JP3443553B2 - Electrode for electrolytic capacitor and method for manufacturing the same - Google Patents
Electrode for electrolytic capacitor and method for manufacturing the sameInfo
- Publication number
- JP3443553B2 JP3443553B2 JP2000090533A JP2000090533A JP3443553B2 JP 3443553 B2 JP3443553 B2 JP 3443553B2 JP 2000090533 A JP2000090533 A JP 2000090533A JP 2000090533 A JP2000090533 A JP 2000090533A JP 3443553 B2 JP3443553 B2 JP 3443553B2
- Authority
- JP
- Japan
- Prior art keywords
- valve metal
- electrode
- electrolytic capacitor
- sintered
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Powder Metallurgy (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、細孔を有する弁金
属の多孔体が弁金属箔に接合された電極であって、該電
極が細孔内面に誘電膜を形成し且つ細孔内に電解質を充
填して電解コンデンサに利用される電解コンデンサ用の
電極とその製造方法に関する。TECHNICAL FIELD The present invention relates to an electrode in which a porous body of valve metal having pores is bonded to a valve metal foil, the electrode forming a dielectric film on the inner surface of the pore and BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode for an electrolytic capacitor that is filled with an electrolyte and used for an electrolytic capacitor, and a method for manufacturing the same.
【0002】[0002]
【従来の技術】現在、電解コンデンサは、小型かつ大容
量が要求されている。たとえば、電解コンデンサを電源
平滑回路の2次側に使用してパーソナルコンピュータの
CPU周辺等に利用する用途では、電解コンデンサは、
高周波特性に優れて且つ大電流を流せるものであること
も求められる。2. Description of the Related Art Currently, electrolytic capacitors are required to have a small size and a large capacity. For example, in an application where an electrolytic capacitor is used on the secondary side of a power supply smoothing circuit and used around the CPU of a personal computer, the electrolytic capacitor is
It is also required to have excellent high-frequency characteristics and to be able to flow a large current.
【0003】この小型大容量化の要求に応じるため、電
解コンデンサに利用されるコンデンサ用電極には様々な
工夫がなされてきた。例えば、アルミ電解コンデンサ
は、通常エッチングによる表面積拡大処理を施されたア
ルミニウム箔を電極として利用するが、エッチング倍率
を高くすることにより、より微細な細孔が形成された金
属箔を電極として利用することが提案されている。この
ような電極に誘電膜を形成すると、細孔の表面にまで誘
電膜が形成され、誘電膜の面積を広くすることができ
る。従って、コンデンサの静電容量は増加する。In order to meet the demand for smaller size and larger capacity, various ideas have been made for capacitor electrodes used in electrolytic capacitors. For example, an aluminum electrolytic capacitor normally uses an aluminum foil that has been subjected to surface area enlargement treatment by etching as an electrode, but by increasing the etching rate, a metal foil with finer pores is used as an electrode. Is proposed. When a dielectric film is formed on such an electrode, the dielectric film is formed even on the surface of the pores, and the area of the dielectric film can be increased. Therefore, the capacitance of the capacitor increases.
【0004】また、タンタル電解コンデンサは、タンタ
ルの微細粉を焼結した弁金属多孔体を電極に利用する。
弁金属多孔体である電極は細孔を有するものであるか
ら、弁金属多孔体の比表面積は大きい。このような電極
に誘電膜を形成すると、細孔にまで誘電膜が形成され、
面積の広い誘電膜が形成される。このようにして、細孔
表面における静電容量を確保することにより、コンデン
サの静電容量を増大させてきた。Further, the tantalum electrolytic capacitor uses a valve metal porous body obtained by sintering fine powder of tantalum as an electrode.
Since the valve metal porous body has pores, the specific surface area of the valve metal porous body is large. When a dielectric film is formed on such an electrode, the dielectric film is formed even in the pores,
A large-area dielectric film is formed. In this way, the capacitance of the capacitor has been increased by ensuring the capacitance on the surface of the pores.
【0005】電極用の弁金属としてはタンタル、アルミ
ニウム、チタン、ニオブなどが知られており、これら金
属の微粉末から形成されるコンデンサ用電極は、例え
ば、特開昭63−283012号公報、実開昭57−1
38330号公報、実開昭58−187136号公報、
実開昭59−187129号公報などで開示されてい
る。これらの公報等で開示されたコンデンサ用電極の構
造の一例は、図5に示すように、塊状の焼結体12の陽
極にリード線16を埋設して立設してあり、リード線1
6の一端を弁金属の微粉末中に埋め込んで成形体とし、
その成形体を焼結して焼結体にしたものである。Tantalum, aluminum, titanium, niobium, etc. are known as valve metals for electrodes, and electrodes for capacitors formed from fine powders of these metals are disclosed, for example, in Japanese Patent Laid-Open No. 63-283012. Kai 57-1
38330, Japanese Utility Model Laid-Open No. 58-187136,
It is disclosed in Japanese Utility Model Publication No. 59-187129. As shown in FIG. 5, an example of the structure of the capacitor electrode disclosed in these publications is such that the lead wire 16 is embedded in the anode of the lump-shaped sintered body 12 to stand upright.
One end of 6 is embedded in a fine powder of valve metal to form a molded body,
The molded body is sintered into a sintered body.
【0006】一般的なタンタル電解コンデンサの製造方
法は、例えば、静電容量30000μF・V/g相当の
比表面積を有するタンタル金属微細粉を使用して、この
金属微粉末を所定の寸法に圧縮成形し、その成形体を焼
成して弁金属多孔体の陽極を作り、この陽極に誘電膜を
形成し、電解質を充填する方法である。このとき、弁金
属多孔体の細孔内面にも、誘電膜が形成され、続いて電
解質を被覆させる。ついで、公知の方法で陰電極を電解
質に接触させて、取着すると、タンタル電解コンデンサ
が得られる。A general method for producing a tantalum electrolytic capacitor is, for example, that tantalum metal fine powder having a specific surface area corresponding to an electrostatic capacity of 30,000 μF · V / g is used, and this fine metal powder is compression molded to a predetermined size. Then, the molded body is fired to form a valve metal porous body anode, a dielectric film is formed on the anode, and an electrolyte is filled. At this time, a dielectric film is also formed on the inner surfaces of the pores of the valve metal porous body, and subsequently, the electrolyte is coated. Then, the negative electrode is brought into contact with the electrolyte and attached by a known method to obtain a tantalum electrolytic capacitor.
【0007】さらに、より小型かつ大容量のコンデンサ
を作るために、タンタル金属の50000μF・V/g
相当の比表面積の微細粉を使用して、上述した陽電極と
同じ寸法で陽電極を作り、電解質として二酸化マンガン
を用いることにより、さらに、大容量のタンタル電解コ
ンデンサとすることが期待される。Further, in order to make a capacitor having a smaller size and a larger capacity, 50000 μF · V / g of tantalum metal is used.
It is expected that a tantalum electrolytic capacitor having a larger capacity can be obtained by using a fine powder having a considerable specific surface area to form a positive electrode having the same size as the positive electrode described above and using manganese dioxide as an electrolyte.
【0008】[0008]
【発明が解決しようとする課題】しかしながら、上述し
たように50000μF・V/gのタンタル微細粉を使
用してコンデンサ用電極を組立てても、この電極から組
立てたタンタル電解コンデンサの静電容量は、上記容量
の大きい微細粉を用いた割には大きくならず、さらに高
周波特性が悪く、大電流を流すのには好ましくないもの
であった。However, even if a capacitor electrode is assembled using tantalum fine powder of 50,000 μF · V / g as described above, the capacitance of the tantalum electrolytic capacitor assembled from this electrode is Even if the fine powder having a large capacity was used, the powder did not become large, the high-frequency characteristics were poor, and it was not preferable to flow a large current.
【0009】従来の電解コンデンサ用電極の上記問題
は、以下のような原因によるものと考えられた。
(1)従来の電極は、陽電極である弁金属多孔体の細孔
が電解質によって十分に満たされていないことである。
即ち、細孔内面に皮膜された誘電膜には、陰電極の役割
を果たす電解質が十分に被着されず、この場合の誘電膜
はコンデンサの形成に利用されないので、静電容量には
関与し得ない。従って、コンデンサ全体として、所望の
静電容量を得ることができなかった。The above problems of the conventional electrolytic capacitor electrodes were considered to be due to the following causes. (1) The conventional electrode is that the pores of the valve metal porous body, which is the positive electrode, are not sufficiently filled with the electrolyte.
That is, the dielectric film coated on the inner surface of the pores is not sufficiently coated with the electrolyte that plays the role of the negative electrode, and the dielectric film in this case is not used for forming the capacitor, so that it does not contribute to the capacitance. I don't get it. Therefore, it was not possible to obtain a desired capacitance as the entire capacitor.
