JP3402275B2 - Electronic component manufacturing method and manufacturing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing an electronic component in which electronic component elements such as piezoelectric elements are bonded with a bonding agent and mounted on a substrate.

[0002]

2. Description of the Related Art For example, when a piezoelectric resonance element of thickness shear vibration mode is mounted on a substrate or the like, a conductive adhesive is applied to both ends of a prismatic element and mounted on the substrate or the like. in this case,
It is necessary to have a structure that does not hinder the vibration of the piezoelectric element, and it is necessary to apply a conductive adhesive so that the conductive adhesive does not adhere to the inside from both ends of the element more than necessary to secure a vibration space.

As a method of applying a bonding agent such as a conductive adhesive to only a predetermined portion of an element mounted on a substrate, the applicant has prepared an adhesion stage having a convex portion on which the bonding agent is applied. Then, by pressing the element on this convex part,
A method has been proposed in which a bonding agent is transferred to a predetermined location and applied (Japanese Patent Application No. 10-307509).

FIG. 11 is a sectional view for explaining such a bonding agent coating method. The convex portions 3 and the convex portions 4 are provided at a predetermined interval, and the bonding agent 10 is applied onto the convex portions 3 and 4. The element 1 is held by being sucked by the suction nozzle 2.
Is pressed onto the convex portions 3 and 4 to transfer and apply the bonding agent 10 to the lower surfaces of both ends of the element 1. According to such a method, since the bonding agent can be applied at a constant interval, it is possible to secure a vibration space when the bonding agent is mounted on the substrate.

[0005]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In order to apply the bonding agent on the lower surface of both ends of the device, it is necessary to position the element 1 with high accuracy before transferring the bonding agent. Generally, in order to improve the production efficiency, it is necessary to handle a plurality of elements at the same time, but in such a case, high-precision positioning is required.
It is necessary to position each element, which is an obstacle to increasing the production speed.

Further, the length of the element may change depending on the required frequency. In such a case, it is necessary to prepare a bonding agent coating device in which the interval between the convex portions is different for each element.

The object of the present invention is to correct the positional deviation of the element and to apply the bonding agent to a predetermined portion of the element, and also to apply the bonding agent to the predetermined portion corresponding to elements having different lengths. An object of the present invention is to provide a method and an apparatus for manufacturing an electronic component that can be manufactured.

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component, in which a bonding agent is applied to the lower surfaces of both ends of the element, and the element is bonded and mounted on a substrate with the bonding agent. That is, the bonding agent is applied to the pair of inclined surfaces that are inclined so as to spread toward each other upward, the element is positioned above the pair of inclined surfaces, and then the element is lowered to remove both ends of the element. It is characterized in that the positional deviation of the element is corrected and the bonding agent is applied to the lower surface and the side surface of both ends of the element by abutting the edge portions including the lower surface and the side surface to the corresponding inclined surfaces. .

According to a second aspect of the present invention, the pair of inclined surfaces is an inclined surface of a V-shaped groove or a U-shaped groove. The invention according to claim 3 is characterized in that the bonding agent is a conductive adhesive, and the invention according to claim 4 is the same as the invention according to claim 3, in which the outside of the element is formed by the conductive adhesive. The electrode is electrically connected to the terminal electrode on the substrate.

According to a fifth aspect of the invention, the element is a piezoelectric element such as a piezoelectric resonance element. The invention according to claim 6 is a manufacturing apparatus of an electronic component for applying a bonding agent to the lower surfaces of both ends of the element, and bonding and mounting the element on a substrate with the bonding agent. In order to correct the element, the element is held so that the element can be moved in the horizontal direction, and has a holding and conveying means for conveying the element to a predetermined position, and a pair of inclined surfaces inclined so as to expand upward from each other. And a bonding agent applying means for applying a bonding agent for applying to both ends of the element on the inclined surface, and the holding and conveying means positions the element above the pair of inclined surfaces of the bonding agent applying means. Then, by lowering the element until the edge portions consisting of the lower surface and the side surface of both ends of the element come into contact with the corresponding inclined surfaces, the positional deviation of the element is corrected and the lower surface and the side surface of the both end portions of the element are corrected. Characterized by applying a bonding agent to the To.

The invention according to claim 7 is characterized in that the holding and conveying means has a suction nozzle for sucking and holding the upper surface of the element. The invention according to claim 8 is characterized in that the pair of inclined surfaces of the bonding agent applying means are inclined surfaces of a V-shaped groove or a U-shaped groove.

