JP3395592B2 - Electronic component mounting equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electronic component mounting equipment for mounting an electronic component on the edge of the panel.

[0002]

2. Description of the Related Art A panel used as a display screen of a display device is made of a transparent plate such as a glass plate, and electronic parts are mounted on its edge. Generally, a large number of electronic components are mounted side by side on a plurality of upper and lower edges of a panel. For this reason, various devices for mounting electronic components on the panel have been proposed (for example, Japanese Patent Laid-Open No. 7-14).
884, JP-A-7-231012).

[0003]

In an electronic component mounting apparatus for assembling a panel, (1) a large number of electronic components are mounted on one panel, so that the work can be performed at high speed, and (2) the electronic component is mounted. Is mounted on the upper and lower edges of the panel, so it is easy to mount on the upper and lower edges. (3) Electrodes of electronic components are accurately positioned on the electrodes formed at a narrow pitch on the edge of the panel. Since they must be joined together, high mounting accuracy is required. In particular, in recent years, the size of panels has been increasing, and some panels having a size of 40 inches or more have appeared. Therefore, high-speed work is increasingly required.

[0004] Accordingly, the present invention aims at providing an electronic component mounting equipment capable of performing the mounting of the electronic component to a panel at high speed and high precision.

[0005]

[0006]

Means for Solving the Problems The electronic component mounting apparatus of the present invention includes: a support table for supporting the panels, a crimping tool for crimping the electronic component to the edge of the panel, is disposed at a position facing the bonding tool When a crimping tool is used to crimp an electronic component to the edge of a panel, a receiving member that receives this edge, an electronic component supply part, and an electronic component provided in the supply part are picked up, and the crimping position by the crimping tool. A head for chucking an electronic component, a moving means for moving the head from the supply section to the pressure-bonding position, and a front-back inverting means for inverting the head. .

Further, the electronic component mounting apparatus of the present invention includes a support table for supporting the panel, a first crimping tool arranged to face an upper edge of the panel supported by the support table, and a first crimping tool. Vertically moving means for vertically moving, a first receiving member arranged below the first crimping tool and receiving the upper edge from below, and a vertically moving means for causing the first receiving member to perform vertical movement. A second crimping tool arranged to face the lower edge of the panel supported by the support table, a vertical movement means for causing the second crimping tool to perform a vertical movement, and an upper part of the second crimping tool. A second receiving member that is disposed on the first receiving member and receives the upper edge from above, a vertical moving unit that causes the second receiving member to move up and down, the first crimping tool, and the first crimping tool.
The receiving member, the second crimping tool, and the moving means for moving the second receiving member in the horizontal direction relative to the panel.

[0008]

According to each of the above-mentioned inventions, electronic parts can be mounted on the upper edge and the lower edge of the panel at high speed and with high accuracy.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus, and FIG. 3 is a mounting method for mounting electronic components on an upper edge of a lower plate of the panel. 4A and 4B are mounting process diagrams for mounting electronic components on the lower edge of the upper plate of the panel.

First, the overall structure of the electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, the panel 1 is supported by a support table 2. Support table 2
Is a turntable for rotating the panel 1 in the horizontal direction. The support table 2 is installed on the movable table 9 and horizontally rotates the panel 1. Panel 1 is upper plate 1A
And the lower plate 1B are attached to each other to be assembled. Upper plate 1A
The electrodes 3 are formed at a narrow pitch on the lower edge and the upper edge of the lower plate 1B. The upper plate 1A and the lower plate 1B are made of transparent plates such as glass plates. As will be described later, this electronic component mounting apparatus mounts a large number of electronic components side by side on the electrodes 3 at the upper and lower edges.

On the side of the support table 2, a supply section 5 for electronic components is provided. The supply unit 5 includes a table 6, and a large number of electronic components 7 are stacked on the table 6. Of the two layers of electronic components 7 on the table 6, one electronic component 7 is mounted on the lower edge of the upper plate 1A, and the other electronic component 7 is mounted on the upper edge of the lower plate 1B.

An ACF (anisotropic conductive material) sticking device 10 is disposed on the side of the support table 2 and the supply section 5. The structure of the sticking device 10 will be briefly described. A supply reel 12 and a take-up reel 13 are mounted on the front surface of the main plate 11. The tape-shaped ACF 14 wound around the supply reel 12 is fed along the guide roller 19 and wound around the take-up reel 13.

