damaged by a mechanical shock. is doing.

In the case of this embodiment, the gap D is appropriately set according to the size of the chip-type electronic component 17, especially the distance between both ends, but the dimensional accuracy of the warp of the rotating disk 12 (for example, the warp dimension). For example, 0.3 mm to 0.7 m in consideration of the mounting accuracy of the rotating disk 12 and the fixed plate 13 or the depth at which the chip type electronic component 17 is inserted in a stable posture.
m, preferably 0.4 mm to 0.5 mm.
Further, the depth of the concave portion 19 is 0.2 mm to 0.5 mm, preferably 0.2 mm to 0.5 mm, because it is desirable that the gap between the rotary disk 12 and the surface of the fixed plate 13 is 0.2 mm or more in view of its dimensional accuracy and mounting accuracy. Is preferably set to 0.2 mm to 0.3 mm. If the gap D or the depth of the concave portion 19 is within the above range, the insertion state of the electronic component 17 is stable, and the rotating disk 12 and the shutter 18 are stable.
It is preferable in that the service life is extended.

Further, the gap E is determined by taking into consideration the dimensional accuracy of the warp of the rotary disk 12 and the mounting accuracy of the rotary disk 12 and the fixed disk 13, and the like, even if the chip-type electronic component 17 is small, the component insertion means. 3 to the component holding through hole 14 in a stable posture, and 0.2 mm to 0.4 mm, preferably 0.2 mm so as not to hinder the conveyance of the component 17 due to the rotation of the rotating disk 12.
It is recommended to set it to mm to 0.3 mm.

The gap F is defined by the electrode 17b of the component 17 rather than the insertion portion.
So that the fixed electrode 15 and the electrode 17a and the movable electrode 16 and the electrode 17b are in stable and sufficient contact with each other.
0.2 mm to 0.5 mm, preferably 0.2 mm to 0.3 mm may be set.

Next, the detailed structure from the insertion portion to the inspection portion in another embodiment of the component holding / conveying mechanism of the present invention will be described.
2A to 2D are sectional views similar to FIG.

In the embodiment shown in FIG. 2A, the rotary disc 12
An example in which the entire gap between the fixed platen 13 and the fixed platen 13 is set to the same value as the gap D in the insertion part, and the convex portion 20 is formed on the surface of the fixed platen 13 in the vicinity of the fixed electrode 15 embedded in the inspection part. Is.

In the embodiment shown in FIG. 2B, the surface of the fixed platen 13 from the insertion part to the inspection part is inclined so that the gap D between the rotary disk 12 and the fixed platen 13 at the insertion part makes In this example, the gap F in the inspection portion having a smaller value is continuously changed. The slope may be steep and stepped, or may be a gently changing slope.
The inclination may be changed stepwise in several steps, and any of them may be appropriately set according to the size of the chip-type electronic component, the distance to be conveyed, and the like.

In the embodiment shown in FIG. 2 (c), the flat surface of the fixed platen 13 from the insertion part to the inspection part is arranged so as to be inclined with respect to the rotary disc 12, and the rotary disc 12 in the insertion part is arranged. And fixed plate
In this example, the gap D with respect to 13 is changed to the gap F in the inspection portion having a smaller value than the gap D so that the gap becomes gradually smaller. When the gap is linearly changed in this way, the entire fixed platen 13 may be arranged so as to be tilted, and the surface of the fixed platen 13 may be arranged so that such a tilt occurs only from the insertion part to the inspection part. It may be processed.

In the embodiment shown in FIG. 2 (d), the rotary disc 12 is disposed so as to be inclined with respect to the fixed platen 13 having a flat surface at least between the insertion portion and the inspection portion, and the rotation at the insertion portion is performed. In this example, the gap D between the disk 12 and the fixed platen 13 is changed to a gap F in the inspection portion having a smaller value than the gap D so that the gap becomes gradually smaller. When the gap is linearly changed in this manner, the entire rotary disc 12 may be arranged with respect to the flat fixed platen 13 by inclining the rotary shaft, for example. Made of a flexible material, provided with a guide that forcibly forces the rotating surface from the outside, and installed the rotating disk 12 so that such inclination occurs only from the insertion part to the inspection part. May be.

The rotary disk 12 of the inspection / sorting machine of the present invention is required to have excellent insulating properties, and for example, resin materials such as Delrin, Duracon, and glass-epoxy resin are used. Among them, the use of DURACON is preferable because it is excellent in workability.

