JP3401432B2 - Substrate transfer device and substrate transfer method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus and method for transferring a substrate such as a semiconductor wafer or an LCD glass substrate into and out of a processing section.

[0002]

2. Description of the Related Art Generally, in a manufacturing process of a liquid crystal display (LCD), photolithography is used to form a circuit, an electrode pattern and the like on a substrate such as a glass substrate. In this photolithography, a series of processes such as cleaning, drying of the substrate, formation of a resist film on the substrate, exposure of the resist film, and development are performed. Then, in the processing apparatus for performing each of these processes, the substrates taken out from the cassette placed in the cassette station are carried one by one to the processing unit while being mounted on the arm,
Processing such as cleaning is sequentially performed on each substrate. In addition, the substrate for which the processing in each processing unit has been completed is carried again while being placed on the arm and returned to the cassette.

By the way, if, for example, the portion supporting the substrate before cleaning and the portion supporting the substrate after cleaning are the same on the upper surface of the arm, contaminants attached to the rear surface of the substrate when the substrate before cleaning is placed. There is a problem that contaminants are attached to the supporting means via the upper surface of the arm, and when the cleaned substrate is placed on the arm and conveyed, the contaminants are redeposited on the back surface of the cleaned substrate. Therefore, as a means for solving this problem, for example, a substrate transfer device disclosed in Japanese Patent Laid-Open No. 5-152266 is disclosed. That is, this Japanese Patent Laid-Open No. 5-152226
In the substrate transfer device of No. 6, the substrate take-out arm that takes out the uncleaned substrate from the cassette to the cleaning unit and the processed substrate storage arm that returns the cleaned substrate in the cleaning unit into the cassette are provided as separate mechanisms. It prevents the reattachment of pollutants.

[0004]

However, in the case where the substrate take-out arm and the processed substrate storing arm are constituted by different mechanisms like this substrate transfer apparatus, the taking-out arm and the storing arm are separately required in the end. In addition, the drive mechanism for switching between the take-out arm and the storage arm is relatively large, and the structure is complicated. Further, since the entire arm turns along with the switching operation, a considerably large space for moving the arm is required, and there is a problem that the device space cannot be effectively used.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate transfer device and method which can reliably prevent redeposition of contaminants on a substrate while having a simple structure.

[0006]

In order to achieve the above object, the invention according to claim 1 provides a first supporting means on the upper surface of the arm.
And second supporting means are arranged and these first supporting means are arranged.
Means and second supporting means are respectively supported by the lifting mechanism
However, the elevating mechanism includes a first supporting means and a second supporting means.
A belt inserted below, and
It is characterized in that a thick portion that is relatively thick is provided . In this case, the supporting means is a suction pad.
You may.

According to the substrate transfer apparatus of the first aspect,
When the unprocessed substrate is taken out from the cassette and conveyed to the processing section, the lower surface of the substrate is supported by, for example, the first supporting means. When the processed substrate is returned to the cassette in the processing unit, the lower surface of the substrate is supported by, for example, the second supporting means. In this way, by supporting the unprocessed substrate and the processed substrate by different supporting means on the upper surface of the same arm, it becomes possible to easily prevent reattachment of contaminants.

According to the invention of claim 3, the arm is moved to
The substrate is loaded into and unloaded from the processing unit while it is placed on the arm.
First substrate supporting device for supporting a substrate
The second supporting means and the second supporting means on the upper surface of the arm.
Together with one of the first support means and the second support means
Is configured to be movable up and down, and the first support means and the second support are
When one of the holding means is raised, the first supporting means and the second
One of the supporting means of the
When one of the steps and the second support means is lowered, the first support is
One of the holding means and the second support means will be lower than the other
Of the first supporting means and the second supporting means.
One side is supported on the upper surface of the diaphragm, and the diaphragm
The pressure adjusting chamber is formed on the lower surface side. Claim
According to the invention of Item 4, the arm is moved and placed on the arm.
Substrate transfer device that transfers substrates in and out of the processing unit
At the upper surface of the arm, a seesaw-shaped swing member is placed
However, when the first support means is formed on one end side of the swing member,
A second supporting means is formed on the other end side of the swinging member.
By swinging the swinging member in the clockwise direction, the first support
The means moves to a position higher than the second supporting means,
By swinging the moving member in the counterclockwise direction, the first support
So that the means move to a higher position than the second support means
It is characterized by being configured. The invention of claim 5 is
Move the robot and place it on the arm with respect to the processing unit.
In the substrate transfer device that loads and unloads the substrate,
A seesaw-shaped rocking member is placed on the upper surface, and one end of the rocking member
The first support means is formed on the side and the other end of the swing member is formed.
The second supporting means is formed on the side and the swing member is pulled by a pulling force.
The spring that rotates clockwise and the extension operation of the cylinder
Fit the lower surface of the other end of the swinging member and resist the tensile force.
And a wedge member for rotating the swinging member counterclockwise.
It is characterized by having. In these cases, the first
At least one of the support means and the second support means is attached to the suction pad.
It may be configured with a code.

According to a seventh aspect of the present invention, in a substrate transfer device for moving an arm and loading and unloading a substrate to and from a processing unit in a state where the arm is placed on the arm, a seesaw-shaped swinging member is provided on an upper surface of the arm. The first suction pad is mounted on one end of the swing member, and the second suction pad is mounted on the other end of the swing member. The upper surface is for the rocking member to rock.
It is characterized in that it is formed with a tapered surface that is low on the outside and high on the inside with respect to the shaft .

