JP3420464B2 - Method for manufacturing multilayer substrate and apparatus for manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer substrate and a manufacturing apparatus therefor.

[0002]

2. Description of the Related Art In order to increase the density of small electronic circuits, a multi-layer substrate formed by laminating a plurality of printed boards is adopted.
The multi-layer substrate is formed by laminating a plurality of substrates each having a circuit pattern printed on both sides, and integrally adhering each substrate with an adhesive layer (prepreg) interposed between the substrates. Circuits on each board are connected to each other through through holes, but accurate alignment is essential for connecting these circuits. As an example of means for such alignment, it is possible to prevent the displacement of each pattern by forming two to four or more holes in the facing surface of each substrate and inserting a pin into these holes. Has been done.

[0003]

As described above, when a hole is formed in each board to align a plurality of printed boards to be laminated and a pin is positioned in the hole, the positions of all holes are This method is limited in accuracy because it is not always accurate. Further, even if it is technically possible to perform highly accurate drilling, there is a problem that an increase in production cost cannot be avoided in order to realize this. Further, when the pin is inserted into the hole provided in each substrate, this work is troublesome, which causes an increase in manufacturing cost.

[0004]

In order to solve the above-mentioned problems, the present invention takes an image of a positioning mark provided on each of a pair of substrates by an imaging means, and processes the image of the taken mark. By doing so, the relative positional deviation between the two substrates is obtained, the positional deviation between the two substrates is corrected, and the temporary fixing is performed in a state of being accurately aligned. The temporary fixing is performed by using the temporary fixing means in a state in which the positional displacement of the pair of substrates is corrected, but the temporary fixing is performed on the opposing surfaces of both substrates at the non-intervening position of the adhesive layer or the position where the adhesive layer is cut off in advance. formed in advance respectively, the metal thin film layer portions
Metals The metal thin film layer portions to each other by providing a transverse ultrasonic vibration to the metal thin film layer portion while being bonded to
It is to be welded . Then, after the temporary fixing, the main fixing is performed to obtain a multilayer substrate.

A manufacturing apparatus for realizing the above-described method for manufacturing a multilayer substrate includes a pair of substrate holding means, a pair of imaging means, and a moving means for relatively moving the pair of substrates. the fixing means adopts an ultrasonic metal welder, it on the opposing surface of the substrate by the ultrasonic metal welder
The preformed metal thin film layers were joined together.
In this state, ultrasonic transverse vibration is applied to the metal thin film layer to
The genus thin layer portions performing each other metals welding.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION A method of manufacturing a multilayer substrate according to the present invention comprises a step of holding a pair of substrates having marks formed on both ends thereof in a facing state with an uncured adhesive layer interposed therebetween. A step of capturing an image of the marks respectively provided at one end of the pair of substrates by the first image capturing means, and an image of each of the marks respectively disposed at the other ends of the pair of substrates by the second image capturing means; A step of obtaining the position of each mark by image processing, a step of obtaining a relative positional deviation of the pair of substrates based on the image processing, and a step of correcting the positional deviation by relatively moving the pair of substrates, The step of temporarily fixing the pair of substrates includes the step of temporarily fixing the pair of substrates in a state where the positional deviation is corrected and the step of permanently fixing the pair of substrates in the state of temporary fixing. In the corrected state,
In non-intervening position or adhesive layer previously cut to Aru position of the adhesive layer, the metal thin film layer on the opposite surface of the substrate pair in a state of being bonded to the metal thin film layer portions formed in advance, respectively
By applying ultrasonic transverse vibration to the metal parts,
It is obtained so as to metals welded.

In the stacking of a pair of substrates, the above-mentioned adhesive layer is provided on one of the pair of substrates, and the other substrate is held in a non-contact state with a certain distance from the adhesive layer. Every
It is preferable to relatively move the pair of substrates and then stack the other substrate on the adhesive layer.

Further, when there is a difference between the distance between the marks on one of the pair of substrates and the distance between the marks on the other substrate, the halved value of the difference is regarded as one end. It is preferable that the pair of substrates be distributed to the other end and the pair of substrates be relatively moved so that the distance between the mark on one substrate and the mark on the other substrate at both ends becomes equal.

The mark provided on one of the pair of substrates is a white mark, and the mark provided on the other substrate has a smaller diameter than the white mark. It is preferable that both marks be imaged with the other mark positioned at.

Further, at least one of the pair of substrates may be a multi-layered substrate composed of a plurality of layers or a plurality of temporarily fixed substrates.

Further, a jig plate having a plurality of holes whose distances are known in advance is arranged so as to overlap with one of the pair of substrates. The image pickup means picks up an image of one of the holes of the jig plate at the time of picking up an image of the mark located at one end, and the second image pickup means
When the image of the mark located at the other end is imaged, another one of the holes of the jig plate is imaged, and the center positions of both holes in the image areas of both imaging means are obtained by image processing, Based on the center position in each image area of each hole, and the distance between the imaged hole portions that is known in advance, calculate the distance between both imaging means, based on the distance between both imaging means, It is effective to include a step of obtaining a relative movement amount for correcting the positional deviation of the pair of substrates.