【0010】(2)陰極である電解質と陰極引出し電極
(通常は、カーボン層、銀導電性樹脂)と接触するべき
接合面積が小さいために、各層間での接触抵抗と各層内
の体積抵抗が大きくなり、言いかえれば、接触面積の大
小を決める多孔体の表面積が充分でなく、細孔の全ての
表面積が有効に利用されていないので、コンデンサの等
価直列抵抗が大きくなり、高周波特性が悪くなってい
た。以上の欠点を克服するには、弁金属多孔体の細孔に
十分に電解質を充填することと、弁金属多孔体の表面積
を増加させ、かつ充分に陰極との接触面に利用すること
が必要である。(2) The contact resistance between each layer and the volume resistance in each layer are small because the joint area to be in contact with the electrolyte which is the cathode and the cathode extraction electrode (usually the carbon layer and the silver conductive resin) is small. In other words, the surface area of the porous body that determines the size of the contact area is not sufficient, and the entire surface area of the pores is not used effectively, so the equivalent series resistance of the capacitor increases and the high frequency characteristics deteriorate. Was becoming. In order to overcome the above drawbacks, it is necessary to sufficiently fill the pores of the valve metal porous body with an electrolyte, increase the surface area of the valve metal porous body, and sufficiently utilize it for the contact surface with the cathode. Is.
【0011】本発明は、以上の知見に基づいて、高周波
特性に優れ、かつ大電流を流すことができる大容量の電
解コンデンサに利用可能な電極を提供しようとするもの
である。さらに、本発明は、そのような特性を発揮し得
る電極を製造する方法を提供しようとするものである。Based on the above findings, the present invention is intended to provide an electrode which is excellent in high frequency characteristics and which can be used for a large capacity electrolytic capacitor capable of flowing a large current. Further, the present invention seeks to provide a method of manufacturing an electrode capable of exhibiting such characteristics.
【0012】[0012]
【課題を解決するための手段】本発明の電解コンデンサ
用の電極は、細孔を有する弁金属多孔体を陽極として弁
金属箔に接合されて電極となし、電極の細孔に誘電膜を
形成し電解質を充填してコンデンサに利用されるもので
あるが、その特徴は、弁金属粉末から形成して複数の成
形体を積層して焼結された焼結体を電極に利用するもの
であり、焼結体は、各成形体に対応する焼結層を積層し
た構造を有するものである。An electrode for an electrolytic capacitor according to the present invention is bonded to a valve metal foil by using a valve metal porous body having pores as an anode to form an electrode, and a dielectric film is formed in the pores of the electrode. It is used for capacitors filled with electrolyte, but the feature is that it uses a sintered body that is formed by laminating a plurality of compacts formed from valve metal powder and then sintered as an electrode. The sintered body has a structure in which sintered layers corresponding to the respective molded bodies are laminated.
【0013】本発明の電極において、焼結体中で互いに
隣合う2つの焼結層の接合界面領域が、焼結層内部より
も密度が低くされており、即ち、接合界面領域の細孔の
径が、焼結された焼結層の内部の細孔の径より大きくさ
れている。電解質の充填の際に、電解質は、積層体外面
に連なる接合界面領域内の大きい寸法の細孔群を伝って
接合界面領域に容易に浸透し、各焼結層の間にある接合
界面領域に浸透した電解質がさらに焼結層内部に小さい
細孔径を伝ってくまなく浸透することができる。このよ
うに、焼結層内部の比較的小さな細孔にも電解質を充分
に充填することができ、コンデンサの容量の効率を上げ
ることができる。これによって、電極は、焼結層に細孔
を有する比表面積をコンデンサの機能に最大限有効に利
用することが可能になる。In the electrode of the present invention, the density of the bonding interface area between two adjacent sintered layers in the sintered body is lower than that of the inside of the sintered layer, that is, the pores in the bonding interface area are The diameter is made larger than the diameter of the pores inside the sintered layer. At the time of filling the electrolyte, the electrolyte easily penetrates into the bonding interface region along the large-sized pores in the bonding interface region continuous with the outer surface of the laminate, and then in the bonding interface region between the respective sintered layers. The permeated electrolyte can further permeate into the sintered layer through the small pore diameter. In this way, the electrolyte can be sufficiently filled even in the relatively small pores inside the sintered layer, and the capacity efficiency of the capacitor can be improved. This allows the electrode to utilize the specific surface area of the sintered layer having pores for the function of the capacitor as effectively as possible.
【0014】このように、本発明の電解コンデンサ用電
極は、1つの弁金属多孔体を多層化し、層境界間に細孔
の大きな部分を設けることにより、電解質の細孔への充
填を容易にし、且つ容量の引き出し効率を向上させる。As described above, the electrolytic capacitor electrode of the present invention facilitates the filling of the electrolyte pores by forming one valve metal porous body in a multi-layer structure and providing a large pore portion between the layer boundaries. In addition, the capacity extraction efficiency is improved.
【0015】本発明は、さらに進めて、電極の焼結体
を、焼結層内の細孔の寸法を変えた2種類の焼結層(即
ち、第1の焼結層と第2の焼結層と)を交互に積層した
積層体とするのがよい。細孔寸法の大きい焼結層(例え
ば、第1の焼結層)は、細孔が大きいので、焼結体表面
から細孔への電解質の充填浸透が容易であり、この第1
の焼結層に隣接する焼結層(例えば、第2の焼結層)が
小さい細孔であっても、第1の焼結層から第2の焼結層
への細孔内への浸透は、浸透距離が短いので比較的生じ
やすく、こうして、細孔への電解質の充填率も高くな
る。In the present invention, the sintered body of the electrode is further processed into two kinds of sintered layers (that is, a first sintered layer and a second sintered layer) in which the size of pores in the sintered layer is changed. It is preferable to form a laminated body in which tie layers and) are alternately laminated. Since the sintered layer having a large pore size (for example, the first sintered layer) has large pores, it is easy to fill and permeate the electrolyte from the surface of the sintered body into the pores.
Even if the sintered layer adjacent to the second sintered layer (for example, the second sintered layer) has small pores, the first sintered layer penetrates into the second sintered layer and penetrates into the pores. Is relatively easy to occur due to its short permeation distance, thus increasing the filling rate of the electrolyte into the pores.
【0016】本発明の電極の製造方法は、弁金属の粉末
から成形された複数の成形体を積層して積層体とする積
層工程と、この積層体を焼結して弁金属多孔体とする焼
結工程とから成るものである。The electrode manufacturing method of the present invention comprises a step of laminating a plurality of compacts formed from valve metal powder to form a laminate, and sintering the laminate to form a valve metal porous body. And a sintering process.
【0017】積層体の隣接する成形体は、焼結工程で、
接合一体されて焼結層となるが、成形体同士の接合界面
領域は、焼結過程で、成形体内部よりも密度が低くな
り、接合界面領域の細孔の径が、焼結された焼結層の内
部の細孔の径より大きくなる。そこで、上述のように、
電解質の充填の際に、電解質は、積層体外面に連なる接
合界面領域内の大きい寸法の細孔群を伝って、さらに、
焼結層内部の小さい細孔径を伝ってくまなく焼結体内部
に浸透することができるのである。Adjacent green bodies of the laminate are subjected to a sintering process,
Although they are integrally joined to form a sintered layer, the density of the joint interface area between the molded bodies becomes lower than that of the inside of the molded body during the sintering process, and the diameter of the pores in the joint interface area is smaller than that of the sintered body. The diameter is larger than the diameter of the pores inside the layer. So, as mentioned above,
During the filling of the electrolyte, the electrolyte propagates through the large-sized pore group in the bonding interface region continuous with the outer surface of the laminate, and further,
It is possible to penetrate the inside of the sintered body through the small pore diameter inside the sintered layer.
【0018】さらに、焼結工程で、複数の成形体を積層
し焼結すると、弁金属多孔体の表面で、相隣接する成形
体間の接合界面付近には、成形体が焼結される過程で収
縮率の違いにより多数の凹部と凸部が発生する(焼結温
度や焼結時間や粉末のグレードや成形密度等の条件によ
り異なるが)。この筋状の凹凸が、弁金属多孔体の表面
積(陰電極との接合面積)が増大し、コンデンサの等価
直列抵抗は低減されるので、高周波特性が向上する。Further, in the sintering step, when a plurality of compacts are laminated and sintered, the compacts are sintered on the surface of the valve metal porous body in the vicinity of the joint interface between adjacent compacts. Due to the difference in shrinkage ratio, a large number of concaves and convexes are generated (although it varies depending on conditions such as sintering temperature, sintering time, powder grade and molding density). These streaky irregularities increase the surface area (joint area with the negative electrode) of the valve metal porous body and reduce the equivalent series resistance of the capacitor, so that high frequency characteristics are improved.
【0019】本発明は、さらに進めて、一つの成形体に
積層すべき複数の成形体を2種類以上に区分して、細孔
の寸法を変えた第1の成形体と第2の成形体とを交互に
積層することにより、焼結後の細孔寸法の異なる第1の
焼結層と第2の焼結層とを形成することもできる。上記
のように、電解質の充填の際には、細孔の寸法の大きい
焼結層(例えば、第1の焼結層)から、これに隣接する
細孔の寸法の小さい焼結層(例えば、第2の焼結層)へ
の電解液の浸透が容易になり、電気容量を高める。The present invention is further advanced to classify a plurality of molded bodies to be laminated on one molded body into two or more kinds, and to form a first molded body and a second molded body having different pore sizes. By alternately stacking and, it is possible to form a first sintered layer and a second sintered layer having different pore sizes after sintering. As described above, at the time of filling the electrolyte, from the sintered layer having a large pore size (for example, the first sintered layer) to the small sintered layer having a small pore size adjacent thereto (for example, The electrolyte solution easily permeates into the second sintered layer) to increase the electric capacity.
