JP3404438B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor plastic package, and more particularly to a method of fixing and supporting components of a BGA package and a method of manufacturing the same.

[0002]

2. Description of the Related Art The structure of a semiconductor package is becoming smaller and thinner in order to achieve high-density packaging. Also, the amount of information processing per chip tends to increase,
The number of input / output pins per package tends to increase. However, since the package size cannot be made too large, the lead pin spacing tends to become very narrow as the number of pins increases. Therefore, under the present circumstances, a high level mounting technique is required for mounting on a circuit board. In order to facilitate this mounting, in recent years, packages having an external connection structure such as PGA (pin grid array) or BGA (ball grid array) whose external connection form is different from the conventional structure have come to be seen. .

The BGA package includes a face-up type and a face-down type.

As an example of a face-up type BGA package, a schematic structure of the BGA disclosed in US Pat. No. 5,216,278 will be described with reference to FIGS. 49 to 51.

FIG. 49 shows a sectional view of the BGA package. The IC chip 1 and the substrate 2 are fixed with an adhesive or the like. An organic material (for example, BT resin) is used as the material of the substrate. IC chip 1 and pad 1 on the substrate
2 is electrically connected by wire bonding 13.

FIG. 50 is a plan view of FIG. 49 seen from above. From the pad 12 on the substrate connected by the wire bonding 13, the wiring 1 for communicating with the electrode 3
05 are provided, and each is electrically connected to the back surface of the substrate through the through hole 106.

FIG. 51 shows a plan view of FIG. 49 seen from below. The electrodes 3 are arranged in a grid pattern, and the metal bumps 4 are bonded thereto to complete the electric wiring. The surface of the substrate on which the IC chip 1 of this component is mounted is covered with a resin 14 to protect it and the package shape is completed.

From the viewpoint of productivity when molding a semiconductor package, it is usual to install a plurality of cavities in a molding die to perform resin filling. Therefore, with this structure, there are problems that positioning in the mold becomes difficult, and the process of taking out the molded product becomes very complicated.
Due to these factors, the production cost is expected to rise and there is a problem that the product becomes expensive.

An example of a face-down type BGA package will be described with reference to FIGS. 52 to 53, which is a schematic structure of the BGA disclosed in US Pat. No. 5,148,265.

FIG. 52 shows a perspective view of the BGA package. The IC chip 1 has a structure in which an insert 32 such as silicone rubber is placed on the circuit surface of the IC chip 1 and a wiring film 31 having a wiring pattern is placed thereon. The IC chip 1 and the wiring film 31 are connected by wire bonding 13.

FIG. 53 shows an enlarged sectional view of the connecting portion. The insert 32 is made of a flexible material such as silicone resin. The IC chip 1 of this component and the portion of the wiring film excluding the electrodes 33 are covered with a flexible resin 14 such as a silicone resin to protect and protect the package. At this time, the same problems as those described in the face-up type may be considered. That is, from the viewpoint of productivity, it is usual to install a plurality of cavities in a mold and perform resin filling during molding. Therefore, with this structure, there are problems that positioning in the mold becomes difficult, and the process of taking out the molded product becomes very complicated. Due to these factors, the production cost may increase and there is a problem that the product becomes expensive.

On the other hand, regarding the molding method including the substrate, the substrate is usually placed between the upper mold and the lower mold, and the cavity is filled with the resin. Therefore, it is necessary to provide a runner, which is a flow path for filling the resin, and a gate portion on the substrate, which is a constraint in designing an electric circuit. Furthermore, in the process of removing unnecessary runners and gates, the substrate may be damaged and reliability may be reduced.

Further, as a molding method without a runner which is a flow path for filling a resin on a substrate and a gate portion, Japanese Patent Publication No. 61-46049 and JP-A-4-184944
Many examples can be found in the gazette and other publications. Japanese Patent Publication 61-46049
In the gazette, a runner or a gate part, which is a flow path for filling a resin into a cavity, is made in a molding die, and a cavity part is made by another plate component (referred to as a cavity plate). It is installed and molded. In this method, there are no restrictions in designing the electric circuit of the substrate, but when making a thin product, the cavity plate also becomes thin, so there is another problem such as deformation of the plate itself or removal of resin burr generated on the substrate. Problems can occur. Further, there is a problem that the cavity plate must be replaced every time molding is performed, and automation of the molding process is difficult.

In Japanese Patent Laid-Open No. 4-184944, a mold structure in which a runner, which is a flow path for filling a resin, and a gate part are incorporated into a mold and these parts slide when the mold is opened. It has been described. However, since the resin flows on the sliding portion, the resin easily flows into this sliding portion, which causes resin burrs to cause sliding resistance, which tends to cause malfunction. In addition, this malfunction can be a serious problem in production.

[0015]

The above-mentioned prior art has a problem that it is difficult to position the above-mentioned parts within a molding die used for resin molding. Further, there is a problem that it is difficult to achieve automation and labor saving such as complicated molding process. Due to these factors, there is a problem that the price of the product becomes high.

In the molding including the substrate, there is a problem in that the resin flow path in the mold has a sliding portion, and the resin enters this portion to form a resin burr, which easily causes a malfunction and reduces the production efficiency. In addition, when the runner or gate part that is the resin flow path is made in the molding die and the cavity part is used as another plate component (cavity plate), it is installed in the mold together with the substrate and molded, when making a thin product However, since the cavity plate is also thin, there is a problem that the plate itself is deformed. Further, there is a problem in that the cavity plate needs to be replaced for each molding, making it difficult to automate the molding process, reducing the molding efficiency, and increasing the price of the product.

It is an object of the present invention to provide a BGA package structure and a manufacturing method which can eliminate the above-mentioned drawbacks and can be manufactured with high productivity and at low cost.

[0018]

In order to achieve the above object, the present invention provides a BGA package structure using a supporting frame for fixing and supporting an IC chip, a substrate or a wiring film. A BGA package structure in which an IC chip, a substrate, or a wiring film is covered with a resin.

The following is a more specific description of the present invention.

As a first aspect of the present invention, an IC chip and a laminated circuit board (hereinafter abbreviated as a board) on which the IC chip is mounted and connected or a wiring film (hereinafter referred to as a wiring) having a wiring pattern formed on an insulating base material. (Hereinafter abbreviated as a film) and an electrode portion for connecting those electric circuit components to the outside, and a metal frame is formed on the electrode portion, in a semiconductor device, a supporting frame for fixing and supporting the IC chip, the substrate or the wiring film. And a semiconductor device having at least a portion other than the electrode portion sealed with an organic substance.

In this case, it is preferable that the support frame is made of a metal material.

The support frame preferably fixedly supports either the IC chip, the substrate or the wiring film.