[0010]

[0011]

The substrate transfer method of the present invention is a substrate transfer method in which an arm is moved, and a substrate is carried in and out of a processing unit while being placed on the arm. First supporting means for supporting the substrate. And the second supporting means are arranged on the upper surface of the arm, and one of the first supporting means and the second supporting means is supported on the upper surface of the diaphragm, and the pressure adjusting chamber provided on the lower surface side of the diaphragm is When one of the first supporting means and the second supporting means is raised by pressurizing or depressurizing, one of the first supporting means and the second supporting means becomes higher than the other, and When one of the supporting means and the second supporting means is lowered, one of the first supporting means and the second supporting means is made lower than the other, and when the substrate is carried into the processing section, One of the first support means and the second support means Supporting the substrate in themselves, when unloading the substrate from the processing unit, characterized by supporting the substrate only in the other of the first supporting means and second supporting means.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described based on a cleaning apparatus 1 for cleaning a substrate W as an object to be processed. FIG. 1 is a plan view of a cleaning apparatus 1 for cleaning a substrate W such as a semiconductor wafer or LCD glass substrate. The cleaning device 1 includes a substrate transfer device 2 according to the embodiment of the present invention. On both sides of the substrate transfer device 2, a cassette station 3 and a cleaning unit 4 are arranged to face each other.

At the cassette station 3, a cassette C carried in by a not-shown transfer robot or the like is placed. Inside the cassette C, a plurality of substrates W are accommodated in a horizontal posture in a state of being aligned in parallel at predetermined intervals. The substrate W is, for example, a disc-shaped semiconductor wafer or a rectangular LCD glass substrate.

A transport path 10 is formed at the center of the cleaning section 4, and the main transport arm 11 moves along the transport path 10. In the illustrated example, the transport path 10
Scrubber units 15 and 16 for cleaning the substrate W by using various chemicals such as pure water, aqueous ammonia solution, aqueous hydrogen peroxide solution, and aqueous hydrogen fluoride solution are disposed on one side. Further, on the other side of the transport path 10, drying units 12, 13, 14 for drying the substrate W are provided.
Are arranged. Then, the substrate W is moved to each of the units 12 to 1 while the main transfer arm 11 moves along the transfer path 10.
Each cleaning process is performed on the substrate W by transporting it to the substrate 6 in a predetermined order.

The substrate transfer device 2 includes an arm 21 attached to the front surface of the base 20. As described below, in the substrate transfer device 2, the base 20 moves in the XY directions shown in FIG. 1 and moves up and down in the vertical direction.
It is configured to rotate about a vertical axis. Then, according to the movement of the base 20, the substrate W before cleaning is taken out from the cassette C placed on the cassette station 3, and the substrate W is transferred while being placed on the arm 21, and the main transfer arm of the cleaning section 4 is carried out. And hand it over to 11,
The substrate W already cleaned in the cleaning unit 4 is received from the main transfer arm 11 and transferred while being placed on the arm 21,
The configuration is such that the cassette is returned to the cassette C of the cassette station 3.

The base 20 has an advancing / retreating mechanism 22 for moving the base 20 horizontally in the X-axis direction to move the arm 21 forward and backward with respect to the cassette C in the posture shown in FIG.
A rotation elevating mechanism 23 for rotating and elevating the arm 21 by rotatably and vertically elevating the lower surface of the advancing / retreating mechanism 22, and a rail 24 provided below the rotational elevating mechanism 23 and provided in the Y-axis direction. It is supported by a lateral movement mechanism 25 that moves the arm 21 in the lateral direction by traveling along. The advancing / retreating mechanism 22, the rotary elevating / lowering mechanism 23, and the lateral moving mechanism 25 cooperate to raise the arm 21 in a state that the arm 21 is fitted in the cassette C placed on the cassette station 3. The substrate W before cleaning can be taken out from the inside of C. And
The substrate W taken out in this way is transferred while being placed on the arm 21, and is transferred to the main transfer arm 11 of the cleaning section 4 which is on standby behind the substrate transfer device 2. When the substrate W already cleaned in the cleaning unit 4 is returned to the cassette C, the main transfer arm 11 places the substrate W on the arm 21 and then transfers the substrate W while placing it on the arm 21. Cassette C of cassette station 3
It is supposed to be returned inside.

The upper surface of the arm 21 is provided with a first support means 31 and a second support means 32 arranged at least at three or more locations. Although the specific configuration will be described later, these first supporting means 31 and second supporting means 32 are provided.
Is a state in which the lower surface of the substrate W is supported only by the first supporting means 31 without contacting the second supporting means 32 on the upper surface of the arm 21 and the first supporting means 31 on the upper surface of the arm 21. The configuration is such that the lower surface of the substrate W can be supported by only the second supporting means 32 without contact.

FIG. 3 is a perspective view of an arm 21 suitable for carrying a substrate W such as a semiconductor wafer having a disk shape. As shown, this arm 21 is
It is constituted by a single plate member 35 attached to the front surface of the above, and on its upper surface, first supporting means 31 and second supporting means 32 are provided at three places respectively. Further, guides 36 and 37 for positioning the peripheral edge of the substrate W such as a semiconductor wafer are provided at the front end and the base end of the plate member 35. The lower surface of the substrate W positioned between the guides 36, 37 is supported on the upper surface of the plate member 35 only by the first supporting means 31 and by the second supporting means 32 only. It can be switched.

FIG. 4 is a perspective view of an arm 21 suitable for carrying a substrate W such as an LCD glass substrate having a rectangular shape. As shown, this arm 21 is
It is constituted by two arm members 38 attached to the front surface of 0, and the upper surface thereof has a first supporting means 31 and a second supporting means 32 arranged at three places respectively.
However, there are 6 places in total. Then, on the upper surfaces of these two arm members 38, it is possible to switch between a state in which the lower surface of the substrate W is supported only by the first supporting means 31 and a state in which the lower surface is supported only by the second supporting means 32. There is.

As described above, the shape of the arm 21 can be freely configured, such as one plate member 35 and two arm members 38. Further, the first supporting means 31 and the second supporting means 32 may be arranged at least at three or more positions on the upper surface of the arm 21 so that the lower surface of the substrate W can be stably supported.

In the cleaning apparatus 1 shown in FIG. 1, first, the cassette C carried in by a transfer robot or the like is placed on the cassette station 3. Inside the cassette C, the substrates W that have not been cleaned are stored in a plurality of stages arranged in parallel.