【0020】具体的には、焼結層の細孔寸法径を調節す
るために、2種類の成形体( 即ち、第1の成形体と第
2の成形体)は、焼結時に弁金属粉末が熱収縮率の異な
る成形体、成形体密度の異なる成形体、比表面積の異な
る弁金属の粉末からなる成形体、又は、物理的強度の異
なる弁金属の粉末からの成形体が利用できる。Specifically, in order to adjust the pore size and diameter of the sintered layer, the two types of compacts (that is, the first compact and the second compact) are composed of valve metal powder during sintering. Can be a molded product having a different heat shrinkage ratio, a molded product having a different molded product density, a molded product made of a valve metal powder having a different specific surface area, or a molded product made of a valve metal powder having a different physical strength.
【0021】[0021]
【発明の実施の形態】本発明の電極は、弁金属の2層以
上の焼結層を積層して、一体構造の多孔体としたことを
特徴とするが、弁金属には、Ta、Nb、Ti等の高融
点金属が利用でき、これら金属の粉末から薄肉の多孔質
の成形体とし、成形体を積層して焼結することにより、
焼結体には、各成形体からが焼結してなる焼結層を含
む。BEST MODE FOR CARRYING OUT THE INVENTION The electrode of the present invention is characterized by laminating two or more sintered layers of valve metal into a porous body having an integral structure. , High-melting-point metals such as Ti can be used, and a thin-walled porous compact is formed from powder of these metals, and the compacts are laminated and sintered,
The sintered body includes a sintered layer formed by sintering each molded body.
【0022】本発明の電極は、細孔寸法を変えるため
に、上記複数の焼結層を互いに密度の異なる第1の焼結
層及び第2の焼結層から成るものを利用することができ
る。即ち、焼結密度の異なる焼結層を積層してなる弁金
属多孔体は、密度の小さい領域と密度の大きい領域とを
層状に備えている。密度の小さい領域に隣接して寸法の
大きな細孔が形成され、従って、この焼結層領域の細孔
に電解質を十分に充填することができる。In the electrode of the present invention, in order to change the pore size, it is possible to utilize a plurality of the above-mentioned sintered layers which are composed of a first sintered layer and a second sintered layer having different densities. . That is, the valve metal porous body formed by stacking the sintered layers having different sintering densities has a region of low density and a region of high density in layers. Large pores are formed adjacent to the low-density region, so that the pores in this sintered layer region can be sufficiently filled with the electrolyte.
【0023】一般に、密度の異なる第1及び第2の焼結
層は、密度比を採ると、密度の小さい焼結層に対して、
密度の大きい焼結層の密度比は、1.1〜3程度が好ま
しい。In general, the first and second sintered layers having different densities have a density ratio that is lower than that of the sintered layers having a lower density.
The density ratio of the sintered layer having a high density is preferably about 1.1 to 3.
【0024】焼結密度は、金属の種類によっても違う
が、例えば、タンタル電極の例を挙げると、一方の密度
の小さい焼結層が2.5〜5.5g/cm3である場合
には、これに対して他方の密度の大きい焼結層は、5.
5ないし7.5g/cm3の範囲が採用できる。The sintering density differs depending on the type of metal, but for example, in the case of a tantalum electrode, if one of the low-density sintered layers has a density of 2.5 to 5.5 g / cm 3. On the other hand, the other high-density sintered layer is 5.
A range of 5 to 7.5 g / cm 3 can be adopted.
【0025】また、本発明の電解コンデンサ用の他の電
極は、比表面積(粉末単位重量当たりの細孔内面積を含
む全面積。以下同じ)の異なる第1の焼結層及び第2の
焼結層から成るものが利用できる。Further, the other electrode for the electrolytic capacitor of the present invention comprises a first sintered layer and a second sintered layer having different specific surface areas (total area including pore inner area per unit weight of powder. The same applies hereinafter). Those consisting of slabs are available.
【0026】比表面積の小さい焼結層(例えば、第1の
焼結層)は、細孔が大きいので、焼結体表面から細孔へ
の電解質の充填浸透が容易であり、この第1の焼結層に
隣接する第2の焼結層が小さい細孔であっても、第1の
焼結層から第2の焼結層への浸透も比較的生じやすいの
で、細孔への電解質の充填率も高くなる。The sintered layer specific surface area smaller (e.g., the first sintered layer), since the pores are large, it is easy to fill penetration of the electrolyte from the surface of the sintered body into the pores, the first Even if the second sintered layer adjacent to the sintered layer has small pores, permeation from the first sintered layer to the second sintered layer is relatively likely to occur, so that the electrolyte in the pores can be prevented. The filling rate is also high.
【0027】このような多孔体は、焼結層と弁金属箔と
が実質的に平行になるように、弁金属多孔体を弁金属箔
に接合されて、電極とされる。また、焼結層が弁金属箔
に実質的に垂直になるように、弁金属多孔体を弁金属箔
に接合してもよい。In such a porous body, the valve metal porous body is bonded to the valve metal foil so that the sintered layer and the valve metal foil are substantially parallel to each other to form an electrode. Further, as a sintered layer is substantially perpendicular to the valve metal foil <br/>, it may be bonded to the valve metal porous body to the valve metal foil.
【0028】また、本発明の電極の製造は、積層工程に
より、弁金属粉末から成形された複数の多孔質の成形体
を積層して積層体にし、焼結工程によって積層体を焼結
し、弁金属の多孔体にされる。細孔を有する弁金属の多
孔体は、さらに、弁金属箔と接合して電極とし、当該電
極の細孔に誘電膜を形成して電解質を充填して電解コン
デンサに利用される。The electrode of the present invention is manufactured by laminating a plurality of porous compacts formed from valve metal powder into a laminate by a laminating step, and sintering the laminate by a sintering step. The valve is made of a porous metal. The porous body of valve metal having pores is further bonded to a valve metal foil to form an electrode, a dielectric film is formed in the pores of the electrode, and an electrolyte is filled therein to be used in an electrolytic capacitor.
【0029】成形体は、微細な弁金属粒子から薄く成形
されたもので、その成形方法には、圧縮成形、例えば、
プレス成形、粉末からのロール成形により板状ないしシ
ート状に成形される。また、成形体は、弁金属粒子を含
むスラリーないしペーストを調整して、剥離板上に所望
の厚みで皮膜を形成して、薄いフィルムを作り、これを
剥がしたグリーンシートでもよい。The molded body is thinly molded from fine valve metal particles, and the molding method includes compression molding, for example,
It is molded into a plate or sheet by press molding or roll molding from powder. In addition, the molded body contains valve metal particles.
Steaming to adjust the slurry or paste, to form a film with a desired thickness on a release plate, creating a thin film may be a green sheet was peeled off the same.
【0030】弁金属粉末は、個々の粉末微粒子自体が、
多数の突起ないし突片を備えたもので、これを成形する
ことにより、成形体は、多数の金属の凝集体となり、多
孔質であり、広い範囲の気孔径分布と、大きな比表面積
とを持っている。これらの成形体を、複数、特に、多数
を積層して、積層体とし、これを、炉中で焼結温度以上
の高温に加熱して、焼結させて一体化させ、多孔質焼結
体、即ち多孔体を得る。In the valve metal powder, individual powder fine particles themselves are
It is equipped with a large number of protrusions or projections, and by molding it, the molded body becomes a large number of metal aggregates, is porous, and has a wide range of pore diameter distribution and a large specific surface area. ing. A plurality of, in particular, a large number of these compacts are laminated to form a laminate, which is heated in a furnace to a high temperature equal to or higher than the sintering temperature and sintered to be integrated into a porous sintered body. That is, a porous body is obtained.
【0031】1つの成形体の厚みは、50〜500μm
が好ましく、この寸法は、ある焼結層から隣接の焼結層
を電解液が迅速に充填するに必要な厚みであるが、充填
すべき細孔径により調整することができる。この成形体
の寸法が、おおよそ、焼結層の厚みにすることができ
る。The thickness of one molded body is 50 to 500 μm.
However, this dimension is a thickness required to quickly fill one sintered layer to an adjacent sintered layer with an electrolytic solution, and can be adjusted by the pore size to be filled. The dimension of this compact can be approximately the thickness of the sintered layer.
【0032】成形体は、上述のように、実質的に同じ細
孔寸法を有する複数の成形体を積層して、積層体とする
ことができる。さらに、電極の焼結体は、細孔寸法を異
にする2種類以上の成形体を積層したものが好ましい。
これにより、互いにに隣接する焼結層を細孔寸法の異な
るものとすることができる。As described above, the molded body can be a laminated body by laminating a plurality of molded bodies having substantially the same pore size. Further, the sintered body of the electrode is preferably a laminate of two or more kinds of molded bodies having different pore sizes.
This allows the sintered layers adjacent to each other to have different pore sizes.
【0033】細孔径の例示として、小さい細孔径の成形
体は、径分布の中央値で0.05〜0.6μmでの細孔
径分布の場合に、これに対して大きい径の成形体は、
0.3〜1.5μmの分布が利用できる。細孔径は、焼
結層の細孔径分布のピーク値で表わされ、細孔の径は、
水銀ぺネットレーション法によるピーク値で評価して、
小さい細孔径の成形体(第2の成形体とする)のピーク
細孔径に対して、大きい細孔径の成形体(第1の成形
体)のピーク細孔径の比として、1.2〜5.0程度を
採用することができる。As an example of the pore size, a compact having a small pore size has a pore size distribution with a median diameter distribution of 0.05 to 0.6 μm.
