JP3433802B2 - Mold for processing printed wiring motherboard and method for manufacturing processed board - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die for processing a printed wiring mother board and a method for manufacturing a worked board, and more specifically, punching a printed circuit board from the printed wiring mother board and an outer shape of the printed wiring mother board. The present invention relates to a printed wiring mother board processing die used for cutting, and a method for manufacturing a processed board obtained by processing a printed wiring mother board.

[0002]

2. Description of the Related Art With the recent miniaturization of electronic equipment, there is an increasing demand for miniaturization and modification of printed circuit boards used in electronic equipment. On the other hand, an automatic electronic component mounting machine such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board (hereinafter referred to as a "self-mounting machine") has a size of a work due to a transportation relation. Has an upper limit and a lower limit. Further, it is required that the outer shape of the work used for the self-mounting machine is substantially rectangular, that is, at least one side is a straight line and all or part of the sides perpendicular to this is a straight line. It

Therefore, when electronic components are mounted on a small-sized and odd-shaped printed circuit board by using a self-mounting machine, first, a plurality of printed circuit boards are formed on a printed wiring mother board, and a V-cut method, Using the pushback method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the processed board having a size and shape that allows the printed wiring board to be transported by a self-mounting machine ( Hereinafter, a method of cutting this into a "mounting substrate") is used.

Among them, the V-cut method inserts a V-shaped groove (V-cut) along a boundary line of a printed circuit printed on a printed wiring board and mounts electronic parts on the printed circuit, It is a method of breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outline is linear.

On the other hand, in the pushback method, the printed circuit board is sandwiched between the upper die and the lower die, and the printed circuit board is punched using a blade having a predetermined shape, and then the punched printed circuit board is punched. It is a method to fit in the original hole. The pushback method is particularly effective for automatically mounting electronic components on a deformed printed circuit board because the shape of the printed circuit board is not limited.

Conventionally, the processing of the printed wiring board using the pushback method is generally performed by the following procedure. That is, first, as shown in FIG.
Printed wiring mother board 1 on which an electric circuit (not shown) is printed
0 is formed with reference holes 12, 12 ... For pushback. Next, as shown in FIG. 8B, a pushback mold is used to perform pushback of the printed circuit boards 14, 14 ... And perforation of the component holes 16, 16. further,
As shown in FIG. 8 (c), the outer shape of the printed wiring mother board 10 is cut by using the outer shape cutting die, and further, the reference hole 17a and the sub reference hole 17b are used as a reference when automatically mounting electronic components. Perforate. As a result, the mounting substrate 18 including the predetermined number of push-back printed circuit boards 14, 14 ... Is obtained.

[0007]

However, since the conventional processing method requires two types of molds for pushback and for contour cutting, the cost of the mold increases and the processing cost increases. There is. In addition, when it is necessary to perform pushback processing and outer shape cutting processing using the same press machine, it is necessary to replace the mold, which lowers workability.

In addition, when performing contour cutting after pushback processing, it is necessary to position the printed wiring mother board with respect to the contour cutting die. This positioning is usually
Positioning pins are provided upright on the lower die of the outer shape cutting die, and the pins are inserted into the pushback reference holes 12, 12 ... Provided in the printed wiring mother board.

However, when the printed circuit board is punched out from the printed wiring board, a non-uniform force acts on the printed wiring board. In some cases, a convex spherical warp may occur. When the warp becomes remarkable and the height of the bottom surface of the printed wiring board 10 exceeds the height of the positioning pin, the positioning pin cannot be inserted into the reference hole.
There is a problem that positioning is difficult when cutting the outer shape.

Further, after the cutting of the outer shape, the mounting substrate also warps. If this warp becomes remarkable, there is a problem that the mounting board is not smoothly transported when the mounting board is transported to the self-mounting machine. Further, the clearance between the printed circuit board punched from the printed wiring board and the hole formed in the printed wiring board by punching the printed circuit board is extremely small. Therefore, if the mounting substrate is significantly warped, it becomes difficult to remove the printed circuit board that has been fitted, and the workability is reduced.

The problem to be solved by the present invention is to provide a die for processing a printed wiring mother board and a method for manufacturing a worked board which can reduce the die cost and have excellent workability. Another problem to be solved by the present invention is to provide a mold for processing a printed wiring board and a method for manufacturing a processed board, which can easily cut the outer shape of the printed wiring board. Further, another problem to be solved by the present invention is to provide a mold for processing a printed wiring mother board and a method for manufacturing a processed plate capable of manufacturing a processed plate such as a mounting substrate having a small warpage after pushback processing. Especially.

[0012]

In order to solve the above-mentioned problems, a mold for processing a printed wiring board according to the present invention is such that a printed circuit board is punched from a printed wiring board and the punched printed circuit board is used as a base material. By pushing back means for fitting into the hole, and at least one side of the punched printed circuit board, by sequentially forming vertical slit pieces parallel to the carrying direction of the printed wiring board, The gist of the present invention is to include a vertical slit forming means for forming a continuous vertical slit that serves as a reference side of the processed plate . In this case, it is composed of two or more horizontal slit pieces that are orthogonal to the vertical slits and are aligned in a straight line in front of or behind the punched printed circuit board, and at least the horizontal slit pieces are arranged. It is desirable to further include a lateral slit forming means for forming a lateral slit, one of which communicates with the vertical slit.