An apparatus for manufacturing a multilayer substrate for realizing the above-described manufacturing method includes a first holding means for holding one substrate of a pair of substrates and another substrate of the pair of substrates. Second holding means for holding so as to face one of the substrates, and first imaging means capable of simultaneously imaging the marks respectively provided on the pair of substrates at one end of the pair of substrates, The second image pickup means capable of simultaneously picking up the marks provided on the pair of substrates at the other end of the pair of substrates, and the relative position of the pair of substrates obtained based on the position of each mark. In order to correct such positional deviation, a pair of moving means for relatively moving the pair of substrates, and a pair of non-intervening positions of the adhesive layer or positions where the adhesive layer has been cut off in advance with the positional deviation corrected. metal which has been previously formed respectively on the opposing surfaces of the substrate In a state of being bonded to film layer portions
The metal thin film layer portion giving transverse ultrasonic vibration to the metal thin film layer portion
A temporary fixing unit that metallic welded to each other to each other, is made Karakara the present anchoring means for welded together by a substrate a pair of heat-pressed pressurized adhesive layer in the temporary fixing state.

The moving means is an XY table means for moving one of the pair of substrates in the longitudinal direction and the width direction, and an XY table means arranged in parallel with the XY table means for moving one of the substrates in the width direction. It is preferable that

Further, it is preferable that both the holding means are provided so that they can approach and separate from each other .

Further, a jig plate is disposed on one of both holding means, and a plurality of holes for confirming the position of the image pickup means are provided on the jig plate, and the distance between these holes is It is known in advance that at least one of the holes can be imaged by the first imaging means at the same time as the mark located at one end of the substrate, and at least one of the other holes is ,
It is effective that the image can be picked up by the second image pickup means at the same time as the mark located at the other end of the substrate.

[0016]

EXAMPLES First, the multilayer substrate P will be described. The simplest structure of a multi-layer substrate is one in which two substrates P1 and P2 having circuit patterns formed on both sides thereof are fixed to each other with an adhesive layer B interposed therebetween (see FIGS. 1 and 2). reference). Alignment marks ml, m2, nl, and n2 are previously attached to both ends of each substrate. In addition, three printed circuit boards are laminated on the multilayer board (6
There are ones having four layers) and four sheets (8 layers). Usually, a copper plate is attached to the upper and lower sides of these substrates via an adhesive layer (insulating property), and the copper plate is patterned by etching or the like. That is, in the end, 6 layers of 2 laminated substrates and 8 layers of 3 laminated substrates
A substrate of 4 layers will have a pattern of 10 layers.

The substrates P1 and P2 constituting the multi-layer substrate are made of epoxy resin plates with circuit patterns formed on both sides. The adhesive layer B is made of a semi-cured resin sheet (prepreg sheet), and is adapted to be cured by heating so that both substrates can be fixed to each other.

As shown in FIGS. 10 and 11, each substrate P1,
Metal thin film layer portions k1 and k2 made of a copper plating layer are formed at four corners of the facing surface of P2. Further, the portion k3 of the adhesive layer B facing the metal thin film layer portions k1 and k2 is cut out in advance, whereby the metal thin film layer portions k1 and k2 of both substrates can directly face each other. The thickness of the adhesive layer B is 50
Since the thickness is about μm to 0.2 mm, the opposing surfaces of both substrates can be brought into contact with each other by pressing the metal thin film layer portions k1 and k2 of the substrate.

Next, an apparatus for manufacturing a multilayer substrate according to the present invention will be described. As shown in FIGS. 1 and 2, a moving means for moving the substrate P is provided on the fixed table 1. The moving means is composed of two left and right parts, one of which is the XY table means 2 which is provided at the left end of the upper surface of the fixed table 1 and which is capable of moving the substrate P in the longitudinal direction and the width direction. . The other one is an XY table means 3 which is provided on the right side of the upper surface of the fixed table 1 and on which the substrate P is movable in the width direction.

XY table means 2 which is the first moving means
Is provided with a Y table 4 and an XY table 5 placed on the upper surface of the fixed table 1. The Y table 4 is in the Y direction (perpendicular to the paper surface) via the first Y-axis guides 7 and 7 fitted to the first Y-axis rails 6 and 6 provided so as to extend in the vertical direction to the paper surface. It is provided so that it can be moved.
On the upper surface of the Y table 4, the X-axis rails 8 and
8 (only the front rail is shown) is provided. The XY table 5 is mounted on this X-axis rail via X-axis guides 9, 9. The Y table 4 is movable in the Y direction (width direction of the substrate) by a driving unit (not shown), and the XY table 5 is movable in the X direction (longitudinal direction of the substrate) by a driving unit (not shown). As a result, the XY table 5 can be arbitrarily moved in the XY directions by driving the driving means.