A distribution of 0.3-1.5 μm is available. The pore diameter is represented by the peak value of the pore diameter distribution of the sintered layer, and the pore diameter is
Evaluate with the peak value by mercury penetration method,
The ratio of the peak pore diameter of the large pore diameter molded body ( first molded body) to the peak pore diameter of the small pore diameter molded body (referred to as the second molded body) is 1.2 to 5. About 0 can be adopted.
【0034】複数の成形体は、成形体の熱収縮率の互い
に異なる第1の成形体と、第2の成形体とから成るもの
が好ましい。積層工程において、第1の成形体と第2の
成形体とを、例えば、交互に、積層して、積層体を作
る。焼結過程では、第1の成形体と第2の成形体との収
縮率の差により、焼結体の外表面には、収縮量の差によ
る凹凸が筋状ないし層状に形成され、この凹凸が、陰電
極との接合面積を増大させ、コンデンサの等価直列抵抗
を低減でき、高周波特性を向上させることができる。The plurality of molded products are preferably composed of a first molded product and a second molded product having different heat shrinkage rates of the molded product. In the laminating step, the first molded body and the second molded body are laminated alternately, for example, to form a laminated body. During the sintering process, due to the difference in shrinkage between the first compact and the second compact, unevenness due to the difference in shrinkage is formed in a streak or layer on the outer surface of the sintered compact. However, the junction area with the negative electrode can be increased, the equivalent series resistance of the capacitor can be reduced, and the high frequency characteristics can be improved.
【0035】本発明の電極の製造方法は、複数の成形体
が成形体密度が互いに異なる第1の成形体及び第2の成
形体からなる2種類の成形体を含んでいて、積層工程に
おいて、第1の成形体と上記第2の成形体とを、例えば
交互に、積層して積層体を作るのが好ましい。In the method for producing an electrode of the present invention, the plurality of molded bodies include two types of molded bodies, which are a first molded body and a second molded body having different molded body densities from each other. It is preferable that the first molded body and the second molded body are laminated, for example, alternately to form a laminated body.
【0036】成形体の密度が小さい成形体の領域は、高
温で焼結することにより焼結が進行して収縮量が大きい
ので、弁金属多孔体の外面で、接合界面付近に、凹部が
層状に発生し、弁金属多孔体の表面積が増大する。これ
は、コンデンサの等価直列抵抗を低減させ、高周波特性
が向上する。逆に、低温で焼結した場合は凸部が発生す
るが効果は同じである。The region of the compact having a low density of the compact has a large shrinkage due to the progress of sintering by sintering at a high temperature. Therefore, a concave portion is layered on the outer surface of the valve metal porous body near the bonding interface. Occurs and the surface area of the valve metal porous body increases. This reduces the equivalent series resistance of the capacitor and improves the high frequency characteristics. On the contrary, when sintered at a low temperature, a convex portion is generated, but the effect is the same.
【0037】また、本発明の電解コンデンサ用の電極の
製造方法は、少なくとも互いに単位重量あたりの比表面
積の異なる弁金属の粉末からなる第1の成形体及び第2
の成形体からなる2種類以上の成形体を含み、積層工程
において、第1の成形体と第2の成形体とを交互に積層
して積層体とするのが好ましい。Further, the method for producing an electrode for an electrolytic capacitor according to the present invention comprises at least a first molded body and a second molded body made of valve metal powders having different specific surface areas per unit weight.
It is preferable to include two or more kinds of molded products of the above-mentioned molded product and to laminate the first molded product and the second molded product alternately in the laminating step to obtain a laminated product.
【0038】比表面積の小さい粉末(例えば、第1の成
形体)からの成形体は、比表面積の大きい粉末の成形体
(例えば、第2の成形体)に比べて焼結されにくいの
で、焼結による熱収縮率が小さく、従って、焼結層には
大きな細孔を残し、外面上には、凸部となる。比表面積
の小さい成形体は、細孔の大きい焼結層になるので、焼
結体表面から細孔への電解質の充填浸透が容易であり、
この第1の焼結層に隣接する第2の焼結層が小さい細孔
であっても、細孔への電解質の充填率も高くなる。A molded body made of a powder having a small specific surface area (for example, a first molded body) is less likely to be sintered than a molded body made of a powder having a large specific surface area (for example, a second molded body). The thermal contraction rate due to binding is small, and thus large pores are left in the sintered layer, and convex portions are formed on the outer surface. Since the compact having a small specific surface area becomes a sintered layer having large pores, it is easy to fill and permeate the electrolyte from the surface of the sintered body into the pores,
Even if the second sintered layer adjacent to the first sintered layer has small pores, the filling rate of the electrolyte into the pores is high.
【0039】そこで、比表面積の異なる成形体から、電
解質の充填を容易にし容量の引き出し効率を向上させ、
かつ弁金属多孔体表面に凹凸を設けることができて、陰
電極との接合面積を増大することにより低等価直列抵抗
を図れる。Therefore, it is possible to facilitate the filling of the electrolyte from the molded products having different specific surface areas and to improve the capacity drawing efficiency.
In addition, the surface of the porous valve metal body can be provided with unevenness, and the low equivalent series resistance can be achieved by increasing the bonding area with the negative electrode.
【0040】また、本発明の電極の製造は、凝集粉末の
物理的強度の異なる弁金属の粉末から成る第1の成形体
及び第2の成形体からなる2種類以上の成形体を含んで
いて、積層工程において、第1の成形体と第2の成形体
とを交互に積層して積層体を作ってもよい。タンタル粉
末は、一次粒子は、多数の微小な突起を有する不定形状
であって、微小な多数の一次粒子が互いに凝集して二次
粒子を形成しているが、二次粒子(凝集粒子)の強度が
大きいと成形体にする際のプレス成形において形崩れが
少ないので、相対的に大きな細孔が残り、他方、強度の
小さい二次粒子を有する粉末は、二次粒子が圧縮されて
崩れやすく、成形体は、相対的に小さい細孔となる。In addition, the production of the electrode of the present invention includes two or more kinds of molded bodies, which are a first molded body and a second molded body made of valve metal powders having different physical strengths of agglomerated powders. In the laminating step, the first molded body and the second molded body may be alternately laminated to form a laminated body. In the tantalum powder, the primary particles have an irregular shape having a large number of minute protrusions, and a large number of minute primary particles aggregate with each other to form secondary particles. When the strength is high, the shape is less likely to collapse in the press molding when forming a molded body, so that relatively large pores remain, on the other hand, the powder having secondary particles of low strength is likely to collapse due to compression of the secondary particles. The molded body has relatively small pores.
【0041】そこで、二次粒子の強度の大きい粉末から
の成形体を焼結すると、強度の弱い粉末の成形体の焼結
層に比べて焼結されにくいので、その燒結層は、焼結に
よる収縮率が小さく、大きな細孔を有し、且つ多孔体の
側面において凸部となり、強度の小さい成形体からの焼
結層は、焼結による収縮率が大きく、小さな細孔を有し
て、多孔体の側面においては凹部になる。このようにし
て、弁金属多孔体に細孔の大きな部分を、容量を効率よ
く引き出すための細孔として、利用し、かつ弁金属多孔
体表面の面積を、表面に凹凸を設けることにより、大き
くし陰電極との接合面積を増大することにより低等価直
列抵抗を図れる。Therefore, when a compact made of a powder of secondary particles having a high strength is sintered, it is more difficult to sinter than a sintered layer of a compact of a powder having a weak strength. Therefore, the sintered layer is formed by sintering. The shrinkage rate is small, has large pores, and becomes a convex portion on the side surface of the porous body, and the sintered layer from the compact having low strength has a large shrinkage rate due to sintering and has small pores. It becomes a recess on the side surface of the porous body. In this way, by using a large portion of the fine pores in the valve metal porous body as pores for efficiently drawing out the capacity, and by providing the surface area of the valve metal porous body with unevenness, A low equivalent series resistance can be achieved by increasing the contact area with the negative electrode.
【0042】さらに、本発明の電極の製造方法において
は、上述の如く、成形体を板状またはシート状とし、積
層工程において、弁金属箔上に成形体を積層して積層体
とするのが好ましい。また、成形体には、板状またはシ
ート状とし、焼結工程で、積層体を焼結して弁金属多孔
体とした後、弁金属多孔体を弁金属箔に接合することも
できる。この場合の接合は、成形体と弁金属箔とが実質
的に平行に、又は、垂直になるように接合することもで
きる。Further, in the method for producing an electrode of the present invention, as described above, the molded body is formed into a plate shape or a sheet shape, and in the laminating step, the molded body is laminated on the valve metal foil to form a laminated body. preferable. Alternatively, the molded body may be formed into a plate shape or a sheet shape, and the laminated body may be sintered into a valve metal porous body in the sintering step, and then the valve metal porous body may be bonded to the valve metal foil. In this case, the molded body and the valve metal foil can also be bonded so as to be substantially parallel or perpendicular to each other.