Next, the work of taking out the substrate W from the inside of the cassette C is started by the arm 21 of the substrate transfer device 2. When the substrate W that has not been cleaned is taken out from the cassette C in this manner, the lower surface of the substrate W can be supported on the upper surface of the arm 21 only by the first supporting means 31. Then, the arm 21 is moved by the cooperation of the advancing / retreating mechanism 22, the rotary elevating mechanism 23, and the lateral movement mechanism 25 described in FIG. 2, and the arm 21 is fitted into the cassette C placed on the cassette station 3, The arm 21 is raised. Thus, the lower surface of the substrate W stored in the cassette C is attached to the first supporting means 3
The substrate W is supported by only 1 and is picked up from below to be received on the arm 21. Then, the substrate W thus received on the arm 21 is taken out from the cassette C.

Next, while the lower surface of the substrate W thus taken out is supported on the arm 21 only by the first supporting means 31, the advancing / retreating mechanism 22, the rotating / elevating mechanism 23 and the lateral moving mechanism 25 cooperate with each other. Transported by
The substrate W is transferred to the main transfer arm 11 of the cleaning unit 4 which is on standby behind the substrate transfer device 2. The substrate W thus transferred is transferred to the units 12 to 16 of the cleaning unit 4 in a predetermined order by the movement of the main transfer arm 11,
Each cleaning process is performed on the substrate W. Then, the substrate W for which the cleaning process in the cleaning unit 4 has been completed is in a state of being placed on the main transfer arm 11 of the cleaning unit 4 and standing by behind the substrate transfer device 2.

Next, when returning the substrate W, which has been subjected to the cleaning process in the cleaning unit 4 to the inside of the cassette C, the lower surface of the substrate W can be supported on the upper surface of the arm 21 only by the second supporting means 32. To do. The arm 21 is moved by the cooperation of the advancing / retreating mechanism 22, the rotation elevating / lowering mechanism 23, and the lateral movement mechanism 25 described with reference to FIG. 2, and stands by in the posture mounted on the main transfer arm 11 behind the substrate transfer device 2. After the arm 21 is positioned below the existing substrate W, the arm 21 is raised. In this way, the lower surface of the substrate W placed on the main transfer arm 11 is supported only by the second supporting means 32, and the substrate W is picked up from below and received on the arm 21.

The advancing / retreating mechanism 22 and the rotary elevating mechanism 23
The arm 21 is moved by the cooperation of the lateral movement mechanism 25, the substrate W received on the arm 21 is transported, and the substrate W is returned to the cassette C mounted on the cassette station 3. Then, when the cleaning process for the substrates W stored in the cassette C is completed by repeating the above steps, the cassette C is unloaded from the cassette station 3 by the transfer robot or the like.

Thus, according to the substrate transfer apparatus 2 of this embodiment, when the substrate W is transferred between the cassette C placed on the cassette station 3 and the main transfer arm 11 of the cleaning unit 4, before cleaning. The substrate W of the first support means 31
Since the substrate W after cleaning is supported only by the second supporting means 32, even if contaminants adhere to the first supporting means 31 from the lower surface of the substrate W before cleaning, There is no fear of reattachment to the cleaned substrate W. In the substrate transfer device 2 of this embodiment,
The substrate W before cleaning is supported only by the second supporting means 32 and is transferred from the cassette C to the main transfer arm 11, and the substrate W after cleaning is supported only by the first supporting means 31 from the main transfer arm 11. Even if it is configured to be transported to the cassette C, it becomes possible to prevent the reattachment of contaminants in the same manner.

The specific structures of the first supporting means 31 and the second supporting means 32 that are preferably used in the substrate transfer apparatus 2 of the present invention will be described below.

5, FIG. 8 and FIG. 11 are all fluid storage chambers 53 as pressure adjusting means below both the first supporting means 51 and the second supporting means 52 arranged on the upper surface of the arm 21. , 54 are arranged respectively. Although only one first support means 51 and one second support means 52 are shown in FIGS. 5, 8 and 11 for the sake of explanation, the upper surface of the arm 21 has the same structure. First support means 51 and second support means 5
2 is arranged at least three or more.

Both the first support means 51 and the second support means 52 shown in FIG. 5 are bellows-shaped expansion / contraction cases 55 and 56.
It is composed of the upper surface of the
A fluid such as air can be supplied to the fluid reservoir chambers 53 and 54 formed inside the valves 5 and 56 as pressure adjusting means through the circuits 57 and 58. Further, in this embodiment, the substrate W before cleaning is placed on the arm 21.
When it is placed on the top and conveyed, as shown in FIG. 6, the expansion case 55 is expanded upward by supplying the fluid to the fluid reservoir chamber 53 through the circuit 57, and the first support means 51 is provided.
Is made higher than the second supporting means 52, and the lower surface of the substrate W is supported only by the first supporting means 51.
Further, when the cleaned substrate W is transferred, as shown in FIG. 7, the fluid is supplied to the fluid reservoir chamber 54 through the circuit 58 to expand the expandable case 56 upward so that the second support means is formed. 52 is made higher than the first supporting means 51, and the lower surface of the substrate W is supported only by the second supporting means 52.

The first support means 51 and the second support means 52 shown in FIG.
It is configured on the upper surface of 1, and these pistons 60, 61
A fluid such as air can be supplied to the fluid reservoir chambers 53 and 54 as pressure adjusting means formed on the lower surface side of the through the circuits 57 and 58. Then, in this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, as shown in FIG. 9, the fluid is supplied to the fluid reservoir chamber 53 through the circuit 57. As a result, the piston 60 is raised to make the first supporting means 51 higher than the second supporting means 52, and the lower surface of the substrate W is supported only by the first supporting means 51. Further, when the substrate W after cleaning is transferred, as shown in FIG. 10, the fluid is supplied to the fluid reservoir chamber 54 via the circuit 58 to raise the piston 61 and move the second support means 52 to the first position. The height is made higher than that of the first supporting means 51, and the lower surface of the substrate W is supported only by the second supporting means 52.

