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JP3409028B2 - Method and apparatus for regenerating solvent - Google Patents
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JP3409028B2 - Method and apparatus for regenerating solvent - Google Patents

Method and apparatus for regenerating solvent

Info

Publication number
JP3409028B2
JP3409028B2 JP2000399583A JP2000399583A JP3409028B2 JP 3409028 B2 JP3409028 B2 JP 3409028B2 JP 2000399583 A JP2000399583 A JP 2000399583A JP 2000399583 A JP2000399583 A JP 2000399583A JP 3409028 B2 JP3409028 B2 JP 3409028B2
Authority
JP
Japan
Prior art keywords
solvent
component
liquid
boiling point
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000399583A
Other languages
Japanese (ja)
Other versions
JP2002014475A (en
Inventor
軌雄 五十嵐
恭 井上
典生 山口
義登 増田
泰人 川瀬
芳芝 青島
昭昌 小田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Refine Co Ltd
Original Assignee
Nippon Refine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26591262&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP3409028(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Refine Co Ltd filed Critical Nippon Refine Co Ltd
Priority to JP2000399583A priority Critical patent/JP3409028B2/en
Priority to TW090109865A priority patent/TW514962B/en
Priority to CNB011171669A priority patent/CN1181520C/en
Priority to KR1020010023074A priority patent/KR100665559B1/en
Publication of JP2002014475A publication Critical patent/JP2002014475A/en
Application granted granted Critical
Publication of JP3409028B2 publication Critical patent/JP3409028B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D3/00Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping
    • B01D3/42Regulation; Control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D1/00Evaporating
    • B01D1/22Evaporating by bringing a thin layer of the liquid into contact with a heated surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D5/00Condensation of vapours; Recovering volatile solvents by condensation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2221/00Applications of separation devices
    • B01D2221/14Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は溶剤の再生方法及
び再生装置に関し、詳しくは、たとえば半導体や液晶デ
ィスプレイのモジュールを製造する際の、基板レジスト
層の剥離工程にて生ずる使用済みの剥離液、もしくはそ
の他用途でレジスト樹脂を溶解させて使用した使用済み
のシンナー等を含む溶剤を再生する方法と装置に係わる
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solvent recycling method and a recycling apparatus, and more specifically, to a used stripping solution generated in a stripping step of a substrate resist layer in manufacturing a semiconductor or liquid crystal display module, Alternatively, the present invention relates to a method and apparatus for reusing a solvent containing used thinner and the like, which is used by dissolving a resist resin for other purposes.

【0002】[0002]

【従来の技術】従来、半導体や液晶ディスプレイのモジ
ュール製造における基板レジスト層の剥離には、加熱し
た剥離液(溶剤)が用いられている。この剥離液は、通
常、モノエタノールアミン(以下、MEAと略記す
る。)とジメチルスルホキシド(以下、DMSOと略記
する。)の混合物よりなる。この混合物は少量の水を含
む場合がある。また、シンナーと称する溶剤としてプロ
ピレングリコールモノメチルエーテルアセテート(以
下、PGMEAと略記する。)とプロピレングリコール
モノメチルエーテル(以下、PGMEと略記する。)の
混合物が使用され、いずれも、水溶性で少量の水を含ん
でいる。
2. Description of the Related Art Conventionally, a heated stripping solution (solvent) has been used for stripping a substrate resist layer in manufacturing a semiconductor or liquid crystal display module. This stripper is usually composed of a mixture of monoethanolamine (hereinafter abbreviated as MEA) and dimethyl sulfoxide (hereinafter abbreviated as DMSO). This mixture may contain a small amount of water. Further, a mixture of propylene glycol monomethyl ether acetate (hereinafter abbreviated as PGMEA) and propylene glycol monomethyl ether (hereinafter abbreviated as PGMEA) is used as a solvent called thinner, and both are water-soluble and a small amount of water. Is included.

【0003】近年、基板は大型化が進み、剥離液、シン
ナーの使用量が増加しており、これらの廃液は廃棄物処
理業者が引取って廃棄処分しているが、引取りコストが
かかり、また、廃液の廃棄処分は地球環境に悪影響を与
えるので、廃棄処分せずに、使用済み剥離液、シンナー
等の溶剤を再生して使用することが望まれている。
In recent years, the size of substrates has been increasing, and the amount of stripping liquid and thinner used has been increasing. These waste liquids have been collected and disposed of by a waste disposal contractor, but the collection cost is high. Further, since the disposal of the waste liquid has a bad influence on the global environment, it is desired to recycle and use the solvent such as the used stripping solution and thinner without discarding it.

【0004】[0004]

【発明が解決しようとする課題】この使用済み溶剤の再
生に関しては、近年、蒸留分離等の操作を用いた方法が
用いられつつあるが、剥離液やシンナーの新液同等の成
分への再生は難しく、また、再生液の品質を維持した状
態で再生装置を長時間安定稼動させることも難しく、半
導体、液晶デバイス分野における使用済み溶剤の再生方
法、専用の装置はまだ確立された状態になく、この分野
の使用済み溶剤の再生方法及び装置が望まれていた。
Regarding the regeneration of the used solvent, a method using an operation such as distillation separation is being used in recent years. However, it is not possible to regenerate the stripper or thinner into a component equivalent to a new liquid. It is difficult, and it is also difficult to stably operate the regenerator for a long time while maintaining the quality of the reclaimed liquid, and the semiconductor, the method of regenerating the used solvent in the liquid crystal device field, and the dedicated device are not yet established. There has been a desire for a method and an apparatus for recycling used solvents in this field.

【0005】また、装置の製作、設置に関しては処理能
力を重視すると大型化する傾向になるが、再生能力が高
くかつ、再生液の品質維持が容易で、小型化した、溶剤
再生装置が望まれていた。
Further, regarding the production and installation of the apparatus, if the processing capacity is emphasized, the size tends to increase. However, a small-sized solvent recycling apparatus which has a high recycling capacity, can easily maintain the quality of the recycled liquid, and is desired. Was there.

【0006】そこで、本発明は前記した従来の要望に応
えるためのものであり、第1の課題は、半導体、液晶基
板の製造において使用されたレジスト樹脂の剥離液もし
くはシンナー等の使用済み溶剤を再使用し得る、溶剤の
再生方法を提供することにある。
Therefore, the present invention is to meet the above-mentioned conventional demands, and the first object is to remove a used solvent such as a stripping solution for a resist resin or a thinner used in the manufacture of semiconductors and liquid crystal substrates. It is to provide a method for reusing a solvent that can be reused.

【0007】また、本発明の第2の課題は、液晶・半導
体基板の製造において使用されたレジスト樹脂の剥離液
もしくはシンナー等の使用済み溶剤を長時間安定して再
生処理し得て、かつ、小型化にし得る溶剤の再生装置を
提供することにある。
A second object of the present invention is that a stripping solution of a resist resin used in the manufacture of liquid crystal / semiconductor substrates or a used solvent such as thinner can be stably regenerated for a long time, and It is an object of the present invention to provide a solvent recycling device that can be miniaturized.

【0008】[0008]