【0043】(実施の形態1)実施の形態1の電解コン
デンサ用電極は、以下のように製造される。最初に、弁
金属の微細粉を圧縮成形して板状の成形体を複数枚、例
えば、10枚、作る。次に、弁金属箔の表面を研磨し
て、表面に微細な凹凸を有する電極用金属箔3を作る。
さらに、電極用金属箔3上に、これら10枚の成形体を
積層して積層体を作る。最後に、積層体を所定の条件で
焼結して弁金属多孔体2を形成することにより、図1に
示す電解コンデンサ用電極20が完成する。(First Embodiment) The electrolytic capacitor electrode of the first embodiment is manufactured as follows. First, a fine powder of valve metal is compression-molded to form a plurality of plate-shaped compacts, for example, 10 compacts. Next, the surface of the valve metal foil is polished to form the electrode metal foil 3 having fine irregularities on the surface.
Further, these 10 molded bodies are laminated on the electrode metal foil 3 to form a laminated body. Finally, the laminated body is sintered under predetermined conditions to form the valve metal porous body 2, whereby the electrode 20 for the electrolytic capacitor shown in FIG. 1 is completed.
【0044】詳細に説明すると、電解コンデンサ用電極
20は、電極用金属箔3に弁金属多孔体2を接合したも
のであるが、弁金属多孔体2は、10個の層状の焼結層
1が積層一体化されて構成されており、各焼結層1はそ
れぞれ成形体が焼結されたものであり、1枚の成形体が
焼結したものが1層の焼結層1に対応する。焼結層1は
その上下に配置された焼結層1と焼結接合されている。
焼結層1がその上下に位置する焼結層1と接触する接合
面6付近の接合界面領域7の密度は、接合界面領域7以
外の領域の密度よりも小さく、また接合界面領域7に形
成される細孔の寸法は、接合界面領域7以外の領域に形
成される細孔の寸法よりも大きい。さらに、図3に示す
ように、焼結層1のエッジは丸みを帯びているので、弁
金属多孔体1の側面の接合面6付近には凹部が形成され
る。More specifically, the electrolytic capacitor electrode 20 is formed by joining the valve metal porous body 2 to the electrode metal foil 3, and the valve metal porous body 2 includes ten layered sintered layers 1. Are laminated and integrated, each sintered layer 1 is formed by sintering a molded body, and one sintered body corresponds to one sintered layer 1. . The sinter layer 1 is sinter-bonded to the sinter layers 1 disposed above and below it.
The density of the bonding interface region 7 near the bonding surface 6 where the sintered layer 1 contacts the upper and lower sintered layers 1 is smaller than the density of the regions other than the bonding interface region 7, and is formed in the bonding interface region 7. The size of the formed pores is larger than the size of the pores formed in the region other than the bonding interface region 7. Furthermore, as shown in FIG. 3, since the edge of the sintered layer 1 is rounded, a concave portion is formed near the joint surface 6 on the side surface of the valve metal porous body 1.
【0045】弁金属多孔体2の側面に凹部が形成される
メカニズムと、接合界面領域7の細孔の寸法が大きくな
るメカニズムについては、上述したように成形体を積層
して積層体を作ると、積層体の2つの成形体に挟まれる
部分の密度は疎になる。従って、この積層体を焼結した
弁金属多孔体2の2つの焼結層1に挟まれる部分、即ち
接合界面領域7付近の密度は疎となる。接合界面領域7
の密度は疎であるから、接合界面領域7に形成される細
孔の寸法が大きくなる。また、2つの成形体に挟まれる
部分は密度が疎であるから焼結による収縮が大きく、そ
の収縮によって、弁金属多孔体1の側面の接合面6付近
に凹部が形成される。Regarding the mechanism of forming the concave portion on the side surface of the valve metal porous body 2 and the mechanism of increasing the size of the pores in the joint interface region 7, when the molded bodies are laminated to form a laminated body as described above. , The density of the portion of the laminated body sandwiched between the two molded bodies becomes sparse. Therefore, the density of the portion between the two sintered layers 1 of the valve metal porous body 2 obtained by sintering this laminated body, that is, the vicinity of the bonding interface region 7 becomes sparse. Bonding interface area 7
Since the density is low, the size of the pores formed in the bonding interface region 7 becomes large. Further, since the portion sandwiched between the two compacts has a low density, the shrinkage due to sintering is large, and the shrinkage forms a recess near the joint surface 6 on the side surface of the valve metal porous body 1.
【0046】[実施例1]具体例として、70000μ
F・V/g相当のタンタル微細粉を、大きさ1.0mm
×3.0mm×0.44mmに圧縮成形して、成形体と
し、この成形体を電極用金属箔に順次10枚積層し、1
350℃で真空焼結して電解コンデンサ用電極10を作
った。[Example 1] As a specific example, 70000μ
Fine tantalum powder equivalent to F / V / g, size 1.0 mm
It is compression-molded to × 3.0 mm × 0.44 mm to obtain a molded body, and the molded body is laminated on the metal foil for electrode in order of 10 sheets, and 1
Vacuum sintering was performed at 350 ° C. to prepare an electrode 10 for an electrolytic capacitor.
【0047】次に、電解コンデンサ用電極10を、約8
5℃のリン酸溶液中で印加電圧20Vで化成して誘電膜
を形成し、続いて電解質に二酸化マンガンを充填して形
成した。さらに、カーボン層及び銀導電性樹脂層からな
る陰極引出電極を設けた後、外部陽極及び外部陰極端子
を接合して、樹脂モールドにより、電解コンデンサを作
った。このように作った電解コンデンサの理論静電容量
は約350μFである。以下、この電解コンデンサを実
施例1と呼ぶ。Next, the electrolytic capacitor electrode 10 is replaced with about 8
A dielectric film was formed by chemical conversion in a phosphoric acid solution at 5 ° C. with an applied voltage of 20 V, and then the electrolyte was filled with manganese dioxide. Furthermore, after providing a cathode extraction electrode composed of a carbon layer and a silver conductive resin layer, an external anode and an external cathode terminal were joined, and an electrolytic capacitor was produced by resin molding. The theoretical capacitance of the electrolytic capacitor thus manufactured is about 350 μF. Hereinafter, this electrolytic capacitor is referred to as Example 1.
【0048】また、比較例として、タンタル微細粉を大
きさ1.0mm×3.0mm×4.4mmのブロック状
に圧縮成形して弁金属多孔体とした。ブロックには、研
磨により表面に凹凸を形成した弁金属箔を接合し、焼結
して電解コンデンサ用電極を作った。以下、このコンデ
ンサ用電極を比較用電極1と呼ぶ。比較用電極1の弁金
属多孔体の密度は、電解コンデンサ用電極10の弁金属
多孔体2の密度にほぼ等しい。As a comparative example, fine tantalum powder was compression molded into a block having a size of 1.0 mm × 3.0 mm × 4.4 mm to obtain a valve metal porous body. A valve metal foil having surface irregularities formed by polishing was joined to the block and sintered to form an electrode for an electrolytic capacitor. Hereinafter, this capacitor electrode is referred to as a comparative electrode 1. The density of the valve metal porous body of the comparative electrode 1 is substantially equal to the density of the valve metal porous body 2 of the electrolytic capacitor electrode 10.
【0049】さらに、実施例1で使用した方法と同様の
方法で、比較用電極1から、理論静電容量が350μF
の比較用電解コンデンサを作成した。Further, in the same manner as that used in Example 1, the theoretical capacitance from the comparative electrode 1 was 350 μF.
A comparative electrolytic capacitor was prepared.
【0050】実施例1及び比較用コンデンサに、周波数
120Hzの電圧を印加した際の静電容量、周波数10
0kHzの電圧を印加した際の静電容量、及び共振点で
ある周波数1MHzの電圧を印加した際の等価直列抵抗
を以下の表1に示す。Capacitance when a voltage of frequency 120 Hz was applied to Example 1 and the comparative capacitor, frequency 10
Table 1 below shows the capacitance when a voltage of 0 kHz is applied and the equivalent series resistance when a voltage of frequency 1 MHz, which is the resonance point, is applied.
【0051】[0051]
【表1】 [Table 1]
【0052】表1から、実施例1の静電容量は、比較用
コンデンサの静電容量よりも大きく、かつ理論静電容量
に近いものであることが判る。また、印加電圧を高周波
した際に発生する静電容量の減少も、比較用コンデンサ
よりも、実施例1の方が小さい。さらに、等価直列抵抗
も、実施例1の方が優れていることが判る。実施例1
は、高周波特性に優れ、大リップル電流が流せるもので
ある。It can be seen from Table 1 that the capacitance of Example 1 is larger than the capacitance of the comparative capacitor and is close to the theoretical capacitance. In addition, the decrease in electrostatic capacitance that occurs when the applied voltage is high frequency is smaller in the first embodiment than in the comparative capacitor. Further, it can be seen that the equivalent series resistance of Example 1 is superior. Example 1
Has excellent high-frequency characteristics and can carry a large ripple current.
【0053】実施例1が大容量であるのは、電解コンデ
ンサ用電極10の弁金属多孔体2の接合界面領域には寸
法の大きな細孔が形成されていて、この寸法の大きな細
孔に誘電膜を形成し、さらに電解質を充填することによ
り、細孔で効率よく静電容量を得ることができるからで
ある。The large capacity of Example 1 is that large pores are formed in the joint interface region of the valve metal porous body 2 of the electrode 10 for the electrolytic capacitor, and the large pores have dielectric properties. This is because the capacitance can be efficiently obtained in the pores by forming the film and further filling the electrolyte.