The first supporting means 51 and the second supporting means 52 shown in FIG. 11 are both constituted by the upper surfaces of bag-shaped inflating members 65 and 66 provided on the upper surface of the arm 21. In the fluid reservoir chambers 53 and 54 as pressure adjusting means formed inside the members 65 and 66, the circuit 57,
A fluid such as air can be supplied via 58. Further, in this embodiment, when the uncleaned substrate W is placed on the arm 21 and conveyed, as shown in FIG. 12, the fluid is supplied to the fluid reservoir chamber 53 through the circuit 57. As a result, the expansion member 65 is expanded upward so that the first supporting means 51 is higher than the second supporting means 52, and the lower surface of the substrate W is supported only by the first supporting means 51. Further, when the cleaned substrate W is transferred, the circuit 5 is placed in the fluid reservoir 54 as shown in FIG.
By supplying a fluid via 8, the expansion member 66 is expanded upward so that the second supporting means 52 is moved to the first supporting means 5
1, and the lower surface of the substrate W to the second supporting means 52.
It is supposed to be supported by only.

Similarly, according to the embodiments shown in FIG. 5, FIG. 8 and FIG.
By supporting the lower surface of the substrate by switching between the first supporting means 51 and the second supporting means 52, the contaminants adhering to the first supporting means 51 from the substrate W before cleaning are reattached to the substrate W after cleaning. It becomes possible to prevent it. The substrate W before cleaning is supported only by the second supporting means 52,
The substrate W after cleaning may be supported only by the first supporting means 51. Further, in the same manner as the embodiment shown in FIGS. 5, 8 and 11, below both the first supporting means 51 and the second supporting means 52 (the fluid reservoir chamber 53 as the pressure adjusting means). , Instead of 54)
In the state where the decompression chambers as the decompression means are respectively arranged and the decompression chamber below the first support means 51 is decompressed, the second support means 52 becomes higher than the first support means 51, and the second support means 52 The first supporting means 51 may be higher than the second supporting means 52 in a state where the pressure in the lower decompression chamber is reduced.

Next, in FIG. 14, the first suction pads 71 and the second suction pads 72 are arranged at three or more positions on the upper surface of the arm 21, and the first suction pads 71 are arranged.
And the second suction pad 72 are supported by the lifting mechanisms 73 and 74, respectively.

Here, FIG. 15 shows an embodiment in which the lifting mechanisms 73, 74 are composed of cylinders 75, 76. Further, in this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, the cylinder 75 is extended to move the first suction pad 71 as shown in FIG. To raise the first suction pad 71
Is made higher than the second suction pad 72, and the lower surface of the substrate W is sucked only by the first suction pad 71. Further, when the substrate W after cleaning is transferred, as shown in FIG. 17, the cylinder 76 is extended to raise the second suction pad 72 to raise the second suction pad 7.
2 is made higher than the first suction pad 71, and the lower surface of the substrate W is sucked only by the second suction pad 72.

Further, FIG. 18 shows the lifting mechanisms 73 and 74,
Bags 77 and 78 that expand by the supply of fluid to lift the first suction pad 71 and the second suction pad 72, respectively.
The embodiment shown in FIG. As shown in FIG. 19, each of these bag bodies 77 and 78 has a sealed bag shape having an opening 79 in the center, and an inflow port 80 thereof.
By introducing air, for example, from the bag 77, 7
8 can be inflated. Then, in this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, as shown in FIG.
To raise the first suction pad 71 and raise the first suction pad 71 higher than the second suction pad 72 so that the lower surface of the substrate W is sucked only by the first suction pad 71. Has become. Further, when the cleaned substrate W is transferred, as shown in FIG. 21, a fluid is supplied into the bag body 78 to expand the bag body 78 and raise the second suction pad 72, The second suction pad 72 is made higher than the first suction pad 71 so that the lower surface of the substrate W is sucked only by the second suction pad 72.

Further, FIG. 22 shows the lifting mechanisms 73 and 74,
The first suction pad 71 and the second suction pad 72 are tensioned by the shortening operation of the cylinders 85 and 86.
In the illustrated embodiment, the strips 87 and 88 are used to raise the belts respectively. In addition, in FIG. 22, both the cylinders 85 and 86 are in the extension operation, whereby the strips 87 and 88 both relax and the first suction pad 7 is released.
Both the first and second suction pads 72 are in a state of being lowered by their own weight. Then, in this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, as shown in FIG. 23, the cylinder 85 is shortened to tension the band 87. Then, the first suction pad 71 is raised, the first suction pad 71 is made higher than the second suction pad 72, and the lower surface of the substrate W is sucked only by the first suction pad 71. . Further, when the substrate W after cleaning is transferred, as shown in FIG.
8 is raised to raise the second suction pad 72 so that the second suction pad 72 is higher than the first suction pad 71 so that the lower surface of the substrate W is sucked only by the second suction pad 72. It has become.

Further, FIG. 25 shows the lifting mechanisms 73 and 74,
It shows an embodiment constituted by a belt 90 inserted below the first suction pad 71 and the second suction pad 72. The belt 90 is wound around a driving roller 91 and a driven roller 92 mounted on the arm 21 so as to rotate. Further, the belt 90 is provided with a thick portion 93 formed relatively thicker than the other portions, and the thick portion 93 is fitted below the first suction pad 71 by the circumferential movement of the belt 90. Then, the first suction pad 71 is pushed up, and the thick portion 93 causes the second suction pad 72 to move.
And the second suction pad 72 is pushed up to switch to a state in which the second suction pad 72 is pushed up. In this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, the thick portion 93 is placed below the first suction pad 71 as shown in FIG. The first suction pad 71 is inserted and pushed up to make the first suction pad 71 higher than the second suction pad 72 so that the lower surface of the substrate W is sucked only by the first suction pad 71. Has become. Further, when carrying the substrate W after cleaning, as shown in FIG. 27, the thick portion 93 is fitted under the second suction pad 72 to push the second suction pad 72 upward and The second suction pad 72 is made higher than the first suction pad 71 so that the lower surface of the substrate W is sucked only by the second suction pad 72.