A sticking tool 15 is arranged midway along the path of the ACF 14. The sticking tool 15 is connected to a rod 17 of a cylinder 16 as a vertically moving means. A receiving portion 18 is provided below the sticking tool 15. As will be described later, the electronic component 7 transferred by the head is positioned on the receiving portion 18, and the attaching tool 15 is moved up and down to attach the ACF 14 to the electronic component 7.

Between the support table 2 and the supply section 5, there is a first
The moving table 20, the second moving table 30, the third moving table 40, and the fourth moving table 50 are provided. First, the first moving table 20 will be described. The Y table 2 is provided on the first moving table 20.
1A is installed, a Z table 21B is installed on the Y table 21A, and a rotary table 22 is installed on the Z table 21B. Turntable 22
A support 23 that supports the electronic component 7 from below is provided on the top. The cross-sectional shape of the support 23 is substantially U-shaped.
The support 23 underlies the electronic component 7 when the electronic component 7 is mounted on the edge of the panel 1. First
When the moving table 20 is driven, the support 23 moves in the longitudinal direction (X direction) of the first moving table 20. The support 23 rotates when the rotary table 22 is driven, and moves up and down when the Z table 21B is driven to adjust its position.

Next, the second moving table 30 will be described. A first receiving member 31 and a second crimping tool 33 are provided on the second moving table 30. The first receiving member 31 is attached to the cylinder 32. The cylinder 32 is a vertical movement unit that causes the first receiving member 31 to perform vertical movement. Further, the second crimping tool 33 is also mounted on the cylinder 34, and the cylinder 34 serves as a vertical movement means for causing the second crimping tool 33 to perform vertical movement. When the second moving table 30 is driven, the first receiving member 31 and the second crimping tool 33 move in the longitudinal direction (X direction) of the second moving table 30.

Above the second moving table 30, a third table is provided.
The moving table 40 is provided. Cylinders 41 and 42 are mounted on the lower surface of the third moving table 40. A first crimping tool 43 is attached to one cylinder 41. A second receiving member 44 is attached to the other cylinder 42. The cylinders 41 and 42 are vertical moving means for moving the first crimping tool 43 and the second receiving member 44 up and down. When the third moving table 40 is driven, the first crimping tool 43 and the second receiving member 44.
Moves in the longitudinal direction (X direction) of the third moving table 40. The first crimping tool 43 and the first receiving member 31 face each other, and the second crimping tool 33 and the second receiving member 44 face each other, and the electronic component 7 to be described later is bonded to the panel 1.

A fourth moving table 50 is provided between the first moving table 20 and the electronic component supply section 5. A movable table 51 is provided on the fourth moving table 50. A pole 52 is erected on the movable base 51, and a drive portion 53 is attached to the upper end of the pole 52. The rotary shaft 54 extends horizontally from the drive unit 53,
A head 55 is attached to the tip of the rotary shaft 54.
The head 55 has a suction hole 56 for chucking the electronic component 7 by vacuum suction (see FIG. 3A). The head 55 serves as a transfer means for transferring the electronic component 7 onto the sticking device 10 and the support 23.

When the fourth moving table 50 is driven, the movable table 51 moves in the longitudinal direction (X direction) of the fourth moving table 50. When the rotation driving means such as a motor built in the movable table 51 is driven, the pole 52 rotates about its axis, and the head 55 rotates in the horizontal direction (arrow A). Further, when the vertical moving means built in the movable table 51 is driven, the pole 52 moves up and down. When the drive unit 53 is driven, the head 55 rotates about the rotary shaft 54 to turn over, and thereby the electronic component 7 chucked by the head 55 is turned over (arrow B). That is, the drive unit 5
Reference numeral 3 is a front / back inverting means for the head 55 and the electronic component 7. As described above, the head 55 performs the horizontal rotation operation, the vertical movement, and the front / back inversion operation.

In FIG. 3A, the electronic component 7 comprises a flexible connector 7a made of a resin film or the like, a substrate 7b mounted on the rear end of the connector 7a, and a chip 7c mounted on the substrate 7b. Made of Chip 7c
It is an electric element that controls driving of the panel 1.

In FIG. 1, a camera 60 is provided above the panel 1. The camera 60 is a moving table 61.
Attached to the panel 1 and moves along the edge of the panel 1.
The camera 60 observes the targets of the panel 1 and the electronic component 7 and detects the relative displacement between the two.