Further, the method for manufacturing a processed plate according to the present invention comprises:
The printed circuit board is punched out from the printed wiring board, the pushback step of fitting the punched printed circuit board into the original hole, and at least one side of the punched printed circuit board is provided with the printed wiring board. The gist of the present invention is to include a vertical slit forming step of forming continuous vertical slits that are reference sides of the processed plate by sequentially forming vertical slit pieces parallel to the transport direction. In this case, it is composed of two or more horizontal slit pieces that are orthogonal to the vertical slits and are aligned in a straight line in front of or behind the punched printed circuit board, and at least the horizontal slit pieces are arranged. It is desirable to further include a lateral slit forming step of forming a lateral slit, one of which communicates with the vertical slit.

In the printed wiring mother board working die and the method for manufacturing a worked board according to the present invention, continuous vertical slits are formed on at least one side of the push-backed printed circuit board. Therefore, the outer shape cutting is simplified as compared with the conventional method. Further, when the horizontal slit forming means is further provided, discontinuous horizontal slits orthogonal to the vertical slits are formed between the respective printed circuit boards arranged in the transport direction of the printed wiring board. Therefore, after the pushback processing is completed, a processed board including a predetermined number of push-backed printed circuit boards can be obtained simply by breaking the connecting portions of the lateral slits formed at predetermined positions.

Further, such vertical slits and horizontal slits can be formed simultaneously with push-back processing of the printed circuit board. That is, according to the present invention, a separate die for contour cutting or a contour cutting step is unnecessary or simplified, so that the die cost can be significantly reduced and the workability is also improved. In addition, when a lateral slit forming means is further provided, the lateral slits formed between the printed circuit boards relieve internal stress generated during pushback processing, so that a processed board with less warpage can be obtained. To be

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. 1 and 2
Fig. 1 shows a mold for processing a printed wiring board according to the first embodiment of the present invention. 1 and 2, a mold 1 for processing a printed wiring board according to the present embodiment is a lower mold 20.
And an upper mold 50.

As shown in FIG. 1, the lower die 20 includes a lower die base plate 22 and a lower die stripper 24. Lower punches 22a and 22b for punching out a printed circuit board (not shown) are provided at substantially the center of the lower die base plate 22. Although two lower punches 22a and 22b having the same shape are shown in FIG. 1, this is merely an example, and the shape and number of the lower punches can be arbitrarily selected according to the purpose. It is possible and is not particularly limited.

Lower punches 22a, 22 of the lower die base plate 22
First slit pins 26a to 26d for forming vertical slit pieces are erected on the side of b. Further, in front of the lower punches 22a and 22b (upstream side with respect to the conveyance direction of the printed wiring board), second slit pins 28a to 28d for forming horizontal slit pieces are provided upright.

The first slit pins 26a to 26d (longitudinal slit forming means) are parallel to the side of the printed circuit board punched by the lower punches 22a and 22b and to the conveying direction of the printed wiring board (not shown). This is for forming continuous vertical slits by successively forming vertical slit pieces. Therefore, the first slit pins erected on the lower die 20 can be arbitrarily selected in number, length and arrangement as long as continuous vertical slits are formed.

In the present embodiment, the lower punch 22a
The two first slit pins 26a, 2 which are provided on the left side of the
6b and the first two of the first punches, which are on the right side of the lower punch 22b and which are erected in a line along the transport direction of the printed wiring board.
A total of four first slit pins of the slit pins 26c and 26d are used.

Further, the first slit pins 26a and 26c (first vertical slit element forming means), which are erected on the downstream side with respect to the conveying direction, have a length of a printed wiring board per press. It is shorter than the transport distance of. Further, the first slit pins 26a and 26c have the rear ends of the vertical slit pieces (first vertical slit pieces) punched out by the second slit pins 26a and 26c, respectively, in the second pressing step in the second pressing step.
The lateral slit pieces formed by the slit pins 28a and 28d are erected upright relative to the centers of the lower punches 22a and 22b so as to communicate with the side ends of the lateral slit pieces.

On the other hand, the first slit pins 26b and 26d (second vertical slit element forming means) which are erected on the upstream side with respect to the conveying direction have the lengths of the first slit pins 26a and 26c. It is longer than the distance between the adjacent first vertical slit pieces punched by. Also,
In the first slit pins 26b and 26d, the rear ends of the vertical slit pieces (second vertical slit pieces) punched out by the first slit pins 26b and 26d are formed by the first slit pins 26a and 26c in the immediately preceding pressing step, respectively. The slit element communicates with the tip of the slit piece, and the tip of each of the second slit pins 28 a and 2 is formed in the immediately preceding pressing step.
The vertical slits 8d are formed so as to be communicated with the side ends of the lateral slit pieces, and are vertically erected so as to be relatively upstream relative to the centers of the lower punches 22a and 22b.

The second slit pins 28a to 28d (horizontal slit forming means) are perpendicular to the vertical slits formed by the first slit pins 26a to 26d, and two or more horizontal slit pieces arranged in a straight line. And for forming at least one lateral slit piece, the lateral slit communicating with the longitudinal slit. The number of horizontal slit pieces constituting the horizontal slit may be 2 or more,
It is not particularly limited.

In this embodiment, a total of 4 horizontal slits are formed so that horizontal slits composed of 4 horizontal slit pieces are formed.
The individual second slit pins 28a to 28d are used. Moreover, these 2nd slit pins 28a-28d are 1st
The slit pins 26a and 26c and the first slit pin 2
It is erected in a line between 6b and 26d.

Of these, the second slit pin 28a at the left end has a long length so that the left end of the horizontal slit piece punched out by the second slit pin 28a communicates with the vertical slit formed by the first slit pins 26a and 26b. Is determined. Similarly, the second slit pin 28d at the right end
The length is determined so that the right end of the horizontal slit piece punched by this communicates with the vertical slit formed by the first slit pins 26c and 26d.