The pair of inclined surfaces in the present invention are not necessarily required to be flat surfaces and may be concave curved surfaces such as U-shaped groove inclined surfaces, or convex curved surfaces. It may be a curved surface.

According to the present invention, it is possible to correct the positional deviation of the element and apply the bonding agent to the lower surface and the side surface of the both ends of the element. Therefore, a separate process for correcting the position of the element is not required, and the bonding agent can be simultaneously applied to a plurality of elements and mounted on the substrate. Further, depending on the piezoelectric element, it is necessary to apply a bonding agent such as a conductive adhesive as a damping material to both end surfaces of the element, particularly to the edge portion in order to suppress vibration leakage from the end portion. According to this, the bonding agent can be simultaneously applied to the lower surface and the edge portions of the side surfaces of both ends of the element, which enables efficient production.

[0014]

1 is a sectional view for explaining a method of manufacturing an electronic component according to an embodiment of the present invention. In addition,
In the following examples, a conductive adhesive is used as the bonding agent.

As shown in FIG. 1A, a groove 11 having a V-shaped cross section is formed in the conductive adhesive application stage 12. Due to the V-shaped groove 11, the conductive adhesive application stage 12 is formed with a pair of inclined surfaces 11 a and 11 b which are inclined so as to spread upward. The conductive adhesive 10 is applied to the pair of inclined surfaces 11a and 11b with a constant thickness. As the conductive adhesive 10, an epoxy resin-Ag filler type is used here. As the conductive adhesive, one generally called a solvent-free adhesive is preferable and has a viscosity of 10
000 to 100,000 cps is preferably used. However, the present invention is not limited to these.

An element 1 such as a piezoelectric element is sucked and held by a suction nozzle 2. Here, the element 1 is held by the suction nozzle 2 in a state of being displaced in the left direction in the drawing. In this state, by lowering the suction nozzle 2 in the direction of arrow A, the element 1 is lowered in the direction of arrow A, that is, in the vertical direction.

As shown in FIG. 1 (b), when the element 1 is lowered in the state of FIG. 1 (a), the end portion of the element 1 (shown by the dotted line) in the direction in which the displacement occurs is the inclined surface 11a. Abut. When the element 1 is further lowered in this state, the element 1 is held by the suction nozzle 2 so as to be movable in the horizontal direction, so that the element 1 moves in the arrow B direction, that is, in the direction for correcting the positional deviation. Such horizontal movement of the element 1 is performed until the opposite end of the element 1 comes into contact with the inclined surface 11b. Then, the element 1 descends until both ends of the element 1 come into contact with the corresponding inclined surfaces 11a and 11b. The element 1 is set at a predetermined position by the contact of the edge portions at both ends with the inclined surfaces 11a and 11b, and the positional deviation of the element 1 is corrected. In this state, the conductive adhesive 10 is attached to the lower surface and the side surface of both ends of the element 1.

As shown in FIG. 1 (c), the displacement of the element 1 is corrected, and the suction nozzle 2 holding the element 1 in the correct position is lifted in the direction of arrow C to move the element 1 in the direction of arrow C. That is, it is raised in the vertical direction. The conductive adhesive 10 attached to the lower surface and the side surface of both ends of the element 1 is
And the lower surface and the side surface of both ends of the element 1 are applied with the conductive adhesive 10. Therefore, the conductive adhesive 10 is transferred and applied in a state where the displacement of the element 1 is corrected, and the conductive adhesive 10 is accurately applied to a predetermined position of the element 1.

As described above, according to the present invention, the displacement of the element can be corrected and the conductive adhesive can be applied to the predetermined positions on the lower surface and the side surface of both ends of the element.
FIG. 2 is a perspective view showing the conductive adhesive supply unit. Such a conductive adhesive supply unit can be used by being incorporated in, for example, a commercially available mounter for a chip mounter. The V-shaped groove 11 is formed on the conductive adhesive application stage 12 as described above. Conductive adhesive application stage 1
A squeegee head 13 is placed on top of 2. The squeegee head 13 is provided with a protrusion 13 a having a V-shaped cross section that fits into the V-shaped groove 11. The squeegee head 13 is provided so as to move on the conductive adhesive application stage 12 along the direction in which the V-shaped groove 11 extends.

After applying the conductive adhesive 10 on the inclined surface of the V-shaped groove 11, the squeegee head 13 is moved to form a layer of the conductive adhesive 10 having a uniform thickness in the V-shaped groove 11. Can be formed on the inclined surface.