According to a second aspect of the present invention, an IC chip and a laminated circuit board (hereinafter abbreviated as a board) on which the IC chip is mounted and connected or a wiring film (hereinafter referred to as a wiring) having a wiring pattern formed on an insulating base material. (Hereinafter abbreviated as a film) and an electrode portion for connecting those electric circuit components to the outside, and a metal frame is formed on the electrode portion, in a semiconductor device, a supporting frame for fixing and supporting the IC chip, the substrate or the wiring film. There is provided a semiconductor device characterized in that

According to a third aspect of the present invention, an IC chip and a laminated circuit board (hereinafter abbreviated as a board) on which the IC chip is mounted and connected or a wiring film (hereinafter referred to as wiring) having a wiring pattern formed on an insulating base material. (Hereinafter abbreviated as a film) and an electrode portion for connecting those electric circuit components to the outside, and a metal frame is formed on the electrode portion, in a semiconductor device, a supporting frame for fixing and supporting the IC chip, the substrate or the wiring film. There is provided a semiconductor device having the outer frame removed.

In each of the above aspects, it is preferable that the IC chip and the substrate are fixedly supported and the IC chip and the substrate are connected by a bonding wire.

Further, it is preferable that the IC chip and the wiring film are fixedly supported, and the IC chip and the wiring film are connected by bonding wires, metal bumps or adhesive bonding with a conductive resin.

In the first aspect, the organic substance is sealed in such a manner that all the components except the chip mounting surface where the IC chip and the substrate are connected by a bonding wire and the electrode portion connected to the outside on the substrate are sealed. Alternatively, the chip mounting surface and the side surface of the substrate may be sealed or only the chip mounting surface may be sealed.

In the first aspect, the organic material is sealed in such a manner that the IC chip and the wiring film are connected by metal bonding or conductive resin, and the mounting surface of the IC chip and the wiring film and on the wiring film. It may be one that seals the portion excluding the external electrode portion, seals the joint surface between the IC chip and the wiring film, or seals all the components.

According to a fourth aspect of the present invention, a laminated circuit board (hereinafter abbreviated as "substrate") or a wiring film having a wiring pattern formed on an insulating base material, and an IC chip are provided on a support frame. At least one of the IC chip, the substrate or the wiring film, and the support frame is mounted and at least one of them is electrically connected to the IC chip and the substrate or the wiring film. Provided is a method for manufacturing a semiconductor device, which comprises filling and sealing a portion with an organic material, and then forming a solder bump.

In this case, it is preferable that the filling and sealing of the organic material be performed using a molding die.

Further, the molding die includes an upper mold and a lower mold which is provided corresponding to the position where the solder bumps are formed and which has a protrusion for molding the shape of the portion where the solder bumps are formed. In the filling and sealing of the organic material, a supporting frame having the IC chip and the substrate or the wiring film electrically connected to each other is mounted on the upper die and the lower die. It may be carried out by sandwiching the resin between and and pressing the resin into the molding die.

According to a fifth aspect of the present invention, a molding die used for resin molding of a semiconductor device comprises an upper mold and a lower mold having a cavity, wherein the lower mold is the semiconductor device. Provided is a molding die characterized in that the cavity has a protrusion arranged in the same pattern as the arrangement pattern of the electrode portion exposed to the outside.

In this case, it is preferable that the lower die has an air vent on the surface provided with the protrusion.

[0034] The air vent is preferably provided substantially at the center of the area provided on the Ki突 Okoshibutsu.

The lower mold is composed of a plurality of parts, and the air vent is preferably formed as a gap at the boundary between the parts. Furthermore, it is preferable that a part of the components be configured to be able to protrude into the cavity.

Further, it is preferable to further include a flexible object having elasticity, which covers the top of the protrusion.

The soft material may be a rubber resin.

The above-mentioned flexible material is a silicone rubber type, or
It may be a resin of polytetrafluoroethylene type.

The surface on which the protrusion is provided is preferably the bottom surface of the cavity.

As a sixth aspect of the present invention, a laminated circuit board (hereinafter abbreviated as “substrate”) or a wiring film having a wiring pattern formed on an insulating base material, the above-mentioned substrate or wiring film, Of the electrically connected IC chip, the IC chip, the substrate or the wiring film, a supporting frame, the IC chip, the substrate or the wiring film, and the supporting frame. At least one has a sealing material that seals at least a part thereof, and a plurality of electrode portions that are electrically connected to the IC chip through the substrate or the wiring film and that are exposed to the outside. A semiconductor device is provided.

The electrode portions may be arranged in a grid pattern.

[0042]

The above-mentioned first to third aspects will be described.

If the above-mentioned means is used, positioning in the molding die cavity is facilitated, and a large number of pieces can be taken in the molding process. By giving the support frame a function as a heat dissipation plate, it is possible to reinforce the strength of the substrate and reduce the warp. Also,
By sealing the IC chip, the substrate or the wiring film with a resin, it is possible to improve the moisture resistance reliability and reduce the warpage of the BGA package. At the same time, the use of the support frame facilitates automation of each process and improves productivity efficiency.

The fourth, fifth and sixth aspects will be collectively described.

First, the substrate or wiring film and the IC chip are mounted on a support frame and electrically connected. And for at least one of these,
At least a part thereof is filled and sealed with an organic material. The sealing is performed by sandwiching a support frame on which an IC chip or the like is mounted between an upper die and a lower die of a molding die and pressing a resin into the molding die.

In this case, the filling and sealing of the organic material is performed using a molding die (upper die / lower die). If the semiconductor device you are trying to manufacture is a BGA type,
Protrusions arranged in the same pattern as the electrode portion arrangement pattern of the semiconductor device are provided on the bottom surface of the cavity of the lower mold. A shape around the electrode pad portion is formed by the protrusion.

When such a protrusion is provided, the flow of the organic material in the lower mold cavity (particularly in the region where the protrusion is provided) becomes worse than that in the upper mold cavity, and the protrusion is provided. Air (voids) tends to remain in the area where it is present. Therefore, by providing an air vent on the surface on which the protrusion is provided, it is possible to prevent such a void from remaining. The air vent can be technically easily realized if it is realized as a gap between a plurality of parts constituting the lower mold (realized by forming the lower mold with one part and providing a single hole in this). Of course it does not matter). In BGA type,
Since the electrode pads are arranged on the entire lower surface of the semiconductor device, finally, the voids also gather at the center of the lower surface. Therefore, by setting the air vent also at the center of the lower side surface (that is, substantially the center of the region where the protrusion is provided), the air (void) can be reliably discharged to the end.

As described above, the flow of the organic material is better in the upper mold cavity. Therefore, during molding, the support frame and the like are in a state of being pushed toward the protrusion by the organic material filling the cavity of the upper mold. This allows
A flexible object (for example, rubber-based resin,
In particular, silicon rubber type and polytetrafluoroethylene type) elastically deform to fill the gap between the electrode pad part and the climbing part of the protrusion. This can prevent the occurrence of burrs in the gap.

If a part of the parts forming the lower mold can be projected into the cavity, it can also serve as a projecting pin for assisting the mold release of the molded product.

After sealing with the organic material as described above, solder bumps are formed on the electrode pad portions to complete the semiconductor device described as the sixth aspect.