【0054】また、実施例1の高周波特性が優れている
のは、上述したように、弁金属多孔体の表面には凹部が
形成され、弁金属多孔体の表面積は大きくなるので、実
施例1の等価直列抵抗は低減されるからである。Further, the high frequency characteristics of Example 1 are excellent because, as described above, since the concave portion is formed on the surface of the valve metal porous body and the surface area of the valve metal porous body becomes large, Example 1 This is because the equivalent series resistance of is reduced.
【0055】(実施の形態2)次に、本発明の実施の形
態2にかかる電解コンデンサ用電極について説明する。
本実施の形態の電解コンデンサ用電極は、以下のように
製造される。まず、弁金属の微細粉を成形して、成形体
密度の異なる2種類の成形体を作る。以下の例では、密
度の小さい方の成形体を第1の成形体、密度の大きい方
の成形体を第2の成形体と呼ぶ。次に、電極用金属箔
上、第1の成形体と第2の成形体を交互に積層し、積層
体を形成する。この積層体を焼結して弁金属多孔体とす
ることにより、本実施の形態の電解コンデンサ用電極が
完成する。(Second Embodiment) Next, an electrolytic capacitor electrode according to a second embodiment of the present invention will be described.
The electrolytic capacitor electrode of the present embodiment is manufactured as follows. First, the valve metal fine powder is molded to form two kinds of molded bodies having different molded body densities. In the following examples, the compact having a lower density is referred to as a first compact, and the compact having a higher density is referred to as a second compact. Next, the first molded body and the second molded body are alternately laminated on the metal foil for electrode to form a laminated body. By sintering this laminated body to form a valve metal porous body, the electrolytic capacitor electrode of the present embodiment is completed.
【0056】図2及び図4を参照して、本実施の形態に
かかる電解コンデンサ用電極20について詳細に説明す
る。図2に示すように、電解コンデンサ用電極20は、
電極用金属箔3に弁金属多孔体2aを接合した構造であ
る。弁金属多孔体2aは、板状の第1の焼結層4と板状
の第2の焼結層5とが交互に積層されてなる10層構造
である。第1の焼結層4及び第2の焼結層5は、それぞ
れ第1の成形体及び第2の成形体を焼結したものであ
る。隣接する第1の焼結層4と第2の焼結層5とは焼結
接合されている。With reference to FIGS. 2 and 4, the electrolytic capacitor electrode 20 according to the present embodiment will be described in detail. As shown in FIG. 2, the electrolytic capacitor electrode 20 is
This is a structure in which the valve metal porous body 2a is bonded to the electrode metal foil 3. The valve metal porous body 2a has a 10-layer structure in which plate-shaped first sintered layers 4 and plate-shaped second sintered layers 5 are alternately laminated. The first sintered layer 4 and the second sintered layer 5 are obtained by sintering the first molded body and the second molded body, respectively. The first sintered layer 4 and the second sintered layer 5 which are adjacent to each other are sintered and joined.
【0057】この例では、第2の焼結層5に存在する細
孔(不図示)の寸法は、第1の焼結層4に存在する細孔
(不図示)の寸法よりも小さい。また、図4に示すよう
に、上下2層の第2の焼結層5に挟まれた第1の焼結層
4の側面は、凹形状である。In this example, the size of the pores (not shown) present in the second sintered layer 5 is smaller than the size of the pores (not shown) present in the first sintered layer 4. Further, as shown in FIG. 4, the side surface of the first sintered layer 4 sandwiched between the upper and lower second sintered layers 5 has a concave shape.
【0058】第1の焼結層4に形成される細孔の寸法が
大きくなるメカニズム及び第1の焼結層4の側面が凹形
状になるメカニズムを、以下に説明する。上述したよう
に、密度の小さい第1の成形体と密度の大きい第2の成
形体とを交互に積層して積層体を作り焼結して、弁金属
多孔体2aが形成される。従って、第1の成形体が焼結
されてなる第1の焼結層4の密度は、第2の成形体が焼
結されてなる第2の焼結層4の密度よりも小さいので、
本実施例の条件下では第1の焼結層4に形成される細孔
の寸法は、第2の焼結層5に形成される細孔の寸法より
も大きくなり、また、第1の成形体は第2の成形体に比
べて熱収縮率が大きく、焼結時に、第2の成形体よりも
第1の成形体が大きく収縮するので、弁金属多孔体2a
の第1の焼結層4の側面は凹形状になる。The mechanism by which the size of the pores formed in the first sintered layer 4 increases and the mechanism by which the side surface of the first sintered layer 4 becomes concave will be described below. As described above, the first compact having a low density and the second compact having a high density are alternately laminated to form a laminated body and sintered to form the valve metal porous body 2a. Therefore, the density of the first sintered layer 4 formed by sintering the first molded body is smaller than the density of the second sintered layer 4 formed by sintering the second molded body,
Under the conditions of this embodiment, the size of the pores formed in the first sintered layer 4 is larger than the size of the pores formed in the second sintered layer 5, and the first molding is performed. The body has a higher heat shrinkage rate than the second molded body, and during sintering, the first molded body shrinks more than the second molded body.
The side surface of the first sintered layer 4 has a concave shape.
【0059】[実施例2]
上記実施例1の場合と同様に、電解コンデンサ用電極2
0から理論静電容量370μFの電解コンデンサを作
る。まず、70000μF・V/gのタンタル微細粉
を、大きさ1.0mm×3.0mm×0.44mmの薄板
に圧縮成形して、密度4.4mg/cm3で板状の第1
の成形体を5枚作った。同様に、70000μF・V/
gのタンタル微細粉を大きさ1.0mm×3.0mm×
0.44mmに成形して、密度6.0mg/cm3で薄板
に第2の成形体を5枚作る。電極用金属箔上に第1の成
形体と第2の成形体を交互に積層して、10層構造の積
層体を電極用金属箔に形成した。この積層体を焼結して
弁金属多孔体とすることにより、本実施の形態の電解コ
ンデンサ用電極が完成する。電極用金属箔の製造方法及
び積層体を焼結する条件は、上記実施の形態1と同様で
ある。[Embodiment 2] Similar to Embodiment 1, the electrode 2 for electrolytic capacitor is used.
An electrolytic capacitor with a theoretical capacitance of 370 μF is made from 0. First, 70000 μF · V / g tantalum fine powder was compression-molded into a thin plate of 1.0 mm × 3.0 mm × 0.44 mm to obtain a plate-shaped first plate with a density of 4.4 mg / cm 3 .
5 molded articles were prepared. Similarly, 70,000 μF · V /
g tantalum fine powder size 1.0mm × 3.0mm ×
It is molded to 0.44 mm and five second molded bodies are formed on a thin plate with a density of 6.0 mg / cm 3 . The 1st molded object and the 2nd molded object were laminated | stacked by turns on the metal foil for electrodes, and the laminated body of 10 layer structure was formed in the metal foil for electrodes. By sintering this laminated body to form a valve metal porous body, the electrolytic capacitor electrode of the present embodiment is completed. The manufacturing method of the electrode metal foil and the conditions for sintering the laminate are the same as those in the first embodiment.
【0060】比較例2として、タンタル微細粉を寸法
1.0mm×3.0mm×4.4mm、密度5.2mg
/cm3にブロック状に圧縮成形して、焼結して弁金属
多孔体を作り、さらに、この弁金属多孔体を、上記第2
の電極に用いたものと同様の電極用金属箔に接合し焼結
して、比較用のコンデンサ電極を作った。この際の焼結
条件は、電解コンデンサ用電極20の弁金属多孔体を焼
結した条件と同様である。As Comparative Example 2, tantalum fine powder having a size of 1.0 mm × 3.0 mm × 4.4 mm and a density of 5.2 mg was used.
/ Cm 3 in a block shape by compression molding and sintering to make a valve metal porous body.
A capacitor electrode for comparison was made by bonding and sintering the same metal foil for electrodes as that used for the electrodes of. The sintering conditions at this time are the same as the conditions for sintering the valve metal porous body of the electrolytic capacitor electrode 20.
【0061】実施例2のコンデンサを作る方法と同じ方
法で、この比較用コンデンサ電極から理論静電容量37
0μFの比較用電解コンデンサを作った。From this comparative capacitor electrode, a theoretical capacitance of 37 is obtained in the same manner as the capacitor of Example 2.
A 0 μF comparative electrolytic capacitor was made.
【0062】実施例2のコンデンサ及び比較例のコンデ
ンサに、周波数120Hzの電圧を印加した際の静電容
量、周波数100kHzの電圧を印加した際の静電容
量、及び共振点である周波数1MHzの電圧を印加した
際の等価直列抵抗を以下の表2に示す。The capacitance of the capacitor of Example 2 and the capacitor of the comparative example when a voltage of 120 Hz was applied, the capacitance when a voltage of 100 kHz was applied, and the voltage of a resonance frequency of 1 MHz. Table 2 below shows the equivalent series resistance when a voltage is applied.
