JP3407349B2 - Polyamide resin composition - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin composition having good mechanical properties and good mold release during molding.

[0002]

2. Description of the Related Art Polyamide resins are widely used as engineering plastics because they have excellent mechanical properties as well as abrasion resistance, electrical properties, chemical resistance and workability. However, the demand for various physical properties of polyamide resins has been improved and diversified as the industry has advanced.

In recent years, one of the properties that has been remarkably advanced is the releasability during injection molding. The reason why the releasability at the time of molding becomes particularly strong is due to the following two reasons.

1. In order to have high performance in the final product,
It has become necessary to manufacture molded products (parts) with complicated shapes. However, after molding, it is difficult to take out a molded product having a complicated shape from the mold, and therefore high mold releasability is required.

2. Further improvement in production efficiency has been demanded, and the need to complete all manufacturing processes in a shorter time has increased. Therefore, even when the same molded product as the conventional one is manufactured, the molded product needs to be separated from the mold more easily.

[0006] Due to such a background, it is strongly required to improve the releasability of the polyamide resin, but at the same time, it is not allowed to lose the excellent mechanical properties and chemical resistance originally possessed by the polyamide resin.

Conventionally, as means for improving the releasability of polyamide resin, polyamide has ethylene bisamide (Japanese Patent Publication No. 449825) and bisureido (Japanese Patent Publication No. 4825).
-6177, JP-A-53-126056)
Stearic acid ester (JP-A-55-31803) Aliphatic carboxylic acid-based substance (JP-A-54-10346)
No. 0) and the like are known.

Also proposed is a method of blocking the molecular end of polyamide with a long-chain alkyl group (Japanese Patent Publication No. 3-23093 and Japanese Patent Laid-Open No. 3-23094).

[0009]

However, when the releasability is improved by blending these additives, the releasability improving effect is not sufficient, and in recent years, the releasability has been remarkably advanced. It cannot meet the demands of sex. Further, when a large amount of these additives is added, the mold releasability is improved to some extent, but there is a problem that the excellent mechanical properties originally possessed by the polyamide resin, particularly the tensile elongation is lowered.

Although a polyamide resin having high releasability can be produced by a method of blocking the molecular end of polyamide with a long-chain alkyl group, there is a problem that the reduction of tensile elongation cannot be avoided. .

Therefore, the object of the present invention is to obtain a polyamide resin composition having good mechanical properties and good mold release during molding.

[0012]

[Means for Solving the Problems] In order to solve the above problems, the present inventors have made diligent efforts and as a result, as a result, the polyamide resin has an amide compound having a specific structure and a specific inorganic compound.
Problem when an object has been added pressure has reached the finding present invention can be completely solved.

That is, the present invention relates to polyamide resin 100.
0.005 to 10 parts by weight of an amide compound represented by the following chemical formula (I), calcium carbonate, and tal
At least one selected from the group consisting of ku, kaolin, and mica
Also there is provided a polyamide resin composition characterized by comprising by added pressure to one inorganic compound 0.0001-5 parts by weight.

[0014]

[Chemical 4] (In the formula, R1 and R2 are each a hydrocarbon group having 5 to 35 carbon atoms and having at least one hydroxyl group, and R3 is 1 to 1 carbon atoms.
12 hydrocarbon groups, R4 is a hydrocarbon group having 1 to 12 carbon atoms, and n is an integer of 0 to 5) The (A) polyamide resin used in the present invention is not particularly limited, (1) A polycondensate composed of a diamine having 4 to 18 carbon atoms and a dicarboxylic acid having 2 to 18 carbon atoms, (2) a polymer of a lactam having 5 to 18 carbon atoms, or an amino having 5 to 18 carbon atoms. The condensates of carboxylic acids and copolymers thereof are mainly mentioned.

Specific examples of the diamine having 4 to 18 carbon atoms include 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane and 1,8-diaminooctane. , 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,13-
Diaminotridecane, 1,14-diaminotetradecane, 1,15-diaminopentadecane, 1,16-diaminohexadecane, 1,17-diaminoheptadecane,
Examples include aliphatic alkylenediamines such as 1,18-diaminooctadecane, aromatic diamines such as metaxylylenediamine and paraxylylenediamine, and aromatic diamines such as phenylenediamine.