[0051]

EXAMPLE An example of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the outline of the BGA package structure of the first embodiment. Face-up type B
The structure of the GA package is as follows. The IC chip 1, the laminated circuit board 2, the electrodes 3 for external conduction on the board mounting surface, the metal bumps 4 to be bonded to the electrodes 3 to be external electrodes, and the supporting frame for fixing them ( i) It consists of 5.
That is, the support frame (i) 5 includes an outer frame 6, a board fixing frame suspension lead 7, a board fixing frame 8, and a tab suspension lead 9.
And a tab 10. The IC chip 1 and the substrate 2 are fixed from above and below with the tab 10 as the center by an adhesive or the like. The base material of the substrate 2 may be an insulator. The wiring is electrically connected to the pad 11 portion of the IC chip 1 and the wiring pad portion 12 of the substrate 2 by wire bonding with a gold wire 13 or the like. Wirings (not shown) for obtaining conduction with the electrodes 3 on the back surface of the substrate 2 are formed from the pads 12 on the front surface of the substrate 2 which are connected by wire bonding. It goes without saying that these electric wirings are protected by an insulator (not shown). Those that are electrically connected to the back surface of the substrate 2 are wired to the respective electrodes 3. In this state, the entire portion except the electrode 3 on the mounting surface of the substrate 2 installed in the molding die is sealed and protected by the resin 14 to complete the package shape. After resin encapsulation, metal bumps such as solder balls are joined to the electrodes 3 to complete electrical wiring and become a product.

2 to 4 show the outline of the manufacturing process and the respective schematic views. The resin molding is usually carried out by multi-cavity molding, and the manufacturing process in this case will be described below. FIG. 2 shows an outline (a) of a process of assembling the IC chip 1, the substrate 2, and the support frame (i) 5, which are the components. That is, the support frame (i) 5 has a multiple structure so that a plurality of moldings can be formed, and has a structure as shown in (c). The IC chip 1 (b) is mounted on each tab 10 portion on the multiple support frame (i) 5 (c) and fixed by an adhesive or the like. Next, the substrate 2 (d) is fixed from the back side of the multiple support frame (i) 5 (c) to the back side of the tab 10 and the board fixing frame 8 part with an adhesive or the like, and the tab 10 part is sandwiched therebetween. To manufacture.
Guide holes (not shown) for automatically performing each manufacturing process are provided on the outer frame of the multiple support frame (i) 5 (c).
Is provided. After that, a pad portion (not shown) on the IC chip 1 and a pad portion (not shown) on the substrate 2 are connected to the gold wire 13.
Wire bonding is performed by using the above method to establish continuity with the substrate 2 to complete the chip / substrate mounting multiple support frame 15 (e).

FIG. 3 shows an outline (a) of a step of resin molding using the chip / substrate mounting multiple support frame 15. Here, a case of transfer molding using an epoxy resin which is a thermosetting resin will be described. A chip / substrate mounting multiple support frame 15 (b) is installed in a cavity 17 provided in a molding die (i) 16 (c). At this time, the molding die (i) 16 is in a state of being heated to a temperature at which the epoxy resin is cured. Next, the molded resin tablet (not shown) is put into a pot (not shown) in the mold and pressed by a plunger (not shown). The resin 14 pressed by a plunger (not shown) is heated and melted, flows through the runner 18 → gate 19 in the mold, flows into the cavity 17, and is cured by a curing reaction to become a molded product. Enlarged view of the inside of the cavity 17 (d)
Will be explained. That is, the multiple support frame 15 is sandwiched between the upper mold 20 and the lower mold 21, and chips /
10 tabs on which a board is mounted are installed. At this time, the chip / substrate mounting multiple support frame 15 is positioned in the cavity 17 by a positioning hole (not shown) provided on the support frame and a positioning pin (not shown) in the mold. Needless to say. In this way, the resin is made to flow in the state of being installed in the cavity 17, and the resin sealing is completed by covering all but the electrode portion. At this time, the resin molding is completed in a state where only the electrode 3 is exposed by preventing the resin 14 from entering the electrode 3 on the mounting surface side of the substrate 2 by the protrusion 22 provided in the cavity of the lower mold 21.

FIG. 4 shows an outline (a) of the steps from the molded product to the finished product. The resin-molded molded product 23 (b) is separated from the molded product 23 by cutting the support frame outer frame 6 portion, the gate 19 and the runner 18 portion, which are unnecessary after resin molding, by the cutting die 24 (c). It The separated cut-molded product 25 (d) then proceeds to step (e) for forming the external electrode portion. That is, for example, a ball-shaped solder 4 is supplied to the electrode 3 portion of the substrate mounting surface that has been exposed previously, and heat bonding is performed to complete the final external electrode portion 26, and all steps are completed to complete the resin sealing type. BGA package (f)
To complete. As described above, by using the multiple chip / substrate mounting support frame 15, the resin sealing step can be performed by a general transfer molding method that is currently performed, so that the production cost can be reduced and the production efficiency can be improved. Further, in the case of a substrate made of an organic substance by sealing the chip / substrate with a resin, it is considered that moisture absorption from the substrate can be prevented and thus the reliability of moisture resistance can be greatly improved. Further, in the case of a product that needs to cool a lot of chip heat during operation, there is a feature that the heat radiation effect is improved through the tab portion under the chip and the substrate fixing frame portion. Further, when high heat dissipation is required, the previously cut support frame outer frame 6 portion can be used as a heat dissipation plate without cutting.

A second embodiment of the present invention is shown in FIG. Figure 5
FIG. 9 is a perspective view of a BGA package structure including a tab suspension lead portion and a support frame (ii) 27 having no tab portion in the support frame constituent portion. That is, the IC chip 1
The substrate 2 is directly bonded to the supporting frame (ii) 27 by bonding the substrate 2 and the substrate fixing frame 8 portion.
Such a structure is effective in reducing the package thickness. Further, the arrangement of the pads 12 on the substrate 2 is characterized in that it can be freely designed. Further, there is a feature that the wire bonding process for connecting the chip and the substrate is also easy. Further, the resin molding may be carried out by replacing the molding die 16 shown in FIGS. 3C and 3D with a molding die (ii) 40 structure shown in FIG. Needless to say, the cutting die 24 shown in FIG. 4C may be replaced depending on the shape of the molded product.

A third embodiment of the present invention is shown in FIG. This is a perspective view of a BGA package structure composed of a support frame (iii) 28 for bending the board fixing frame suspension lead 7 and fixing and adhering the board fixing frame portion 8 to the mounting surface side of the board 2 where the electrode 3 is located. is there. With such a structure, the pads on the substrate 2 can be freely arranged, and it is possible to cope with a large number of pads. Further, there is a feature that the wire bonding process for connecting the chip and the substrate is also easy. The resin molding may be performed by replacing the molding die 16 shown in FIGS. 3C and 3D with the molding die (iii) 41 structure shown in FIG. Needless to say, the cutting die 24 shown in FIG. 4C may be replaced depending on the shape of the molded product.

The first to third embodiments described above are the electrodes 3 of the substrate 2.
It has a structure in which all parts other than the parts are sealed with resin, which has the effect of ensuring high moisture resistance reliability. It goes without saying that this sealing has the same effect even if a sealing method using an inorganic material is used.

Next, a package structure in which the side surface of the substrate is resin-sealed will be described. A fourth embodiment of this structure is shown in FIG. The structure of the support frame is similar to that of the first embodiment. A fifth embodiment is shown in FIG. The support frame structure is similar to that of the second embodiment.