Further, the intermediate second slit pins 28b and 28c respectively have second slit pins 28a to 28c.
The length of the connecting portion between the lateral slit pieces formed by d is determined so that the connecting portion has a predetermined length. The length of the connecting portion between the lateral slit pieces is not particularly limited, but is preferably 1 to 2 times the board thickness of the printed wiring board. If the length of the connecting portion is less than 1 time the thickness of the printed wiring board, the strength of the connecting portion will be reduced, which is not preferable. On the other hand, if the length of the connecting portion exceeds twice the thickness of the printed wiring board, it is difficult to break the connecting portion, which is not preferable. The length of the connecting portion is more preferably 1.3.
It is more than double and less than 1.7 times.

In addition, each first slit pin 26a-26b
As shown in FIG. 1 (b), has a horizontal portion at its lower end, and this horizontal portion is inserted into a counterbore hole provided on the upper surface of the lower die base plate 22 and bolted to lower the lower portion. It is fixed to the mold base plate 22. 2nd slit pin 2
Although not shown, 8a to 28d are also fixed to the lower die base plate 22 by similar means.

The method of fixing the first slit pins 26a to 26d and the second slit pins 28a to 28d is not limited to this, and the lower die base plate 22 is provided with a countersunk hole to form a lower die base. You may insert and fix a slit pin from the lower surface of the plate 22.

The lower die stripper 24 has a lower punch 22.
a, 22b, first slit pins 26a to 26d and second
Through holes are provided at positions corresponding to the slit pins 28a to 28d, respectively, and the lower die stripper 24 is vertically movable along the side wall surfaces of these through holes.

The lower die stripper 24 is provided with a plurality of bolts 30 and 3 which are loosely inserted from below the lower die base plate 22.
.. is restricted from moving upward, and is urged upward by elastic members 32, 32 ... Inserted between the lower mold base plate 22 and the lower mold stripper 24.
The material of the elastic members 32, 32 ... Is not particularly limited, but urethane rubber is mentioned as a suitable example.

Further, post guiding holes 24a, 24a ... For guiding the posts 78, 78 ... Provided in the upper mold 50 are provided at four corners of the lower mold stripper 24.
Similarly, post guide holes 22c, 22c ... Are provided at corresponding positions of the lower die base plate 22.

On the upper surface of the lower die stripper 24, on the left side of the lower punch 22a and on the right side of the lower punch 22b, positioning pins 34a and 34b used for positioning during pushback processing are erected. There is. Also,
On the upstream side of the positioning pins 34a and 34b, positioning pins 34c and 34d are provided upright at positions corresponding to the transport distance of the printed wiring board. Further, on the upper surfaces of the lower punches 22a, 22b, component hole forming holes 36, 36 ... For forming component holes in the printed circuit board.
Is provided.

As shown in FIG. 2, the upper die 50 is provided with an upper die base plate 52 and four holders 54a to 54d. The upper die base plate 52 and the holders 54a to 54d are
The knock pins 56 erected on the upper mold base plate 52 are stacked as a reference and fastened by a plurality of fastening bolts 58.

Further, slide spaces 62, 62 are provided in the holder 54d located at the extreme end of the upper die 50,
In the slide spaces 62, 62, upper die strippers 60a for punching the printed circuit board,
60b is loosely inserted. Upper die strippers 60a and 60
b are lower punches 22a provided on the lower die 20, respectively.
And 22b.

Upper die strippers 60a, 60b
Is a bolt 6 that is loosely inserted from above the holder 54c so that its tip slightly projects from the surface of the holder 54d.
Are supported by 4, 64 ... And are restricted from moving downward. Further, the bolts 64, 64 ... Are vertically movable along a through hole 66 provided in the holder 54b.

The pressing pins 68, 68 ... Are for pressing the upper die strippers 60a, 60b downward.
The holders 54b and 54c are loosely inserted into through holes that vertically penetrate the holders 54b and 54c. One end of the upper die stripper 60a, 60
It contacts the upper surface of b and the other end thereof contacts the lower surface of the pressing plate 72 arranged in the central space 70 of the holder 54a.

The pressing plate 72 is for pressing the pressing pins 68, 68 ... Downward. The elastic members 76, 76 ... Are inserted between the upper surface of the pressing plate 72 and the cap bolts 74, and the elastic members 76, 76 ... Energize the pressing plate 72 downward. Elastic members 76, 76 ...
The material of is not particularly limited, but urethane rubber is mentioned as a suitable example.

Posts 78 are provided at the four corners of the holder 54d at positions corresponding to the post guide holes 24a ... 22c provided in the lower mold 20. Post 78, 7
8 are used for positioning the lower die 20 and the upper die 50 during pressing. Further, on the lower surface of the holder 54d, the positioning pins 34a to 34d that are erected on the lower mold 20 are provided.
Positioning pin guide holes 80 at the positions corresponding to
a to 80d are provided.

Further, component hole forming pins 82, 82 ... Are provided at positions corresponding to the component hole forming holes 36, 36 ... Formed on the upper surfaces of the lower punches 22a, 22b. These tips are loosely inserted into the through holes provided in the upper die strippers 60a and 60b, and
0a and 60b move upward along the slide spaces 62 and 62, the upper die strippers 60a and 60b
It is designed to stick out from the bottom surface of the.

