JP3424717B2 - Heating element mounting semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-generating-element-mounted semiconductor device, and more particularly to a heat-generating-element-mounted semiconductor device having a cooling device having a highly efficient heat dissipation effect and mounting a high density LSI module as a heat generating element.

[0002]

2. Description of the Related Art As the operating speed of an LSI module increases and the integration density of the LSI module also increases, the amount of heat generated by each high-density LSI module, which is a heating element, increases. It is increasing. Under such circumstances, it is required to develop a more efficient cooling device for a semiconductor device mounted with a high density LSI module.

An LSI module mounted semiconductor device generally has a large number of LSs required on one surface of a printed circuit board.
The I module is mounted and externally connected via terminal pins formed on the other surface. To cool this LSI module mounted semiconductor device, the entire semiconductor device is cooled by forced air cooling, or the entire semiconductor device is cooled by liquid cooling in which it is immersed in a cooling liquid.

[0004]

When a semiconductor device is cooled by a cooling liquid, cooling fins are formed on the LSI module-mounted semiconductor device, which is the object to be cooled, so that the cooling liquid absorbs heat radiated from the semiconductor device. Heat is dissipated to the outside through this cooling liquid. Due to the formation of the cooling fins in the semiconductor device, various restrictions are added to the structure of the printed circuit board, the terminal pins and other mounting structures and shapes of the semiconductor device, and it is necessary to take measures against this.

According to the present invention, only the heat-generating element having an extremely large calorific value is enclosed and housed by the printed circuit board and the cooling liquid sealing case and is cooled by the cooling liquid flowing therethrough, and is placed outside the cooling liquid sealing case on the printed circuit board. The arranged semiconductor device is provided with a heating element-mounted semiconductor device in which the above-mentioned problems are solved by cooling using a general cooling device for forced air cooling.

[0006]

A printed circuit board 1 is provided with a flow receiving portion 25 for circulating a cooling liquid 7 formed by covering a cooling liquid hermetically sealed case 2 and enclosing and holding a heating element 3 therein. A heating element-mounted semiconductor device having a cooling device for circulating the cooling liquid 7 in 25 was constructed.

Then, a sealing portion 2 for liquid-tightly sealing the surface of the printed circuit board 1 and the peripheral end portion 26 of the cooling liquid sealing case 2 is formed.
The heat-generating element-mounted semiconductor device of No. 7 was constructed. Further, the sealing portion 27 is formed on the surface of the printed circuit board 1 in the area where the cooling liquid sealing case 2 peripheral end portion 26 engages with the metal foil 1.
1 and a semiconductor device mounting semiconductor device comprising an elastic body packing 4 interveningly engaged between the end face of the peripheral end portion 26 and the metal foil 11.

Further, the cooling device constitutes a heating element mounted semiconductor device in which the cooling liquid 7 whose temperature is adjusted and pressurized to a required pressure is injected into the circulation containing portion 25. Further, the circulation containing portion 25 constitutes a heating element mounted semiconductor device in which the partition wall 24 is formed on the inner surface of the cooling liquid hermetically sealed case 2. Here, the bottom wall 21 of the cooling liquid hermetic case 2 and one side wall 22 facing each other toward the printed circuit board 1 and the other side wall 23, or from the other side wall 23 to the printed circuit board 1 and one side wall. Two
A heating element-mounted semiconductor device in which the partition walls 24 that do not reach the printed circuit board 1 and the opposing side wall are alternately formed toward 2 is formed.

The partition wall 24 reaches the printed circuit board 1 and constitutes a semiconductor device mounting a heating element.
Further, the semiconductor device arranged outside the cooling liquid sealed case 2 on the printed circuit board 1 constitutes a heating element mounted semiconductor device in which a general forced air cooling cooling device is used for cooling.