FIG. 3 is a sectional view showing the positional relationship between the conductive adhesive application stage 12 and the squeegee head 13.
By maintaining a predetermined distance between the conductive adhesive application stage 12 and the squeegee head 13, it is possible to maintain a predetermined distance between the V-shaped groove 11 and the protrusion 13a. Therefore, by applying the conductive adhesive on the inclined surface of the V-shaped groove 11 and then moving the squeegee head 13,
The thickness of the conductive adhesive 10 can be set to a predetermined thickness. Further, by changing the distance between the conductive adhesive application stage 12 and the squeegee head 13, the conductive adhesive 1
The thickness of 0 can be changed. By changing the thickness of the conductive adhesive 10, the amount of the conductive adhesive applied to both ends of the element can be changed.

FIG. 4 is a sectional view showing an example of the shape of another groove formed on the conductive adhesive coating stage. The conductive adhesive application stage 14 has a pair of inclined surfaces similar to a V-shaped groove, and a groove 14a having a bottom extending downward is formed. The squeegee head 15 placed on the conductive adhesive application stage 14 is provided with a protrusion 15a that fits into the shape of the groove 14a.

FIG. 5 is a sectional view showing an example of still another groove shape formed on the conductive adhesive coating stage. The conductive adhesive application stage 16 has a pair of inclined surfaces similar to the V-shaped groove, a horizontal bottom portion is formed below the inclined surfaces, and a groove 16a having a shape extending downward inside thereof is formed. Has been formed. Conductive adhesive application stage 1
The squeegee head 17 placed on the
A protrusion 17a that fits in the shape of 6a is formed.

In the present invention, the shape of the groove formed on the conductive adhesive application stage is not limited to the above-mentioned groove shape, but a groove shape having a pair of inclined surfaces which are inclined so as to spread upward. Any other shape, such as a U shape or an inverted trapezoidal shape, may be used.

In the present invention, the conductive adhesive supply section as described above can be used to apply the conductive adhesive to both ends of the element while simultaneously adjusting the positional deviations of a plurality of elements. Therefore, the electronic component can be efficiently manufactured.

FIG. 6 is a perspective view showing a state in which a conductive adhesive is applied to both ends of the element. As shown in FIG. 6, the conductive adhesive 10 is applied to the lower surface 1 a and the side surface 1 of both ends of the element 1.
Coated on b and 1c. The amount of the conductive adhesive 10 applied can be adjusted by changing the thickness of the conductive adhesive layer applied on the inclined surface, as described above. That is, increasing the thickness of the conductive adhesive layer can increase the coating amount, and decreasing the thickness of the conductive adhesive layer can reduce the coating amount.

FIG. 7 is a partial side view showing a state in which the conductive adhesive 10 is applied to both ends of the element 1 as shown in FIG. 6 and then mounted on the substrate 20. Here, the substrate 20
A terminal electrode 21 is formed at the end of the element 1, and the element 1 is bonded onto the terminal electrode 21 via a conductive adhesive 10. By forming an external electrode on the lower surface 1a or the side surface 1b of the end portion of the element 1, the external electrode of the element 1 and the terminal electrode 21 of the substrate 20 are electrically connected via the conductive adhesive 10. You can

FIG. 8 is a perspective view showing a state in which a conductive adhesive is applied according to the present invention to both ends of a piezoelectric resonance element of thickness shear vibration mode. An excitation electrode 32 is formed on the upper surface of the piezoelectric resonance element 30, and the excitation electrode 32 extends to one end of the piezoelectric resonance element 30 and is electrically connected to an external electrode 31 formed on the side surface of the one end. There is. An excitation electrode 34 is formed on the lower surface of the piezoelectric resonance element 30, and the excitation electrode 34 extends to the other end of the piezoelectric resonance element 30 and is electrically connected to an external electrode 33 formed on the side surface of the other end. Has been done.

The excitation electrode 32 formed on the upper surface of the piezoelectric resonance element 30 and the excitation electrode 34 formed on the lower surface thereof.
Are provided so as to overlap with each other in the central portion of the piezoelectric resonance element 30, and an electrode overlapping portion shown by a dotted line is formed. With such an electrode structure, vibration can be confined in the electrode overlapping portion, and vibration-free portions can be formed at both ends of the element. However, it is known that vibration leaks and reaches both ends. Especially, when the size of the element is reduced, the length of the element becomes shorter, and the leakage of the vibration becomes larger. As a method of suppressing such vibration, it is known that it is effective to apply a material having mass and viscoelasticity such as a conductive adhesive to the edge portion in the length direction of the element and mount it on the substrate. There is. According to the present invention, the conductive adhesive can be applied to not only the lower surface of both ends of the element but also the side surfaces thereof, so that vibration leakage from the end can be effectively suppressed.