Further, at the positions corresponding to the first slit pins 26a to 26d provided upright on the lower die 20, respectively,
First guide holes (vertical slit forming means) 84a to 84d are provided. The first guide holes 84a to 84d are for guiding the tips of the first slit pins 26a to 26d, and have a length that penetrates the holders 54b to 54d.

Further, the holder 54a has a first guide hole 84.
a, 84b, and a first cut waste discharge path 86a that horizontally penetrates the upper mold 50 along the longitudinal direction of its cross section, and communicates with the tips of the first guide holes 84c, 84d. In addition, a first cut waste discharge path 86b that horizontally penetrates the upper mold 50 is provided along the longitudinal direction of the cross section. Further, a nozzle (first nozzle) for supplying air is provided at one end of each of the first cut waste passages 86a and 86b.
Air supply means) 88a, 88b are provided.

The second slit pin 2 provided upright on the lower mold 20.
Second guide holes (lateral slit forming means) 90a to 90d are provided at positions corresponding to 8a to 28d, respectively. The second guide holes 90a to 90d are used for the second slit pin 2
It is for guiding the tips of 8a to 28d, and has a length that penetrates the holders 54c and 54d.

The holder 54b has a second guide hole 90.
A second cut waste discharge path 92 is provided which communicates with the tips of a to 90d and which penetrates the upper mold 50 in the horizontal direction along the longitudinal direction of its cross section. That is, the length from the bottom surface of the upper die 50 to the second cut waste passage 92 is shorter than the length from the bottom surface of the upper die 50 to the first cut waste passages 86a and 86b. 2 cut waste passage 9
2 and the first cut waste discharge paths 86a and 86b are crossed three-dimensionally. Further, the second cut waste discharge path 92
At once, a nozzle (second air supply means) 94 for supplying air is provided.

Next, pushback processing of a printed circuit board using the mold 1 for processing a printed wiring board according to the present embodiment will be described. FIG. 3 shows the process chart.
First, as shown in FIG. 3A, the printed wiring mother board 10 is placed on the upper surface of the lower mold 20. At this time, the positioning of the printed wiring mother board 10 is performed by inserting the positioning pins 34a to 34d into the pushback reference holes 12 provided in the printed wiring mother board 10.

At this time, the component hole forming holes 36, 36, ... Provided in the lower punches 22a, 22b are cut out 37 by the component hole forming pins 82, 82 ... In the previous pressing step. , 37 ... are jammed. Similarly, the first guide hole 84a provided in the upper mold 50
Are in a state in which the scraps 85, 85 ... Punched in the previous pressing step are clogged by the first slit pin 26a. Although not shown, the other first guide holes 84b to 84d and the second guide holes 90a to 90d are in the same state as the first guide hole 84a.

When the upper die 50 is lowered from such a state, the lower punch 22a pushes upward the upper die strippers 60a and 60b against the biasing force of the elastic member 76. As a result, the printed circuit board 14 is punched out from the printed wiring board 10.

Further, as the upper die stripper 60a slides upward, the component hole forming pins 82 project from the lower surface of the upper die stripper 60a. As a result, the component hole forming pin 82 penetrates the printed wiring board 10 and the component hole 16 is formed in the printed circuit board 14. Further, the cut dust 37 ′ punched at this time is pushed into the component hole forming hole 36, so that the cut dust 37 ″ at the lowermost end of the component hole forming hole 36 is pushed out from the lower surface of the lower die base plate 22. .

On the other hand, as the upper die stripper 60a slides upward, the holder 54d pushes the lower die stripper 24 downward against the urging force of the elastic member 32, so that the first slit pin 26a moves downward. Stripper 2
Stick out from the upper surface of 4. As a result, the first slit pin 2
6a penetrates the printed wiring mother board 10 to form vertical slit pieces on the printed wiring mother board 10.

Also, the scrap 8 punched at this time
5'is pushed into the first guide hole 84a, so that the cut residue 85 '' at the uppermost end of the first guide hole 84a.
Is discharged to the first cut waste discharge path 86a. Therefore, if air is blown from the nozzle 88a provided at one end of the first cut waste discharge path 86a at this time, the cut waste 85 ″ is blown off and discharged from the upper mold 50. Other first guide holes 84b to 84d and second guide holes 90a to 9
Although not shown, the cut waste clogged in 0d is also discharged from the upper mold 50 by a similar method.

When the upper die 50 is lifted after the pressing is completed,
The biasing force of the elastic member 76 is transmitted to the upper mold stripper 60a via the pressing plate 72 and the pressing pin 68, and pushes the upper mold stripper 60a downward. At the same time, the elastic member 32 pushes the lower die stripper 24 upward. Therefore, the punched printed circuit board 14
However, it is fitted into the original hole of the printed wiring board 10.

Next, a method of manufacturing a mounting substrate (working plate) using the printed wiring mother board working die 1 according to the present embodiment will be described. 4 and 5 show a process drawing of the press working. First, as shown in FIG. 4 (a), the positioning pins 34a, 34b erected on the lower mold 20 are inserted into the pushback reference holes 12, 12 ... Formed at the front end of the printed wiring board 10. .

In addition to the pushback reference holes 12, 12 ... In the printed wiring mother board 10, a reference hole 17a and a sub reference hole 17 which serve as a reference when electronic components are automatically mounted.
Although it is desirable to form b in advance, these may be formed after the mounting substrate (working plate) 18 is cut out from the printed wiring board 10.