This electronic component mounting apparatus has the above-mentioned structure, and its operation will be described below. First, a method of mounting the electronic component 7 on the electrode 3 of the lower plate 1B will be described. Figure 3
(A) to (d) show the same method in the order of steps. Figure 1
In the above, the head 55 moves up and down with respect to the electronic components 7 stacked on the table 6 of the supply unit 5, and picks up the uppermost electronic component 7 by vacuum suction.

Next, the head 55 horizontally rotates in the direction of arrow A and sends the electronic component 7 to the sticking device 10. FIG. 3A shows the state at this time. Thereupon, the receiving portion 18 rises to support the tip portion of the connector 7a of the electronic component 7 from below, and the attachment tool 15 descends, so that the ACF 14 is attached to the connector 7a.
(See the sticking tool 15 and the receiving portion 18 shown by the chain line in FIG. 3A).

After the ACF 14 is attached to the connector 7a of the electronic component 7 as described above, the attaching tool 15 is retracted upward and the receiving portion 18 is retracted downward. Next, the head 55 is horizontally rotated again to mount the electronic component 7 on the support 23. At that time, the head 55 is rotated 180 ° about the rotation shaft 54 to turn the electronic component 7 upside down, whereby the ACF attached to the connector 7a of the electronic component 7 is reversed.
Position 14 on the lower side. FIG. 3B shows the state at this time. Reference numeral 28 is a suction hole formed in the support 23, and vacuum-sucks and fixes the electronic component 7. Further, the head 55 that has released the vacuum suction state of the electronic component 7 moves in the direction opposite to the previous direction and returns to above the table 6 for picking up the next electronic component.

Then, the camera 60 observes the electronic component 7 and the lower plate 1B to detect the relative positional deviation between them. Camera 6
When observing at 0, the first crimping tool 43 is retracted to the side so as not to hinder the observation. Then, the detected positional deviation is corrected by horizontally moving the electronic component 7 relative to the panel 1. Among the positional deviations, the positional deviations in the arrangement direction (X direction) of the electrodes 3 are the first moving table 2
It is corrected by driving 0 to move the electronic component 7 in the same direction, and the positional deviation in the rotation direction is corrected by driving the support table 2 and horizontally rotating the panel 1. The positional deviation in the Y direction practically causes no problem.

Next, as shown in FIG. 3C, the electronic component 7 is lowered to land the ACF 14 on the electrode 3 at the upper edge of the lower plate 1B. Next, as shown by the chain line in FIG.
The first receiving member 31 is raised to lower the edge of the lower plate 1B, and the first crimping tool 43 is attached to the first receiving member 3.
1. The ACF 14 is attached to the electrode 3 of the lower plate 1 </ b> B by pressing the edge portion of the electronic component 7 while lowering it above 1. At this time, preferably, the first pressure bonding tool 43 is heated by a heater (not shown), and the ACF 14 is bonded by thermocompression bonding to the lower plate 1B. By repeating the above operation while relatively moving the first crimping tool 43 and the first receiving member 31 along the edge of the lower plate 1B, the electronic components 7 are successively placed on the upper edge of the lower plate 1B. It is mounted side by side.

After the electronic component 7 is mounted on the upper edge of the lower plate 1B as described above, the electronic component 7 is then mounted on the lower edge of the upper plate 1A. 4A to 4C show the process. In FIG. 1, the support table 2 is driven to horizontally rotate the panel 1 by 90 °, and the lower edge of the upper plate 1A on which the electronic component 7 is mounted is moved to the support 23 side. Further, the second moving table 30 is driven to retract the first receiving member 31 to the side (right in FIG. 1), move the second crimping tool 33 to the working position, and move the third moving table. By driving 40, the second receiving member 44 is also moved to the working position.

The following operation is similar to that of FIG.
The head 55 vacuum-sucks and picks up the electronic component 7 on the table 6, attaches the ACF 14 to the electronic component 7 by the attaching device 10, and then moves the electronic component 7 onto the support 23. Then, the head 55 releases the vacuum suction state of the electronic component 7 and returns to the table 6. However, in this case, the electronic component 7 is not turned upside down, and therefore the ACF 14 is still attached to the upper surface of the electronic component 7.

FIG. 4A shows the state at this time. Therefore, the upper plate 1A of the panel 1 is moved forward relative to the electronic component 7 (the upper plate 1 shown by the chain line in FIG. 4A).
(See A), the camera 60 observes the upper plate 1A and the electronic component 7, and detects a relative positional deviation between the two.

