JP3400957B2 - Laser synchronization pulse delay device and control method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus and method using a pulse laser, and more particularly to a laser processing apparatus and method suitable for annealing a semiconductor thin film.

[0002]

2. Description of the Related Art As a conventional laser processing method using a pulse laser, for example, laser annealing for converting amorphous Si into polycrystalline Si using an excimer laser is known.

In this type of laser annealing apparatus,
Amorphous Si thin film is superposedly irradiated with a pulsed laser at an appropriate oscillation frequency (Japanese Patent Laid-Open No. 7-2495).
91 publication).

[0004]

In the above laser processing apparatus, various heating of the amorphous Si thin film by the pulse laser is required in order to recrystallize the amorphous Si thin film under desired conditions. Is starting to appear.

In response to such a demand, for example, two laser oscillators are prepared, and a synchronous pulse (so-called "double pulse") in which two types of pulsed laser lights with different intensities and wavelengths output from both laser oscillators are combined. It is conceivable to irradiate the amorphous Si thin film. The pulsed laser light forming such a double pulse is, for example, tens to thousands of ns.
A case may be considered in which they are sequentially generated at time intervals of ec.
In such a case, if the trigger signals are individually applied to the two laser oscillators and they are individually controlled, the precise control of the time interval of the double pulse is caused due to the oscillation characteristics of both laser oscillators and the change over time. It is expected that will not always be easy.

For example, the delay from the input of a trigger signal to the laser oscillator to the oscillation (hereinafter referred to as “oscillation delay”) and the jitter variation which is the variation of each oscillation delay are high voltage for discharge (hereinafter referred to as “HV value”). That is, it often fluctuates according to fluctuations of the oscillation parameter such as the oscillation frequency, and there is a problem that the time interval of the pulsed light forming the double pulse is linked to the change of the oscillation parameter.
Specifically, since the oscillation delay of the laser oscillator changes according to the change of the HV value as described above, there is a function of changing the HV value in the laser oscillator to stabilize the energy of the pulsed laser light. When used, it is considered that the time interval of the pulsed light changes even if the energy of the double pulse stabilizes.

Furthermore, the existence of jitter caused by the characteristics of the trigger circuit, the laser oscillator, etc. cannot be ignored, and it is also necessary to suppress such jitter.

Therefore, the present invention is a laser processing apparatus using a synchronous pulse obtained by synthesizing pulse lasers from two or more laser oscillators, and precise control of the time interval of the pulsed light forming the synchronous pulse is possible. An object of the present invention is to provide a possible laser processing apparatus and method.

[0009]

[Means for Solving the Problems] In order to solve the above problems,
A first laser processing apparatus according to the present invention includes a first laser oscillator that generates pulsed laser light in response to a first trigger signal input, and a pulsed laser light in response to a second trigger signal input. A second laser oscillation device for generating
A delay control unit for generating a second trigger signal based on a trigger signal , wherein the delay control unit is configured to emit the first laser beam.
In response to the trigger signal output from the vibration device,
Generate a Riga signal.

In the above laser processing apparatus, the delay control section receives the trigger signal output from the first laser oscillation apparatus.
Since the second trigger signal is generated, it is possible to reduce the occurrence of jitter as compared with the case where the trigger signal generating circuit is individually provided, and it is possible to further adjust the light emission timings of the first laser oscillator and the second laser oscillator. Be accurate. Where the first
The trigger signal may be derived from an output terminal of a trigger signal generation circuit provided outside the first laser oscillator to start and oscillate the trigger signal. It may be supplied to a switch circuit or the like that applies a voltage. In the latter case, the possibility of jitter generation can be further reduced.

A second laser processing apparatus according to the present invention is a first laser oscillating apparatus for generating pulsed laser light in response to the input of a first trigger signal, and a second laser processing apparatus for receiving a second trigger signal. The second laser oscillator that generates pulsed laser light and the respective time differences from the input of the first and second trigger signals to the generation of the laser light are calculated as operating conditions of the first and second laser oscillators. And a delay control unit having a storage unit that stores the table as a table.