Specific examples of the dicarboxylic acid having 2 to 18 carbon atoms include oxalic acid, malonic acid, succinic acid, glutaric acid,
Adipic acid, pimelic acid, suberic acid, azelaic acid,
There are aliphatic dicarboxylic acids such as sebacic acid, undecanedioic acid, dodecanedioic acid, prasiric acid, tetradecanedioic acid, pentadecanedioic acid and octadecanedioic acid, and aromatic dicarboxylic acids such as terephthalic acid and isophthalic acid.

Specific examples of lactams include ε-caprolactam, ζ-enanthlactam, η-capryllactam and ω-laurolactam.

Specific examples of the aminocarboxylic acid having 5 to 18 carbon atoms include aliphatic aminocarboxylic acids such as 6-aminocaproic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid, and aromatic compounds such as aminobenzoic acid. Group aminocarboxylic acids and the like.

Specific examples of the polyamide resin include nylon 4, nylon 6, nylon 11, nylon 12, nylon 46, nylon 66, nylon 610 and nylon 6.
12, nylon 1112, nylon 1212, nylon 6/66, nylon 6/610, nylon 6/12, nylon 6/66/610, nylon 6T, nylon 6
I, nylon 8T, nylon 12T, nylon 8I, nylon 12I, nylon 6 / 6T, nylon 66/6
T, nylon 6I / 6T, nylon 6/66 / 6T, nylon MXD6, nylon 6 / MXD6, nylon PX
D6, nylon PXD8, nylon PXD12 and the like can be mentioned. Of these, nylon 6, nylon 12, nylon 46, nylon 66, nylon 610, nylon 6
/ 66, nylon 6 / 6T, nylon 66 / 6T, nylon 6I / 6T, nylon 6/66 / 6T, nylon M
XD6 is particularly preferably used (T: terephthalic acid, I: isophthalic acid, MXD: metaxylylenediamine, PXD: paraxylylenediamine, /; copolymerization was used as an abbreviation here).

The polymerization degree of the (A) polyamide resin used here is not particularly limited, but the relative viscosity (measured at 25 ° C. by dissolving 1 g of polymer in 100 ml of 98% concentrated sulfuric acid, the same applies hereinafter) is 1. .2 to 5.0, preferably 1.8
.About.4.0, more preferably 2.2 to 3.5 is used. When the relative viscosity is less than 1.2, the toughness is low, and
If it exceeds 0, the fluidity is lowered, and thus both are not preferable.

The amide compound (B) added to the polyamide resin (A) in the present invention is represented by the following chemical formula (I).

[0022]

[Chemical 5] (In the formula, each of R1 and R2 is a hydrocarbon group having 5 to 35 carbon atoms and having at least one hydroxyl group, and R3 is 1 hydrocarbon group.
To 12 hydrocarbon groups, R4 represents a hydrocarbon group having 1 to 12 carbon atoms, and n represents an integer of 0 to 5) Of these, the following compound (IV) in which n = 0 is particularly preferable.

[0023]

[Chemical 6] (In the formula, R1, R2, and R3 are the same as those in (I).) The hydrocarbon group represented by R1 and R2 has 5 to 35 carbon atoms and is particularly limited as long as it has at least one hydroxyl group. Although it is not a group, one having one hydroxyl group in an alkyl group having 5 to 35 carbon atoms or a branched alkyl group is preferable, and more preferably one having one hydroxyl group in an alkyl group having 9 to 35 carbon atoms or a branched alkyl group, More preferably, it has 11 carbon atoms.
Those having 1 to 35 hydroxyl groups with 1 to 35 alkyl groups or branched alkyl groups, most preferably those having 1 hydroxyl group with an odd number of 11 to 35 carbon atoms are used.

Examples of R1 and R2 are hydroxypentyl group, hydroxyhexyl group, hydroxyheptyl group, hydroxyoctyl group, hydroxynonyl group, hydroxydecyl group, hydroxyundecyl group, hydroxydodecyl group, hydroxytridecyl group and hydroxy. Tetradecyl group, hydroxypentadecyl group, hydroxyhexadecyl group, hydroxyheptadecyl group, hydroxyoctadecyl group, hydroxynonadecyl group, hydroxyeicosanyl group, hydroxyheneicosanyl group, hydroxydocosanyl group, hydroxytricosanyl group Group, hydroxytetracosanyl group, hydroxyethylhexyl group and the like.