On the other hand, the material of the stationary platen 13 is required to be excellent in abrasion resistance, and for example, hard iron such as super steel or SUS (stainless steel) is used.

The surface of the fixed board 13 is a chip type electronic component.
It is preferable to perform tuftride treatment (surface hardening treatment) or mirror polishing treatment so that 17 can be transported smoothly.

When the concave portion 19 is formed on the surface of the stationary platen 13, the shape thereof is preferably a mortar (cone) shape, a flat bottom mortar shape, or a bowl (cup) shape, among which the bottom is flat. The mortar shape is preferable in that the electronic component 17 can be smoothly transported and external defects such as scratches and abrasion due to an inspection machine are less likely to occur. The concave portion 19 is formed so as to be smoothly continuous with the surface of the surrounding fixed platen 13, and the formation thereof is performed by a method such as surface hardening treatment (tuftride treatment) in a mirror state. In addition, the concave portion 19 is produced separately from the fixed platen 13, and a concave portion for mounting the concave plate 19 is formed at a position of the fixed platen 13 where the concave portion 19 is formed, and then fitting, screwing, screwing, bonding, or the like is performed. It may be replaceably mounted, in which case, depending on the size of the chip-type electronic component 17, the same fixing plate 13 is used and various suitable concave portions 19 are used.
Can be formed.

On the other hand, when the convex portion 20 is formed on the surface of the fixed platen 13, its shape is preferably a conical shape with a flat head, a trapezoidal shape or the like.
This is preferable in that the 17 can be transported smoothly and external defects such as scratches and abrasion due to the inspection machine are less likely to occur. The convex portion 20 is formed so as to be smoothly continuous with the surface of the surrounding fixed platen 13, and the formation thereof is performed by a method such as surface hardening treatment (tuftride treatment) in a mirror state. Further, the convex portion 20 is produced separately from the fixed platen 13, and a concave portion or a convex portion for its attachment is formed at a position of the fixed platen 13 where the convex portion 20 is formed, and fitting, screwing, screwing, It may be replaceably attached by a method such as adhesion, and even in that case, the same fixing plate is used depending on the size of the chip-type electronic component 17.
It is possible to use 13 to form various suitable convex portions 20.

The fixed electrode 15 is embedded in the inspection unit at a position facing the component holding through hole 14 of the fixed platen 13. The shape is a cylindrical shape, a prismatic shape, a hemispherical shape, or the like, and the electrode 17a of the chip-type electronic component 17 conveyed by the rotation of the rotating disc 12 is used.
Are provided with a size larger than the size of the component holding through hole 14 so that they can be stably abutted. The material is super steel,
Phosphor bronze, gold or gold plating, copper, or the like is used. Among them, phosphor bronze is preferable because it is excellent in detection accuracy and a capacitor can reduce variations in measurement such as capacitance and dielectric loss. In addition, by mounting, sliding, screwing, screwing, etc. to the fixed plate 13,
Buried or fixed. Then, it is connected to the inspection means 4 and the inspection control unit 8 by a conductor wire passing through the inside of the fixed board 13 from the mounting portion of the fixed electrode 15 or a conductor provided inside the fixed board 13.

On the other hand, the movable electrode 16 is arranged on the surface side of the rotating disk 12 in the inspection section so as to face the fixed electrode 15.
The shape is cylindrical, disk-shaped, plate-shaped, rod-shaped, brush-shaped, etc., and the electrode 17b of the chip-type electronic component 17 conveyed by the rotation of the rotating disk 12 is stably brought into contact with it. As described above, the size is larger than the size of the electrode 17b. In order to bring the movable electrode 16 into contact with the electrode 17b, the movable electrode 16 may be moved back and forth as illustrated by a cylinder mechanism, a cam mechanism, or the like, or it may be held by an elastic support and pressed by the elastic force. You may Then, like the fixed electrode 15, the inspection means 4 and the inspection control unit 8 are formed by a conductor or conductor.
Connected to.

The inspection means 4 and the inspection controller 8 include various devices for measuring and inspecting the electrical characteristics of the chip-type electronic component 17, such as an LCR meter, an insulation resistance meter, an LCZ meter, a capacitance meter, a withstand voltage meter, etc. Can be used.

The size and spacing of the component holding through holes 14 and the rotation speed of the rotary disk 12 are appropriately set according to the size and inspection content of the chip-type electronic component 17 to be inspected. For example, in the case of measuring the capacitance of a chip-type monolithic ceramic capacitor, it is usually good to set about 8 capacitors / sec.