Further, in the above-described semiconductor device having the heating element mounted therein, the circulation containing portion 25 and the cooling device are the printed circuit board 1
A semiconductor device having a heating element mounted on both sides was constructed. Further, a heat generating element-mounted semiconductor device in which a cooling liquid circulation hole that communicates both the circulation containing portions 25 is formed in the printed circuit board 1 is configured.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. 1B is a diagram showing a line bb ′ of FIG. 1A viewed in the arrow direction, and FIG. 2 is a line 2-2 ′ of the FIG. 1A viewed in the arrow direction. FIG. In these figures, the printed circuit board 1 is provided with heating elements 3 as heating elements arranged on both sides thereof in a matrix form in the left-right and up-down directions. Reference numeral 31 denotes a terminal pin that electrically and mechanically attaches the heating element 3, which is a heating element, to the printed board 1. 32 is a heating element 3
The cooling member is bonded and fixed to the surface, and is made of a material having a high thermal conductivity such as copper or aluminum, and has a large number of fins formed on the surface. Printed circuit board 1
Further, a large number of connectors 5 are attached to the peripheral edge portion of the. The terminal pins 31 of the heating element 3 are connected to these connectors 5 via the multilayer wiring of the printed circuit board 1. Cooling liquid sealing cases 2 are provided on both sides of the printed circuit board 1, and a circulation housing portion 25 is formed between the printed circuit board 1 and the printed circuit board 1 so as to surround and house the heating element 3. That is, the bottom wall 21 forming the cooling liquid sealed case 2 and the one facing each other 1
The side wall 22 and the side wall 23 of the set are formed from the bottom wall 21 and one side wall 22 opposite to the printed circuit board 1 and the other side wall 23, or from the other side wall 23.
Further, the partition walls 24 that do not reach the printed circuit board 1 and the opposing side wall are alternately formed toward the one side wall 22. Here, a configuration may be adopted in which the partition wall 24 that extends to the printed circuit board 1 but does not reach the opposing side wall is stretched. As a result, a circulation housing portion 25 that surrounds and houses the heating element 3 is formed between the printed circuit board 1 and the cooling liquid sealed case 2, and this also serves as a path for the cooling liquid 7 to flow in the direction indicated by the arrow. Reference numeral 61 denotes an inflow port for allowing the cooling liquid 7 to flow into the circulation housing section 25,
Reference numeral 62 is an outlet for letting out the cooling liquid 7. Partition 2
The shape and size of the heating element 3 are set in order to enhance the cooling effect for suppressing the temperature rise of the heating element 3 and the printed circuit board 1.
The shape of the heating element 3 and the printed circuit board 1 to be cooled is determined in advance by an experimental analysis because the shape of the heating element 3 and the printed circuit board 1 are closely related to the shape structure and other states. Properly designed and manufactured according to the structure. The flow rate and flow rate of the cooling liquid 7 are also determined by the printed circuit board 1
Determine appropriately according to the heat generation density inside. Here, a configuration is adopted in which the cooling liquid is allowed to flow from one surface side of the printed circuit board 1 to the other surface side by forming a cooling liquid circulation hole that communicates both the circulation housing portions 25 in the printed circuit board 1.
It is possible to simplify the shape structure of the cooling device or the semiconductor device on which the heating element is mounted, or improve the cooling efficiency.

Referring to FIG. 3, FIG. 3 shows a printed circuit board 1.
It is a figure explaining the sealing part 27 which liquid-tightly seals between the surface and the cooling liquid sealing case 2 peripheral end part 26. To form the sealing portion 27, the metal foil 11 is formed in advance on the surface of the printed circuit board 1 in the region where the cooling liquid sealing case 2 peripheral end portion 26 engages. The metal foil 11 is formed by applying a gold plating pattern on the surface of the printed circuit board 1, or by forming a copper pattern first and then applying gold plating thereon. The surface of the printed circuit board 1 and the cooling liquid hermetic case 2 are engaged with each other with the elastic packing 4 made of an O ring interposed between the concave groove 28 formed on the end face of the peripheral end portion 26 and the metal foil 11. The cooling liquid sealing case 2 is pressed against the printed circuit board 1 from both sides thereof to ensure the sealing by the sealing portion 27. The elastic body packing 4 interposed between the cooling liquid sealed case 2 and the printed circuit board 1 is made of a material that is not deteriorated by the cooling liquid 7. As the cooling liquid 7, Fluorinert (registered trademark: 3M Co.) which is an inert liquid can be used. Then, the metal foil 11 is plated with gold, whereby the sealing property of the sealing portion 27 can be maintained for a long period of time.

The heating element 3 which is a heating section housed and mounted in the circulation housing section 25 and the cooling member 32 mounted on the surface of the heating element 3 flow the cooling liquid 7 whose temperature is appropriately controlled in the cooling liquid sealing case 2. It is cooled by being pressed in at a necessary pressure from an external refrigerator via the inlet 61 and a pipe. The cooling liquid 7 that has been press-fitted into the circulation housing portion 25 from the inflow port 61 flows as shown by an arrow to remove heat from the heating element 3 and the cooling member 32, and the outflow port 62.
Is discharged from the outside.