The position of the hydroxyl group is not necessarily limited, but those bonded to the α position, β position, ψ position and ω position are preferable.

Preferred examples of R1 and R2 including the position of the hydroxyl group are 1-hydroxyundecyl group, 2-hydroxyundecyl group, 10-hydroxyundecyl group, 11-hydroxyundecyl group and 1-hydroxytridecyl group. Decyl group, 2-hydroxytridecyl group, 1-hydroxypentadecyl group, 2-hydroxypentadecyl group,
10-hydroxypentadecyl group, 11-hydroxypentadecyl group, 15-hydroxypentadecyl group, 1-
Hydroxyheptadecyl group, 2-hydroxyheptadecyl group, 11-hydroxyheptadecyl group, 1-hydroxynonadecyl group, 2-hydroxynonadecyl group, 14-
Examples thereof include a hydroxynonadecyl group and a 19-hydroxynonadecyl group.

A preferred example of R3 is a methylene group,
Ethylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group,
Octamethylene group, nonamethylene group, decamethylene group,
Examples include an undecamethylene group, a dodecamethylene group, an isopropylidene group, a phenylene group, and a xylylene group.

A preferred example of R4 is a methylene group,
Ethylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group,
Octamethylene group, nonamethylene group, decamethylene group,
Examples include isopropylidene group and phenylene group.

In the present invention, the following compounds are mentioned as typical representative examples of the (B) amide compound (I) added to the (A) polyamide resin:

[Chemical 7] The addition amount of the (B) amide compound of the present invention is 0.005 to 10 parts by weight, preferably 0.01 to 5 parts by weight, and more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the (A) polyamide resin.
It is 1 part by weight, most preferably 0.1 to 0.5 part by weight. If the addition amount is less than 0.005 parts by weight, releasability,
The effect of improving the mechanical properties is not sufficient, and if it exceeds 10 parts by weight, not only the mechanical properties are deteriorated but also gas is generated during molding, which is not preferable.

Used with the (B) amide compound of the present invention
And is an inorganic compound, (C) calcium carbonate, talc, at least one inorganic compound selected from the group consisting of kaolin, mica, it is possible to shorten them a forming time significantly to added pressure.

Conventionally, these inorganic compounds have been added as a nucleating agent for polyamide resins, but there is a problem in that the toughness is rapidly lowered together with the addition. However, when these compounds (C) are added to the (A) polyamide resin together with the (B) amide compound of the present invention, the toughness of the molded article is less deteriorated, and the addition amount of (C) is reduced. It was found by the present inventors that a high effect can be obtained.

The amount of the inorganic compound added is 0.0001 to 5 parts by weight, preferably 0.0002 to 1 part by weight, more preferably 0.002 to 100 parts by weight of the polyamide resin (A).
001-0.1 parts by weight, most preferably 0.005-
It is 0.05 part by weight.

The particle diameter of the inorganic compound (C) is not particularly limited, but if the average diameter is 5 μm or less, preferably 3 μm or less, the deterioration of toughness is further small. Further, when the inorganic compound does not contain particles having a particle size of 10 μm or more, deterioration of toughness is further reduced, which is preferable.

Further, the present inventors not only improve the releasability but also adjust the mechanical properties by further adding at least one of the following four compounds to the amide compound (B) of the present invention. I found it.

Diol ester of aliphatic carboxylic acid having 12 to 42 carbon atoms, group I of aliphatic carboxylic acid having 12 to 42 carbon atoms, or
Group II or Group III metal salts, compounds represented by the following chemical formula (II), compounds represented by chemical formula (III)

[Chemical 8] (In the formula, R5 and R6 each represent a hydrocarbon group having 5 to 35 carbon atoms, and R7 represents a hydrocarbon group having 1 to 12 carbon atoms)

[Chemical 9] (In the formula, R8 and R9 are each a hydrocarbon group having 5 to 35 carbon atoms, R10 is a hydrocarbon group having 1 to 12 carbon atoms, R11 is a hydrocarbon group having 1 to 12 carbon atoms, and m is an integer of 0 to 5. Examples of the aliphatic carboxylic acid having 12 to 42 carbon atoms include lauric acid, myristic acid, palmitic acid, stearic acid, nonadecanoic acid, arachidic acid, behenic acid, lignoceric acid, cerotic acid, heptacosanoic acid, montan. Examples thereof include acid, limesic acid, laxeric acid, oleic acid, elaidic acid, cetoleic acid, erucic acid, brassic acid, linoleic acid, linolenic acid, arachidonic acid and stearolic acid.