These FIG. 15, FIG. 18, FIG. 22 and FIG.
Similarly, according to any of the embodiments shown in FIG. 5, by switching the lower surface of the substrate W between the first suction pad 71 and the second suction pad 72 before and after cleaning, suction is performed.
It is possible to prevent the contaminants attached to the first suction pad 71 from the substrate W before cleaning from reattaching to the substrate W after cleaning. The substrate W before cleaning may be sucked only by the second suction pad 72, and the substrate W after cleaning may be sucked only by the first suction pad 71.

Next, in FIG. 28, a seesaw-shaped swinging member 100 is arranged on the upper surface of the arm 21, a first suction pad 101 is attached to one end of the swinging member 100, and a second suction pad 101 is attached to the other end. 2 shows an embodiment in which the suction pad 102 of FIG. Similarly, although only one swinging member 100 and the first suction pad 101 and the second suction pad 102 are shown for the sake of explanation, the swinging member 100 of the same structure is provided on the upper surface of the arm 21. At least three or more first suction pads 101 and second suction pads 102 are arranged.

These rocking members 100 are attached to a drive shaft 103 which is rotationally driven by an actuator (not shown). When the rocking member 100 is rocked in the clockwise direction by the rotational driving of the drive shaft 103, the first When the suction pad 101 moves to a position higher than the second suction pad 102 and the swinging member 100 swings counterclockwise on the contrary, the second suction pad 102 causes the first suction pad 1 to move.
It is designed to move to a position higher than 01.

In this embodiment, when the uncleaned substrate W is placed on the arm 21 and conveyed, the rocking member 100 is rocked clockwise as shown in FIG. 29, for example. The first suction pad 101 is moved to a position higher than the second suction pad 102, and the lower surface of the substrate W is sucked by only the first suction pad 101. on the other hand,
When transporting the cleaned substrate W, as shown in FIG. 30, the swinging member 100 is swung in the counterclockwise direction so that the second suction pad 102 is positioned higher than the first suction pad 101. The lower surface of the substrate W to the second suction pad 1
Adsorb only by 02. As described above, by switching the lower surface of the substrate W between the first suction pad 101 and the second suction pad 102 before and after cleaning and suctioning, the contamination adhered from the substrate W before cleaning to the first suction pad 101. This makes it possible to prevent the substance from being redeposited on the substrate W after cleaning.

Even if the substrate W before cleaning is adsorbed only by the second adsorption pad 102 and the substrate W after cleaning is adsorbed only by the first adsorption pad 101, the contaminant Can prevent reattachment.

31 and 32, the wedge member 1 for fitting the swinging member 100 into the lower surface of the other end side of the swinging member 100 by the pulling force of the spring 106 and the extension operation of the cylinder 107.
It shows an embodiment in which it is configured to swing by 08. Note that the first suction pad 101 is provided on one end side of the swinging member 100 as in the embodiment described above with reference to FIG.
Is attached, and the second suction pad 102 is attached to the other end side.

In this embodiment, when the uncleaned substrate W is placed on the arm 21 and conveyed, the cylinder 107 is swung to shorten the swinging motion as shown in FIG. 31, for example. The wedge member 108 is pulled out from the lower surface of the other end side of the member 100, and the swinging member 100 is swung clockwise by the tensile force of the spring 106 to move the first suction pad 101 from the second suction pad 102. Is also moved to a higher position, and the lower surface of the substrate W is moved to the first suction pad 10
Adsorb only by 1. On the other hand, when the substrate W after cleaning is transferred, as shown in FIG. 32, the cylinder 107 is extended so that the wedge member 108 is fitted into the lower surface of the swing member 100 on the other end side and the spring 106 is pulled. The swinging member 100 is swung counterclockwise against the force to move the second suction pad 102 to a position higher than the first suction pad 101, and the lower surface of the substrate W is moved to the second suction pad 102. Adsorb only by. Therefore, according to this embodiment as well, it becomes possible to prevent the contaminants from re-adhering to the substrate W after cleaning from the substrate W before cleaning.

As described with reference to FIGS. 28 to 32, the swing of the swing member 100 causes the first suction pad 10 to move.
In the case where it is configured to switch between suction by 1 and suction by the second suction pad 102, the first suction pad 1
When the upper surface of 01 and the upper surface of the second suction pad 102 are both tapered as shown in the figure, the outer surface is lower and the inner surface is higher, the adhesiveness of each pad upper surface to the lower surface of the substrate W is increased. There is.

Next, in FIG. 33, the seesaw-shaped rocking member 110 is arranged on the upper surface of the arm 21, the first supporting means 111 is formed on one end side of the rocking member 110, and the second supporting member 111 is formed on the other end side. It shows an embodiment in which the support means 112 is formed. Similarly, for the sake of explanation, only one rocking member 110 and the first supporting means 111 and the second supporting means 112 are shown, but on the upper surface of the arm 21, all of these rocking members 110 having the same structure are shown. At least three or more first support means 111 and second support means 112 are arranged.

These rocking members 110 are attached to a drive shaft 113 which is rotationally driven by an actuator (not shown). When the rocking member 110 rocks in the clockwise direction by the rotational driving of the drive shaft 113, the first When the supporting means 111 moves to a position higher than the second supporting means 112 and the swinging member 110 swings counterclockwise on the contrary, the second supporting means 112 moves to a position higher than the first supporting means 111. To move to.

In this embodiment, when the uncleaned substrate W is placed on the arm 21 and conveyed, the swing member 110 is swung clockwise as shown in FIG. 34, for example. The first support means 111 is moved to a position higher than the second support means 112, and the lower surface of the substrate W is supported only by the first support means 111. On the other hand, when transporting the cleaned substrate W, as shown in FIG. 35, the swinging member 110 is swung counterclockwise so that the second supporting means 112 is moved more than the first supporting means 111. The substrate W is moved to a higher position and the lower surface of the substrate W is supported only by the second supporting means 112. As described above, by switching the lower surface of the substrate W between the first supporting means 111 and the second supporting means 112 before and after cleaning and adsorbing the same, the contamination adhered to the first supporting means 111 from the substrate W before cleaning. This makes it possible to prevent the substance from being redeposited on the substrate W after cleaning.