Cooling liquid sealing case 2 on printed circuit board 1
The semiconductor devices and components that generate heat other than the heat generating element 3 are arranged outside the element, but these are cooled using a general cooling device for forced air cooling.

[0015]

As described above, according to the present invention, only the heating element 3 having a very large calorific value is enclosed and housed by the printed circuit board 1 and the cooling liquid sealing case 2 and is circulated in the cooling liquid. Cool with 7. Since the semiconductor device and parts arranged outside the cooling liquid sealed case 2 on the printed circuit board 1 are cooled by using a general forced air cooling device, various accidents may occur during mounting. It is possible to configure an inexpensive semiconductor device mounting semiconductor device as a whole.

Then, the distribution housing portion and the cooling device are formed on both surfaces of the printed circuit board 1, and the printed circuit board 1 is further provided with a cooling liquid circulation hole for communicating the both circulation housing parts 25, thereby increasing the mounting density of the heating elements. In addition to increasing the temperature, the cooling device or the heating element mounting semiconductor device as a whole is simplified in shape and structure.
The cooling efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an example.

FIG. 2 is a diagram illustrating an example.

FIG. 3 is a diagram illustrating a sealing portion.

[Explanation of symbols]

1 printed circuit board 11 metal foil 2 Cooling liquid sealed case 21 bottom wall 22 Side wall 23 Side wall 24 partitions 25 Distribution Housing 26 peripheral edge 27 Sealing part 28 groove 3 heating element 31 terminal pin 32 Cooling member 4 Elastic body packing 5 connector 61 Inlet 62 Outlet 7 Cooling liquid

Continuation of front page (56) Reference JP-A-3-139899 (JP, A) JP-A-2-17659 (JP, A) JP-A-8-159635 (JP, A) JP-A-6-164178 (JP , A) JP-A-1-191917 (JP, A) JP-A-3-263398 (JP, A) JP-A-2-188995 (JP, A) JP-A-4-233300 (JP, A) 3-67446 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 7/20

Claims (8)

(57) [Claims] 1. A cooling device for circulating a cooling liquid, which is formed by covering a printed circuit board with a cooling liquid hermetically sealed case, and having a circulation housing for surrounding and housing a heating element, the cooling device circulating the cooling liquid in the circulation housing. Possession
And the bottom walls that make up the cooling liquid-tight case and face each other.
From one side wall to the printed circuit board and the other side wall.
On the printed circuit board and one side
Alternating towards the wall, the printed circuit board and the opposite side wall
A semiconductor device mounted with a heating element, characterized in that a partition wall that does not reach the temperature is formed by extension . 2. The heating element-mounted semiconductor device according to claim 1, wherein a sealing portion that liquid-tightly seals between the surface of the printed circuit board and the peripheral edge of the cooling liquid sealing case is formed. Heater element mounted semiconductor device. 3. The heating element-mounted semiconductor device according to claim 2, wherein the sealing portion is a metal foil formed in a region of the printed circuit board surface where the cooling liquid sealing case peripheral edge portion engages, and the peripheral edge portion. A semiconductor device mounted with a heating element, characterized in that the heating element-mounted semiconductor device is composed of an elastic packing that is interposed and engaged between an end surface of the sheet and a metal foil. 4. The heat-generating-element-mounted semiconductor device according to claim 1, wherein the cooling device circulates and stores the cooling liquid whose temperature is adjusted to a required pressure. A semiconductor device mounted with a heating element, characterized in that it is injected into a portion. 5. The heating element-mounted semiconductor device according to claim 1 , wherein the partition wall reaches the printed circuit board. In the heat generating element mounting semiconductor device described in any of the 6. The method of claim 1 to claim 5, a semiconductor device which is arranged outside the cooling fluid sealed case on the printed circuit board is common force A heating-element-mounted semiconductor device characterized by being cooled using a cooling device for air cooling. 7. The heating element-mounted semiconductor device according to any one of claims 1 to 6 , wherein the circulation container and the cooling device are formed on both sides of the printed circuit board. Heating element mounted semiconductor device. 8. The heating element-mounted semiconductor device according to claim 7 , wherein the printed circuit board is provided with a cooling liquid circulation hole that communicates both the circulation containing portions.