Examples of diols include aliphatic diols such as ethylene glycol, propylene glycol and 1,4-butanediol.

Examples of the group I, II or III metals include lithium, sodium, potassium, rubidium, magnesium, calcium, strontium, barium and aluminum.

Specific examples of the diol esters of aliphatic carboxylic acids having 12 to 42 carbon atoms include ethylene glycol ester of montanic acid, 1,4-butanediol ester of montanic acid, ethylene glycol ester ester of melissic acid. And so on.

Specific examples of the group I, group II or group III metal salts of aliphatic carboxylic acids having 12 to 42 carbon atoms include calcium stearate, magnesium stearate, barium stearate and aluminum stearate. , Calcium montanate, sodium montanate and the like.

The hydrocarbon group represented by R5, R6, R8 and R9 is not particularly limited as long as it has 5 to 35 carbon atoms, but an alkyl group having 5 to 35 carbon atoms or a branched alkyl group is preferable. Preferably, the alkyl group having 9 to 35 carbon atoms or the branched alkyl group is more preferable, and the carbon number is 1 is more preferable.
It is an alkyl group having 1 to 35 alkyl groups or a branched alkyl group, and most preferably an odd number of alkyl groups having 11 to 35 carbon atoms.

Examples of R5, R6, R8 and R9 are pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group. , Heptadecyl group, octadecyl group, nonadecyl group,
Eicosanyl group, heneicosanyl group, docosanyl group,
Examples thereof include tricosanyl group, tetracosanyl group and ethylhexyl group.

Preferred examples of R7 and R10 are methylene group, ethylene group, trimethylene group, tetramethylene group, pentamethylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group, decamethylene group, undecamethylene. Group, dodecamethylene group, isopropylidene group, phenylene group, xylylene group and the like.

Preferred examples of R11 are methylene group, ethylene group, trimethylene group, tetramethylene group,
Examples thereof include a pentamethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group, a decamethylene group, an isopropylidene group and a phenylene group.

The following compounds may be mentioned as preferred representative examples of the formulas (II) and (III):

[Chemical 10] The amount of these compounds added is (A) polyamide resin 100
0.005 to 3 parts by weight, preferably 0.0
It is 1 to 2 parts by weight, more preferably 0.1 to 1 part by weight.

In the present invention, various fillers can be added. The amount of the filler is preferably 0 to 200 parts by weight with respect to 100 parts by weight of the resin component, glass fiber, potassium titanate fiber, gypsum fiber, brass fiber, stainless fiber, steel fiber, ceramics fiber, boron whisker fiber, Fiber beads, glass flakes, glass micro balloons, clay, wollastonite, titanium oxide and other fibrous, powdery, granular or plate-like inorganic fillers and other polymer fibers (carbon fiber, aramid fiber) etc. are used. be able to.

Among the above fillers, glass fiber is preferably used. The glass fiber can be selected from long fiber type, short fiber type chopped strand, milled fiber, etc., and the average fiber diameter of the glass fiber is 3 in terms of surface appearance of the molded product, improvement of moldability, etc. Above 1
It is preferably less than 5μ, particularly 5 or more and less than 13μ.

The length of the glass fiber is 30 or more and 10,
It is preferably less than 000 μ, particularly preferably 1,000 or more and less than 4,000 μ.

When the filler is added, it is preferably added in an amount of 5 to 200 parts by weight, preferably 15 to 150 parts by weight, based on 100 parts by weight of the resin component.

The glass fiber may be coated or bundled with a thermoplastic resin such as ethylene / vinyl acetate copolymer or a thermosetting resin such as an epoxy resin, or a coupling agent such as silane or titanate. , And may be treated with other surface treatment agents.

The composition of the present invention contains an antioxidant and a heat stabilizer (for example, hindered phenol type, hydroquinone type, phosphite type and substitution products thereof, iodine, etc.) to the extent that the object of the present invention is not impaired. Copper oxide, potassium iodide, etc.), UV absorber type, salicylate type, benzotriazole type, benzophenone type, hindered amine type, etc., lubricants and mold release agents (montanic acid and its salts, its esters, its half esters, stearyl alcohol) , Stearylamide and polyethylene wax), dyes (eg nigrosine etc.) and pigments (eg cadmium sulfide, phthalocyanine, carbon black etc.) and other conventional additives such as colorants, plasticizers, antistatic agents, It is possible to impart predetermined characteristics.