The substrate W before cleaning is placed on the second supporting means 1
Even if the substrate W is supported only by 12 and the cleaned substrate W is supported only by the first supporting means 111, the redeposition of contaminants can be similarly prevented.

Next, FIG. 36 shows an embodiment in which one of the first supporting means 121 and the second supporting means 122 arranged on the upper surface of the arm 21 is configured to be movable up and down. In the illustrated embodiment, the first supporting means 121 can be moved up and down, and the arms 21 are provided on both sides of the first supporting means 121.
Second support means 122 consisting of a protrusion fixed to the upper surface of the
Is arranged. In the illustrated example, the first supporting means 121 is composed of a suction pad, and a circuit 123 is connected to the first supporting means 121. As will be described later, by sucking through this circuit 123, the first supporting means 121 The lower surface of the substrate W located above the supporting means 121 can be sucked. The first supporting means 121 composed of this suction pad is supported on the upper surface of the diaphragm 125, and a pressure adjusting chamber 126 is formed on the lower surface side of the diaphragm 125. A circuit 127 is connected to the pressure adjusting chamber 126. As will be described later, by supplying compressed air into the pressure adjusting chamber 126 through this circuit 127, the diaphragm 125 is bulged upward and the first The support means 121 can be raised,
Further, by depressurizing the pressure adjusting chamber 126 through the circuit 127, the diaphragm 125 can be retracted downward and the first supporting means 121 can be lowered. Note that, in FIG. 36, only one first supporting means 121 and the second supporting means 122 arranged on both sides thereof are shown for the sake of explanation, but the upper surface of the arm 21 has the same structure. The 1st support means 121 and the 2nd support means 122 are arrange | positioned at at least 3 or more places.

In this embodiment, when the substrate W before cleaning is placed on the arm 21 and conveyed, compressed air is supplied through the circuit 127 into the pressure adjusting chamber 126 as shown in FIG. And the diaphragm 125 is bulged upward. Then, by raising the first supporting means 121, the first supporting means 121 is made higher than the second supporting means 122, and the lower surface of the substrate W is supported only by the first supporting means 121. In this case, by sucking through the circuit 123, the lower surface of the substrate W is sucked by the first supporting means 121 composed of a suction pad.

On the other hand, when carrying the substrate W after cleaning,
As shown in FIG. 38, through the circuit 127, the pressure regulation chamber 1
The inside of 26 is decompressed, and the diaphragm 125 is retracted downward. Then, by lowering the first support means 121, the first support means 121 is moved to the second support means 12
2 to lower the lower surface of the substrate W to the second supporting means 12
Support only with 2. In this case, suction through the circuit 123 is not performed.

Similarly, according to the embodiment shown in FIG. 36, the lower surface of the substrate W is switched between the first supporting means 121 and the second supporting means 122 before and after the cleaning so as to be supported before the cleaning. From the substrate W to the first supporting means 12
It is possible to prevent the contaminants attached to No. 1 from reattaching to the cleaned substrate W. The first support means 1
21 is movable up and down, and the second support means 122 is used for the arm 2
Although the example in which it is fixed to the upper surface of No. 1 has been described, conversely, the second supporting means 122 may be vertically movable by the same configuration, and the first supporting means 121 may be fixed to the upper surface of the arm 21. In addition, the first support means 121 and the second support means 12
Both 2 may be lifted and lowered. The substrate W before cleaning may be supported only by the second supporting means 122, and the substrate W after cleaning may be supported only by the first supporting means 121. Furthermore, the first supporting means 12
Although the example in which 1 is configured by a suction pad has been described, the second support means 122 may be configured by a suction pad, and both the first support means 121 and the second support means 122 are configured by suction pads. May be.

Further, the embodiment shown in FIG. 39 is similar to that shown in FIG.
6 is a modification of the embodiment described in FIG. 6, in which the first support means 121 is higher than the second support means 122 in a state where the pressure adjustment chamber 126 below the first support means 121 is not depressurized, and the pressure adjustment is performed. The first supporting means 121 is lower than the second supporting means 122 when the chamber 126 is depressurized. In this modified example, when the substrate W before cleaning is placed on the arm 21 and conveyed, as shown in FIG. 39, decompression through the circuit 127 is not performed. Then, the first supporting means 121 is made higher than the second supporting means 122, and the lower surface of the substrate W is supported only by the first supporting means 121. Further, by sucking through the circuit 123, the lower surface of the substrate W is sucked by the first supporting means 121 composed of a suction pad. On the other hand, when transporting the cleaned substrate W, as shown in FIG. 40, the pressure inside the pressure adjusting chamber 126 is reduced through the circuit 127, and the diaphragm 125 is retracted downward. Then, by lowering the first supporting means 121, the first supporting means 121 is made lower than the second supporting means 122, and the lower surface of the substrate W is supported only by the second supporting means 122. In this case, suction through the circuit 123 is not performed. Similarly, according to the modification shown in FIG. 39, the lower surface of the substrate W is switched between the first supporting means 121 and the second supporting means 122 before and after cleaning so as to support the lower surface of the substrate W before cleaning. It is possible to prevent the contaminants attached to the one support means 121 from being reattached to the cleaned substrate W. In addition,
The second support means 122 may be vertically movable by the same structure, and the first support means 121 may be fixed to the upper surface of the arm 21. Further, both the first supporting means 121 and the second supporting means 122 may be vertically movable. In addition, the substrate W before cleaning is supported only by the second supporting means 122,
The substrate W after cleaning may be supported only by the first supporting means 121. Furthermore, although the example in which the first supporting means 121 is configured by the suction pad has been described, the second supporting means 122 may be configured by the suction pad, and the first supporting means 121 and the second supporting means 122 may be configured. Both of them may be constituted by suction pads.