At the center of the XY table 5, there is provided a lower table support portion 5a formed in a cylindrical shape so as to protrude from the upper surface. An imaging hole 5b that penetrates vertically is provided at the center of the lower table support 5a. A ball bearing 10 is fitted on the outer peripheral portion of the lower table support portion 5a, and the lower table 11 supported via the ball bearing 10 can be swung in a horizontal plane. The lower table support portion 5a supports the lower table 11 via the ball bearing 10 so as to be movable in the longitudinal direction and the width direction.

XY table means 3 which is the second moving means
Is provided at the right end of the upper surface of the fixed table 1 and supports the right end of the lower table 11 so as to be movable in the Y direction (width direction of the substrate). The XY table means 3 is mounted on the fixed table 1 on the second Y-axis rails 12, 12 provided in the direction perpendicular to the plane of the drawing via the second Y-axis guides 13, 13.
The Y table 14 is provided so as to be movable in any direction. The Y table 14 can be moved in the width direction (direction perpendicular to the paper surface) by a driving unit (not shown). Cylindrical protrusion 14a formed in the center of the upper surface of the Y table 14
A connecting member 15 is fitted to the ball bearing 10 via a ball bearing 10. Further, on the upper surface of the connecting member 15, the second X
The shaft guide 15a is integrally provided. The second X-axis guide 15a is fitted with the second X-axis rail 16 provided on the lower surface of the lower table 11, and the lower table 11 is relatively opposed to the Y table 14 in the X direction (longitudinal direction). Can be moved. Therefore, the left end of the lower table 11 is the first
Can be moved in the longitudinal direction and the width direction by the XY table means 2 which is the moving means of the second moving means , and the right end is the second moving means .
The XY table means 3 is movable in the width direction, and the second X-axis guide 15a and the second X-axis rail 16 allow the movement in the longitudinal direction by the first moving means. In addition, Y of the first and second moving means 2 and 3
The swinging of the lower table 11 in the horizontal plane due to the difference in the amount of movement in the direction can be smoothly handled by the ball bearings 10 and 10, respectively.

On the lower table (first holding means) 11,
Adsorption means (not shown in the drawing) for adsorbing and fixing the lower substrate P1 placed on the upper surface thereof is incorporated. Further, above the lower table 11, there is provided a second holding means 17 for sucking and holding the upper substrate P2 to be stacked on the multilayer substrate P or the lower substrate P1. Second holding means 1
Reference numeral 7 has a suction portion communicating with the vacuum generating device on the lower surface of the chuck portion 17a, and is provided so as to be able to approach and separate from the suction means integrated with the lower table 11.

XY table means 2 which is the first moving means
A first X-ray generator 18 constituting the first image pickup means C1 is provided above. Below the XY table 5, an X-ray camera 19 for picking up transmitted light of X-rays emitted from the first X-ray generator 18 is provided. The X-rays emitted from the first X-ray generator 18 are the substrates P1 and P.
2 through the hole 5b provided in the XY table 5 to reach the first X-ray camera 19, and the positioning marks m1 and n1 provided in the substrate can be imaged (see FIG. 2). .

A second image pickup means C2 is provided on the right side of the first image pickup means C1. The second X-ray generation device 20 and the second X-ray camera 21 which constitute the second imaging means C2.
Are provided so as to be integrally movable by moving means (not shown).

As shown in FIG. 2, above the lower table 11, there are provided ultrasonic metal welding machines 22, 22 which are a plurality of temporary fixing means for pressing and fixing the substrates to each other (only two are shown in the figure. ). The ultrasonic metal welder 22 applies ultrasonic transverse vibration to the metal thin film layer portions of the pair of substrates P1 and P2 to be laminated. The ultrasonic metal welding machine 22 has a main body 22a.
Is provided so that the horn 22b extends horizontally from
The main body is mounted so that it can rotate horizontally at a certain angle and can move up and down. A vibrating tip 22c is attached to the tip of the horn 22b. Four vibrating tips 22c are provided around the tip of the horn 22b at equal intervals of 90 °, and by rotating the horn 22b by 90 ° in the circumferential direction, it is possible to use it while replacing it in case of wear. . Each outer peripheral surface of the vibrating tip 22c is knurled to increase the frictional resistance at the time of contact.

In each ultrasonic metal welding machine 22, the vibrating tip 22c is rotated by the rotation of the main body 22a only at the time of temporary fixing.
Is located above the position where the substrates P1 and P2 are to be welded, and the vibrating chip 22c is attached to the upper surface of the substrate P2 by the lifting and lowering operation of the main body 22a.

Next, a method of manufacturing the multi-layer substrate will be described with reference to the flow chart shown in FIG. 3,
When the activation switch is turned on (S1), first, the second holding means 17 sucks and holds the lower substrate P1 and places it on the upper surface of the lower table 11 to set it (S2). At this time,
The image of the mark ml is picked up by the first image pickup means C1 to find its center, and the center and the center of the ball bearing 10 are made to substantially coincide with each other. The lower substrate P1 placed on the lower table 11 is sucked and fixed at a predetermined position on the lower table by the suction means provided on the lower table (S3).