When the first press is performed in this state, the lower pad
The printed circuit board 1 in the first row by the punches 22a and 22b.
Four₁, 14₁Push back processing and parts hole 16₁,
16 ₁The perforation is performed. Also, at the same time,
Circuit board 14₁, 14₁In front of the second slit
28a to 28d, the horizontal slit element 10 in the first row
0a₁~ 100d₁Is punched out. In addition, print
Circuit board 14₁, 14₁On the sides of the
The first vertical slit element 1 by the contact pins 26a and 26c.
02a₁, 102b₁Is punched out.

Next, as shown in FIG. 4B, the printed wiring board 10 is transported forward by a transport distance corresponding to the length between the positioning pins 34a-34c (or 34b-34d). The positioning pins 34a to 34d are reinserted into the next pushback reference holes 12, 12 ...

Next, when the second pressing is performed, as shown in FIG.
As shown in (c), 2 column of printed circuit board ₁₄ 2,
And pushback processing 14 _2, Accessory holes ₁₆ 2, 16 ₂
The perforation is performed. At the same time, the second column of the printed circuit board ₁₄ 2, 14 ₂ of the front and side, respectively, the second row of horizontal slits piece 100a ₂ ～100D ₂
And the first vertical slit pieces 102a ₂ and 102b ₂ are newly punched. Further, the first slit pins 26c, 2
6d allows the second vertical slit pieces 104a ₂ and 104
b ₂ is newly punched.

In the present embodiment, as described above, there is a predetermined relationship regarding the lengths of the first slit pins 26a to 26d and their relative positions.
Therefore, as shown in FIG. 4C, the first vertical slit piece 102a ₁ punched out in the first pressing step.
And 102b ₁ are second vertical slit pieces 104a ₂ and 1 punched out in the second pressing step, respectively.
04b ₂ extends to the upstream side, and a horizontal slit element 1
It communicates with the left end of 00a ₁ and the right end of the lateral slit piece 100d ₁ .

At the same time, the left end of the lateral slit piece 100a ₂ and the right end of the lateral slit piece 100d ₂ formed during the second press were formed during the first press. It communicates with the rear ends of the first vertical slit pieces 102a ₁ and 102b ₁ .

Hereinafter, when the same steps are sequentially repeated, FIG.
As shown in (a), vertical slits 102, 102 are formed on both sides of the printed wiring board 10 so as to be parallel to the carrying direction and continuous. In addition, the k-th printed circuit board 14 _k and the k + 1-th printed circuit board 14
_{Between k + 1} , a horizontal slit 100 _{k + 1} which is perpendicular to the transport direction and discontinuous is formed.

Finally, as shown in FIG.
Push-back reference formed at the end of wiring board 10
Insert the positioning pins 34c, 34d into the holes 12, 12,
Press n times. This allows the printed wiring board
At the end of 10, a lateral slit piece 100a_n~ 100d
_nNth lateral slit 100 consisting of_nIs formed.
Also, the horizontal slit element 100a_nLeft edge and 100d_n
The right edge of each is the previous ((n-1) th) press
First vertical slit piece 102a formed in the process
_n-1And 102d_n-1Communicate with the rear end of. further,
With the first slit pins 26b and 26d, the n-th
2 vertical slit pieces 104a_nAnd 104b _nPunched out
As a result, continuous vertical slits 102, 102 are obtained.

[0060] Thereafter, the printed wiring mother board 10 of the first column, which is formed at the uppermost end and the coupling portion of the lateral three slits 100 _1, the printed wiring mother board 10 of the n-th column which are formed at the lowermost end of the If the connecting portions of the lateral slits 100 _n are broken, as shown in FIG. 5C, a predetermined number of push-back processed printed circuit boards 14, 14, ... Are included and are substantially rectangular. The mounting substrate (working plate) 18 is obtained.

When the connecting portion of the lateral slits is broken, some burrs remain. However, the mounting substrate 18
The position of the connecting portion is required because at least one side that is a complete straight line and at least one side that is orthogonal to this and partially has a straight line portion are required to mount If is optimized, burr will not be a problem.

The printed wiring mother board 10 may be slightly larger than the mounting substrate 18, and one mounting substrate 18 may be cut out from one printed wiring mother board 10. Alternatively, the printed wiring board 10 having a length that is an integral multiple of the mounting board 18 + α may be used. In this case, after performing the push-back process continuously, the connecting portions of the lateral slits are broken at a predetermined cycle to take out a plurality of mounting boards 18 from one printed wiring board 10. Therefore, there are advantages that the material yield is high and the workability is improved.

As described above, according to the mold 1 for processing a printed wiring board according to the present embodiment, the printed circuit board 14 is
The vertical slits 102 and 1
02 and lateral slits 100 ... And these vertical slits 102, 102 and lateral slits 100 ...
As it is, it becomes the reference side of the mounting substrate. Therefore, a die for cutting the outer shape is unnecessary, and the die cost can be significantly reduced. Further, since it is not necessary to separately provide an outer shape cutting step for producing the mounting board, the number of steps is reduced and the workability is improved.

Further, the discontinuous lateral slits formed between the printed circuit boards 14, 14 ... In addition to the function of holding the punched printed circuit boards 14, 14 ... It has a function of relieving the uneven stress introduced into the wiring mother board 10. for that reason,
It is possible to obtain a mounting board with extremely small warpage.

Further, two first slit pins 26a, 26b (or, along the carrying direction of the printed wiring board 10) (or,
The first slit pins 26c, 26d) are erected in a row, and by using the means for forming continuous vertical slits by sequentially forming vertical slit pieces, push to the end of the printed wiring board. It can be used for back processing and improves the material yield.

