JP3392101B2 - Photosensitive resin composition and photosensitive film using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a printed wiring board,
The present invention relates to a photosensitive resin composition used for forming patterns of lead frames, semiconductor packages, etc., and a photosensitive film using the same.

[0002]

2. Description of the Related Art Conventionally, in the production of printed wiring boards, lead frames and the like, when forming a fine circuit pattern or shape pattern, a photosensitive film formed by layering a photosensitive resin composition has been used. ing.

As the above-mentioned photosensitive film, a light-transmitting support film is usually provided on one surface of the photosensitive resin composition layer.
Further, a film having a multi-layer structure in which a protective film is laminated on the other surface of the photosensitive resin composition layer is used. The formation of the circuit pattern using the photosensitive film is performed as follows, for example. That is, a base material for a circuit board in which a copper foil is laminated on a board is prepared, and a photosensitive resin composition layer is attached to the surface of the board while peeling off a protective film (cover film) layer. A pattern mask is placed on it, and a circuit pattern is formed by passing through an exposure process, a development process, and an etching process.

[0004]

By the way, in recent years,
Along with the finer pitch of the circuit pattern, it is required to improve the resolution. Therefore, the thinning of the photosensitive film is required. However, when the above-mentioned conventional photosensitive film is made thinner, the thickness of the periphery of the through hole is further reduced during lamination on the substrate, so that the strength of the tent film is lowered and the tent film is broken. Furthermore, when using the above-mentioned conventional photosensitive resin composition, the resist stripping speed is slow, and the resist stripping piece becomes a film, and problems such as being entangled with the transport roll of the automatic stripping machine occur, and resist stripping property There is also the drawback of being inferior.

The present invention has been made in view of the above circumstances, and provides a photosensitive resin composition having high resolution, high tent film strength, and excellent resist releasability, and a photosensitive film using the same. Is its purpose.

[0006]

To achieve the above object, the present invention provides a photosensitive resin composition containing a binder component (A), a monomer component (B) and a photopolymerization initiator (C). Therefore, the first gist is a photosensitive resin composition in which the monomer component (B) contains at least a compound (B1) represented by the following general formula (1).

[0007]

[Chemical 2]

Further, the present invention is a photosensitive film comprising a support film laminated on one surface of a photosensitive resin composition layer and a protective film laminated on the other surface of the photosensitive resin composition layer, The second gist is a photosensitive film in which the photosensitive resin composition layer is formed by using the photosensitive resin composition.

That is, the inventors of the present invention have conducted intensive studies mainly on photosensitive resin compositions in order to obtain a photosensitive film having high resolution, high tent film strength, and excellent resist strippability. As a result, the monomer component (B) containing at least the compound (B1) represented by the general formula (1) together with the binder component (A) and the photopolymerization initiator (C).
The inventors have found that the intended purpose can be achieved by using, and have reached the present invention. The reason for this is not necessarily clear, but it is presumed as follows. That is, the generation of hydrogen bonds based on urethane bonds in the compound (B1) improves the toughness of the resist film, increases the strength of the tent film, and has high hydrolyzability, so that the resist strippability is also improved. Seem.

When the binder component (A) contains at least the styrene-acrylic polymer (A1), the chemical resistance is improved and the resist peeling dispersibility is excellent.

Further, when the content of the styrene-acrylic polymer (A1) in the binder component (A) is set in a specific range, excellent resist peeling dispersibility and tent film strength are improved. To do.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described in detail.

The photosensitive resin composition of the present invention can be obtained by using the binder component (A), the monomer component (B) and the photopolymerization initiator (C). The present invention is most characterized in that the monomer component (B) contains at least the compound (B1) represented by the general formula (1).

The binder component (A) preferably contains at least a styrene-acrylic polymer (A1). Examples of the styrene-acrylic polymer (A1) include a copolymer of styrene and (meth) acrylic acid, a copolymer of α-methylstyrene and (meth) acrylic acid, and the like. Of these, a copolymer of styrene and (meth) acrylic acid is preferable.