FIG. 9 is a perspective view showing a state where the piezoelectric resonance element having the both ends shown in FIG. 8 coated with a conductive adhesive is mounted on a substrate such as an alumina substrate. As shown in FIG. 8, the piezoelectric resonance element having both ends coated with a conductive adhesive is directly conveyed to a position above the substrate by a holding and conveying means such as a suction head, and at that position the substrate is lowered to be placed on the substrate. Can be installed.

As shown in FIG. 9, terminal electrodes 21 and 22 are formed on both ends of the substrate 20, respectively, and one end of the piezoelectric resonance element 30 is formed on the terminal electrode 21 via a conductive adhesive 10. The parts are joined. The external electrode 33 of the piezoelectric resonance element 30 is electrically connected to the terminal electrode 21 via the conductive adhesive 10. Similarly, the other end of the piezoelectric resonance element 30 is bonded onto the terminal electrode 22 via the conductive adhesive 10. The external electrode 31 of the piezoelectric resonance element 30 is
It is electrically connected to the terminal electrode 22 via the conductive adhesive 10. The conductive adhesive 10 can be hardened by performing heat treatment, such as in an oven.

After the piezoelectric resonance element 30 is mounted on the substrate 20 as described above, a metal cap 40, for example, is placed on the substrate 20 and adhered and sealed. The adhesive can be applied to the opening of the cap 40, for example.

FIG. 10 is a sectional view showing a state in which a conductive adhesive is applied to elements having different lengths. Since the V-shaped groove 19 formed on the conductive adhesive application stage 18 has the inclined surfaces 19a and 19b that expand toward each other upward, the element 35 having a relatively short element length is provided. Is the conductive adhesive 1 at a deeper portion of the V-shaped groove 19.
0 can be applied, and for the element 36 having a relatively long element length, the conductive adhesive 10 can be applied in a shallower portion of the V-shaped groove 19. As described above, according to the present invention, the conductive adhesive can be applied even when the elements have different lengths.

In the above embodiments, the conductive adhesive was used as an example of the bonding agent, but the present invention is not limited to this, and a bonding agent having no conductivity is used at both ends of the element. It can also be applied to the case where it is applied to and mounted on a substrate.

Further, in the above embodiment, the piezoelectric resonance element of the thickness shear vibration mode is exemplified, but the present invention is not limited to this, and piezoelectric elements of other vibration modes may be used. Further, it can be applied to elements other than the piezoelectric element.

The present invention can also be applied to the case where an element is mounted on a circuit board.

[0037]

According to the first aspect of the present invention, it is possible to correct the positional deviation of the element and apply the bonding agent to a predetermined portion of the element. Therefore, steps such as element positioning and positional deviation correction are not required, and efficient production is possible. Further, since a plurality of elements can be handled at the same time, efficient production can be achieved. Also,
Since the bonding agent is applied in a state where the displacement of the element is corrected, the position and amount of application can be accurately controlled.
Further, the bonding agent can be applied to predetermined locations correspondingly to elements having different lengths.

According to the second aspect of the invention, since the pair of inclined surfaces can be formed by forming the V-shaped or U-shaped groove, a simpler device structure can be obtained.

According to the third and fourth aspects of the invention, a conductive adhesive is used, and the conductive adhesive can be applied not only to the lower surface of both ends of the element but also to the side surface thereof. The electrical conduction between the electrodes of the substrate and the substrate can be made more reliable.

According to the fifth aspect of the present invention, the piezoelectric element is used as the element, and when vibration leakage occurs from the piezoelectric element, the bonding agent can be applied to the edge portions of both ends of the element. Vibration leakage from the part can be suppressed.

According to the invention described in claim 6, it is possible to correct the displacement of the element and to apply the bonding agent to a predetermined portion of the element. Therefore, steps such as element positioning and positional deviation correction are not required, and efficient production is possible. Further, since a plurality of elements can be handled at the same time, efficient production can be achieved. In addition, since the bonding agent is applied with the positional deviation of the element corrected,
The position and amount of application can be controlled accurately. Further, the bonding agent can be applied to predetermined locations correspondingly to elements having different lengths.