Further, at the same time as the pushback processing of the printed circuit board 14, the first vertical slit pieces 102a, 10
2b, when forming the second vertical slit pieces 104a, 104b and the horizontal slit pieces 100a to 100d, if all the slit pins for forming the vertical slit pieces and the horizontal slit pieces are provided on the upper mold 50, Elastic members 32, 32, ... For biasing the lower die stripper 24 upward.
However, it may not be able to withstand the pressing force of the slit pin and may not be able to punch through the slit.

On the other hand, as shown in FIG. 1, when the slit pins are erected on the lower die 20, even if the number of slit pins is large and the total cross-sectional area of the slit pins is relatively large, The slit can be punched in.

Further, cut waste discharge paths 86a, 86b, 92 are provided to horizontally penetrate the upper mold 50, and further air supply means 88a, 88b, 94 are provided at one end of the cut waste discharge paths 86a, 86b, 92. Then, the scraps punched by the slit pin can be easily discharged from the upper mold 50.

Further, the first cut dust discharge paths 86a and 86b for discharging cut dust generated by punching out the vertical slit pieces and the second cut dust discharge paths for discharging cut dust generated by punching out the horizontal slit pieces. When the cut waste discharge path 92 is crossed over in the upper mold 50,
Since the air supplied from the air supply means 88a and 88b and the air supplied from the second air supply means 94 do not interfere with each other, the scraps can be discharged smoothly.

Next, a mold for processing a printed wiring mother board according to the second embodiment of the present invention will be described. Although not shown, the mold for processing a printed wiring board according to the present embodiment has a length longer than the carrying distance of the printed wiring board per press on at least one side of the printed circuit board. A third vertical slit element forming means for forming the vertical slit element is provided.

Specifically, in the mold 1 for processing a printed wiring board shown in FIGS. 1 and 2, the first slit pins 26b and 26d that are erected on the upstream side are removed and the first slit pins 26b and 26d are erected on the downstream side. The length of the formed first slit pins 26a and 26c may be longer than the transport distance of the printed wiring board 10 per press. Other configurations are shown in FIGS.
Since it is the same as the printed wiring board mother die 1 shown in FIG.

Next, a method of manufacturing a processed plate using the mold for processing a printed wiring board according to the present embodiment will be described. In the following description, the names of each part of the mold are
The names and reference numerals used in FIGS. 1 and 2 are used as they are.

6 and 7 are process diagrams of the press working. First, as shown in FIG. 6A, a pushback reference hole 12 formed at the front end of the printed wiring board 10,
12, a positioning pin 34a that is erected on the lower mold 20,
34b is inserted.

When the first press is performed in this state, the lower pad is pressed.
The printed circuit board 1 in the first row by the punches 22a and 22b.
Four₁, 14₁Push back processing and parts hole 16₁,
16 ₁The perforation is performed. Also, at the same time,
Circuit board 14₁, 14₁In front of the second slit
28a to 28d, the horizontal slit element 10 in the first row
0a₁~ 100d₁Is punched out. In addition, print
Circuit board 14₁, 14₁On the sides of the
The third vertical slit piece 1 by the contact pins 26a and 26c.
06a₁, 106b₁Is punched out.

The printed wiring mother board 10 is previously
When the reference hole 17a is provided, the reference hole 17a is formed as shown in FIG.
As shown in (a), the first-row printed circuit board 14₁,
14 ₁Formed by the second press, not on the side of
To be formed on the side of the printed circuit board in the second row
preferable. This point will be described later.

Next, as shown in FIG. 6B, the printed wiring board 10 is transported forward by a transport distance corresponding to the length between the positioning pins 34a-34c (or between 34b-34d). The positioning pins 34a to 34d are reinserted into the next pushback reference holes 12, 12 ...

Next, when the second pressing is performed, as shown in FIG.
As shown in (c), 2 column of printed circuit board ₁₄ 2,
And pushback processing 14 _2, Accessory holes ₁₆ 2, 16 ₂
The perforation is performed. At the same time, the second column of the printed circuit board ₁₄ 2, 14 ₂ of the front and side, respectively, the second row of horizontal slits piece 100a ₂ ～100D ₂
And the third vertical slit pieces 106a ₂ and 106b ₂ are newly punched.

In the present embodiment, as described above, the length of the first slit pins 26a and 26c is longer than the carrying distance of the printed wiring board 10. Therefore, as shown in FIG. 6C, the rear ends of the third vertical slit pieces 106a ₁ and 106b ₁ formed by the first press are the third vertical slits formed by the second press, respectively. The tips of the element pieces 106a ₂ and 106b ₂ overlap with each other to form continuous vertical slits 102, 102.

Also, the second slit pins 28a and 28d
The left end of the lateral slit piece 100a ₂ and the right end of the lateral slit 100d ₂ punched by are respectively connected to the rear ends of the third vertical slit pieces 106a ₁ and 106b ₁ formed by the first press.

Thereafter, when the same steps are sequentially repeated, FIG.
As shown in (a), vertical slits 102, 102 are formed on both sides of the printed wiring board 10 so as to be parallel to the carrying direction and continuous. In addition, the k-th printed circuit board 14 _k and the k + 1-th printed circuit board 14
_{Between k + 1} , a horizontal slit 100 _{k + 1} which is perpendicular to the transport direction and discontinuous is formed.

Finally, as shown in FIG. 7B, the pushback reference holes 12, 12 formed at the ends of the printed wiring board 10 are inserted into the positioning pins 34c, 34d,
Press n times. Thereby, the lateral slit pieces 100a _{n to} 100d are provided at the ends of the printed wiring board 10.
_{An nth} lateral slit 100 _n consisting of n is formed.
In addition, the left end of the lateral slit element 100a _n and 100d _n
The right ends of the third vertical slit pieces 106a formed in the previous ((n-1) th) pressing step.
_It communicates with the rear ends of _n-1 and 106d _n-1 .