【0063】[0063]
【表2】 [Table 2]
【0064】表2は、実施例2のコンデンサの静電容量
は、比較用コンデンサ静電容量よりも大きく、かつ理論
静電容量に近いものであることが判る。印加電圧を高周
波した際に発生する静電容量の減少も、比較用コンデン
サよりも実施例2のコンデンサの方が小さい。さらに、
等価直列抵抗も、実施例2のコンデンサの方が優れてい
ることが判る。つまり、実施例2のコンデンサは、高周
波特性に優れ、大リップル電流が流せるものである。Table 2 shows that the capacitance of the capacitor of Example 2 is larger than the capacitance of the comparative capacitor and close to the theoretical capacitance. The decrease in electrostatic capacitance that occurs when the applied voltage is high frequency is also smaller in the capacitor of the second embodiment than in the comparative capacitor. further,
It can be seen that the capacitor of Example 2 is also superior in equivalent series resistance. That is, the capacitor according to the second embodiment is excellent in high frequency characteristics and can flow a large ripple current.
【0065】実施例2のコンデンサの静電容量が大きい
のは、電解コンデンサ用電極20に設けられている弁金
属多孔体の第1の焼結層に寸法の大きな細孔が形成され
ているからである。即ち、この寸法の大きな細孔に電解
質を充填することにより、細孔で効率よく静電容量を得
たからである。The capacitance of the capacitor of Example 2 is large because large pores are formed in the first sintered layer of the valve metal porous body provided in the electrode 20 for the electrolytic capacitor. Is. That is, by filling the electrolyte in the large pores of this size, the capacitance was efficiently obtained in the pores.
【0066】また、実施例2のコンデンサの等価直列抵
抗が小さくなったのは、上述したように、第1の焼結層
の側面が凹形状になった結果、弁金属多孔体の表面積は
大きくなったためである。等価直列抵抗が低減されるこ
とにより、実施例2のコンデンサの高周波特性が向上す
る。また、陰電極との物理的強度が高まり剥離防止など
信頼性も高くなった。Further, the equivalent series resistance of the capacitor of Example 2 was small because the side surface of the first sintered layer was concave as described above, and the surface area of the valve metal porous body was large. This is because By reducing the equivalent series resistance, the high frequency characteristics of the capacitor of the second embodiment are improved. Further, the physical strength with the negative electrode is increased, and the reliability such as prevention of peeling is improved.
【0067】さらに、上記実施の形態では、同じタンタ
ル粉末を用いて、密度の異なる成形体を作り焼結して、
部分的に粗密さ、細孔の寸法、収縮性等の異なる弁金属
多孔体を作るが、さらに、タンタル粉末の一次粒子径又
は二次粒子の凝集度合を調整すること、タンタル粉末の
粉末径又は嵩密度を2水準以上に調整することにより、
密度又は熱収縮率の異なる複数の成形体を作り、この成
形体を積層し焼結して弁金属多孔体を作ってもよい。ま
た、密度又は熱収縮率の異なる2種類以上の弁金属の粉
末を用いて、それぞれ成形体を作ってもよい。Further, in the above-described embodiment, the same tantalum powder is used to form compacts having different densities, which are then sintered,
Partial coarseness, pore size, different valve metal porous body with different shrinkage, etc. are made, and further, the primary particle diameter of tantalum powder or the degree of aggregation of secondary particles is adjusted, the powder diameter of tantalum powder or By adjusting the bulk density to 2 levels or more,
A plurality of molded bodies having different densities or heat shrinkage rates may be prepared, and the molded bodies may be laminated and sintered to form the valve metal porous body. Further, a molded body may be formed by using two or more kinds of valve metal powders having different densities or heat shrinkage rates.
【0068】[0068]
【発明の効果】本発明の電解コンデンサ用電極は、複数
の成形体を積層し焼結してなる弁金属多孔体を備え、弁
金属多孔体は、密度が小さい領域と密度が大きい領域を
備えていて、密度が小さい領域には寸法の大きな細孔が
形成されるので、この電極を用いて電解コンデンサを作
ると、上記寸法の大きな細孔に電解質を十分に充填する
ことができるので、大容量の電解コンデンサを得ること
ができる。The electrode for an electrolytic capacitor of the present invention comprises a valve metal porous body obtained by laminating and sintering a plurality of molded bodies, and the valve metal porous body has a low density region and a high density region. However, since pores with large dimensions are formed in the region of low density, if an electrolytic capacitor is made using this electrode, it is possible to sufficiently fill the pores with large dimensions with electrolyte. An electrolytic capacitor having a capacity can be obtained.
【0069】また、密度が小さい領域は熱収縮率が大き
いので、弁金属多孔体には凹領域が形成される。このこ
とによって、弁金属多孔体の表面積が増加するので、陰
電極との接合抵抗が低減され、電解コンデンサの等価直
列抵抗が低減されて、高周波特性が向上する。Further, since the region of low density has a large heat shrinkage, a concave region is formed in the valve metal porous body. As a result, the surface area of the valve metal porous body is increased, the junction resistance with the negative electrode is reduced, the equivalent series resistance of the electrolytic capacitor is reduced, and the high frequency characteristics are improved.
【0070】本発明の電解コンデンサ用電極において、
成形密度の異なる複数の成形体を積層し焼結してなる弁
金属多孔体を用いることにより、弁金属多孔体の表面積
をより増大させることができる。In the electrolytic capacitor electrode of the present invention,
By using a valve metal porous body obtained by laminating and sintering a plurality of molded bodies having different molding densities, the surface area of the valve metal porous body can be further increased.
【0071】本発明の電解コンデンサ用電極において、
熱収縮率の異なる弁金属の粉末から複数の成形体を作
り、この成形体を積層し焼結してなる弁金属多孔体を用
いることにより、弁金属多孔体の表面積をさらに増大さ
せることができる。In the electrolytic capacitor electrode of the present invention,
The surface area of the valve metal porous body can be further increased by forming a plurality of molded bodies from powders of valve metals having different heat shrinkage rates, and using the porous valve metal body formed by stacking and sintering the molded bodies. .
【図1】 本発明の実施の形態の電解コンデンサ用電極
の断面図を示す。FIG. 1 shows a sectional view of an electrode for an electrolytic capacitor according to an embodiment of the present invention.
【図2】 本発明の実施の形態の電解コンデンサ用電極
の断面図を示す。FIG. 2 shows a cross-sectional view of an electrode for an electrolytic capacitor according to an embodiment of the present invention.
【図3】 本発明の実施の形態の電解コンデンサ用電極
の拡大断面図を示す。FIG. 3 shows an enlarged sectional view of an electrode for an electrolytic capacitor according to an embodiment of the present invention.
【図4】 本発明の実施の形態の電解コンデンサ用電極
の拡大断面図を示す。FIG. 4 shows an enlarged sectional view of an electrode for an electrolytic capacitor according to an embodiment of the present invention.
【図5】 従来の電解コンデンサ用電極の斜視図を示
す。FIG. 5 shows a perspective view of a conventional electrode for an electrolytic capacitor.
1 焼結層 2 弁金属多孔体 2a 弁金属多孔体 3 電極用金属箔 4 第1の焼結層 5 第2の焼結層 20 電解コンデンサ用電極。 1 Sintered layer 2 valve metal porous body 2a Valve metal porous body Metallic foil for 3 electrodes 4 First sintered layer 5 Second sintered layer 20 Electrolytic capacitor electrode.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 樋口 吉浩 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭50−36951(JP,A) 特開 平10−233347(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01G 9/052 H01G 9/04 H01G 9/00 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Yoshihiro Higuchi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-50-36951 (JP, A) JP-A-10- 233347 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01G 9/052 H01G 9/04 H01G 9/00
Claims (17)
に接合されて成る電極であって、該電極が、細孔内面に
誘電膜を形成し且つ細孔内に電解質を充填して電解コン
デンサに利用される電解コンデンサ用の電極において、 弁金属の多孔体が、弁金属粉末から成形された多孔質の
複数の焼結層から積層されて成る焼結体であり、 上記の焼結体中には、相隣接する焼結層の積層界面領域
が、焼結層内部の細孔よりも径の大きな孔を有すること
を特徴とする電解コンデンサ用電極。1. An electrode comprising a valve metal porous body having pores bonded to a valve metal foil, wherein the electrode forms a dielectric film on the inner surface of the pores and fills the pores with an electrolyte. In an electrode for an electrolytic capacitor used in an electrolytic capacitor, the valve metal porous body is a sintered body formed by laminating a plurality of porous sintered layers formed from valve metal powder. An electrode for an electrolytic capacitor, characterized in that a laminated interface region of adjacent sintered layers has pores having a diameter larger than the pores inside the sintered layers in the bound body.
れと隣接する第2の焼結層とが、互いに異なる細孔径を
有することを特徴とする請求項1記載の電解コンデンサ
用電極。2. The electrolysis according to claim 1, wherein in the plurality of sintered layers, the first sintered layer and the second sintered layer adjacent thereto have different pore sizes. Electrodes for capacitors.
れと隣接する第2の焼結層とが、焼結密度の異なること
を特徴とする請求項1または2記載の電解コンデンサ用
電極。3. The plurality of sintered layers according to claim 1, wherein the first sintered layer and the second sintered layer adjacent thereto have different sintering densities. Electrode for electrolytic capacitor.
れと隣接する第2の焼結層とが、互いに比表面積の異な
ることを特徴とする請求項1または2記載の電解コンデ
ンサ用電極。4. The plurality of sintered layers according to claim 1, wherein the first sintered layer and the second sintered layer adjacent thereto have different specific surface areas from each other. Electrode for electrolytic capacitor.
