JP3417511B2 - Electronic component soldering method and solder jet device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering electronic parts and a solder jet apparatus using a solder jet technique,
In particular, the present invention relates to a soldering method and a solder jet apparatus, which are suitable for electronic components with leads and which enable uniform, rapid and economical soldering of electronic components to an electric circuit board.

[0002]

2. Description of the Related Art Conventionally, as a method of soldering an electronic component with a lead, a jet soldering method using a solder jet device has been mainly adopted from the viewpoint of its reliability and simplicity.

This solder jet device generally comprises a solder bath, a solder supply device, a solder outlet, a mount for mounting an electric circuit board, and the like. The solder heated and melted in the solder bath is supplied from the solder supply device. It is a device that supplies solder to a solder outlet and then sprays molten solder onto an electronic component from the solder outlet to solder the electronic component.

By the way, in order to prevent a short circuit or the like, a space between electronic components is narrowed due to a high density accompanied by a lighter, thinner, shorter and smaller electronic component such as an IC chip in recent years.
Uniform and precise soldering is required. In addition, rapid soldering is also required to reduce the cost of electrical products and improve productivity.

[0005]

[0006]

[0007]

[Problems to be Solved by the Invention]
In the technique of attaching, there is a problem that when the soldering work is repeated, the solder or the flux used for the solder is directly scattered or partially gasified and scattered around. Therefore, the conventional soldering method is economical
Which is disadvantageous to the environment, or solder or flux scattered around
The soldering device, etc.
To maintain a constant environment, you must spend time and labor to clean it.
Not only if it reduces the speed and economy of soldering
There was such a problem.

The present invention has been made in view of the conventional problems, and a soldering method capable of uniformly and quickly and economically soldering an electronic component with leads to an electric circuit board, and An object is to provide a solder jet device.

[0009]

A solder jet apparatus of the present invention.
Is a solder bath, solder supply device, solder outlet, and electrical
A solder jet apparatus including a pedestal for mounting a circuit board,
The pedestal has the tip of the solder outlet protruding upward.
And the tip of the solder outlet
Lead is integrated with the pedestal so as to cover the outside or the outer periphery of the edge.
Directly protruding and ejected from the tip of the solder outlet
Solder diffusion prevention that blocks molten solder from scattering outside
Positioning hand for positioning the stop wall and the electric circuit board
And a step. Furthermore, the electric circuit board
A cover is provided to cover the plate from the surroundings. this
By doing so, the scattering of solder and flux around the
Preventive measures to improve economic effects and save time and labor for cleaning.
You can

Further, the solder jet device according to the present invention has a structure provided with a suction device for sucking gas in the cover. By doing this, the flux gas can be effectively
By recovering, the working environment of the soldering work was improved.
You can do good.

In the solder jet device according to the present invention, a suction force adjusting opening communicating with the atmosphere is provided between a part of the cover or between the cover and the suction device, and the size of the suction force adjusting opening is increased. The degree of suction in the cover by the suction device is adjusted by adjusting the height.
By doing this, it is easy to adjust the degree of suction inside the cover.
You can

Further, the solder jet apparatus according to the present invention has a structure in which a cylinder for opening and closing the cover is provided. This will allow you to set and solder the electrical circuit board.
It is possible to easily take out after scraping.

Further, the solder jet apparatus according to the present invention has a structure in which a pressing means for mechanically fixing an electric component mounted on the electric circuit board is provided in a part of the cover. In this way, during the soldering by the pressing means
There is no misalignment of electronic components and electric circuit boards,
More precise soldering with less short circuit
You can

In the solder jet apparatus according to the present invention, the pressing means can be detached from the cover. This way, different types of electrical
It is possible to quickly respond to the road substrate.

Further, the solder jet apparatus according to the present invention is configured to move the cover in the vertical direction. this
If this is done, the pressing means will be installed at a predetermined position on the electric circuit board.
Efficiently and evenly presses the electronic components placed in the table
You can

Further, in the solder jet apparatus according to the present invention, the cover is transparent or semitransparent. This
By doing so, the soldering status can be visually checked.