The copolymerization ratio (weight ratio) of styrene and (meth) acrylic acid is preferably styrene / (meth) acrylic acid = 65/35 to 80/20.

The styrene-acrylic polymer (A1)
Has a weight average molecular weight (Mw) of 5,000 to 40,000.
The range of 0 is preferable, and particularly preferably 10,000 to 3
It is 10,000.

The styrene-acrylic polymer (A1)
The content of is preferably in the range of 10 to 40% by weight, and particularly preferably in the range of 15 to 35% by weight, based on the whole binder component (A). That is, when the content of the styrene-acrylic polymer (A1) is less than 10% by weight, the resist peeling dispersibility is poor, and conversely, when it exceeds 40% by weight,
This is because the resist film becomes brittle.

The styrene-acrylic polymer (A1)
As the binder component (A) other than, for example, an acrylic polymer obtained by copolymerizing (meth) acrylic acid ester as a main component with ethylenically unsaturated carboxylic acid and other copolymerizable monomer It is preferable to use.

Examples of the (meth) acrylic acid ester include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, and 2-ethylhexyl (meth). ) Acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth)
Examples include acrylate.

As the ethylenically unsaturated carboxylic acid, for example, monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid are preferably used, and dicarboxylic acids such as maleic acid, fumaric acid and itaconic acid, and those An anhydride or a half ester can also be used. Among these, acrylic acid and methacrylic acid are particularly preferable.

Examples of the other copolymerizable monomers include (meth) acrylic acid tetrahydrofurfuryl ester, (meth) acrylic acid dimethylaminoethyl ester, (meth) acrylic acid diethylaminoethyl ester, methacrylic acid glycidyl ester, 2, 2, 2
-Trifluoroethyl (meth) acrylate, (meth)
Examples thereof include acrylamide, 2,2,3,3-tetrafluoropropyl (meth) acrylate acrylamide, diacetone acrylamide, vinyltoluene, vinyl acetate, alkyl vinyl ether, and (meth) acrylonitrile.

The monomer component (B) used together with the binder component (A) is not particularly limited as long as it contains at least the compound (B1) represented by the following general formula (1).

[0023]

[Chemical 3]

In the above general formula (1), R is preferably a methyl group, X is preferably --CH ₂ CH ₂ O--, and Y is preferably --CH ₂ CH (CH ₃ ) O--.

In the above general formula (1), the divalent hydrocarbon group having 2 to 20 carbon atoms represented by Z is, for example,
In addition to-(CH ₂ ) _6- , the following are also included.
Among them, - (CH _{2) 6} - is preferable.

[0026]

[Chemical 4]

In the above general formula (1), k is 10 to 2
An integer of 0 is preferable, m is preferably an integer of 3 to 6, and n is
Is preferably an integer of 3 to 6.

The compound represented by the general formula (1) (B
The weight average molecular weight (Mw) of 1) is 1900 to 3500.
Is preferable, and 2400 to 3000 is particularly preferable.
Is.

The compound represented by the above general formula (1) is
Among the products (B1), R = -CH ₃, X = -CH₂C
H₂O-, Y = -CH₂CH (CH₃) O-, Z =-
(CH ₂)₆-, K = 15, m = 6, n = 4
Compounds are particularly preferred.

The compound represented by the general formula (1) (B
As the monomer component (B) other than 1), an ethylenically unsaturated compound is preferable, and examples thereof include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di ( Meta)
Acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6
-Hexane glycol di (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol di (meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester Di (meth) acrylate,
Hydroxypivalic acid-modified neopentyl glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, 1,6-hexamethyldiglycidyl ether di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri ( (Meth) acrylate, dipentaerythritol penta (meth) acrylate, glycerin polyglycidyl ether poly (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 2,2'-bis (4
-(Meth) acryloxydiethoxyphenyl) propane, 2,2'-bis (4- (meth) acryloxypentaethoxyphenyl) propane, 2,2'-bis (4-
Examples thereof include polyfunctional monomers such as (meth) acryloxypolyethoxyphenyl) propane, 2-hydroxy-3- (meth) acryloyloxypropyl acrylate, and trimethylolpropane triglycidyl ether tri (meth) acrylate. Moreover, a monofunctional monomer may be used in combination with the polyfunctional monomer in an appropriate amount, and examples of such a monofunctional monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxypropyl (meth) acrylate. Hydroxybutyl (meth) acrylate, 2-phenoxy-2-hydroxypropyl (meth) acrylate, 2- (meth) acryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl (meth) acrylate,
Glycerin mono (meth) acrylate, 2- (meth) acryloyloxyethyl acid phosphate, half (meth) acrylate of phthalic acid derivative, N-methylol (meth) acrylamide and the like can be mentioned.