The thermoplastic resin composition of the present invention is used in switches, micro slide switches, DIP switches, switch housings, lamp sockets, binding bands, connectors, connector housings, connector shells, IC sockets, coil bobbins, Bobbin cover, relay, relay box, condenser case, motor internal parts, small motor case, gear cam, dancing pulley, spacer, insulator, fastener, buckle, wire clip, bicycle wheel, caster, helmet, terminal block, electric Tool housing, starter insulation, spoiler, canister, radiator tank, chamber tank, reservoir tank,
Fuse box, air cleaner case, air conditioner fan, terminal housing, wheel cover, intake / exhaust pipe, bearing retainer, cylinder head cover, intake manifold, water pipe impeller, clutch release, bearing hub, speaker diaphragm, heat resistant container, microwave oven parts , Rice cooker parts, electrical / electronic related parts such as printer ribbon guides, automobile / vehicle related parts, household / office electrical product parts,
It is useful for computer related parts, facsimile / copier related parts, machine related parts, and other various applications.

[0052]

The present invention will be described in detail below with reference to examples.
The present invention is not limited to the following examples unless it exceeds the gist. Each evaluation was performed according to the method described below.

Characteristic evaluation method: (1) Tensile measurement The tensile elongation at break at 23 ° C.
It was measured according to -638.

(2) Rigidity The flexural modulus at 23 ° C. was measured according to ASTM D-790.

(3) Releasability injection molding machine (cylinder temperature: 240 ° C., mold temperature: 8
A box-shaped molded product with a pressure sensor (length 100 mm, width 60 m) using 0 ° C., injection time 5 seconds, cooling time; 10 seconds)
m, height 25 mm, thickness 2.5 mm), and the force at the time of protrusion by the protrusion pin was measured by the pressure sensor, and the average of 10 shots was taken as the mold release force.

(4) Ejection-deformable injection molding machine (cylinder temperature: 240 ° C., mold temperature: 8
Using 0 ° C., injection time 2 seconds, cooling time 5 seconds, a hat type molded product (upper part; 2 mmφ, lower part; 3 mmφ, height;
5.5 mm 16 pieces) were molded, the deformation ratio at the time of protrusion by the protrusion pin was measured, and the average of 10 shots was taken as the protrusion deformation ratio.

Used base polyamide; Polyamide A; Nylon 6 Relative viscosity 2.6 Polyamide B; Nylon 6 Relative viscosity 3.4 Polyamide C; Nylon 66 Relative viscosity 2.7 Polyamide D; Nylon 610 Relative viscosity 3.0 Polyamide E; Nylon 66 / 6T (50:50) Relative Viscosity 2.9 Amide compound having hydroxyl group used;

[Chemical 11] Other additives;

[Chemical 12] To specific Comparative Examples 1 18 the polymer 100 parts by weight, the additive from a composition drove blends shown in Table 1, subjected to injection molding by the condition, the mechanical properties of the resulting molded product, evaluation of the molded article I went. The obtained results are also shown in Table 1 .

[0058]

[Table 1] (In the table, the addition amount of the amide compound is 1 for the polyamide resin.
It represents the added weight part of the amide compound when the amount is 00 parts by weight. The toughness (elongation at break) was expressed by rounding off the first digit. The mold releasability and the protruding deformability are expressed in units of 5 kgf and 5%, respectively. (In general, the higher the toughness and rigidity, the better the releasability and protruding deformation. )

Examples 1-10, Comparative Examples 19-23 100 parts by weight of the above-mentioned polymers were dry-blended with the additives shown in Table 2 and injection-molded under the above conditions to obtain molded articles. The mechanical properties and moldability of the above were evaluated. The results obtained are shown in Table 3 .

