JP3402131B2 - Method of attaching adhesive sheet to substrate for semiconductor package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching an adhesive sheet when adhering components such as a semiconductor chip to a semiconductor device lead frame, a tape carrier, etc., and particularly to excellent workability and cost reduction. The present invention relates to a method of attaching an adhesive sheet that can be attached and that can be attached accurately.

[0002]

2. Description of the Related Art A liquid adhesive is generally used as a method for bonding a semiconductor chip or the like onto a semiconductor package substrate such as a lead frame, tape carrier, or printed circuit board. When applied on top, components such as solvent remaining in the adhesive do not completely volatilize, gas is generated at the sealing stage and foaming occurs in the sealing resin, or the sealing resin cracks after sealing. Recently, a method of using a sheet-shaped adhesive agent (adhesive sheet) has been put into practical use instead of this method.

FIG. 4 shows this adhesive sheet. In the figure, (a) is a plan view and (b) is a BB sectional view of (a). The adhesive sheet 20 is made of a material such as a thermoplastic resin, a mixture of a thermoplastic resin and a thermosetting resin, or a thermosetting resin, and has a tacky surface.

FIG. 5 shows a state in which this adhesive sheet is stuck on a substrate. As shown in the figure, first, the conveyed adhesive sheet 20 is punched with a punching die 30 to have a predetermined size and a predetermined shape (FIG. 5A), and the punched adhesive sheet 20.
While heating, pressurize and stick on the substrate 40 (FIG. 5).
(B)). After that, the semiconductor chip 50 is placed on the adhesive sheet 20 attached on the substrate 40, and is heated and pressed to adhere (FIG. 5C).

However, according to this method for applying an adhesive sheet, since the surface of the adhesive sheet is tacky, when the adhesive sheet is continuously applied to the substrate while being conveyed, the adhesive sheet is applied in the application device. As a result, the punching die and the adhesive sheet adhere to each other and the punched shape becomes abnormal, and in the case of an adhesive sheet with low tensile strength, the adhesive sheet breaks during transportation and remarkably reduces workability. It may decrease. Further, since the punching die and the adhesive sheet are in direct contact with each other, it is necessary to clean the punching die during the work.

For this reason, the inventor has studied the operation of attaching the carrier film to the surface of the adhesive sheet when carrying the adhesive sheet. FIG. 6 shows this adhesive sheet with a carrier film. In the figure, (a) is a plan view and (b) is a BB sectional view of (a). This carrier film-attached adhesive sheet is made of PET (polyethylene terephthalate) having a wider width on both sides of the adhesive sheet 20.
The carrier films 21 and 22 made of are adhered.

FIG. 7 shows a method of attaching an adhesive sheet using this adhesive sheet with a carrier film. As shown in the figure, first, the adhesive sheet with a carrier film is conveyed to a sticking device (FIG. 7A), and the carrier film 22 located between the base 40 and the sticking surface of the adhesive sheet 20 immediately before punching. The adhesive sheet 20 is wound up and peeled off, punched out with a press machine 30 (FIG. 7B), and punched out.
While heating, pressurize and stick it on the substrate 40 (FIG. 7).
(C)). After this, before adhering the semiconductor chip 50, the carrier film 21 on the adhering surface of the semiconductor chip 50 is peeled off from the adhering sheet 20 (FIG. 7D), and the semiconductor chip 50 is placed on the adhering sheet 20 and adhering while applying heat and pressure. (FIG. 7E).

According to the method for sticking an adhesive sheet using this adhesive sheet with a carrier film, since the carrier film is stuck on both sides of the adhesive sheet, the adhesive sheet can be easily conveyed to the press machine, and There will be no sticking of the adhesive sheet in the sticking device and no abnormalities or breaks in the punched shape. Further, since the punch portion is not contaminated, it is not necessary to clean the die.