Next, an adhesive layer B is formed (prepreg set) on the upper surface of the lower substrate P1 by prepreg supply means (not shown) (S4).

Next, from the upper substrate storage (not shown) to the second
Holding means (substrate suction head) 17 for holding the upper substrate P2
Is adsorbed, taken out, moved to a predetermined position, and held in a non-contact state with the adhesive layer B at a constant interval (S5). FIG. 1 shows a state in which the lower substrate P1 and the upper substrate P2 are held by holding means at regular intervals.

As described above, the positioning mark ml attached to the left end of the lower substrate P1 is set so as to be within the image pickup range of the first image pickup means C1, and similarly, the positioning mark attached to the left end of the upper substrate P2. The mark nl is also set so as to be within the imaging range.

Next, the first imaging means C1 images the left end marks m1 and nl of the upper and lower substrates, and the second imaging means C
The marks m2 and n2 at the right end of the upper and lower substrates are imaged by 2 (see FIG. 4). The image pickup of the mark by the image pickup means C1 and C2 is performed by irradiating the mark position of each substrate with X-rays from the X-ray generators 18 and 20, and taking X-ray images of each mark by the X-ray cameras 19 and 21. (See FIG. 2).

In order to facilitate image processing, each mark m, n is a ring-shaped mark obtained by whitening the mark m on the lower substrate P1, and the mark n on the upper substrate P2 is a white mark of this ring-shaped mark. A small black circle mark that can be stored in the removed part is used (see Fig. 4). Each of these marks m, n
Is image-processed (S6), and the lower table 11 is moved and adjusted so that the mark n of the upper substrate P2 is placed in the white portion of the ring-shaped mark m of the lower substrate P1.

FIG. 4 shows dot marks n on the upper substrate P2 in white marks ml and m2 on the lower substrate P1.
It shows a state in which l and n2 are respectively included. Here, the centers A1 and A2 of the white marks and the centers B1 and B2 of the dot marks match each other, so that the upper and lower substrates are completely aligned. However, it is extremely rare that the two centers coincide with each other from the beginning, and normally the positions are displaced as shown in the drawing.

Each of these marks m and n corresponds to each image pickup means C.
When the images are picked up by 1 and C2, the image processing device (not shown) calculates the center of gravity (center) for obtaining the positions A and B of the centers of the marks m and n (S7). As a result of the center of gravity calculation, first, the deviation of the line connecting the respective centers of gravity A1-A2 and B1-B2 is calculated. Therefore, the substrate P1 is calculated based on this calculated value.
Assuming that both ends of each mark have been moved in the Y direction (direction perpendicular to the paper surface), the distances L1 and L2 between the respective center positions when the center positions of both marks coincide with each other are calculated. As a result, there is a difference of L1-L2 between the distance L1 between the center positions B1 and B2 of the upper substrate P2 with respect to the distance L1 between the center positions A1 and A2 of the lower substrate P1. The distribution calculation is performed on each side (L1-L2) / 2 (S8),
Alignment is performed so that the distance between the center of the mark m on one substrate P1 and the center of the mark n on the other substrate P2 at both ends is equal. That is, the distance between A1-B1 and A2-B
Make the distance between the two equal.

In this way, the positional deviation is calculated by the image processing, and the positions B1 'and B to which the mark on the upper substrate should be moved.
When 2'is obtained, the first moving means 2 is activated to move the lower table 11 in the XY directions so that the center position B1 of the mark at the left end of the upper substrate coincides with the target position B1 '. Relative movement is performed (S9).

At this time, the lower table 11 is moved in the longitudinal direction only by the XY table means 2.
In the Y table means 3, the second X-axis rail 16 is moved in the XY direction along the second X-axis guide 15a. On the other hand, the swinging of the lower table 11 in the width direction by the XY table means 3 can be handled by the ball bearings 10 and 10, respectively. When the center position B1 of the mark at the left end coincides with B1 ', next, the center position B2 of the mark at the right end of the upper substrate relatively moves so as to coincide with the target position B2' (S10).

This alignment is performed by moving the right end of the lower table 11 in the XY directions by the second moving means 3. Also at this time the lower table 1
The rocking of No. 1 can be handled by the ball bearing 10. Alternatively, the relative position may be moved after the target position of the mark m on the lower substrate P1 to be moved is calculated.

Thus, the center position A of each mark on the upper and lower substrates
After correcting the displacement based on 1, B1 and A2, B2,
Next, the suction head 17, which is the second holding means, is lowered,
As shown in FIG. 2, the upper substrate P2 is overlaid on the adhesive layer B set on the lower substrate P1 (S11). Adhesive layer B
Is in a semi-cured state, the upper substrate P2 and the upper substrate P2 are not bonded to each other simply by stacking the upper substrate P2 and the upper substrate P2 .