For the component inserting means 3, for example, a combination of a ball feeder and a shooter is used.
A combination of a feeder and a pusher can be used.

As the discharging means 5, a means using a pusher, air (pressurized air), vacuum or the like is used, and the discharging means 5 is discharged toward several discharging ports according to the characteristics of the component 17.

Specific examples will be described in detail below. [Example 1] AMC-5 manufactured by Human Laboratories Co., Ltd. as an inspection / sorting machine for chip-type electronic components having the configuration shown in FIG.
No. 00 was used to inspect and select the capacitance characteristics of a small chip type monolithic ceramic capacitor having a size of 0.8 mm length × 1.25 mm width × length (distance between both ends) 2.0 mm. The inspection / sorting machine includes a rotating disc having the configuration shown in FIG.
A component holding / transporting mechanism consisting of 12 and a fixed platen 13 was attached. Here, the rotating disk 12 has a diameter of 140 mm and a thickness of 1.3 m.
The size is 1.0mm x length
The component holding through hole 14 with a width of 1.7 mm is set to a pitch circle diameter of 123.5.
mm, and the interval was 7.2 mm, and a total of 50 pieces were formed. Meanwhile, fixed plate
13 is made of super steel with a diameter of 145 mm and a thickness of 15 mm, and the concave portion 19 has a size of 15 mmφ and a depth of 0.3 mm.
A flat bottomed mortar-shaped product was formed by grinding, and the surface thereof was subjected to tufftride finish. Then, the gap D between the rotary disc 12 and the fixed plate 13 in the insertion part is
0.5 mm, the gap E between the rotating disk 12 and the component insertion means 3
0.2 mm, and the gap F between the rotating disk 12 and the fixed plate 13 in the inspection section was set to 0.3 mm. Further, as the fixed electrode 15, an electrode made of phosphor bronze having a size of 3 mmφ is embedded, and as the movable electrode 16, a 3 mmφ size gold-plated copper spring contact pin which moves back and forth by a motor, a cam and a bearing is used. Using.

Using this inspection / sorting machine, 500,000 chip type multilayer ceramic capacitors were inspected to check for the occurrence of defective insertion into the rotary disk. The defective rate was 0%.

Further, the time (life) until the rotary disc and the component inserting means must be replaced due to wear is 288 hours, and even if continuous operation is performed for 24 hours a day, replacement is performed every 12 days. Became frequency.

[Example 2] In contrast to [Example 1], when the same chip type monolithic ceramic capacitor is inspected and selected by the same inspection and sorting machine, a conventional flat surface fixing plate is used as a component holding / transporting mechanism. used. And, the gap A between the rotary disc 12 and the fixed plate 13 in the insertion part is 0.3 m.
m, the gap B between the rotating disk 12 and the component insertion means 3 is 0.5 m
m, the gap C between the rotating disk 12 and the fixed plate 13 in the inspection section
It was set to 0.3 mm.

As a result, the number of defective insertions in the inspection of 500,000 chip type multilayer ceramic capacitors was 17,500, and the defective insertion rate was 3.5%.

The service life of the rotary disc and the component insertion means was shortened to 240 hours due to defective insertion of the components, and when continuous operation was performed for 24 hours a day, the replacement frequency was every 10 days. .

In this example, when the gap A and the gap C were set to 0.5 mm and the gap B was set to 0.2 mm, the end electrodes of the chip type monolithic ceramic capacitor were placed on the surface side of the rotating disk in the inspection section. It did not project sufficiently and the contact with the movable electrode was insufficient, so a normal characteristic test could not be performed.

As can be seen from the results of [Example 1] and [Example 2], the chip type electronic component inspection / sorting machine using the component holding / conveying mechanism of the present invention does not cause defective insertion of components. The insertion failure rate could be reduced to 0%. Also,
Since an operation loss of 2 tacts occurs for each occurrence of defective insertion of parts, the operation rate of the inspection / sorting machine of the present invention is 3.5% × 2, that is, the defective rate of insertion of the conventional inspection / sorting machine, ie, 7%. %
Improved. The service life of the rotary disc and the component insertion means of the inspection / sorting machine of the present invention is improved by 20% as compared with the conventional inspection / sorting machine. In addition, in the inspection / sorting machine of the present invention, the electrodes at both ends of the chip-type electronic component in the inspection section are in sufficient contact with the fixed electrode and the movable electrode, and stable inspection can be performed.