The fourth and fifth embodiments are characterized in that they can be easily dealt with when the number of electrodes 3 on the substrate is large and resin sealing becomes difficult. The resin molding is performed by using the molding die 16 shown in FIGS. 3C and 3D as the molding die (iv) 42 structure shown in FIG. 28 in the fourth embodiment and shown in FIG. 29 in the fifth embodiment. The molding die (v) 43 may be replaced with the one having the structure. Also,
It goes without saying that the cutting die 24 shown in FIG. 4C may be replaced depending on the shape of the molded product. Further, there is a feature that the production of the cavity portion of the molding die (the projection portion of the lower die cavity portion is unnecessary) is facilitated and the production cost can be reduced.

Next, a package structure in which the chip / substrate mounting surface is resin-sealed will be described. A sixth embodiment of this structure is shown in FIG. The structure of the support frame is similar to that of the first embodiment. The seventh embodiment is shown in FIG. The support frame structure is similar to that of the second embodiment. There is a feature that the molding die can be easily manufactured and the production cost can be reduced.

The sixth and seventh embodiments are characterized in that they can be easily dealt with when the number of electrodes 3 on the substrate is large and resin sealing is difficult. The resin molding is performed by using the molding die 16 shown in FIGS. 3 (c) and 3 (d) as a molding die (vi) 46 structure shown in FIG. 30 in the sixth embodiment and shown in FIG. 31 in the seventh embodiment. It may be replaced with a molding die (vii) 47 structure. Needless to say, the cutting die 24 shown in FIG. 4C may be replaced depending on the shape of the molded product. Further, there is a feature that the production of the cavity portion of the molding die (the projection portion of the lower die cavity portion is unnecessary) is facilitated and the production cost can be reduced.

The substrate material used in the above-mentioned first to seventh embodiments has been mainly described as being made of an organic material.
It goes without saying that there is no problem even if an inorganic substance is used according to the purpose. Furthermore, what can be said in common to the first to seventh embodiments is that by using the support frame, damage to the substrate can be eliminated even when the runner and the gate, which are unnecessary after molding, are cut. That is, since the resin-sealed product is connected to the outer frame of the support frame only by the frame-fixing frame suspension leads, the stress applied to the substrate at the time of cutting can be eliminated and the reliability can be improved. Further, when the chip generates a lot of heat during operation and high heat dissipation is required, the previously cut support frame outer frame 6 portion can be used as a heat dissipation plate without cutting.

11 to 16 show patterns of one molded product portion of the support frame used in the first to seventh embodiments. Figure 1
Reference numeral 1 shows a support frame used in the first, fourth and sixth embodiments. The outer frame 6 and the substrate fixing frame 8 are connected by a substrate fixing frame suspension lead 7, and the tab 10 is connected by a tab suspending lead 9 to the substrate fixing frame 8. FIG. 12 shows a supporting frame used in the second, fifth and seventh embodiments. The outer frame 6 and the board fixing frame 8 are connected by a board fixing frame suspension lead 7. FIG. 13 shows a supporting frame used in the third embodiment. Outer frame 6 and board fixing frame 8
Has a structure in which they are connected by a frame fixing lead 7 for fixing a substrate. The board fixing frame suspension leads 7 are bent, and the board fixing frame 8 is located below the outer frame 6. Here, the connection of each element is described in four places, but the number of leads to be connected may be increased or decreased as necessary.

FIGS. 14 to 16 show one molded product portion of the support frame when the substrate fixing frame 8 is formed in the shape of the substrate fixing leads 30 which are adhered at four points instead of the form of the substrate fixing frame 8. It goes without saying that the use of such a support frame has the same effect as described above. The support frame shown in FIGS. 11 to 16 is, for example, Fe-Ni.
A metal material such as an alloy or a Cu alloy may be used. Further, although the description has been given of the case where each element is connected at four places, the number of connected leads may be increased or decreased as necessary.

The outer frame 6 of the support frame described with reference to FIGS. 14 to 16 has a structure in which guide holes 29 are provided for positioning in each manufacturing process.

Next, a perspective view of a face-down type BGA package structure according to an eighth embodiment of the present invention is shown in FIG.
7 shows. The structure of the BGA package is IC chip 1,
A wiring film 31 (hereinafter abbreviated as a wiring film) having a wiring pattern formed on a heat-resistant insulating base material, an insulating insert 32, an electrode 33 on the wiring film 31 and an electrode 33 connected to the electrode 33 to serve as an external electrode. It is composed of metal bumps 4 and a supporting frame (iv) 34 for fixing them. That is, the support frame (iv) 34 is composed of the outer frame portion 6, the tab suspension leads 9 and the tab portion 10.
The back surface side of the IC chip 1 is fixed to the tab portion 10 with an adhesive or the like. The wiring is a pad portion (not shown) of the IC chip 1 and a wiring pad portion (not shown) of the wiring film 31.
Are metal-bonded and electrically connected. This film 3
Wiring is connected from the pad on 1 to each external electrode 33. In this state, the external electrode 33 is installed in the molding die.
The portion except for the back surface side of the tab 10 is sealed and protected by the resin 14 to complete the package shape. After resin encapsulation, metal bumps 4 such as solder balls are joined to the electrode portions 33 to complete electrical wiring and become a product.

The manufacturing process is different from that described in the first embodiment in its constituent members, and therefore its outline is shown in FIG.
Since the resin molding is usually performed in a multi-cavity molding, this case will be described. FIG. 18 shows an outline (a) of a process of assembling the IC chip 1, the wiring film 31, the insert 32, and the support frame (iv) 34, which are the components. That is, the support frame (iv) 34 has multiple structures so that a plurality of moldings can be formed, and has a structure as shown in (e). The IC chip 1 (d) is attached to the tab portion 10 on the multiple support frame (iv) 34 (e).
Mounted and glued. Next, the insulative insert 32 (c) is placed and bonded to a portion of the IC chip 1 other than the pad portion. Finally, the pad portion (not shown) of the wiring film 31 (b) and the chip pad portion (not shown) are aligned and bonded to the insert 32 (c). This multiple support frame (iv) 3
Guide holes (not shown) for automatically performing each manufacturing process are provided on the outer frame 4 (e). IC chip 1
The wiring film 31 and the wiring film 31 are electrically connected to each other by, for example, heat bonding of a metal material such as Au or a solder alloy, or adhesive bonding using a conductive resin such as an epoxy resin containing metal powder. As a result, the chip / wiring film mounted multiple frames 35
(F) is completed. After that, the same process as the process shown in FIGS. 3 to 4 described in the first embodiment is performed. In this step, the resin molding may be performed by replacing the molding die 16 shown in FIGS. 3C and 3D with the structure of the molding die (viii) 48 shown in FIG. Further, it goes without saying that the cutting die 24 shown in FIG. 4 (c) is replaced according to the shape of the molded product. With such a structure, the back surface of the tab 10 is exposed, so that high heat dissipation can be obtained. Further, there is a feature that a forced cooling mechanism such as a cooling fin can be easily attached. Further, since the parts other than the external electrodes 33 on the wiring film 31 are sealed with a resin, the humidity resistance is improved.