【課題を解決するための手段】上記した第1の課題を解
決するため発明として以下の手段が提供される。 (1) 樹脂成分と溶剤成分よりも低沸点の低沸点不純
物とを含む使用済み溶剤を再生する方法であって、 樹脂
成分を除去する樹脂成分除去工程と、樹脂成分が除去さ
れた使用済み溶剤から低沸点不純物を蒸発除去する工程
と、低純点不純物除去工程で得られた残留液を蒸留し、
前記溶剤成分を蒸発させ凝縮液として回収する蒸留工
程、とを備え、前記樹脂成分除去工程において、内周面
を加熱可能な蒸発面として有する密閉状の筒本体と、前
記筒本体内に配置される回転体であってその外周面に放
射状にブラシを有する回転体、とを備える樹脂除去装置
を用い、前記筒本体内の前記蒸発面と回転する前記回転
体又は前記ブラシとの間に前記使用済み溶剤を供給し、
加熱された前記蒸発面に前記使用済み溶剤を接触させる
ことにより、低沸点不純物と溶剤成分と蒸発させるとと
もに前記使用済み溶剤中の樹脂成分を流下させる、方
法。 (2)前記樹脂成分除去工程に先だって、前記使用済み
溶剤を脱気する工程を備える、(1)に記載の方法。 (3)前記使用済み溶剤は、溶剤成分としてモノエタノ
ールアミンを含有し、前記低沸点不純物除去工程におけ
る分離温度を前記使用済み溶剤に含まれる炭酸ガスが分
離可能となる温度以上とする、(1)又は(2)に記載
の方法。 (4)前記使用済み溶剤の主成分が一成分もしくは複数
の成分からなる剥離液である、(1)〜(3)のいずれ
かに記載の方法。 (5)前記使用済み溶剤の主成分が一成分もしくは複数
の成分からなるシンナーである、(1)又は(2)に記
載の方法。 (6)前記樹脂成分除去工程、前記低沸点不純物除去工
程、前記蒸留工程において、被処理液から溶剤を蒸発分
離する液の分離温度を使用材質の腐食に耐える温度以下
になるように減圧下で蒸発させる、(1)〜(5)のい
ずれかに記載の方法。 (7)気化した溶剤成分を含む排ガス発生源からの排ガ
スを凝縮する工程を備え、前記工程で得られた凝縮液を
前記使用済み溶剤の一部とする、(1)〜(6)のいず
れかの方法。 (8)樹脂成分と溶剤よりも低沸点の低沸点不純物とを
含む使用済み溶剤を再生 する装置であって、前記使用済
み溶剤から樹脂成分を除去する樹脂成分除去装置と、樹
脂成分が除去された使用済み溶剤から低沸点不純物を蒸
発させ除去する第1の蒸留装置と、低沸点不純物が除去
された使用済み溶剤からから溶剤成分を蒸発させ回収す
る第2の蒸留装置、とを備え、前記樹脂成分除去装置
は、内周面を加熱可能な蒸発面として有する密閉状の筒
本体と、前記筒本体内に配置される回転体であってその
外周面に放射状にブラシを有する回転体、とを備える樹
脂除去装置を用い、前記筒本体内の前記蒸発面と回転す
る前記回転体又は前記ブラシとの間に前記使用済み溶剤
を供給し、加熱された前記蒸発面に前記使用済み溶剤を
接触させることにより、低沸点不純物と溶剤成分と蒸発
させるとともに前記使用済み溶剤中の樹脂成分を流下さ
せるようになっている、溶剤の再生装置。 (9) 前記第1の蒸留装置及び第2の蒸留装置のどち
らか一方又は双方を充填式蒸留塔とする、(8)に記載
の装置。 (10) 第1の蒸留装置において除去される低沸点成
分を凝縮させる凝縮手段を保温し、凝縮手段が循環冷媒
の所定温度範囲を保つ、(8)又は(9)に記載の装
。 (11) 前記樹脂成分除去装置、前記第1の蒸留装
置、及び前記第2の蒸留装置に付随して備えられる貯留
槽に貯留される液体を搬出する窒素ガスの圧送手段を備
える、(8)〜(10)のいずれかに記載の装置。 (12) 第2の蒸留装置の残液分を廃液として処理す
る廃液経路に、前記残液分を樹脂成分除去手段に返送す
る経路を連結し、当該返送経路を選択的に使用可能とす
る、(8)〜(11)のいずれかに記載の装置。 (13)前記各装置間の処理液を還流もしくは移送もし
くは返送に用いるそれぞれの移送手段の前段には液温度
低下のための熱交換手段を設ける、(8)〜(12)の
いずれか記載の装置。 (14) 第2の蒸留装置から得られる回収溶剤成分の
主送液管から一部を取り出して前記主送液管に戻す経路
に分光分析手段を設け、処理液成分を連続監視し 運転制
御する、(8)〜(13)のいずれかに記載の装置。 (15) 気化した溶剤成分を含む排ガス発生源からの
排ガスを凝縮する手段を備え、この凝縮液を前記使用済
みの溶剤の一部として再生する、(8)〜(14)のい
ずれかに記載の装置。
Means for Solving the Problems In order to solve the above-mentioned first problem, the following means are provided as an invention. (1) Impurity with a low boiling point that is lower than that of the resin and solvent components
A method of reproducing a spent solvent containing and objects, resin
The resin component removal process to remove the components and the resin component removal
Process for removing low boiling impurities from the used solvent
And distill the residual liquid obtained in the low-purity point impurity removal step,
Distiller that evaporates the solvent component and recovers it as a condensate
And the inner peripheral surface in the resin component removing step.
And a sealed cylinder body that has
A rotating body that is placed inside the storage cylinder body
A rotating body having a brush in a spray shape, and a resin removing device.
Using the rotation that rotates with the evaporation surface in the cylinder body
Supplying the used solvent between the body or the brush,
Contacting the used solvent with the heated evaporation surface
By evaporating the low boiling point impurities and solvent components,
In order to flow down the resin component in the used solvent,
Law. (2) It has been used before the resin component removing step.
The method according to (1), comprising a step of degassing the solvent. (3) The used solvent is monoethano as a solvent component.
Containing low-temperature boiling point impurities in the low boiling point impurities removal step.
The separation temperature at which the carbon dioxide gas contained in the used solvent is
Described in (1) or (2) above the temperature at which separation is possible
the method of. (4) One or more main components of the used solvent
Any of (1) to (3), which is a stripping solution comprising the components of
The method described in crab. (5) One or more main components of the used solvent
As described in (1) or (2), which is a thinner consisting of
How to list. (6) The resin component removing step, the low boiling point impurity removing step
In the distillation step, the solvent is evaporated from the liquid to be treated.
The separation temperature of the liquid to be separated is below the temperature that can withstand the corrosion of the materials used.
Evaporate under reduced pressure so that (1) to (5)
The method described in some cases. (7) Exhaust gas from an exhaust gas source containing a vaporized solvent component
It is equipped with a step of condensing
Any of (1) to (6) as a part of the used solvent
Some way. (8) A resin component and a low-boiling point impurity having a lower boiling point than the solvent
A device for regenerating used solvent including
A resin component removing device that removes the resin component from the solvent
Low boiling impurities are vaporized from the used solvent from which the fat component has been removed.
First distillation device to generate and remove, and low boiling point impurities are removed
Evaporate and collect solvent components from the used solvent
A second distillation device, and the resin component removing device
Is a sealed cylinder having an inner peripheral surface as a heatable evaporation surface.
A main body and a rotating body arranged in the cylinder main body,
A rotating body having a brush radially on its outer peripheral surface;
Rotate with the evaporation surface in the cylinder body using a fat removing device.
The used solvent between the rotating body or the brush
To supply the used solvent to the heated evaporation surface.
By contacting, low-boiling impurities and solvent components evaporate
And the resin component in the used solvent is allowed to flow down.
A solvent recycling device that is designed to be used . (9) Which of the first distillation apparatus and the second distillation apparatus
Described in (8), one or both of which is a packed distillation column
Equipment . (10) Low boiling point component removed in the first distillation apparatus
The condensing means for condensing the heat is kept warm, and the condensing means is a circulating refrigerant.
The device according to (8) or (9), which maintains a predetermined temperature range of
Place (11) The resin component removing device, the first distillation device
And a storage provided in association with the second distillation device
Equipped with a pumping means for nitrogen gas that carries out the liquid stored in the tank
The device according to any one of (8) to (10) . (12) Treat the residual liquid of the second distillation device as waste liquid
The residual liquid is returned to the resin component removing means to the waste liquid path.
Link the routes to be used and selectively use the return route.
The device according to any one of (8) to (11) . (13) Recirculate or transfer the processing liquid between the above-mentioned devices
Liquid temperature in front of each transfer means used for return
Providing heat exchange means for lowering, (8) to (12)
The device according to any of the above . (14) Recovery solvent component obtained from the second distillation apparatus
Route for taking out a part of the main liquid supply pipe and returning it to the main liquid supply pipe
Provided with a spectroscopic analysis means to continuously monitor the processing liquid components and control the operation.
The device according to any one of (8) to (13) . (15) From an exhaust gas generation source containing a vaporized solvent component
Equipped with means for condensing exhaust gas, this condensate is
Recycled as a part of Mino solvent, (8) to (14)
The device described in any way.

【0009】使用済み溶剤は溶剤成分の他に、レジスト
樹脂と水成分等の低沸点成分を含んでいる。本発明の再
生方法によれば、使用済み溶剤はレジスト樹脂成分が除
去され、水成分等の低沸点成分が除去されて、溶剤成分
が再生されて回収される。また、溶剤を処理する工程の
排気系統には少なからず気化した溶剤成分を含んでい
る。この気化した溶剤成分は排気ガスとして処理せずに
溶剤成分として回収される。
The used solvent contains a resist resin and a low boiling point component such as a water component in addition to the solvent component. According to the regenerating method of the present invention, the resist resin component is removed from the used solvent, the low boiling point component such as the water component is removed, and the solvent component is regenerated and recovered. Further, the exhaust system in the step of treating the solvent contains a considerable amount of vaporized solvent components. The vaporized solvent component is recovered as a solvent component without being treated as exhaust gas.

【0010】使用済み溶剤の樹脂成分および水などの低
沸点成分が除去され、次いで一成分もしくは複数の成分
の剥離液を回収することもできるし、使用済み溶剤の樹
脂成分および水などの低沸点成分が除去され、次いで一
成分もしくは複数の成分のシンナーを回収することもで
きる。
The resin component of the used solvent and low-boiling components such as water can be removed, and then the stripping solution of one component or a plurality of components can be recovered, or the resin component of the used solvent and low-boiling components such as water. It is also possible to remove the components and then recover the thinner of one or more components.

【0011】さらに、樹脂成分の除去手段を、内周面を
加熱可能な蒸発面として有する密閉状の筒本体と、前記
筒本体内に配置される回転体であってその外周面に放射
状にブラシを有する回転体、とを備える樹脂除去装置を
用い、前記筒本体内の前記蒸発面と回転する前記回転体
又は前記ブラシとの間に前記使用済み溶剤を供給し、加
熱された前記蒸発面に前記使用済み溶剤を接触させるこ
とにより、低沸点不純物と溶剤成分と蒸発させるととも
に前記使用済み溶剤中の樹脂成分を流下させる流下膜式
濃縮手段とすることにより、樹脂成分が使用済み用溶剤
から除去される。また、後段の成分分離処理が容易とな
る。 溶剤成分がガスを吸収して塩類を発生することがあ
るが、低沸点物除去工程にてガス成分が分離除去され
る。脱気工程により、使用済み溶剤に溶存する不要の気
体が除去される。使用済み溶剤に溶存される余分なガス
等を予め除去することにより、回収再生効率の向上が図
れる。
Further, a means for removing the resin component is provided on the inner peripheral surface.
A closed cylindrical main body having a heatable evaporation surface, and
Radiator on the outer peripheral surface of a rotating body placed inside the cylinder body
A rotating body having a brush in a shape of
Using the rotating body that rotates with the evaporation surface in the cylinder body
Or, supply the used solvent between the brush and
Contacting the used solvent with the heated evaporation surface
By evaporating low boiling point impurities and solvent components,
A falling film type that allows the resin component in the used solvent to flow down to
By using the concentration means, the resin component can be used solvent
Removed from. In addition, the subsequent component separation process is easy.
It Solvent components may absorb gas and generate salts.
However, gas components are separated and removed in the low boiling point removal process.
It Unnecessary gas dissolved in the used solvent due to the degassing process
The body is removed. Extra gas dissolved in used solvent
It is possible to improve recovery and regeneration efficiency by removing
Be done.