は、第1の焼結層と第2の焼結層との積層を少なくとも
1回以上繰り返すことを特徴とする請求項1ないし4の
いずれかに記載の電解コンデンサ用電極。5. A sintered body formed by laminating a plurality of sintered layers, wherein the first sintered layer and the second sintered layer are laminated at least once or more. 5. The electrode for an electrolytic capacitor according to any one of 1 to 4.
は、第1の焼結層と第2の焼結層とが交互に積層されて
いることを特徴とする請求項1ないし4のいずれかに記
載の電解コンデンサ用電極。6. A sintered body formed by laminating a plurality of sintered layers, wherein first sintered layers and second sintered layers are alternately laminated. 4. The electrode for an electrolytic capacitor according to any one of 4 above.
に平行になるように、弁金属多孔体が弁金属箔に接合さ
れていることを特徴とする請求項1ないし6のいずれか
に記載の電解コンデンサ用電極。7. The valve metal porous body is bonded to the valve metal foil so that the sintered layer and the valve metal foil are substantially parallel to each other. The electrode for an electrolytic capacitor as described in any one.
直になるように、弁金属多孔体が弁金属箔に接合された
ことを特徴とする請求項1ないし6のいずれかに記載の
電解コンデンサ用電極。8. The valve metal porous body is bonded to the valve metal foil such that the sintered layer is substantially perpendicular to the valve metal foil. The electrode for an electrolytic capacitor as described in.
と接合して電極とし、当該電極の細孔に誘電膜を形成し
て電解質を充填して電解コンデンサに利用される電解コ
ンデンサ用の当該電極を製造する方法において、 弁金属粉末から成形された複数の多孔質の成形体で、か
つその焼結時における熱収縮率が互いに異なる第1の成
形体と第2の成形体とから成る2種類以上の成形体を、
互いに接合するように積層して積層体にする積層工程
と、 該積層体を焼結して弁金属の多孔体にする焼結工程と、
を含み、 該弁金属の多孔体を、多孔質の複数の焼結層から積層し
て成る焼結体とすることを特徴とする電解コンデンサ用
電極の製造方法。9. An electrolytic capacitor used as an electrolytic capacitor by bonding a porous body of valve metal having pores to a valve metal foil to form an electrode, forming a dielectric film in the pores of the electrode and filling an electrolyte. A method for manufacturing the electrode for use in a method, comprising: a first molded body and a second molded body which are a plurality of porous molded bodies molded from valve metal powder and have different heat shrinkage rates during sintering. Two or more types of molded bodies consisting of
A laminating step of laminating so as to be bonded to each other into a laminated body, and a sintering step of sintering the laminated body into a porous body of valve metal,
A method of manufacturing an electrode for an electrolytic capacitor, comprising: a porous body of the valve metal, which is formed by laminating a plurality of porous sintered layers.
箔と接合して電極とし、当該電極の細孔に誘電膜を形成
して電解質を充填して電解コンデンサに利用される電解
コンデンサ用の当該電極を製造する方法において、 弁金属粉末から成形された複数の多孔質の成形体で、か
つ成形体密度が互いに異なる第1の成形体と第2の成形
体とから成る2種類以上の成形体を、互いに接合するよ
うに積層して積層体にする積層工程と、 該積層体を焼結して弁金属の多孔体にする焼結工程と、
を含み、 該弁金属の多孔体を、多孔質の複数の焼結層から積層し
て成る焼結体とすることを特徴とする電解コンデンサ用
電極の製造方法。10. An electrolytic capacitor which is used as an electrolytic capacitor by bonding a porous body of valve metal having pores to a valve metal foil to form an electrode, forming a dielectric film in the pores of the electrode and filling an electrolyte with the electrolyte. A method for producing the electrode for use in a method, comprising: a plurality of porous compacts molded from valve metal powder, and two or more kinds of first compacts and second compacts having different compact densities. A step of laminating the molded articles of 1 above so as to be bonded to each other to form a laminated body; a sintering step of sintering the laminated body to form a porous body of valve metal;
A method of manufacturing an electrode for an electrolytic capacitor, comprising: a porous body of the valve metal, which is formed by laminating a plurality of porous sintered layers.
箔と接合して電極とし、当該電極の細孔に誘電膜を形成
して電解質を充填して電解コンデンサに利用される電解
コンデンサ用の当該電極を製造する方法において、 弁金属粉末から成形された複数の多孔質の成形体で、か
つ比表面積が互いに異なる弁金属の粉末から成る第1の
成形体と第2の成形体とからなる2種類以上の成形体
を、互いに接合するように積層して積層体にする積層工
程と、 該積層体を焼結して弁金属の多孔体にする焼結工程と、
を含み、 該弁金属の多孔体を、多孔質の複数の焼結層から積層し
て成る焼結体とすることを特徴とする電解コンデンサ用
電極の製造方法。11. An electrolytic capacitor which is used as an electrolytic capacitor by bonding a porous body of a valve metal having pores to a valve metal foil to form an electrode, forming a dielectric film in the pores of the electrode and filling an electrolyte. A method for manufacturing the electrode for use in a method, comprising: a first molded body and a second molded body, which are a plurality of porous molded bodies molded from valve metal powder, and made of valve metal powders having different specific surface areas. A step of laminating two or more kinds of molded bodies consisting of the above so as to be bonded to each other to form a laminated body, and a sintering step of sintering the laminated body to form a porous body of valve metal,
A method of manufacturing an electrode for an electrolytic capacitor, comprising: a porous body of the valve metal, which is formed by laminating a plurality of porous sintered layers.
箔と接合して電極とし、当該電極の細孔に誘電膜を形成
して電解質を充填して電解コンデンサに利用される電解
コンデンサ用の当該電極を製造する方法において、 弁金属粉末から成形された複数の多孔質の成形体で、か
つ互いに粉末の物理的強度の異なる弁金属の粉末からな
る第1の成形体及び第2の成形体からなる2種類以上の
成形体を、互いに接合するように積層して積層体にする
積層工程と、 該積層体を焼結して弁金属の多孔体にする焼結工程と、
を含み、 該弁金属の多孔体を、多孔質の複数の焼結層から積層し
て成る焼結体とすることを特徴とする電解コンデンサ用
電極の製造方法。12. An electrolytic capacitor which is used as an electrolytic capacitor by joining a porous body of valve metal having pores with a valve metal foil to form an electrode, forming a dielectric film in the pores of the electrode and filling an electrolyte. A method for manufacturing the electrode for use in a method, comprising: a plurality of porous compacts formed from valve metal powder, and a first compact and a second compact made of valve metal powders having different physical strengths from each other. A laminating step of laminating two or more types of shaped bodies made of shaped bodies so as to be bonded to each other into a laminated body; and a sintering step of sintering the laminated body into a porous body of valve metal,
A method of manufacturing an electrode for an electrolytic capacitor, comprising: a porous body of the valve metal, which is formed by laminating a plurality of porous sintered layers.
形体とを交互に積層することを特徴とする請求項9ない
し12のいずれかに記載の電解コンデンサ用電極の製造
方法。13. The method for producing an electrode for an electrolytic capacitor according to claim 9, wherein the laminating step comprises alternately laminating the first molded body and the second molded body.
形体との積層を少なくとも1回以上繰り返すことを特徴
とする請求項9ないし12のいずれかに記載の電解コン
デンサ用電極の製造方法。14. The electrode for an electrolytic capacitor according to claim 9, wherein the laminating step repeats laminating the first molded body and the second molded body at least once or more. Production method.
り、積層工程において、弁金属箔の上に成形体を積層し
て積層体とすることを特徴とする請求項9ないし14の
いずれかに記載の電解コンデンサ用電極の製造方法。15. The molded body is plate-shaped or sheet-shaped, and in the laminating step, the molded body is laminated on the valve metal foil to form a laminated body. A method for manufacturing an electrode for an electrolytic capacitor as described in 1.
り、焼結工程後に、さらに、成形体を焼結して成る焼結
層が弁金属箔とが実質的に平行になるように、弁金属多
孔体を弁金属箔に接合する請求項9ないし14のいずれ
かに記載の電解コンデンサ用電極の製造方法。16. The molded body is plate-shaped or sheet-shaped, and after the sintering step, the sintered layer formed by sintering the molded body is substantially parallel to the valve metal foil, The method for manufacturing an electrode for an electrolytic capacitor according to claim 9, wherein the valve metal porous body is bonded to the valve metal foil.
り、焼結工程後に、成形体を焼結して成る焼結層が弁金
属箔と実質的に垂直になるように、弁金属多孔体を弁金
属箔に接合する請求項9ないし14のいずれかに記載の
電解コンデンサ用電極の製造方法。17. A valve metal porous body, wherein the molded body is plate-shaped or sheet-shaped, and after the sintering step, the sintered layer formed by sintering the molded body is substantially perpendicular to the valve metal foil. The method for manufacturing an electrode for an electrolytic capacitor according to claim 9, wherein the body is joined to the valve metal foil.
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|---|---|---|---|
| JP2000090533A JP3443553B2 (en) | 1999-04-16 | 2000-03-29 | Electrode for electrolytic capacitor and method for manufacturing the same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-109246 | 1999-04-16 | ||
| JP10924699 | 1999-04-16 | ||
| JP2000090533A JP3443553B2 (en) | 1999-04-16 | 2000-03-29 | Electrode for electrolytic capacitor and method for manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
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