[0009]

However, according to the method of applying the adhesive sheet which has been examined, there are the following problems. (1) When adhering the adhesive sheet to the base, work is performed by peeling off the carrier film located between the adhering surfaces of the base and the adhesive sheet immediately before punching the adhesive sheet, and adhering the semiconductor chip to the adhesive sheet. In this case, it becomes complicated because it is necessary to remove the carrier film located between the semiconductor chip and the adhesive surface of the adhesive sheet before mounting the semiconductor chip. (2) In addition, when burrs are generated on the adhesive sheet during punching of the adhesive sheet, the substrate to which the burrs are attached becomes a defective product, resulting in a decrease in yield and an increase in cost. (3) Furthermore, by sticking the carrier film on both sides of the adhesive sheet, problems such as adhesion that occur during transportation can be solved, but when the adhesive sheet is punched out and stuck at a predetermined position on the substrate, it must be stuck accurately. I can't.

[0010]

SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide a method for applying an adhesive sheet, which has excellent workability, can reduce costs, and can be applied accurately.

[0011]

In order to achieve the above-mentioned object, the present invention punches and sticks an adhesive sheet having a predetermined shape on one surface of a carrier film, and the stuck adhesive sheet is used for the semiconductor package from the carrier film . Disclosed is a method for attaching an adhesive sheet to a semiconductor package substrate, which is characterized in that the adhesive sheet is transferred to the substrate .

In this case, the transfer is performed by the semiconductor package.
It is desirable that the other surface of the carrier film is pressed by a pressing means on the substrate for storage , and the carrier film preferably has a hole for alignment.

[0013]

DETAILED DESCRIPTION OF THE INVENTION Referring to the accompanying drawings,
Embodiments of the present invention will be described in detail.

FIG. 1 shows a carrier film with an adhesive sheet to which the method for pasting an adhesive sheet according to an embodiment of the present invention is applied. In the figure, (a) is a plan view,
(B) is an AA sectional view of (a), and (c) is a partial perspective view. This carrier film with adhesive sheet has 1
Adhesive sheet 20 made of thermosetting epoxy resin in a rectangular shape of 0 mm (width direction) x 5 mm (longitudinal direction)
And a carrier film 10 made of PET (polyethylene terephthalate) having a width of 25.4 mm and a thickness of 50 μm. In the above configuration, the adhesive sheet 20
Are affixed on the carrier film 10 at intervals of 15 mm, and circular positioning holes 13 having a diameter of 1 mm are provided on both end faces in the width direction of the carrier film 10 at positions of 5 mm from the sheet edge at intervals of 5 mm. Has been. A positioning pin 14, which will be described later, is inserted into the positioning hole 13.

FIG. 2 shows the base 4 of these adhesive sheets 20.
The method of sticking to 0 is shown. As shown in the figure, first, the adhesive sheet 20 is punched out to an adhesive size by a press machine 30 and attached to the carrier film 10 (FIG. 2A), and the position of the carrier film 10 to which the adhesive sheet 20 is attached is aligned. The positioning pin 14 is inserted into the hole 13 for feeding and is conveyed to the sticking device 31 on which the substrate 40 made of a polyimide film is mounted, and the sticking die 32 is used to pressurize the adhesive sheet 20 from the carrier film 10 side. And transfer (FIG. 2 (b)). After that, the semiconductor chip 50 is placed on the adhesive sheet 20 transferred onto the substrate 40 and adhered to the adhesive sheet 20 while heating and pressing (FIG. 2C).

According to this method, since the adhesive sheet is attached to the carrier film and conveyed, the adhesive sheet does not stick to the attaching device and is easy to convey. Moreover, since the positioning holes are used, the positioning with the base body that is the adherend can be performed quickly and accurately. Further, since pressure is applied from the carrier film side when transferring the adhesive sheet, there is no risk of contaminating the punch of the sticking die. Furthermore, even if a punching burr occurs in the adhesive sheet attached on the carrier film, it can be removed before the transfer to the substrate, so that the yield reduction can be prevented.