【0012】各工程の処理液を還流もしくは移送もしく
は返送する移送手段は熱交換手段により液温低下される
ことにより、温度低下させた処理液を移送手段に導入し
通過させることができる。これによれば、温度によって
影響を受けるポンプの寿命を長期化することができる。
分光分析手段を設けると、たとえば、900nmから2
100nmの波長の赤外光により処理液成分中の分子固
有の赤外光吸収作用を利用して、処理液成分を連続監視
し運転制御することにより、再生溶剤の品質が常時確認
できる。このため、溶剤の含有主成分比率のみならず、
不純物成分(水分、レジスト分等)をも計測でき、この
ため、連続的に再生溶剤の成分分析が装置運転中にで
き、異常に対する対応も即座にでき、常に安定した液質
を薬液供給槽に供給できる。取り扱い液に対する使用材
質の耐温度腐食性を考慮し、混合液から分離する液の分
離温度を使用材質の腐食に耐える温度以下になるよう減
圧することにより、耐腐食性向上がはかれる。これによ
り、特殊な材質を使用しなくても、短期間で部品交換す
ること無く、長期間安定して装置の運転を行うことが可
能となる。低沸点除去物中の溶剤濃度を調節し、低沸点
物除去工程の出口温度を凝縮工程の冷媒温度より高い適
度な温度に設定することにより、低沸点成分が液体とし
て回収される。これにより、冷媒温度を考慮し、凝縮手
段にて最適な条件で低沸点成分を液化させることができ
る。貯槽及び、または処理液槽から次工程への液の供給
を窒素ガスの圧送により行うことにより、精製後の溶剤
に不要な気体に触させることなく、清浄な溶剤が供給さ
れる。このため、液質に不純物を混入させることなく、
安定した、送液が可能となる。精製工程の残液分を廃液
として処理する廃棄経路に、残液分を樹脂成分除去工程
に戻す戻し経路を設け、前記戻し経路を選択的に使用可
能としたことにより、残液側に含まれる溶剤成分の再精
製抽出が図れる。これにより、精製工程での高沸点成分
を再度分離抽出でき、再生効率を上げることができる。
レジスト樹脂成分の溶解に用いた樹脂成分を含む使用済
み溶剤、もしくは基板に重ねたレジスト樹脂の剥離工程
で生ずる樹脂成分を含む使用済みの溶剤は、最 終的に精
製溶剤を蒸発した後、凝縮液として回収されることによ
り、レジスト樹脂成分が除去され、水成分等の低沸点成
分が除去されて、溶剤成分が再生し回収される。流下膜
式濃縮装置によれば、樹脂成分が使用済み溶剤から除去
される。充填式蒸留塔により、小型でも棚段式と同等の
蒸留性能が得られる。これにより、蒸留塔を小型化で
き、そのため、装置全体を小型にすることが可能とな
り、コスト、施工性で改善がはかれる。また、凝縮手段
が循環冷媒の所定温度範囲を維持することにより、設置
雰囲気温度に関係無く、一定の凝縮性能が得られる。こ
れにより、季節によって設置周囲温度が変わっても、特
に冬期、外気温低下の過冷却による析出物の発生等を防
ぐ事ができ、品質、装置運転の安定が図れる。さらに、
装置全体を少なくとも2つの装置の間で分割した複数の
ユニットから構成することにより、施工性向上が図れ
る。また、装置全体を複数のユニットに機能的に分ける
ことができ、運搬性、施工性の改善が図れる。
Reflux or transfer of the treatment liquid of each step
The liquid temperature of the transfer means for returning the liquid is lowered by the heat exchange means.
By doing so, the treatment liquid whose temperature has been lowered is introduced into the transfer means.
Can be passed. According to this, depending on the temperature
The life of the affected pump can be extended.
If a spectroscopic analysis means is provided, for example, from 900 nm to 2
Infrared light with a wavelength of 100 nm causes the molecular solids in the treatment liquid component to
Continuously monitors the components of the processing liquid by utilizing the existing infrared light absorption effect
The quality of the regenerated solvent is constantly checked by controlling the operation.
it can. Therefore, not only the main component ratio of the solvent,
Impurity components (water content, resist content, etc.) can also be measured.
Therefore, it is possible to continuously analyze the components of the regenerated solvent during operation of the equipment.
Can respond to abnormalities immediately, and always has stable liquid quality
Can be supplied to the chemical solution supply tank. Materials used for handling liquids
The amount of liquid separated from the mixed liquid in consideration of the thermal corrosion resistance of the quality.
Reduce the separation temperature to below the temperature that can withstand the corrosion of the materials used.
By applying pressure, the corrosion resistance can be improved. By this
Parts can be replaced in a short period of time without using a special material.
It is possible to operate the device stably for a long time without
It becomes Noh. Low boiling point is adjusted by adjusting the solvent concentration in the removed material.
The outlet temperature of the substance removal process is higher than the refrigerant temperature of the condensation process.
By setting the temperature to a moderate temperature, low boiling point components become liquid.
Be recovered. This allows the condenser temperature to be taken into consideration in consideration of the refrigerant temperature.
The low boiling point component can be liquefied under optimum conditions in the stage.
It Supply of liquid from storage tank and / or processing liquid tank to the next process
The solvent after purification is carried out by pumping nitrogen gas.
Clean solvent is supplied without touching unnecessary gas.
Be done. Therefore, without mixing impurities in the liquid quality,
Stable liquid transfer is possible. Waste liquid remaining in the purification process
The residual liquid component is removed from the resin component in the disposal route to be treated as
There is a return path to return to, and the return path can be used selectively
As a result, the solvent components contained in the residual liquid side are re-refined.
Manufacturing and extraction can be achieved. As a result, high boiling point components in the purification process
Can be separated and extracted again, and the regeneration efficiency can be improved.
Used including the resin component used to dissolve the resist resin component
Removal process of solvent or resist resin overlaid on the substrate
Spent solvent containing a resin component resulting in the final to fine
After evaporating the solvent, it is recovered as a condensate.
The resist resin component is removed and the low boiling point components such as water components are removed.
The component is removed, and the solvent component is regenerated and recovered. Falling film
Type concentrator removes resin components from used solvent
To be done. The packed distillation column, even if small, is equivalent to the tray type.
Distillation performance is obtained. This makes the distillation column smaller.
Therefore, it is possible to reduce the size of the entire device.
Cost and workability can be improved. Also, condensing means
Installed by maintaining the specified temperature range of the circulating refrigerant
A certain condensation performance can be obtained regardless of the ambient temperature. This
Even if the ambient temperature changes depending on the season,
In addition, it prevents the generation of precipitates due to overcooling due to the decrease in outside temperature during the winter.
The quality and operation of the equipment can be stabilized. further,
The entire device is divided between at least two devices
By constructing from a unit, workability can be improved.
It Also, the entire device is functionally divided into multiple units.
It is possible to improve transportability and workability.

【0013】[0013]

【発明の実施の形態】本発明に用いる使用済みの溶剤は
半導体、液晶基板の製造においてレジスト樹脂の溶解、
剥離に使用された使用済みの廃液であり、主要溶剤成分
の他に、樹脂成分としてのレジスト樹脂、及びわずかの
水分を主体とする。
BEST MODE FOR CARRYING OUT THE INVENTION The used solvent used in the present invention is dissolution of resist resin in the production of semiconductors and liquid crystal substrates,
It is a used waste liquid used for peeling, and mainly contains a resist resin as a resin component and a small amount of water in addition to a main solvent component.

【0014】本発明方法は、図1に示すように最初に使
用済み溶剤を樹脂成分除去工程で樹脂成分(レジスト樹
脂)を除き、次いで低沸点物除去工程で水分等の低沸点
物を除去し、最終的に、再生溶剤成分を蒸発後に凝縮液
として得る精製工程よりなる。この工程により、不揮発
性の樹脂成分を最初に除去できるため、その後段の操作
において浮遊樹脂成分による影響を考慮する必要がない
点で、安定化運転が可能となる利点がある。樹脂成分を
除去した後に、低沸点成分を除去し、最終的に溶剤を蒸
発分離させ精製し、凝縮させて再生溶剤を得るこの方法
はフローが簡素化できる。
In the method of the present invention, as shown in FIG. 1, a used solvent is first removed in a resin component removing step to remove a resin component (resist resin), and then a low boiling point removing step is performed to remove low boiling point substances such as water. Finally, it comprises a purification step in which the regenerated solvent component is obtained as a condensate after evaporation. By this step, the non-volatile resin component can be removed first, so that there is no need to consider the influence of the floating resin component in the subsequent operation, and there is an advantage that a stable operation can be performed. After removing the resin component, the low boiling point component is removed, and finally the solvent is evaporated and separated for purification and condensation to obtain a regenerated solvent. This method can simplify the flow.

【0015】図2に示すように、溶剤を扱う工程で気化
した溶剤を含む雰囲気の排気系統の排気ガスは、排気ガ
ス処理工程に至る前の排気凝縮工程で凝縮液とし、前記
凝縮液を使用済み溶剤とすることができる。この使用済
み溶剤は再生溶剤に再生することができる。
As shown in FIG. 2, the exhaust gas of the exhaust system in the atmosphere containing the solvent vaporized in the solvent handling step is used as a condensate in the exhaust gas condensing step before reaching the exhaust gas treatment step, and the condensate is used. It can be used solvent. This used solvent can be regenerated into a regenerated solvent.

【0016】また、本発明方法は、レジスト樹脂の剥離
工程で使用する一成分もしくは複数の成分からなる剥離
液廃液(たとえばMEAとDMSOを主成分とする)な
どの使用済み溶剤から、図3に示すように、レジスト樹
脂、水分等を除去して剥離液を再生することができる。
In the method of the present invention, a used solvent such as a stripping solution waste solution (for example, containing MEA and DMSO as a main component) or the like used in the step of stripping the resist resin is used as shown in FIG. As shown, the stripping solution can be regenerated by removing the resist resin, water and the like.

【0017】また、本発明方法は、図4に示すように、
使用済み溶剤が剥離工程及びその他の工程で使用する一
成分もしくは複数の成分からなるシンナー廃液(たとえ
ばPGMEAとPGMEを主成分とする)の場合におい
ても適用される。すなわち、シンナー廃液から、レジス
ト樹脂、水分等を除去してシンナーを再生することがで
きる。
The method of the present invention, as shown in FIG.
It is also applied to the case where the used solvent is a thinner waste liquid (for example, PGMEA and PGME as main components) composed of one or more components used in the stripping step and other steps. That is, the thinner can be regenerated by removing the resist resin, water and the like from the thinner waste liquid.

【0018】樹脂成分除去工程は流下膜式濃縮手段とす
ることにより、樹脂成分の高濃度分離が可能である。
By using the falling film type concentration means in the resin component removing step, it is possible to separate the resin component at a high concentration.

【0019】溶剤成分の内、MEAなどは大気中のガス
(CO2)を吸収して、塩類(炭酸塩)を生成しやす
い。この塩類からガスを低沸点物除去工程にて分離す
る。
Among the solvent components, MEA or the like easily absorbs gas (CO2) in the atmosphere and easily produces salts (carbonates). Gas is separated from the salts in the low boiling point substance removing step.