After this, a shape is formed on the upper end of the printed wiring board 10.
Second row horizontal slit 100 made _Two3 connecting parts
And the n-th row formed at the bottom end of the printed wiring board 10.
Side slit 100_nBreak the three connecting parts
For example, as shown in Fig. 7 (c), pushback processing is performed.
A predetermined number of printed circuit boards 14, 14 ...
The mounting substrate (working plate) 18 that is substantially rectangular is
can get.

The connecting portion of the horizontal slits 100 _{2 in} the second row is broken to form the mounting substrate 18 so that the tips of the vertical slits 102 and 102 are respectively the horizontal slit pieces 1.
This is because they are not completely connected to 00a ₁ and 100d ₁ . The connecting portion of the vertical slits 102, 102 and the horizontal slit pieces 100a ₁ and 100d ₁ is broken to form the mounting board 18, because a burr remains on the vertical side of the mounting board 18 and is not a complete straight line. It is not preferable.

[0084] However, after breaking the connecting portion of the longitudinal slits 102 upper, when removing burrs by machining may be the mounting substrate 18 by breaking the connecting portion of the lateral slit 100 ₁ of the first column . Further, in such a case, the reference hole 17a is formed on the printed circuit board 14 _{1 in the} first row.
It should be formed on the side of.

The printed wiring board 10 may be slightly larger than the mounting board 18, or
Similar to the first embodiment, a printed wiring mother board having a length that is an integral multiple of the mounting substrate 18 + α may be used.

As described above, according to the mold for processing a printed wiring board according to the present embodiment, the vertical slits 102, 10 are formed at the same time as the pushback processing of the printed circuit board 14.
Since the two and the lateral slits 100 ... Are formed, a die for contour cutting and a separate step for contour cutting are unnecessary.

Further, due to the discontinuous lateral slits formed between the printed circuit boards 14, 14, ..., Uneven stress introduced into the printed wiring board 10 is relieved, and a mounting board with extremely little warpage is obtained. Obtainable.

Furthermore, the mold for processing the printed wiring mother board according to the present embodiment using one first slit pin is 2
Although the material yield is slightly lower than that of the mold using the individual second slit pins, the number of parts of the mold is reduced and the cost of the mold can be further reduced.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments and various modifications can be made without departing from the gist of the present invention. is there.

For example, in the above embodiment, the case where two first slit pins are erected in parallel to the carrying direction of the printed wiring board 10 and the case where one first slit pin is erected. Although the case has been described, the number of the first slit pins is not limited to this, and three or more first slit pins are erected upright along the transport direction, and continuous vertical slits are formed using these. It may be formed.

Further, in the above-mentioned embodiment, the first slit pin is provided upright on both sides of the two lower punches arranged in a line, but the first slit pin is provided on either the right side or the left side. It may be upright.

Further, in the above embodiment, the linear first slit pin for forming the vertical slit piece is used, but the cross section of the first slit pin is L-shaped or T-shaped, The first slit pin may form a vertical slit piece and a horizontal slit piece communicating with the vertical slit piece.

In the above embodiment, the first slit pins 26a-26d and the second slit pins 28a-28 are used.
Although all d are erected on the lower die 20, all or a part of these slit pins may be provided on the upper die as long as they do not hinder the punching of the slits.

Further, in the above embodiment, the second slit pins for forming the lateral slit pieces are all provided upright in front of the lower punch, but these are placed behind the lower punch (in the carrying direction). Alternatively, it may be installed on the downstream side). Alternatively, a part of the second slit pin may be erected in front of the lower punch and the other part may be erected in the rear of the lower punch. Furthermore, even if the mold has only the vertical slit forming means,
At least one reference straight line can be formed at the same time as the pushback, and the other side intersecting with the reference straight line is formed by using a general-purpose processing method (for example, perforation processing, shirring, etc.). Since it can be formed, the outer shape cutting process can be significantly simplified as compared with the conventional method.

[0095]

According to the method of manufacturing a printed wiring board mother die and a working board according to the present invention, since continuous vertical slits are formed on at least one side of the pushed back printed circuit board. There is an effect that the contour cutting can be simplified. Further, when the horizontal slit forming means is provided, since a discontinuous horizontal slit is formed between the printed circuit boards in a direction perpendicular to the vertical slits, it is only necessary to break the connecting portion of the horizontal slits to form the processed board. Therefore, there is an effect that a die for contour cutting and a separate step for contour cutting are unnecessary.

Further, two vertical slit forming means, that is, a first vertical slit forming means and a second vertical slit forming means are provided along the conveying direction of the printed wiring board, and each vertical slit piece formed by these is formed. When the continuous vertical slits are formed by making them communicate with each other, there is an effect that the material yield is improved.

When the vertical slit forming means is capable of forming a third vertical slit piece having a length longer than the conveying distance of the printed wiring board per press, the number of parts of the mold is reduced. Is reduced, and the die cost can be further reduced.

Further, when the first slit pin for forming the vertical slit piece and / or the second slit pin for forming the horizontal slit piece is erected on the lower die, when the number of slit pins is large, Alternatively, even if the cross-sectional area of the slit pin is relatively large, the slit can be reliably punched out.

Further, when the slit pin is erected on the lower die, if the cut dust discharge passage that horizontally penetrates the upper mold is provided and the air supply means is provided at one end of the cut dust discharge passage, the slit pin is provided. This has the effect of facilitating the discharge of the scraps punched out by.