The compound represented by the general formula (1) (B
The content of 1) is preferably set in the range of 3 to 70% by weight, and particularly preferably 5 to 50% by weight, based on the whole monomer component (B). That is, the above compound (B1)
If the content is less than 3% by weight, the effect of reliability of the tent film is lost, and if it exceeds 70% by weight, the resist shape may be deteriorated and the resolution may be lowered.

The mixing ratio (weight ratio) of the binder component (A) and the monomer component (B) is A / B = 70 /
A range of 30 to 40/60 is preferable, and A is particularly preferable.
/ B = 60/40 to 45/55. That is, when the weight ratio of the monomer component (B) is less than 30, the curing speed may be slow and the adhesiveness may be lowered. On the contrary, when the weight ratio of the monomer component (B) exceeds 60, the peeling speed may be decreased. Is likely to be delayed.

Examples of the photopolymerization initiator (C) used together with the binder component (A) and the monomer component (B) include lophine dimers, ketones, xanthones, triazines and acridine derivatives. .
Among them, it is preferable to use the lophine dimer and the ketones in combination from the viewpoint of the deep-part curability.

The above-mentioned lophine dimer is a lophine (2,
There is no particular limitation so long as it is a dimer of (4,5-triphenylimidazole), and for example, 2,2'-bis (o-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-
1,2'-biimidazole, 2,2'-bis (o-chlorophenyl) -4,5,4 ', 5'-tetraphenyl-
1,1'-biimidazole, 2,2'-bis (o-fluorophenyl) -4,5,4 ', 5'-tetraphenyl-1,1'-biimidazole, 2,2'-bis (o -Methoxyphenyl) -4,5,4 ', 5'-tetraphenyl-1,1'-biimidazole, 2,2'-bis (p-
Methoxyphenyl) -4,5,4 ', 5'-tetraphenyl-1,1'-biimidazole, 2,4,2', 4 '
-Bis [bi (p-methoxyphenyl)]-5,5'-diphenyl-1,1'-biimidazole, 2,2'-bis (2,4-dimethoxyphenyl) -4,5,4 ', 5 ′
-Diphenyl-1,1'-biimidazole, 2,2'-
Bis (p-methylthiophenyl) -4,5,4 ', 5'
-Diphenyl-1,1'-biimidazole, bis (2,2
Examples include 4,5-triphenyl) -1,1′-biimidazole. These may be used alone or in combination of two or more. Among these, 2,2'-bis (o-
Chlorophenyl) -4,5,4 ', 5'-tetraphenyl-1,2'-biimidazole is preferred.

The content of the lophine dimer is 100, which is the total amount of the binder component (A) and the monomer component (B).
The range of 1 to 10 parts is preferable, and the range of 2 to 6 parts is particularly preferable, with respect to parts by weight (hereinafter abbreviated as “part”). That is, if it is less than 1 part, the sensitivity is lowered, and if it is more than 10 parts, on the contrary, it may be deposited in the developing tank to cause contamination.

Examples of the above-mentioned ketones include p-aminophenyl ketones, and specifically, N, N '.
-Tetraalkyl-4,4'-diaminobenzophenone (Michler's ketone), benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzoin isophenyl ether, benzyl diphenyl disulfide, benzyl dimethyl ketal , Diacetyl, anthraquinone, naphthoquinone, 3,3'-dimethyl-4-methoxybenzophenone, benzophenone, 4,4'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone and the like. Among them, 4,
4'-bis (diethylamino) benzophenone is preferred.