【0020】各工程で分離された成分液は次または前の
工程もしくは槽に送液する場合に、熱交換手段をその液
送手段(たとえばポンプ等)の前段又は途中に設け、処
理液温度を低下し、液送手段の長寿命化を図ることがで
きる。
When the component liquid separated in each step is fed to the next or previous step or tank, a heat exchange means is provided in front of or in the middle of the liquid feeding means (such as a pump) to control the temperature of the treatment liquid. As a result, the life of the liquid feeding means can be extended.

【0021】前記、記載の通り、溶剤成分はガスを吸収
し塩類となる場合があり、またガスを溶存している場合
がある。このようなガスを吸収した使用剤み溶剤は脱気
工程(超音波印加方法等による溶存気体の分離。)での
処理を追加することにより、後段での様々な悪影響の低
減や再生溶剤の純度向上を図ることができる(図5参
照)。
As described above, the solvent component may absorb gas to form a salt, or the gas may be dissolved. By adding a treatment in the degassing step (separation of dissolved gas by ultrasonic wave application method, etc.), the used solvent and solvent that have absorbed such gas can reduce various adverse effects in the latter stage and improve the purity of the regenerated solvent. This can be improved (see FIG. 5).

【0022】図6に示すように、精製工程以降の再生溶
剤の品質を連続監視し、最適化制御することで、溶剤品
質を安定に保つことができる。
As shown in FIG. 6, by continuously monitoring the quality of the regenerated solvent after the refining step and controlling it for optimization, the solvent quality can be kept stable.

【0023】減圧度を高めることにより、使用済み溶剤
から溶剤成分の分離温度を低下させることができ、腐食
性を有する溶剤に対し、耐温度腐食性を有する材質を特
殊な金属(ハステロイ等)を使用しなくても、耐腐食性
が得られる。
By increasing the degree of reduced pressure, the separation temperature of the solvent components from the used solvent can be lowered, and a special metal (such as Hastelloy) is used as the material having temperature corrosion resistance against the solvent having corrosiveness. Corrosion resistance is obtained even if it is not used.

【0024】低沸点物除去工程で蒸発分離される低沸点
成分(水分等)に混入する溶剤成分の割合を調整して、
その後段の凝縮工程の冷媒温度より高めでベーパー化す
ることにより、ベーパーは、前記凝縮工程に導入されて
凝縮液となる。
By adjusting the ratio of the solvent component mixed in the low boiling point component (moisture etc.) evaporated and separated in the low boiling point substance removing step,
By vaporizing at a temperature higher than the refrigerant temperature in the subsequent condensation process, the vapor is introduced into the condensation process and becomes a condensed liquid.

【0025】主として精製後の再生溶剤の貯槽へ、貯槽
からの液送は窒素ガスの圧送によって行うことにより、
再生溶剤の液質を保つことができる。
By mainly feeding the liquid of the regenerated solvent after purification to the storage tank of the purified solvent by pressure feeding of nitrogen gas,
The quality of the regenerated solvent can be maintained.

【0026】精製工程で分離された高沸点成分を、廃液
処理と返送ポンプによる樹脂成分除去工程に返送処理の
双方を選択可能とし、通常は返送して再度、最初からの
処理を行い分離効率を高めることができる。
The high boiling point component separated in the refining step can be selected from both the waste liquid treatment and the resin component removal step by the return pump, and usually, the high boiling point component is returned and treated again from the beginning to improve the separation efficiency. Can be increased.

【0027】図7に示す各工程が処理されるように樹脂
成分除去装置を前段に、次に低沸点物除去装置、最後に
精製装置の主構成とする使用済溶剤の再生装置におい
て、樹脂成分を予め除去することで、後段の装置での樹
脂成分による悪影響を防ぐことが可能となる。また、最
終的に再生溶剤を蒸発させ凝縮して得ることにより、純
度の高い再生溶剤が得られる。
In order to process each step shown in FIG. 7, in the former stage of the resin component removing device, next in the low boiling point substance removing device, and finally in the spent solvent regenerating device which is the main constituent of the purifying device, the resin component removing device is used. By removing in advance, it is possible to prevent the adverse effect of the resin component in the subsequent apparatus. Further, by finally evaporating and condensing the regenerated solvent, a regenerated solvent having high purity can be obtained.

【0028】樹脂成分除去装置を図8に示すような流下
膜式蒸発装置とすることによって、樹脂成分の分離が容
易である。
When the resin component removing device is a falling film evaporator as shown in FIG. 8, the resin component can be easily separated.

【0029】また、樹脂成分(不揮発成分)を予め除去
することで、装置運転上、液品質上の有害要因がまず、
取り除け、後段の低沸点物除去工程以降の蒸留塔は、付
着物等の可能性がなく、充填型蒸留塔の使用が可能とな
る。
Further, by removing the resin component (non-volatile component) in advance, the harmful factors in the operation of the apparatus and the liquid quality are
After removal, the distillation column after the low boiling point removal step in the latter stage has no possibility of deposits and the like, and thus the packed distillation column can be used.

【0030】低沸点物除去装置からベーパー化させ除去
された低沸点成分を液化させる凝縮手段を保温すること
により、冷媒の所定温度範囲を維持でき,安定した運転
が可能となる。
By maintaining the temperature of the condensing means for liquefying the low boiling point component removed by vaporizing from the low boiling point substance removing device, a predetermined temperature range of the refrigerant can be maintained and stable operation can be performed.

【0031】また、充填型蒸留塔を採用することによ
り、再生装置の小型化が容易となるため、施工性、運搬
性を考慮し、装置全体を複数のユニット構造とすること
が可能となる。
Further, by adopting the packed distillation column, the regenerator can be easily miniaturized, so that it is possible to construct the whole apparatus into a plurality of unit structures in consideration of workability and transportability.

【0032】[0032]

【実施例】次に、本発明の実施例を図面に基づいて説明
する。まず、溶剤再生方法の実施に使用する溶剤再生装
置(以下、再生装置と略記する)について説明する。
Embodiments of the present invention will now be described with reference to the drawings. First, a solvent regenerator (hereinafter abbreviated as a regenerator) used for carrying out the solvent regenerating method will be described.

【0033】以下、図7図12に再生装置1の構造を示
す。使用済溶剤Lは、半導体もしくは液晶製造工程から
の廃液や排気系統の凝縮液を回収した液である。図7お
いて、使用済溶剤Lを貯留する溶剤回収槽2はポンプ3
により第1導管4を介して、樹脂分除去機5(本発明の
樹脂成分除去装置、流下膜式濃縮手段に対応する。)の
上部に接続されている。前記樹脂分除去機5は下部側面
に加熱用蒸気取入口6a、取出し口6b、更に底部に樹
脂分取出し口6cが形成され、前記樹脂分取出し口6c
は樹脂分貯槽7に接続され、樹脂分が排出可能とされて
いる。
The structure of the reproducing apparatus 1 is shown in FIGS. The used solvent L is a liquid obtained by collecting waste liquid from the semiconductor or liquid crystal manufacturing process or condensate of the exhaust system. In FIG. 7, the solvent recovery tank 2 for storing the used solvent L is a pump 3
It is connected to the upper part of the resin component removing machine 5 (corresponding to the resin component removing device of the present invention and the falling film type concentrating means) via the first conduit 4. The resin component removing machine 5 has a heating vapor inlet 6a, an outlet 6b on the lower side surface, and a resin outlet 6c on the bottom, and the resin outlet 6c.
Is connected to the resin component storage tank 7 so that the resin component can be discharged.

【0034】樹脂分除去機5の上部はベーパー排出口8
a、返送液受入口8bを有している。前記、ベーパー排
出口は8aは第2導管8を介して、蒸留塔9(本発明の
低沸点物除去装置に対応する。)のほぼ中段に接続され
る。本蒸留塔9は充填式蒸留塔であり、上段側に充填物
10aを内蔵し、より上部に還流口11、最上部付近に
ベーパー排出口12が構成されている。
The vapor discharge port 8 is provided at the upper portion of the resin removing machine 5.
It has a return liquid receiving port 8b. The vapor discharge port 8a is connected to almost the middle stage of the distillation column 9 (corresponding to the low boiling point substance removing device of the present invention) via the second conduit 8. The main distillation column 9 is a packed distillation column, in which a packing 10a is built in the upper side, a reflux port 11 is formed in the upper part, and a vapor discharge port 12 is formed in the vicinity of the uppermost part.

【0035】前記ベーパー排出口12は第3導管13を
介して、それぞれ冷却水往復路を有する第1コンデンサ
ー14、第1ベントコンデンサー15を経由し、還流槽
16に至っている。前記還流槽16は槽下部より液を取
り出し、還流ポンプ17を介し、前記還流口11へ至る
還流路18と還流路18より三方弁19で分岐し、還流
槽16に戻る戻り管20、更に槽の上側部より取り出す
低沸点成分排出路21を有している。
The vapor discharge port 12 reaches a reflux tank 16 via a third conduit 13 and a first condenser 14 and a first vent condenser 15 each having a cooling water reciprocating path. The reflux tank 16 takes out the liquid from the lower part of the tank, and returns to the reflux tank 16 via a reflux pump 17, a reflux path 18 leading to the reflux port 11, and a three-way valve 19 from the reflux path 18, and a return pipe 20 returning to the reflux tank 16, and a tank. It has a low boiling point component discharge passage 21 taken out from the upper side of.

【0036】前記低沸点成分排出路21は低沸点成分貯
槽22に至り、排出可能とされている。一方、前記、蒸
留塔9の下段側には充填物10bを内蔵し、最下部に塔
内貯槽23を構成している。前記塔内貯槽23は加熱用
リボイラー24からの循環管路25が接続され、他方で
移送ポンプ26を介し精留塔27へ至る第4導管28が
接続されている。
The low boiling point component discharge passage 21 reaches the low boiling point component storage tank 22 and can be discharged. On the other hand, the packing 10b is built in the lower side of the distillation column 9 and the in-column storage tank 23 is formed at the lowermost part. A circulation pipe 25 from the heating reboiler 24 is connected to the in-tower storage tank 23, and a fourth conduit 28 is connected to the rectification tower 27 via a transfer pump 26 on the other hand.

【0037】前記精留塔27は縦型の多段式蒸留塔であ
り、上段側に複数の棚段29を内蔵し、より上部に還流
口30、最上部付近にベーパー排出口31を構成してい
る。前記ベーパー排出口31は第5導管32を介して、
それぞれ冷却水往復路を有する第2コンデンサー33、
第2ベントコンデンサー34を経由し、還流槽35に至
っている。
The rectification column 27 is a vertical multi-stage distillation column in which a plurality of trays 29 are built in on the upper side, a reflux port 30 is arranged at the upper part, and a vapor discharge port 31 is formed near the uppermost part. There is. The vapor discharge port 31 is connected through a fifth conduit 32,
A second condenser 33 each having a cooling water return path,
It reaches the reflux tank 35 via the second vent condenser 34.

【0038】前記還流槽35は槽下部より液を取り出
し、還流ポンプ36を介し、前記還流口30へ至る還流
路37と槽の上側部より取り出す再生成分排出路38を
有している。
The reflux tank 35 has a reflux passage 37 for taking out the liquid from the lower portion of the tank and reaching the reflux port 30 via a reflux pump 36, and a regeneration component discharge passage 38 for taking out the liquid from the upper portion of the tank.

【0039】一方、前記精留塔27の下段側には、最下
部に塔内貯槽39が構成され、前記塔内貯槽39は加熱
用リボイラー40からの循環管路41が接続され、他方
で熱交換器(熱交換手段)42、返送ポンプ43を介
し、前記樹脂分除去機5の返送液受入口8bへ至る返送
路44が接続されている。
On the other hand, on the lower side of the rectification column 27, an in-column storage tank 39 is formed at the lowermost portion, the internal storage tank 39 is connected to a circulation pipe line 41 from a heating reboiler 40, and the other side is heated. A return passage 44 is connected to the return liquid receiving port 8b of the resin content remover 5 via an exchanger (heat exchange means) 42 and a return pump 43.

【0040】前記再生成分排出路38は第1処理液槽4
5及び第2処理液槽46に接続されている。第1処理液
槽45及び第2処理液槽46はそれぞれ低部より第6導
管47a、47bを介し濃度調整槽48に接続されてい
る。更に濃度調整槽48は内部にテフロン製の濾材が内
装された濾過器49を経由する第7導管50を介して薬
液供給槽51に接続され、半導体、液晶製造工程へ供給
可能とされている。
The regeneration component discharge passage 38 is provided in the first processing liquid tank 4
5 and the second processing liquid tank 46. The first processing liquid tank 45 and the second processing liquid tank 46 are connected to the concentration adjusting tank 48 from the lower portions through sixth conduits 47a and 47b, respectively. Further, the concentration adjusting tank 48 is connected to the chemical solution supplying tank 51 via a seventh conduit 50 passing through a filter 49 having a Teflon filter medium inside, and can be supplied to the semiconductor and liquid crystal manufacturing process.

【0041】前記第7導管50は濾過器49と薬液供給
槽51の間で分岐され、分岐管50aは分光分析手段5
2を経由し、第7導管50に戻されている。
The seventh conduit 50 is branched between the filter 49 and the chemical solution supply tank 51, and the branch pipe 50a is provided with the spectroscopic analysis means 5
It is returned to the seventh conduit 50 via 2.

【0042】また、減圧装置53(たとえば真空ポンプ
など)から減圧導管54a、54bを介して、第1ベン
トコンデンサー15、第2ベントコンデンサー34、低
沸点成分貯槽22、処理液槽45、46に接続され、蒸
留塔9、精留塔27、樹脂分除去機5をも減圧可能な構
成としている。
Further, the pressure reducing device 53 (for example, a vacuum pump or the like) is connected to the first vent condenser 15, the second vent condenser 34, the low boiling point component storage tank 22, and the processing liquid tanks 45 and 46 through the pressure reducing conduits 54a and 54b. Therefore, the distillation column 9, the rectification column 27, and the resin component removing machine 5 are also configured to be capable of reducing the pressure.

【0043】前記樹脂分除去機5は図8に示すように、
密閉円筒状の筒本体55が外周面の蒸気等を導入する加
熱手段56により加熱され、筒本体55が蒸発面57と
されている。筒本体55の内部には円筒形の回転体58
が前記、筒本体55に同軸上で回転可能にされている。
回転体58の周面は放射状にブラシ59を有し、ブラシ
59面と筒本体55内面は接触回動自在に配備されてい
る。
As shown in FIG. 8, the resin component removing machine 5 is
The closed cylinder-shaped cylinder body 55 is heated by the heating means 56 that introduces steam or the like on the outer peripheral surface, and the cylinder body 55 serves as an evaporation surface 57. A cylindrical rotating body 58 is provided inside the cylinder body 55.
Is coaxially rotatable with the cylinder body 55.
The peripheral surface of the rotating body 58 has brushes 59 radially, and the surface of the brush 59 and the inner surface of the cylinder body 55 are arranged so as to be rotatable in contact with each other.

【0044】また、前記、蒸留塔9、精留塔27共、塔
内の内部温度、圧力が計測可能に上段、中段、下段には
温度計、圧力計が配備されている。前記蒸留塔9、精留
塔27共、本実施例では外部にリボイラー24、40を
設ける構造としているが、それぞれの塔内貯槽23、3
9に一体型として設ける(たとえば、カランドリア型)
場合も加熱効果は同等であり、省スペース面でより効果
が得られる。
Further, both the distillation column 9 and the rectification column 27 are provided with a thermometer and a pressure gauge at the upper, middle and lower stages so that the internal temperature and pressure inside the column can be measured. In this embodiment, both the distillation column 9 and the rectification column 27 have external reboilers 24 and 40.
Provided as an integral type in 9 (for example, calandria type)
Also in this case, the heating effect is the same, and a more space-saving effect can be obtained.

【0045】図7及び図9に示すとおり、低沸点貯槽2
2は窒素ガスを導入する窒素導管60と開閉バルブ61
aを有し、各状況を切換える切換え用バルブ61b、6
1c、61d、61eが配備されている。61bは大気
開放系、61cは前段からの送液系(低沸点成分排出路
21)、61dは減圧系、61eは槽からの排出系に設
けられている。
As shown in FIGS. 7 and 9, the low boiling point storage tank 2
2 is a nitrogen conduit 60 for introducing nitrogen gas and an opening / closing valve 61.
a, and switching valves 61b, 6 for switching each situation
1c, 61d, 61e are provided. Reference numeral 61b is an atmosphere opening system, 61c is a liquid sending system from the previous stage (low boiling point component discharge passage 21), 61d is a decompression system, and 61e is a discharge system from the tank.

【0046】同様に、図10に示すとおり、第1処理液
槽45及び第2処理液槽46もそれぞれ窒素ガスを導入
する窒素導管62、63と開閉バルブ64a、65aを
有し、各状況の切換え用バルブ64b、64c、64
d、64e及び65b、65c、65d、65eが配備
されている。64b、65bは大気開放系、64c,6
5cは前段からの送液系(再生成分排出路38a、38
b)、64d、65dは減圧系、64e、65eは槽か
らの排出系に設けられている。
Similarly, as shown in FIG. 10, the first treatment liquid tank 45 and the second treatment liquid tank 46 also have nitrogen conduits 62, 63 and opening / closing valves 64a, 65a for introducing nitrogen gas, respectively, and are provided for each situation. Switching valves 64b, 64c, 64
d, 64e and 65b, 65c, 65d, 65e are provided. 64b and 65b are open to the atmosphere, 64c and 6
5c is a liquid delivery system from the previous stage (regenerated component discharge paths 38a, 38
b), 64d and 65d are provided in the pressure reducing system, and 64e and 65e are provided in the discharge system from the tank.

【0047】また、図11に示すとおり、蒸留塔9上部
から接続される第1コンデンサー14、第1ベントコン
デンサー15及び冷媒配管(冷却水)の外周面には保温
材67及び減圧用配管には加温手段66を包み込んだ保
温材67が覆われている。加温手段66としては蒸気、
ヒーター等が有効である。
Further, as shown in FIG. 11, the first condenser 14, the first vent condenser 15, and the refrigerant pipe (cooling water) connected from the upper part of the distillation column 9 are provided with a heat insulating material 67 and a pressure reducing pipe on the outer peripheral surface thereof. A heat insulating material 67 enclosing the heating means 66 is covered. Steam as the heating means 66,
A heater is effective.

【0048】次に、再生装置1の作用を装置運転手順と
使用済み溶剤の流れに沿って説明する。図7において、
減圧装置53(真空ポンプ)を作動させ、減圧導管54
a、54bを経由して、樹脂分除去機5、蒸留塔9、精
留塔27内が真空に近い減圧状態に保持される。また、
樹脂分除去機5、蒸留塔9、精留塔27内は加熱手段に
よって所定温度に加熱される。
Next, the operation of the regenerating apparatus 1 will be described along with the apparatus operating procedure and the flow of the used solvent. In FIG.
The decompression device 53 (vacuum pump) is operated, and the decompression pipe 54
The resin content remover 5, the distillation column 9, and the rectification column 27 are maintained under a reduced pressure close to a vacuum via a and 54b. Also,
The resin content remover 5, the distillation column 9, and the rectification column 27 are heated to a predetermined temperature by heating means.

【0049】しかる後、溶剤回収槽2の使用済み溶剤L
がポンプ3により樹脂分除去機5に送液される。樹脂分
除去機5に導入された使用済み溶剤Lは図8に示す機内
の回転体58及びブラシ59に飛ばされて蒸発面57に
接触し、膜状に分散し、ベーパー化した揮発成分L1が
蒸発し、液状の不揮発成分(樹脂成分)L2に分離さ
れ、揮発成分L1はベーパー排出口8aから蒸留塔9に
導入される。なお、前記した樹脂分除去機5は、この樹
脂分除去機5と同構造の日本車輌製造株式会社製造販売
の「薄膜蒸発装置」を用いることができる。
After that, the used solvent L in the solvent recovery tank 2
Is sent to the resin content remover 5 by the pump 3. The used solvent L introduced into the resin content removing machine 5 is blown off by the rotating body 58 and the brush 59 in the machine shown in FIG. 8 to come into contact with the evaporation surface 57, disperse in a film form, and vaporize the volatile component L1. It is evaporated and separated into a liquid non-volatile component (resin component) L2, and the volatile component L1 is introduced into the distillation column 9 through the vapor discharge port 8a. As the resin component removing machine 5, the "thin film evaporator" manufactured and sold by Japan Vehicle Manufacturing Co., Ltd. having the same structure as the resin component removing machine 5 can be used.

【0050】前記不揮発成分L2は樹脂分除去機5の下
部側に内壁を伝い落ち、底部に貯まり、樹脂分貯槽7に
貯留される(図7、図8参照)。一方、図7に示すよう
に、蒸留塔9に導入された揮発成分L1は充填物10
a、10b内で下降する還流液Lr1と加熱により上昇
するベーパーとの気液接触による蒸留が行われ、低沸点
成分L3はベーパー化し、上昇してベーパー排出口12
から排出され、冷却水が循環する第1コンデンサー1
4、第2ベントコンデンサー15で凝縮し、還流槽16
に一時貯留され、下部から還流ポンプ17により還流液
Lr1として蒸留塔9の還流口11へ蒸留のバランスを
保ちながら送液し、余剰液Leは還流槽16に戻る。還
流槽16の高レベルのオーバーフロー分は低沸点成分排
出路21経由で低沸点成分貯槽22に貯え、排出に備え
る。
The non-volatile component L2 travels down the inner wall to the lower side of the resin content remover 5, is stored at the bottom, and is stored in the resin content storage tank 7 (see FIGS. 7 and 8). On the other hand, as shown in FIG. 7, the volatile component L1 introduced into the distillation column 9 is the filler 10
Distillation is carried out by vapor-liquid contact between the reflux liquid Lr1 descending in a and 10b and the vapor rising by heating, and the low boiling point component L3 is vaporized and rises to vapor discharge port 12
Condenser 1 which is discharged from the tank and circulates cooling water
4, condensed in the second vent condenser 15, and returned to the reflux tank 16
Is temporarily stored in the recirculation tank 16 and is fed from the lower portion to the recirculation port 11 of the distillation column 9 as the recirculation liquid Lr1 while maintaining the balance of distillation, and the surplus liquid Le is returned to the recirculation tank 16. The high-level overflow of the reflux tank 16 is stored in the low-boiling-point component storage tank 22 via the low-boiling-point component discharge passage 21 and prepared for discharge.

【0051】低沸点成分貯槽22における低沸点成分L
3の排出は、開閉バルブ(切換え用バルブ)61c、6
1dを閉じ、開閉バルブ(切換え用バルブ)61bを開
とし大気圧に戻し、その後、バルブ61bを閉とし、次
いで開閉バルブ61a、61eを開とし、開閉バルブ6
1aから窒素ガスを送ることによって行なうことができ
る。排出を終了時は開閉バルブ61a、61eを閉じ、
61bを開き大気圧に戻す。次いで、開閉バルブ61
c、61dを開き、貯槽に備える。
Low boiling point component L in low boiling point component storage tank 22
3 is discharged by opening / closing valves (switching valves) 61c, 6
1d is closed, the open / close valve (switching valve) 61b is opened to return to atmospheric pressure, then the valve 61b is closed, and then the open / close valves 61a and 61e are opened to open / close the open / close valve 6
It can be performed by sending nitrogen gas from 1a. At the end of discharging, the on-off valves 61a and 61e are closed,
Open 61b and return to atmospheric pressure. Next, the open / close valve 61
Open c and 61d and prepare for the storage tank.

【0052】一方、図7において、高沸点成分L4は塔
内貯槽23に液体として貯えられ、移送ポンプ26によ
り第4導管28経由で精留塔27の下層部に供給され
る。精留塔27に導入された高沸点成分L4は塔内で塔
内貯槽39に貯まり、加熱により一部はベーパー化し上
昇する。棚段29で下降する還流液Lr2と前記上昇す
るベーパーとの気液接触による蒸留が行われ、精留成分
L5(最終再生成分)は、上昇してベーパー排出口31
から排出され、冷却水が循環する第2コンデンサー3
3、第2ベントコンデンサー34で凝縮され、還流槽3
5に一時貯留される。還流槽35に貯留された低沸点成
分L5は前記還流槽35の下部から還流ポンプ36によ
り還流液Lr2として精留塔27の還流口30へ蒸留の
バランスを保ちながら送液される。図7に示すように、
還流槽35の設定液面のオーバーフロー分は再生成分排
出路38経由で処理液槽45、46のいづれか一方に再
生液成分(精留成分)L5として貯留され、貯留した再
生液槽が一杯になったときには他方の処理液槽が使用さ
れる交互貯留を行う。
On the other hand, in FIG. 7, the high boiling point component L4 is stored as a liquid in the in-column storage tank 23, and is supplied by the transfer pump 26 to the lower layer portion of the rectification column 27 via the fourth conduit 28. The high boiling point component L4 introduced into the rectification column 27 is stored in the column internal storage tank 39 in the column, and part of it vaporizes and rises by heating. Distillation by gas-liquid contact between the reflux liquid Lr2 that descends in the tray 29 and the vapor that rises is performed, and the rectification component L5 (final regenerated component) rises and vapor discharge port 31
Second condenser 3 that is circulated by the cooling water discharged from the
3, the second vent condenser 34 is condensed, the reflux tank 3
It is temporarily stored in 5. The low boiling point component L5 stored in the reflux tank 35 is fed from the lower portion of the reflux tank 35 by the reflux pump 36 as the reflux liquid Lr2 to the reflux port 30 of the rectification column 27 while maintaining the balance of distillation. As shown in FIG.
The overflow of the set liquid level of the reflux tank 35 is stored as a regenerated liquid component (rectification component) L5 in one of the treated liquid tanks 45 and 46 via the regenerated component discharge passage 38, and the stored regenerated liquid tank becomes full. In that case, alternate storage is performed in which the other processing liquid tank is used.

【0053】図10に示すように、第1処理液槽45が
満杯になった場合、開閉バルブ64c、64dを閉じ、
第2処理液槽46側の開閉バルブ65c、65dを開
き、第2処理液槽46側に貯留を開始する。第1処理液
槽45もしくは第2処理液槽46に貯留された再生液成
分L5は満杯になった槽から窒素ガスの圧送により、そ
れぞれの第6導管47a、47bを経由させて濃度調整
槽48に交互に送液を行う。
As shown in FIG. 10, when the first processing liquid tank 45 is full, the open / close valves 64c and 64d are closed,
The opening / closing valves 65c and 65d on the second processing liquid tank 46 side are opened to start storage on the second processing liquid tank 46 side. The regenerant liquid component L5 stored in the first treatment liquid tank 45 or the second treatment liquid tank 46 is pressure-fed with nitrogen gas from the filled tank to pass through the sixth conduits 47a and 47b, and the concentration adjusting tank 48 is supplied. The liquids are alternately delivered to.

【0054】図10に示すように、第1処理液槽45か
らの排出は、開閉バルブ64bを開とし大気圧に戻し、
その後 64bを閉とし、次いで開閉バルブ64a、6
4eを開とし、開閉バルブ64aから窒素ガスを送るこ
とによって行なうことができる。排出の終了時は開閉バ
ルブ64a、64eを閉じ、64bを開き大気圧に戻
す。次いで、開閉バルブ64c、64dを開き、貯槽に
備える。第2処理液槽46からの排出も同様の開閉バル
ブ操作によって、行なわれる。
As shown in FIG. 10, the discharge from the first processing liquid tank 45 is performed by opening the open / close valve 64b and returning to the atmospheric pressure.
After that, 64b is closed, and then the open / close valves 64a, 6
4e is opened, and nitrogen gas is sent from the opening / closing valve 64a. At the end of discharging, the open / close valves 64a and 64e are closed and 64b is opened to return to atmospheric pressure. Next, the opening / closing valves 64c and 64d are opened to prepare for the storage tank. The discharge from the second processing liquid tank 46 is also performed by the same opening / closing valve operation.

【0055】濃度調整槽48では後段の分光分析手段5
2の即座の分析結果により、必要に応じ、所定成分濃度
となるように、例えば、再生溶剤がMEAとDMSOか
らなる剥離液の場合、所定濃度に満たない成分を必要量
供給する。所定成分濃度内に収まっている場合は濃度調
整槽48での濃度調整の必要はない(図6、図7参
照)。
In the concentration adjusting tank 48, the spectroscopic analysis means 5 in the subsequent stage is used.
According to the immediate analysis result of No. 2, if necessary, so that a predetermined component concentration is obtained, for example, when the regenerating solvent is a stripping solution composed of MEA and DMSO, a necessary amount of a component that does not reach the predetermined concentration is supplied. When the concentration is within the predetermined component concentration, it is not necessary to adjust the concentration in the concentration adjusting tank 48 (see FIGS. 6 and 7).

【0056】分光分析手段は、分岐管50aを流れる再
生溶剤L6に対して赤外光の固有の吸収作用を利用して
成分濃度測定を行ない、再生溶剤L6が所定濃度外の場
合は再生装置の運転を停止したり、濃度調整したりして
再生溶剤L6の品質を知るようにしたものである。分光
分析手段には各種の分光器を用い得る。濃度調整をされ
た処理液L6は濾過器49において、液に含まれる粗大
粒子が除去されたのち、薬液供給槽51に貯留され、製
造工程への供給に備える。
The spectroscopic analysis means measures the component concentration of the regenerating solvent L6 flowing through the branch pipe 50a by utilizing the inherent absorption function of infrared light. When the regenerating solvent L6 is out of the predetermined concentration, The quality of the regenerated solvent L6 is known by stopping the operation or adjusting the concentration. Various spectroscopes can be used as the spectroscopic analysis means. The concentration-adjusted treatment liquid L6 is stored in the chemical liquid supply tank 51 after the coarse particles contained in the liquid are removed in the filter 49, and is prepared for supply to the manufacturing process.

【0057】本実施の形態によれば、溶剤の廃液を再生
使用する効率を高めることができ、安定した再生溶剤の
品質、装置の長寿命化が図れ、廃液量、廃液処理コスト
が低減できる。また、地球環境に及ぼす悪影響を軽減す
ることができる。
According to this embodiment, the efficiency of reusing the waste liquid of the solvent can be improved, the quality of the regenerated solvent can be stabilized, the life of the apparatus can be extended, and the waste liquid amount and the waste liquid treatment cost can be reduced. In addition, it is possible to reduce adverse effects on the global environment.

【0058】蒸留塔9、精留塔27など、混合成分を含
む溶剤から溶剤を蒸発分離する液の分離温度は減圧で蒸
発させることにより、溶剤の分離温度を下げることが可
能となり、所定温度以下での分離にすれば、特殊な材質
を使用しなくても、短時間で部品交換すること無く、長
時間安定して装置の運転を行うことが可能となる。たと
えば、表1に示すように、MEAとDMSOの混合液に
対し、SUS304でも従来状態(圧力、温度:P0、
T0)より、12.7kpa減圧すると約40℃温度を
低減でき、腐食度を大幅に良化でき、特殊材質を使用し
なくても、寿命を長期化ができ、コスト、製作納期の面
で削減できる。
The separation temperature of the liquid, such as the distillation column 9 and the rectification column 27, which evaporates and separates the solvent from the solvent containing the mixed components can be lowered by evaporating the liquid at a reduced pressure. If the separation is performed, it becomes possible to stably operate the apparatus for a long time without replacing parts in a short time without using a special material. For example, as shown in Table 1, a mixed liquid of MEA and DMSO has a conventional state (pressure, temperature: P0,
By reducing the pressure by 12.7 kpa from T0), the temperature can be reduced by about 40 ° C, the corrosion rate can be significantly improved, the life can be extended without using special materials, and the cost and delivery time can be reduced. it can.

【0059】[0059]

【表1】 [Table 1]

【0060】また、本実施例においては、使用済み溶剤
Lの再生使用が可能となり、表2に示すように、その再
生を約90%と高い効率で行なうことができ、従来、購
入していた溶剤の新液量を10%以下へと大幅に低減で
き、その分のコスト削減が可能となる。廃液量、廃液処
理コストも大幅に低減できる。また、排気凝縮を行なう
と更に回収廃液量を増加でき、再生液の絶対量を増やす
ことができると共に、排ガス処理工程での環境面の負荷
を低減でき、新液の購入量の削減ができる。また、品質
面では安定した再生溶剤の品質が維持でき、装置の長寿
命化が可能となる。
Further, in the present embodiment, the used solvent L can be regenerated and reused, and as shown in Table 2, the regeneration can be performed with a high efficiency of about 90%, which was conventionally purchased. The amount of new solvent can be greatly reduced to 10% or less, and the cost can be reduced accordingly. The amount of waste liquid and the cost of waste liquid treatment can be greatly reduced. Further, by performing exhaust gas condensation, the amount of recovered waste liquid can be further increased, the absolute amount of regenerated liquid can be increased, the environmental load in the exhaust gas treatment process can be reduced, and the purchase amount of new liquid can be reduced. Further, in terms of quality, stable quality of the regenerated solvent can be maintained, and the life of the device can be extended.

【0061】[0061]

【表2】 [Table 2]

【0062】上記した再生装置1は樹脂分除去機5、蒸
留塔9、精留塔27などを順次組付けて形成している
が、再生装置1は、各装置部分ごとに予じめ分割して組
付けた複数のユニットとして構成し、設置現場で各ユニ
ットを接続して所定の再生装置1とすることができる。
たとえば図12に示すユニット68,69として予じめ
組付け構成しておき、設定現場で、ユニット68,69
をボルト類で接続し、相互ユニット68、69間の連結
配管類もフランジ構造を結合可能とすれば施設し易い。
The above-mentioned regenerator 1 is formed by sequentially assembling the resin content remover 5, the distillation column 9, the rectification column 27, etc., but the regenerator 1 is divided into parts for each device in advance. It is possible to configure a plurality of units assembled as described above, and connect the units at the installation site to form a predetermined reproducing apparatus 1.
For example, the units 68 and 69 shown in FIG. 12 are preliminarily assembled and configured, and the units 68 and 69 are set at the setting site.
Are connected by bolts, and connecting pipes between the mutual units 68 and 69 can be easily installed if the flange structure can be connected.

【0063】[0063]

【発明の効果】本発明によれば、使用済み溶剤から溶剤
成分を回収再生して、使用可能な溶剤を得ることができ
る。
According to the present invention, a usable solvent can be obtained by recovering and regenerating a solvent component from a used solvent.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明実施例の各処理工程を示す図である。FIG. 1 is a diagram showing each processing step of an example of the present invention.

【図2】同実施例の前段の処理工程を示す図である。FIG. 2 is a diagram showing a first-stage processing step of the example.

【図3】同実施例の処理工程を示す図である。FIG. 3 is a diagram showing processing steps of the embodiment.

【図4】同実施例の処理工程を示す図である。FIG. 4 is a diagram showing a processing step of the embodiment.

【図5】本発明方法変更例の各処理工程を示す図であ
る。
FIG. 5 is a diagram showing each processing step of a modified example of the method of the present invention.

【図6】本発明方法のさらなる変更例の処理工程を示す
図である。
FIG. 6 is a diagram showing processing steps of a further modified example of the method of the present invention.

【図7】本発明実施例の溶剤再生装置の略体図である。FIG. 7 is a schematic view of a solvent recycling apparatus according to an embodiment of the present invention.

【図8】同一部破断した樹脂分除去機の構造図である。FIG. 8 is a structural diagram of a resin component removing machine in which the same portion is broken.

【図9】同低沸点成分貯槽周りの略体図である。FIG. 9 is a schematic diagram around the low boiling point component storage tank.

【図10】同両処理液槽周りの略体図である。FIG. 10 is a schematic diagram around the both treatment liquid tanks.

【図11】同凝縮手段周りの略体図である。FIG. 11 is a schematic view around the condensing means.

【図12】本発明の他の実施例の装置構成図である。FIG. 12 is a device configuration diagram of another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…… 再生装置 2…… 溶剤回収槽 5…… 樹脂分除去機 7…… 樹脂分貯槽 9…… 蒸留塔 10…… 充填物 14…… 第1コンデンサー 15…… 第1ベントコンデンサー 16…… 還流槽 22…… 低沸点成分貯槽 23…… 塔内貯槽 27…… 精留塔 33…… 第2コンデンサー 34…… 第2ベントコンデンサー 35…… 還流槽 42…… 熱交換手段 43…… 返送ポンプ 44…… 返送路 48…… 濃度調整槽 49…… 濾過器 51…… 薬液供給槽 52…… 分光分析手段 53…… 減圧装置 66…… 加温手段 67…… 保温材 68…… 第1ユニット 69…… 第2ユニット 1 ... Playback device 2 ... Solvent recovery tank 5 …… Resin removal machine 7 ... Resin storage tank 9 ... Distillation tower 10 ... Filling material 14 ... 1st condenser 15 …… First vent condenser 16 ... Reflux tank 22 ... Low boiling point component storage tank 23 ... In-tower storage tank 27 ... rectification tower 33 …… Second condenser 34 …… Second vent condenser 35 ... Reflux tank 42 ... Heat exchange means 43 ... Return pump 44 ... Return route 48 ... Concentration adjustment tank 49 ... Filter 51 ... Chemical supply tank 52 ... Spectroscopic analysis means 53 ... Pressure reducing device 66 ... Heating means 67 ... Heat insulation material 68 …… First unit 69 …… Second unit

───────────────────────────────────────────────────── フロントページの続き (72)発明者 井上 恭 石川県能美郡川北町山田先出25 松下環 境空調エンジニアリング株式会社 石川 出張所内 (72)発明者 山口 典生 石川県能美郡川北町山田先出25 松下環 境空調エンジニアリング株式会社 石川 出張所内 (72)発明者 増田 義登 石川県能美郡川北町山田先出25 松下環 境空調エンジニアリング株式会社 石川 出張所内 (72)発明者 川瀬 泰人 東京都千代田区丸の内2−2−1 岸本 ビル11F 日本リファイン株式会社 東 京事務所内 (72)発明者 青島 芳芝 千葉県市原市八幡海岸通74−18 日本リ ファイン株式会社 千葉工場内 (72)発明者 小田 昭昌 千葉県市原市八幡海岸通74−18 日本リ ファイン株式会社 千葉工場内 (56)参考文献 特開 平9−49093(JP,A) 特開 平8−318263(JP,A) 特開 平9−205056(JP,A) 特開 平7−171552(JP,A) 特開 平5−142781(JP,A) 特開 平6−262003(JP,A) 特開 平9−34121(JP,A) 特開2000−305285(JP,A) 特開2001−145802(JP,A) 特開2001−194807(JP,A) 特表2000−508572(JP,A) 国際公開97/025127(WO,A1) (58)調査した分野(Int.Cl.7,DB名) H01L 21/027 G03F 7/42 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Kyo Inoue, Yamada, Kawakita-machi, Nomi-gun, Ishikawa 25, Matsushita Tamaki Sakai Air-Conditioning Engineering Co., Ltd. Ishikawa branch office (72) Inventor, Norio Yamaguchi, Kawakita-machi, Nomi-gun, Ishikawa, 25, Matsuda Environmental Air-Conditioning Engineering Co., Ltd. Ishikawa Branch Office (72) Inventor Yoshito Masuda Yamada, Kawakita-cho, Nomi-gun, Ishikawa No. 25 Matsushita Environment Air-Conditioning Engineering Co., Ltd. Ishikawa Branch Office (72) Yasushi Kawase 2 Marunouchi, Chiyoda-ku, Tokyo 2-1 Kishimoto Building 11F Japan Refine Co., Ltd. Tokyo office (72) Inventor Yoshishiba Aoshima 74-18 Hachiman Kaigan Dori, Ichihara City, Chiba Prefecture Japan Refine Co., Ltd. Chiba Factory (72) Inventor Akimasa Oda Chiba Prefecture 74-18 Hachiman Kaigan-dori, Ichihara City Japan Refine Co., Ltd. Chiba Field (56) Reference JP-A-9-49093 (JP, A) JP-A-8-318263 (JP, A) JP-A-9-205056 (JP, A) JP-A-7-171552 (JP, A) JP 5-142781 (JP, A) JP 6-262003 (JP, A) JP 9-34121 (JP, A) JP 2000-305285 (JP, A) JP 2001-145802 (JP , A) JP 2001-194807 (JP, A) JP 2000-508572 (JP, A) International Publication 97/025127 (WO, A1) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/027 G03F 7/42

Claims (15)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 樹脂成分と溶剤成分よりも低沸点の低沸
点不純物とを含む使用済み溶剤を再生する方法であっ
て、 樹脂成分を除去する樹脂成分除去工程と、 樹脂成分が除去された使用済み溶剤から低沸点不純物を
蒸発除去する工程と、 低沸点不純物除去工程で得られた残留液を蒸留し、前記
溶剤成分を蒸発させ凝縮液として回収する蒸留工程、と
を備え、 前記樹脂成分除去工程において、内周面を加熱可能な蒸
発面として有する密閉状の筒本体と、前記筒本体内に配
置される回転体であってその外周面に放射状にブラシを
有する回転体、とを備える樹脂除去装置を用い、前記筒
本体内の前記蒸発面と回転する前記回転体又は前記ブラ
シとの間に前記使用済み溶剤を供給し、加熱された前記
蒸発面に前記使用済み溶剤を接触させることにより、低
沸点不純物と溶剤成分と蒸発させるとともに前記使用済
み溶剤中の樹脂成分を流下させる、方法。
1. A low boiling point having a boiling point lower than that of a resin component and a solvent component.
It is a method to recycle used solvent containing point impurities.
The resin component removal step of removing the resin component and the low boiling point impurities from the used solvent from which the resin component has been removed.
The step of removing by evaporation and the residual liquid obtained in the step of removing low-boiling-point impurities are distilled,
A distillation step of evaporating the solvent component and collecting it as a condensate;
In the resin component removing step, the inner peripheral surface can be heated.
The sealed cylindrical body that has the emitting surface and the
It is a rotating body placed, and brushes are radially arranged on its outer peripheral surface.
A rotating body having a resin removing device including
The rotating body or the bra rotating with the evaporation surface in the main body
Supply the used solvent between the
By bringing the used solvent into contact with the evaporation surface,
Boiled impurities and solvent components are evaporated and used as above
A method of flowing down the resin component in the solvent.
【請求項2】前記樹脂成分除去工程に先だって、前記使
用済み溶剤を脱気する工程を備える、請求項1に記載の
方法。
2. The use of the resin prior to the resin component removing step.
The method according to claim 1, comprising a step of degassing the spent solvent.
Method.
【請求項3】前記使用済み溶剤は、溶剤成分としてモノ
エタノールアミンを含有し、前記低沸点不純物除去工程
における分離温度を前記使用済み溶剤に含まれる炭酸ガ
スが分離可能となる温度以上とする、請求項1又は2に
記載の方法。
3. The used solvent is a mono solvent as a solvent component.
The step of removing low-boiling point impurities containing ethanolamine
The separation temperature of the carbon dioxide contained in the used solvent is
The temperature is equal to or higher than the temperature at which the gas can be separated, according to claim 1 or 2.
The method described.
【請求項4】前記使用済み溶剤の主成分が一成分もしく
は複数の成分からなる剥離液である、請求項1〜3のい
ずれかに記載の方法。
4. The main component of the used solvent is one component or
Is a stripping solution composed of a plurality of components.
The method described in some cases.
【請求項5】前記使用済み溶剤の主成分が一成分もしく
は複数の成分からなるシンナーである、請求項1又は2
に記載の方法。
5. The main component of the used solvent is one component or
Is a thinner composed of a plurality of components.
The method described in.
【請求項6】前記樹脂成分除去工程、前記低沸点不純物
除去工程、前記蒸留工程において、被処理液から溶剤を
蒸発分離する液の分離温度を使用材質の腐食に耐える温
度以下になるように減圧下で蒸発させる、請求項1〜5
のいずれかに 記載の方法。
6. The resin component removing step, the low boiling point impurities
In the removal step and the distillation step, the solvent is removed from the liquid to be treated.
The separation temperature of the liquid to be vaporized and separated is the temperature that can withstand the corrosion of the materials used.
6. Evaporating under reduced pressure so as to be less than 100 degrees Celsius.
The method described in any one of .
【請求項7】気化した溶剤成分を含む排ガス発生源から
の排ガスを凝縮する工程を備え、前記工程で得られた凝
縮液を前記使用済み溶剤の一部とする、請求項1〜6の
いずれかの方法。
7. From an exhaust gas source containing a vaporized solvent component
Of the exhaust gas of the above step.
Condensed liquid is used as a part of said used solvent, and
Either way.
【請求項8】樹脂成分と溶剤よりも低沸点の低沸点不純
物とを含む使用済み溶剤を再生する装置であって、 前記使用済み溶剤から樹脂成分を除去する樹脂成分除去
装置と、 樹脂成分が除去された使用済み溶剤から低沸点不純物を
蒸発させ除去する第1の蒸留装置と、 低沸点不純物が除去された使用済み溶剤からから溶剤成
分を蒸発させ回収する第2の蒸留装置、とを備え、前記
樹脂成分除去装置は、内周面を加熱可能な蒸発面として
有する密閉状の筒本体と、前記筒本体内に配置される回
転体であってその外周面に放射状にブラシを有する回転
体、とを備える樹脂除去装置を用い、前記筒本体内の前
記蒸発面と回転する前記回転体又は前記ブラシとの間に
前記使用済み溶剤を供給し、加熱された前記蒸発面に前
記使用済み溶剤を接触させることにより、低沸点不純物
と溶剤成分と蒸発させるとともに前記使用済み溶剤中の
樹脂成分を流下させるようになっている、溶剤の再生装
8. A low boiling point impurity having a boiling point lower than that of the resin component and the solvent.
A device for regenerating a used solvent containing a substance, which removes a resin component from the used solvent.
Low boiling impurities from the equipment and used solvent from which resin components have been removed
The first distillation device that evaporates and removes it, and the solvent composition consisting of the used solvent from which low-boiling point impurities have been removed.
A second distillation device for evaporating and recovering the component,
The resin component removal device uses the inner surface as a heatable evaporation surface.
A closed cylindrical body having a ring and a rotation arranged in the cylindrical body.
A rotating body that has radial brushes on its outer surface
Using a resin removing device including a body and
Between the evaporation surface and the rotating body or brush that rotates
The used solvent is supplied to the heated evaporation surface.
By contact with used solvent, low boiling point impurities
And the solvent components are evaporated and
Solvent recycling equipment designed to allow resin components to flow down
Place
【請求項9】 前記第1の蒸留装置及び第2の蒸留装置
のどちらか一方又は双方を充填式蒸留塔とする、請求項
8に記載の装置
9. The first distillation apparatus and the second distillation apparatus
Either one or both of them as a packed distillation column,
8. The device according to item 8 .
【請求項10】 第1の蒸留装置において除去される低
沸点成分を凝縮させる凝縮手段を保温し、凝縮手段が循
環冷媒の所定温度範囲を保つ、請求項8又は9に記載の
装置
10. The low removed in the first distillation apparatus.
The condensing means for condensing the boiling point components is kept warm and the condensing means circulates.
The ring refrigerant according to claim 8 or 9, which maintains a predetermined temperature range.
Equipment .
【請求項11】 前記樹脂成分除去装置、前記第1の蒸
留装置、及び前記第2の蒸留装置に付随して備えられる
貯留槽に貯留される液体を搬出する窒素ガスの圧送手段
を備える、請求項8〜10のいずれかに記載の装置
11. The resin component removing device, the first steam
A distillation device and an auxiliary device for the second distillation device
Nitrogen gas pressure feed means for carrying out the liquid stored in the storage tank
An apparatus according to any of claims 8 to 10, comprising:
【請求項12】 第2の蒸留装置の残液分を廃液として
処理する廃液経路に、前記残液分を樹脂成分除去手段に
返送する経路を連結し、当該返送経路を選択的に使用可
能とする、請求項8〜11のいずれかに記載の装置
12. The residual liquid of the second distillation apparatus is used as waste liquid.
In the waste liquid path to be processed, the residual liquid component is used as a resin component removing means.
You can use the return route selectively by connecting the return route
The device according to any one of claims 8 to 11, which is capable .
【請求項13】前記各装置間の処理液を還流もしくは移
送もしくは返送に用いるそれぞれの移送手段の前段には
液温度低下のための熱交換手段を設ける、請求項8〜1
2のいずれか記載の装置
13. The processing liquid between the respective devices is refluxed or transferred.
In front of each transfer means used for sending or returning
A heat exchange means for lowering the liquid temperature is provided, and the heat exchange means is provided.
2. The device according to any one of 2 .
【請求項14】 第2の蒸留装置から得られる回収溶剤
成分の主送液管から一部を取り出して前記主送液管に戻
す経路に分光分析手段を設け、処理液成分を連続監視し
運転制御する、請求項8〜13のいずれかに記載の装
14. A recovered solvent obtained from the second distillation apparatus.
Take a part of the component from the main liquid feed pipe and return it to the main liquid feed pipe.
A spectroscopic analysis means is installed in the path to continuously monitor the processing liquid components.
The device according to claim 8, which controls operation.
Place
【請求項15】 気化した溶剤成分を含む排ガス発生源
からの排ガスを凝縮する手段を備え、この凝縮液を前記
使用済みの溶剤の一部として再生する、請求項8〜14
のいずれかに記載の装置。
15. An exhaust gas generation source containing a vaporized solvent component.
Means for condensing the exhaust gas from the
15. Recycle as part of the used solvent.
The device according to any one of 1.
JP2000399583A 2000-04-28 2000-12-27 Method and apparatus for regenerating solvent Expired - Lifetime JP3409028B2 (en)

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JP2000399583A JP3409028B2 (en) 2000-04-28 2000-12-27 Method and apparatus for regenerating solvent
TW090109865A TW514962B (en) 2000-04-28 2001-04-25 Method and apparatus for reclaiming used solvent
CNB011171669A CN1181520C (en) 2000-04-28 2001-04-27 Regeneration method and device for waste solvent
KR1020010023074A KR100665559B1 (en) 2000-04-28 2001-04-27 Method and apparatus for reclaiming used solvent

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CN1181520C (en) 2004-12-22
CN1322005A (en) 2001-11-14

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