Next, the external electrodes 33 on the wiring film 31.
Other than the ninth embodiment, which is sealed with resin 14 except for FIG.
Shown in. The resin molding may be performed by replacing the molding die 16 shown in (c) and (d) of FIG. 3 with the structure of the molding die (ix) 49 shown in FIG. 33. Further, it goes without saying that the cutting die 24 shown in FIG. 4 (c) is replaced according to the shape of the molded product. With such a structure, the structure has characteristics suitable for those requiring high moisture resistance reliability.

Next, a tenth embodiment is shown in FIG. This is one in which only the chip / wiring film pad portion joint portion is resin-sealed. The resin molding is shown in FIG.
The molding die 16 shown in (d) may be replaced with the molding die (x) 50 shown in FIG. 34. Also,
It goes without saying that the cutting die 24 shown in FIG. 4 (c) is replaced according to the shape of the molded product. Such a structure has characteristics suitable for thinning the package.

In this structure, the BGA package structure in the case where the number of external electrodes is too large to be arranged within the chip size is shown in FIG. 21 as an eleventh embodiment. The support frame (v) 36 is used for mounting the chip outer electrode by extending the extension tabs 37 from the four sides of the tab portion 10 as needed. By bending the expansion tab 37 and the tab suspension lead 9, the height is adjusted in advance so as to be the same height as the electrode portion 39 on the expansion wiring film 38 arranged on the IC chip 1. As a result, the flatness when the expansion wiring film 38 is adhesively fixed is maintained. In this state, resin sealing is performed to form a BGA package. The manufacturing process goes through the steps of assembling the constituent parts described with reference to FIG. 18 and the same steps as the steps shown in FIGS. 3 to 4 described in the first embodiment. In this step, the resin molding may be performed by replacing the molding die 16 shown in FIGS. 3C and 3D with the structure of the molding die (xi) 51 shown in FIG.
Further, it goes without saying that the cutting die 24 shown in FIG. 4 (c) is replaced according to the shape of the molded product. in this way,
There is a feature that a large number of electrodes can be easily accommodated by changing the shape of the expansion tab portion 37 of the support frame (v) 36. In addition, the flatness of the extended wiring film 38 can be easily ensured. Since the tab portion 10 is exposed, it is easy to attach the cooling mechanism. Further, there is a feature that the heat radiation effect through the expansion tab portion 37 is large. Needless to say, the moisture resistance reliability is improved by the resin sealing.

A twelfth embodiment is shown in FIG. 22 and a thirteenth embodiment is shown in FIG. In this, the resin 14 sealing portion is changed according to the necessity of the product. The resin molding is performed by using the molding die 16 shown in FIGS. 3C and 3D and the structure of the molding die (xii) 52 shown in FIG. 36 in the twelfth embodiment.
In the thirteenth embodiment, the molding die (Xiii) 53 shown in FIG. 37 is used.
You can replace it with the one of the structure. In addition, FIG.
It goes without saying that the cutting die 24 shown in (4) is replaced according to the shape of the molded product. These are the first package structures
It goes without saying that it has the same features as those described in the first embodiment.

What is common to the eighth to thirteenth embodiments is that by using the supporting frame, damage to the substrate can be eliminated even when the runner and the gate, which are unnecessary after molding, are cut. That is, since the resin-sealed product is connected to the outer frame of the support frame only by the tab suspension leads, the stress applied to the chip and the wiring film at the time of cutting can be eliminated and the reliability can be improved. Further, when the chip generates a large amount of heat during operation and high heat dissipation is required, the expansion tab portion serves as a heat dissipation plate, which has a characteristic of enhancing cooling efficiency. Further, there is a feature that the previously cut support frame outer frame 6 portion can be used as a heat dissipation plate without being cut.

The patterns of one molded product portion of the support frame used in the eighth to thirteenth examples are summarized in FIGS. FIG. 24 shows a supporting frame used in the eighth to tenth embodiments. The outer frame 6 and the tab 10 are connected by a tab suspension lead 9. FIG. 25 shows the first
It is what shows the support frame used for the Examples 1-13. The outer frame 6 and the tab 10 are connected by a tab suspension lead 9, and the extension tabs 37 project from the four sides of the tab 10. The expansion tab 37 and the tab suspension lead 9
Is bent and the electrode portion 39 on the extended wiring film 38 is bent.
The height is adjusted in advance so that all of them have the same height. Here, the connection of each element was described at four places, but the number of leads to be connected may be increased or decreased as necessary. Further, the support frame in FIGS. 24 and 25 may be made of, for example, a metal material such as Fe—Ni alloy, Cu alloy or the like. The outer frame 6 of the supporting frame shown in FIGS. 24 and 25 has a structure in which a guide hole 29 is provided for positioning in each manufacturing process.

In molding the first, second, third, eighth, ninth, eleventh, and twelfth embodiments, it is necessary to eliminate appearance defects such as voids in the molded product and to bond the solder bumps and the like to the substrate electrode. It is necessary to solve the two problems that no resin burr is generated on the surface. Therefore, methods for solving the two problems will be described below.

A method for solving the above problem will be described.

First, the resin filled state when the package of the above embodiment is molded will be schematically described with reference to FIGS. 38 to 40. This shows the problem void generation process and the method for preventing it.

FIG. 38 schematically shows a resin filled state at the time of molding.

FIG. 38A shows a process in which the resin 14 having passed through the gate 19 fills the inside of the cavity. Figure 38
38B is a sectional view taken along the line I-I of FIG. Figure 3
9 (a) and FIG. 39 (b) show the subsequent resin filling state.

The solid line 54 schematically shows the resin flow front end of the upper mold cavity portion, and the broken line 54 shows the resin flow front end of the lower mold cavity portion at the same time.

As can be seen from FIG. 39, the upper mold cavity 56 and the lower mold cavity 57 have greatly different resin flow channel shapes. For this reason, when the resin flows, the filling of the upper mold cavity portion 56 is completed much faster than the filling of the lower mold cavity portion 57. The lower die cavity 57, which has a complicated flow path, is filled later than this. Upper mold cavity 5
After filling 6 parts, in the lower mold cavity 57 parts,
The resin filling proceeds from the four sides toward the center. Therefore, as shown in FIG. 39, in the lower mold cavity 57, air (voids) in the lower mold cavity is generated.
58 loses his escape and becomes trapped.

Even when the resin filling is finally completed, as shown in FIG. 40, the air (void) 58 remains in the center of the lower mold cavity 57, resulting in defective molding.

In the present invention, an air vent is provided in the lower mold cavity of the molding die to eliminate the void 58 and prevent defective molding. Hereinafter, the molding die will be described as a fourteenth embodiment with reference to FIGS.

FIG. 41 is an enlarged view of the central portion of the lower die cavity portion 57. In this embodiment, a passage (hereinafter, referred to as an air vent) 5 for letting out air that becomes a void is provided.
9 is provided in the lower mold cavity portion 57.