[0060]

[Table 2]

[Table 3] (In the table, the addition amounts of the amide compound and the inorganic compound are the addition parts by weight when the polyamide resin is 100 parts by weight. Releasability and protruding deformability are 5 kgf and 5%, respectively.
Expressed in units. Generally, the larger the toughness and rigidity are, the smaller the releasability and protruding deformability are. The clearer the values are from Tables 2 and 3 , the amide compound having a hydroxyl group and the inorganic nucleating agent of the present invention are added. In this case, it is understood that the crystallization characteristics are improved and a molded product having good mold releasability and mechanical properties can be obtained. On the other hand, when only the inorganic additive is added and the amide compound having a hydroxyl group is not added, or when the inorganic additive and a general amide compound are added, the crystallization characteristics are improved. It is understood that the mechanical properties represented by the tensile elongation are remarkably reduced.

Examples 1-10 and Comparative Example 1 in Tables 2 and 3
The relationship between the average particle size and the average elongation of talc is shown in FIG. 1 based on the data of 9-23 . It can be seen that when the amide compound (F) having a hydroxyl group of the present invention is added, it has higher toughness (elongation) than when the general amide compound (K) is added.

[0062] For example 11-14, Comparative Example 24-26 The above polymer 100 parts by weight, the additives shown in Table 4 from the composition were dry blended, subjected to injection molding by the conditions, the resulting molded The mechanical properties and moldability of the product were evaluated. The results obtained are shown in Table 5 .

[0063]

[Table 4]

[Table 5] (In the table, the addition amounts of the amide compound, the inorganic compound, and other additives represent the addition parts by weight when the polyamide resin is 100 parts by weight. Further, the toughness (elongation at break))
Represents the first digit rounded off. The mold releasability and the protruding deformability are expressed in units of 5 kgf and 5%, respectively. In general,
The larger the toughness and rigidity are, the smaller the releasability and the protruding deformability are, the better.) As is clear from Tables 4 and 5 , in addition to the hydroxyl group-containing amide compound of the present invention, various other additives. It can be seen that even when is added, a polyamide resin exhibiting excellent properties in terms of releasability, mechanical properties, and crystallinity can be obtained.

[0064]

EFFECTS OF THE INVENTION The polyamide resin composition of the present invention has excellent mold releasability and crystallinity, can shorten the molding cycle, can remarkably improve the productivity, and can obtain a molded product excellent in mechanical properties. Therefore, the industrial value is extremely high.

[Brief description of drawings]

FIG. 1 is an example 1-4 in Tables 2 and 3 and a comparative example 19-2.
It is the figure which showed the relationship between the average particle diameter of talc and the average elongation based on the data of 3 .

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-3-270201 (JP, A) JP-A-1-270204 (JP, A) JP-A-5-59276 (JP, A) JP-A-4- 83306 (JP, A) JP-A-6-172658 (JP, A) JP-A-47-1425 (JP, A) JP-A-58-157856 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08L 77/00-77/12 CA (STN) REGISTRY (STN)

Claims (2)

(57) [Claims] 1. To 100 parts by weight of (A) a polyamide resin, (B) an amide compound represented by the following chemical formula (I):
005 to 10 parts by weight , and (C) calcium carbonate,
Less selected from the group consisting of Luk, Kaolin, Mica
Both one inorganic compound 0.0001-5 polyamide resin composition characterized by comprising by weight parts added pressure. [Chemical 1] (In the formula, each of R1 and R2 is a hydrocarbon group having 5 to 35 carbon atoms and at least one hydroxyl group, and R3 is 1 carbon atom.
To 12 hydrocarbon groups, R4 represents a hydrocarbon group having 1 to 12 carbon atoms, and n represents an integer of 0 to 5). Wherein the diol esters of aliphatic carboxylic acids of Claim 1 Symbol further to the polyamide resin composition of the mounting (D), carbon atoms 12 to 42, aliphatic carboxylic acids, carbon atoms 12 to 42 I Tribe or I
Group I or Group III metal salts, compounds represented by the following compound (II), compounds represented by compound (III) (In the formula, R5 and R6 each represent a hydrocarbon group having 5 to 35 carbon atoms, and R7 represents a hydrocarbon group having 1 to 12 carbon atoms). (In the formula, R8 and R9 are each a hydrocarbon group having 5 to 35 carbon atoms, R10 is a hydrocarbon group having 1 to 12 carbon atoms, R11 is a hydrocarbon group having 1 to 12 carbon atoms, and m is an integer of 0 to 5. the to at least one compound of 100 parts by weight of the polyamide resin selected from the group consisting of each represent), polyamide resin composition characterized by comprising adding 0.005 parts by weight.