According to the invention described in claim 7, a suction nozzle for sucking and holding the upper surface of the element is used as the holding and conveying means, and the holding and conveying means can be constructed with a simple structure.

According to the eighth aspect of the present invention, since the pair of inclined surfaces can be formed by forming the V-shaped or U-shaped groove, a simpler device structure can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a method for manufacturing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a conductive adhesive supply unit according to an embodiment of the present invention.

3 is a cross-sectional view showing the positional relationship between the conductive adhesive application stage and the squeegee head shown in FIG.

FIG. 4 is a sectional view showing another shape of a groove having a pair of inclined surfaces according to the present invention.

FIG. 5 is a sectional view showing still another shape of the groove having a pair of inclined surfaces in the present invention.

FIG. 6 is a perspective view showing a state of an element coated with a conductive adhesive according to an embodiment of the present invention.

7 is a partial side view showing a state in which the device shown in FIG. 6 is bonded onto a substrate.

FIG. 8 is a perspective view showing a state in which a conductive adhesive is applied to both ends of a piezoelectric resonance element in a thickness shear vibration mode in another embodiment of the present invention.

9 is a perspective view showing a state in which the piezoelectric resonance element shown in FIG. 8 is mounted on a substrate.

FIG. 10 is a sectional view for explaining a state in which a conductive adhesive is applied to elements having different lengths in the present invention.

FIG. 11 is a cross-sectional view for explaining a conventional bonding agent coating method.

[Explanation of symbols]

1 ... element 2 ... Suction nozzle 10 ... Conductive adhesive 11 ... V-shaped groove 11a, 11b ... inclined surface 12, 14, 16 ... Conductive adhesive application stage 13, 15, 17 ... Squeegee head 14a, 16a ... Groove 20 ... substrate 21 ... Terminal electrode 30 ... Piezoelectric resonance element 31, 33 ... External electrodes 32, 34 ... Excitation electrodes 35, 36 ... Elements with different lengths 40 ... Cap

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-8-125105 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/52

Claims (8)

(57) [Claims] 1. A bonding agent is applied to the lower surfaces of both ends of the element,
A method of manufacturing an electronic component, in which the element is bonded and mounted on a substrate with the bonding agent, wherein the bonding agent is applied to a pair of inclined surfaces that are inclined so as to spread toward each other upward, After locating the element above the inclined surface of the device, lower the element and bring the edges of the bottom and side surfaces of both ends of the element into contact with the corresponding inclined surfaces, thereby correcting the displacement of the element. In addition, a method for manufacturing an electronic component, characterized in that the bonding agent is applied to the lower surface and the side surface of both ends of the element. 2. The method of manufacturing an electronic component according to claim 1, wherein the pair of inclined surfaces are inclined surfaces of a V-shaped groove or a U-shaped groove. 3. The method of manufacturing an electronic component according to claim 1, wherein the bonding agent is a conductive adhesive. 4. The method of manufacturing an electronic component according to claim 3, wherein the external electrode of the element and the terminal electrode on the substrate are electrically connected by the conductive adhesive. 5. The element according to claim 1, which is a piezoelectric element.
The method for manufacturing an electronic component according to any one of 1. 6. A bonding agent is applied to the lower surfaces of both ends of the element,
A manufacturing apparatus of an electronic component for bonding and mounting the element on a substrate with the bonding agent, wherein the element is held so that the element can be moved in a horizontal direction in order to correct the positional deviation of the element, A holding and conveying means for conveying the element to a predetermined position, and a pair of inclined surfaces inclined so as to spread upward from each other, and a bonding agent for applying to both end portions of the element is provided on the inclined surfaces. A bonding agent applying means to be applied, wherein the holding and conveying means positions the element above a pair of inclined surfaces of the bonding agent applying means, and then an edge composed of lower and side surfaces of both ends of the element. By lowering the element until the parts come into contact with the corresponding inclined surfaces, the positional deviation of the element is corrected, and the bonding agent is applied to the lower surface and the side surface of both ends of the element. Of electronic components Forming apparatus. 7. The apparatus for manufacturing an electronic component according to claim 6, wherein the holding and conveying means has a suction nozzle that sucks and holds the upper surface of the element. 8. The pair of inclined surfaces of the bonding agent applying means comprises:
The inclined surface of a V-shaped or U-shaped groove.
The electronic device manufacturing apparatus described in.