The content of the above ketones is preferably in the range of 0.02 to 0.5 part, particularly preferably 0. 0, based on 100 parts of the total amount of the binder component (A) and the monomer component (B). 05 to 0.3 parts. That is, 0.02
This is because if it is less than 0.5 parts, the sensitivity and resolution may be lowered, and if it is more than 0.5 parts, the adhesion may be lowered.

In the photosensitive resin composition of the present invention, in addition to the binder component (A), the monomer component (B) and the photopolymerization initiator (C), a dye (pigment, discoloring agent), and thermal polymerization are added. Inhibitors, plasticizers, adhesion promoters, antioxidants, solvents,
A surface tension modifier, a stabilizer, a chain transfer agent, an antifoaming agent, a flame retardant, etc. may be added. Examples of the dye include leuco crystal violet and malachite green.

The photosensitive resin composition of the present invention contains the binder component (A), the monomer component (B) and the photopolymerization initiator (C) as essential components, and if necessary, other components such as a dye. Can be prepared by mixing and mixing.

That is, a support film (carrier film) is laminated on one surface of a photosensitive resin composition layer formed by using the photosensitive resin composition of the present invention, and
A representative example is a photosensitive film having a three-layer structure in which a protective film (cover film) is laminated on the other surface of the photosensitive resin composition layer.

The support film is not particularly limited, and examples thereof include a polyethylene terephthalate (PET) film and a polypropylene film (OPP), and a PET film is preferable.

The above-mentioned protective film is used for the purpose of preventing transfer of the adhesive photosensitive resin composition layer to the support film when the photosensitive film is used in a roll form. , For example, polyethylene (P
E) film, PET film, polypropylene film (OPP, CPP), polyvinyl alcohol film, polytetrafluoroethylene (PTFE) film, nylon film and the like are mentioned, and PE film is preferable.

The photosensitive film of the present invention can be produced, for example, as follows. That is, the photosensitive resin composition of the present invention is uniformly applied to one surface of the support film, and dried in an oven at 90 ° C. for 5 minutes to form a photosensitive resin composition layer. Then, by pressure laminating a protective film on the other surface of the photosensitive resin composition layer,
It is possible to produce a photosensitive film having a three-layer structure in which a support film is laminated on one surface of the photosensitive resin composition layer and a protective film is laminated on the other surface of the photosensitive resin composition layer.

In the photosensitive film of the present invention, the thickness of the photosensitive resin composition layer is preferably 50 μm or less, particularly preferably 10 to 40 μm. That is, when the thickness of the photosensitive resin composition layer exceeds 50 μm, it becomes difficult to obtain sufficient resolution. The thickness of the support film is usually 5 to 25 μm, preferably 12 to 20 μm. That is, when the thickness is less than 5 μm, the film is too flexible and inconvenient to handle, and when it exceeds 25 μm, the resolution is lowered and the cost is increased, which is not preferable. The thickness of the protective film is usually 10 to 50 μm, preferably 10
˜30 μm.

The photosensitive film of the present invention is used, for example, in the manufacture of printed wiring boards, lead frames, etc., and precision processing of metals. A method for producing a printed wiring board using the photosensitive film of the present invention will be described below.

[Exposure] To form an image on the photosensitive film, the protective film is peeled from the surface of the photosensitive resin composition layer, and then the surface of the photosensitive resin composition layer is removed.
It is attached to a metal surface such as a copper clad substrate, 42 alloy or SUS. Then, a pattern mask is brought into close contact with the support film on the opposite side of the photosensitive resin composition layer and exposed.
The above-mentioned exposure is usually carried out by ultraviolet irradiation, and as the light source at that time, a high pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp or the like is used. If necessary, it is possible to complete the curing by heating after the irradiation of ultraviolet rays.

[Development] After the exposure, the support film on the photosensitive resin composition layer is peeled and removed, and then development is performed.
When the photosensitive resin composition is a rare alkali development type,
After exposure, develop with sodium carbonate, potassium carbonate, etc.
It is performed using an alkaline aqueous solution of about 2% by weight. In addition,
A surfactant, a defoaming agent, and a small amount of an organic solvent for promoting development may be mixed in the aqueous alkaline solution.