The air vent must be sized so that only air escapes and no resin can enter. Since it is technically difficult to directly form a hole having such a size, in the present invention, the lower mold is divided into a plurality of parts, and the air vent is formed at the boundary between these parts. Specifically, the lower mold cavity portion 57 is provided with a hole having a certain size, and the split component 60 is fitted into the hole like a stopper. Then, by leaving a predetermined clearance on the boundary surface 61 between the two, the clearance serves as the air vent 59. Therefore, the void passes through the air vent 59,
It will escape in the thickness direction of the lower mold cavity 57.

As described above, the lower mold cavity portion 57 is provided with the projections 22 for leaving the electrode portions in a grid pattern. Similarly, on the upper surface of the split part 60, the protrusion 2
2 is provided.

Further, in the present embodiment, this divided part 60
It also protrudes to double as a pin. That is, the divided parts 6
By projecting 0 toward the inside of the cavity 57 as necessary, the mold release of the molded product 23 is assisted. The protruding operation of the divided part 60 causes the outer end of the divided part 60 to
It is realized by attaching to a fixed plate 63 that is configured to be movable in the vertical direction. As a result, the split component 60 can project into the cavity as the fixing plate 63 moves in the vertical direction.

A series of molding steps using such a die will be described with reference to FIG.

FIG. 42A shows an enlarged cross section of the support frame 5 installed in the mold cavity (here, the first embodiment is taken as an example), the substrate 2, and the central portion of the cavity of the IC chip 1. It is a thing.

FIG. 42B shows the filling process of the resin 14. The trapped void 58 flows through the air vent 59 in the thickness direction of the lower mold cavity and is discharged to the outside of the cavity. In the figure, the Voith 5
The flow of 8 is indicated by an arrow.

FIG. 42 (c) shows a state where the molded product is released from the mold after the resin 14 is filled and the heat curing is completed. When the fixing plate 63 is moved so as to approach the mold, the split component 60 is in a state of protruding inside the cavity. As a result, the molded product 23 is released from the mold. Further, the resin burr 64, which is generated when the resin slightly invades the air vent 59, also peels off along with the sliding operation of the divided component 60. Therefore, at the next molding, the air vent 59 returns to the normal state again.

Here, the case where the lower mold cavity portion is divided into two has been described, but it goes without saying that a plurality of divisions may be made if necessary.

Furthermore, although the shape of the divided part 60 is rectangular, it goes without saying that other shapes (rectangular, circular, etc.) may be used.

Further, it goes without saying that surface treatment for facilitating the removal of resin burrs, for example, polytetrafluoroethylene coating or other treatment may be performed.

By providing the air vent in the lower mold cavity in this way, voids can be eliminated. Furthermore, the resin burr adhering to the air vent portion can be automatically removed by making the component for providing the air vent (here, the split component 60) also serve as the projecting pin. Therefore, automation of the molding process is easy.

Next, the process for generating resin burrs on the surface of the substrate electrode which is the subject and the method for preventing it will be described.

Before that, the generation process of resin burr will be described with reference to FIG.

FIG. 43 (a) shows an enlarged cross section of the substrate electrode portion and the lower mold cavity protrusion portion.

Around the electrode 3 of the substrate 2 and wiring (not shown)
Are covered with an insulator 65. Inside the cavity, the electrode surface 66 of the substrate 2 and the climbing portion 67 of the protrusion 22 of the lower mold cavity are in contact with each other. That is, the solid surfaces are in contact with each other. FIG. 43 (b) is a diagram in which the contact portion is further enlarged and schematically drawn. Both the electrode surface 66 and the climbing portion 67 have fine irregularities on their surfaces.
Therefore, a gap 68 exists at the contact portion between the two. When resin molding is performed with such a gap 68, as shown in FIG. 43C, the resin 14 enters the gap 68 and remains on the electrode surface 66 as a resin burr 64.

Further, when viewed from the entire substrate, it is conceivable that resin burrs may be generated due to warp deformation and thickness variation of the substrate itself.

As a method of preventing the occurrence of resin burr caused by these factors, a method of eliminating the gap by forcibly pressing the substrate against the protrusion of the lower mold cavity can be considered. However, in this method, the substrate may be damaged by the pressing force. Therefore, the present invention proposes a method of preventing the resin burr by filling the gap with a release agent or a rubber resin. Hereinafter, a method using a release agent will be described as a fifteenth example, and a method using a rubber resin will be described as a sixteenth example.

A fifteenth embodiment will be described with reference to FIGS.

First, a dummy mold 71 having dummy protrusions 69 arranged in the same pattern as the electrodes 3 on the substrate 2 is formed.
To prepare. Then, the mold release agent 70 is applied to the top of the dummy protrusion 69 (see FIG. 44A). The release agent may be applied to the dummy protrusions 69, for example, by applying the release agent 69 to a plate or the like coated with the release agent. As the release agent, for example, dispersed in a solvent,
A silicone resin type or a polytetrafluoroethylene resin type is preferable. A wax type may be used as long as it is in a liquid state near the molding temperature.

Next, the substrate 2 is placed on the dummy mold 71 (see FIG. 44B). In this case, the dummy protrusion 69
And the electrode 3 are aligned with each other. This allows
The release agent 70 can be transferred to the surface of the electrode 3 (electrode surface 66) (see FIG. 44 (c)).

In this way, the release agent 70 is applied to the electrode surface 66.
Substrate 2 on which is transferred is placed in a mold for resin molding.
Then, the electrode surface 66 of the substrate 2 and the climbing portion 67 of the protrusion 22 of the lower mold cavity are in contact with each other via the release agent 70 (see FIG. 45 (a)).

The gap between the electrode surface 66 and the surface of the protrusion 22 is filled with the release agent 70. As a result, the resin is prevented from entering the gap during molding, and resin burrs can be prevented from occurring (see FIG. 45 (b)).

After molding, a release agent 70 is attached to the electrode surface 66 and the climbing portion 67 (see FIG. 45 (c)). Therefore, after this is removed, solder bumps and other external electrodes are formed on the electrode surface 66 to complete the package.

A sixteenth embodiment will be described with reference to FIGS. 46 to 47.

In this method, it is necessary to prepare a special mold in advance. First, the preparation stage of the mold will be described.

First, a thermosetting rubber resin 72 is applied to the electrode 3 of the substrate 2 (FIG. 46 (a)). Examples of thermosetting rubber-based resins include silicone resin-based and poly-4
Fluorinated ethylene type is preferable. The rubber-based resin 72 can be applied by the same method as the method of applying the release agent in the fifteenth embodiment.

Then, the substrate 2 is placed on a molding die (see FIG. 46 (b)) to transfer the rubber resin 72 to the projection 22 of the lower die cavity (see FIG. 46 (c)). ). Then, the rubber resin 72 is cured under predetermined curing conditions.

In this way, the rubber resin 7 is applied to the protrusion 22.
It is possible to manufacture a mold provided with 2. Next, the manner of resin molding using this mold will be described with reference to FIG.