Further , the present invention is a method for soldering an electronic component.
Is also effective as the invention of the electronic component of the present invention.
The soldering method is the solder jet apparatus according to any one of claims 1 to 9.
A method of soldering an electronic component using a
A cover is provided to cover the circuit board, and a suction device is installed inside the cover.
Blow molten solder from the solder outlet while using
This is a method of attaching and soldering. in this way
Then, by effectively collecting the flux gas,
Can improve the working environment of soldering work.
It

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below. (Electronic Component) The electronic component applicable to the present invention is not particularly limited in type, but it is difficult to adapt by a surface mounting soldering method such as reflow using infrared rays.
1 is preferred. The leaded electronic component 11 is
It is necessary to insert the lead into the board and electrically and mechanically fix it to the electric circuit board 9. According to the soldering method of the present invention, the solder is sufficiently soldered to the through hole of the electric circuit board 9. This is because it can invade between the leads and expect such an effect.

(Solder Jet Device) The solder jet device 1 according to the embodiment of the present invention preferably includes the following configuration.

Solder tank The solder tank 12 is for storing the molten solder 13 for soldering with a stable viscosity, and is composed of a heat resistant container, a heater, a thermostat, a solder outlet conduit, and the like. Although it depends on the type of solder used,
In the case of ordinary solder, it is preferable to control the temperature to 200 to 260 ° C., and in the case of low melting point solder, it is preferable to control the temperature to about 180 to 200 ° C.

Solder Supply Device The solder supply device serves as a power source for stably supplying the molten solder 13 for soldering to the solder outlet 2 and spraying the solder onto a predetermined soldering portion. Specifically, the impeller 14 placed in the solder bath and the root wheel 14
It is composed of a motor for rotating the.

Here, it is preferable that the motor is capable of adjusting the liquid level height of the molten solder 13 in the solder blow-out port 2 through the impeller 14 by changing the rotation speed of the motor. is there.

The method of changing the number of rotations of the motor is not limited, but for example, one motor has a plurality of variable resistors,
It is preferable to adjust the rotation speed of the motor by switching this variable resistance with a switch. In this way, depending on the rotation speed of the motor, the molten solder 13
If the liquid level of the solder bath 12 can be adjusted, a constant liquid level can be secured at the solder outlet 2 regardless of the liquid level of the solder bath 12, and the electrical circuit board 9
The distance to can be short and constant.

Therefore, even if the liquid level of the solder bath 12 is lowered, the molten solder 13 can always exist at a fixed position in the solder outlet 2, and the molten solder 13 is immediately transferred to the electric circuit board. It is preferable in that it can be sprayed toward 9. Further, since the moving distance of the molten solder 11 is short, the flow becomes smooth, strong local blowout does not occur, and it is also preferable in that it is possible to perform soldering precisely and in a small amount. In addition, for the same reason, when soldering electronic components having different lead lengths, it is possible to rapidly and precisely spray a fixed amount of the molten solder 13 at a stable speed.

Solder blow-out port The solder blow-out port 2 refers to a portion at which the molten solder 13 is directly blown onto the electric circuit board 9, and it is preferable that the solder blow-out port 2 be wide open upward. By doing so, it is possible to deal with the large-area electric circuit board 9 and a plurality of soldering points.
That is, the connecting portion of the solder outlet 2 that is connected to the solder bath 12 usually corresponds to the size of the impeller 14 and is 10 to 10.
It has a cylindrical shape of 50 mmφ, and the opening of the solder outlet 2 is determined according to the size of the electric circuit board 9.
For example, a square type having a side length of 100 to 500 mm is suitable.

Further, a wax-like one having a taper and a wide opening toward the electric circuit board 9 is also preferable so that the solder can be sprayed more smoothly.

Further, it is preferable that the solder blow-out port 2 has a plurality of openings corresponding to the soldering points, from which the solder can be sprayed in a concentrated and precise manner. . The solder outlet 2 is located in the center of the upper surface.
Is connected to the gantry 3 by a connecting member.

The frame 3 on which the frame electric circuit board 9 is placed is the solder outlet 2
The plurality of openings 15 are arranged in the upper part. By doing so, it becomes possible to quickly spray the molten solder 13 ejected from the solder ejection port 2 to a predetermined position determined in advance. The tip of the solder outlet 2 is
It is attached so as to project upward from the opening 9. In addition, the opening 15 also functions as a solder escape port for allowing the excess solder ejected from the solder outlet 2 to fall under its own weight and flow back to the solder bath 12.

In the vicinity of the edge of the opening 15 of the gantry 3, specifically, within 1.0 mm from the edge, more preferably, 0.
It is preferable that the solder diffusion preventing wall 7 is provided vertically within 5 mm. By doing so, the electronic component 11 or the lead of the electronic component 11 or the like is inserted in a substantially vertical direction between the opening 15 and the solder diffusion preventing wall 7,
The molten solder 13 can be sprayed from the solder outlet 2 to solder the electronic component 11 to the electric circuit board 9.

Here, the opening 15 needs to have a size such that at least the electronic component 11 or the lead of the electronic component 11 can be inserted and passed. Specifically, the size, shape, arrangement of the electronic component 11, Although it is determined in consideration of the number and the like, the size is preferably 1.1 to 50.0 times the size of one electronic component 11 to be inserted or the lead of the electronic component 11. When the size of the opening 15 is less than 1.1 times,
It becomes difficult to insert the electronic component 11 quickly, while 50.
This is because if it exceeds 0 times, a short circuit between the electronic components 11 is likely to occur and soldering to unnecessary portions increases. Therefore, in consideration of such balance, the range is more preferably 1.5 to 20.0 times.

The shape and number of the openings 15 are not particularly limited and may be determined according to the application. The shape may be rectangular or circular, and the shape of the openings 15 is not limited. By providing a plurality of electronic components 11, the electronic components 11 can be simultaneously soldered to a plurality of predetermined locations.

Next, the solder diffusion preventing wall 7 provided on the frame 3 near the edge of the opening 15 will be described. this
The solder diffusion prevention wall 7 is the solder blowout protruding from the mount 3.
So as to cover the outside or the outer periphery of the tip (spout) of the outlet 2.
It is a wall protruding from the gantry 3 and is sprayed from the solder outlet 2.
Solder does not scatter to the outside of the solder diffusion prevention wall 7.
Is blocked. The wall 7 is not particularly limited in height, shape, material, etc. as long as it can effectively prevent the lateral diffusion of the solder 13 among the plurality of electronic components 11.

The height of the wall 7 means the distance from the position where the electric circuit board 9 abuts to the plane of the frame 3 on which the electric circuit board 9 is placed. It is preferable that the thickness is in the range of 0.1 to 30 mm. If the height of the wall 7 is less than 0.1 mm, it becomes difficult to dispose another electronic component 11 between the walls, or the solder 13
This is because the prevention of the lateral diffusion of the solder may be insufficient. On the other hand, if the height exceeds 30 mm, the force for uniformly supporting the electric circuit board 9 decreases, and conversely the solder 13 diffuses in the lateral direction. Insufficient prevention, wall 7 and electric circuit board 9
Is easily damaged or difficult to create. Therefore, in consideration of such a balance, the wall 7
Height is 1.0 to 20 mm, optimally 5.0 to 1
The range is 5.0 mm.

Further, the thickness of the wall 7 is also determined in consideration of the lateral diffusion preventing property of the solder 13, but specifically, the range of 0.05 to 5.0 mm is preferable. When the thickness of the wall 7 is less than 0.05 mm, the mechanical strength of the wall 7 is weakened, the wall 7 itself may be damaged by repeated use, and the lateral diffusion of the solder 13 may be insufficiently prevented. Or by supporting it non-uniformly, the electric circuit board 9
On the other hand, if the thickness of the wall 7 exceeds 5.0 mm, the electronic components 11 with a narrow gap are formed.
It is difficult to adapt in the meantime. Therefore, in consideration of such a balance, the thickness of the wall 7 is more preferably 0.1 to 3.0 mm, and most preferably 0.5 to 2.0 m.
The range is m.

Further, explaining the shape of the wall 7,
When soldering at multiple points, in order to minimize the effect on other soldering points or already soldered points, put a lid between the walls to form a tunnel or rectangular shape. A space is provided to prevent the diffusion of solder and heat to other soldering points, or when there is an electronic component 11 such as a soldered IC chip, a structure that covers the electronic component 11 is preferable. .

In consideration of the diffusion preventive property of the solder 13,
It is also preferable to provide a flat portion having an L-shaped or T-shaped cross section at the tip portion of the wall 7, that is, at the portion in contact with the electric circuit board 9. With such a structure, the solder 11 is in close contact with the electric circuit board 2, the lateral diffusion preventing property of the solder 11 is further improved, and the electric circuit board 9 is not likely to be damaged due to uneven support. Is.

Further, the material of the solder diffusion preventing wall 7 will be described. At least a portion of the wall 7 that contacts the electric circuit board 9 is made of polytetrafluoroethylene (PTF).
E), fluorine-based resins such as polytrifluoroethylene and polyvinylidene fluoride (PVDF), silicone-based resins such as polyorganosiloxane, acrylic-silicone-based resins, epoxy-silicone-based resins, phenol-based resins, epoxy-based resins It is preferable to use a resin having solder heat resistance, such as a polyether resin or the like, or a composite reinforcing material of these and glass fiber or carbon fiber.

By using these resins in the tip portion of the wall 7, that is, in the portion that comes into contact with the electric circuit board 9, the resin partially elastically deforms and comes into close contact with the electric circuit board 9, and the solder 1
This is because the lateral diffusion preventing property of No. 3 becomes better, and there is no fear of damaging the electric circuit board 9. For the portion other than the tip portion, it is preferable to use stainless steel, a steel plate, an iron plate or the like in consideration of mechanical strength, workability, lightness and the like.

The solder diffusion preventing wall 7 may be integrated with the pedestal 3 or may be separated from the pedestal 3. Therefore, in the case of an integral type, the thick wall pedestal prototype may be formed by cutting or the like. On the other hand, in the case of the separation type, it is also preferable that the plate-shaped mount is provided with a concave portion and the wall member is provided with a convex portion, and these are fitted together.

Next, the electric circuit board 9 provided on the gantry 3
The electric circuit board guide 10 which is the positioning means will be described. That is, depending on the size of the electric circuit board 9, the electric circuit board guide 10 such as a protrusion, a wall, a pillar, or a depression is formed.
Is preferably provided around the pedestal 3 around which the electric circuit board 9 is mounted. Such a positioning means exerts a guide function, so that the electric circuit board 9 can be accurately and quickly placed on the pedestal 3, and the positional deviation is small.
More precise soldering is possible .

The cover 5 empties the electric circuit board 9 from the surroundings.
It has a structure that covers the space.

Another reason for providing the cover 5 is to effectively prevent the solder 13 and flux from scattering around.
This is to improve the economic effect and save the trouble of cleaning.
The flux contains flux gas, and by preventing the flux gas from scattering, the working environment of the soldering work can be improved.

The shape of the cover 5 is not particularly limited as long as it can be a constant internal pressure lower than the atmospheric pressure when the electric circuit board 9 is spatially covered from the surroundings and sucked. For example, the cover 5 preferably has a substantially rectangular parallelepiped shape. In this case, the electric circuit board 9 is generally a substantially rectangular parallelepiped, and a shape corresponding to it is preferable in order to eliminate a wasteful space. Moreover, if the electric circuit board 9 is a substantially rectangular parallelepiped, it can easily contact the pedestal 3. This makes it possible to control the internal pressure more effectively.

The cover 5 is provided at the rear end 16 of the upper surface of the solder jet apparatus 1 and has a rod tip connected to the front upper part of the cover 5 (rotating cylinder) 4.
The cylinder 5 is not connected by the cover 5
Open and close (rotate) diagonally to the back with the back end of the
With such a configuration, the cylinder 4 can be operated and the cover 5 can be greatly opened and closed so that the electric circuit board 9 can be easily set and taken out after soldering.

Furthermore, when setting or taking out the electric circuit board 4, the cover 5 is temporarily lifted in the vertical direction by a cylinder (not shown), and then the cylinder 4 is moved.
Therefore, it is advisable to open and close (rotate) in a diagonal direction to the back side. By doing so, the space can be effectively used, so that it is not necessary to provide the cover 5 so much, and solder or the like attached to the cover 5 can be used. Can be effectively shaken off in the vertical direction to improve the economic efficiency, or prevent the adhered solder from re-adhering to the electric circuit board to cause a short circuit or the like. Another advantage is that it is easy to secure the field of view of the transparent cover 5.

Next, the material of the cover 5 will be described. Since it comes into contact with the hot air from the molten solder 13 and a certain level of heat resistance and flux resistance is required, specifically, acrylic, transparent vinyl chloride, polystyrene is used. , Polycarbonate, PEEK, polyester, ionomer, ABS
It is preferable to use a resin or the like.

In addition, to visually check the soldering status,
The cover 5 is preferably made of transparent or translucent resin. Specifically, it is preferable to use a resin having a light transmittance of 50% or more, more preferably 70% or more, and optimally 90% or more.

Holding means Also, in this embodiment, the electronic component 11 to be soldered
Alternatively, it is preferable to provide a holding means 6 for mechanically fixing the electronic component 11 and the electric circuit board 9 which have already been soldered so that the electronic component 11 does not move or float. The positional deviation between the electronic component 11 and the electric circuit board 9 is eliminated, and more precise soldering with less short circuit can be performed.

The pressing means 6 is not particularly limited as long as it can press the electronic component 11 uniformly, but a mechanism using an elastic member can be preferably used. For example, a shaft, a spring into which the shaft is inserted, and a holed retainer plate in which the shaft tip is inserted into a hole may be a mechanism in which the retainer plate is movable in the axial direction. Even if solder or the like adheres, the pressing pressure hardly changes, and it is suitable in terms of high durability. Further, the pressing means using an elastic member such as silicon or urethane foam can press the electronic component 11 more uniformly.

Further, it is preferable that the pressing means 6 is provided on a part of the cover 5 described above, particularly on the upper surface thereof. With this configuration, the cover 5 spatially covers the electric circuit board 9 from the surroundings, and the pressing means 6 efficiently and uniformly presses the electronic component 11 placed at a predetermined position on the electric circuit board 9. be able to.

However, the pressing means 6 may be integrated with the cover 5, but since it can quickly cope with different types of electric circuit boards 9, it is detachably separated from the cover 5. Also, for example, the cover 5
It is advisable to provide a fitting portion or the like so that unevenness or a groove is provided on the upper part of the so as to fit them mechanically.

Suction Device In the present embodiment, it is preferable to solder while sucking the inside of the cover 5 by using a suction device (not shown). In this case, the electronic component 1 is sucked by the suction force of the suction device.
The molten solder 13 sprayed toward 1 can be uniformly and quickly infiltrated into the gap between the through hole of the electric circuit board 9 and the lead of the electronic component 11. Further, by effectively collecting the flux gas, the working environment of the soldering work can be further improved. Therefore, the electric component 11 can be soldered to the electric circuit board 9 electrically and mechanically.

Here, the suction device is not particularly limited, but it is preferable to use an exhaust fan or a vacuum pump. Although the suction device may be directly installed on the cover 5, a suction port 8 is provided on a part of the cover 5 so as not to interfere with the opening and closing of the cover 5, and a suction conduit (not shown).
It may be sucked via the like.

The suction force of the suction device is also not particularly limited, but it must be carefully determined so that the molten solder 13 is not sucked up onto the electric circuit board 9. That is, if the solder is sucked too much, the molten solder 13 will be absorbed into the through hole of the electric circuit board 9 and the electronic component 11.
This is because it may reach the surface of the substrate 9 or the like through the gap between the lead and the like and cause a short circuit or the like .

Therefore, while preventing the molten solder 13 from being sucked up as described above, the electric circuit board 9 and the electronic component 11 can be reliably connected.
In order to infiltrate the solder 13 into the gap between the lead and
It is preferable to actually solder the electric circuit board 9 and the electronic component 11 and determine the suction force by trial and error. Therefore, the cover 5 described above is preferably transparent or translucent so that the soldering condition can be visually checked. Is.

In order to adjust the suction force, a means for adjusting the pressure inside the cover 5, for example, a part of the cover 5 or a suction force adjusting opening (not shown) is provided between the cover 5 and the suction device. ) Is provided and the size of the suction force adjusting opening is adjusted by a diaphragm mechanism, a baffle plate, or the like, thereby adjusting the degree of suction in the cover 5 by the suction device.

Further, as a measure of the suction force, a pressure gauge is attached to the cover 5 for monitoring, and the pressure inside the cover is
700 to 760 (excluding 760 mmHg) mm
It is preferable to control so that it will be Hg. 700
If it is less than mmHg, the suction force is too high, while 760mm
When the pressure is Hg or more, that is, when the atmospheric pressure is reached, the suction force may be too low and the penetration of the solder into the gap between the through hole of the electric circuit board 9 and the lead of the electronic component 11 may be delayed.

[Electronic Component Soldering Method] Next, an embodiment of an electronic component soldering method will be described. First, solder 1 is placed in a solder bath 12 made of a heat resistant container.
3 is heated and melted, and the temperature is controlled to 200 to 250 ° C. and stored.

Next, in order to change the number of rotations, a motor having two or more variable resistors is set to about 8 which is a middle rotation.
00r. p. driven by m, and impeller 14 via belt
To rotate. By doing so, the molten solder 13 stops at a liquid level height that is higher than the solder liquid level in the solder bath 12 and does not reach the surface of the solder outlet 2 that contacts the pedestal 3. This state is called an operation preparation state, and gravity and the pushing force by the impeller 14 are in balance, and the molten solder 1
While being convected by its own weight, 3 is held in place without being cooled and solidified.

Next, the frame 3 suitable for the predetermined electric circuit board 9 is placed above the solder outlet 2. In addition, stand 3
Is provided with a positioning means so as to be compatible with the member of the solder blowing port 2, and the pedestal 3 can be arranged accurately and quickly. The pedestal 3 is provided with an electric board guide 10 as a positioning means for a predetermined electric circuit board around the electric circuit board 9 to be mounted, and slides laterally or as it is from above. Can be placed.

Further, the pedestal 3 is partially provided with an opening 15, and a solder diffusion preventing wall 7 is provided in the vertical direction along the edge of the opening 15. The height of the solder diffusion preventing wall 7 is 10 mm, the thickness is 1.0 mm, and the material is PT.
FE, which is the electric circuit board 9 and the electronic component 1 to be used
A fitting part is provided so that the fitting part can be changed according to the type, and can be detached from the gantry 3.

Further, a part of the cover 5 above the electric circuit board 9 is provided with a mechanism composed of a shaft, a spring member and a perforated pressing plate as the component holding means 6, and the spring member around the shaft is provided. , The electronic components 9 and the like are uniformly pressed through the perforated presser plate which can be moved along the circumference of the shaft. Further, the holding means 6 is detachably attached to the cover 5. Then, the predetermined electric circuit board 9 is placed on the gantry 3. At this time, the pedestal 3 is fitted in the step groove of the electric circuit board guide 10 which is a positioning means of the electric circuit board 9 and is fixed at a predetermined position.

Next, when the switch of the motor is switched, first, the cylinder 4 is actuated, and the cover 5 descends diagonally by the cylinder 4 and becomes horizontal, and then the cylinder 5 (not shown) is further inserted. And vertically descends to spatially cover the electric circuit board 9 from the surroundings. Then, the high speed rotation is about 1400 r.p.m. p. When it is set to m, the operation is changed from the operation preparation state to the operation state, and the suction device interlocks with the suction device to suck the inside of the cover 5 through the suction port 8 and the suction conduit provided in a part of the cover 5. Done.

At the same time, the impeller 14 driven by the motor via the belt is rotated at a high speed, the molten solder 13 is blown out from the solder blowing port 2, is inserted into the electric circuit board 9, and is prevented from diffusing the pedestal opening 15 and the solder. The lead of the electronic component 11 protruding between the wall 7 and the wall 7 is uniformly, quickly and economically soldered. The molten solder 13 that did not adhere is
As it is, it is returned to the solder bath 12 through the space between the solder escape port 2 and the opening 15, is completely melted again, and is reused for soldering.

[0065]

According to the method of soldering an electronic component and the solder jet apparatus according to the present invention, an electronic component with a lead or the like is semi-finished.
When attaching the pad, solder and flux may spatter unnecessarily.
It also reduces the number of electronic components placed in the narrow corners.
There is no risk of damage, and other surface mounting etc.
It is possible to solder without adversely affecting the electronic components
became.

Also, it seems that the cover is used,
The temperature distribution becomes uniform, the preheating time of the electric circuit board circuit can be shortened, and the solder failure due to the temperature unevenness of the electric circuit board is extremely reduced, so that more reliable soldering is possible.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view of a solder jet device using the method of the present invention.

[Explanation of symbols]

1 Solder jet device 2 Solder outlet 3 mounts 4 cylinders 5 cover 6 holding means 7 Solder diffusion prevention wall 8 suction port 9 Electric circuit board 10 Electric circuit board guide 11 electronic components 12 Solder bath 13 Molten solder 14 impeller 15 openings 16 Backside edge

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Claims (10)

(57) [Claims] 1. A solder bath, a solder supply device, and a solder outlet.
And solder jet apparatus including a pedestal for mounting an electric circuit board
A is, the cradle, the tip of the solder outlet is upwardly projecting
And the tip of the solder outlet
Lead is integrated with the pedestal so as to cover the outside or the outer periphery of the edge.
Directly protruding and ejected from the tip of the solder outlet
Solder diffusion prevention that blocks molten solder from scattering outside
Positioning hand for positioning the stop wall and the electric circuit board
A solder jet apparatus comprising a step. 2. A cover for covering the electric circuit board from the surroundings.
The solder jet equipment according to claim 1, wherein
Place 3. The solder jet apparatus according to claim 2, further comprising a suction device for sucking gas in the cover. 4. A suction force adjusting opening communicating with the atmosphere is provided between a part of the cover or between the cover and the suction device,
4. The solder jet apparatus according to claim 3 , wherein the degree of suction in the cover by the suction device is adjusted by adjusting the size of the suction force adjusting opening. 5. The solder jet apparatus according to claim 2 , further comprising a cylinder for opening and closing the cover. 6. The solder according to claim 2 , wherein a holding means for mechanically fixing an electric component mounted on the electric circuit board is provided on a part of the cover. Jet device. 7. The solder jet apparatus according to claim 6 , wherein the pressing means is removable from the cover. 8. The solder jet apparatus according to claim 6, wherein the cover is moved in a vertical direction. 9. The solder jet apparatus according to claim 2 , wherein the cover is transparent or semi-transparent. 10. A solder jet device according to any one of claims 1 to 9.
A method of soldering an electronic component using a soldering method, comprising providing a cover for covering the electric circuit board, and sucking the inside of the cover.
Melting from the solder outlet while sucking with a pulling device
Electricity characterized by spraying solder to perform soldering
Soldering method for child parts.