[Etching, Plating] Etching is usually carried out by an ordinary method using an acidic etching solution such as a cupric chloride-hydrochloric acid aqueous solution or a ferric chloride-hydrochloric acid aqueous solution.
In rare cases, an ammonia-based alkaline etching solution is also used. In the plating method, after pretreatment using a plating pretreatment agent such as a degreasing agent or a soft etching agent, plating is performed using a plating solution.

[Removal and Removal of Cured Resist] After the etching or plating process, the remaining cured resist is removed. The cured resist is stripped and removed by using an alkaline stripping solution composed of an aqueous solution of sodium hydroxide, potassium hydroxide or the like having a concentration of about 0.5 to 5% by weight or an aqueous solution containing ethanolamines or the like.

Next, examples will be described together with comparative examples.

First, the following materials were prepared prior to the examples and comparative examples.

[Binder Component (A)] Obtained by polymerizing methyl methacrylate, n-butyl acrylate, methacrylic acid and 2-hydroxyethyl methacrylate at a ratio of 55/18/22/5 (weight ratio). Copolymer (Mw = 8
10,000)

[Styrene-acrylic copolymer (A
1)] Copolymer obtained by polymerizing styrene and acrylic acid at a ratio of 75/25 (weight ratio) (Mw = 2,00)
0)

[Compound (B1)] In the general formula (1), R = -CH ₃ , X = -CH ₂ CH ₂ O-, Y =-
_{CH 2 CH (CH 3) O-} , Z = - (CH 2) 6 -, k
= 15, m = 6, n = 4

[Monomer component (B)] EO-modified trimethylolpropane triacrylate

[Monomer component (B)] 2,2'-bis (4-methacryloxypentaethoxyphenyl) propane

[Monomer Component (B)] β-Hydroxyethyl-β′-acryloyloxyethyl-o-phthalate

[Photoinitiator (C)] Lophine dimer: 2,2'-bis (o-chlorophenyl) -4,5,
4 ', 5'-tetraphenyl-1,2-biimidazole

[Photoinitiator (C)] Ketones: 4,
4'-bis (diethylamino) benzophenone

[0060]

Examples 1 and 2, Comparative Examples Each component shown in Table 1 below was dissolved in a solvent (methyl ethyl ketone: isopropanol = 9: 1 [weight ratio]) at a ratio shown in the same table to prepare a photosensitive resin composition. Prepared. Then, this photosensitive resin composition was uniformly applied onto a PET film (support film) having a thickness of 19 μm using an applicator and dried in an oven at 90 ° C. for 5 minutes to form a photosensitive resin composition layer having a thickness of 35 μm. Was formed. Furthermore, on the other surface of the photosensitive resin composition layer,
A PE film (protective film) having a thickness of 25 μm was laminated and left standing for 1 day to obtain a photosensitive film. On the other hand, a copper clad substrate (thickness: 1.6 mm, size: 250 mm x 200 mm) is prepared by laminating a copper foil having a thickness of 35 μm, and the copper foil surface is buffed with Scotch Bright SF (Sumitomo Three M Co., Ltd.). Then, it was washed with water, dried with an air stream to be surface-conditioned, and preheated to 60 ° C. in an oven. Then, on the copper foil surface, P of the photosensitive film
While peeling off the E film (protective film), a film composed of the PET film (support film) and the photosensitive resin composition layer was laminated using a hand type roll laminator (laminating condition: hot roll temperature 100
℃, roll pressure about 0.3MPa, laminating speed 1.5m
/ Min).

[0061]

[Table 1]

Using the products of Examples and Comparative Examples thus obtained, the respective properties were evaluated according to the following criteria. The results are also shown in Table 2 below.

