JP3412913B2 - Photosensitive resin plate for foil stamping - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin plate for foil stamping, and more particularly, to a method of applying the same to a heat-sensitive foil or a pressure-sensitive foil. The present invention relates to a photosensitive resin plate for foil stamping, which has good printing durability and excellent printing accuracy without printing unevenness. 2. Description of the Related Art Conventionally, printed matter has an aesthetic appearance,
For the purpose of giving a sense of quality, a printed material such as a book cover, an album, a plastic plate, or the like, on which an arbitrary metal foil character or metal foil design is printed is commercially available. The printing of the metal foil letters and the metal foil design is performed by a foil stamping method. Specifically, a metal foil and a hot-melt adhesive are sequentially laminated on a support film made of polyvinyl chloride, polyethylene terephthalate, or the like. In a state where the foil-pressed film is superimposed so that the adhesive surface is in contact with the substrate,
The metal plate on which the design is formed is pressed into contact, and the metal foil is transferred onto the printing material under heating. However, with a metal plate that has been widely used conventionally, it is very difficult to create an arbitrary design, and a complicated process is required to create the plate. In recent years, there has been an increasing demand for foil printing of a large number of types of characters and designs in a small number of copies, but the metal plate has not met such demand. [0003] In order to solve such problems, it is known to use a photosensitive resin plate having a high hardness (Japanese Patent Laid-Open No. 2-1852). Since this photosensitive resin plate has high hardness, it is necessary to apply pressure evenly, setting is difficult,
If the setting is wrong, the printing pressure may not be applied uniformly to the foil and the printing may not be able to be partially transferred.
There were problems such as limited choice of foil. [0004] The inventors of the present invention have conducted intensive studies to solve the problems of the conventional photosensitive resin plate for foil pressing, and as a result, the photosensitive resin layer was formed into a multilayer structure. The inventors have found that the above problems can be solved by sequentially changing the hardness after photocuring from the uppermost layer to the lowermost layer, and have completed the present invention. [0005] That is, an object of the present invention is to provide a foil-pressing photosensitive resin plate which has good foil breakage, excellent printing durability, and excellent printing accuracy. SUMMARY OF THE INVENTION The present invention, which achieves the above object, is directed to a photosensitive resin plate for foil stamping in which a support and a photosensitive resin layer are laminated via an adhesive layer. Has a multilayer structure, and the hardness of each layer after photo-curing is higher in order than the layer bonded to the support. [0007] The photosensitive resin plate for foil stamping of the present invention is a photosensitive resin plate in which a support and a photosensitive resin layer are laminated via an adhesive layer, and the photosensitive resin layer after photo-curing. This is a photosensitive resin plate having a two-layer structure having different hardnesses, and in which the hardness of each photosensitive resin layer after curing increases in order from the layer on the support side. The thickness of the entire photosensitive resin layer is 300 μm or more.
It is selected in the range of 3000 μm, preferably 600 to 1500 μm. If the thickness of the photosensitive resin layer is less than 300 μm, the non-printed portion of the printing plate may come into contact with the foil, and the foil of the non-printed portion may be transferred during printing. On the other hand, if the thickness of the photosensitive resin layer exceeds 3000 μm, the thermal conductivity decreases, and heat cannot be sufficiently transmitted to the relief surface of the photosensitive resin plate, and the printing speed decreases. The photosensitive resin of the present invention having the above two-layer structure
The hardness of the upper photosensitive resin layer after curing is Shore D.
Hardness is 70 or more, and lower layer hardness is 40-8 in Shore D hardness.
0 and the upper layer is Shore D harder than the lower layer
At least 10 higher in degrees . If the hardness of the upper layer is less than 70 in Shore D hardness, the reproducibility of the printed foil and the foil breakage are poor. Further, since the hardness of the lower layer is at least 10 lower than the hardness of the upper layer , even when the upper layer has high hardness, the pressure at the time of foil pressing can be made uniform, there is no printing unevenness, and it is easy to select a printing machine and foil. The change in hardness can be achieved by changing the amount of a photopolymerizable monomer and the amount thereof or the amount of a plasticizer such as polyglycerin in each photosensitive resin composition forming the photosensitive resin layer. For example, the compounding amount of the photopolymerizable monomer is 1 part by weight of the photopolymerizable monomer in the upper layer , and the compounding amount of the photopolymerizable monomer in the lower layer is 0.1 to 0.8 part by weight. , Preferably 0.2
When it is set to 0.7 parts by weight, a suitable hardness balance can be obtained. When the hardness of the lower layer is less than 40, the printing durability is difficult. When the hardness is more than 80, printing unevenness occurs. When the number of the photosensitive resin layers is two, the thickness of the upper photosensitive resin layer may be 30 to 80%, preferably 40 to 60% of the total thickness of the photosensitive resin layer. . If the thickness of the upper layer is less than 30% of the total thickness of the photosensitive resin layer, the reproducibility of the printed foil and the cutting of the foil are poor, and if it exceeds 80%, the printing durability is not improved and printing unevenness occurs. But not preferred. As the photosensitive resin composition for forming the photosensitive resin layer, a composition mainly composed of a polymer binder, a photopolymerizable monomer and a photopolymerization initiator is selected. Examples of the polymer binder include partially saponified polyvinyl acetate resins and derivatives thereof, copolymers of acrylic acid esters and maleic acid, alkyd resins, polyethylene oxide, water-soluble or alcohol-soluble polyamide resins, and ethylene-vinyl acetate copolymers. Polymer, polystyrene resin, phenol resin, polyester resin, epoxy resin, polyvinyl butyral resin, etc., partially or completely saponified vinyl alcohol and (meth) acrylic acid, (meth) acrylamide, N-methylol (meth) acrylamide, styrene, propylene ,
Maleic anhydride, (meth) acrylonitrile, (meth)
A copolymer containing an acrylic acid ester as a monomer, or a product obtained by reacting the copolymer with a lower alkylol (meth) acrylamide such as methylol (meth) acrylamide or ethylol (meth) acrylamide to form an ether; , N′-bis (aminomethyl) -piperazine, diamines such as N, N′-bis (β-aminoethyl) -piperazine, N, N′-bis (carboxymethyl) -piperazine, N, N′-bis Dicarboxylic acids such as (carboxymethyl) -methylpiperazine and their lower alkyl esters or acid halides;
Examples thereof include a water-soluble polyamide obtained by polymerizing an ω-amino acid such as (aminoethyl) -N ′-(carboxymethyl) -piperazine as a monomer, and a polyamide resin having a sulfonate group or a base component. Especially partially saponified polyvinyl acetate resin and its derivatives, alkyd resin,
Epoxy resins and phenolic resins are suitable because of their high thermal conductivity. The polymer binder is blended in an amount of 20 to 85% by weight, preferably 30 to 60% by weight, based on 100 parts by weight of the photosensitive resin layer. If the compounding amount is less than 20% by weight, the coatability at the time of forming the photosensitive resin layer is poor, and tackiness appears and hinders exposure, which is not preferable. If it exceeds 85% by weight, heat resistance may be poor. Not appropriate. The photopolymerizable monomer includes (meth) acrylic acid, (meth) acrylic acid ester, (meth) acrylamide, (meth) acrylonitrile, styrene, and the like having at least one photopolymerizable alkenyl group. Glycidyl (meth) acrylate, allyl (meth) acrylate, vinyl ether compounds, and vinyl ester compounds can be used. Specifically, acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate , Propyl methacrylate, butyl acrylate, butyl methacrylate, hydroxymethyl acrylate, hydroxymethyl methacrylate, 2-
Hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, triacryl formal, glycerol acrylate, glycerol methacrylate, glycerol triacrylate,
Glycerol trimethacrylate, ethylene glycol monoacrylate, ethylene glycol monomethacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate,
Triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, trimethylolpropane tri Acrylate, trimethylolpropane trimethacrylate, tetramethylolpropane diacrylate, tetramethylolpropane dimethacrylate, tetramethylolpropane triacrylate, tetramethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythri Lumpur triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol penta methacrylate,
Dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, 1,6-hexanediol diacrylate, benzyl acrylate, benzyl methacrylate, acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, etc., alkylol derivatives of urea or thiourea, alkylation An alkylol derivative is polycondensed with N-alkylol acrylamide or N-alkylol methacrylamide in the presence of an acid or an ammonium salt, or is reacted with urea, thiourea and formaldehyde to form a linear condensate. A polymer was formed and then grafted with N-alkylol acrylamide or N-alkylol methacrylamide in the presence of an acid or ammonium salt. Or a product obtained by reacting urea, thiourea or an alkyl derivative thereof with N-alkylolacrylamide or N-alkylolmethacrylamide in water or a hydrophilic organic solvent in the presence of an acid or alkali catalyst. Can be mentioned. This photopolymerizable monomer is based on 100 parts by weight of the polymer binder.
It can be blended in the range of 10 to 200 parts by weight. When the amount is less than 10 parts by weight, the sensitivity is low, the exposure time is long, and the mechanical strength and water resistance of the obtained printing plate are insufficient because the crosslinking density is low. Since the surface of the photosensitive resin layer thus obtained becomes sticky, the adhesion to the negative film is deteriorated, and the reproducibility of a pattern obtained after exposure and development may be reduced. Further, conventionally known photopolymerization initiators can be applied. Specifically, benzophenone, 4,
4'-bis (dimethylamino) benzophenone, 3,3
Benzophenone derivatives such as -dimethyl-4-methoxy-benzophenone; anthraquinone derivatives such as anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone and tert-butylanthraquinone; benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether and benzoin propyl ether; Alkyl ether derivative, acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-hydroxy-2-methylpropiophenone, 4′-isopropyl-2-hydroxy-
2-methylpropiophenone, 2-methyl-1- [4-
Acetophenone derivatives such as (methylthio) phenyl] -2-morpholino-1-propanone, thioxanthone derivatives such as 2-chlorothioxanthone, diethylthioxanthone, isopropylthioxanthone and diisopropylthioxanthone, Michler's ketone, benzyl,
2,4,6- (trihalomethyl) triazine, 2- (o
-Chlorophenyl) -4,5-diphenylimidazolyl dimer, 9-phenylacridine, 1,7-bis (9-
(Acridinyl) heptane, 1,5-bis (9-acridinyl) pentane, 1,3-bis (9-acridinyl) propane, trimethylbenzoyldiphenylphosphine oxide, tribromomethylphenylsulfone, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butan-1-one and the like, but are not limited thereto. At least one of the photopolymerization initiator in 100 parts by weight of the photopolymerizable monomer,
It can be blended in the range of 0.1 to 20 parts by weight. When the amount is less than 0.1 part by weight, the sensitivity is low and the exposure time is long. When the amount exceeds 20 parts by weight, it is uneconomical. The photosensitive resin composition for forming the photosensitive resin layer of the present invention contains, in addition to the above-mentioned polymer binder, photopolymerizable monomer and photopolymerization initiator, if necessary, heat resistance, Fillers that impart thermal conductivity, stabilizers such as methylhydroquinone, defoamers, polymerization inhibitors, and the like can be added. As the filler, silica, mica, talc, diatomaceous earth,
Clay, bentonite, carbon black, calcium carbonate, titanium oxide, barium sulfate, magnesium oxide,
Examples include powders of iron oxide, alumina, fluorite, copper, silicon, iron, and the like. In the method for producing the photosensitive resin plate of the present invention, it is preferable that the photosensitive resin composition comprising the above components is dissolved in a solvent and applied on the adhesive layer formed in advance. And the solvent is water, methanol, ethanol, propanol, isopropanol, butanol, t
alcohol solvents such as tert-butyl alcohol and N-hexanol; ether solvents such as ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, diethylene glycol monoethyl ether and dipropylene glycol monomethyl ether; and acetate solvents thereof. , Methyl acetate, ethyl acetate, butyl acetate,
Examples thereof include ester solvents such as tert-butyl acetate and ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone. In addition, a petroleum-based solvent can be used as a diluent for the purpose of adjusting the viscosity. Examples of such a petroleum-based solvent include swazole (manufactured by Maruzen Petrochemical Co., Ltd.) and Solvesso (manufactured by Tonen Petrochemical Co., Ltd.). For the coating, for example, a bar coater, a curtain flow coater, a roll coater, a reverse coater, or the like is used. After the application of the photosensitive resin layer, the photosensitive resin plate is dried by warm air, infrared rays or the like to obtain a photosensitive resin plate. As the support of the photosensitive resin plate of the present invention, a material known in the related art such as metal and plastic can be used, but a metal plate is preferably used because of its high thermal conductivity. . Specifically, copper, aluminum, zinc, nickel, lead, tin, iron, brass, bronze, bronze, and the like are preferable, but not limited thereto. In order to increase the adhesion of the support to the adhesive layer, it is preferable to previously perform physical and chemical roughening treatment on the adhesive layer side of the support to increase the specific surface area. The adhesive layer for bonding the support and the photosensitive resin layer is formed of an adhesive containing an epoxy resin, and has a high heat resistance.
And also has a high thermal conductivity. The curing agents for these adhesives include diethylenetriamine, triethylenetetramine, butanediol bisaminopropyl ether,
Amine-based curing agents such as N, N-diethylaminopropylamine, metaphenylenediamine, methylenedianiline, diaminophenylmethane, and 4,4'-diaminodiphenylsulfone are preferably used. Further, in addition to the above components, various conventionally known dyes, pigments and ultraviolet absorbers can be added as antihalation agents. The adhesive may be one or two in consideration of the adhesiveness between the photosensitive resin layer and the support.
More than species are selected. When two or more types are selected, they are sequentially laminated and used. The adhesive layer is formed on the support by
It is formed with a thickness in the range of ５０50 μm. When the photosensitive resin plate of the present invention is stored or used, the photosensitive resin layer is prevented from being damaged or its performance being reduced by oxygen desensitization upon exposure. Alternatively, a protective film may be provided by pressing. As the protective film, for example, polyamides, polyesters, polyolefins, polyvinyl chlorides and the like are used, and a polyethylene terephthalate resin film is particularly preferable. Protective film layer is 10-50
A thickness of about 0 μm is good. If the surface in contact with the photosensitive resin layer of the protective film layer is subjected to alkali treatment, sand blast treatment, coating treatment, etc. to form a mat,
When the protective film layer is peeled off and exposed, it is advantageous because fine irregularities are formed on the surface of the photosensitive resin layer so that the protective film layer can be uniformly adhered to the pattern mask. Further, an anti-adhesion agent can be provided on the contact surface between the protective film layer and the photosensitive resin layer. By providing this anti-adhesion layer, when the protective film is peeled off at the time of exposure, it is possible to improve the releasability and improve the adhesion to the pattern mask. This anti-adhesion layer is made of polyvinyl alcohol, polyvinyl butyral, polyamide, polymethyl methacrylate, polystyrene, a copolymer of styrene and an acrylic monomer, ethyl cellulose, cellulose acetate butyrate, and the like.
These are added between the photosensitive resin layer and the protective film layer by 0.1%.
It can be provided with a thickness of ３０30 μm. This makes it possible to directly adhere to the pattern mask even when the adhesiveness of the photosensitive resin layer is strong. Next, the method of using the photosensitive resin plate for foil stamping of the present invention will be described below. First, the photosensitive resin layer is irradiated with active energy rays using a chemical lamp, ultra-high pressure mercury lamp, etc., through a negative mask in which the parts other than letters and designs are shaded in advance, and developed with an organic solvent, alkaline aqueous solution, etc. To form a foil-pressing photosensitive resin plate. The amount of exposure at this time varies somewhat depending on the components of the photosensitive resin layer, but can be usually performed in the range of 100 to 3,000 mJ / cm ² . If the exposure amount is less than 100 mJ / cm ² , photocuring cannot be performed sufficiently and development cannot be performed.
On the other hand, if it exceeds 3,000 mJ / cm ² , it is not preferable because it hardens to an unexposed portion due to halation. The obtained photosensitive resin plate is attached so that the heating plate of the foil stamping press and the support are in contact with each other, and the photosensitive resin plate is heated in such a manner that the surface temperature of the photosensitive resin plate becomes about 100 to 180 ° C. The foil film is pressed with a pressure of 15 kg / cm ² , and the foil film corresponding to the convex portion of the photosensitive resin layer is adhered to the printing material. Then, the heating plate and the photosensitive resin plate are separated from the printing material, and the transfer printing is performed. Done. Next, the present invention will be described based on specific examples, but the present invention is not limited to these examples. EXAMPLES Preparation of Photosensitive Resin Composition A The following components were mixed to obtain photosensitive resin composition A. Partially saponified polyvinyl alcohol (PVA) resin (Saponification degree 80%, polymerization degree 500) 100 parts by weight Condensation product of dimethylol urea dimethyl ether and N-methylol acrylamide 150 parts by weight Glycerol triacrylate 60 parts by weight Triacryl formal 10 parts by weight Dimethoxyphenylacetophenone 3 parts by weight Methylhydroquinone 0.1 part by weight Methanol 75 parts by weight Water 200 parts by weight Preparation of photosensitive resin composition B The following components were mixed to obtain photosensitive resin composition B. Partially saponified PVA resin (Saponification degree 80%, polymerization degree 500) 100 parts by weight Condensate of dimethylol urea dimethyl ether and N-methylol acrylamide 100 parts by weight Glycerol triacrylate 50 parts by weight Triacryl formal 10 parts by weight Dimethoxyphenyl acetophenone 2 0.5 parts by weight Methylhydroquinone 0.1 parts by weight Methanol 50 parts by weight Water 150 parts by weight Preparation of photosensitive resin composition C The following components were mixed to obtain photosensitive resin composition C. Partially saponified PVA resin (Saponification degree 80%, polymerization degree 500) 100 parts by weight Condensate of dimethylol urea diethyl ether and N-methylol methacrylamide 80 parts by weight Triacryl formal 8 parts by weight Dimethoxyphenyl acetophenone 2 parts by weight Methylhydroquinone 0.05 parts by weight Methanol 50 parts by weight Water 150 parts by weight Preparation of photosensitive resin composition D The following components were mixed to obtain a photosensitive resin composition D. Partially saponified PVA resin (Saponification degree 80%, polymerization degree 500) 100 parts by weight Condensate of dimethylol urea diethyl ether and N-methylol methacrylamide 60 parts by weight Dimethoxyphenyl acetophenone 2 parts by weight Methylhydroquinone 0.05 parts by weight Methanol 50 parts by weight Water 150 parts by weight Preparation of photosensitive resin composition E The following components were mixed to obtain a photosensitive resin composition E. Partially saponified PVA resin (Saponification degree 80%, polymerization degree 500) 100 parts by weight Condensation product of dimethylol urea diethyl ether and N-methylol methacrylamide 60 parts by weight Glycerol trimethacrylate 10 parts by weight Dimethoxyphenyl acetophenone 2 parts by weight Methylhydroquinone 0.05 parts by weight Methanol 50 parts by weight Water 150 parts by weight Preparation of photosensitive resin composition F The following components were mixed to obtain photosensitive resin composition F. Partially saponified PVA resin (80% saponification degree, 500 polymerization degree) 100 parts by weight Condensate of dimethylol urea diethyl ether and N-methylol acrylamide 60 parts by weight Polyethylene glycol diacrylate 10 parts by weight Polyglycerin 35 parts by weight Dimethoxyphenyl acetophenone 2 parts by weight Methylhydroquinone 0.05 parts by weight Methanol 50 parts by weight Water 150 parts by weight A portion of each of the above A to F photosensitive resin compositions was taken and exposed to light. The resin hardness was measured. Table 1 shows the results. [Table 1] Example 1, Reference Examples 2 , 3 and Comparative Examples 1-4 Each of the above photosensitive resin compositions was previously coated with an epoxy adhesive ("Epicoat" manufactured by Yuka Shell Epoxy Co., Ltd., amine based) Thickness 0.3 coated with curing agent)
A photosensitive resin plate was prepared by applying the composition on an aluminum plate having a thickness of 1,500 μm and drying at 70 ° C. for 1 hour. Table 2 below shows the photosensitive resin compositions used and their thicknesses. Thereafter, 700 mJ / cm ² ultraviolet rays were irradiated through a mask pattern, developed with hot water at 45 ° C. for 2 minutes using a spray-type washer, dried, and then post-exposed at 1 J / cm ² . This printing plate is printed on a foil-pressing press (Iwasaki Seisakusho 33040T)
Mold) and use a stamping foil (Murata Gold Leaf MF type) to set the heating plate of the foil-pressing press to 16
Heated to 5 ° C. and printed on 0.5 mm thick cardboard. Table 3 below shows the cutting of foil, the printed state of the printed matter, and the number of printable sheets (printed up to 15,000 sheets) when using each photosensitive resin plate.
Shown in [Table 2] Note) The values in parentheses indicate the thickness (μm) of the photosensitive resin layer. [Table 3] As can be seen from Table 3 above, the printing using the photosensitive resin plate for foil stamping of the present invention showed good foil breakage, and the condition was good even when 15,000 or more sheets were printed. Examples 2 to 5 and Comparative Examples 5 to 6 Next, using the photosensitive resin compositions B and E, an epoxy adhesive ("Epicoat" manufactured by Yuka Shell Epoxy Co., Ltd.) was previously formed to a film thickness of 10 μm. ) Applied thickness 0.3
The resulting resin was applied on an aluminum plate having a thickness of 2 mm so that the dry thickness of each of B and E was as shown in Table 4 below, and dried at 70 ° C. for 1 hour to prepare a photosensitive resin plate. Table 2 shows the photosensitive resin compositions used and their thicknesses. Thereafter, 700 mJ / cm ² ultraviolet rays were irradiated through a mask pattern, developed with hot water at 45 ° C. for 2 minutes using a spray-type washer, dried, and then post-exposed at 1 J / cm ² . This printing plate is used as a foil-pressing press (Iwasaki Seisakusho Co., Ltd. 3
3040T type), and a heating plate of a printing press for foil stamping was heated to 165 ° C. using a stamping foil (MF type manufactured by Murata Gold Leaf Co., Ltd.) to perform printing on a 0.5 mm thick cardboard. Foil break when using each photosensitive resin plate,
The printing state is also shown in Table 4 below. In the table, as for the printing stains, the foil was transferred according to the relief pattern. C: Foil was transferred to portions other than the relief of almost all printed matter. Was evaluated. [Table 4] As is apparent from Table 4 above, when the photosensitive resin plate for foil pressing of the present invention is used for printing, the transfer of the foil is favorably performed. According to the present invention, since the photosensitive resin layer has a multilayer structure, the uppermost layer has a high hardness and the lower layer has a low hardness, the pressure can be easily set at the time of printing, and the foil is cut and the printing durability is improved. Excellent in nature,
It is a photosensitive resin plate for foil stamping that can print a printed material having a good printing surface.

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Toshiya Takagi 150 Nakamaruko, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Tokyo Ohka Kogyo Co., Ltd. (56) References JP-A-62-124559 (JP, A) JP-A-54- 92402 (JP, A) JP-A-2-1852 (JP, A) JP-A-58-174945 (JP, A) JP-A-59-102228 (JP, A) JP-A-61-213844 (JP, A) JP-A 2-113740 (JP, U) JP-A 2-112469 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G03F 7/00 502 B41M 5/00 101 G03F 7 / 095

Claims (1)

(57) In the Claims 1. A support and the photosensitive resin layer and the foil photosensitive resin plate for laminated through an adhesive layer, a photosensitive resin layer comprises two layers, light The hardness of the upper layer after curing is 70 or more in Shore D hardness, the hardness of the lower layer after light curing is selected in the range of 40 to 80 in Shore D hardness, and the hardness of the upper layer is at least 10 in Shore D hardness than the hardness of the lower layer. A photosensitive resin plate for foil stamping, wherein the adhesive layer is high and the adhesive layer is formed of an adhesive containing an epoxy resin.