In the above laser processing apparatus, the delay control unit corresponds the respective time differences from the input of the first and second trigger signals to the generation of the laser light to the operating conditions of the first and second laser oscillators. Even if the operating conditions of the first and second laser oscillating devices are changed or fluctuated, the first laser oscillating device and the second laser oscillating device are considered in consideration of oscillation delay and jitter at that time. Since the light emission timing with the device can be adjusted, a precise delay time can be set according to the operating conditions of the first and second laser oscillation devices, and the light emission timing can be adjusted precisely and stably. When the light emission timings of the first and second laser oscillators are adjusted based on the above table, the delay time can be reset each time the operating condition is changed or changed, but until the fixed time elapses. The delay time can be reset after waiting or until the operating condition fluctuates beyond a certain allowable amount.

A third laser processing apparatus according to the present invention includes a first laser oscillator for generating pulsed laser light, a second laser oscillator for generating pulsed laser light, and the first laser oscillator. A photodetector that detects the laser light generated by the laser oscillator, and a delay controller that adjusts the generation timing of the laser light generated by the second laser oscillator based on the detection output of the photodetector. Prepare

In the above laser processing apparatus, since the delay control unit adjusts the generation timing of the laser light generated by the second laser oscillator based on the detection output of the photodetector, the delay controller generates from the first laser oscillator. Since the generation timing of the laser light generated from the second laser oscillation device can be adjusted based on the actual laser light, the light emission timing can be adjusted precisely and stably. In this case, not only may the laser light from the first laser oscillator be used as a trigger to generate the laser light from the second laser oscillator, but the laser light generated by the second laser oscillator may be detected. By further providing a photodetection device for performing the above, it is possible to detect the time difference between the laser light from the first laser oscillation device and the laser light from the second laser oscillation device based on the outputs of these photodetection devices. Can be fed back to the resetting of the delay time when the pair of pulsed lights is generated later.

Also, in the laser processing method according to the present invention, the first trigger signal is input to the first laser oscillator to generate pulsed laser light, and the second trigger signal is input to the second laser oscillator. Pulsed laser light is generated according to the operating conditions of the first and second laser oscillators, and the respective time differences from the input of the first and second trigger signals to the generation of the laser light. The input timing of the first and second trigger signals is controlled on the basis of the stored table.

In the above laser processing method, a table in which the respective time differences from the input of the first and second trigger signals to the generation of the laser light are stored in correspondence with the operating conditions of the first and second laser oscillators. Since the input timings of the first and second trigger signals are controlled based on the above, even if the operating conditions of the first and second laser oscillators are changed or fluctuated, the oscillation delay and jitter at that time are taken into consideration. The emission timings of the first laser oscillator and the second laser oscillator can be adjusted, and precise delay times can be set according to the operating conditions of the first and second laser oscillators. The adjustment is precise and stable.

The above laser processing apparatus and method are
For example, it can be applied to a laser annealing apparatus that heats a semiconductor by depositing an amorphous semiconductor on a substrate with a synchronous pulse to perform laser annealing. In particular, an excimer laser is used as a laser oscillator, and amorphous Si is polycrystallized. It is suitable to be applied to a laser annealing device for converting to Si. Such a laser annealing apparatus is applied to manufacture a TFT for a liquid crystal display device using polycrystalline Si as an active layer.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] A laser processing apparatus according to a first embodiment of the present invention will be described below.
This apparatus is a laser annealing apparatus that heats an amorphous semiconductor by a synchronous pulse to perform laser annealing, and includes a laser oscillator 10 that generates laser light having a desired wavelength and waveform, and laser light from the laser generator 10. A laser irradiation processing unit 20 that actually processes the substrate W by utilizing the above, and a main controller 30 that integrally controls these operations.
The substrate W, which is a workpiece, is made of a glass plate or the like,
An amorphous Si layer which is, for example, an amorphous semiconductor is deposited on the surface of the amorphous Si layer, and the amorphous Si layer becomes a polycrystalline Si layer by the processing with the laser beam.

The laser generator 10 controls the pair of laser oscillators 11 and 12 for generating pulse type laser light and the oscillation timings of the laser oscillators 11 and 12 individually to appropriately control the pair of pulsed lights. An oscillation control device 13, which is a delay control unit for generating a time difference, is provided. Here, the first laser oscillation device 11 is a main laser device which is first irradiated when the substrate W is processed, and the second laser oscillation device 12 is a secondary laser device which is next irradiated when the substrate W is processed. is there. The respective laser lights from the first and second laser oscillators 11 and 12 are appropriately adjusted in time difference and power so as to be optimal for processing the substrate W, and both pulse lights PL are overlapped via the photosynthesis system 70. By combining them, it becomes a synchronous pulse light for processing.