When the substrate 2 is put into the former mold, the electrode surface 66 of the substrate 2 and the projection 22 of the lower mold cavity are in contact with each other through the rubber-based resin cured product 73 (FIG. 47).
(See (a))). As described above, during resin molding, the upper mold cavity is filled with the resin earlier than the lower mold cavity portion (see FIGS. 38 to 40). Therefore, when the lower die cavity is being filled with resin, the substrate 2 is pressed against the protrusion 22 side of the lower die cavity by the resin filled in the upper die cavity. By pressing the substrate 2 downward in this manner, the electrode surface 66 and the rubber-based resin cured product 73 are brought into close contact with each other. Further, along with this, the rubber-based resin cured product 73
Elastically deforms following the surface irregularities of the protrusions 22,
The gap between the electrode surface 66 and the rubber-based resin cured product 73 is filled (see FIG. 47 (b)). As a result, it is possible to prevent the resin from invading between the two during molding and causing resin burrs.

When the molded product 23 is released after the molding is completed, the elastically deformed rubber-based resin cured product 73 is restored to the original state (see FIG. 47 (c)). Therefore, the mold can be used for the next molding as it is.

Thereafter, external electrodes such as solder bumps are formed on the electrodes 3 of the substrate 2 to complete the package.

The effects of the fifteenth embodiment and the sixteenth embodiment will be described.

If resin burrs are formed on the electrode surface 66, solder bumps cannot be formed on the electrode surface. Therefore, here, the effect is examined based on the yield at the time of forming the solder bumps. The solder bump formability is shown in FIG. The data shown here is an example when the number of electrodes is 400.

In the system in which there is no flexible material between the substrate electrode surface and the mold protrusion, the solder bump formation rate is about 50.
%Met. On the other hand, in the fifteenth and sixteenth examples in which the soft material (the releasing agent 70 or the rubber-based resin cured material 72 described above) is provided on the mold protrusion, the value is almost 100%. Therefore, as in the fifteenth and sixteenth embodiments, by interposing a flexible object between the substrate electrode surface and the mold protrusion, it is possible to absorb the warp of the substrate and the variation in the thickness, and to adhere the both surfaces to each other. The property can be improved and the occurrence of resin burr can be prevented.

Here, the releasing agent and the rubber-based cured product are described, but it goes without saying that the same effect can be obtained as long as it is a flexible product which is deformable at the molding temperature.

[0119]

According to the present invention, by using the support frame, it is easy to improve the productivity and reduce the cost. Further, by sealing the BGA element with a resin, it is possible to greatly improve the moisture resistance reliability and the like. Further, even in the structure in which the number of electrodes is large and the electrodes are arranged on the outside of the chip as in the eleventh to thirteenth embodiments, by changing the shape of the tab in the structure of the support frame, the expanded tab shape can be obtained. It can be handled easily. By using these supporting frames, automation of the molding process and labor saving can be facilitated by incorporating a commonly used molding method, and production efficiency can be improved and stable production can be achieved.

A molding die structure that prevents voids generated during resin molding and resin burrs on the surface of the substrate electrode can improve production efficiency and enable stable production.

[Brief description of drawings]

FIG. 1 is a perspective view of a BGA package structure according to a first embodiment.

FIG. 2 is a process drawing until completion of a chip / board mounted multiple frame.

FIG. 3 is a process drawing up to resin molding.

FIG. 4 is a process drawing from a molded product to completion.

FIG. 5 is a perspective view of a BGA package structure according to a second embodiment.

FIG. 6 is a perspective view of a BGA package structure according to a third embodiment.

FIG. 7 is a perspective view of a BGA package structure according to a fourth embodiment.

FIG. 8 is a perspective view of the BGA package structure of the fifth embodiment.

FIG. 9 is a perspective view of a BGA package structure according to a sixth embodiment.

FIG. 10 is a perspective view of a BGA package structure according to a seventh embodiment.

FIG. 11 is a shape diagram of a support frame used in the first, fourth and sixth embodiments.

FIG. 12 is a shape diagram of a support frame used in the second, fifth and seventh embodiments.

FIG. 13 is a shape diagram of a support frame used in a third embodiment.

FIG. 14 is a shape diagram when the shape of the support frame is changed.

FIG. 15 is a shape diagram when the shape of the support frame is changed.

FIG. 16 is a shape diagram when the shape of the support frame is changed.

FIG. 17 is a perspective view of a BGA package structure according to an eighth embodiment.

FIG. 18 is a process drawing up to the completion of a chip / wiring film mounted multiple frame.

FIG. 19 is a perspective view of a BGA package structure according to a ninth embodiment.

FIG. 20 is a perspective view of a BGA package structure according to a tenth embodiment.

FIG. 21 is a perspective view of the BGA package structure of the eleventh embodiment.

FIG. 22 is a perspective view of a BGA package structure according to a twelfth embodiment.

FIG. 23 is a perspective view of a BGA package structure according to a thirteenth embodiment.

FIG. 24 is a shape view of a support frame used in eighth, ninth and tenth examples.

FIG. 25 is a shape view of the support frame used in the eleventh, twelfth, and thirteenth embodiments.

FIG. 26 is a perspective view of a molding die when molding a second embodiment.

FIG. 27 is a perspective view of a molding die when molding according to a third embodiment.

FIG. 28 is a perspective view of a molding die when molding according to a fourth embodiment.

FIG. 29 is a perspective view of a molding die when molding according to a fifth embodiment.

FIG. 30 is a perspective view of a molding die when molding according to a sixth embodiment.

FIG. 31 is a perspective view of a molding die when molding according to a seventh embodiment.

FIG. 32 is a perspective view of a molding die when molding according to an eighth embodiment.

FIG. 33 is a perspective view of a molding die when molding is performed in the ninth embodiment.

FIG. 34 is a perspective view of a molding die when molding the tenth embodiment.

FIG. 35 is a perspective view of a molding die when molding the eleventh embodiment.

FIG. 36 is a perspective view of a molding die when molding in a twelfth embodiment.

FIG. 37 is a perspective view of a molding die when molding in a thirteenth embodiment.

FIG. 38 is a schematic view showing the state of the resin filling process.

FIG. 39 is a schematic view showing the state of the resin filling process.

FIG. 40 is a schematic view of the state at the end of the resin filling process.

FIG. 41 is an enlarged view of the central portion of the lower mold cavity according to the fourteenth embodiment of the present invention.

FIG. 42 is a schematic view of a mold cavity central portion showing the operation of Embodiment 14 of the present invention.

FIG. 43 is a diagram schematically showing a contact state between a substrate electrode portion and a lower mold cavity protrusion portion.

FIG. 44 is a diagram showing a step of applying a release agent to the surface of the substrate electrode according to Example 15 of the present invention.

FIG. 45 is a diagram illustrating a molding process of a substrate with a release agent.

FIG. 46 is a diagram showing a step of attaching a thermosetting rubber-based resin to the protrusions 22 of Example 16 of the present invention.

FIG. 47 is a protrusion 2 to which a rubber-based resin cured product 73 is attached.
It is a figure showing the process of shape | molding using the metal mold provided with 2.

FIG. 48 is a comparison diagram of solder bump formation rates.

FIG. 49 is a cross-sectional view of a conventional face-up type BGA package.

FIG. 50 is a plan view of FIG. 49 seen from the upper side.

FIG. 51 is a plan view of FIG. 49 seen from the lower side.

FIG. 52 is a perspective view of a conventional face-down type BGA package.

53 is an enlarged cross-sectional view of the connection portion of FIG. 41.