The inspection / sorting machine using the component holding / conveying mechanism of the present invention is not limited to the inspection / sorting of the electric capacity of the capacitor shown in the concrete example, but also various chips such as chip resistors and chip coils. It can also be applied to inspection and selection of mold electronic parts,
It goes without saying that the operating rate can be increased and the occurrence of troubles and defects can be reduced.

[0059]

As described above in detail, according to the chip type electronic component inspection / sorting machine of the present invention, the respective gaps between the rotating disk, the fixed plate and the component inserting means are predetermined in the component holding / conveying mechanism. By setting such a relationship, a small chip-type electronic component can be stably inserted into the component holding through hole of the rotating disc, and a chip-type electronic component inspection / sorting machine that can inspect the characteristics by the same inspection means as the conventional one Could be provided. With such a configuration, it is possible to increase the insertion rate of the chip-type electronic component into the component holding / transporting mechanism and increase the operating rate.

Further, according to the chip type electronic component inspection / sorting apparatus of the present invention, the wear and damage of the rotary disc of the component holding / conveying mechanism and the component inserting means due to the insertion abnormality of the chip type electronic component can be reduced to reduce the wear and damage. It has been possible to provide an inspection / sorting machine for chip-type electronic components, which has a longer life and reduces defects such as damage and cracks of the chip-type electronic components.

Further, according to the inspection / sorting machine of the present invention, the concave portion or the convex portion formed on the fixed plate can be exchanged, which makes it easy for chip type electronic parts of various sizes. We were able to provide an inspection and sorting machine that can handle the above.

[Brief description of drawings]

FIG. 1 is a sectional view showing a detailed configuration of an embodiment of a component holding / conveying mechanism of an inspection / sorting machine according to the inspection / sorting machine of the present invention.

2 (a) to (d) are cross-sectional views showing detailed configurations of other embodiments of the component holding / conveying mechanism of the inspection / sorting machine according to the present invention.

3A is an external front view showing a schematic configuration of a chip type electronic component inspection / sorting machine, FIG. 3B is an exploded perspective view showing a configuration of a component holding / conveying mechanism, and FIG. FIG. 9 is an external perspective view for explaining the operation of the component holding / transporting mechanism.

4 (a) and (b) are parts holding / inspection / sorting machines of the inspection / sorting machine.
It is sectional drawing which shows the detailed structure of a conveyance mechanism.

[Explanation of symbols]

1 ... Inspection / sorting machine 2 ... Parts holding / conveying unit 3 ... Parts inserting means 12 ... Rotating disk 13 ... Fixed plate 14 ... Parts holding through hole 15 ...・ Fixed electrode 16 ・ ・ ・ Movable electrode 17 ・ ・ ・ Chip type electronic component 19 ・ ・ ・ Concave part 20 ・ ・ ・ Convex part A, D ... Gap B, E between the rotary disk and the fixed plate at the insertion part ..Gap C between the rotating disk in the insertion section and the component insertion means, F ... Gap between the rotating disk and fixed plate in the inspection section

Claims (3)

(57) [Claims] 1. A rotary disc having a thickness smaller than a distance between both ends of the chip type electronic component, wherein a plurality of component holding through holes for accommodating the chip type electronic component having electrodes on both ends are concentrically provided. A fixed electrode is disposed so as to cover the back surface of the rotary disc with a gap, and a fixed electrode for measuring and inspecting the electrical characteristics of the chip-type electronic component is embedded at a position facing at least one of the component holding through holes. A fixed disk, a movable electrode arranged on the surface side of the rotary disk that comes into contact with the fixed electrodes together with the electrodes at both ends of the chip-type electronic component conveyed by the rotation of the rotary disk, and the rotary disk A chip type electronic component inspection / sorting machine equipped with a component inserting means for inserting a chip type electronic component from the front surface side into a component holding through hole, and a sorting means for sorting or discharging the chip type electronic component according to an inspection result. Ah The chip-type electronic component inspection / sorting device is characterized in that the gap between the rotary disk and the fixed plate in the region where the chip-type electronic component is inserted is made wider than in other regions. 2. The chip type electronic component inspection / sorting machine according to claim 1, wherein a concave portion is formed on a surface of the stationary platen in a region where the chip type electronic component is inserted. 3. The inspection / sorting machine for chip-type electronic components according to claim 1, wherein a convex portion is formed on a surface in the vicinity of a region where the fixed electrode of the fixed plate is embedded.