The embodiment shown in FIG. 41 is another modification of the embodiment described with reference to FIG. 36, and it is the first modification when the pressure adjusting chamber 126 below the first supporting means 121 is not under high pressure. When the supporting means 121 of the first supporting means 121 becomes lower than the second supporting means 122 and the high pressure air is supplied to the pressure adjusting chamber 126 to bulge the diaphragm 125 upward, the first supporting means 121 becomes the second supporting means. It is configured to be higher than 122. In this modification, when the substrate W before cleaning is placed on the arm 21 and conveyed, high-pressure air is supplied into the pressure adjusting chamber 126 through the circuit 127 and the diaphragm 125 as shown in FIG. 42. Bulge upward. Then, by raising the first supporting means 121, the first supporting means 121 is moved to the second supporting means 122.
And the lower surface of the substrate W is made higher than the first supporting means 121.
Only support. Further, by sucking through the circuit 123, the first supporting means 12 composed of a suction pad
At 1, the lower surface of the substrate W is adsorbed. On the other hand, when the cleaned substrate W is transported, the high pressure air is not supplied through the circuit 127 as shown in FIG. Then, the first supporting means 121 is made lower than the second supporting means 122, and the lower surface of the substrate W is supported only by the second supporting means 122. In this case, suction through the circuit 123 is not performed.
Similarly, according to the other modification shown in FIG. 41, the lower surface of the substrate W is switched between the first supporting means 121 and the second supporting means 122 before and after the cleaning so as to be supported. Therefore, it is possible to prevent the contaminants attached to the first supporting means 121 from being redeposited on the cleaned substrate W. It should be noted that the second supporting means 122 may be vertically movable by a similar structure, and the first supporting means 121 may be fixed to the upper surface of the arm 21. Further, both the first supporting means 121 and the second supporting means 122 may be vertically movable. In addition, the substrate W before cleaning is placed on the second supporting means 1
The substrate W may be supported by only 22 and the cleaned substrate W may be supported by only the first supporting means 121. Furthermore, although the example in which the first supporting means 121 is configured by the suction pad has been described, the second supporting means 122 may be configured by the suction pad, and the first supporting means 121 and the second supporting means 122 may be configured. Both of them may be constituted by suction pads.

The embodiment of the present invention has been described above based on the cleaning apparatus 1 for cleaning the substrate W. However, the substrate transfer apparatus of the present invention is not limited to cleaning, and may be used for other purposes such as substrate drying or resist film coating. It is also possible to apply the present invention to various processing devices that perform the above processing.

[0058]

According to the present invention, the substrate before processing and the substrate after processing can be supported by different supporting means by switching the supporting means without moving the arm itself. Therefore, even though the structure is relatively simple, there is a feature that problems such as redeposition of contaminants on the substrate after processing can be reliably solved. Further, since the substrate transfer device can be made compact, it is possible to effectively use the space.

[Brief description of drawings]

FIG. 1 is a plan view of a cleaning device.

FIG. 2 is a perspective view of a substrate transfer device according to an embodiment of the present invention.

FIG. 3 is a perspective view of an arm suitable for carrying a substrate such as a semiconductor wafer.

FIG. 4 is a perspective view of an arm suitable for carrying a substrate such as an LCD glass substrate.

FIG. 5 is a cross-sectional view showing an embodiment in which fluid storage chambers as pressure adjusting means are arranged below both the first supporting means and the second supporting means, respectively. All of the supporting means are formed by the upper surface of a bellows-shaped expandable case.

FIG. 6 is an explanatory diagram of a state in which a substrate before cleaning is transported in the embodiment of FIG.

FIG. 7 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG.

FIG. 8 is a cross-sectional view showing an embodiment in which fluid storage chambers as pressure adjusting means are respectively arranged below both the first supporting means and the second supporting means. 7 shows an example in which each of the supporting means is constituted by an upper surface of a piston which can be raised and lowered.

FIG. 9 is an explanatory diagram of a state in which a substrate before cleaning is transported in the embodiment of FIG.

FIG. 10 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG.

FIG. 11 is a cross-sectional view showing an embodiment in which fluid storage chambers as pressure adjusting means are arranged below both the first supporting means and the second supporting means, respectively. 2 shows an example in which all of the supporting means are constituted by the upper surface of a bag-shaped expansion member provided on the upper surface of the arm.

FIG. 12 is an explanatory diagram of a state in which a substrate before cleaning is transported in the embodiment of FIG.

FIG. 13 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG.

FIG. 14 is a perspective view showing an embodiment in which a first suction pad and a second suction pad are respectively supported by a lifting mechanism.

FIG. 15 is a cross-sectional view showing an embodiment in which a cylinder is used as a lifting mechanism.

FIG. 16 is an explanatory diagram of a state in which a substrate before cleaning is transported in the embodiment of FIG.

FIG. 17 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG.

FIG. 18 is a cross-sectional view showing an embodiment using a bag body as an elevating mechanism that expands by supplying a fluid to lift the first suction pad and the second suction pad respectively.

FIG. 19 is a perspective view of a bag body.

FIG. 20 is an explanatory diagram showing a state where the substrate before cleaning is transported in the embodiment of FIG. 18.

FIG. 21 is an explanatory diagram of a state where the substrate after cleaning is transported in the embodiment of FIG.

FIG. 22 is a cross-sectional view showing an embodiment using a belt body that raises the first suction pad and the second suction pad by being tensioned as an elevating mechanism.

FIG. 23 is an explanatory diagram of a state where the substrate before cleaning is transported in the embodiment of FIG. 22.

FIG. 24 is an explanatory diagram of a state where the substrate after cleaning is transported in the embodiment of FIG. 22.

FIG. 25 is a cross-sectional view showing an embodiment in which a belt inserted below a first suction pad and a second suction pad is used as a lifting mechanism.

FIG. 26 is an explanatory diagram of a state where the substrate before cleaning is transported in the embodiment of FIG. 23.

FIG. 27 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG. 23.