The oscillation control device 13 is composed of a computer, a signal shaping circuit, and the like, and generates a reference pulse generating circuit 51 for generating a reference pulse and a generation interval, that is, a time difference between a pair of pulsed lights PL forming a synchronous pulsed light. The operation timings of the first and second laser oscillators 11 and 12 are set based on signal outputs from the delay time setting circuit 52 and the delay time setting circuit 52 that are set in advance, and a command signal corresponding to this is generated. An arithmetic circuit 53,
A trigger pulse generation circuit 54 that receives the output of the command signal from the arithmetic circuit 53 and generates the first and second trigger signals for oscillating the first and second laser oscillators 11 and 12.
And a first photodetector that photoelectrically converts the laser outputs of the first and second laser oscillators 11 and 12 at high speed.
And a second photosensor 61, 62, a pair of amplifiers 63, 63 for individually amplifying the outputs from the first and second photosensors 61, 62, and a light detection signal from both amplifiers 63, 63. And a delay time detection circuit 55 for detecting a time difference between the two light detection signals.

The delay time setting circuit 52 has a time difference (hereinafter referred to as a set time difference) such that the waveform of the synchronization pulse obtained by superposing the laser beams from the first and second laser oscillators 11 and 12 is optimum for processing the substrate W. t1) is set. Such a set time difference t1 can be set by externally inputting it via a keyboard or the like, or by reading a set value stored in advance according to the type of the substrate W.

The arithmetic circuit 53 is the delay time setting circuit 5
A command signal S2 corresponding to the set time difference t1 set in 2 is generated. Further, based on the output of the measurement time difference t3 from the delay time detection circuit 55, a correction time difference t2 obtained by correcting the set time difference t1 is calculated, and a command signal S2 'corresponding to this set time difference t2 is generated.

The trigger pulse generating circuit 54 is composed of the arithmetic circuit 5
3 receives the command signal S2 (S2 ') output from the signal generator 3, performs appropriate signal processing, and uses the reference pulse from the reference pulse generation circuit 51 as a trigger to generate the first and second laser oscillators 11 and 1.
First and second trigger signals Tr1 for oscillating 2
Tr2 is generated by shifting each by a time difference t1 (t2).

The command signal S2 is output from the arithmetic circuit 53.
Instead of (S2 '), the first and second trigger signals Tr1,
It is also possible to generate a pair of pulses corresponding to Tr2. In this case, the trigger pulse generation circuit 54 incorporates a correction time detection circuit for separating the pair of pulses (corresponding to the first and second trigger signals Tr1 and Tr2) to obtain the correction time t2. The trigger pulse generation circuit 54, based on the output of the correction time detection circuit, outputs the first and second trigger signals Tr.
1, Tr2 will be generated. Further, the output from the arithmetic circuit 53 to the trigger pulse generating circuit 54 may be two lines, and a pair of pulses corresponding to the first and second trigger signals Tr1 and Tr2 may be individually output to the trigger pulse generating circuit 54. . If the time difference between the outputs of the pair of pulses is set to be the correction time t2, the trigger pulse generating circuit 54 outputs the first and second trigger signals Tr1 and Tr2 with a time difference corresponding to the correction time t2. Will be done.

The delay time detection circuit 55 includes both amplifiers 6
A pair of photodetection signals from 3 and 63 are cut out with a predetermined threshold, and the first timing is detected from the difference in the rising timing.
Also, the delay time t3 between the pair of laser beams output from the second laser oscillators 11 and 12 is detected.

The laser irradiation processing section 20 emits the laser beam from the laser generation section 10, and mirrors 71, 72 and a half mirror 73.
Synchronous pulse light synthesized through the photosynthesis system 70 including the above is incident. The laser irradiation processing unit 20 projects a synchronization pulsed light as a beam having a desired cross-sectional shape and energy density distribution onto a substrate W, and a stage 2 that supports the substrate W and moves with the substrate W during scanning.
2 and a stage drive system 2 for controlling the operation of the stage 22
3 and 3.