[Brief description of drawings]

FIG. 1 (a) is a plan view of a lower die of a mold for processing a printed wiring board according to a first embodiment of the present invention, and FIG. 1 (b) is a BB thereof. 'Line cross-section, Figure 1 (c)
FIG. 11 is a cross-sectional view taken along the line CC ′.

FIG. 2 (a) is a front view of an upper die of a printed wiring mother board processing die according to the first embodiment of the present invention, and FIG. 2 (b) is a bottom view thereof. is there. Also, FIG.
The left side of (a) is a cross-sectional view taken along the line AA ′ of FIG.

FIG. 3 is a process drawing of pushback processing using the printed wiring mother board processing die shown in FIGS. 1 and 2.

FIG. 4 is a process diagram showing a method of manufacturing a processed plate using the mold for processing a printed wiring board shown in FIGS. 1 and 2.

FIG. 5 is a continuation of the process diagram shown in FIG.

FIG. 6 is a process diagram showing a method of manufacturing a processed plate using a mold for processing a printed wiring board according to the second embodiment of the present invention.

7 is a continuation of the process diagram shown in FIG.

FIG. 8 is a process diagram showing a conventional method for processing a printed wiring board.

[Explanation of symbols]

1 Mold for printed wiring mother board processing 10 printed wiring board 14 printed circuit board 18 Mounting board (processing board) 20 Lower mold 26a-26d 1st slit pin 28a-28d 2nd slit pin 50 Upper mold 84a-84d 1st guide hole 86a, 86b First cut waste discharge path 88a, 88b nozzles (first air supply means) 90a to 90d Second guide hole 92 Second cut waste discharge path 94 nozzles (second air supply means) 100 horizontal slits 100a-100d horizontal slit pieces 102 vertical slit 102a, 102b First vertical slit piece 104a, 104b 2nd vertical slit element 106a, 106b Third vertical slit element

Front page continued (58) Fields surveyed (Int.Cl. ⁷ , DB name) B26F 1/14 H05K 3/00

Claims (12)

(57) [Claims] 1. A push-back means for punching a printed circuit board from a printed wiring board and fitting the punched printed circuit board into the original hole, and at least one side of the punched printed circuit board. , By sequentially forming vertical slit pieces parallel to the carrying direction of the printed wiring board,
A mold for processing a printed wiring mother board, comprising a vertical slit forming means for forming a continuous vertical slit that serves as a reference side . 2. The vertical slit forming means forms, on at least one side of the printed circuit board, a first vertical slit piece having a length shorter than a transport distance of the printed wiring board per press. And a second vertical slit piece forming means for forming a second vertical slit piece for communicating between the adjacent first vertical slit pieces already formed. The mold for processing a printed wiring board according to claim 1, which is provided. 3. The vertical slit forming means forms, on at least one side of the printed circuit board, a third vertical slit piece having a length longer than a conveying distance of the printed wiring board per press. The mold for processing a printed wiring mother board according to claim 1, which is a third vertical slit piece forming means for. 4. The vertical slit forming means includes a first slit pin standing on a lower die for forming the vertical slit piece, and a tip of the first slit pin provided on the upper die. 2. A first guide hole for guiding,
The mold for processing a printed wiring mother board according to 2 or 3. 5. A first cut waste discharge path communicating with the upper end of the first guide hole and horizontally penetrating the upper mold along the longitudinal direction of the cross section of the first guide hole, The mold for processing a printed wiring mother board according to claim 4, further comprising a first air supply means provided at one end of the one- cut waste discharge path. 6. A front or rear side of the punched printed circuit board, which is composed of two or more horizontal slit pieces that are perpendicular to the vertical slits and are aligned in a straight line, and
The mold for processing a printed wiring board according to any one of claims 1 to 5, further comprising a lateral slit forming means for forming a lateral slit in which at least one of the lateral slit pieces communicates with the vertical slit. . 7. The lateral slit forming means includes a second slit pin that is provided upright on a lower die for forming the lateral slit element, and a tip of the second slit pin provided on the upper die. The mold for processing a printed wiring mother board according to claim 6, further comprising a second guide hole for guiding. 8. A second cut waste discharge path communicating with the upper end of the second guide hole and horizontally penetrating the upper mold along the longitudinal direction of the cross section of the second guide hole, The mold for processing a printed wiring mother board according to claim 7, further comprising a second air supply unit provided at one end of the 2-cut waste discharge path. 9. The length from the bottom surface of the upper mold to the second cut waste discharge path is shorter than the length from the bottom surface of the upper mold to the first cut waste discharge path.
A mold for processing a printed wiring mother board according to. 10. The lateral slit has a length of a connecting portion between the lateral slit pieces which is equal to a plate thickness of the printed wiring board.
The mold for processing a printed wiring board according to any one of claims 6 to 9, wherein the mold is at least twice and at most twice. 11. A push-back step of punching a printed circuit board from a printed wiring board and fitting the punched printed circuit board into an original hole, and at least one side of the punched printed circuit board, By sequentially forming vertical slit pieces parallel to the conveyance direction of the printed wiring board,
A method of manufacturing a machined plate, comprising a vertical slit forming step of forming continuous vertical slits serving as reference sides . 12. A front or rear side of the punched printed circuit board, which is composed of two or more horizontal slit pieces that are orthogonal to the vertical slits and are aligned in a straight line, and
The method for manufacturing a processed plate according to claim 11, further comprising a horizontal slit forming step in which at least one of the horizontal slit pieces forms a horizontal slit that communicates with the vertical slit.