[Resolution] Line / space = 1 on the surface of the photosensitive resin composition layer laminated on the copper clad substrate.
/ 1 (10 μm, 15 μm, 20 μm, 25 μm, 30
μm, 35 μm, 40 μm, 45 μm, 50 μm) of each pattern mask (made of glass chrome dry plate) was vacuum-adhered. Then, using a 2 kW ultra-high pressure mercury short arc lamp (parallel light), expose the stouffer with a 21-step step tablet at an exposure amount equivalent to 7 steps, and the resist image is resolved after development at a time equivalent to twice the minimum development time. I checked the line width.

[Adhesion] On the surface of the photosensitive resin composition layer laminated on the copper clad substrate, a line width (10 μm,
15μm, 20μm, 25μm, 30μm, 35μm,
Each pattern mask (made of a glass chrome dry plate) of individual fine lines of 40 μm, 45 μm, 50 μm) was brought into close contact with each other, and development was carried out in the same manner as described above to examine the minimum line width of the independent fine line portion having good adhesiveness.

[Tent film strength] TH with a diameter of 4.5 mm
A 1.6 mm-thick base material having (through holes) is prepared, and a PET film (support film) and a photosensitive resin composition are formed on the surface of the base material while peeling the PE film (protective film) of the photosensitive film. A film of layers was applied. Then, after exposing and developing under the same conditions as above, the tent film strength was measured using a tension gauge having a diameter of 2 mm.

[Resist peelability (speed, dispersibility)] The resist exposed area (180 mm × 100 mm) was exposed to 3 ° C. at 50 ° C.
Spray a weight% sodium hydroxide aqueous solution with a spray,
The resist peeling speed (peeling end time) was measured. Also,
At that time, the resist peeling dispersibility (size of the resist peeling piece) was visually evaluated. In addition, the evaluation is ⊚ when the size of the peeling piece is less than 20 mm, and ◯ when the size is 20 to 30 mm
Those exceeding 30 mm were marked with x.

[0067]

[Table 2]

From the results shown in Table 2 above, the examples have high resolution, excellent adhesion, high tent film strength, no tent film breakage, and excellent resist strippability.

On the other hand, in Comparative Example, since the compound (B1) represented by the general formula (1) was not used as the monomer component, the tent film strength was low and the resist releasability was poor. .

[0070]

As described above, the photosensitive film of the present invention contains at least the compound (B1) represented by the general formula (1) together with the binder component (A) and the photopolymerization initiator (C). Since a special photosensitive resin composition prepared by using the above is used, it has high resolution, high tent film strength, and excellent resist strippability.

When the binder component (A) contains at least the styrene-acrylic polymer (A1), chemical resistance is improved and resist dispersibility is excellent.

When the content of the styrene-acrylic polymer (A1) in the binder component (A) is set within a specific range, excellent resist peeling dispersibility and tent film strength are improved. To do.

Continuation of front page (51) Int.Cl. ⁷ identification code FI C08F 290/06 C08F 290/06 G03F 7/004 512 G03F 7/004 512 7/033 7/033 (56) Reference JP-A-61-77844 (JP, A) JP 2000-95837 (JP, A) JP 7-278492 (JP, A) JP 11-218911 (JP, A) JP 6-107754 (JP, A) (58) ) Fields surveyed (Int.Cl. ⁷ , DB name) G03F ^7/ 00-7/42

Claims (4)

(57) [Claims] 1. A photosensitive resin composition containing a binder component (A), a monomer component (B), and a photopolymerization initiator (C), wherein the monomer component (B) is at least the following general formula ( A photosensitive resin composition comprising the compound (B1) represented by 1). [Chemical 1] 2. The photosensitive resin composition according to claim 1, wherein the binder component (A) contains at least a styrene-acrylic polymer (A1). 3. The photosensitive resin composition according to claim 2, wherein the content of the styrene-acrylic polymer (A1) in the binder component (A) is in the range of 10 to 40% by weight. 4. A photosensitive film comprising a support film laminated on one surface of a photosensitive resin composition layer and a protective film laminated on the other surface of the photosensitive resin composition layer, the photosensitive resin comprising: A photosensitive film, wherein the composition layer is formed by using the photosensitive resin composition according to any one of claims 1 to 3.