Next, both substrates are temporarily fixed to each other at the four corners of the superposed substrates by using the ultrasonic metal welding machine 22 which is a temporary fixing means (S12). For temporary fixing, the ultrasonic metal welding machine 22 is rotated in the horizontal direction, and the vibrating chips 22c provided at the tip of the horn 22b are attached to the metal thin film layer portions k1 and k at the four corners of the substrate.
2 (see FIG. 10), the vibrating tip presses the upper substrate P2 toward the lower substrate P1 and applies ultrasonic transverse vibration to both metal thin films. It is performed by ultrasonic metal welding between the layers (see FIGS. 10 and 11).

When the temporary fixing is completed, the fixing of the lower substrate P1 to the lower table 11 by the first holding means is released, and the suction head 17, which is the second holding means, is removed from both the joined substrates P1 and P2. Then, the substrate P, which is temporarily fixed, is lifted while being held (S13).

Then, the suction head 17 is moved by a moving means (not shown) while holding the temporarily fixed substrate P, and the temporarily fixed substrate P is discharged to a substrate recovery box (not shown) (S14). .

The temporarily fixed substrate is conveyed to a separately provided main pressing means, that is, a heat press device (not shown), and the main fixing, which is the entire bonding by the adhesive layer B, is thermally pressed there. By doing so, a multilayer substrate is completed. Since both substrates are temporarily fixed in the aligned state, there is no fear of positional displacement even after being thermally pressed.
In the present invention, since alignment and temporary fixing are continuously performed by the same device, there is almost no risk of misalignment.

Next, another embodiment will be described. This uses a jig plate for facilitating the position confirmation of the image pickup means in the manufacturing apparatus of the multilayer substrate described in the above-mentioned embodiment, and the jig plate is used for each manufacturing process in advance. By confirming the position of the image pickup means, the calculation of the mark position on the substrate is surely and easily performed.

As shown in FIG. 5, the jig plate J comprises a rectangular plate having a predetermined width and the same length as the lower table 11 and provided with a plurality of holes for confirming the position of the image pickup means. . The hole is formed at the same time as the mark located at one end of the substrate, at the same time as the first hole 51 provided at a position where the first image pickup means C1 can image, and at the same time as the mark located at the other end of the substrate. The second hole portion 52 is arranged in parallel so as to face each other at a position where it can be imaged by the second image pickup means C3 (see FIGS. 6 and 7). Since the intervals between these hole portions 51 and 52 are known in advance, the distance between the two image pickup means is determined with reference to these hole portions, and the movement amount of the image pickup means is determined and moved based on the obtained distance. Accurate alignment between the upper and lower substrates is easy. The long groove 53 provided in parallel with the row of the second holes 52 is a window for picking up an image of the mark.

Here, an outline of an apparatus for manufacturing a multi-layer substrate using the jig plate J in the present invention will be described. Figure 6,
As shown in FIG. 7, the basic configuration is the same as that of the above-described embodiment, so only different parts will be described, and description of common parts will be omitted. The same reference numerals are given in the drawings.

6 and 7 show a state in which the jig plate J is placed on the upper surface of the lower table 11 to align the two substrates, and the jig plate J is moved by the first image pickup means C1. Of the first hole 51, the mark m1 on the lower substrate P1 and the upper substrate P2
It is possible to simultaneously image the mark n1.

On the other hand, the second image pickup means C3 for picking up an image of the right side of the multilayer substrate is movably attached together with the second Y table means 63. Second Y table means 6
3 is provided so as to be movable in the X direction (longitudinal direction of the multilayer substrate) by being guided by the second X-axis rails 76, 76 laid on the upper surface of the fixed table 1 and the lower surface of the lower table 11. A movable table 75b of Y table means is fixed on an X-axis guide 75a slidably provided on a second X-axis rail 76 laid on the upper surface of the fixed table 1. On the upper surface of the moving table 75b, second Y-axis rails 72, 72 extending in the Y direction (width direction of the multilayer substrate) are provided. Above the moving table 75b, each second Y
The second Y-axis guides 73, 7 mounted on the shaft rail 72
A second Y table 74 is provided via The center of the Y table 74 is erected in a cylindrical shape to form a Y table support portion, and the ball bearing 70 is formed around the Y table support portion.
Has been inserted. The upper surface of the ball bearing 70 is the Y-axis guide 75a provided on the lower surface of the lower table 11 described above.
It is stuck to.

With such a configuration, the X-ray camera 21 of the second image pickup means C3 has the second Y table means 63.
Can be moved in the Y direction (width direction of the multilayer substrate) by the moving table 75b and can be moved in the X direction along the X-axis rails 76, 76 by the moving table 75b as described above. Then, the second image pickup means C3 moves in the X direction along the second X-axis rails 76, 76 and moves to the second position of the jig plate J.
At least one of the hole portions 52 of the lower substrate P1 and the mark m of the lower substrate P1.
2 and the mark n2 on the upper substrate can be imaged at the same time.

Also in this embodiment, the temporary fixing means employs a plurality of ultrasonic metal welding machines which apply ultrasonic transverse vibration to the pair of substrates (not shown).

Next, a method of aligning the lower substrate P1 and the upper substrate P2 in this embodiment will be described. As shown in FIG. 8, the first hole portion 51 of the jig plate J is located within the image area f1 of the X-ray camera 19 (see FIG. 6) of the first image pickup means C1, and the second image pickup means C3. The second hole portions 52, 52 are located in the image area f2 of the X-ray camera 21 of FIG. Of the plurality of second holes 52 arranged in parallel, the lower substrate P1
Of the second Y table 74 and the second image pickup means C3 to the position where the mark m2 of FIG.
The two shown in FIG. 8 are located in the image area f2 in a state where they are moved along the line 76. At this time, the known hole 5
With reference to the distance L3 between the first and second image areas 52, both image regions f1,
The distance between the centers (i1, i2) of f2 can be easily calculated.

That is, the first hole portion 51 is formed by image processing.
And the center of the second hole portion 52 (any one may be provided). The center i1 of the image area f1 and the first
The relative position relationship between the center of the hole 51 and the center i2 of the image region f2 and the center of the second hole 52 is calculated. Since the distance L3 between the holes 51 and 52 is known, the distance L4 between the centers i1 and i2 of the two image areas can be obtained in consideration of the relative positional relationship.

When imaging the holes 51 and 52, the marks m1 and m2 on the lower substrate P1 and the marks n1 and n1 on the upper substrate P2.
n2 is also imaged at the same time. Then, similarly to the first embodiment, the upper substrate P2 is aligned with the marks A1, A2 on the lower substrate.
The moving means 2 and 3 are operated so that the marks B1 and B2 of 1 are located at the target positions B1 ′ and B2 ′ (see FIG. 4). Specifically, first, the center B1 of the mark on the left side of the substrate is moved to the position B1 'by the first moving means 2, and then the center B2 of the mark on the right side is moved to the position B2' by the second moving means 3. To do. At this time, the substrate is fixed on the left side and moved on the right side. That is, as shown in FIG.
Since 1 and C3 are incorporated in the centers of the moving means 2 and 3, the imaging means C3 side rotates about the center i1 (see FIG. 8) of the imaging means C1 as the rotation center. Here, the distance L4 between the image pickup means C1 and C3 obtained previously is the radius of gyration. Since the radius of gyration is known in this way, the amount of movement of the moving means 3 to bring B2 to the position of B2 'can be accurately calculated.

In the case of the first embodiment, when the right side of the substrate is moved, an error occurs due to the addition of the rotational motion, and it is necessary to make a correction by trial and error. In this embodiment, the radius of rotation is known. Since the moving amount due to the rotational movement can be calculated, the moving amount of the moving means 3 can be obtained in consideration of this rotational movement, and the mark center B2 can be easily and accurately obtained.
Can be moved to the position of B2 '.

FIG. 7 shows each of the substrates P1 and P as described above.
After the two marks m1, n1 and m2, n2 have been aligned, the two substrates are laminated via a prepreg (adhesive layer) B. The subsequent steps are the same as those in the first embodiment described above.

In this embodiment, the distance between the holes of the jig plate is known in advance, and the distance between the centers of the visual fields of the X-ray cameras 19 and 21 is obtained with the center of the holes as a reference. The amount of movement of the moving means can be accurately and easily obtained.

Further, since the second hole portions 52 are arranged side by side so as to face each other with the long groove 53 sandwiched therebetween, by determining the degree of inclination of the straight line connecting them, within the image area, The mounting error of the image pickup means 3 is found, and it can be used as the correction data when moving.

Further, since each hole of the jig plate can be imaged at all times, it is possible to cope with the secular change of the machine, and it is possible to accurately position the printed boards on each other for a long period of time. Further, since the marks are aligned with the holes of the jig plate, the amount of camera misalignment can be known even when the camera is exchanged, which facilitates alignment when exchanging the camera. There is.

Actually, the marks A1 and A shown in FIG.
2, B1 and B2 and the holes 51 and 52 shown in FIG. 8 appear in the same screen, but they are shown separately in FIG. 4 and FIG. 8 for ease of explanation.

In the above description, in any of the embodiments, one substrate (single-sided substrate or double-sided substrate) having a circuit pattern formed on the surface is laminated, but These substrates may be either a lower substrate or an upper substrate, or both of them may be a multilayer substrate or a plurality of substrates temporarily fixed.

For example, when the lower substrate is a two-layer (four-layer) multilayer substrate manufactured in the above process and the upper substrate is one double-sided substrate (two layers), the alignment mark is as shown in FIG.
As shown in FIG. 3, g of the upper substrate is added to m and n on both ends of the lower substrate. Then, the distribution calculation can be similarly performed. However, as described above, since the marks nl and n2 of the upper substrate of the multilayer substrate already exist on the line connecting the center positions A1 and A2 of the white marks, the marks gl and g2 of the upper substrate are further provided on this line. It may be confusing and difficult to position. Therefore, in such a case, the marks gl on the upper substrate,
The center position of g2 is set in advance as the center position A1 of the mark on the lower substrate.
Provided at a position separated from A2 by a constant distance dl, d2,
At the time of alignment, it is advisable to correct the distances dl and d2. In this way, it is possible to manufacture a substrate having three layers (six layers).

In addition, as another embodiment of the present invention, an XY having a rotating mechanism in addition to the XY table mechanism as the moving means.
It is also possible to use a single moving means as the θ table. Of course, in this case, the procedure for aligning the upper and lower substrates is different. Further, in the above description, the position adjustment is performed by moving the lower table 11, but it is also possible to make the lower table immovable and move the suction head to perform the position adjustment. Although each of the image pickup means is positioned at the center of the moving means such as the XY table, it may be provided inside or outside the moving means.

Further, the image pickup means is not limited to the combination of the X-ray generator and the X-ray camera adopted in each of the above embodiments, and CCD cameras and the like are arranged above and below the lower table, respectively. It is also possible to adopt a configuration in which the mark provided on the surface of the substrate is imaged. In this case, the mark on the lower substrate does not need to be blank, and the mark on the upper substrate need not have a small diameter.

In each of the above-mentioned embodiments, each substrate and the adhesive layer were automatically conveyed and set by the second holding means 17, but each substrate and the adhesive layer were manually placed on the lower table 11. After that, the second holding means 17 may suck only the upper substrate to start the alignment operation.

[0065]

According to the present invention, a pair of substrates, each having a mark for alignment, are held in a state of being opposed to each other via an uncured adhesive layer, and these marks are subjected to image processing. The fixing work of the pair of substrates is performed in a state where the positional deviation is corrected. Further, the temporary fixing performed before the main fixing of the pair of substrates is performed in advance on the facing surfaces of the pair of substrates. Since the formed metal thin film layer portions are firmly bonded to each other by ultrasonic metal bonding, it is possible to manufacture a multi-layer substrate with high alignment accuracy.

Further, an adhesive layer is formed on either one of the pair of substrates, the other substrate is held in a non-contact state at a constant interval, and both substrates are moved for alignment, Since the other substrate is brought into close contact with the adhesive layer, it can be fixed in a state of being accurately aligned without being obstructed by the adhesive layer.

If there is a difference between the distance between the marks on one substrate and the distance between the marks on the other substrate, this difference is calculated, and the two divided values are distributed to both substrates. Accurate alignment can be easily performed by relatively moving and aligning.

As a mark used for alignment, the mark on one substrate is outlined and the mark on the other substrate is smaller in diameter than this outline mark, so that the center position of each mark can be easily calculated. Contribute to the promotion of automation.

Further, since the pair of substrates may be a single-layer substrate, a multi-layer substrate in which two substrates are stacked or a plurality of substrates temporarily fixed, a multi-layer substrate in which three or more substrates are laminated is easy. Can be manufactured.

Further, a jig plate having a plurality of holes whose center-to-center distances are known in advance is provided on one of both holding means,
If the mark position of each substrate is obtained with reference to these holes, more accurate and easy alignment can be achieved, and alignment is facilitated even when the image pickup means is replaced. .

[Brief description of drawings]

FIG. 1 is a schematic view of a multi-layer substrate manufacturing apparatus according to the present invention.
FIG. 6 is a cross-sectional view of a main part showing a state where a pair of substrates are held in a non-contact state with a constant space.

FIG. 2 is a cross-sectional view of an essential part showing a state in which a pair of substrates are in close contact with each other via an adhesive layer.

FIG. 3 is a flow chart showing a manufacturing process of a multilayer substrate according to an embodiment of the present invention.

FIG. 4 is an explanatory diagram showing correction of positional deviation between marks on a pair of substrates.

FIG. 5 is a plan view showing a state in which a jig plate is provided on a lower substrate.

FIG. 6 is a cross-sectional view of an essential part showing a state in which a pair of substrates is held in a non-contact state at a constant interval in another embodiment.

FIG. 7 is a cross-sectional view of essential parts showing a state in which a pair of substrates are in close contact with each other with an adhesive layer in another example.

FIG. 8 is an explanatory diagram showing the relationship between the distance between the holes provided in the jig plate and the distance between the image pickup means in another embodiment.

FIG. 9 is an explanatory diagram showing the positions of marks when one of a pair of substrates is a multilayer substrate.

FIG. 10 is an enlarged cross-sectional view showing a state before the temporary adhesion of the pair of substrates and the adhesive layer.

FIG. 11 is an explanatory diagram showing a relationship between a metal thin film layer portion formed on a pair of substrates and a cut portion of an adhesive layer.

[Explanation of Codes] P (P1, P2) Substrates m, n, g Marks k1, k2 Metal thin film layer portion B Adhesive layer (prepreg) C1 First image pickup means C2, C3 Second image pickup means J Jig plate 2 , 3,63 moving means 11 first holding means (lower table) 17 second holding means (substrate suction head) 22 temporary fixing means 51, 52 hole

Claims (10)

(57) [Claims] 1. A mark which is previously formed on both ends.
A step of holding the pair of substrates in an opposed state with an adhesive layer in an uncured state interposed, and imaging the marks provided on one end of the pair of substrates with a first imaging means. , A step of capturing an image of the mark provided on the other end portion by the second image capturing means, a step of obtaining the position of each mark by image processing, and a step of determining the position of each mark based on the image processing. A step of obtaining a relative positional deviation and correcting the positional deviation by relatively moving the pair of substrates; and a step of temporarily fixing the pair of substrates with the positional deviation corrected. And the step of temporarily fixing the pair of substrates in the temporarily fixed state. The step of temporarily fixing the pair of substrates includes a position where the adhesive layer is not present or a position where the adhesive layer is cut off in advance. Then, facing the pair of substrates In the state where the metal thin film layer portions which are respectively formed in advance are bonded to each other, ultrasonic transverse vibration is applied to the metal thin film layer portions so that the metal thin film layer portions are metal-welded to each other. Substrate manufacturing method. 2. The adhesive layer according to claim 1, wherein the adhesive layer is provided on one of the pair of substrates, and the other substrate is held in a non-contact state with a certain distance from the adhesive layer. A method for manufacturing a multi-layer substrate, which comprises relatively moving the pair of substrates and then stacking the other substrate on the adhesive layer. 3. The difference according to claim 1 or 2, wherein when a gap between marks on one of the pair of substrates and a gap between marks on the other substrate are different from each other, The equal value is divided into one end and the other end, and the pair of substrates are relatively arranged so that the distance between the mark on the one substrate and the mark on the other substrate at both ends becomes equal. A method for manufacturing a multi-layered substrate, comprising: 4. The method according to any one of claims 1 to 3,
The mark provided on one of the pair of substrates is a white mark, and the mark provided on the other substrate has a diameter smaller than that of the white mark. A method for manufacturing a multi-layer substrate, characterized in that an image of both of the marks is taken in a state where the other mark is located at. 5. The method according to any one of claims 1 to 4,
At least one of the pair of substrates is a multi-layered substrate composed of a plurality of layers or a plurality of temporarily fixed substrates, and a method of manufacturing a multi-layered substrate. 6. The jig plate according to claim 1, wherein a jig plate having a plurality of holes whose distances are known in advance overlaps one of the pair of substrates. The first imaging means images one of the holes of the jig plate when the mark located at the one end is imaged, and the second imaging means Means for imaging the other one of the holes of the jig plate at the time of imaging the mark located at the other end, and by image processing, the both holes in the image area of the both imaging means. The center position of each part is obtained, and the interval between the image capturing means is calculated based on the center position of each hole in each image region and the previously known interval between the imaged holes. However, the position of the pair of substrates is determined based on the distance between the two imaging means. Method for manufacturing a multilayer substrate which comprises the step of determining the amount of relative movement to correct the. 7. A mark formed in advance on both ends.
A multi-layer substrate manufacturing apparatus in which a pair of substrates are fixed to each other via an adhesive layer, the first holding means holding one substrate of the pair of substrates, and the pair of substrates of the pair of substrates. Second holding means for holding the other substrate of the pair of substrates so as to face the one substrate, and the mark provided on each of the pair of substrates at one end of the pair of substrates at the same time. Possible first imaging means, second imaging means capable of simultaneously imaging the marks provided on the pair of substrates at the other end of the pair of substrates, and the position of each mark In order to correct the relative positional deviation of the pair of substrates obtained based on the above, the moving means for relatively moving the pair of substrates, and the adhesive layer with the positional deviation corrected. Cut off the non-intervening position or the adhesive layer in advance At a certain position, ultrasonic transverse vibration is applied to the metal thin film layer portions so that the metal thin film layer portions are preliminarily formed on the opposing surfaces of the pair of substrates and the preformed metal thin film layer portions are bonded to each other. An apparatus for manufacturing a multi-layer substrate, comprising: a temporary fixing means for metal-welding each other; and a main fixing means for heat-pressing the temporarily fixed state to weld the pair of substrates to each other by the adhesive layer. 8. The moving means according to claim 7, wherein the moving means is an XY table means for moving one substrate of the pair of substrates in a longitudinal direction and a width direction, and the one substrate is provided in parallel with the XY table means. And an XY table means for moving the substrate in the width direction. 9. The apparatus for manufacturing a multilayer substrate according to claim 7, wherein the both holding means are provided so as to be close to and away from each other. 10. The jig plate according to claim 7, wherein a jig plate is provided on one of the holding means, and the jig plate has a plurality of holes for confirming the position of the image pickup means. The holes are provided in advance, and the intervals between these holes are known in advance. And at least one of the other holes is imaged by the second imaging means at the same time as the mark located at the other end of the substrate. Substrate manufacturing equipment.