Next, as in the above case, the electronic component 7 is horizontally moved relative to the upper plate 1A to correct the positional deviation, and then the electronic component 7 is relatively moved to the upper plate 1A. It is raised and the ACF 14 is attached to the electrode 3 at the lower edge of the upper plate 1A. FIG. 4B shows the state at this time.

Next, as shown in FIG. 4 (c), the second receiving member 44 is lowered to land on the upper edge of the upper plate 1A, and the second crimping tool 33 is raised to raise the ACF 14 to the upper plate. 1A
The electrode 3 on the lower edge is pressed and attached. Next, when the second pressure bonding tool 33 is lowered and the second receiving member 44 is raised, the attachment of the electronic component 7 is completed. Second
By repeating the above operation while relatively moving the crimping tool 33 and the second receiving member 44 along the edge of the upper plate 1A, the electronic components 7 are arranged side by side on the lower edge of the upper plate 1A one after another. To be implemented.

[0032]

According to the present invention, electronic parts can be mounted on the upper edge and the lower edge of the panel with high speed and high accuracy. Further, since the ACF attachment to the electronic component and the mounting of the electronic component to the panel can be performed in parallel, the workability is extremely good and the mounting at high speed becomes possible. Further, in particular, the present invention is provided with the front and back reversing means of the head for chucking the electronic component, so that the electronic component can be mounted on the lower edge of the upper plate and the upper edge of the lower plate without inverting the panel. Moreover, it is advantageous for mounting electronic components on a large panel.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a mounting process diagram for mounting an electronic component on the upper edge of the lower plate of the panel according to the embodiment of the present invention.

FIG. 4 is a mounting process diagram for mounting an electronic component on the lower edge of the upper plate of the panel according to the embodiment of the present invention.

[Explanation of symbols]

1 panel 1A upper plate 1B lower plate 2 support table 3 electrodes 5 Electronic parts supply 7 electronic components 10 ACF sticking device 14 ACF 31 First receiving member 32 cylinders 33 Second crimping tool 34 cylinders 41 cylinders 42 cylinders 43 First Crimping Tool 44 Second receiving member 53 Drive 55 heads

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-7-74208 (JP, A) JP-A-5-228755 (JP, A) JP-A-5-3225 (JP, A) JP-A-7- 78852 (JP, A) JP 7-142536 (JP, A) JP 9-27519 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/60 G02F 1 / 1345

Claims (4)

(57) [Claims] 1. A support table for supporting a panel, a crimping tool for crimping an electronic component to an edge portion of a panel, and a crimping tool disposed at a position opposed to the crimping tool to crimp the electronic component to the edge portion of the panel. And a transfer means for picking up the electronic component provided in the supply part and transferring it to the crimping position by the crimping tool. An electronic component mounting apparatus comprising: a head that chucks an electronic component; a moving unit that moves the head from the supply unit to the pressure-bonding position; and a front-back inverting unit that reverses the head. 2. An ACF sticking device is provided, and the transfer means is
Before picking up the electronic parts of the electronic parts supply section
Transfer to ACF sticking device and stick ACF to electronic parts
After that, transfer to the crimping position by the crimping tool
The electronic component according to claim 1, wherein
Equipment. 3. A support table for supporting the panel, a first crimping tool arranged to face an upper edge of the panel supported by the support table, and a vertical movement for causing the first crimping tool to perform a vertical movement. Means, a first receiving member arranged below the first crimping tool to receive the upper edge from below, a vertical moving means for causing the first receiving member to perform vertical movement, and supported by the support table. A second crimping tool that is arranged to face the lower edge of the panel, a vertical movement means that causes the second crimping tool to move up and down, and a second crimping tool that is arranged above the second crimping tool to move the upper edge. A second receiving member received from above, a vertical moving means for causing the second receiving member to perform vertical movement, the first crimping tool, the first receiving member, the second crimping tool, and the second receiving member. And a moving means for moving the horizontal relative to the panel. An electronic component mounting apparatus characterized by. 4. An electronic component supply unit and an ACF sticking device are provided.
And the transfer means picks up the electronic component of the electronic component supply unit.
And transfer it to the ACF sticking device.
After attaching the ACF to the product, the first crimping tool and the
Transferred to the crimping position by the second crimping tool
The electronic component mounting apparatus according to claim 3, wherein: