JP3417705B2 - Semiconductor mounting apparatus and semiconductor mounting method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor mounting device and a semiconductor mounting device in which a semiconductor element or the like is bonded and formed on a wiring board.
It relates to the wearing method .

[0002]

2. Description of the Related Art Generally, a semiconductor mounting device for joining a semiconductor element and the like to a wiring board is equipped with a height adjusting mechanism, a rotation adjusting mechanism and a pressure adjusting mechanism.

An example of a conventional semiconductor mounting device will be described below with reference to FIG.

In FIG. 5, 1 is a rotation direction AC servo motor for positioning in the rotation direction, 2 is a height direction AC servo motor for adjusting the height direction, and 3 is the height direction A.
A ball screw 4 for converting the rotational torque transmitted by the C servo motor 2 to a straight traveling direction and for positioning in the vertical direction, 4 is a nut attached to the ball screw 3, and 5 is a nut.
Is a harmonic speed reducer for reducing the rotation transmitted from the AC servo motor 1 in the rotation direction without backlash, 6
Is a pressurizing cylinder for controlling the load, 7 is a suction collet for sucking and holding a semiconductor element (not shown) to be mounted, and 8 is a wiring board on which the semiconductor element is mounted.

Next, the operation of the conventional device will be described.

The suction collet 7 that has sucked the semiconductor element is
After the position is corrected on the wiring board 8, a semiconductor element or the like is placed on the wiring board 8. At this time, first, the rotation direction AC servomotor 1 positions the suction collet 7 in the rotation direction. At that time, the harmonic speed reducer 5 increases the resolution. After that, height direction AC
By driving with the servo motor 2, the ball screw 3
The suction collet 7 is moved up and down through. When the semiconductor element is brought into contact with the wiring board 8 at a high speed during the ascending / descending operation, an impact is applied.
The semiconductor element is mounted on the wiring board 8 by performing step acceleration / deceleration. Then, the pressure cylinder 6 is used to apply a force to the semiconductor element and the like.

[0007]

In such a conventional semiconductor mounting device, the unit itself becomes large because the drive system for the vertical movement and the pressurization operation are individually provided, and since the ball screw or the like is used, dust is generated. Problems are likely to occur.

Further, there is a problem that it is not possible to judge whether or not the semiconductor element hits the wiring board, and the quality of the protruding electrode is remarkably deteriorated.

An object of the present invention is to solve the above problems, and enables simplification and weight of the structure, yet highly accurate position control, a semiconductor mounting device and which can load control
It is to provide a semiconductor mounting method .

[0010]

In order to achieve the above-mentioned object, according to the present invention, a holding member for holding a semiconductor element is moved by height adjustment and rotation adjustment with respect to a wiring board to move the semiconductor element to the wiring board. in the semiconductor mounting device to be installed on any surface of, the holding member, vertically movable and rotatably supported
A supported shaft body is provided, and the rotation motor and the linear motor are attached to the shaft body.
And the linear motor together with the shaft body.
To move down and to allow the shaft to rotate in the circumferential direction
A magnet provided on the shaft and an electromagnetic field facing the magnet.
It is composed of a coil and moves the magnet up and down by magnetic force.
The height of the holding member with respect to the wiring board
Direction adjustment and through the semiconductor element
The load on the wiring board is adjusted, and the rotary motor
The positioning of the holding member in the rotating direction is performed .

Further, in the semiconductor mounting method for mounting the semiconductor element on an arbitrary surface of the wiring board, the holding member for holding the semiconductor element is moved by height adjustment and rotation adjustment with respect to the wiring board, and the holding member is held. a member, a vertically movable and rotatable supported shaft provided, a magnet provided so as to allow rotation in the circumferential direction of the shaft member to the shaft member, magnet
Opposed to constitute a linear motor and a solenoid coil, prior to
The magnets in serial linear motor, Rukoto is vertically moved together with the shaft body by the magnetic force between the electromagnetic coil
The holding member with respect to the wiring board.
Adjusted performs, the have line load adjustment to the distribution <br/> line substrate through a semiconductor element, a further shaft member to said shaft member
A rotary motor that rotates in the circumferential direction is provided
By rotating the shaft body,
The kick rotational adjustment, characterized in row Ukoto.

[0012]

[0013]

[0014]

[0015]

[0016]

A semiconductor mounting device having the above-mentioned structure according to the present invention and
In the semiconductor mounting method , a linear motor is provided in a holding member for mounting a semiconductor element on a protruding electrode on an arbitrary wiring board to perform position control in the height direction, and whether the semiconductor element hits the wiring board or not. Detects and controls the load.

[0017]

As described above, the linear motor is used to perform the vertical height operation and the pressurizing operation of the holding member by one mechanism, thereby simplifying the structure. Further, by eliminating the need for a ball screw and the like, dust such as grease is suppressed and the cleanliness is improved in terms of quality and becomes stable.

[0019]

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing the external appearance of an embodiment of a semiconductor mounting apparatus according to the present invention. 10 is a table for moving a mounted wiring board 11 in one direction (Y direction), and 12 is a semiconductor. The suction collet that suction-holds the element 13, 14 is provided so as to extend from the suction collet 12, and a pressure shaft that constitutes a holding member together with the suction collet 12, 15 is the above-mentioned pressure in the center as described later. A linear motor through which the shaft 14 is inserted, 16 is a rotary motor that is connected to the pressure shaft 14 for positioning in the rotational direction, and 17 is the rotary motor 16
Harmonic speed reducer section for appropriately decelerating the rotation transmitted from, 18, is provided in the lower portion of the linear motor 15,
A height sensor for detecting the height (mounting position) of the suction collet 12 with respect to the wiring board 11 at the time of mounting from the moving amount of the pressure shaft 14, 19 is provided above the rotary motor 16, and It is an origin detection sensor for detecting the upper limit position (origin position) of the suction collet 12 from the movement amount of the pressure shaft 14.

FIG. 2 is a schematic diagram showing the relationship between the pressure shaft and the linear motor. The pressure shaft 14 is
The linear motor 15 configured by the electromagnetic coil 20 and the magnet 21 penetrates through the center of the electromagnetic coil 20 and the electromagnetic coil 20
A magnet 21 facing the inside is held via a bearing 22 so as to be rotatable in the circumferential direction, and is movable in the vertical direction together with the magnet 21. The electromagnetic coil 20
Is fixed to the device main body 23, while the magnet 21 is made movable to facilitate coil wiring.

Further, the pressure shaft 14 includes a linear motor 15
The part protruding from the upper and side surfaces of the bearing 26,
It is held by convex receiving cylinders 24 and 25 supported by 27. The pressure shaft 14 and the receiving cylinders 24 and 25 have a ball spline structure so that the pressure shaft 14 can move up and down, and the pressure shaft 14 and the receiving cylinders 24 and 25 rotate in the circumferential direction. It is possible. The rotation of the pressure shaft 14 in the circumferential direction is performed by rotating the upper receiving cylinder 24 by the rotary motor 16 via the harmonic speed reducer unit 17.

In FIGS. 1 and 2, first, the wiring board 11 is placed and fixed on the shaft table 10. Then, suction collet 12
The semiconductor element 13 held by is exposed to the wiring board 11 and aligned. At this time, the rotary motor 16 inputs the rotation to the input side of the harmonic speed reducer unit 17 to perform alignment in the rotation direction. After this alignment, the linear motor 15 is driven and the magnet 21 is moved by the electromagnetic force between the electromagnetic coil 20 and the magnet 21 to lower the pressure shaft 14. At this time, the height sensor 18 is used to decelerate to a low speed immediately before the semiconductor element 13 contacts the wiring board 11, and the semiconductor element 13 is grounded to the wiring board 11 in the low speed state. The contact detection of whether or not it is grounded detects that the torque (current) command value of the linear motor 15 rises, and then enters the pressurization state. Pressurization by the pressurizing shaft 14 applies a current of the linear motor 15 proportional to the pressurizing value for a certain period of time. When the pressurizing state is completed, the pressurizing shaft 14 is raised and positioned to the origin position.

Next, the vertical movement of the linear motor will be described with reference to FIGS.

FIG. 3 is a control block diagram of the linear motor. 30 is a position control unit for inputting a position command and a position, 31 is a speed control unit for inputting a speed command and a speed, and 32 is a current command and a current. Input current control unit, 33 is a power amplifier that amplifies the current signal, 34 is a current detection unit that detects the current of the linear motor 15, and 35 is an induction voltage that detects the induced voltage generated in the linear motor 15 via the sensor 35a. A voltage detector, 36 is a speed detector that detects the speed of the linear motor 15, and 37 is a position detector that detects the position of the linear motor 15. The position detector 36 and the position detector 37 detect the position and speed. The signal is fed back to the position control unit 30 and the speed control unit 31 by obtaining information from the two sensors of the height sensor 18 and the origin detection sensor 19 and the induced voltage detection unit 35 of the linear motor 15.

The transition of the detecting operation from the origin detecting sensor 19 to the height sensor 18 will be described with reference to FIG. The detection step is a first step of accelerating from a certain position in the origin detection sensor 19, and then a second step of exiting the detection range of the origin detection sensor 19 and detecting the induced voltage of the linear motor 15 to perform control. Process and then height sensor 18
And the third step of decelerating and stopping for positioning at any position.

In the first step, the position and speed are detected by the origin detection sensor 19 and are fed back to the control units 30 and 31 for control. In the second step, the two sensors 18, 19 are
Since the signal of 1 cannot be used, the linear motor 15 is controlled by detecting the speed from the induced voltage of the linear motor 15. In the third step, since the height sensor 18 is within the detection range, the height sensor 18 detects and controls the position and speed.
Further, at this time, the pressure shaft 14 is positioned at a position to be stopped within the detection range of the height sensor 18.

As described above, the information of the two sensors 18 and 19 and the linear motor 15 are determined by the position of the pressure shaft 14.
The linear motor 15 is controlled while switching the induced voltage information. The same operation is performed when the pressure shaft 14 is raised by the linear motor 15.

[0030]

As described above, according to the semiconductor mounting apparatus and the semiconductor mounting method of the present invention, at the time of mounting, the position control and the pressure control in the height direction with respect to the wiring board are performed by using one linear motor. Therefore, the configuration can be simplified, the weight can be reduced, and the cost can be reduced, and high-speed mounting can be achieved. Moreover, holding that holds the semiconductor element
The magnet of the linear motor is installed on the shaft of the member,
By enabling movement and rotation, it is possible to support and drive the holding member.
The configuration for the
The wiring process on the file side is also simplified.

[0031]

[0032]

[0033]

[0034]

[0035]

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of an embodiment of a semiconductor mounting device of the present invention.

FIG. 2 is a schematic configuration diagram showing the relationship between the pressure shaft and the linear motor of FIG.

FIG. 3 is a control block diagram of a linear motor in one embodiment of the present invention.

FIG. 4 is an operation explanatory diagram of the linear motor according to the embodiment of the present invention.

FIG. 5 is a perspective view of a conventional semiconductor mounting device.

[Explanation of symbols]

10 ... table, 11 ... wiring board, 12 ... adsorption collet,
13 ... Semiconductor element, 14 ... Pressure shaft, 15 ... Linear motor, 16 ... Rotation motor, 17 ... Harmonic reducer section, 18 ... Height (mounting position) sensor, 19 ... Origin detection sensor, 20 ... Electromagnetic coil, 21 … Magnets, 22, 26, 27… Bearings, 24, 25… Receiving cylinders, 30… Position controller, 31
… Speed controller, 32… Current controller, 33… Power amplifier, 34… Current detector, 35… Induced voltage detector, 36…
Speed detector, 37 ... Position detector.

─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP 62-55947 (JP, A) JP 7-15183 (JP, A) JP 6-137968 (JP, A) JP 63- 232496 (JP, A) JP 60-66500 (JP, A) JP 5-82998 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (2)

(57) [Claims] 1. A holding member for holding a semiconductor element is provided with wiring.
Adjust the height and rotation with respect to the substrate to move the semiconductor element.
For semiconductor mounting equipment in which the child is installed on any surface of the wiring board
In advance, For the holding memberSupported vertically and rotatably
A shaft is provided, and a rotary motor and a linear motor are installed on the shaft.
Ke Move the linear motor up and down together with the shaft,
In order to allow the shaft to rotate in the circumferential direction,
From the magnet provided and the electromagnetic coil facing the magnet
Compose and move the magnet up and down by magnetic force, and hold it
Position adjustment of the member in the height direction with respect to the wiring board
And the wiring board via the semiconductor element
The load on the motor and hold it with the rotary motor.
Positioning the member in the direction of rotation Characterized by
Semiconductor mounting equipment. 2. A semiconductor mounting method for mounting a semiconductor element on an arbitrary surface of a wiring board by moving a holding member for holding a semiconductor element with respect to a wiring board while adjusting height and rotation of the holding member. a holding member, a vertically movable and rotatable supported shaft provided, a magnet provided so as to allow rotation in the circumferential direction of the shaft member to the shaft member, the electromagnetic co facing the magnet
Constitute a linear motor and a yl, in the linear motor
The magnet in the magnetic force between the magnet and the electromagnetic coil
The Rukoto moved vertically together with the shaft member, the holding
Performs height adjustment relative to the wiring board in member, the have line load adjustment to the wiring board via the semiconductor element, further rotation of the shaft body in the circumferential direction to said shaft body
A rotation motor is provided, and the shaft is rotated by the rotation motor.
A semiconductor mounting method, wherein rotation of the holding member is adjusted by rotating the holding member .