The synchronizing pulse light projected on the substrate W by the projection optical system 21 is a linear beam extending on one axis of the substrate W. Then, the stage 22 can move the substrate W at a constant speed in a direction orthogonal to the longitudinal direction of the linear beam. Thereby, the synchronous pulsed light can be scanned over the entire surface of the substrate W, and the entire surface of the substrate W can be uniformly laser-annealed.

The operation of the laser processing apparatus shown in FIG. 1 will be described below. The main controller 30 controls the oscillation controller 13 to generate a pair of pulsed lights PL which are deviated from the first and second laser oscillators 11 and 12 by a set time difference t1. The two pulsed lights PL are superimposed on each other via the photosynthesis system 70, and are irradiated onto the substrate W as processing synchronous pulsed lights having a predetermined waveform. Since the synchronizing pulse light is generated by using the reference pulse from the reference pulse generating circuit 51 as a trigger, the irradiation of the synchronizing pulse light onto the substrate W is repeated at a cycle corresponding to the cycle of the reference pulse.

At this time, by monitoring the delay time t3 output from the delay time detection circuit 55, it is possible to know how much the actual delay time t3 deviates from the set time difference t1, and the correction time difference obtained by subtracting this deviation amount Δt. t2 =
Let t1−Δt (= 2 × t1−t3) be the new target value.
This makes it possible to generate a pair of pulsed lights PL that are shifted from the first and second laser oscillators 11 and 12 by a set time difference t1. That is, when the delay time t3 ′ output from the delay time detection circuit 55 exceeds the predetermined upper limit value or the lower limit value due to factors such as the response characteristics of the first and second laser oscillators 11 and 12, changes over time, and the like, a new Correction time difference t2 ′ = t1−Δt ′ obtained by subtracting the deviation amount Δt ′
Is a new target value. By repeating the above, the time interval between the pair of pulsed lights PL forming the synchronous pulsed light can be always kept constant. That is, even if the characteristics of the two laser oscillators 11 and 12 are different and the response time from the trigger to the light emission varies due to changes over time or changes in operating conditions, the synchronous pulsed light with a stable waveform is generated. The substrate W can be irradiated.

FIG. 2 is a diagram for explaining signal processing and the like in the laser processing apparatus of FIG. FIG. 2A is a chart showing the generation state of the reference pulse, and FIG.
Is a command signal S2 (S2 ') for transmitting a time difference t1 (t2)
2C is a chart showing pulses of the first and second trigger signals Tr1 and Tr2,
FIG. 2D shows the first and second laser oscillators 11 and 12.
2 shows the intensities of the pair of pulsed lights PL emitted from the. In FIG. 2D, the symbol A shows the pulsed light PL from the main first trigger signal Tr1 and the symbol B shows the pulsed light PL from the subordinate second trigger signal Tr2.

In the first embodiment described above, the first and second laser oscillators 11 and 12 may be laser devices having substantially the same structure, and different types that output different wavelengths, waveforms, powers, and the like. Laser device. At this time, the number of laser devices to be combined is not limited to two, and a synchronized pulsed light composed of three or more pulsed lights is formed by adjusting the pulsed light generation timing of three or more laser devices. can do.

Further, the set time difference t1 set by the delay time setting circuit 52 does not need to be set to be longer than the time width of the pulsed light PL output by both oscillators 11 and 12, and both oscillators 11 and 12 output. The pair of pulsed lights PL can be synchronized pulsed lights that temporally overlap each other.

The first and second laser oscillators 11,
Instead of the first and second photosensors 61 and 62 that individually detect 12 laser outputs, the sync pulse light itself is photoelectrically converted by a single photosensor to form the sync pulse light. It is also possible to detect the generation time shift of each pulsed light PL that is generated.

As the feedback control performed by the delay time detecting circuit 55 and the arithmetic circuit 53, needless to say, various controls utilizing the classical control theory called PID can be performed, of course, required accuracy, etc. It is also possible to make control that makes full use of modern control theory.

Further, the projection optical system 21 makes the synchronous pulsed light a linear beam extending on one axis of the substrate W,
The present invention is not limited to this, and the synchronous pulsed light is projected as a spot-shaped beam onto the substrate W, or the substrate W is formed as an area-shaped beam that substantially covers the entire surface of the substrate W.
It can be projected on.

[Second Embodiment] The laser processing apparatus of the second embodiment will be described below. This laser processing apparatus is a modified example of the apparatus of the first embodiment, and the structure of the laser generator is mainly different from that of the first embodiment.

FIG. 3 is a block diagram for explaining the structure of the laser generator 110. The laser generator 110 is a pair of laser oscillators that generate pulsed light PL.
And the second pulse laser oscillators 111 and 112, and the oscillation control device 113 that is a delay control unit that individually controls the oscillation timings of the pulse laser oscillators 111 and 112 to generate a pair of pulsed lights PL with an appropriate time difference. Prepare

The oscillation control device 113 generates a reference pulse and sets a generation interval, that is, a time difference between the pair of pulsed lights PL which become the synchronous pulsed lights.
And a first trigger signal Tr1 for oscillating the first pulse laser oscillator 111 in response to the output of the controller 81.
Waveform generator 82, which is a trigger pulse generation circuit for generating
And a trigger delay circuit 83 for generating a second trigger signal Tr2 by delaying the first trigger signal Tr1 by a predetermined time.
And photodetectors 161, 162 for photoelectrically converting the laser outputs of the first and second pulse laser oscillators 111, 112 to output as photodetection signals, and photodetection signals for receiving photodetection signals from the photodetectors 161, 162. And a pulse interval measuring device 155 for detecting the time difference of

First and second pulse laser oscillators 111,
For example, a XeCl excimer laser is used for 112, and in this case, the pulse width is about 10 to 50 nsec.

First and second pulse laser oscillators 111,
The oscillation delay of 112, that is, the delay time from the trigger input to the laser to the oscillation (pulse emission) and the jitter thereof vary depending on these oscillation parameters. In the present embodiment, the oscillation delay variation range is set to about 200 nsec for the first pulse laser oscillator 111 and about 50 nsec for the second pulse laser oscillator 112, for example. In addition, the first and second pulse laser oscillators 11
Nos. 1 and 112 have the function of automatically changing the HV value during oscillation and stabilizing the pulse energy.

The controller 81 can be constituted by a computer or the like, and includes the first and second pulse laser oscillators 1
11, 112, the waveform generator 82, and the trigger delay circuit 8
3 and the function of connecting and communicating with the pulse interval measuring device 155. The controller 81 also has a function of communicating with a higher-order controller (corresponding to the main controller 30 in FIG. 1). A storage medium that functions as a storage unit is provided in the controller 81. The storage medium corresponds to oscillation parameters that define the operating conditions of the pulse laser oscillators 111 and 112, that is, each HV voltage and each oscillation frequency. The oscillation delay values are stored in the form of a table. This oscillation delay value is based on the rising timing of the trigger signal input to each pulse laser oscillator 111, 112 and each pulse laser oscillator 111, 112.
This is equivalent to a statistically summarized time difference from the rising timing of the pulsed light output from the device.

The waveform generator 82 generates the first trigger signal Tr1 to the first pulse laser oscillator 111. In addition,
The trigger signal Tr1 is input to a trigger circuit (not shown) provided as an interface with an external device in the first laser oscillator 111. This trigger circuit outputs a signal Tr1 ′ to the trigger delay circuit 83.

The trigger delay circuit 83 is composed of a high-speed digital counter circuit, an amplifier and the like, and outputs a delayed signal obtained by delaying the input signal by a certain set time. This delay time is 0 to 1 s in units of several psec.
The controller 81 can be set within the range of ec
It can be changed as appropriate based on the instructions from. That is, the trigger delay circuit 83 includes the first pulse laser oscillator 1
In response to the trigger signal Tr1 ′ output from the trigger circuit 11 of FIG. 11, the trigger signal T to the second pulse laser oscillator 111 is received.
Generate r2.

The photodetectors 161 and 162 are attached so as to face the back surfaces of the mirrors arranged for bending the optical path on the paths of the pulsed light PL emitted from the first and second pulse laser oscillators 111 and 112, respectively.
When the leaked light from the rear surface of the mirror is incident, it outputs a voltage value or a current value according to the light intensity. Each of the photodetectors 161 and 162 is composed of a photodiode capable of high-speed response, and its rising speed is 1n.
Within sec. These photo detectors 161,
The light detection signal from 162 is connected to the pulse interval measuring device 155 in order to measure the laser emission timing of the first and second pulse laser oscillators 111 and 112.

The pulse interval measuring device 155 receives the pulsed photodetection signals output from the photodetectors 161 and 162 in real time, measures the time interval between these pulsed photodetection signals, and outputs the result. Output to the controller 81. The time difference between the two pulse signals, which will be described in detail below, is used to adjust the light emission timings of the first and second pulse laser oscillators 111 and 112.

The operation of the apparatus shown in FIG. 3 will be described below. When the processing is started, first, the pulse time interval Td of the pair of pulsed lights PL forming the synchronous pulsed light necessary for the processing
And the HV value and oscillation frequency f of the first and second pulse laser oscillators 111 and 112 are determined (step S
1).

Next, the controller 81 sets the set H
The oscillation delay value corresponding to the V value and the oscillation frequency f is set to the second
The pulse laser oscillators 111 and 112 are read from the table (step S2). Hereinafter, the oscillation delay value on the first pulse laser oscillator 111 side will be referred to as a first laser oscillation delay value Td1, and the oscillation delay value on the second pulse laser oscillator 112 side will be referred to as a second laser oscillation delay value Td2.

Next, the controller 81 calculates the delay time Ts to be set in the trigger delay circuit 83 based on the target pulse time interval Td and the first and second laser oscillation delay values Td1 and Td2 ( Step S3). This delay time Ts is calculated by the following equation. Ts = Td1 + Td-Td2-Tc Here, the fourth term Tc is a value obtained by subtracting only the delay amount in advance in consideration of the delay inside the trigger delay circuit 83.

After setting Ts equal to or less than the delay time in the trigger delay circuit 83, the controller 81 causes the first and second pulse laser oscillators 111 and 112 to start oscillation (step S4). First and second pulsed laser oscillator 11
Assuming that 1 and 112 are operating ideally, the pulse time interval T from both pulse laser oscillators 11 and 12 is
A pair of pulsed lights PL accurately displaced by d should be generated. The two pulsed lights PL are superimposed on each other via the photosynthesis system 70 shown in FIG. 1 and are irradiated onto the substrate W as processing synchronous pulsed lights having a predetermined waveform.

A pair of pulsed light PL from each of the pulsed laser oscillators 111 and 112 is a pair of photodetectors 1.
The light detection signals observed at 61 and 162 are input to the pulse interval measuring device 155 in real time,
5 measures the time interval Tm of the pulsed lights PL based on the pair of photodetection signals (step S5).

The controller 81 uses the pulse interval measuring device 1
The time interval Tm measured at 55 is received at a constant pulse number interval, and when the desired pulse number is reached, the average delay time Tma is calculated by averaging the time intervals Tm sampled until then (step S6). Further, the controller 81 uses the average delay time Tma and the target pulse time interval Td.
And the first and second laser oscillation delay values Td1,
The delay time Ts 'to be set in the trigger delay circuit 83 is calculated based on Td2, and this delay time Ts' is set in the trigger delay circuit 83 (step S7).

Hereinafter, the operations of steps S4 to S7 described above are repeated until the processing of the substrate is completed.

FIG. 4 is a timing chart for explaining the operation timing of the device of FIG. 4A shows the trigger signal Tr1 output from the waveform generator 82, FIG. 4B shows the pulsed light PL emitted from the first pulse laser oscillator 111, and FIG. 4 shows the trigger signal Tr2 output from the trigger delay circuit 83, and FIG.
(D) shows pulsed light PL emitted from the second pulsed laser oscillator 112. As apparent from the figure, if the delay time Ts is set in the trigger delay circuit 83, theoretically, the desired pulse time interval Td (= Td2-Td1 + Ts) is obtained.
It can be seen that + Tc).

Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above embodiments. For example, although the substrate is annealed by using the excimer laser in the second embodiment, polysilicon or the like can be annealed by using a laser beam other than the excimer laser. Further, the purpose of processing is not limited to the application to annealing for producing polysilicon for liquid crystal substrates, but can be applied to the annealing of constituent materials such as various semiconductor materials.

In addition, the laser devices 11 and 1 of the above embodiment
By appropriately changing ₂ , 111, 112 to a YAG laser, a C02 laser, or the like, a pulse laser processing apparatus that enables not only annealing of material but also cutting / welding can be realized.

[0056]

As is apparent from the above description, according to the first laser processing apparatus of the present invention, the delay control section receives the trigger signal output from the first laser oscillation apparatus.
Since the second trigger signal is generated, it is possible to reduce the occurrence of jitter as compared with the case where the trigger signal generating circuit is individually provided, and it is possible to further adjust the light emission timings of the first laser oscillator and the second laser oscillator. Be accurate.

Further, according to the second laser processing apparatus, the delay control section determines the respective time differences from the input of the first and second trigger signals to the generation of the laser light by the first and second laser oscillations. Since it is stored as a table corresponding to the operating conditions of the device, even if the operating conditions of the first and second laser oscillating devices are changed or fluctuated, the first laser oscillation is taken into consideration in consideration of oscillation delay and jitter at that time. Device and second
Since the emission timing with the laser oscillator can be adjusted,
The delay time can be set accurately according to the operating conditions of the first and second laser oscillators, and the light emission timing can be adjusted precisely and stably.

Further, according to the third laser processing apparatus, the delay control section adjusts the generation timing of the laser light generated by the second laser oscillation apparatus based on the detection output of the photodetection apparatus. Since the generation timing of the laser light generated from the second laser oscillation device can be adjusted based on the actual laser light generated from the one laser oscillation device, the light emission timing can be adjusted precisely and stably.

Further, according to the laser processing method of the present invention, the respective time differences from the input of the first and second trigger signals to the generation of the laser light are determined by the operating conditions of the first and second laser oscillators. Since the input timings of the first and second trigger signals are controlled based on the table stored in association with the above, even if the operating conditions of the first and second laser oscillation devices are changed or fluctuated, The first laser oscillator and the second laser oscillator in consideration of the oscillation delay and jitter of
The light emission timing with the laser oscillator can be adjusted, and the precise delay time can be set according to the operating conditions of the first and second laser oscillators, and the emission and emission timing can be adjusted precisely and stably. .

[Brief description of drawings]

FIG. 1 is a diagram illustrating a structure of a laser processing apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating an operation of the laser processing apparatus of FIG.

FIG. 3 is a diagram illustrating a structure of a main part of a laser processing apparatus according to a second embodiment.

FIG. 4 is a diagram illustrating an operation of the laser processing apparatus of FIG.

[Explanation of symbols]

10 Laser generator 11 First Laser Oscillator 12 Second laser oscillator 13 Oscillation control device 20 Laser irradiation processing unit 21 Projection optical system 22 stages 23 Stage drive system 30 Main controller 51 Reference pulse generator 52 Delay time setting circuit 53 arithmetic circuit 54 Trigger pulse generation circuit 55 Delay time detection circuit 61,62 Photo sensor 70 Photosynthesis system 81 controller 82 Waveform generator 83 Trigger delay circuit 110 Laser generator 111 First laser oscillator 112 Second laser oscillator 113 Oscillation control device 155 pulse interval measuring instrument 161,162 Photo detector W board

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B23K 26/00-26/42

Claims (4)

(57) [Claims] 1. A first laser oscillator that generates pulsed laser light in response to input of a first trigger signal, and a second laser oscillator that generates pulsed laser light in response to input of a second trigger signal. A laser processing apparatus comprising: an apparatus; and a delay control unit that generates the second trigger signal based on the first trigger signal.
The delay control unit outputs the output from the first laser oscillator.
The second trigger signal is received.
A laser processing apparatus characterized by being a thing. 2. A first laser oscillating device for generating pulsed laser light in response to input of a first trigger signal, and a second laser oscillating device for generating pulsed laser light in response to input of a second trigger signal. And a storage unit that stores a time difference between the input of the first and second trigger signals and the generation of the laser light as a table corresponding to the operating conditions of the first and second laser oscillators. A laser processing apparatus comprising: a delay control unit. 3. A first laser oscillating device for generating a pulsed laser beam, a second laser oscillating device for generating a pulsed laser beam, and the laser beam generated by the first laser oscillating device. A laser processing apparatus comprising: a photodetector; and a delay controller that adjusts the generation timing of the laser light generated by the second laser oscillator based on the detection output of the photodetector. 4. A first trigger signal is input to the first laser oscillator to generate pulsed laser light, and a second trigger signal is input to the second laser oscillator to generate pulsed laser light. A laser processing method, which is based on a table in which respective time differences from the input of the first and second trigger signals to the generation of the laser light are stored in association with the operating conditions of the first and second laser oscillators. And controlling the input timing of the first and second trigger signals.