[Explanation of symbols]

1 ... IC chip, 2 ... laminated circuit board, 4 ...
Metal bumps, 5 ... Support frame (i), 7 ... Substrate fixing frame, 15 ... Chip / plate mounting multiple support frame, 27 ... Support frame (ii), 28 ... Support Frame (iii), 29 ... Guide hole, 30 ... Board fixing lead, 31 ... Wiring film, 32 ... Insulating insert, 34 ... Support frame (iv), 35 ...
・ Chip / wiring film mounting support frame, 36 ...
Support frame (v), 37 ... Expansion tab, 38 ...
Extended wiring film, 58 ... Void, 60 ... Divided parts, 62 ... Projection pin, 64 ... Resin burr,
66 ... Electrode surface, 69 ... Dummy protrusion, 70 ...
..Release agent, 71 ... Substrate with release agent, 72 ... Thermosetting rubber-based resin, 73 ... Rubber-based resin cured product

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Isamu Yoshida 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Pref., Institute of Industrial Science, Hitachi, Ltd. (72) Inventor Kazuya Ohji 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Address: Hitachi, Ltd., Production Technology Laboratory (72) Inventor Michiharu Honda, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa 292 Address: Hitachi, Ltd. Production Technology Laboratory (72) Inventor, Makoto Kitano Kamimachi, Tsuchiura City, Ibaraki Prefecture No. 502 Hitachi Co., Ltd., Mechanical Research Laboratory (72) Inventor, Nana Yoneda, Kamidate-cho, Tsuchiura City, Ibaraki Prefecture 502 No., Hitachi Co., Ltd., Mechanical Research Laboratory, (72) Inventor, Kashishi Eguchi, 7-1, Omika-cho, Ibaraki Prefecture No. 1 Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Kunihiko Nishi 20-5, Kamimizuhonmachi, Kodaira-shi, Tokyo No. 1 Hitachi Ltd., Semiconductor Division (72) Inventor Ichiro Yasue 5-20-1, Josuihoncho, Kodaira-shi, Tokyo Hitachi Ltd. Semiconductor Division (72) Inventor Kenichi Otsuka, Josuihonmachi, Kodaira-shi, Tokyo 5-20-1 Hitachi Ltd. Semiconductor Division (56) Reference JP-A-61-222151 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/12

Claims (15)

(57) [Claims] 1. A semiconductor chip and the semiconductor chip electrically connected to the semiconductor chip.
Laminated circuit board with metal bumps on the back side of the
A semiconductor device having a plate, the semiconductor device further having a support frame for fixedly supporting the laminated circuit board , and at least a side surface of the laminated circuit board and the semiconductor chip are provided.
A semiconductor device characterized by being sealed with an article. 2. A semiconductor chip and a semiconductor chip electrically connected to the semiconductor chip.
Laminated circuit board with metal bumps on the back side of the
A semiconductor device having a plate, the semiconductor device further in contact with the semiconductor chip and in contact with the laminated circuit board.
And has a supporting frame for fixedly supporting both of them, and at least the semiconductor chip is sealed with an organic substance.
And a semiconductor device. 3. The semiconductor device according to claim 1 or 2.
And the outer frame of the supporting frame is removed.
Conductor device. 4. The method according to any one of claims 1 to 3.
The semiconductor device of claim 1, wherein the semiconductor chip and the metal bump are provided through a through hole provided inside the laminated circuit board.
Semiconductor device characterized by being electrically connected
Place 5. The method according to any one of claims 1 to 4.
The semiconductor device further includes a surface of the laminated circuit board on which a semiconductor chip is mounted, and
Connection of the metal bumps, which is the backside of the mounted surface and the metal bumps
The part except the electrode part to be used is sealed with an organic substance.
And a semiconductor device. 6. A semiconductor chip, the semiconductor chip electrically connected to the semiconductor chip, and the semiconductor chip.
Film having metal bumps on the back side of the surface facing the
A semiconductor device having bets, the semiconductor device further includes a support for fixing and supporting the semiconductor chip or the wiring film
It has a frame and at least the semiconductor chip is sealed with an organic substance.
And a semiconductor device. 7. A semiconductor chip and the semiconductor chip electrically connected to the semiconductor chip.
Film having metal bumps on the back side of the surface facing the
And a semiconductor device further comprising: a semiconductor device that is in contact with the semiconductor chip and is also in contact with the wiring film.
And has a supporting frame for fixedly supporting both of them, and at least the semiconductor chip is sealed with an organic substance.
And a semiconductor device. 8. The semiconductor device according to claim 6 or 7.
And the outer frame of the supporting frame is removed.
Conductor device. 9. The method according to any one of claims 6 to 9.
The semiconductor device according to claim 1, wherein the semiconductor chip and the wiring film are bonded together.
Ear or metal bump bonding or adhesive bonding with conductive resin
Semiconductor device characterized by being electrically connected together
Place 10. A method of manufacturing a semiconductor device, the method comprising electrically connecting a semiconductor chip and a laminated circuit board.
If, tower to the support frame to secure support laminated circuit board
At least by the mounting process and transfer molding using a molding die
The side surface of the laminated circuit board and the semiconductor chip are sealed with an organic substance.
And a step of forming a metal bump on the electrode portion of the laminated circuit board
And a method of manufacturing a semiconductor device. 11. A method of manufacturing a semiconductor device, wherein both a semiconductor chip and a laminated circuit board are supported by a supporting frame.
Mounting on a support frame so as to be in contact with the frame, and electrically connecting the semiconductor chip and the laminated circuit board
At least by the process and transfer molding using a molding die
Step of encapsulating the semiconductor chip with an organic material, and step of forming a metal bump on an electrode portion of the laminated circuit board
And a method of manufacturing a semiconductor device. 12. A method of manufacturing a semiconductor device, comprising the step of electrically connecting a semiconductor chip and a wiring film.
And the semiconductor chip or the wiring film are fixedly supported.
At least by the step of mounting on the support frame and the transfer molding using the molding die.
A step of sealing the semiconductor chip with an organic material, and a step of forming a metal bump on an electrode portion of the wiring film
A method of manufacturing a semiconductor device, comprising: 13. A method of manufacturing a semiconductor device, comprising the step of electrically connecting a semiconductor chip and a wiring film.
And both supporting the semiconductor chip and the wiring film
The process of mounting on the support frame so that it contacts the frame
And by transfer molding using a molding die,
A step of sealing the semiconductor chip with an organic material, and a step of forming a metal bump on an electrode portion of the wiring film
And a method of manufacturing a semiconductor device. 14. Any one of claims 10 to 13.
The method of manufacturing a semiconductor device according to claim 1, wherein the support frame is a multiple support frame, and in the step of sealing , the semiconductor device is formed by transfer molding.
Device for sealing a plurality of devices in a lump
Manufacturing method. 15. Any one of claims 10 to 14.
The method of manufacturing a semiconductor device according to claim 1, wherein the molding die is provided corresponding to an upper die and a position where the metal bump is formed.
There is a protrusion for molding the shape of the part that forms the pump.
And a lower die for performing the sealing, the supporting frame is formed by the upper die and the lower die.
Of a semiconductor device characterized by being performed by sandwiching
Method.