FIG. 28 shows an embodiment in which seesaw-shaped swinging members are arranged at three or more positions on the upper surface of the arm, and the first suction pad and the second suction pad are attached to one end side and the other end side of these swinging members. It is sectional drawing which shows a form.

FIG. 29 is an explanatory diagram showing a state where the substrate before cleaning is transported in the embodiment of FIG. 28.

FIG. 30 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG. 28.

FIG. 31 is a cross-sectional view showing an embodiment in which the swing member is swung by a pulling force of a spring and a wedge member fitted on the lower surface of the swing member at the other end side, and the substrate before cleaning is transported. It shows the state.

FIG. 32 is an explanatory diagram of a state where the substrate after cleaning is transported in the embodiment of FIG. 31.

FIG. 33 is a cross-sectional view showing an embodiment in which a seesaw-shaped swinging member is provided on the upper surface of an arm, and first supporting means and second supporting means are provided on one end side and the other end side of the swinging member. Is.

34 is an explanatory diagram of a state in which a substrate before cleaning is transported in the embodiment of FIG. 33. FIG.

FIG. 35 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG. 33.

FIG. 36 is a cross-sectional view showing an embodiment in which one of the first supporting means and the second supporting means arranged on the upper surface of the arm is configured to be vertically movable.

FIG. 37 is an explanatory diagram of a state where the substrate before cleaning is transported in the embodiment of FIG. 36.

FIG. 38 is an explanatory diagram of a state in which the substrate after cleaning is transported in the embodiment of FIG. 36.

FIG. 39 is a cross-sectional view showing a modified example of the embodiment described in FIG. 36, showing a state where the substrate before cleaning is transported.

FIG. 40 is an explanatory diagram of a state in which the substrate after cleaning is transported in the modification example of FIG. 39.

41 is a cross-sectional view showing another modified example of the embodiment described in FIG. 36, showing a state in which the substrate after cleaning is transported.

FIG. 42 is an explanatory diagram showing a state where the substrate before cleaning is transported in the modified example of FIG. 41.

[Explanation of symbols]

W board C cassette 2 Substrate transfer device 3 cassette stations 4 Cleaning section 21 arms 31 First Support Means 32 Second Support Means

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-6-349933 (JP, A) JP-A-8-107136 (JP, A) JP-A-7-297154 (JP, A) JP-A-3- 12948 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 B25J 15/06 B65G 49/07

Claims (8)

(57) [Claims] 1. A substrate transfer apparatus for moving an arm and loading and unloading a substrate to and from a processing unit in a state where the arm is placed on the arm. First supporting means and second supporting means are arranged on an upper surface of the arm. In addition, the first supporting means and the second supporting means are respectively supported by an elevating mechanism, and the elevating mechanism is a belt inserted below the first supporting means and the second supporting means, and A substrate transfer device, wherein the belt is provided with a relatively thick portion. 2. The substrate transfer device according to claim 1, wherein the supporting means is a suction pad. 3. A substrate transfer apparatus for moving an arm and loading and unloading the substrate to and from a processing section in a state where the arm is placed on the arm. First supporting means and second supporting means for supporting the substrate. Is arranged on the upper surface of the arm, and one of the first supporting means and the second supporting means is configured to be vertically movable, and
When one of the first support means and the second support means rises, one of the first support means and the second support means becomes higher than the other, and the first support means and the second support means One of the first support means and the second support means is lower than the other when one of them is lowered, and one of the first support means and the second support means is attached to the upper surface of the diaphragm. And a pressure adjusting chamber formed on the lower surface side of the diaphragm. 4. A substrate transfer apparatus for moving an arm and loading and unloading a substrate to and from a processing unit in a state where the arm is placed on the arm, and a seesaw-shaped swing member is disposed on an upper surface of the arm, and the swing member is provided. Of the first supporting means is formed on one end side of the rocking member and second supporting means is formed on the other end side of the rocking member, and the first supporting means is formed by rocking the rocking member in the clockwise direction. Is moved to a position higher than the second supporting means, and the first supporting means is moved to a higher position than the second supporting means by the counterclockwise rotation of the rocking member. A substrate transfer device characterized in that 5. A substrate transfer device for moving an arm and loading and unloading a substrate to and from a processing unit in a state where the arm is placed on the arm, and a seesaw-shaped swinging member is disposed on an upper surface of the arm, and the swinging member is provided. A first supporting means is formed on one end side of the rocking member and a second supporting means is formed on the other end side of the rocking member, a spring for rotating the rocking member clockwise by a tensile force, and an extension of the cylinder. A substrate transfer device, comprising: a wedge member that is fitted into the lower surface of the other end of the swing member to rotate the swing member counterclockwise against the tensile force. 6. The substrate transfer apparatus according to claim 3, wherein at least one of the first support means and the second support means is configured by a suction pad. 7. A substrate transfer apparatus for moving an arm and loading and unloading a substrate to and from a processing unit while being mounted on the arm, wherein a seesaw-shaped swing member is disposed on an upper surface of the arm, and the swing member is provided. with mounting the first suction pad at one end of the second suction pad mounted on the other end of the swinging member, the first upper surface of the suction pad and the second suction pad of the
A substrate transfer device, characterized in that each of the swing members is formed into a tapered surface with a lower outside and a higher inside with respect to an axis for swinging . 8. A substrate transfer method of moving an arm and loading / unloading the substrate to / from a processing unit in a state where the arm is placed on the arm. First supporting means and second supporting means for supporting the substrate. Is disposed on the upper surface of the arm, one of the first supporting means and the second supporting means is supported on the upper surface of the diaphragm, and the pressure adjusting chamber provided on the lower surface side of the diaphragm is pressurized or depressurized. Thus, when one of the first support means and the second support means rises, one of the first support means and the second support means becomes higher than the other, and the first support means and the second support means When one of the supporting means descends, one of the first supporting means and the second supporting means becomes lower than the other, and when the substrate is loaded into the processing section, the first supporting means and The substrate is supported by only one of the second supporting means, A substrate transfer method, wherein the substrate is supported only by the other one of the first supporting means and the second supporting means when the substrate is carried out from the processing section.