FIG. 3 shows another example of the carrier film with an adhesive sheet. In the figure, (a) is a plan view,
(B) is an AA sectional view of (a), and (c) is a partial perspective view. This carrier film with adhesive sheet,
9.5 mm circular adhesive sheet 20 made of thermoplastic polyimide resin, width 25.4 mm, thickness 50 μ
m carrier film 10 made of PET (polyethylene terephthalate). In the above structure, the adhesive sheet 20 is attached to the center portion of the carrier film 10 at intervals of 20 mm, and the carrier sheet 10 has a width of 5 mm from both edge surfaces of the carrier film 10.
Circular positioning holes 13 having a diameter of 1 mm are provided at 5 mm intervals at 5 mm positions.

The method for sticking the carrier film with the adhesive sheet to the substrate is the same as that shown in FIG. 2, so a duplicated description will be omitted. However, this method also facilitates transportation, and the substrate such as a printed circuit board. Can be accurately adhered to a predetermined position, and the punch of the attachment die can be prevented from being contaminated and the yield can be prevented from decreasing.

[0019]

As described above, according to the method for sticking an adhesive sheet of the present invention, an adhesive sheet having a predetermined shape is punched and stuck on one surface of a carrier film, and the stuck adhesive sheet is adhered from the carrier film to an adherend. Since the transfer is performed, the adhesive sheet is on the carrier film at the time of transportation so that no sticking or the like occurs in the sticking device, and when the semiconductor chip is placed on the adhesive sheet after being stuck to the substrate, Since there is no film, the work of removing the carrier film is unnecessary and workability is improved. Further, since the positioning hole is provided on the carrier film, the adherend can be easily and accurately attached to a predetermined position. Furthermore, since the pressure is applied from the side of the carrier film when the adhesive sheet on the carrier film is transferred onto the substrate, the punch of the sticking die is not contaminated. Furthermore, even if a punching burr occurs in the adhesive sheet attached on the carrier film, it can be removed before the transfer to the substrate, so that the yield reduction can be prevented. On the other hand, the adhesive sheet to be attached to the carrier film only needs to have a size enough to be transferred, and has an advantage of reducing the loss of the adhesive sheet.

[Brief description of drawings]

1A and 1B are views showing a carrier film with an adhesive sheet to which an adhesive sheet sticking method according to an embodiment of the present invention is applied, in which FIG. 1A is a plan view and FIG. FIG.

FIG. 2 is a diagram showing a method of attaching an adhesive sheet according to an embodiment of the present invention.

FIG. 3 is a view showing another example of a carrier film with an adhesive sheet.

FIG. 4 is a diagram showing a conventional adhesive sheet, (a) is a plan view, and (b) is a BB sectional view of (a).

5 is a diagram showing a method of attaching the adhesive sheet of FIG.

6A and 6B are diagrams showing a conventional adhesive sheet with a carrier film, in which FIG. 6A is a plan view and FIG. 6B is a sectional view taken along line BB of FIG.

FIG. 7 is a diagram showing a method of attaching an adhesive sheet using the adhesive sheet with a carrier film of FIG.

[Explanation of symbols]

10 Carrier film 13 Alignment hole 14 Positioning pin 20 Adhesive sheet 30 presses 31 Sticking device 32 Sticking die 40 base 50 semiconductor chips

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuharu Kameyama 3550 Kidayomachi, Tsuchiura City, Ibaraki Prefecture, Hitachi Cable Systems Co., Ltd. (56) References JP 64-19735 (JP, A) Kaihei 2-256251 (JP, A) JP 9-17810 (JP, A) JP 6-326240 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21 / 52

Claims (3)

(57) [Claims] 1. An adhesive sheet having a predetermined shape is punched and stuck on one surface of a carrier film, and the stuck adhesive sheet is removed from the carrier film.
Semi- characterized by transferring to a semiconductor package substrate
A method for attaching an adhesive sheet to a conductor package substrate. 2. The transfer is the substrate for the semiconductor package.
2. The semiconductor package according to claim 1 , wherein the other surface of the carrier film is pressed by a pressing means on the upper surface.
A method for sticking an adhesive sheet to a substrate for electric field . 3. The method of attaching an adhesive sheet according to claim 1, wherein the carrier film has holes for alignment.